JPH01220891A - Method of mounting electronic part - Google Patents

Abstract

PURPOSE:To reduce defective soldering while improving reliability and workability by positioning and fixing an electronic part at a required relative position to a part mounting hole by an adhesive tape and soldering the electronic part to a board. CONSTITUTION:An adhesive tape 7 in proper size is stuck onto the rear of a board 1, a chip part 4 is housed so as to be accurately positioned at a necessary relative position to a part mounting hole 2, the rear of the chip part 4 is fastened by the adhesive tape 7, and the chip part 4 is held at the precise position of housing. Consequently, the chip part 4 is positioned and fixed correctly into the part mounting hole 2, and board electrodes and part electrodes 3a and 5a, 3b and 5b corresponding to the board electrodes are soldered 6 respectively. Since the chip part 4 is soldered 6 and connected under the state in which it is positioned accurately into the part mounting hole 2, the quantities of solder 6 in each connecting section are made proper, thus acquiring appropriate strength, and improving reliability.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Field of Application) The present invention relates to a method for mounting electronic components on a board installed in, for example, an IC card or the like.

(Prior art) An IC card is a pocket-sized card body with a CPU
and a tC chip constituting a memory, and a hole/contact is provided on the surface of the card body for transmitting and receiving required data with an external device such as a reader/writer. According to the 180 (International Standardization System) standard, the thickness of the card base is specified to be 0.76 mm. Since it is necessary to embed an IC chip or the like in such a thin card base, thin mounting is adopted for IC cards, and a thin film carrier or the like is used as a mounting substrate.

By the way, IC cards are of a standard format with an IC chip as described above, but in recent years, in order to have multiple functions, IC cards have been equipped with crystal cameras, liquid crystal display boards, thin batteries, resistors, and capacitors. A card base is being considered in which necessary electronic components such as chip components such as the above are built into the card base.

Figures 3 (A) and (B) and Figure 4 (A) and (B) show conventional electronic component mounting in which such electronic components are mounted on the connecting portions of the board by soldering or connecting. Shows how.

In these figures, reference numeral 1 denotes a thin board, and rectangular component mounting holes 2 corresponding to the shape of the components are bored in required parts of the board 1, and board electrodes 3a13b are provided on both sides of the holes 2. . 4 is a chip component such as a resistor, and component electrodes 5a are provided at both ends thereof.

5b is formed.

Then, the board 1 is placed on the workbench, the chip components 4 are stored in the component mounting holes 2, and the board electrodes and the corresponding component electrodes 3a and 5a, 3b and 5b are soldered, respectively. A chip component 4 is mounted on a substrate 1 by connection. Thereafter, the board 1 is installed in a card base to complete an IC card incorporating necessary electronic components. As described above, since the mounting board applied to an IC card or the like is mounted inside a thin card base, the thickness of the board 1 may increase in the mounting area of the electronic component due to vertical positional displacement of the electronic component. There is no electronic component in the component mounting hole 2.
Correctly positioned and soldered connections are required.

(Problem to be Solved by the Invention) Conventionally, the board 1 is placed on a workbench, and the chip component 4 as an electronic component is housed in the component mounting hole 2 without being particularly positioned and fixed, and soldering is not performed. Because the connection was made, the chip component 4 was too eccentric to one side in the component mounting hole 2 (Fig. 3 (A)) and was misaligned diagonally (Fig. 3 (B)).
The chip components 4 may be soldered with
There are cases where soldering is connected with one end of the chip component 40 shifted upward (Figure 4 (A)) or with both ends of the chip component 40 shifted in both the vertical directions (Figure 4 (B)). If soldering is performed in a state where misalignment occurs, there will be excess or insufficient amount of solder at the connection part, solder will wrap around to the side of the board 11, etc., and the strength of the connection part will deteriorate, reducing reliability. Moreover, the thickness of the board 1 increases at the portion where electronic components are mounted, which may make it difficult to install it into the card base, and furthermore, there are problems in that workability is poor.

This invention was made based on the above circumstances, and it is possible to connect by soldering while the electronic component is accurately positioned and fixed at the required relative position with respect to the component mounting hole, and soldering reduces defects. It is an object of the present invention to provide a method for mounting electronic components, which can improve reliability by providing appropriate strength to the connection portion, and further improve workability.

[Structure of the Invention] (Means for Solving Problem M1) In order to solve the above-mentioned problem, this invention uses an adhesive tape to attach an electronic component to be mounted in a component mounting hole formed on a mounting board. After fixing and positioning the electronic component at a relative position, the electronic component is soldered to the board.

(Function) After the electronic component is positioned and fixed at a required relative position to the component mounting hole with adhesive tape, it is soldered to the board. Therefore, soldering is performed with the electronic component accurately positioned in the component mounting hole, and there is no excess or deficiency in the amount of solder at the connection part, which provides appropriate strength and improves workability. will improve.

(Example) Hereinafter, an example of the present invention will be described with reference to FIGS. 1 and 2.

In addition, in FIGS. 1 and 2, the above-mentioned FIGS.
Items that are the same or equivalent to the parts and parts in the diagrams are
The same reference numerals as above are used to omit redundant explanation.

First, we will explain the members applied to this example.
In FIGS. 1 and 2, 6 is solder and 7 is an adhesive tape. The adhesive tape 7 is made of a material that can withstand soldering temperatures and does not cause deformation or breakage.

Next, a method and operation of mounting the chip component 4 as an electronic component onto the substrate 1 will be explained.

Adhesive tape 7 of an appropriate size is pasted on the back surface of the board 1, and then the chip component 4 is housed so as to be correctly positioned at the required relative position with respect to the component mounting hole 2, and the back surface is covered with the adhesive tape 7. Fixed and held in the correct storage position. After the chip component 4 is accurately positioned and fixed in the component mounting hole 2 in this way, the substrate electrodes and the corresponding component electrodes 3a and 5a, and 3b and 5b are soldered 6, respectively.

Since the chip component 4 is connected with the solder 6 while being accurately positioned in the component mounting hole 2, each connection part will not have an excess or deficiency of 6 m of solder, and will have appropriate strength. This improves reliability. Furthermore, since the chip component 4 is held fixed during soldering, work efficiency is improved.

Note that after soldering is completed, the adhesive tape 7 is usually peeled off, but if desired, it can be used as it is as an insulating sheet without being peeled off.

[Effects of the Invention] As explained above, according to the present invention, an electronic component is positioned and fixed at a required relative position with respect to a component mounting hole using an adhesive tape, and then the electronic component is soldered to a board. Therefore, the electronic components are accurately positioned in the component mounting holes when soldering is performed, reducing the number of soldering defects and providing appropriate strength to the connections, improving reliability and further improving workability. The advantage is that it can be improved. Therefore, it is possible to provide an extremely suitable mounting method for mounting electronic components onto an IC card or the like.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing the mounting state of electronic components on a board obtained in an embodiment of the electronic component mounting method according to the present invention, FIG. 2 is a sectional view taken along line n-I in FIG. The figure is a diagram for explaining problems in the conventional electronic component mounting method, and FIG. 4 is a diagram for explaining other problems in the conventional example. 1: Board 2: Component mounting hole 4: Chip component (electronic component) 6: Solder 7: Adhesive tape.

Claims (1)

[Claims] The electronic component to be mounted is fixed and positioned at a required relative position with an adhesive tape in a component mounting hole formed on a mounting board, and then the electronic component is soldered to the board. How to mount electronic components.