KR101151025B1 - Manufacturing method of contact and non-contact card - Google Patents

Abstract

The present invention discloses a contact and contactless combined card capable of easily and accurately connecting an antenna (RF) terminal and a loop antenna on the back side of a COB of a card having contact and contactless functions and a method of manufacturing the same. Method of manufacturing a contact and non-contact card according to an embodiment of the present invention comprises the steps of forming a pair of connection terminals connected to both ends of the loop antenna wired on the substrate to a position corresponding to the RF terminal on the back of the combination COB and And bonding the pair of connection terminals to the RF terminal on the back side of the combination COB. Accordingly, in the cards with contact and contactless functions, when the COB rear antenna (RF) terminal and the perforated connection terminal of the loop antenna are heat-bonded on the surface of the COB, the bonding failure is eliminated and the contact and contactless functions of the card It is of high quality and can reduce production costs and minimize the generation of environmental pollutants in the manufacturing process.

Description

Manufacturing method of contact and non-contact card {MANUFACTURING METHOD OF CONTACT AND NON-CONTACT CARD}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic interface card known as a smart card, and more particularly, to an electronic interface card having contact and contactless functions and a method of manufacturing the same.

Today, smart cards are widely used in various fields such as communication, finance, transportation, and e-commerce. These smart cards have contact and contactless functions, and have a microprocessor, a card operating system, a security module, a memory, and the like, and a IC chip (IC chip) that handles specific tasks.

On the other hand, COB (Chip on Board) technology is widely used in the manufacture of IC cards and SIM cards, and does not use conventional thin small outline package (TSOP) type memory chips or ball grid array (BGA) type memory chips. By attaching a small memory chip cut out from the wafer directly onto a PCB, it is more reliable, has good heat dissipation effect, and enables small size and large capacity.

However, in the method of manufacturing a card having contact and contactless functions, a back antenna (RF) terminal of a COB and a loop antenna performing a radio communication function to perform a radio communication function with a contact and contactless function card. The junction of is important. This requires a number of separate processes to be carried out.

That is, soldering to the rear antenna (RF) terminal of the COB by using a conductive adhesive between the rear antenna (RF) terminal and the loop antenna or directly drawing the loop antenna wire inside the card, or starting point and end point of the loop antenna. In addition, a number of separate processes are required, such as making additional terminals and welding between the additional terminals and the COB backside with separate wires. Therefore, there is a problem that the quality is not uniform and the equipment and the process cost according to the additional process is excessively required.

The present inventors have solved this problem of the prior art, and have studied the technology of uniform quality and reducing the installation process.

The present invention has been made to solve the above problems, a contact and non-contact card and a method of manufacturing the same that can easily and accurately connect the antenna (RF) terminal and the loop antenna on the back of the COB of the card having a contact and contactless function The purpose is to provide.

Method of manufacturing a contact and non-contact card according to an embodiment of the present invention comprises the steps of forming a pair of connection terminals connected to both ends of the loop antenna wired on the substrate to a position corresponding to the RF terminal on the back of the combination COB and And bonding the pair of connection terminals to the RF terminal on the back side of the combination COB.

Contact and non-contact card according to an embodiment of the present invention is a pair of the substrate, a loop antenna that is wired on the substrate, and a pair of the end of the loop antenna, which is connected to both ends of the loop COB is formed in a position corresponding to the And a combination COB formed with a connection terminal of and terminals connected to a pair of connection terminals.

Accordingly, in the cards with contact and contactless functions, when the COB rear antenna (RF) terminal and the perforated connection terminal of the loop antenna are heat-bonded on the surface of the COB, the bonding failure is eliminated and the card having contact and non-contact function is removed. It is of high quality and can reduce production costs and minimize the generation of environmental pollutants in the manufacturing process.

1A is a perspective view of a combined contact and contactless card according to an embodiment of the present invention,
1B is a cross-sectional view taken along line A-A 'of a contact and contactless card according to an embodiment of the present invention;
2 is a reference diagram of a loop antenna and a connection terminal attached to a substrate according to an embodiment of the present invention;
3 is an exploded perspective view of a combined contact and non-contact card according to an embodiment of the present invention,
4 is a flowchart illustrating a method of manufacturing a contact and contactless combined card according to an embodiment of the present invention;
5 to 8 is a perspective view of the manufacturing process according to the manufacturing method of the contact and non-contact combined card according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The terms used are terms selected in consideration of functions in the embodiments, and the meaning of the terms may vary depending on the intention or precedent of the user or operator. Therefore, the meaning of the terms used in the embodiments to be described later, according to the definition if specifically defined herein, and if there is no specific definition should be interpreted to mean generally recognized by those skilled in the art.

1A is a perspective view of a contact and contactless dual card according to an embodiment of the present invention, Figure 1B is a cross-sectional view taken along line A-A 'of a contact and contactless combined card according to an embodiment of the present invention.

First, referring to FIG. 1A, a contact and contactless combined card 50 according to an embodiment of the present invention includes a substrate, a loop antenna 40, a combination COB 100, and a connection terminal connected to a loop antenna. Substrate is a synthetic resin used in general smart cards. The loop antenna 40 is wired to the substrate, and a receiving groove for accommodating the combination COB 100 is formed. The loop antenna 40 wired to the substrate may be wired by ultrasonic loading. A printed layer and a protective layer are stacked on top of the card 50 on which the loop antenna 40 is wired to protect the wired antenna 40.

The loop antenna 40 may be a coil used in the card 50 for general radio frequency (RF) communication. The loop antenna 40 may be wired by ultrasonic loading on the substrate. The loop antenna 40 to be wired may be wired without passing through a COB receiving groove, which is an area in which the combination COB 100 is accommodated. That is, the wiring starts around the COB receiving groove of the loop antenna 40, the wiring is formed in a loop form on the substrate, and the wiring is terminated around the receiving groove of the combination COB 100.

In addition, the loop antenna 40 forms an extra loop antenna before wiring to a position corresponding to one of the RF terminals on the back of the combi COB 100 on the substrate, and the other of the RF terminals on the back of the combi COB 100 is formed. After the wiring is terminated at a position corresponding to one terminal, an extra loop antenna is not formed on the substrate. The extra coil formed before the wiring of the loop antenna 40 and the extra coil formed after the wiring are joined to a connection terminal described later. Connection terminals bonded to both ends of the loop antenna 40 will be described later with reference to FIGS. 1B and 2.

Combi COB 100 may be a memory chip used in a general smart card. It can be more reliable by directly attaching the memory chip cut from the wafer to the substrate, has good heat dissipation effect, and is widely used in transportation cards, credit cards, etc. The combination COB 100 is bonded to a substrate, and an RF antenna terminal is formed on the back of the combination COB 100 in contact with the substrate. RF terminal is bonded to the loop antenna 40, in the present invention is characterized in that it is bonded to the connection terminal bonded to the loop antenna 40.

Contact and non-contact card 50 according to an embodiment of the present invention may further form a protective layer added to the upper and lower surfaces of the substrate. The protective layer may be composed of, for example, a printing layer and a protective layer. The protective layer prevents air contact of the loop antenna 40 wired to the substrate and prevents cutting by external impact. The protective layer may be laminated on the upper and lower surfaces of the substrate and bonded through hot pressing.

Hereinafter, a structure in which the combination COB and the card side connection terminal are joined will be described with reference to FIG. 1B.

Referring to FIG. 1B, the printing layer 21 and the protection layer 22 may be laminated on the upper and lower surfaces of the substrate 20, respectively. The first COB receiving groove 30 may be formed in the substrate 20 to accommodate the combination COB 100. In this case, the first COB receiving groove 30 is formed between the card 50 side connection terminal 10. Thus, the protrusion on the back side of the COB 100 is accommodated on the substrate 20.

Meanwhile, a second COB receiving groove 31 accommodating an upper portion of the COB 100 may be formed in the printing layer 21 and the protection layer 22 laminated on the upper surface of the substrate 20. In the second COB receiving groove 31, an area including the connection terminal 10 is milled so that all the connection terminals 10 on the card 50 side can be exposed. In this case, the second COB accommodating groove 31 includes the first COB accommodating groove 30 and is preferably milled to a size where all of the connection terminals 10 may be exposed.

The RF terminal 110 on the back side of the COB 100 is designed to structurally contact the card 50 side connection terminal 10 bonded on the substrate 20, and the card 50 side connection terminal 10 or RF Lead may be applied to the terminal 110 to heat-couple the RF terminal 110 and the connection terminal 10 on the card 50 side. The gap between the COB 100 and the second COB receiving groove 31 may be fixed by using an adhesive such as hot melt. Hot melt is bonded to the back of the COB 100 in advance, the COB 100 is accommodated in the COB receiving grooves (30, 31) and then the back of the second COB receiving groove 31 and the RF terminal 110 by heat bonding Are bonded. Accordingly, the COB 100 may be stably fixed to the card 50.

2 is a reference diagram of a loop antenna and a connection terminal attached to a substrate according to an embodiment of the present invention.

Referring to FIG. 2, connection terminals 10 may be bonded to both ends of the loop antenna 40 wired to the substrate 20. The connection terminal 10 may be formed of a metal of a conductive material. As described above, the connection terminal 10 is for facilitating the connection with the RF terminal 110 formed on the rear surface of the combination COB 100. The connection terminal 10 may be perforated on a portion of the surface in contact with the RF terminal 110. A bonding material may be applied to a portion punched in the connection terminal 10. For example, the bonding material may be lead (Pb), which is a conductive material.

When the COB 100 is heated by contacting the connection terminal 10 coated with lead on the perforated portion, the connection terminal 10 and the RF terminal 110 are primarily coupled to each other. Accordingly. In the card 50 having contact and non-contact functions, when the joint of the RF terminal on the back of the COB 100 and the perforated connection terminal 10 of the loop antenna 40 is heated on the surface of the COB 100, a poor bonding occurs. Eliminates the quality of cards with contact and non-contact functions, reducing production costs and minimizing environmental pollutants in the manufacturing process.

3 is an exploded perspective view of a combined contact and non-contact card according to an embodiment of the present invention.

Referring to FIG. 3, in the contact and non-contact combined card 50 according to an embodiment of the present invention, a loop antenna 40 is formed on a substrate 20 and a first COB 100 in which the COB 100 is accommodated. The receiving groove 30 is formed. On the upper and lower surfaces of the substrate 20, the print layer 21 and the protective layer 22 are laminated to form a protective layer. In this case, a second COB 100 accommodating groove 31 is formed in the protective layer laminated on the upper surface of the substrate 20 so that the connection terminal 10 is exposed to be connected to the RF terminal 110 of the COB 100. Can be formed. The combination COB 100 is accommodated in the COB 100 receiving groove in a state where the substrate 20 and the layers are laminated.

4 is a flowchart illustrating a method of manufacturing a contact and non-contact card according to an embodiment of the present invention. In this regard, it will be described with reference to FIGS. 5 to 8.

Referring to FIG. 4, first, connection terminals are connected to both ends of a loop antenna of a substrate (410). In this regard, it will be described with reference to FIG. 5.

Referring to FIG. 5, the connection terminal 10 is joined to both ends of the loop antenna 40 wired to the substrate 20. The connection terminal 10 is positioned around the outer edge of the first COB receiving groove 30. In the manufacturing method of the contact and non-contact card 50 of the present invention, since the COB receiving grooves 30 and 31 are formed after the protective layer is formed, the connection terminal 10 can be joined to the end of the loop antenna 40. At this time, the first COB receiving groove 30 is not formed. Therefore, in this case, it is preferable that the position where the first COB receiving groove 30 is to be formed on the substrate 20 is displayed.

In this case, it is preferable that the connection terminal 10 is connected to both ends of the loop antenna 40 in a state where a portion joined to the RF terminal 110 is previously punched. The pair of connection terminals 10 may be bonded to the ends of the loop antenna 40, and then lead may be applied to the perforated regions of the connection terminals 10. Accordingly, in the card 50 having contact and non-contact functions, the COB 100 rear RF terminal and the perforated connection terminal 10 of the loop antenna 40 are heated and bonded at the surface of the COB 100. The defect is eliminated and the quality of the card 50 having contact and non-contact functions is excellent, and the production cost can be reduced in the manufacturing process and the generation of environmental pollutants can be minimized.

4, the protective layer is laminated on the upper and lower surfaces of the substrate, and then it is heated and compressed. Multiple layers may be formed on the upper and lower surfaces of the substrate to protect the loop antenna. A bonding material may be applied to each layer, and a single card may be formed by laminating a substrate and a protective layer and heating and compressing the same.

Next, a COB receiving groove is formed in the substrate and the protective layer (430). In this regard, referring to FIG. 6, the COB receiving grooves 30 and 31 in which the COB 100 is to be accommodated may be formed in the substrate 20 and the protective layer, respectively. The first COB receiving grooves 30 formed in the substrate 20 may be formed between the connection terminals 10 on the card 50 side. In this case, the first COB receiving groove 30 may be finely formed using a milling machine so that the COB 100 may be inserted into the card 50.

The second COB receiving groove 31 formed in the protective layer may be formed only in the protective layer formed on the upper surface of the substrate 20. Therefore, when the print layer 21 and the protective layer 22 are formed as the protective layer, the second COB receiving grooves 31 may be formed, respectively. The second COB receiving groove 31 is preferably formed to a sufficient size so that the connection terminal 10 on the card 50 side can be sufficiently exposed. In this case, the second COB receiving groove 31 may be formed finely using a milling machine. Accordingly, the COB 100 may be seated in the COB receiving grooves 30 and 31 formed in the substrate 20 and the protective layer.

Meanwhile, in the card 50 manufacturing process, one card 50 may be manufactured to manufacture the plurality of cards 50, and then the plurality of cards 50 may be produced by cutting them into a predetermined size. According to the manufacturing facility, the loop antenna 40 may be wired on an area separated from each other on one large substrate 20.

4 again, after the hot melt is bonded to the back surface of the combination COB, the combination COB is inserted into the first COB accommodating groove and the second COB accommodating groove, and then heat-bonded (440). In this regard, it will be described later with reference to FIGS.

Referring to FIG. 7, the combination COB 100 inserted into the COB receiving grooves 30 and 31 is connected to the connection terminal 10 of the loop antenna 40, and the RF terminal 110 behind the COB 100 is connected. The upper terminal of the combination COB 100 is connected to the connection terminal 10 at both ends of the loop antenna 40 exposed to the COB receiving grooves 30 and 31 and the RF terminal 110 at the rear of the COB 100 using lead coated on the lead. In the contact fusion heater 200 is heated and bonded.

In addition, the hot melt is bonded to the back of the combination COB 100. In this case, hot melt is punctured in the RF terminal 110 portion of the combination COB. When the COB 100 is inserted into the COB receiving grooves 30 and 31 and then thermally compressed, the contact surface of the second COB receiving groove 31 and the rear surface of the RF terminal 100 is joined. Accordingly, the COB 100 is bonded to the RF terminal 110 and the connection terminal 10 and the back of the COB 100 and the second receiving groove 31 is made.

Referring to FIG. 8, in addition to the connection terminal 10 at both ends of the RF terminal 110 and the loop antenna 40 on the back of the COB 100 bonded to each other, the back and the second COB of the COB 100 excluding the RF terminal are accommodated. The groove 31 is joined. In order to bond the back surface of the COB 100 and the second COB receiving groove 31, a hot melt fusion heater 300 may be used.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, Accordingly, the invention should be construed by the description of the claims, which are intended to cover obvious variations that can be derived from the described embodiments.

10: Connection terminal
20: substrate
21: print layer
22: protective layer
30: first COB receiving groove
31: 2nd COB receiving groove
40 loop antenna
50: card
100: combination COB
110: RF terminal
200: heater for fusion welding
300: hot melt fusion heater

Claims (15)

Forming a pair of connection terminals connected to both ends of the loop antenna wired on the substrate to a position corresponding to the RF terminal on the back side of the combination COB;
Puncturing a portion of the pair of connection terminals to which the RF terminal on the rear surface of the COB is bonded;
Laminating a protective layer and a print layer on the upper and lower surfaces of the substrate and thermally compressing them; And
Bonding the pair of connection terminals to the RF terminal on the back side of the combination COB;
Forming the connection terminal,
A redundant loop antenna is formed before wiring the loop antenna to a position corresponding to one of the RF terminals on the back side of the combi COB on the substrate, and a position corresponding to the other terminal of the RF terminals on the back side of the combi COB. Forming an extra loop antenna on the substrate that is not wired after the wiring is terminated; And
Placing the pair of connection terminals at corresponding positions of each of the RF terminals on the back side of the combination COB on the substrate, and then joining the redundant loop antennas not wired on the substrate to the pair of connection terminals. step;
Contact and contactless non-contact card manufacturing method comprising a. delete delete The method of claim 1, wherein prior to the bonding step,
Milling a space between the pair of connection terminals on the substrate to form a first COB receiving groove for receiving the protrusion on the back side of the combination COB;
Method of manufacturing a contact and contactless combined card further comprising. delete The method of claim 1, wherein after the thermocompression step,
Milling a region including the pair of connection terminals in the layers stacked on the upper surface of the substrate to form a second COB receiving groove accommodating the combination COB;
Method of manufacturing a contact and contactless combined card further comprising. The method of claim 4 or 6, wherein the manufacturing method of the card is
Bonding a hot melt to the back surface of the combination COB, and then heating and bonding the combination COB to the first and second COB receiving grooves;
Method of manufacturing a contact and contactless combined card further comprising. Contact and non-contact combined inlay card produced by the manufacturing method of any one of claims 1 to 4. Contact and non-contact card produced by the manufacturing method of claim 7. A substrate;
A loop antenna wired on the substrate;
A pair of connection terminals connected to both ends of the loop antenna and formed at a position corresponding to the RF terminal on the rear side of the combination COB, and including a junction hole at which a portion of the loop antenna is joined;
A protective layer laminated on upper and lower surfaces of the substrate and thermally compressed; And
And a combination COB having terminals joined to the pair of connection terminals.
The loop antenna,
A starting coil formed separately from the substrate before the coil is wired on the substrate and bonded to one terminal of the pair of connection terminals; And
A finishing coil formed after the coil is wired on the substrate and separated from the substrate and bonded to one of the pair of connection terminals;
Contact and contactless combined card comprising a. delete The method of claim 10, wherein the substrate,
A first COB receiving groove milled to accommodate the protrusion of the rear surface of the combination COB in a space between the pair of connection terminals;
Contact and contactless combined inlay card comprising a. delete delete The method of claim 10, wherein the protective layer,
A second COB receiving groove milled to accommodate the combination COB in an area including the pair of connection terminals;
Contact and contactless combined card comprising a.

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