CN100537211C - Smart card label production technique - Google Patents
Smart card label production technique Download PDFInfo
- Publication number
- CN100537211C CN100537211C CNB2007100309000A CN200710030900A CN100537211C CN 100537211 C CN100537211 C CN 100537211C CN B2007100309000 A CNB2007100309000 A CN B2007100309000A CN 200710030900 A CN200710030900 A CN 200710030900A CN 100537211 C CN100537211 C CN 100537211C
- Authority
- CN
- China
- Prior art keywords
- antenna
- base material
- smart card
- surface encapsulation
- card label
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title description 4
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000005538 encapsulation Methods 0.000 claims abstract description 18
- 239000012467 final product Substances 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 11
- 239000002994 raw material Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000011162 core material Substances 0.000 description 9
- 210000003298 dental enamel Anatomy 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012372 quality testing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
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- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
- Burglar Alarm Systems (AREA)
Abstract
The present invention discloses a manufacture technology of an intelligent card label which is characterized in that firstly a COB module which contains a chip and surface encapsulation base materials are prepared; then an embedding thread antenna is embedded at a surface encapsulation base material; then the COB module is put at the end of the antenna, and an ultrasonic bonding equipment is used to weld the end of the antenna and the COB; finally another surface encapsulation base material is thermal-sealed and laminated. The intelligent card label, which is produced by the present invention, has simple structure, and the structures between layers are reduced, so the raw material is saved, and the cost of the label (card) is reduced.
Description
Technical field
The present invention relates to a kind of preparation method of smart card label.
Background technology
Common RFID smart card label is " the label core material " that must produce earlier for the later stage encapsulation on process.This core material generally by metal antenna layer, glue-line, adhere to the insulated base material layer with the fixing metal antenna, after chemical etching, obtain antenna module, fall encapsulation or metal wire nation by chip again and decide mode, antenna is connected on the IC, it is synthetic to add that at last bottom and upper strata encapsulating material (generally with PET or PVC material) carry out hot pressing, this traditional antenna core material of making through complicated technology also must add one deck glue-line and rolling technology again and be embodied as and close.This preparation method complex process, the smart card label interlayer structure of making is many, and raw materials consumption is big, the production cost height of smart card label.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of manufacture craft of smart card label, this technology is simple, has saved raw material, has reduced production cost, and the smart card label of making reduced interlayer structure, thereby simple in structure.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of manufacture craft of smart card label, it is characterized in that at first being ready to contain the COB module and the surface encapsulation base material of chip, on a surface encapsulation base material, plant wire antenna again, place the COB module then in the antenna end, and aerial head and COB are carried out the circuit welding with ultrasonic wave bonding wire machine, add that at last another surface encapsulation base material carries out the heat seal lamination and gets final product.
The above surface encapsulation base material is PVC or PET base material.
The invention has the beneficial effects as follows: the process that this patent relates to, only use the metal antenna material, as the insulation enamel covered wire, must turn to the tread flaking antenna in advance unlike traditional handicraft, or copper film, aluminium membrane material are etched into the antenna core material, thereby technology is simple; The new technology antenna only uses a kind of metal antenna material, and the traditional antenna core material must use: the base material of metal antenna material+fixed antenna+be stained with rubber alloy, so saved raw material; The line facility are planted in use, directly metal wire rod (as the insulation enamel insulated round copper wire) is upward got final product by certain one deck (as bottom) that the design image is implanted to the encapsulation base material, so production control are simple; Simultaneously replaced traditional antenna core material assembly, thereby the Electronic Tag Structure that adopts the present invention to produce is simple, has reduced interlayer structure, has saved raw material, has reduced the production cost of smart card label by " planting wire antenna ".
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the smart card label profile that the present invention produces;
Fig. 2 is the smart card label plane that the present invention produces;
Fig. 3 is the partial enlarged drawing of the smart card label produced of the present invention by the IC chip position.
The specific embodiment
Be ready to contain the COB module 1 and the PVC surface encapsulation base material 2 of chip at first traditionally, on a surface encapsulation base material 2, plant wire antenna 3 again, place COB module 1 then in antenna 3 ends, and aerial head and COB are carried out the circuit welding with ultrasonic wave bonding wire machine, adding at last that another surface encapsulation base material 2 fills up closes lamination, and carry out electrical property and detect, cut edge again and post-processed such as printing, and quality testing once more before packing, promptly make as Fig. 1, Fig. 2, smart card label shown in Figure 3.
The present invention only uses the metal antenna material, as the insulation enamel covered wire, must turn to the tread flaking antenna in advance or be etched into the antenna core material unlike traditional handicraft, thereby technology is simple; Saved raw material, the new technology antenna only uses a kind of metal antenna material, and the traditional antenna core material must use: the base material of metal antenna material+fixed antenna+be stained with rubber alloy; Production control is simple: the line facility are planted in use, directly metal wire rod (as the insulation enamel insulated round copper wire) are upward got final product by certain one deck (as bottom) that the design image is implanted to the encapsulation base material.And through the traditional antenna core material that complicated technology is made, also must add one deck glue-line or pad compression technology again and be embodied as and close.
Claims (2)
1. the manufacture craft of a smart card label, it is characterized in that at first being ready to contain the COB module and the surface encapsulation base material of IC chip, on a surface encapsulation base material, directly plant wire antenna again, place the COB module in the inner end of antenna then, and aerial head and COB are carried out the circuit welding with ultrasonic wave bonding wire machine, add that at last another surface encapsulation base material carries out the heat seal lamination and gets final product.
2. the manufacture craft of a kind of smart card label according to claim 1 is characterized in that described surface encapsulation material is PVC or PET base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100309000A CN100537211C (en) | 2007-10-13 | 2007-10-13 | Smart card label production technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100309000A CN100537211C (en) | 2007-10-13 | 2007-10-13 | Smart card label production technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101138894A CN101138894A (en) | 2008-03-12 |
| CN100537211C true CN100537211C (en) | 2009-09-09 |
Family
ID=39191080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100309000A Expired - Fee Related CN100537211C (en) | 2007-10-13 | 2007-10-13 | Smart card label production technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100537211C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101350447B (en) * | 2008-07-05 | 2012-08-22 | 中山达华智能科技股份有限公司 | Line-imbedding type UHF frequency band line-establishing antennae and UHF electronic label using the same |
| CN104239930A (en) * | 2013-06-09 | 2014-12-24 | 上海长丰智能卡有限公司 | Electronic tag for pet management and implementing method of electronic tag for pet management |
| CN109919289A (en) * | 2019-04-17 | 2019-06-21 | 上海赞润微电子科技有限公司 | A kind of electronic tag and its production method |
| CN110472721B (en) * | 2019-08-09 | 2021-08-10 | 福耀玻璃工业集团股份有限公司 | Embedded RFID label |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1119317A (en) * | 1994-09-14 | 1996-03-27 | 株式会社派特 | Continous lable body and making of same |
| CN1201417A (en) * | 1995-11-08 | 1998-12-09 | A·W·维尔凯 | Method of mfg. of labels |
| CN2545651Y (en) * | 2002-05-16 | 2003-04-16 | 蔡小如 | Non-contacting IC card |
| US20030136503A1 (en) * | 2002-01-18 | 2003-07-24 | Avery Dennison Corporation | RFID label technique |
| CN2921963Y (en) * | 2006-03-13 | 2007-07-11 | 蔡小如 | RFID electronic label packaging structure and electronic label utilizing the same package structure |
-
2007
- 2007-10-13 CN CNB2007100309000A patent/CN100537211C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1119317A (en) * | 1994-09-14 | 1996-03-27 | 株式会社派特 | Continous lable body and making of same |
| CN1201417A (en) * | 1995-11-08 | 1998-12-09 | A·W·维尔凯 | Method of mfg. of labels |
| US20030136503A1 (en) * | 2002-01-18 | 2003-07-24 | Avery Dennison Corporation | RFID label technique |
| CN2545651Y (en) * | 2002-05-16 | 2003-04-16 | 蔡小如 | Non-contacting IC card |
| CN2921963Y (en) * | 2006-03-13 | 2007-07-11 | 蔡小如 | RFID electronic label packaging structure and electronic label utilizing the same package structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101138894A (en) | 2008-03-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHONGSHAN DAHUA INTELLIGENT TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CAI XIAORU Effective date: 20091016 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20091016 Address after: Guangdong province Zhongshan City Xiaolan Town, ten North Road, No. 8, Heng Jie company Patentee after: Tatwah Smarttech Co., Ltd. Address before: Guangdong Province, Zhongshan City, Guangdong Province, Zhongshan City Xiaolan Town, ten North Road, No. 8, Heng Jie company Patentee before: Cai Xiaoru |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181210 Address after: 528415 No. 9 Shuiyi South Road, Taifeng Industrial Zone, Xiaolan Town, Zhongshan City, Guangdong Province Patentee after: Zhongshan Hengda Intelligent Technology Co., Ltd. Address before: 528400 No. 8, Shiheng Street, Delai North Road, Xiaolan Town, Zhongshan City, Guangdong Province Patentee before: Tatwah Smarttech Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090909 Termination date: 20201013 |
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| CF01 | Termination of patent right due to non-payment of annual fee |