CN103199025B - A kind of double-interface card closed automatic welding encapsulation production method - Google Patents
A kind of double-interface card closed automatic welding encapsulation production method Download PDFInfo
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- CN103199025B CN103199025B CN201310093133.3A CN201310093133A CN103199025B CN 103199025 B CN103199025 B CN 103199025B CN 201310093133 A CN201310093133 A CN 201310093133A CN 103199025 B CN103199025 B CN 103199025B
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Abstract
The present invention relates to a kind of double-interface card closed automatic welding encapsulation production method, described method comprises: step one: first, carries out the production of inlay sheet material, and then, being carried out by the inlay sheet material produced reprocessing rear production is double-interface card body; Step 2: after double-interface card body completes, carries out the closed automatic welding encapsulation of double-interface card body, completes the production of double-interface card.Beneficial effect of the present invention is: present method solves existing production method mainly by artificial problem of producing, time saving and energy saving, change in addition first by hand module and card sky wire bonding, carry out the mode of production of module package again, achieve closed automatic soldering technique, the production efficiency of double-interface card is improved, has ensured the demand in market, energy savings, improves the economic benefit of country and enterprise.
Description
Technical field
The present invention relates to technical field of intelligent card, particularly relate to a kind of double-interface card closed automatic welding encapsulation production method.
Background technology
Along with the fast development of information technology, smart card is day by day universal in the application of numerous industries such as finance, traffic, communication, and contact intelligent card and contact type intelligent card, in the fusion of different applications, advance the new development of double-interface smart card.The technical scheme of double-interface smart card is introduced radio-frequency antenna and corresponding treatment circuit and is realized on contact type smart card chip.The production method of current smart card makes by artificial individual, and speed of production is slow, and every day 20, people can only produce 4000 double-interface cards; The production of batch can not be formed.Can not meet the demand in market; Manually utilize electric iron to weld, easily cause scald and Danger Electric shock risk.
Summary of the invention
The object of this invention is to provide a kind of double-interface card closed automatic welding encapsulation production method, to overcome current existing method above shortcomings.
The object of the invention is to be achieved through the following technical solutions:
A kind of double-interface card closed automatic welding encapsulation production method, said method comprising the steps of:
Step one: first, carries out the production of inlay sheet material, and then, being carried out by the inlay sheet material produced reprocessing rear production is double-interface card body.
(1) select materials: select in the coiling that the PVC of 0.2mm thickness material is inlay sheet material and expect, the PVC material selecting 0.1mm thickness is the fabric of inlay sheet material, by all material at perforating press upper punch location hole, be then benchmark with location hole, by middle material at another perforating press upper punch tin film perforation;
(2) sunken cord: middle material is determined on ultrasonic wave sunk cord machine the position of sunkening cord, the end of a thread two holes position place coiling three times, carries out resonance frequency detection respectively subsequently, paint remover is dropped in position, hole place simultaneously, makes the copper core wire at position, hole place exposed after erasing;
(3) fill out tin sheet: position, hole place tin sheet being filled into exposed copper core wire, the upper and lower surface of expecting in the coiling of inlay sheet material respectively covers the fabric of one deck inlay sheet material, carries out laminate adhesive; Produce inlay sheet material;
(4) finally again carry out resonance frequency sampling observation, carry out the inspection of inlay sheet material outward appearance after detection, waste product is made mark, then put in storage for subsequent use;
(5) print: on the positive fabric and reverse side material of card, carry out pattern printing, thickness is 0.125mm, after printing, carries out the inspection of printing effect, and marks; By coating force feed on the another side of positive and negative printing layered material and the fabric of inlay sheet stock, and put into infrared ray drying tunnel and carry out drying, after drying, two-layer printed layers and inlay sheet edge are bondd by glue; And
Then and test (6) after bonding, carry out lamination, what lamination was good get stuck goes out individual card with punch machine, obtains double-interface card body, and, after inspection, warehouse-in is continued to employ.
Step 2: after double-interface card body completes, carries out the closed automatic welding encapsulation of double-interface card body, and the closed automatic welding encapsulation of described double-interface card body comprises the following steps:
(1) module gum, back of the body solder: use back-gluing machine to carry on the back PUR in module chip face, reserve solder joint and chip, then use spot gluing equipment low-temperature alloy solder droplets on the pad of module chip face, self-assembling formation solder joint after cooling, the melting temperature of low-temperature alloy solder is 90 degree;
(2) groove milling: use slotting equipment to carry out groove milling, once can mill out three layers of slot, ground floor is module carrier band groove, and the second layer is welding groove, and third layer is chip groove;
(3) automatic welding is encapsulated: the module of whole dish having been carried on the back thermosol and solder loads automatic encapsulation device, again the card of good for milling groove is put into automatic encapsulation device, carry out automatic module die-cut, encapsulation, encapsulating that the temperature of perming is 150 degree, hot pressure time and under the time of colding pressing is 1.5 seconds and pressure is the condition of 3 MPas, realize the automatic welding of module package and solder joint and card internal antenna simultaneously; And
(4), after welding envelope has turned, carry out resonance frequency inspection, visual examination and bending song and the inspection of contact height successively, pack warehouse-in after inspection, complete the production of double-interface card.
Beneficial effect of the present invention is: the invention solves existing production method mainly by artificial problem of producing, can save labour 70%; Change first by hand module and card sky wire bonding, then carry out the mode of production of module package; Directly encapsulate, utilize the temperature and pressure needed during package module just can weld, the welding of package module and antenna is carried out simultaneously, realizes enclosed automatic welding; Achieve and produce in batches on the common sealed in unit of existing SIM card, improve production efficiency, ensure the market demand; Produced in batches by equipment, protect the injury to personnel to greatest extent; Energy savings, improves the economic benefit of country and enterprise.
Embodiment
A kind of double-interface card described in the embodiment of the present invention closed automatic welding encapsulation production method, said method comprising the steps of:
Step one: first, carries out the production of inlay sheet material, and then, being carried out reprocessing rear production by the inlay sheet material produced is double-interface card body, and concrete grammar comprises the following steps:
(1) select materials: select in the coiling that the PVC of 0.2mm thickness material is inlay sheet material and expect, the PVC material selecting 0.1mm thickness is the fabric of inlay sheet material, by all material at perforating press upper punch location hole, be then benchmark with location hole, by middle material at another perforating press upper punch tin film perforation;
(2) sunken cord: middle material is determined on ultrasonic wave sunk cord machine the position of sunkening cord, the end of a thread two holes position place coiling three times, carries out resonance frequency detection respectively subsequently, paint remover is dropped in position, hole place simultaneously, makes the copper core wire at position, hole place exposed after erasing;
(3) fill out tin sheet: position, hole place tin sheet being filled into exposed copper core wire, the upper and lower surface of expecting in the coiling of inlay sheet material respectively covers the fabric of one deck inlay sheet material, carries out laminate adhesive; Produce inlay sheet material;
(4) finally again carry out resonance frequency sampling observation, carry out the inspection of inlay sheet material outward appearance after detection, waste product is made mark, then put in storage for subsequent use;
(5) print: on the positive fabric and reverse side material of card, carry out pattern printing, thickness is 0.125mm, after printing, carries out the inspection of printing effect, and marks; By coating force feed on the another side of positive and negative printing layered material and the fabric of inlay sheet stock, and put into infrared ray drying tunnel and carry out drying, after drying, two-layer printed layers and inlay sheet edge are bondd by glue; And
Then and test (6) after bonding, carry out lamination, what lamination was good get stuck goes out individual card with punch machine, obtains double-interface card body, and, after inspection, warehouse-in is continued to employ.
Step 2: after double-interface card body completes, carries out the closed automatic welding encapsulation of double-interface card body, and the closed automatic welding encapsulation of described double-interface card body comprises the following steps:
((1) module gum, back of the body solder: use back-gluing machine to carry on the back PUR in module chip face, reserve solder joint and chip, then spot gluing equipment is used low-temperature alloy solder droplets on the pad of module chip face, self-assembling formation solder joint after cooling, spot size is determined according to various module difference, be generally the bright metal dots that 1mm*2mm is full, solder joint height is 0.2mm, and the thickness adding upper module carrier band can not be advisable more than 0.5mm.Low-temperature alloy solder: be a kind of low-temperature alloy, it and tin, copper, the good welding effect of Jin Douyou, electric conductivity is high, the feature that resistance is little, and his melting temperature is 90 degree.
(2) groove milling: use slotting equipment to carry out groove milling, once can mill out three layers of slot, ground floor groove is module carrier band groove, specification: 13mm*11.8mm, and the degree of depth is 0.23mm; Second layer slot is welding groove, and specification is: 11mm*2mm, and the degree of depth is 0.4mm; Third layer is chip groove, and specification is: 8mm*8mm, and the degree of depth is: 0.58mm.
(3) automatic welding is encapsulated: the module of whole dish having been carried on the back thermosol and solder loads automatic encapsulation device, again the card of good for milling groove is put into automatic encapsulation device, encapsulating that the temperature of perming is 150 degree, hot pressure time and under the time of colding pressing is 1.5 seconds and pressure is the condition of 3 MPas, carry out automatic module die-cut, encapsulation, realize closed automatic welding.
Thermosol melt temperature is greater than 120 degree, because hot pressure head acts on module carrier band face, thermosol is in module chip face, lean on carrier band heat conduction, and the time is short, so hot pressure head temperature is greater than thermosol melt temperature, the melt temperature of low-temperature alloy solder is 90 degree, be less than the temperature of glue, but thickness is greater than the thickness of glue, identical temperature and time is can reach to melt effect completely, alloy melt after can and card on put out connection, automatic welding operation is just completed after cooled and solidified, alloy can not form fluid after melting, the coefficient of expansion is little, at short notice, there are the situations such as the failure welding that there will not be alloy flow to cause when pressure.
(4) finally all packaged cards are carried out to the inspection of resonance frequency inspection and contact-making surface, whether the function of checking module reaches requirement, if you have questions, module is pulled down, and card is cancelled; Whether full inspection card outward appearance has the mass defect not meeting quality standard; Spot-check the inspection that packaged card carries out bending song, the firmness of checking module encapsulation, distortion must reach more than 2000 times, the situation that module does not occur breach with card and comes off, it is qualified to be judged as, the contact height of selective examination module package is within the scope of quality standard; The double-interface card checked out is packed warehouse-in on request.
The present invention is not limited to above-mentioned preferred forms; anyone can draw other various forms of products under enlightenment of the present invention; no matter but any change is done in its shape or structure; every have identical with the application or akin technical scheme, all drops within protection scope of the present invention.
Claims (2)
1. a double-interface card closed automatic welding encapsulation production method, is characterized in that, said method comprising the steps of:
Step one: first, carries out the production of inlay sheet material, and then, being carried out by the inlay sheet material produced reprocessing rear production is double-interface card body;
Step 2: after double-interface card body completes, carries out the closed automatic welding encapsulation of double-interface card body, and the closed automatic welding encapsulation of described double-interface card body comprises the following steps:
(1) module gum, back of the body solder: use back-gluing machine to carry on the back PUR in module chip face, reserve solder joint and chip, then use spot gluing equipment low-temperature alloy solder droplets on the pad of module chip face, self-assembling formation solder joint after cooling, the melting temperature of low-temperature alloy solder is 90 degree;
(2) groove milling: use slotting equipment to carry out groove milling, once can mill out three layers of slot, ground floor is module carrier band groove, and the second layer is welding groove, and third layer is chip groove;
(3) automatic welding is encapsulated: the module of whole dish having been carried on the back thermosol and solder loads automatic encapsulation device, again the card of good for milling groove is put into automatic encapsulation device, carry out automatic module die-cut, encapsulation, encapsulating that the temperature of perming is 150 degree, hot pressure time and under the time of colding pressing is 1.5 seconds and pressure is the condition of 3 MPas, realize the automatic welding of module package and solder joint and card internal antenna simultaneously; And
(4), after welding envelope has turned, carry out resonance frequency inspection, visual examination and bending song and the inspection of contact height successively, pack warehouse-in after inspection, complete the production of double-interface card.
2. double-interface card according to claim 1 closed automatic welding encapsulation production method, it is characterized in that, step one is further comprising the steps:
(1) select materials: select in the coiling that the PVC of 0.2mm thickness material is inlay sheet material and expect, the PVC material selecting 0.1mm thickness is the fabric of inlay sheet material, by all material at perforating press upper punch location hole, be then benchmark with location hole, by middle material at another perforating press upper punch tin film perforation;
(2) sunken cord: middle material is determined on ultrasonic wave sunk cord machine the position of sunkening cord, the end of a thread two holes position place coiling three times, carries out resonance frequency detection respectively subsequently, paint remover is dropped in position, hole place simultaneously, makes the copper core wire at position, hole place exposed after erasing;
(3) fill out tin sheet: position, hole place tin sheet being filled into exposed copper core wire, the upper and lower surface of expecting in the coiling of inlay sheet material respectively covers the fabric of one deck inlay sheet material, carries out laminate adhesive; Produce inlay sheet material;
(4) finally again carry out resonance frequency sampling observation, carry out the inspection of inlay sheet material outward appearance after detection, waste product is made mark, then put in storage for subsequent use;
(5) print: on the positive fabric and reverse side material of card, carry out pattern printing, thickness is 0.125mm, after printing, carries out the inspection of printing effect, and marks; By coating force feed on the another side of positive and negative printing layered material and the fabric of inlay sheet stock, and put into infrared ray drying tunnel and carry out drying, after drying, two-layer printed layers and inlay sheet edge are bondd by glue; And
(6) after bonding, carry out lamination, what lamination was good get stuck goes out individual card with punch machine, obtains double-interface card body, then tests, and after inspection, warehouse-in is continued to employ.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310093133.3A CN103199025B (en) | 2013-03-22 | 2013-03-22 | A kind of double-interface card closed automatic welding encapsulation production method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310093133.3A CN103199025B (en) | 2013-03-22 | 2013-03-22 | A kind of double-interface card closed automatic welding encapsulation production method |
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| CN103199025A CN103199025A (en) | 2013-07-10 |
| CN103199025B true CN103199025B (en) | 2016-03-23 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108073972A (en) * | 2017-12-29 | 2018-05-25 | 靖州鑫兴智能科技有限公司 | A kind of double interface chip IC card and preparation method thereof |
| CN114834139A (en) * | 2022-07-01 | 2022-08-02 | 深圳源明杰科技股份有限公司 | Intermediate material production line and intermediate material production method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP1183644B1 (en) * | 1999-11-29 | 2007-08-22 | Ask S.A. | Method for making a non-contact hybrid smart card with an antenna support made of fibrous material |
| JP2008140293A (en) * | 2006-12-05 | 2008-06-19 | Toppan Printing Co Ltd | Antenna sheet, ic card and manufacturing method for ic card |
| CN102024175A (en) * | 2010-12-09 | 2011-04-20 | 武汉天喻信息产业股份有限公司 | Biface smart card and manufacture method thereof |
| CN102063637A (en) * | 2010-11-12 | 2011-05-18 | 上海一芯智能科技有限公司 | Intelligent double-interface card and welding packaging technology thereof |
| CN102708399A (en) * | 2012-04-16 | 2012-10-03 | 韦业明 | Soldering and packaging method for biface smart cards |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1183644B1 (en) * | 1999-11-29 | 2007-08-22 | Ask S.A. | Method for making a non-contact hybrid smart card with an antenna support made of fibrous material |
| JP2008140293A (en) * | 2006-12-05 | 2008-06-19 | Toppan Printing Co Ltd | Antenna sheet, ic card and manufacturing method for ic card |
| CN102063637A (en) * | 2010-11-12 | 2011-05-18 | 上海一芯智能科技有限公司 | Intelligent double-interface card and welding packaging technology thereof |
| CN102024175A (en) * | 2010-12-09 | 2011-04-20 | 武汉天喻信息产业股份有限公司 | Biface smart card and manufacture method thereof |
| CN102708399A (en) * | 2012-04-16 | 2012-10-03 | 韦业明 | Soldering and packaging method for biface smart cards |
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Effective date of registration: 20170724 Address after: 550003, Guizhou province new security zone, an integrated security bonded area Patentee after: Guizhou star Ruian Electronic Industry Co., Ltd. Address before: 100094, Yongjia Road, Yongfeng Industrial Park, Beijing, Haidian District, six Patentee before: Beijing Huasheng Yingke Intelligent Science & Technology Co., Ltd. |
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