JPS6134687A - Ic card - Google Patents

Abstract

PURPOSE:To obtain an IC module which can be installed correctly to a reference position by embedding an IC module of a plane shape, which contains an IC chip of a microcomputer, etc., and has cut a circle partically by a straight line, into a synthetic resin sheet base body. CONSTITUTION:Etching is executed to a glass epoxy film substrate 1 in order to obtain a desired pattern by using a printed circuit use film laminated with a copper foil. Thereafter, nickel plating and gold plating are executed, and a connecting terminal use electrode pattern 2 and a circuit pattern 3 are formed, and punched to a shape which has cut partially a circle of a desired size by a straight line. Subsequently, the patterns 2, 3 are connected electrically by a through-hole 4, an IC chip 5 is brought to die bonding, and an electrode 6 and the pattern 3 are connected by an electric conductor 7. Next, an IC module 10 is obtained by installing a bonding frame 8 to the substrate 1, and molding it by an epoxy resin 9. This IC module is embedded into a hole provided by punching, etc. on a desired position of a milk-white hard vinyl chloride sheet, an embedded substrate of a half hardened glass epoxy sheet is put in, and a card is obtained.

Description

Detailed Description of the Invention (Technical Field of the Invention) The present invention relates to the structure of an IC card, and particularly to an IC module in which all electrical elements including one or more IC chips and a circuit board are modularized. The present invention relates to an IC card mounted on a card base material, which facilitates the manufacture of the IC card and improves its reliability.

(Technical background of the invention and its problems) In recent years, chip cards and memory cards are equipped with or have built-in IC modules that are modularized IC chips such as microcomputers and memories.

Research and development is being carried out on cards called microcomputer cards, electronic cards, etc. (hereinafter simply referred to as IC cards). This IC card has a larger storage capacity than a conventional magnetic stripe card, so it can be used in the financial field to record and store deposit history in place of a bankbook.
In the field of credit, it is being considered to record and store transaction history such as shopping.

As a method for embedding such an IC module in a card base material, four IC module-sized parts are provided in a laminated power card base material using an end mill, a drill, etc.
There is a method of embedding an IC module in these four parts using an adhesive, and a method of embedding the IC module by punching, end milling, drilling, etc. at the desired position of a lamination sheet having a thickness equivalent to the IC module.
After creating a C module-sized burial hole, a lamination sheet for supporting the IC module is temporarily pasted and laminated, and then the IC module is buried in the burial hole and press lamination is performed. .

In any case, IC modules require a certain degree of rigidity in order to provide durability against bending due to external forces, etc., and if an elastic card base material is used, the card cannot be used while being carried. There is a problem in that the card folds or cracks along the edges of the module in response to forces that bend the substrate. That is, FIG. 1 shows a conventional IC car 120, which has a rectangular IC.
The module 21 is attached to the surface of the IC card 20, but with such a rectangular IC module 21, when the card is bent, its outer circumference (especially the inside of the card)
The card is easily bent or broken along the straight line 21A.

To prevent such card bending or card cracking, it is preferable to form the IC module into a circular shape as shown in FIG. However, when using the circular IC module 22,
There is a drawback that it is easy to deviate from the reference line (angle θ) when installed, making it difficult to maintain a normal external connection terminal position. Furthermore, when performing wire bonding or wire bonding of IC chips, there is also the problem that it is difficult to position the circuit board, which is the base of the IC module.

(Object of the invention) This invention was made under the above circumstances,
It is an object of the present invention to provide an IC module that can prevent card bending and card cracking and that can correctly mount the IC module in a reference position.

(Summary of the Invention) This invention relates to an IC card, in which an IC module containing an IC chip such as a microcomputer, memory, etc. and having a planar shape in which a circular part is partially cut with a straight line is mounted and buried in a synthetic resin sheet body. It is something.

(Embodiments of the Invention) FIG. 3 shows a cross section of an IC module used in the present invention, and this IC module is manufactured as follows.

First, a glass epoxy film substrate 1 with a thickness of approximately 0.11!1 is etched using a printed wiring film laminated with 18 ga+ copper foil to obtain a desired pattern, and then nickel and gold plating is applied. Then, an electrode pattern 2 for connecting terminals with the outside and a circuit pattern 3 are formed, and a circular shape of a desired size is partially cut along a straight line to form a shape as shown in FIG. 4. Next, the connection terminal electrode pattern 2 and the circuit pattern 3 are electrically connected through the through holes 4 at necessary locations. Then, the IC chip 5 is die-bonded at a predetermined position on the circuit pattern 3, and the electrode 6 of the IC chip 5 and the circuit pattern 3 are connected by a wire bonding method using a conductor 7.

Note that this part can also be implemented by a two-way bonding method that does not use wires, and in that case, a thinner IC module can be obtained. On the other hand, before the bonding process, a botting frame 8 made of a material such as glass epoxy is attached to the glass epoxy film substrate 1 with an epoxy adhesive or the like to prevent the resin from flowing during epoxy resin sealing. IC chip 5 and circuit pattern 3
After making the connection, the epoxy resin 9 is poured and molded.The IC module 10 for the IC card can be obtained by the method described above. 2 and how to form IC chip 5
All of the methods described here, including the method of bonding, are compatible with current technology in the relevant industry.

Using the IC module 10 obtained in this way,
A target IC card according to the present invention can be obtained by the following method. Hereinafter, as an example, one card base material is made of hard vinyl chloride, and a glass cloth impregnated with an epoxy resin having heat-adhesive curing properties is used as an embedded substrate provided in the card base material to prevent the peeling of the IC module IO. That is, the case where a B-stage glass epoxy sheet is used will be described.

FIG. 5 is a plan view of the IC card of the present invention, and FIG. 6 is a cross-sectional view taken along the line X-X in FIG. ) 14, the transparent hard vinyl chloride sheets 12b, 12c, and 11 are temporarily pasted and laminated, and module embedding holes are punched out at desired locations. Align the desired IC module embedding location on the milky white hard vinyl chloride sheet (12d) and insert the IC.
A hole in which a buried substrate 13 made of, for example, a stainless steel plate and approximately the same size as the module 10 is to be buried is provided by a punching method or the like.

Next, from the bottom layer, transparent hard vinyl chloride sheets 1
2F, a milky white hard vinyl chloride sheet supporting the IC module 10 and the embedded substrate 13)+2c, and the above-mentioned punched sheets 12d, 11, 12c, 12b and 12a.
are aligned and laminated into a laminated sheet. Then, a buried substrate 13 made of a semi-cured (B stage) glass epoxy sheet is installed in the buried substrate hole provided at 12d, and a module 10 is installed in the IC module buried hole, and a temporary laminated laminate is installed in the IC module embedding hole. get. The laminate thus obtained is made of mirror-finished material such as stainless steel.
Clamped between two metal plates, temperature 150℃, pressure 25kg
/crn', under the lamination conditions of 30 minutes to obtain a hard vinyl chloride laminate in which the IC module IO is embedded. Punch out the card to obtain the desired card.

In the embodiment described in -, the IC module is mounted with the partially cut side 10G of the IC module 10 facing the side of the IC card, but in order to facilitate positioning during mounting, the cut side 10G is may be placed parallel to the side or top and bottom surfaces. The IC module IOA in Figure 7 is cut side 1.
An example is shown in which 0C faces the top surface, and an example in which the cut side 10G of the IC module IOB faces inward is shown. However, if the cut sides 10G are turned inward as in the IC module IOH, the cut sides 10G are likely to be bent or broken along the straight line 100, as described above, so it is desirable that the cut sides 10G are turned outward.

On the other hand, FIG. 8 shows a configuration other than this invention,
As the above-mentioned embedded substrate 13, an uncured epoxy film lea is placed on both sides of a cured epoxy plate or other metal plate 15.
, IBb is used.

There is no limit to the thickness S of all the vinyl chloride sheets and buried substrates used, but for example, sheets +2a-12f have a thickness of about 0.1 mm, sheet 11 has a thickness of about 0°2mm, and buried substrate 13 has a thickness of about 0.1 mm. ) 12d, and therefore, by making the IC module IO about 0.1 mm thick and the IC module IO about 0.5 mm thick, it is possible to obtain an IC card about 0.8 mm thick. Furthermore, there is no particular restriction on the number of vinyl chloride sheets stacked, and it can be made smaller or larger than in the example. However, it is advantageous if the sheet in which the holes for installing the buried substrate are formed has the same thickness as the buried substrate because of better workability.

Furthermore, as shown in FIG. 9, in the IC module used in the present invention, one of the six electrodes 30 to 35, for example, the electrode 35, is electrically connected to the surrounding wide area 3B,
This electrode 35 may be used as a ground electrode. In this case, since the other electrodes 30 to 34 are all surrounded by the ground area, destruction of the IC chip due to static electricity can be prevented.

(Effect of the invention) As described above, according to the IC card of this invention, the circular I
Since a part of the C module is cut in a straight line, positioning for mounting on the card base is easy, and card bending and card cracking can be prevented.

[Brief explanation of drawings]

1 and 2 are external views showing an example of a conventional IC card, FIG. 3 is a sectional structural view showing an example of an IC module used in the present invention, FIG. 4 is a view showing its shape, and FIG. The figure is an external view showing an example of the IC card of this invention.
The figure is a sectional view taken along line XX in FIG. , FIG. 9 is a diagram showing an example of the electrodes of the IC module of the present invention. 1... Glass epoxy film substrate, 2... Electrode pattern, 3...
・Circuit pattern, 4...Through hole, 5...IC
Chip, 6... Electrode, 7... Conductor, 8... Potting frame, 9... Epoxy resin, 10... IC module, 11, 12a-12f... Hard vinyl chloride sheet-1,, 13... Embedded substrate, 14... Print pattern (picture), 18... Card base material. Written amendment (method) % formula % 2. Name of the invention IC card 3. Person making the amendment Relationship to the case Patent applicant Dai Nippon Printing Co., Ltd., 12-chome (28!3), Ichigaya Kaga-cho, Shinjuku-ku, Tokyo 4. Agent 5, date of amendment order: November 7, 1980 (shipping date: November 27, 1988) As per the engraving and attachment of the drawings attached to this application (no change in content)

Claims (3)

[Claims] (1) An IC card characterized in that an IC module containing an IC chip such as a microcomputer, memory, etc. and having a planar shape of a circular part cut with straight lines is mounted and embedded in a synthetic resin sheet base. (2) The IC card according to claim 1, wherein the dimension of the straight line obtained by partially cutting the IC module is the radius of a circle or larger than the radius. (3) The IC according to claim 1, wherein the partially cut straight line of the IC module faces the inside of the card.
card.