CN202306624U - Intelligent card meanwhile possessing two read-write mode matrixes - Google Patents
Intelligent card meanwhile possessing two read-write mode matrixes Download PDFInfo
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- CN202306624U CN202306624U CN2011204321959U CN201120432195U CN202306624U CN 202306624 U CN202306624 U CN 202306624U CN 2011204321959 U CN2011204321959 U CN 2011204321959U CN 201120432195 U CN201120432195 U CN 201120432195U CN 202306624 U CN202306624 U CN 202306624U
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- write mode
- elastic conductive
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Abstract
The utility model discloses an intelligent card meanwhile possessing two read-write mode matrixes (abbreviated as DI, dual interface), comprising an antenna layer and antennas and a chip circuit layer arranged on the antenna layer. The antennas and the chip circuit layer are in electric connection through an elastic conductive apparatus. According to the utility model, the elastic conductive apparatus electrically connects the antennas with the chip circuit layer and no handwork operations such as tin pasting are needed, which can raise production efficiency; a milling cutter with a special sensor is employed to perform groove milling, which can guarantee product quality; the yield is high and the intelligent card has good stability.
Description
Technical field
The utility model belongs to smart card and makes the field, relates in particular to the smart card that has two kinds of read-write mode matrixes simultaneously.
Background technology
DI (Dual Interface) card is the abbreviation that has the smart card of two kinds of read-write mode matrixes simultaneously.The DI card is that PVC layer and chip, coil are processed, and is the card of one based on single-chip, collection contact and non-contact interface.The DI card has two operation interfaces; Both can also can under the situation of (in the 10cm) separated by a distance, visit chip, carry out identical operations through the contact of the way of contact through RF-wise; Two different standards are followed at two interfaces respectively, and contact interface meets ISO/IEC7816; The noncontact interface meets ISO/IEC 14443. these two interfaces and shares same microprocessor, operating system and EEPROM (EEPROM).
Except a microprocessor chip, also have an aerial coil that links to each other with little process chip in the DI card, when using the noncontact interface, the electromagnetic field that is produced by read write line provides energy, realizes energy supply and data transmission through RF-wise.
The main production run of DI card is two types at present, and one type comprises the steps:
Make antenna and base material and carry out obtaining after pre-laminated Inlay (chip circuit) layer; To comprise that back layer and the said Inlay layer of positive layer, back layer printed material and diaphragm of front printed material and diaphragm is accurate carries out lamination and Qie Ka after corresponding, is had the card base of the smart card of two kinds of read-write mode matrixes simultaneously; Place, chip module place at said card base carries out a groove milling, on the card base that obtains after the groove milling, through manual antenna is carried out the first-class processing of take-up, backguy and trimming, carries out the secondary groove milling to blocking base afterwards; On two contacts with chip module on the other equipment, carry out a tin simultaneously and mill flat the processing, last card base and chip after progressively putting processing on the packaging machine encapsulates.
Another kind of comprising the steps:
Make antenna and base material and carry out obtaining after pre-laminated Inlay (chip circuit) layer; To comprise that back layer and the said Inlay layer of positive layer, back layer printed material and diaphragm of front printed material and diaphragm is accurate carries out lamination and Qie Ka after corresponding, obtains the card base of smart card; Place, chip module place at said card base carries out a groove milling, on the card base that obtains after the groove milling in the secondary groove milling of chip module contact point place; Inject conducting resinl in the position of secondary groove milling, and chip is inserted corresponding contact point be cured;
Last card base and chip after progressively putting processing on the packaging machine encapsulates.
State in realization in the process of DI card production; The inventor finds to exist at least in the prior art following problem: adopt conducting resinl; Because glue contacts with outside air in solidification process; And set time is long, so the electric conductivity of conducting resinl receives time and environmental impact bigger, can cause electric conductivity unstable.
The utility model content
The technical matters that the utility model will solve provides the smart card that a kind of good product quality, yield rate are high, stability has two kinds of read-write mode matrixes in the time of high.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of smart card that has two kinds of read-write mode matrixes simultaneously comprises antenna stack, is located at antenna and chip circuit layer on the said antenna stack, and it is characterized in that: said antenna and said chip circuit layer are electrically connected through elastic conductive device.
The smart card that has two kinds of read-write mode matrixes in the time of the utility model; The end of a thread of wherein said antenna is electrically connected with elastic conductive device; Said elastic conductive device is located at the zone corresponding with the circuit contacts point of chip circuit layer, and the one side of said elastic conductive device contacts electrical connection with the circuit contacts point of chip circuit layer.
The smart card that has two kinds of read-write mode matrixes in the time of the utility model, wherein said elastic conductive device are the metallic elastic electric installations.
The smart card that has two kinds of read-write mode matrixes in the time of the utility model, wherein said elastic conductive device are non-metallic elastic electric installations.
The smart card that has two kinds of read-write mode matrixes in the time of the utility model, the end of a thread of wherein said antenna is arranged at zone corresponding with the circuit contacts point of described chip circuit layer on the antenna stack with the mode of single line or multi-thread reciprocal coiling.
The smart card that has two kinds of read-write mode matrixes in the time of the utility model, the end of a thread of wherein said antenna adopts the mode of welding to be electrically connected with the another side of elastic conductive device.
The smart card that has two kinds of read-write mode matrixes in the time of the utility model, the end of a thread of wherein said antenna directly contact with the another side of elastic conductive device and are electrically connected.
The smart card that has two kinds of read-write mode matrixes in the time of the utility model, the thickness of wherein said antenna stack are 0.13-0.16mm.
The smart card that the utility model has two kinds of read-write mode matrixes simultaneously adopts elastic conductive device that antenna and said chip circuit layer are electrically connected, and has guaranteed product quality, and yield rate is high, the smart card good stability.
By international and domestic examination criteria, the bent test of bending exceeds this standard 2-3 doubly, and hot and humid shock-resistant experiment exceeds standard 0.5-1 doubly.Other each items all meet the world and domestic standard.
The smart card and the working method thereof that have two kinds of read-write mode matrixes below in conjunction with accompanying drawing to the utility model the time are described further.
Description of drawings
Fig. 1 has the structural representation of the smart card of two kinds of read-write mode matrixes simultaneously for the utility model;
Fig. 2 has the skeleton view of the smart card of two kinds of read-write mode matrixes simultaneously for the utility model;
Fig. 3 has the cut-open view of the smart card of two kinds of read-write mode matrixes simultaneously for the utility model.
Fig. 4 is the partial enlarged view of Fig. 3;
Fig. 5 processes the structural representation behind the groove for card is basic;
Fig. 6 is the structural representation of putting into behind the elastic conductive device;
Fig. 7 is the structural representation of the linear position of chip, elastic conductive device and antenna relation.
Fig. 8 is the linear structure synoptic diagram of antenna stack after sunkening cord.
Embodiment
Like Fig. 1-4, shown in Figure 7; The utility model has the smart card of two kinds of read-write mode matrixes simultaneously, comprises basic unit 1, antenna stack 2, is located at antenna 3 and chip circuit layer 4 on the antenna stack 2, and the thickness of antenna stack 2 is 0.13-0.16mm; Antenna stack 2 is arranged in the basic unit 1; The end of a thread of antenna 3 is arranged at zone corresponding with the circuit contacts point of chip circuit layer 4 on the antenna stack 2 with the mode of single line or multi-thread reciprocal coiling, offers groove B5, B6 in the basic unit 1, offers two groove B3 on the bottom surface of groove B5 respectively; Elastic conductive device 5 has two; Place respectively in two groove B3, elastic conductive device 5 is located at two zones that circuit contacts point is corresponding with chip circuit layer 4 respectively, and the end of a thread 31 of antenna 3 is electrically connected with the one side of elastic conductive device 5; Chip circuit layer 4 places groove B5, B6, and the another side of elastic conductive device 5 contacts electrical connection with the circuit contacts point of chip circuit layer 4.Elastic conductive device 5 is metallic elastic electric installation such as metal spring pressing, also can be non-metallic elastic electric installation such as electrically conductive graphite.The end of a thread 31 of antenna 3 adopts the mode of welding or the direct way of contact to be electrically connected with elastic conductive device.
The working method that the utility model has the smart card of two kinds of read-write mode matrixes simultaneously may further comprise the steps:
(1) sunken cord:
As shown in Figure 8; Antenna 3 is buried in the back side or front at antenna stack 2 underground; And the end of a thread of antenna 3 made a contact disc through reciprocal coiling; Or make contact chip like welding one wire on sheet metal with additive method; It is corresponding position such as the B1 and the B2 (Fig. 7) of two circuit contacts points of chip module that contact disc or contact chip are placed on the antenna stack with chip circuit layer 4, and this is in order to make antenna and chip module can pass through the elastic conductive device excellent contact, and Fig. 8 shows a kind of reciprocal winding mode of the end of a thread.
(2) lamination:
(3) Qie Ka and groove milling:
Card base carrier to the good justifying of lamination is cut card, finally obtains the card base, and the card base that obtains is carried out groove milling; As shown in Figure 5, at first, mill a groove B5 earlier to placing the position groove milling of chip circuit layer 4; The degree of depth of this groove B5 equates with the thickness on chip circuit layer 4 border, and then mills a groove B6 at the middle part of groove B5, and milling this position need be with the milling cutter that has special sensor; Milling cutter is in the process of groove milling; Whether detection in real time mills the layer of sunkening cord, and just stops according to predefined program at once and remembers this value when milling the end of a thread of sunkening cord, with the precision of the method assurance groove milling; Last 5 the position groove milling B3 that again elastic conductive device placed, the degree of depth of its groove B3 is confirmed by memory value.
(4) encapsulation:
Like Fig. 6, shown in 7, be placed into elastic conductive device 5 in the groove B3 earlier, B5 and B6 are put in the position of putting corresponding elastic conductive device 5 to chip circuit layer 4 with its circuit contacts then, carry out heat-seal, cold encapsulation setting and intelligent card function test at last.
Above-described embodiment describes the preferred implementation of the utility model; Be not that scope to the utility model limits; Under the prerequisite that does not break away from the utility model design spirit; Various distortion and improvement that those of ordinary skills make the technical scheme of the utility model all should fall in the definite protection domain of the utility model claims.
Claims (8)
1. a smart card that has two kinds of read-write mode matrixes simultaneously comprises antenna stack, is located at antenna and chip circuit layer on the said antenna stack, and it is characterized in that: said antenna and said chip circuit layer are electrically connected through elastic conductive device.
2. the smart card that has two kinds of read-write mode matrixes simultaneously according to claim 1; It is characterized in that: the end of a thread of said antenna is electrically connected with elastic conductive device; Said elastic conductive device is located at the zone corresponding with the circuit contacts point of chip circuit layer, and the one side of said elastic conductive device contacts electrical connection with the circuit contacts point of chip circuit layer.
3. the smart card that has two kinds of read-write mode matrixes simultaneously according to claim 2 is characterized in that: said elastic conductive device is the metallic elastic electric installation.
4. the smart card that has two kinds of read-write mode matrixes simultaneously according to claim 2 is characterized in that: said elastic conductive device is non-metallic elastic electric installation.
5. according to claim 3 or the 4 described smart cards that have two kinds of read-write mode matrixes simultaneously, it is characterized in that: the end of a thread of said antenna is arranged at zone corresponding with the circuit contacts point of described chip circuit layer on the antenna stack with the mode of single line or multi-thread reciprocal coiling.
6. the smart card that has two kinds of read-write mode matrixes simultaneously according to claim 5 is characterized in that: the end of a thread of said antenna adopts the mode of welding to be electrically connected with the another side of elastic conductive device.
7. the smart card that has two kinds of read-write mode matrixes simultaneously according to claim 5 is characterized in that: the end of a thread of said antenna directly contacts with the another side of elastic conductive device and is electrically connected.
8. according to claim 6 or the 7 described smart cards that have two kinds of read-write mode matrixes simultaneously, the thickness that it is characterized in that said antenna stack is 0.13-0.16mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204321959U CN202306624U (en) | 2011-11-03 | 2011-11-03 | Intelligent card meanwhile possessing two read-write mode matrixes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204321959U CN202306624U (en) | 2011-11-03 | 2011-11-03 | Intelligent card meanwhile possessing two read-write mode matrixes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202306624U true CN202306624U (en) | 2012-07-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204321959U Expired - Lifetime CN202306624U (en) | 2011-11-03 | 2011-11-03 | Intelligent card meanwhile possessing two read-write mode matrixes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202306624U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110428040A (en) * | 2019-08-19 | 2019-11-08 | 北京德鑫泉物联网科技股份有限公司 | A kind of Multifunction card using elastic conductive device |
| EP3673415B1 (en) * | 2017-08-25 | 2022-05-25 | CPI Card Group -Colorado, Inc. | Weighted transaction card |
-
2011
- 2011-11-03 CN CN2011204321959U patent/CN202306624U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3673415B1 (en) * | 2017-08-25 | 2022-05-25 | CPI Card Group -Colorado, Inc. | Weighted transaction card |
| CN110428040A (en) * | 2019-08-19 | 2019-11-08 | 北京德鑫泉物联网科技股份有限公司 | A kind of Multifunction card using elastic conductive device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Intelligent card with two read-write matrixes and production method thereof Effective date of registration: 20130205 Granted publication date: 20120704 Pledgee: Bank of Communications Ltd Beijing economic and Technological Development Zone sub branch Pledgor: Beijing Golden Spring Internet of Things Inc. Registration number: 2013990000084 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20140904 Granted publication date: 20120704 Pledgee: Bank of Communications Ltd Beijing economic and Technological Development Zone sub branch Pledgor: Beijing Golden Spring Internet of Things Inc. Registration number: 2013990000084 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Intelligent card with two read-write matrixes and production method thereof Effective date of registration: 20181219 Granted publication date: 20120704 Pledgee: Beijing ustron Tongsheng financing Company limited by guarantee Pledgor: Beijing Golden Spring Internet of Things Inc. Registration number: 2018990001236 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120704 |
|
| CX01 | Expiry of patent term |