CN102708399A - Soldering and packaging method for biface smart cards - Google Patents
Soldering and packaging method for biface smart cards Download PDFInfo
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Abstract
The invention relates to a soldering and packaging method for biface smart cards. By processes of preparation of a first electronic shell of an antenna electronic layer, addition of metal parts, chip bonding treatment and the like and unique setup of process parameters, the technical problems of slowness and high processing wastes in the field are solved, and wire selection, manual soldering, manual mounting and semiproduct preparation in the biface smart card packaging process can be realized. Further, the processing technology is simple, processing is quick, yield is high, and the biface smart cards soldered and packaged by the method have the advantages of high intelligent transmission, long service life and more flexibility in use.
Description
Technical field
The present invention relates to a kind of technical field of intelligent card, relate in particular to double-interface smart card manufacturing technology field, particularly relate to a kind of welding method for packing of double-interface smart card.
Background technology
In smart card and relevant industries; At the contact intelligent card that manufactures a finished product, radio frequency smart card, double-interface card (single-chip possesses contact and non-contact function simultaneously) before; Intelligent card chip supplier generally provides the chip that is packaged into the band mode to smart card manufacturer and developer, as the important component part of smart card parts.
So-called band is the circuit board that a kind of outer appearnce is similar to the specific glass fibrous material of film adhesive tape.Length is generally tens of rice to rice up to a hundred, and width has only 3.5 centimetres.Can encapsulate up to ten thousand intelligent card chips of 2 rows above the band at one.This band just is equivalent to up to ten thousand little circuit boards and is serially connected.This outward appearance and structure are well suited for the full-automatic assembly line of smart card production line and produce, so intelligent card chip supplier is packaged into the band mode with intelligent card chip to be supplied to smart card manufacturer and developer.
The existing band encapsulation technology and the technology of smart card industry only limit to the encapsulation to single intelligent card chip at present, also do not have the ripe multicore sheet encapsulation technology based on band.
Double-interface smart card is the CPU card of a kind of integrated contact, contactless two kinds of communication interfaces.It has combined the advantage of contact and contactless IC card,, good reliability big, safe, characteristics such as applicability is strong with memory capacity, thereby be widely used in fields such as finance, telecommunications, public transport, social insurance.
There are many gordian techniquies to be different from the production of single interface card in the production of double-interface smart card; Such as one group of antenna is arranged in the double-interface card, the two ends of this root antenna will be connected with chip back two ends, two interface pad, so in encapsulation process; Must antenna two the end of a thread be milled out; After also having two chip two ends, interface and antenna being connected, can form place's tin point, so on second layer groove, must mill out the groove that can hold tin point.
Usually, as shown in Figure 3, the double-interface smart card production run is following:
(1) sunkens cord.Antenna is implanted card, and line style commonly used now is " ∑ " type and " N " type, and these line style starting points are all being placed two layers of groove zone;
(2) closed assembly.Be made up of 5-7 layer PVC or PET material, antenna is placed on center core layer;
(3) lamination.Utilizing high temperature, high pressure that card is pressed melts together;
(4) mill one deck groove.On the card base, mill out the ground floor groove that can hold chip, expose antenna with the corresponding position of antenna;
(5) choose, pull wire head.Choose, pull out with chip on the antenna that links to each other of two place's end points;
(7) mill two layers of groove.Mill out the second layer groove that can hold chip package and end points;
(7) draw, the trimming head.Unnecessary antenna is drawn, cut to length according to two endpoint locations on the chip;
(8) encapsulation.Utilize packaging machine that antenna is connected with chip.
Because the whole encapsulation of double-interface smart card can't realize full-automation at present, so whole production technology is quite complicated, causes problems such as the product quality undulatory property is big, production efficiency is low, production cost height.
The SIM at band noncontact interface is the SIM of a kind of integrated contact, contactless two kinds of communication interfaces.It has combined the advantage of contact and contactless IC card; The memory capacity of existing Contact Type Ic Card is big, good reliability, safe characteristics, and the characteristics such as plug-in card, easy to operate, quick, the anti-environmental pollution of transaction and electrostatic capacity are strong that need not of non-contact IC card are arranged again.
Therefore; It is once the attention that people occur receiving; Demonstrate good prospects for application; It is applied in motorbus, subway, ferry etc., particularly is applied to embedded device realization mobile payment, authentications etc. such as portable terminal, and these are used and bring very big facility for lives of people.
In application, the SIM at band noncontact interface needs external antenna to come inductive energy, the electric current that provides internal work to need.Generally use the adhesive type antenna at present, connect antenna and SIM owing to adopt to paste glue, therefore exist and SIM between owing to pasting the loose contact problem that dislocation, virtual connection and reason such as aging cause.
A kind of in addition welded type antenna that generally uses adopts certain several point of welding to be connected with SIM, exists that rosin joint, solder joint come off, solder joint corrodes problem such as wear out, thereby reason causes the communication failure problem.
For example, application number is that 200920222371.9 utility model discloses a kind of gadget antenna, and this antenna comprises housing; Said enclosure interior is packaged with aerial coil, and two leading-out terminals of said aerial coil are drawn outside the housing, to be used to connect the noncontact point of IC-card chip.Through antenna is independent, aerial coil is arranged in the special housing, two joints of coil are drawn outside the carrier, be connected with contactless IC card chip in the Near Field Communication equipment and accomplish the noncontact communication, this gadget antenna and chip independence.
Above-mentioned patent does not solve the technological deficiency that adhesive type and welded type antenna exist, and promptly antenna and SIM tie point are exposed to problems such as wearing out of causing easily in the air, corrosion.
Double-interface smart card possesses contact card-reading function and contactless card-reading function; The contact card-reading function is resolved in the structure of chip surface, and then to be chip pin be connected to form inducing function with the inner antenna of card base to contactless card-reading function obtains.
In the technology of the double-interface smart card of making at present, because antenna is meticulous, if directly carry out groove milling and polishing in antenna surface, cause the antenna weak point to split easily, and because surface of contact is too small, weld insecure durablely, pin and antenna weld and cause directly; Usually need antenna be chosen externally and weld, and then chip attach blocked on the base through hot-pressing technique with chip pin.Antenna 2 is chosen from the substrate groove 1 that blocks base referring to Fig. 1; And be welded on the pin of chip 3, and be hot-pressed onto in the standard draw-in groove through hot-press equipment, chip bottom 4 is bonding with the bottom groove 6 of card base; The chip substrate bottom is bonding with the substrate groove 1 of card base; Some is outstanding for pin and antenna pad, so the half slot of specially leaving 7 and 8 is to place these two protruding points, other lead-in wires are then put at the bottom groove inner by pressure.This technology is because middle material can't be beforehand with semi-manufacture, and automaticity is not high, thus exist speed slow, the shortcoming of easy occurrence of waste.
The present packing forms of smart card mainly is the gold thread welding and the chips welding of falling.Usually in order to realize the function of smart card module, prior art is by the printed circuit board (belt for smart card) that has adopted one deck or two-layer circuit, silver slurry, chip, the smart card module encapsulation technology that the plastic packaging glue of gold thread and protection chip is formed.
Usually smart card module uses lead key closing process, realizes the aluminum pad 2 of chip 300 and being connected of smart card contact point 3 through gold thread 1, uses plastic packaging glue 600 protection chips 300 and gold thread 1 then.Belt for smart card is divided into surface of contact and face of weld; At first chip 300 is bonded on the face of weld through cementing agent (for example, the silver slurry) 400, carries out the gold thread bonding then; The contact point 3 that connects chip aluminum pad 2 and smart card face of weld; The circuit of realizing module connects, and seals chip 300 and gold thread 1 with plastic packaging glue 600 at last, plays the effect of protection chip and gold thread.
The main at present resin base material that uses of belt for smart card, the PCB cost is than higher, and use gold thread bonding technology, and the technological process that needs is many, and packaging efficiency is not high.
Summary of the invention
The present invention is directed to the deficiency of prior art, mainly solve: a kind of double-interface smart card that invent for the existing problem of the double-interface smart card that solves current trend (1); (2) for the take-up in the double-interface smart card packaging technology that solves current trend, manual welding, manual installation, can't prepare semi-manufacture and the speed that causes is slow, the high problem of processing waste product, and a kind of double-interface smart card packaging technology of invention; Reach take-up, manual welding, manual installation in can the double-interface smart card packaging technology, can prepare semi-manufacture; Processing technology is simple and easy; Process velocity is fast and yield rate is higher, high intelligent transmission and long service life and the useful more flexibly technique effect of use.
For realizing above-mentioned purpose, the present invention realizes through following technical scheme:
The welding method for packing of a kind of double-interface smart card of the present invention, said double-interface smart card comprise card base, inside antenna, inside antenna electronic shell and chip; It is characterized in that; The employing metalwork carries out spring layer, increase, broadening with the inside antenna electronic shell and thickens; Low temperature adds scolding tin on said chip pin, and chip bottom pin exterior portions is used cementing agent, uses the hot pressing contact that chip is carried out hot-pressing processing; Make low temperature scolding tin and the welding of the metalwork in the said inside antenna electronic shell on the said chip pin, said chip bottom and said card base bond and are integrated; The base part of said inside antenna electronic shell and inside antenna carry out the butt-joint welding; And the face of weld of the metalwork of said inside antenna electronic shell is exposed at said inside antenna electronic shell surface outward; Formation has the antenna electronics layer of hard contact, through the lamination of said card base and described card base mill the chip groove, the metalwork redundance is excised; Said hard contact exposes and is positioned at chip substrate groove bilateral; Low temperature adds scolding tin on chip pin, carries out hot pressing, and chip pin is welded on the metalwork contact; Its double-interface smart card welding encapsulation technology specifically may further comprise the steps:
(1) preparation of first electronic shell of said inside antenna electronic shell; On the sheet surface of said first electronic shell, a plurality of independent zones evenly are provided with corresponding a plurality of paired rectangle dead slot, and the xsect of said rectangle dead slot is identical with corresponding metalwork shape;
(2) add metalwork; In said paired rectangle dead slot, place the metalwork of said correspondence;
(3) inside antenna is buried underground; On the sheet material of said first electronic shell of the metalwork of placing said correspondence, in each independent zone, carry out burying underground of inside antenna, and the start bit of inside antenna is welded on the metalwork with terminal position;
(4) inside antenna and metalwork weld; With the position of inside antenna and metalwork welding, carry out butt-joint through the high stream of low pressure butt-welding machine; Wherein, the surface finish of inside antenna is carried out low temperature scolding tin welding at a slow speed to remove behind the insulation course 2/5ths to 3/5ths part of inside antenna squeezed in the metalwork;
(5) collocation before the lamination; The inside antenna in the said first electronic shell sheet material and the A face of metal bond pad, the B face of exposed metal face; On said A face, cover the sheet material of the same material of one deck, thickness is arranged on 100-350nm (original text: thickness is arranged on 200-350nm); On said B face, cover one deck and in lamination, avoid the metal covering and the bonding screen layer of metal laminate plate that expose; This screen layer plays buffer protection to the sheet material and the metalwork of said same material; And behind the lamination of stating the card base, the sheet material of said screen layer and said same material is not bonding but strippable;
(6) lamination is synthetic; Material with collocation before above-mentioned steps (5) lamination; Successively be placed in the metal laminate plate; And to be arranged on 120-180 ℃, pressure through temperature be to keep 10-30 minute 2-8MPa, time; (and be arranged on 140 ℃, pressure be to keep 46～48 minutes 600N, time) through temperature, with the first electronic shell sheet material with the second electronic shell sheet material is synthetic is in the same place, outside surface is smooth;
(7) peel off additional materials behind the lamination; After above-mentioned steps (6) lamination is synthetic,, form antenna electronics layer with hard contact with peeling off out the sheet material of said screen layer after synthetic;
(8) preparation of card base; Enclose the card face thin slice that is provided with color-printed layer and protective clear layer at said upper and lower surface with antenna electronics layer of hard contact; Carrying out temperature is 2-8MPa, time to keep the hot pressing of 10-30 minute (original text: 600 ℃) at 120-150 ℃, pressure; And it is die-cut on punch machine, to carry out fixed measure, forms individual card;
(9) the groove milling preparation of card base; The groove milling of card base is on the position of hard contact, to carry out the draw-in groove that groove milling obtains placing chip; Said draw-in groove comprises substrate groove and bottom groove, and said groove milling is inserted filler piece in said rectangle dead slot, and uses polymeric material that said filler piece is fixed; Wherein, In the groove milling of hard contact position, up to exposing filler piece, and with the about half thickness of said filler piece mill off; Extract remaining filler piece up to exposing hard contact through vacuum suction;
(10) chips welding pre-service; Chip need add scolding tin by low temperature on the chip bottom pin before welding, bottom that said bottom groove is corresponding and chip substrate bottom evenly scribble cementing agent;
(11) chips welding; Chip is placed in the said draw-in groove; Use contact encapsulation hot-press arrangement to carry out temperature 230-233 ℃ high temperature hot pressing; Chip pin welds through low temperature scolding tin and metalwork surface, and the bottom that chip substrate bottom and said bottom groove are corresponding bonds through cementing agent and draw-in groove.
As optimal technical scheme: in the step (4) surface finish of inside antenna is carried out low temperature scolding tin welding at a slow speed to remove behind the insulation course 1/2nd part of inside antenna squeezed in the metalwork.
Double-interface smart card according to the preparation of the welding method for packing of described a kind of double-interface smart card.
In addition, gordian technique of the present invention also is: the welding method for packing of double-interface smart card, said double-interface smart card comprise the card base; Inside antenna electronic shell and chip is characterized in that, in preparation antenna electronics layer step; Increased a kind of metalwork; Aerial coil is connected with the pedestal of metalwork, and the exposed face of metalwork then is exposed to the antenna electronics laminar surface, thereby obtains having the antenna electronics layer of hard contact; The antenna electronics layer that will have hard contact closes layer in the card base; And will block base and carry out the groove milling step of standard, hard contact is exposed to the surperficial both sides of chip substrate groove, and chip pin is connected through hot pressing and with the basic hard contact of card with low temperature scolding tin; Specifically comprise following welding method for packing step.
A) production stage of ground floor material
On the ground floor material sheet, two rectangular dead slots are left according to the metalwork shape of correspondence in the zone of the standard that can arrange as required in each scope;
B) production stage of interpolation metalwork
In the position of dead slot, place metalwork;
C) carry out the production stage that antenna is buried underground
Placing on the sheet material of metalwork, carrying out carrying out burying underground of antenna in each independent zone, and the start bit of antenna is being passed through on the welding position of metalwork with terminal position;
D) production stage that welds of antenna and metalwork
With antenna and metalwork welding position, carry out butt-joint through the high stream of low pressure butt-welding machine, with the outer lacquer of antenna destroy and with antenna general half squeeze in the metalwork, form good welding effect; If the antenna outside does not have insulating material, can weld through the eutectic welding process of tin;
E) production stage of material before the collocation lamination
That that antenna and metal bond pad arranged in the ground floor sheet material simultaneously is called the A face, and that will the exposed metal face simultaneously is called the B face; On the A face, cover the sheet material of the same material of one deck, thickness can change as required; (so-called screen layer is in lamination, and metal covering and the metal laminate plate avoiding exposing are bonding on the B face, to cover one deck screen layer; And sheet material and metalwork are played buffer protection function; And screen layer can be not bonding with material sheet behind lamination, can strip down.)；
F) production stage of lamination synthetic material
Lamination step is with the material that matches, and successively is placed in the metal laminate plate, and temperature, pressure, time through certain value is set, effectively with the ground floor sheet material with second layer sheet material is synthetic is in the same place flat appearance;
G) peel off the production stage of additional materials behind the lamination
After lamination finishes, peel ply is peeled off out from synthetic good sheet material, form antenna electronics layer with hard contact.
H) production stage of preparation card base
Enclose card face material (normally color-printed layer and protective clear layer) at the upper and lower surface of antenna electronics layer, carry out hot pressing, and on punch machine, carry out die-cutly, form individual card.
I) the groove milling production stage of card base
The groove milling of card base is on the position of hard contact, carries out the groove milling action of standard, obtains placing the substrate groove and the bottom groove of chip.
J) pre-treatment step of chips welding
Chip need add low temperature scolding tin, bottom and B.B.P adding additives on pin before welding.
K) production stage of chips welding
Chip is placed in the draw-in groove, uses contact encapsulation hot-press equipment, carry out hot pressing, chip pin welds through low temperature scolding tin and metal covering, and chip substrate bottom and bottom are through cementing agent and draw-in groove bonding.
Description of drawings
Fig. 1 is the take-up welding encapsulation technology synoptic diagram of the double-interface smart card of current trend;
Fig. 2 is the part synoptic diagram in regularly arranged zone on the ground floor material that uses of the present invention;
Fig. 3 is the cut-open view of Fig. 2;
Fig. 4 is the rough schematic of the metalwork among the present invention, and (1) is the vertical view of metalwork, and (2) are the cut-open view of metalwork;
Fig. 5 is in the groove of ground floor material of the present invention, has loaded the material behind the metalwork, and the synoptic diagram of that one side of substrate portion is arranged;
Fig. 6 is in the groove of ground floor material of the present invention, has loaded the material behind the metalwork, and the synoptic diagram of that one side of exposed metal face is arranged;
Fig. 7 is the cut-open view of Fig. 5 and Fig. 6;
Fig. 8 is the part-structure synoptic diagram that carries out the ground floor material after antenna is buried underground behind the filling metalwork of the present invention;
Fig. 9 is the cut-open view of Fig. 8;
Figure 10 welding schematic sectional view that carries out antenna and metalwork of the present invention;
Figure 11 is the present invention has hard contact in the lamination preparation an antenna electronics layer batching synoptic diagram before;
Figure 12 is the structural representation behind the lamination of the present invention;
Figure 13 is the structure cut-open view of peeling off behind the lamination of the present invention behind the shielding material layer;
Figure 14 is the part-structure synoptic diagram of peeling off behind the lamination of the present invention behind the shielding material layer;
Figure 15 is that the antenna electronics layer with metal electricity that uses of the present invention is intermediate materials, and what be equipped with color membrane material and transparent protection material up and down is laminated into the basic preceding equipment configuration synoptic diagram of card;
Figure 16 is that the present invention prepares after card basic unit presses, middle antenna electronics layer material, color membrane material, transparency protected membrane material are carried out lamination after, the structural representation that is integrated;
Figure 17 is among the present invention, material is die-cut into the synoptic diagram of single card base with punch machine;
Figure 18 is among the present invention, and the single card base is carried out the synoptic diagram that groove milling obtains having the double-interface smart card chip groove of standard;
Figure 19 is the cross-sectional schematic of Figure 18;
Figure 20 is among the present invention, the synoptic diagram of low temperature scolding tin on the double-interface smart card pin of chip, and wherein (1) part is the chip bottom vertical view, (2) part is the cut-open view of chip;
Figure 21 is the structural representation that double-interface smart card chip and Ka Ji carry out hot pressing among the present invention through thermal head.
Embodiment
According to production procedure of the present invention and technical characterstic are described,, further set forth the present invention below in conjunction with embodiment.
The packaging technology of double-interface smart card of the present invention has following steps:
A) production stage of ground floor material
On ground floor material sheet 101, two rectangular dead slots 103 are left according to the metalwork shape of correspondence in the zone 102 of the standard that can arrange as required in each scope; Specifically referring to Fig. 1 and Fig. 2.
B) production stage of interpolation metalwork;
Fig. 3 is the structural representation of metalwork 104, specifically referring to Fig. 3;
The exposed parts of metalwork 104 is filled in the position of dead slot 103, connects a metalwork placement location (specifically placing) relatively according to product requirement; Referring to Fig. 4 and Fig. 5, Fig. 6.
C) carry out the production stage that antenna is buried underground;
On the sheet material that places metalwork 101, carry out carrying out burying underground of antenna 105 in each independent scope, and the start bit of antenna 105 is passed through on the welding position of metalwork 104 with terminal position; Referring to Fig. 7 and Fig. 8.
D) production stage that welds of antenna and metalwork;
With antenna 105 and metalwork 104 welding positions, carry out butt-joint through the high stream of low pressure butt-welding machine, with the outer lacquer of antenna destroy and with antenna general half squeeze in the metalwork, form good welding effect; If the antenna outside does not have insulating material, can weld through the eutectic welding process of tin; Referring to Fig. 9
E) production stage of material before the collocation lamination;
That that antenna and metal bond pad arranged in the ground floor sheet material 101 simultaneously is called the A face, and that will the exposed metal face simultaneously is called the B face; On the A face, cover the sheet material 106 of the same material of one deck, thickness can change as required;
(so-called screen layer is in lamination, and metal covering and the metal laminate plate avoiding exposing are bonding on the B face, to cover one deck screen layer 107; And sheet material and metalwork are played buffer protection function; And screen layer can be not bonding with material sheet behind lamination, can strip down.); Referring to Figure 10.
F) production stage of lamination synthetic material
Lamination step; Be with the material that matches (106+101+107), successively be placed in the metal laminate plate, and temperature, pressure, time through certain value is set; Effectively ground floor sheet material 101 is synthesized with second layer sheet material 106 and form 108, flat appearance together; Referring to Figure 11.
G) peel off the production stage of additional materials behind the lamination
After lamination finishes, be to peel off out from synthetic good sheet material 108, form antenna electronics layer 109 with hard contact with peel ply 107; Referring to Figure 12 and Figure 13, Figure 14.
H) production stage of preparation card base
Enclose card face material 110 (normally color-printed layer and protective clear layer) at the upper and lower surface of antenna electronics layer, carry out hot pressing, and on punch machine, carry out die-cutly, form single card base 111, see Figure 15, Figure 16, Figure 17.
I) the groove milling production stage of card base
The groove milling of card base 111 is on the position of hard contact; Carry out the groove milling action of standard; Obtain placing the draw-in groove 112 of chip, draw-in groove comprises substrate groove 113 and bottom groove 114, and metalwork expose contact 115 in 113 both sides; Figure 18 and Figure 19 are seen in corresponding double-interface smart card pin of chip position.
J) pre-treatment step of chips welding
Chip need add low temperature scolding tin on pin 117 before welding, bottom 116 and B.B.P 118 adding additives.See Figure 20, (1) is bottom plan view, and (2) are cut-open view.
K) production stage of chips welding
Chip is placed in the draw-in groove 112; Use contact encapsulation hot-press equipment; Carry out hot pressing; Chip pin 117 welds through low temperature scolding tin and metalwork exposed parts 115, substrate groove 113 bondings in chip substrate bottom 118 and the draw-in groove, bottom groove 114 bondings in chip bottom 116 and the draw-in groove.
Double-interface smart card welding method for packing of the present invention is compared the result through unique design with the take-up welding technology of current trend and is seen form 1.
Scope of the present invention does not receive the restriction of said specific embodiments, and said scheme also comprises the method and the component of functional equivalent only as the single example of illustrating various aspects of the present invention in the scope of the invention.In fact, except content as herein described, those skilled in the art can easily grasp multiple improvement of the present invention with reference to the description and the accompanying drawing of preceding text.Said improvement also falls within the scope of claims.
Claims (3)
1. the welding method for packing of a double-interface smart card, said double-interface smart card comprises card base, inside antenna, inside antenna electronic shell and chip; It is characterized in that; The employing metalwork carries out spring layer, increase, broadening with the inside antenna electronic shell and thickens; Low temperature adds scolding tin on said chip pin, and chip bottom pin exterior portions is used cementing agent, uses the hot pressing contact that chip is carried out hot-pressing processing; Make low temperature scolding tin and the welding of the metalwork in the said inside antenna electronic shell on the said chip pin, said chip bottom and said card base bond and are integrated; The base part of said inside antenna electronic shell and inside antenna carry out the butt-joint welding; And the face of weld of the metalwork of said inside antenna electronic shell is exposed at said inside antenna electronic shell surface outward; Formation has the antenna electronics layer of hard contact, through the lamination of said card base and described card base mill the chip groove, the metalwork redundance is excised; Said hard contact exposes and is positioned at chip substrate groove bilateral; Low temperature adds scolding tin on chip pin, carries out hot pressing, and chip pin is welded on the metalwork contact; Its double-interface smart card welding encapsulation technology specifically may further comprise the steps:
(1) preparation of first electronic shell of said inside antenna electronic shell; On the sheet surface of said first electronic shell, a plurality of independent zones evenly are provided with corresponding a plurality of paired rectangle dead slot, and the xsect of said rectangle dead slot is identical with corresponding metalwork shape;
(2) add metalwork; In said paired rectangle dead slot, place the metalwork of said correspondence;
(3) inside antenna is buried underground; On the sheet material of said first electronic shell of the metalwork of placing said correspondence, in each independent zone, carry out burying underground of inside antenna, and the start bit of inside antenna is welded on the metalwork with terminal position;
(4) inside antenna and metalwork weld; With the position of inside antenna and metalwork welding, carry out butt-joint through the high stream of low pressure butt-welding machine; Wherein, the surface finish of inside antenna is carried out low temperature scolding tin welding at a slow speed to remove behind the insulation course 2/5ths to 3/5ths part of inside antenna squeezed in the metalwork;
(5) collocation before the lamination; The inside antenna in the said first electronic shell sheet material and the A face of metal bond pad, the B face of exposed metal face; On said A face, cover the sheet material of the same material of one deck, thickness is arranged on 100-350nm (original text: thickness is arranged on 200-350nm); On said B face, cover one deck and in lamination, avoid the metal covering and the bonding screen layer of metal laminate plate that expose; This screen layer plays buffer protection to the sheet material and the metalwork of said same material; And behind the lamination of stating the card base, the sheet material of said screen layer and said same material is not bonding but strippable;
(6) lamination is synthetic; Material with collocation before above-mentioned steps (5) lamination; Successively be placed in the metal laminate plate; And to be arranged on 120-180 ℃, pressure through temperature be to keep 10-30 minute 2-8MPa, time; (and be arranged on 140 ℃, pressure be to keep 46～48 minutes 600N, time) through temperature, with the first electronic shell sheet material with the second electronic shell sheet material is synthetic is in the same place, outside surface is smooth;
(7) peel off additional materials behind the lamination; After above-mentioned steps (6) lamination is synthetic,, form antenna electronics layer with hard contact with peeling off out the sheet material of said screen layer after synthetic;
(8) preparation of card base; Enclose the card face thin slice that is provided with color-printed layer and protective clear layer at said upper and lower surface with antenna electronics layer of hard contact; Carrying out temperature is 2-8MPa, time to keep the hot pressing of 10-30 minute (original text: 600 ℃) at 120-150 ℃, pressure; And it is die-cut on punch machine, to carry out fixed measure, forms individual card;
(9) the groove milling preparation of card base; The groove milling of card base is on the position of hard contact, to carry out the draw-in groove that groove milling obtains placing chip; Said draw-in groove comprises substrate groove and bottom groove, and said groove milling is inserted filler piece in said rectangle dead slot, and uses polymeric material that said filler piece is fixed; Wherein, In the groove milling of hard contact position, up to exposing filler piece, and with the about half thickness of said filler piece mill off; Extract remaining filler piece up to exposing hard contact through vacuum suction;
(10) chips welding pre-service; Chip need add scolding tin by low temperature on the chip bottom pin before welding, bottom that said bottom groove is corresponding and chip substrate bottom evenly scribble cementing agent;
(11) chips welding; Chip is placed in the said draw-in groove; Use contact encapsulation hot-press arrangement to carry out temperature 230-233 ℃ high temperature hot pressing; Chip pin welds through low temperature scolding tin and metalwork surface, and the bottom that chip substrate bottom and said bottom groove are corresponding bonds through cementing agent and draw-in groove.
2. the welding method for packing of a kind of double-interface smart card according to claim 1 and 2; It is characterized in that, in the step (4) surface finish of inside antenna is carried out low temperature scolding tin welding at a slow speed to remove behind the insulation course 1/2nd part of inside antenna squeezed in the metalwork.
3. the double-interface smart card of the welding method for packing of a kind of double-interface smart card according to claim 1 preparation.
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| CN2012101095048A CN102708399A (en) | 2012-04-16 | 2012-04-16 | Soldering and packaging method for biface smart cards |
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| CN2012101095048A CN102708399A (en) | 2012-04-16 | 2012-04-16 | Soldering and packaging method for biface smart cards |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103199025A (en) * | 2013-03-22 | 2013-07-10 | 北京华盛盈科智能科技有限公司 | Dual interface card closed type automatic welding encapsulation production method |
| CN104063735A (en) * | 2013-03-22 | 2014-09-24 | 程金先 | Dual-interface card and contact card production technique |
| CN105488558A (en) * | 2015-11-26 | 2016-04-13 | 深圳市源明杰科技有限公司 | Production method of double-interface smart card and double-interface smart card |
| CN106392646A (en) * | 2016-12-14 | 2017-02-15 | 深圳源明杰科技股份有限公司 | Intelligent card wire picking device and intelligent card production system |
| CN106960167A (en) * | 2016-01-11 | 2017-07-18 | 深圳市创新佳电子标签有限公司 | A kind of shield card with defencive function |
| CN106991466A (en) * | 2017-04-07 | 2017-07-28 | 金邦达有限公司 | Double-interface smart card and its manufacture method |
| CN109409486A (en) * | 2018-10-31 | 2019-03-01 | 江苏恒宝智能系统技术有限公司 | A kind of smart card and its processing method |
| CN111081561A (en) * | 2019-06-25 | 2020-04-28 | 姜凤明 | Electronic chip packaging structure and method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103199025A (en) * | 2013-03-22 | 2013-07-10 | 北京华盛盈科智能科技有限公司 | Dual interface card closed type automatic welding encapsulation production method |
| CN104063735A (en) * | 2013-03-22 | 2014-09-24 | 程金先 | Dual-interface card and contact card production technique |
| CN103199025B (en) * | 2013-03-22 | 2016-03-23 | 北京华盛盈科智能科技有限公司 | A kind of double-interface card closed automatic welding encapsulation production method |
| CN105488558A (en) * | 2015-11-26 | 2016-04-13 | 深圳市源明杰科技有限公司 | Production method of double-interface smart card and double-interface smart card |
| CN105488558B (en) * | 2015-11-26 | 2018-06-12 | 深圳源明杰科技股份有限公司 | The production method and double-interface smart card of double-interface smart card |
| CN106960167A (en) * | 2016-01-11 | 2017-07-18 | 深圳市创新佳电子标签有限公司 | A kind of shield card with defencive function |
| CN106392646A (en) * | 2016-12-14 | 2017-02-15 | 深圳源明杰科技股份有限公司 | Intelligent card wire picking device and intelligent card production system |
| CN106392646B (en) * | 2016-12-14 | 2018-03-27 | 深圳源明杰科技股份有限公司 | The wire picking device of smart card and the production system of smart card |
| CN106991466A (en) * | 2017-04-07 | 2017-07-28 | 金邦达有限公司 | Double-interface smart card and its manufacture method |
| CN109409486A (en) * | 2018-10-31 | 2019-03-01 | 江苏恒宝智能系统技术有限公司 | A kind of smart card and its processing method |
| CN111081561A (en) * | 2019-06-25 | 2020-04-28 | 姜凤明 | Electronic chip packaging structure and method thereof |
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Application publication date: 20121003 |