JPS61222793A - Manufacture of integrated circuit card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing an IC card, and particularly to improving the positional accuracy of external terminal holes in a cover film thereof.

[Conventional technology]

Generally, IC cards have memory and CPU inside the card body.
It has a built-in IC module consisting of a card body, etc., and has a decorative cover film, such as a laminate film, attached to the top and bottom surfaces of the card body, and has a large storage capacity and arbitrary calculation functions such as a verification function. be.

As such an IC card, there has conventionally been one shown in FIG. In the figure, 1 is a base which is a card body made of vinyl chloride resin, and 2 is an I which is made of memory and CPU.
C modules 6 and 7 are attached to the upper and lower surfaces of the base 1 with adhesive tape 8, and a decorative laminate film 9 is formed on the laminate film 6° and adhesive tape 8 to cover both surfaces of the base 1. It is also an external terminal hole of the electrode 2a of the IC module 2.

[Problem that the invention seeks to solve]

By the way, in IC cards, laminate film 6
It is also necessary that the external terminal holes 9 formed in the adhesive tape 8 match the electrodes 2a of the IC module 2 with high precision. Therefore, in the above conventional IC card, an external terminal hole 9 is provided at a predetermined position of the laminate film 6 and the adhesive tape 8.
was formed by punching, and the laminate film 6 was attached to the base body 1 with an adhesive tape 8 so that both external terminal holes 9 were precisely positioned on the electrodes 2a.

However, this adhesive tape 8 and thus the laminate film 6 may shift when attached to the substrate 1, and the edge of the external terminal hole 9 tends to protrude onto the electrode 2a. It is difficult to position the IC card, and as a result, in the conventional IC card described above, there are problems in that the pasting work is complicated, the positioning accuracy of the external terminal hole is low, and the reliability of the adhesive strength of the electrode 2a portion is low. .

The present invention has been made in view of such conventional problems, and provides an IC card manufacturing method that can simplify the processing process and improve the mounting position accuracy and the reliability of the adhesive strength of the terminal hole portion of the cover film. It is intended to.

[Means for solving problems]

The present invention provides a method for manufacturing an IC card, in which a cover film is attached to the surface of a base body on which an IC module is embedded, and the cover film on the electrode side for the IC module is placed at a predetermined position based on the outer end surface of the base body. An external terminal hole is formed therein.

[Effect]

In the present invention, since a cover film without external terminal holes is attached onto the substrate, there is no need to align the terminal holes as in the conventional method, which simplifies the attachment process and improves adhesive strength. Furthermore, since the external terminal hole is formed by, for example, laser machining at a pre-memorized position with respect to the outer end surface of the base body, the positional accuracy of the size can be easily improved.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 are for explaining a method for manufacturing an IC card according to an embodiment of the present invention. In this embodiment, a base 1 has a built-in IC module 2 whose electrodes 2a are plated with gold. First, as shown in FIG. 1(a), laminate films 6. are placed on the upper and lower surfaces of the substrate 1.
7 is attached using adhesive tape 8. Here, the laminate film 6.7 is suitably made of a polyethylene resin having a high hydrogen content, for example, and a thermosetting film such as a phenol resin is not suitable.

Next, external terminal holes 9 are formed in the laminate film 6 and adhesive tape 8 using a laser processing device (not shown). In this case, as shown in the first opening), the external terminal hole 9 is formed with the outer end surfaces 1a and lb of the base body l as a reference. Here, the distances x and y of each electrode 2a from the outer end surfaces 1a and lb of the base body 1 are stored in the laser processing apparatus, and the laser beam is irradiated to the x and y positions.

Then, the laser beam is reflected from the gold-plated surface of the electrode 2a, so that only the laminate film 6 and the adhesive tape 8 are melted. Also, since the laminate film 6 is made of polyethylene resin with a high hydrogen content, carbon etc. will not remain.

In this way, in the method of this embodiment, after the laminate film 6 is attached to the surface of the base 1, the external terminal holes 9 are formed by laser processing with reference to the outer end surfaces 1a and lb of the base 1. The complicated work of attaching a cover film while aligning punched external terminal holes with electrodes is no longer necessary, and the work of attaching the laminate film 6 is extremely easy. Furthermore, the adhesive strength of the laminate film 6 to the base body 1 can be improved, and the positional accuracy of the external terminal holes can also be improved.

In addition, in the above embodiment, the case where the laminate film 6 is made of epoxy resin has been explained, but this film is not limited to being made of epoxy resin, and may be one that has a high hydrogen content and does not leave carbon during laser irradiation. Good to have. Furthermore, it goes without saying that the method for forming the external terminal hole 9 is not limited to laser processing.

〔Effect of the invention〕

As described above, according to the method for manufacturing an IC card according to the present invention, a cover film is attached to the surface of the base, and holes for external terminals are formed in the cover film with reference to the outer end surface of the base. The hole forming operation is easy, and the adhesive strength of the cover film and the positional accuracy of the external terminal holes can be improved.

[Brief explanation of drawings]

FIGS. 1(a) and 1(b) show an IC according to an embodiment of the present invention.
FIG. 2 is a process diagram for explaining the method of manufacturing the card, and is a sectional view showing the IC card according to the above embodiment and the conventional IC card. In the figure, 1 is the base, la and lb are the outer end surfaces of the base, and 2
2a is an IC module, 2a is an electrode, 6 is a laminate film (cover film), and 9 is an external terminal hole.

Claims (2)

[Claims] (1) An IC module is embedded in the upper surface of a substrate, a cover film is attached to the upper and lower surfaces of the substrate, and the electrodes of the IC module are placed on the upper cover film at predetermined positions with reference to the outer end surface of the substrate. A method for manufacturing an IC card, comprising forming an external terminal hole for extraction. (2) A patent characterized in that the electrodes of the IC module are plated with gold on their surfaces, the cover film on the top surface is made of polyethylene resin, and the external terminal holes are formed by laser processing. A method for manufacturing an IC card according to claim 1.