CN206627987U

CN206627987U - Smart card

Info

Publication number: CN206627987U
Application number: CN201720336195.6U
Authority: CN
Inventors: 陈柳章
Original assignee: Shenzhen Excelsecu Data Technology Co Ltd
Current assignee: Shenzhen Excelsecu Data Technology Co Ltd
Priority date: 2017-03-31
Filing date: 2017-03-31
Publication date: 2017-11-10
Anticipated expiration: 2027-03-31

Abstract

The utility model belongs to field of intelligent cards, more particularly to smart card.Aerial coil is directly arranged on circuit board, using first substrate as the carrier of circuit board, and sets second substrate or overlay film on the first substrate, card is formed by lamination, the recessing on card.Using the IC modules with chip, the function of IC modules is equivalent to the function after carrying unit and IC chip electrical connection in the prior art, and security is higher.IC modules are placed on groove, and are directly welded on the conducting medium of circuit board, IC modules are connected with aerial coil is fabricated to smart card.The smart card production efficiency is high, and production cost is relatively low, and security is higher, and customers' approval degree is higher.

Description

Smart card

Technical field

The utility model belongs to field of intelligent cards, more particularly to smart card.

Background technology

Double-interface smart card is the smart card for supporting contact and contactless two kinds of communication modes simultaneously, in the prior art Double-interface smart card production program be：First copper wire is wound on substrate and forms aerial coil, then is welded on circuit boards, IC cores Piece paster is on circuit board, and the IC chip is not in the IC chip position of standard card, then the IC that will carry unit and be placed on standard card Conducting medium welding on chip position simultaneously and on circuit board, carrier band unit and IC chip are connected by the circuit on circuit board, Program comparision of production is complicated, and production cost is higher.And this kind of customized solution cause fabrication progress compared with it is slow, efficiency is low.

Utility model content

The purpose of this utility model is to provide a kind of smart card, it is intended to solves the complicated skill of existing smart card comparision of production Art problem.

The utility model is achieved in that smart card, including：

First substrate；

The circuit board being arranged on the first substrate, the circuit board have aerial coil and contact zone, the antenna The end of the both ends lead of coil is respectively positioned on the contact zone, and the end of the both ends lead is equipped with conducting medium；

It is arranged on second substrate and/or overlay film of the circuit board departing from the side of the first substrate, the circuit Plate be fixed between the first substrate and the second substrate form a card or be fixed on the first substrate with it is described A card is formed between overlay film, the card is fluted corresponding to being opened up at the contact zone；And

IC modules with chip, the IC modules are in the groove, the IC modules and aerial coil electricity Connection.

Further, the circuit board is flexible PCB, and the edge of the aerial coil close to the circuit board is set Put.

Further, in addition to the first substrate is arranged at close to the center of the side of the circuit board, in described Frame has the holding tank for being used for accommodating the circuit board.

Further, the outer rim shape of the center is adapted with the outer rim shape of the first substrate.

Further, it is be bonded between the circuit board and the first substrate, between the center and the first substrate Bonding.

Further, the contact zone is offered for avoiding the IC modules toward the sphere side of the first substrate The first avoid holes, the both ends lead of the aerial coil gets around first avoid holes.

Further, the contact zone offers the second avoid holes for avoiding the IC modules, the aerial coil Both ends lead be the wire that is connected with the antenna contacts of the aerial coil.

Further, the escape groove for avoiding the wire is offered on the card.

Further, the IC modules are the contact module of the chip of band 7816.

Further, the outside of the first substrate is provided with surface printing layer.

The utility model is had the technical effect that relative to prior art, and aerial coil is directly arranged on circuit board, with Carrier of one substrate as circuit board, and second substrate or overlay film are set on the first substrate, card is formed by lamination, in card Upper recessing.Using the IC modules with chip, the function of IC modules is equivalent to carrier band unit in the prior art and IC chip electricity Function after connection, and security is higher.IC modules are placed on groove, and are directly welded on the conducting medium of circuit board, IC modules are connected with aerial coil is fabricated to smart card.The smart card production efficiency is high, and production cost is relatively low, and security is higher, Customers' approval degree is higher.

Brief description of the drawings

Fig. 1 is the front view for the smart card that the utility model first embodiment provides；

Fig. 2 is the sectional view of Fig. 1 smart card；

Fig. 3 is the three-dimensional exploded view of Fig. 1 smart card；

Fig. 4 is the front view for the smart card that the utility model second embodiment provides；

Fig. 5 is the front view for the smart card that the utility model 3rd embodiment provides.

Embodiment

In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining The utility model, it is not used to limit the utility model.

Refer to Fig. 1 to Fig. 3, the smart card that the utility model first embodiment provides, including first substrate 20；It is arranged at Circuit board 10 on first substrate 20, circuit board 10 have aerial coil 11 and contact zone 12, the both ends lead of aerial coil 11 111 end is respectively positioned on contact zone 12, and the end of both ends lead 111 is equipped with conducting medium 13；Circuit board 10 is arranged on to deviate from Second substrate 30 and/or overlay film in the side of first substrate 20, circuit board 10 are fixed on first substrate 20 and second substrate 30 Between form a card or be fixed between first substrate 20 and overlay film and form a card, card, which corresponds at contact zone 12, to be opened Provided with groove 21；And the IC modules 40 with chip, IC modules 40 are in groove 21, IC modules 40 and the electricity of aerial coil 11 Connection.Circuit board 10 is fixed between first substrate 20 and second substrate 30 situation for forming a card, included in second substrate 30 departing from situation of the side of first substrate 20 provided with overlay film one card of formation.

Aerial coil 11 is directly arranged on circuit board 10, the carrier using first substrate 20 as circuit board 10, and Second substrate 30 or overlay film are set on one substrate 20, card is formed by lamination, recessing 21 on card.Using with chip IC modules 40, the functions of IC modules 40 is equivalent to the function after carrying unit and IC chip electrical connection in the prior art, and safety Property is higher.IC modules 40 are placed on groove 21, and are directly welded on the conducting medium 13 of circuit board 10, IC modules 40 and day Line coil 11 is connected and is fabricated to smart card.The smart card production efficiency is high, and production cost is relatively low, and security is higher, client's accreditation Degree is higher.

Carrier of the circuit board 10 as aerial coil 11, aerial coil 11 are formed on the circuit board 10 by wire coiling, tool Body can use the existing process such as printing, corrosion to be made on circuit board 10.The contact zone 12 of circuit board 10 refers to standard card IC chip position, for installing carrier band unit or there is the IC modules 40 of chip.Conducting medium 13 it is reserved on the circuit board 10 and The welding of IC modules 40 is used.The lamination of first substrate 20, second substrate 30 and/or overlay film can use laminating machine or other press Tool is realized.The groove 21 of card can use milling or other techniques to process.Groove 21 can be in the base of first substrate 20 or second On plate 30.

Further, IC modules 40 are the contact modules of the chip of band 7816 or other chips, the functions of IC modules equivalent to Function after carrier band unit and chip electrically connect in the prior art, IC modules and the end of 11 both ends lead of aerial coil 111 are led Dielectric 13 is welded, and IC modules are connected with the aerial coil 11 on circuit board 10 and are fabricated to double-interface smart card.

Further, it is standard card in double-interface smart card made from the present embodiment, position sign of the IC modules in upper substrate Standardization card code requirement.

Further, circuit board 10 is flexible PCB, and aerial coil 11 is set close to the edge of circuit board 10.The party Case can improve the inducing function of aerial coil, and easily make, and structural thickness is smaller, does not influence the component placement of flexible PCB Realized with intelligent card function.Contact zone 12 is located in aerial coil 11, is easy to implement the inducing function of aerial coil 11.Antenna line The both ends lead 111 of circle 11 is arranged at the position close to contact zone 12, can reduce the consumptive material of aerial coil 11.Both ends lead 111 it is parallel extend to contact zone 12, the structure is easily worked.

Further, in addition to it is arranged at first substrate 20 and has close to the center 50 of the side of circuit board 10, center 50 There is the holding tank 51 for accommodating circuit board 10.Center 50 easily assembles, for circuit board 10 to be positioned and protected.Center 50 punch formings, are easily worked.When configuring center 50, first substrate 20, center 50, second substrate 30 are laminated by encapsulating 60 After card is made, the Stability Analysis of Structures is reliable.

Further, the outer rim shape of center 50 is adapted with the outer rim shape of first substrate 20.The shape of first substrate 20 Shape is the shape of standard card, rectangular.Circuit board 10 is rectangular, and the outer rim of center 50 is rectangular, and the holding tank 51 of center 50 is cut Face is rectangular.The outer rim shape of circuit board 10 is adapted with the section of holding tank 51 of center 50, compact-sized.Certainly, this implementation Smart card in example is alternatively nonstandard card, is rectangle without limiting first substrate 20, center 50, circuit board 10, can freely customize Its shape.

Further, it is be bonded between circuit board 10 and first substrate 20, it is be bonded between center 50 and first substrate 20.The party Case is easily worked, and connection is reliable.Pass through encapsulating 60 between circuit board 10 and first substrate 20, between center 50 and first substrate 20 Realize connection.Connection is realized by encapsulating 60 between circuit board 10 and second substrate 30, between center 50 and second substrate 30.Can To understand ground, between circuit board 10 and first substrate 20, between center 50 and first substrate 20, circuit board 10 and second substrate 30 Between, welding or other existing connected modes can also be used between center 50 and second substrate 30.

Further, the outside of first substrate 20 and/or second substrate 30 is provided with surface printing layer 70, is printed for surface Brush.

Further, circuit board 10 is provided with display screen 14, offers an opening 22 on first substrate 20, display screen 14 is embedding Loaded on opening 22, user would know that relevant information by display screen 14.

Referring to Fig. 4, the smart card that the utility model second embodiment provides, the smart card provided with first embodiment is big Cause identical, unlike first embodiment, contact zone 12 is offered for avoiding IC modules toward the sphere of first substrate First avoid holes 121 of side, the both ends lead 111 of aerial coil 11 get around the first avoid holes 121.The program can do smart card It is thin.For IC modules towards the face of smartcard internal be typically packaged into sphere the characteristics of, by circuit board 10 and IC modules sphere compared with The first avoid holes 121 are dug out in region corresponding to thick part, so as to reduce the thickness of whole smart card.It is corresponding, circuit board 10 The both ends lead 111 that upper aerial coil 11 electrically connects with IC modules needs to bypass first avoid holes 121.Wherein one end lead 111 extend directly to contact zone 12, and other end lead 111 gets around the first avoid holes 121 and set, and the program is easy to IC module balls The thicker part in face enters the first avoid holes 121, while does not influence aerial coil 11.

Referring to Fig. 5, the smart card that the utility model 3rd embodiment provides, the smart card provided with first embodiment is big Cause identical, unlike first embodiment, contact zone 12 offers the second avoid holes 122 for avoiding IC modules, antenna The both ends lead 111 of coil 11 is the wire being connected with the antenna contacts 112 of aerial coil 11.The program can do smart card It is thin.To dig out the second avoid holes 122 on circuit board 10 with 40 corresponding region of IC modules, the aerial coil 11 on circuit board 10 with Electrical connection between IC modules 40 passes through the connecting wire between the antenna contacts 112 of circuit board 10 and 40 corresponding contact of IC modules Realize.Preferable wire is copper cash.

Further, the escape groove (not shown) for avoiding wire is offered on card.Further do smart card thin, Escape groove can be set for the position of corresponding lead on first substrate 20.Escape groove can be in first substrate 20 or second substrate 30 On.

Refer to Fig. 1 to Fig. 3, a kind of manufacture method for smart card that the utility model embodiment provides, including following step Suddenly：

S1) aerial coil 11 is made on the circuit board 10 with contact zone 12, the both ends lead 111 of aerial coil 11 End be respectively positioned on contact zone 12, the end of both ends lead 111 is equipped with conducting medium 13.Circuit board 10 is used as aerial coil 11 Carrier, aerial coil 11 forms on the circuit board 10 by wire coiling, specifically the existing process such as printing, corrosion can be used to make In on circuit board 10.The contact zone 12 of circuit board 10 refers to the IC chip position of standard card, for installing carrier band unit or having The IC modules 40 of chip.Reserved welded on the circuit board 10 with IC modules 40 of conducting medium 13 is used.

S2 it is fixed on after) circuit board 10 is positioned on first substrate 20；

S3 second substrate 30 and/or overlay film) are set departing from the side of first substrate 20 in circuit board 10, by lamination the One substrate 20, second substrate 30 and/or overlay film, obtain card；Lamination can use laminating machine or other pressing machineries to realize.

S4) card, which corresponds at contact zone 12, opens up groove 21, makes conducting medium 13 visible in the bottom of groove 21；Groove 21 can use milling or other techniques to process.Groove 21 is on first substrate 20.

S5 the IC modules 40 with chip) are put into groove 21, IC modules 40 and conducting medium 13 are conductively connected, made IC modules 40 electrically connect with aerial coil 11, obtain smart card.Welded between IC modules 40 and conducting medium 13.

Further, aerial coil 11 is printed on circuit board 10.Aerial coil 11 is preferably when making circuit board 10 Design be printed on circuit board, relative to aerial coil in the prior art be first wound in substrate be welded in again it is this multiple on circuit board Miscellaneous production stage, the present embodiment technique is simple, and effectively reduces production cost.

Further, IC modules 40 are the contact modules of the chip of band 7816 or other chips, the functions of IC modules equivalent to The function after unit and chip electrical connection is carried in the prior art.IC modules and the end of 11 both ends lead of aerial coil 111 are led Dielectric 13 is welded, and IC modules are connected with the aerial coil 11 on circuit board 10 and are fabricated to double-interface smart card.

Further, step S2) be specially：Circuit board 10 is arranged on first substrate 20, by with holding tank 51 Center 50 is arranged at first substrate 20 close to the side of circuit board 10, circuit board 10 is contained in holding tank 51.Center 50 Easily assembling, for circuit board 10 to be positioned and protected.The punch forming of center 50, is easily worked.When configuring center 50, Card is made after encapsulating 60 is laminated first substrate 20, center 50, second substrate 30, the Stability Analysis of Structures is reliable.

Further, it is be bonded between circuit board 10 and first substrate 20, it is be bonded between center 50 and first substrate 20.The party Case is easily worked, and connection is reliable.Pass through encapsulating 60 between circuit board 10 and first substrate 20, between center 50 and first substrate 20 Realize connection.In practical solution, circuit board 10 and center 50 are pasted on first substrate 20 by brush coating before encapsulating.Electricity Connection is realized by encapsulating 60 between road plate 10 and second substrate 30, between center 50 and second substrate 30.It is it is to be appreciated that electric Between road plate 10 and first substrate 20, between center 50 and first substrate 20, between circuit board 10 and second substrate 30, center 50 Welding or other existing connected modes can also be used between second substrate 30.

Further, lead between the first substrate 20, the center 50, the second substrate 30 and/or the overlay film Cross encapsulating lamination to fix, the circuit board 10 is fixed in the center 50.The program is easily assembled, and Stability Analysis of Structures is reliable.

Further, please refer to Fig. 4, in step S1) in, contact zone 12 is offered for avoiding the direction of IC modules 40 The first avoid holes 121 in the sphere side of first substrate 20, the both ends lead 111 of aerial coil 11 get around the first avoid holes 121. The program can do smart card thin.For IC modules towards the face of smartcard internal be typically packaged into sphere the characteristics of, by circuit The first avoid holes 121 are dug out in the region corresponding with the part that IC module spheres are thicker of plate 10, so as to reduce the thickness of whole smart card Degree.Corresponding, the both ends lead 111 that aerial coil 11 electrically connects with IC modules on circuit board 10 needs to bypass first avoid holes 121.Wherein one end lead 111 extends directly to contact zone 12, and other end lead 111 gets around the first avoid holes 121 and set, should Scheme is easy to the thicker part of IC module spheres to enter the first avoid holes 121, while does not influence aerial coil 11.

Or please refer to Fig. 5, contact zone 12 offers the second avoid holes 122 for avoiding IC modules 40, antenna The both ends lead 111 of coil 11 is the wire being connected with the antenna contacts 112 of aerial coil 11.The program can do smart card It is thin.To dig out the second avoid holes 122 on circuit board 10 with 40 corresponding region of IC modules, the aerial coil 11 on circuit board 10 with Electrical connection between IC modules 40 passes through the connecting wire between the antenna contacts 112 of circuit board 10 and 40 corresponding contact of IC modules Realize.Preferable wire is copper cash.

Preferred embodiment of the present utility model is these are only, it is all in this practicality not to limit the utility model All any modification, equivalent and improvement made within new spirit and principle etc., should be included in guarantor of the present utility model Within the scope of shield.

Claims

1. smart card, it is characterised in that including：

First substrate；

The circuit board being arranged on the first substrate, the circuit board have aerial coil and contact zone, the aerial coil The end of both ends lead be respectively positioned on the contact zone, the end of the both ends lead is equipped with conducting medium；

Second substrate and/or overlay film of the circuit board departing from the side of the first substrate are arranged on, the circuit board is consolidated Due to forming a card between the first substrate and the second substrate or be fixed on the first substrate and the overlay film Between form a card, the card correspond at the contact zone open up it is fluted；And

IC modules with chip, in the groove, the IC modules electrically connect the IC modules with the aerial coil.

2. smart card as claimed in claim 1, it is characterised in that the circuit board is flexible PCB, the aerial coil Set close to the edge of the circuit board.

3. smart card as claimed in claim 1, it is characterised in that also include being arranged at the first substrate close to the electricity The center of the side of road plate, the center have the holding tank for being used for accommodating the circuit board.

4. smart card as claimed in claim 3, it is characterised in that the outer rim shape of the center is outer with the first substrate Edge shape is adapted.

5. smart card as claimed in claim 3, it is characterised in that be bonded between the circuit board and the first substrate, institute State be bonded between center and the first substrate.

6. the smart card as described in any one of claim 1 to 5, it is characterised in that the contact zone is offered for avoiding institute IC modules are stated toward the first avoid holes of the sphere side of the first substrate, the both ends lead of the aerial coil gets around described First avoid holes.

7. the smart card as described in any one of claim 1 to 5, it is characterised in that the contact zone is offered for avoiding institute The second avoid holes of IC modules are stated, the both ends lead of the aerial coil is what is be connected with the antenna contacts of the aerial coil Wire.

8. smart card as claimed in claim 7, it is characterised in that offered on the card for avoiding keeping away for the wire Allow groove.

9. the smart card as described in any one of claim 1 to 5, it is characterised in that the IC modules are with 7816 chips Contact module.

10. the smart card as described in any one of claim 1 to 5, it is characterised in that the outside of the first substrate is provided with surface Printing layer.