JPS60121793A - Method of producing thick film hybrid integrated circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing a thick film hybrid integrated circuit board in which a recognition mark is provided on a thick film board so that the mounting position of circuit components is corrected. .

[Prior art]

The assembly process for thick film hybrid integrated circuits is diepond.

Bonding processes such as wire bonding, capacitors,
The process of mounting electronic components such as resistors and chip components such as mini-7-wire semiconductor devices, and the soldering process of disk IJ-toad components and external leads are comprised of three processes. Among these processes, in particular, Semiconductors such as transistors, diodes, and ICs are used in the front-end process.

The conventional method for manufacturing thick film hybrid integrated circuit boards is as shown in Figure 1, which is a schematic plan view of a thick film board with recognition marks. Two marks (2) are formed at positions A and B. This recognition mark is made of a black ruthenium-based resistor or a dielectric of the same color, and is used simultaneously after the conductor circuit pattern (not shown) of the thick film circuit is formed and when the resistor pattern or dielectric pattern is formed. Additionally formed. In this way, the thick film circuit pattern formed on the thick film substrate (1) is covered with a protective dielectric glass (not shown) except for the component mounting area.

Conventionally, the above recognition mark (2) was used and the process was carried out as follows. The thick film board +11 is equipped with a recognition mark (2) and a pattern recognition function, and by recognizing the mounting point of the component with the recognition mark (2) for each board +1+,
The positional deviation of the board (1) is calculated by an electronic computer and corrected with the X-ray, Y-axis and inclination angle V of the mounting point, and the mounting operation is started.

The method using the conventional recognition mark (2) described above converts the image into a black and white image by contrast between the white thick film substrate (1) surface and the black recognition mark (2), and converts it into a binary signal level using electronic division. The positional shift of the thick film substrate [11] is detected and corrected. In this case, in order to ensure the stability of the binarization level, a blackish resistor or dielectric material is used as the recognition mark (2) for convenience. However, the component mounting point is originally not placed on the resistor or dielectric, but on the silver-palladium based conductor of the circuit pattern formed on the surface of the substrate i11. Therefore, there is a deviation between the previously applied conductor and the subsequently applied recognition mark (2) within the tolerance for overlay accuracy of thick film printing.

The manufacturing method using the conventional recognition mark (2) described above can satisfy the positional accuracy of 200 μ or less required for mounting chip components such as capacitors, resistors, and mini-molded elements.

However, in the case of bonding processes such as Gui-bond and wire-bond, which require higher positional accuracy within 50 μm, the recognition mark (2) has the drawback of producing defective products.

It is also possible to form a recognition mark with a conductor made of the same material at the same time as the silver-palladium conductor in the pattern applied on the substrate (1), but this would result in high positional accuracy. The button-palladium type C color was grayish-white, and there was no contrast with the white background of the +1i surface of the substrate, and the binarization level was unstable, which was inconvenient as a recognition mark.

[Summary of the invention]

This invention was made in order to eliminate the drawbacks of the above-mentioned conventional methods.In addition to forming a circuit pattern of a conductor on a thick film substrate, a recognition mark is formed using a conductor made of the same material, and a half-layer is formed on the conductor. By overlapping and printing thick films covered with transparent dielectric glass, the contrast between the ground color of the thick film board and the color of the recognition mark is increased, and the positioning accuracy is high and the detection level is high. It is an object of the present invention to provide a method for manufacturing a thick film hybrid integrated circuit board in which the mounting point is stable, the bonding position is accurate, the bonding position is high, and the position can be corrected.

[Embodiments of the invention]

FIG. 2 is a plan view of a thick film substrate showing a method of manufacturing a thick film hybrid integrated circuit board according to an embodiment of the present invention. A thick film circuit pattern (not shown) made of a silver-palladium based conductor is printed and fired on the upper surface of the thick film substrate (1). Simultaneously with the formation of this thick film circuit pattern, two recognition marks (5) made of a conductor made of the same material are printed and fired at positions A and B. (6) is a dielectric glass (not shown) that covers and protects the conductor, resistor, etc. forming the thick film circuit pattern, and at the same time is a glass coating layer that covers the recognition pattern (5) with the same material. The recognition mark portion formed on the thick film substrate H is shown in an enlarged cross-sectional view in FIG.

The dielectric glass constituting the glass coating layer (6) is semitransparent with a light edge color or light brown color. As a result, through this glass coating layer (6), the white part of the thick film substrate (+) becomes the color of the dielectric glass, and the recognition pattern (5) part becomes black as the gray of the conductor overlaps with the color of the dielectric glass. The closer the color, the darker it becomes, and the pattern recognized as optically thick film substrate +11 (6)
The contrast between the two images is clearly captured, and the binarization level during pattern recognition is stabilized.

In this way, the recognition mark (5), component mounting point, die bonding point, wire bonding point, etc. can be set using the same thick film conductor patterned in the same process as a reference, and each position coordinate data can be set. It is possible to perform highly accurate position correction of ±50μ required in the bonding process.

In the above embodiment, a silver-palladium-based conductor is used as the conductor, but the present invention can also be applied to conductors made of other materials with a color that has a weak contrast with the color of the thick film substrate (1). It is.

Further, in the above embodiment, the recognition mark (5) is square, but it may be of any other shape as long as the position of the thick film substrate (1) can be detected.

〔Effect of the invention〕

As described above, according to the present invention, a recognition pattern is formed on the surface of a thick film substrate using a conductor at the same time as a thick film circuit pattern, and a necessary part of the circuit pattern and the recognition pattern are covered with a conductive glass, This glass coating layer is made of a light-colored, semi-transparent layer that provides a contrast between the background color of the thick film substrate and the color of the recognition pattern.This recognition pattern is detected and the position of the thick film substrate is corrected, so that the detection level is is stabilized, highly refined position correction is possible, the accuracy of component mounting position and bonding position can be read, and quality is improved.

[Brief explanation of the drawing]

FIG. 1 is a schematic plan view of a stamped film substrate with recognition marks showing a conventional method of manufacturing a thick film hybrid integrated circuit board, and FIG. 2 is a schematic plan view of a thick film hybrid integrated circuit board according to an embodiment of the present invention. Schematic plan view of a thick film substrate with identification marks indicating the method;
FIG. 3 is an enlarged sectional view of the recognition mark portion of the substrate shown in FIG. 2. 1... Thick film base・', LE, 5... Recognition pattern, 6
...Glass coating layer. Note that the same reference numerals in the figures indicate the same or equivalent parts. Agent Hiro Oiwa

Claims (1)

[Claims] +11 Forming a thick film circuit pattern using a conductor on the surface of a thick film substrate so that electronic components can be mounted thereon, forming a GM mark using the same conductor at the same time as forming the thick film circuit pattern, The required parts on the thick film circuit pattern and the upper gR mark are coated and protected with dielectric glass, and this glass coating layer is a thin film that enhances the contrast between the ground color of the thick film substrate and the color of the conductor of the recognition mark. A method for manufacturing a thick film hybrid integrated circuit board in which the color is translucent and the positions of component mounting points and bonding points on the thick film circuit pattern are corrected by detecting the recognition mark. (2) The method for manufacturing a thick film hybrid integrated circuit board according to claim 1, wherein the conductor is made of a complex-palladium metal.