JPH06177595A - Measurement of mounting accuracy of electronic component recognition mounting machine and measuring jig - Google Patents

Abstract

PURPOSE:To provide a method capable of measuring the mounting accuracy of a mounting machine without being exerted an effect due to a bend of the leads of an electronic component. CONSTITUTION:A positional deviation of mounting is not measured using an actual electronic component, but a light-transmitting flat plate 11 recorded with lead patterns 10 is mounted on a glass flat plate 9 recorded with land patterns 13 by a mounting machine and the positional deviation of the patterns 10 from the patterns 13 is measured to find the mounting accuracy of the mounting machine.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting accuracy measuring method for a mounting machine which recognizes the shape of an electronic component and mounts it on a printed wiring board.

[0002]

2. Description of the Related Art A conventional measuring method will be described below. Conventionally, the electronic component recognition mounting accuracy measuring method is carried out by mounting an actual electronic component A as shown in FIG. 5 or a dummy component made by punching a lead 3 having a lead width of 1 and a lead pitch of 2 from a die. And the mounting position deviation a between the lead 3 and the land pattern 5 shown in FIG.
Is measured and the mounting accuracy of the mounting machine is measured.
The measurement of the mounting position deviation a is performed using a tool microscope or the like.

[0003]

As the lead pitch of the electronic component becomes finer, the lead width 1 and lead pitch 2 of the electronic component A or the dummy component as shown in FIG. 7 are obtained.
Becomes narrower and the lead thickness 4 becomes thinner, so that the strength of the lead is lowered, and a bent lead 7 as shown in FIG. Therefore, there is a problem that the accuracy of parts affects the measurement of the mounting accuracy of the mounting machine.

Further, the work of highly accurately reading the dimension of the mounting position deviation a with a tool microscope or the like is very troublesome. An object of the present invention is to provide a method capable of measuring the mounting accuracy of the mounting machine itself.

Another object of the present invention is to provide a tool which can easily obtain a highly accurate measured value in a measuring operation using a tool microscope or the like.

[0006]

According to a first aspect of the present invention, there is provided a mounting accuracy measuring method, wherein a transparent flat plate having a lead pattern in an opaque region corresponding to a lead shape of an electronic component handled is recorded on the transparent plate. Is mounted on a flat plate on which a land pattern is recorded in correspondence with the lead spacing by a mounting machine, and the positional deviation between the lead pattern and the land pattern is measured through the transparent flat plate. The mounting accuracy measuring jig according to claim 2 is a translucent flat plate on which lead patterns matching the lead shape of an electronic component to be handled are recorded at equal intervals, and a fixed amount of deviation in pitch with the same shape as the lead shape. And a land pattern recorded with.

[0007]

According to the structure of the first aspect, the land pattern is recorded by the mounter on the translucent flat plate on which the lead pattern is recorded, instead of measuring the mounting position deviation by using an actual electronic component. Since it is mounted on a flat plate and the positional deviation between the lead pattern and the land pattern is measured, the accurate mounting positional deviation can be measured without being affected by bending of the leads of the electronic component.

According to the second aspect of the present invention, the translucent flat plate in which the lead patterns are recorded at equal intervals is mounted on the land patterns which are recorded in the same shape as the lead shape with a certain amount of pitch deviation. By recognizing the portion where the lead pattern and the land pattern are accurately overlapped with each other, the mounting position deviation amount can be determined.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The mounting accuracy measuring method of the present invention will be described below with reference to specific embodiments shown in FIGS.

1 to 3 show a first embodiment. When measuring the mounting accuracy of the mounting machine, the first jig 8 and the glass flat plate 9 as the second jig shown in FIG. 1 are used. The first jig 8 forms a mold of an electronic component on a positive film 11 as a light-transmissive flat plate on which a lead pattern 10 in an opaque area that matches the shape of the lead 3 of the electronic component according to CAD data is printed. The flat plate 12 made of plastic is bonded by an adhesive. The land pattern 13 having the same pitch as the lead interval of the electronic component is CAD on the glass plate 9.
Printed by data.

As shown in FIG. 2, the mounting machine to be measured is
The plastic flat plate 12 of the first jig 8 is sucked by the suction nozzle 14 and is conveyed to the station D where the CCD camera on the mounting machine corrects the recognition position. It is mounted on a glass plate 9 as a second jig placed on the substrate C.

FIG. 3 shows how the lead pattern 10 of the jig 8 thus mounted and the land pattern 13 printed on the glass plate 9 are misaligned and mounted through the transparent area of the positive film 11. The mounting accuracy can be obtained by measuring the displacement a with a tool microscope.

According to this measuring method, it is possible to exclude the influence of the lead bending of the actual electronic component or dummy component on the mounting position accuracy, and it is possible to measure the mounting accuracy of the mounting machine itself.

In the first embodiment described above, the positive film 11 and the glass flat plate 10 in which the shapes of the conventional parts, the dummy parts, and the lands are printed by the CAD data are used, but in the second embodiment shown in FIG. By using the glass flat plate 19 on which the lands are printed with a certain amount of deviation in pitch, the mounting position deviation a can be easily measured.

Specifically, as shown in FIG. 4 (a), a positive film 11 on which leads 10 of parts and leads 10 of lead pitch 2 are printed, and a plastic flat plate 12 in the shape of a mold. A first jig 8 composed of the above and a glass plate 19 as a second jig having a land pattern 18 having a pitch different from that of the first embodiment as shown in FIG. 4B are used. Regarding the land pattern 18, the land width 15 and the land length 16 are the same as the lead width 1 and the lead length 14, respectively,
Although the land pitch 17 is the same pitch, the land pattern 18 is printed differently from the size of the lead pitch 2. The first jig 8 is mounted on the glass flat plate 19 as the second jig by the mounting machine, and the lead pattern is formed as shown in FIG.
The mounting accuracy is read from the overlapping portion 20 of the land pattern 18 and the land pattern 18 according to the vernier principle found in the caliper measuring tool.

Here, the lead width W1 and the lead length L
1. The positive film 11 on which the leads of the lead pitch P1 are printed is mounted on the glass flat plate 19 on which the land pattern W of the land width W2, the land length L2 and the land pitch P2 is printed, and the overlapping portion 20 In the case where overlaps such as those indicated by are obtained, the mounting position accuracy is (P1-P2) in the horizontal direction and "2.
The result of (P1-P2) "is obtained.

[0017]

According to the mounting accuracy measuring method of the first aspect, a transparent flat plate having a lead pattern of an opaque region corresponding to the lead shape of the electronic component to be handled is recorded on the lead interval of the electronic component. Correspondingly, a mounting machine is used to mount on a flat plate on which the land pattern is recorded, and the position deviation between the lead pattern and the land pattern is measured through the translucent flat plate. Accurate mounting position deviation can be measured from the positional deviation between the land pattern and the lead pattern of the translucent flat plate without being affected by bending of the leads of the electronic component as in the case of measuring the deviation. The mounting accuracy measuring jig according to claim 2, further comprising: a translucent flat plate on which lead patterns corresponding to the lead shape of the electronic component to be handled are recorded at equal intervals, and the same shape as the lead shape and a fixed amount at a pitch. When a mounting accuracy measuring jig including a land pattern recorded with a deviation is used, it is possible to easily achieve highly accurate dimension reading when reading with a tool microscope or the like.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a first embodiment of the present invention.

FIG. 2 is an explanatory diagram of a measurement process of the same example.

FIG. 3 is a plan view at the time of reading the mounting position measurement result of the same embodiment.

FIG. 4 is a plan view of an essential part of the second embodiment.

FIG. 5 is a perspective view of a conventional component or dummy component used for measuring the mounting position accuracy.

FIG. 6 is a plan view when reading a conventional measurement result of the mounting position accuracy.

FIG. 7 is an enlarged view of a lead portion of an electronic component or a dummy component.

FIG. 8 is an explanatory diagram of lead bending of an electronic component or a dummy component.

[Explanation of symbols]

 8 First jig 9 Glass flat plate [Second jig] 10 Lead pattern 11 Positive film [Translucent flat plate] 13,18 Land pattern

Claims (2)

[Claims] 1. A translucent flat plate on which a lead pattern of an opaque region corresponding to a lead shape of an electronic component to be handled is recorded, on a flat plate on which a land pattern is recorded corresponding to a lead interval of the electronic component. A mounting accuracy measuring method in an electronic component recognizing mounting machine, in which the mounting pattern is mounted on a mounting machine, and the positional deviation between the lead pattern and the land pattern is measured through the transparent plate. 2. A translucent flat plate on which lead patterns corresponding to lead shapes of electronic parts to be handled are recorded at equal intervals.
A mounting accuracy measuring jig having the same shape as the lead shape and a land pattern recorded with a certain amount of deviation in pitch.