JPH04129259A - Electronic parts - Google Patents
Electronic partsInfo
- Publication number
- JPH04129259A JPH04129259A JP2250911A JP25091190A JPH04129259A JP H04129259 A JPH04129259 A JP H04129259A JP 2250911 A JP2250911 A JP 2250911A JP 25091190 A JP25091190 A JP 25091190A JP H04129259 A JPH04129259 A JP H04129259A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- electronic component
- electronic parts
- recognition
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子部品に関し、特に電子部品を回路基板上に
装着する際の電子部品の位置認識を容易に行えるものに
関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to electronic components, and particularly to an electronic component that can easily recognize the position of the electronic component when it is mounted on a circuit board.
従来の技術
例えば、リード付電子部品を保持して回路基板の所定位
置に装着し、そのリードを回路基板上の電極に接合する
際には、電子部品の位置を精度良く認識して装着しない
と、リードと電極の適正な接合状態が得られず、隣接す
る電極とリード間で短絡を生ずる恐れがある。Conventional technology For example, when holding an electronic component with leads and mounting it on a predetermined position on a circuit board, and joining the leads to electrodes on the circuit board, the position of the electronic component must be accurately recognized and mounted. , a proper bonding state between the lead and the electrode cannot be obtained, and there is a possibility that a short circuit may occur between the adjacent electrode and the lead.
そこで、従来から電子部品の装着時に電子部品を保持し
た状態でその位置を認識しているが、その認識時には第
５図に示すように、電子部品本体１２の側辺から突設さ
れたり一ド１３の内、対角位置にあるリード１３ａ等、
適当なリードを選択してそのリード１３ａの外郭形状か
らその位置を検出することによって電子部品１１の位置
を認識している。Therefore, conventionally, the position of an electronic component is recognized while holding the electronic component when it is installed, but at the time of recognition, as shown in FIG. 13, leads 13a, etc. located at diagonal positions,
The position of the electronic component 11 is recognized by selecting an appropriate lead and detecting the position from the outer shape of the lead 13a.
発明が解決しようとする課題
しかしながら、上記のような電子部品１１の位置認識方
法では、リード１３の位置を検出するためのデータ処理
が複雑で、認識に時間がかがるとともに、認識装置が高
価になるという問題があった。Problems to be Solved by the Invention However, in the method for recognizing the position of the electronic component 11 as described above, data processing for detecting the position of the lead 13 is complicated, recognition takes time, and the recognition device is expensive. There was a problem with becoming.
本発明は上記問題点に鑑み、位置認識を容易に短時間で
行うことができる電子部品を提供することを目的とする
ものである。SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide an electronic component that can easily recognize a position in a short time.
課題を解決するための手段
上記問題点を解決するために、本発明の電子部品は、電
子部品本体の側辺から突出されたリードの内、適当なリ
ード上に位置認識用のマークを形成したものである。Means for Solving the Problems In order to solve the above-mentioned problems, the electronic component of the present invention is provided with marks for position recognition formed on appropriate leads among the leads protruding from the sides of the electronic component body. It is something.
又、電子部品本体の側辺の適当箇所から、位置認識用の
マークを形成した擬似リードを突設しても良い。Further, a pseudo lead having a mark for position recognition may be provided protruding from an appropriate location on the side of the electronic component main body.
さらに、電子部品本体の周辺の適当箇所から外方に位置
認識用の突部を突設しても良い。Furthermore, a protrusion for position recognition may be provided protruding outward from a suitable location around the electronic component main body.
作用
本発明は上記した構成によって、リード上に形成された
位置認識用のマークを認識することによって、簡単な認
識データ処理によって短時間にかつ簡単な認識装置で電
子部品の位置を認識することができる。又、電極との接
合用のリードとは別に位置認識用のマークを形成した擬
似リードを突設しても、又は本体の周辺から位置認識用
の突部を突設しても同様の効果が得られる。According to the present invention, with the above-described configuration, the position of an electronic component can be recognized in a short time and with a simple recognition device through simple recognition data processing by recognizing the position recognition mark formed on the lead. can. Furthermore, the same effect can be obtained even if a pseudo lead with a mark for position recognition is provided protrudingly provided in addition to the lead for bonding with the electrode, or a protrusion for position recognition is provided protruding from the periphery of the main body. can get.
実施例
以下、本発明の各実施例におけるリード付電子部品につ
いて、第１図〜第４図を参照しながら説明する。EXAMPLES Hereinafter, leaded electronic components in each example of the present invention will be described with reference to FIGS. 1 to 4.
第１図に示す第１実施例において、１はリード付電子部
品であり、その電子部品本体２の四側辺から外方に向け
てそれぞれ複数のり一部３が突設されている。電子部品
本体２の対角位置に突出されたリード３の電子部品本体
２の近傍の所定位置には、プレス加工又はエツチングに
より形成された小穴から成る位置認識用のマーク４が形
成されている。リード３がリードフレーム等の肉厚のあ
る部材にて構成されている場合にはプレス加工が好適で
あり、キャリアフィルム上に形成された金属箔にて構成
されている場合にはエツチングが好適である。又、マー
ク４としては小穴に限らず、リード表面と異なる反射率
を与えるような表面処理にて形成してもよく、その形状
も丸に限らず三角形等、任意の形状・とすることができ
る。In the first embodiment shown in FIG. 1, numeral 1 is an electronic component with leads, and a plurality of glue portions 3 are provided outwardly from each of the four sides of a main body 2 of the electronic component. A position recognition mark 4 consisting of a small hole formed by pressing or etching is formed at a predetermined position near the electronic component body 2 of the lead 3 protruding diagonally from the electronic component body 2. If the lead 3 is made of a thick member such as a lead frame, press processing is suitable, and if it is made of metal foil formed on a carrier film, etching is suitable. be. Further, the mark 4 is not limited to a small hole, but may be formed by a surface treatment that gives a reflectance different from that of the lead surface, and its shape is not limited to a circle, but can be any shape such as a triangle. .
以上のようにリード３に位置認識用のマーク４を形成し
たリード付き電子部品１を用いると、そのマーク４を認
識処理することによりその位置を認識することができ、
簡単で安価な認識装置を用いて短時間でリード付電子部
品１の位置を認識できる。なお、近年は製造後検査工程
を経たリード付電子部品１はその寸法精度及び信頼性が
高いため、搬送及び装着工程でリード３の曲がり等の発
生要因を無くす工夫を行えば、このマーク４でリード付
電子部品１の位置を認識して装着するだけでも、電子部
品１を高い信頼性をもって回路基板の所定位置に装着す
ることができる。When using the lead-equipped electronic component 1 in which the mark 4 for position recognition is formed on the lead 3 as described above, the position can be recognized by processing the mark 4 to recognize it.
The position of the leaded electronic component 1 can be recognized in a short time using a simple and inexpensive recognition device. In addition, in recent years, leaded electronic components 1 that have gone through the post-manufacturing inspection process have high dimensional accuracy and reliability, so if measures are taken to eliminate causes such as bending of the leads 3 during the transportation and installation process, this mark 4 can be achieved. Simply by recognizing the position of the electronic component 1 with leads and mounting it, the electronic component 1 can be mounted at a predetermined position on the circuit board with high reliability.
第２図に示す第２実施例においては、マーク４を形成す
るり一部３の基部に幅広部５を形成し、この幅広部５に
マーク４を形成し、リード３の断面積がマーク４を形成
しても小さくなることがないようにしている。In the second embodiment shown in FIG. 2, a mark 4 is formed or a wide part 5 is formed at the base of the part 3, the mark 4 is formed in this wide part 5, and the cross-sectional area of the lead 3 is Even if it is formed, it does not become small.
次に、第３図に示す第３実施例を説明すると、回路基板
の電極との接合用のリード３とは別に、これらリード３
と干渉しない電子部品本体２の対角線上の角部の位置に
短寸の擬似リード６が設けられ、この擬似リード６にマ
ーク４が形成されている。Next, explaining the third embodiment shown in FIG. 3, in addition to the leads 3 for bonding with the electrodes of the circuit board, these leads 3
A short pseudo lead 6 is provided at a diagonal corner of the electronic component main body 2 that does not interfere with the electronic component main body 2, and a mark 4 is formed on this pseudo lead 6.
なお、第２図や第３図の実施例においては、マーク４と
してリードの幅広部５や擬似リード６の側縁に切欠やｖ
ノツチを形成してもよい。In the embodiments shown in FIGS. 2 and 3, the mark 4 is a notch or v
A notch may be formed.
次に、第４図に示す第４実施例を説明すると、電子部品
本体２の各リード３と干渉することのない対角位置の角
部から位置認識突部７が一体的に突出形成されている。Next, a fourth embodiment shown in FIG. 4 will be described. Position recognition protrusions 7 are integrally formed to protrude from diagonally positioned corners that do not interfere with each lead 3 of the electronic component main body 2. There is.
この位置認識突部７には位置検出用のマークとしてＶノ
ツチ８が形成され、その■ノツチ８の角にて位置を指示
するようにしている。この実施例においても、位置認識
突部７にマークとして小穴を形成してもよい。A V-notch 8 is formed on the position recognition protrusion 7 as a mark for position detection, and the corner of the notch 8 is used to indicate the position. Also in this embodiment, a small hole may be formed in the position recognition protrusion 7 as a mark.
近年は、樹脂成形の寸法精度が向上しているため、この
実施例のように樹脂モールドにて形成される電子部品本
体２の一部にて位置認識用のマークを形成しても必要な
位置認識精度を満たすことできる。この実施例は位置認
識突部７を電子部品本体２と一体的に形成したことによ
って変形したリする恐れがないため、形状が安定して認
識し易いという特長を有している。In recent years, the dimensional accuracy of resin molding has improved, so even if a mark for position recognition is formed on a part of the electronic component body 2 formed by resin molding as in this example, it will not be possible to locate the required position. Recognition accuracy can be met. This embodiment has the advantage that since the position recognition protrusion 7 is formed integrally with the electronic component body 2, there is no risk of deformation, and the shape is stable and easy to recognize.
発明の効果
以上のように本発明の電子部品によれば、リード上に形
成された位置認識用のマークを認識することによって、
簡単な認識データ処理によって短時間にかつ簡単な認識
装置で電子部品の位置を認識することができるという効
果を発揮する。又、電極との接合用のリードとは別に位
置認識用のマークを形成した擬似リードを突設しても、
又は本体の周辺から位置認識用の突部を突設しても同様
の効果を発揮する。Effects of the Invention As described above, according to the electronic component of the present invention, by recognizing the position recognition mark formed on the lead,
By simple recognition data processing, the position of an electronic component can be recognized in a short time and with a simple recognition device. Furthermore, even if a pseudo lead with a mark for position recognition is provided in addition to the lead for connection with the electrode,
Alternatively, a similar effect can be obtained by providing a protrusion for position recognition protruding from the periphery of the main body.
第１図〜第４図はそれぞれ本発明の各実施例におけるリ
ード付電子部品の平面図、第５図は従来のリード付電子
部品の平面図である。
１−一−−−・−−−−−一−−−−−−−−−・−・
−・−電子部品２−・・・・・−・−・−−−−一−・
・−・・−・−電子部品本体３・−・・・−・−・・・
・−・−−一−−−−−・−・リードマ
ーク
擬イ以リード
位置認識突部
■ノツチ（マーク）1 to 4 are plan views of leaded electronic components according to embodiments of the present invention, and FIG. 5 is a plan view of a conventional leaded electronic component. 1-1----・-------1--
−・−Electronic parts 2−・・・・−・−・−−−−1−・
・−・・−・−Electronic component body 3・−・−・−・・
・−・−−１−−−−−・−・Lead mark pseudo-I or lead position recognition protrusion ■Notch (mark)
Claims (3)
適当なリード上に位置認識用のマークを形成したことを
特徴とする電子部品。(1) Among the leads protruding from the side of the electronic component body,
An electronic component characterized by having a position recognition mark formed on a suitable lead.
のマークを形成した擬似リードを突設したことを特徴と
する電子部品。(2) An electronic component characterized in that a pseudo lead with a mark for position recognition is provided protruding from an appropriate location on the side of the electronic component body.
識用の突部を突設したことを特徴とする電子部品。(3) An electronic component characterized by having a protrusion for position recognition protruding outward from an appropriate location around the electronic component body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2250911A JPH04129259A (en) | 1990-09-19 | 1990-09-19 | Electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2250911A JPH04129259A (en) | 1990-09-19 | 1990-09-19 | Electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04129259A true JPH04129259A (en) | 1992-04-30 |
Family
ID=17214859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2250911A Pending JPH04129259A (en) | 1990-09-19 | 1990-09-19 | Electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04129259A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5525841A (en) * | 1994-02-22 | 1996-06-11 | Nec Corporation | Power gaAs fet having internal matching circuit |
| US5643835A (en) * | 1992-12-18 | 1997-07-01 | Lsi Logic Corporation | Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs |
| WO2017085866A1 (en) * | 2015-11-20 | 2017-05-26 | 新電元工業株式会社 | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63215060A (en) * | 1987-03-04 | 1988-09-07 | Matsushita Electric Ind Co Ltd | Semiconductor device |
-
1990
- 1990-09-19 JP JP2250911A patent/JPH04129259A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63215060A (en) * | 1987-03-04 | 1988-09-07 | Matsushita Electric Ind Co Ltd | Semiconductor device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5643835A (en) * | 1992-12-18 | 1997-07-01 | Lsi Logic Corporation | Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs |
| US5525841A (en) * | 1994-02-22 | 1996-06-11 | Nec Corporation | Power gaAs fet having internal matching circuit |
| WO2017085866A1 (en) * | 2015-11-20 | 2017-05-26 | 新電元工業株式会社 | Semiconductor device |
| JPWO2017085866A1 (en) * | 2015-11-20 | 2017-11-16 | 新電元工業株式会社 | Semiconductor device |
| US10553523B2 (en) | 2015-11-20 | 2020-02-04 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor device |
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