JPS622692A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPS622692A JPS622692A JP14215885A JP14215885A JPS622692A JP S622692 A JPS622692 A JP S622692A JP 14215885 A JP14215885 A JP 14215885A JP 14215885 A JP14215885 A JP 14215885A JP S622692 A JPS622692 A JP S622692A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- printed wiring
- wiring board
- solder resist
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の技術分野］
この発明は例えばテレビジョン受像機及びビデオテープ
レコーダ等の音ＩＩ器を含む電子機器に搭載される印刷
配線基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a printed wiring board mounted on an electronic device including a second audio device such as a television receiver and a video tape recorder.
［発明の技術的背景］
一般に、この種の印刷配線基板は第４図に示すように基
板１のに所定の位置にチップ部品搭載用の装着ランド２
を所定の間隔に形成し、この装着ランド２にソルダーレ
ジスト枠３を取着して上記基板１上にソルダーレジスト
４を形成した後、図示しない装置Ｉ機械により上記装着
ランド２の各銅箔コーナ部５を判別してセンター位置６
を検出し、チップ部品（第４図中では図示せず）を装着
ランド２の所定の位置に搭載するようになっている。[Technical Background of the Invention] Generally, this type of printed wiring board has a mounting land 2 for mounting chip components at a predetermined position on a board 1, as shown in FIG.
are formed at predetermined intervals, a solder resist frame 3 is attached to the mounting land 2, and a solder resist 4 is formed on the substrate 1. After that, each copper foil corner of the mounting land 2 is part 5 and center position 6
is detected, and a chip component (not shown in FIG. 4) is mounted at a predetermined position on the mounting land 2.
［背景技術の問題点］
ところが、上記印刷配線基板では、その構成上、装着ラ
ンド２にソルダーレジスト枠３を取着してソルダーレジ
スト４を形成する際、第５図に示すようにソルダーレジ
スト枠３に位置ずれが生じると、ソルダーレジスト４が
装着ランド２の位置判定用の銅箔コーナ部５に重なって
形成されるという問題を有していた。これによれば、チ
ップ部品を装着ランド２に装着する際、装ｗｉ械が装着
ランド２間の正規のセンター位置６を判別することが困
難なためにチップ部品が誤搭載されるおそれを有してい
る。また、第６図に示すように装着ランド２間にパター
ン７を形成する場合には、該パターン７をソルダーレジ
スト４で被覆する必要があることで、ソルダーレジスト
枠３を予め位置ずれを考慮して装着ランド２の銅箔コー
ナ部５に位置するように設計しなければならないために
、装着ランド２間のセンター位置６の判別が特に問題と
なっていた。[Problems with Background Art] However, due to the structure of the printed wiring board described above, when attaching the solder resist frame 3 to the mounting land 2 to form the solder resist 4, the solder resist frame 3 is attached to the mounting land 2 as shown in FIG. If a positional shift occurs in 3, there is a problem in that the solder resist 4 is formed overlapping the copper foil corner portion 5 for determining the position of the mounting land 2. According to this, when mounting a chip component on the mounting land 2, it is difficult for the mounting machine to determine the correct center position 6 between the mounting lands 2, so there is a risk that the chip component may be incorrectly mounted. ing. Furthermore, when forming the pattern 7 between the mounting lands 2 as shown in FIG. 6, it is necessary to cover the pattern 7 with the solder resist 4, so that the positional shift of the solder resist frame 3 must be taken into account in advance. Since the copper foil corner portion 5 of the mounting land 2 must be designed to be located at the copper foil corner 5 of the mounting land 2, determining the center position 6 between the mounting lands 2 has been particularly problematic.
〔発明の目的］
この発明は上記の事情に鑑みてなされたもので、簡易な
構成で、かつ、装着ランドの判別を確実に行ない得るよ
うにして可及的にチップ部品の搭載精度を向上し得るよ
うにした印刷配線基板を提供することを目的とする。[Objective of the Invention] The present invention has been made in view of the above circumstances, and is intended to improve the mounting accuracy of chip components as much as possible by having a simple configuration and reliably identifying the mounting land. It is an object of the present invention to provide a printed wiring board that can be obtained.
［発明の概要］
すなわち、この発明はチップ部品が搭載される複数の装
着ランドの互いの対向面に凸形状のパターン認識部を形
成することによって、ソルダーレジストに位置ずれが生
じた場合においても前記装着ランド間のセンター位置を
確実に識別し得るように構成し、所期の目的を達成した
ものである。[Summary of the Invention] That is, the present invention forms convex pattern recognition portions on mutually opposing surfaces of a plurality of mounting lands on which chip components are mounted, so that even when a positional shift occurs in the solder resist, The structure is such that the center position between the mounting lands can be reliably identified, and the intended purpose has been achieved.
「発明の実施例］
以下、この発明の実施例について、図面を参照して詳細
に説明する。“Embodiments of the Invention” Examples of the present invention will be described in detail below with reference to the drawings.
第１図はこの発明の一実施例に係る印刷配線基板の要部
を取出して示すもので、その基板１０には所定の間隔に
チップ部品搭載用の装着ランド１１が形成される。これ
ら装着ランド１１にはその互いに対向する面部にランド
幅より幅狭な凸形状のパターン認識部１２が第２図に示
すようにチップ部品に対応して形成される。そして、上
記基板１０にはソルダーレジスト枠１３を用いて上記装
着ランド１１以外の部分にソルダーレジスト１４が形成
された後、図示しない装着機械で上記装着ランド１１間
のセンター位置１５を判定しながらチップ部品１６が搭
載される。FIG. 1 shows a main part of a printed wiring board according to an embodiment of the present invention, and mounting lands 11 for mounting chip components are formed on the board 10 at predetermined intervals. As shown in FIG. 2, convex pattern recognition portions 12 having a width narrower than the land width are formed on opposing surfaces of these mounting lands 11 in correspondence with chip components. After a solder resist 14 is formed on the substrate 10 at a portion other than the mounting lands 11 using the solder resist frame 13, the chip is placed while determining the center position 15 between the mounting lands 11 using a mounting machine (not shown). Part 16 is mounted.
すなわち、上記構成において、基板１０の装着ランド１
１にチップ部品１６を搭載する場合、該装着ランド１１
に形成したパターン認識部１２を判定して装着ランド１
１間のセンター位置１５が判定されてチップ部品１６が
正規の位置に搭載される。That is, in the above configuration, the mounting land 1 of the board 10
1, when mounting the chip component 16 on the mounting land 11
The pattern recognition part 12 formed on the mounting land 1 is determined by
The center position 15 between 1 and 1 is determined, and the chip component 16 is mounted at the correct position.
また、上記印刷配線基板はその製造工程において、装着
ランド１１に対してソルダーレジスト枠１３が位置ずれ
を起して取着されてソルダーレジスト１４が形成された
場合、ソルダーレジスト１４がパターン認識部１２に及
ぶことなく、以後のチップ部品１６の搭載作業に支障を
来たすことがないもので、該パターンａ識部１２のｉ！
！識が可能となされる。しかして、上記印刷配線基板は
そのパターン認識部１２により装着ランド１１間のセン
ター位置１５の正確な判定が行われ、チップ部品１６を
装着ランド１１の正規の位置に搭載させることができる
ものである。Further, in the manufacturing process of the printed wiring board, if the solder resist frame 13 is attached to the mounting land 11 with a positional shift and the solder resist 14 is formed, the solder resist 14 is attached to the pattern recognition part 12. The i!
! knowledge is made possible. Therefore, in the printed wiring board, the pattern recognition unit 12 accurately determines the center position 15 between the mounting lands 11, and the chip component 16 can be mounted at the correct position on the mounting land 11. .
このように、上記印刷配線基板は装着ランド１１に互い
に対向するパターン認識部１２を設け、ソルダーレジス
ト１４が位置ずれを起して形成された場合においても、
上記パターン認識部１２の判定を行ない得るように構成
したので、可及的にチップ部品１６の誤搭載を防止し得
るもので、製品の信頼性の向上に寄与し得る。In this way, the printed wiring board has the pattern recognition parts 12 facing each other on the mounting land 11, so that even if the solder resist 14 is formed with misalignment,
Since the structure is configured such that the pattern recognition section 12 can perform the determination, it is possible to prevent incorrect mounting of the chip component 16 as much as possible, which can contribute to improving the reliability of the product.
尚、この発明は上記実施例に限ることなく、その外、こ
の発明の要旨を逸脱しない範囲で種々の変形を実施し得
ることはいうまでもないことである。It goes without saying that the present invention is not limited to the above embodiments, and that various modifications can be made without departing from the spirit of the invention.
「発明の効果コ
以上詳述したように、この発明によれば、簡易な構成で
、かつ、装着ランドの判別を確実に行ない得るようにし
て可及的にチップ部品の搭載精度を向上し得るようにし
た印刷配線基板を提供するができる。"Effects of the Invention As detailed above, according to the present invention, it is possible to improve the mounting accuracy of chip components as much as possible with a simple configuration and to be able to reliably identify the mounting land. It is possible to provide a printed wiring board having such a structure.
第１図はこの発明の一実施例に係る印刷配線基板の要部
を示す構成説明図、第２図は第１図の装着ランドとチッ
プ部品との関係を示す配置図、第３図は第１図の動作を
説明するために示した状態図、第４図乃至第６図はそれ
ぞれ従来の印刷配線基板を説明するために示した構成図
である。
１０・・・基板、１１・・・装着ランド、１２・・・パ
ターン認識部、１３・・・ソルダーレジスト枠、１４・
・・ソルダーレジスト、１５・・・センター位置、１６
・・・チップ部品。FIG. 1 is a configuration explanatory diagram showing the main parts of a printed wiring board according to an embodiment of the present invention, FIG. 2 is a layout diagram showing the relationship between the mounting land of FIG. 1 and chip components, and FIG. FIG. 1 is a state diagram shown to explain the operation, and FIGS. 4 to 6 are configuration diagrams shown to explain the conventional printed wiring board. DESCRIPTION OF SYMBOLS 10... Board, 11... Mounting land, 12... Pattern recognition part, 13... Solder resist frame, 14...
...Solder resist, 15...Center position, 16
...Chip parts.
Claims (1)
品を搭載してなる印刷配線基板において、前記装着ラン
ドの互いの対向面に凸形状のパターン認識部を具備した
ことを特徴とする印刷配線基板。A printed wiring board in which chip components are mounted on a plurality of mounting lands formed on a board, characterized in that a convex pattern recognition portion is provided on mutually opposing surfaces of the mounting lands. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14215885A JPS622692A (en) | 1985-06-28 | 1985-06-28 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14215885A JPS622692A (en) | 1985-06-28 | 1985-06-28 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS622692A true JPS622692A (en) | 1987-01-08 |
Family
ID=15308709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14215885A Pending JPS622692A (en) | 1985-06-28 | 1985-06-28 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS622692A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0262770U (en) * | 1988-10-28 | 1990-05-10 | ||
| JPH05251858A (en) * | 1993-01-14 | 1993-09-28 | Ibiden Co Ltd | Printed-circuit board for surface mounting |
-
1985
- 1985-06-28 JP JP14215885A patent/JPS622692A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0262770U (en) * | 1988-10-28 | 1990-05-10 | ||
| JPH05251858A (en) * | 1993-01-14 | 1993-09-28 | Ibiden Co Ltd | Printed-circuit board for surface mounting |
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