CN102567766A - Method for manufacturing dual-interface card and dual-interface card - Google Patents
Method for manufacturing dual-interface card and dual-interface card Download PDFInfo
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- CN102567766A CN102567766A CN2011104144662A CN201110414466A CN102567766A CN 102567766 A CN102567766 A CN 102567766A CN 2011104144662 A CN2011104144662 A CN 2011104144662A CN 201110414466 A CN201110414466 A CN 201110414466A CN 102567766 A CN102567766 A CN 102567766A
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- 238000000034 method Methods 0.000 title claims abstract description 52
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 91
- 239000000463 material Substances 0.000 claims abstract description 29
- 238000003801 milling Methods 0.000 claims abstract description 13
- 238000010030 laminating Methods 0.000 claims abstract description 11
- 238000005516 engineering process Methods 0.000 claims abstract description 3
- 230000009977 dual effect Effects 0.000 claims description 25
- 230000008569 process Effects 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 238000004804 winding Methods 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 12
- 238000004590 computer program Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 239000002699 waste material Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The embodiment of the invention provides a method for manufacturing a dual-interface card and the dual-interface card. The method is used for increasing the production efficiency of the dual-interface card. The method comprises the following steps: an antenna which is needed by the dual-interface card can be manufactured; two ends of the antenna are respectively provided with a metal connection point; an upper layer material and a lower layer material are respectively arranged at the upper part and the lower part of the antenna, and a card base can be manufactured by the adoption of a laminating technology; a corresponding position of the card base can be subjected to groove milling so as to form a groove for containing a dual-interface card module, and the metal connection points can be exposed; and the dual-interface card module can be encapsulated into the groove, antenna connection points are respectively in contact with the metal connection points, and thus electric connection can be realized. By the adoption of the method disclosed by the embodiment of the invention, the production efficiency of the dual-interface card can be increased.
Description
Technical Field
The invention relates to the technical field of smart card manufacturing, in particular to a manufacturing method of a dual-interface card and the dual-interface card.
Background
At present, with the development of science and technology, smart cards have been generally applied to various fields. The smart card mainly comprises a contact smart card, a non-contact smart card and a dual-interface card; the dual-interface card is an intelligent card having both functions of a contact type intelligent card and a non-contact type intelligent card, and is more and more popular with people due to the characteristic of comprehensive functions.
The structure of the dual interface card is shown in fig. 1, which includes an upper PVC plate 11, a middle layer 12 and a lower PVC plate 13; wherein, the upper and lower PVC plates are respectively pressed on the upper and lower surfaces of the middle layer 12 through laminating operation to protect the middle layer 12; the structure of the intermediate layer 12 is shown in fig. 2, which includes a card base 21, a coil layer 22 in the card base 21, and a smart card module; the smart card module includes a carrier tape 23 and a chip 25; the carrier tape 23 is used for carrying a chip 25, and the carrier tape 23 comprises 2 contact points 24; the chip 25 comprises 8 pins, namely C1, C2, C3, C4, C5, C6, C7 and C8, wherein C4 and C8 are non-contact points which are respectively contacted with 2 contact points of the carrier tape; the coil layer 22 is formed by winding a metal wire with a conductive function, and is used for inducing a magnetic field change and generating an induced voltage according to the magnetic field change, and the generated induced voltage is transmitted to the chip through 2 contact points, C4 pins and C8 pins, so that the chip can be driven to perform data exchange operation.
In the prior art, the main manufacturing method of the middle layer of the dual-interface card is as follows:
manufacturing a coil layer serving as an antenna by using a winding process, respectively arranging an upper layer material and a lower layer material on the upper side and the lower side of the coil layer, and laminating the upper layer material, the lower layer material and the coil together to form a card base through a laminating operation; two ends of the metal wire of the coil layer are exposed completely through groove milling operation; picking out two ends of the metal wire in a manual wire picking mode; welding the two ends on contact points of the carrier tape respectively; the middle layer is completed by connecting 2 contact points to the C4 and C8 pins, respectively, by a baseline operation.
The inventor finds that a large amount of manpower and material resources are wasted by picking out two ends of a metal wire in a manual wire picking mode in the prior art, and the possibility of damaging the metal wire due to manual wire picking operation is increased, so that the production efficiency of producing the dual-interface card is reduced, and the possibility of generating waste cards is increased.
Disclosure of Invention
The embodiment of the invention provides a manufacturing method of a dual-interface card, which is used for improving the production efficiency of the dual-interface card.
A manufacturing method of a dual-interface card is provided, wherein a dual-interface card module is arranged on the dual-interface card; the dual-interface card module is provided with two antenna connection points, and the method comprises the following steps:
manufacturing an antenna required by the dual-interface card, wherein two ends of the antenna are respectively provided with a metal connection point;
respectively arranging an upper layer material and a lower layer material on the upper part and the lower part of the antenna, and manufacturing a card base by adopting a laminating process;
milling grooves at corresponding positions of the card base to form grooves for accommodating the double-interface card module and expose the metal connecting points;
and packaging the double-interface card module into the groove, so that the antenna connection points are respectively contacted with the metal connection points to realize electric connection.
A dual-interface card is provided with a dual-interface card module; be provided with two antenna tie points on the dual interface card module, dual interface card still includes:
the antenna comprises an antenna, wherein two ends of the antenna are respectively provided with a metal connecting point; the antenna connection points are respectively in contact with the metal connection points;
a card base including the antenna, an upper layer material and a lower layer material; the upper layer material and the lower layer material are respectively arranged on the upper part and the lower part of the antenna;
the groove is arranged at the position of the milling groove on the card base and is used for accommodating the double-interface card module; and the metal connection points are exposed in the grooves;
and the antenna connection points on the dual-interface card module are respectively contacted with the metal connection points to realize electric connection.
Therefore, by adopting the method provided by the embodiment of the invention, two ends of the antenna are respectively provided with a metal connection point; and the metal connection points are exposed after the groove milling process, and when the double-interface card module is packaged in the groove, the antenna connection points on the double-interface card can be directly contacted with the metal connection points respectively to realize electric connection. Therefore, the method omits the operation of manual thread picking, reduces the card waste rate of the dual-interface card caused by human errors, and improves the production efficiency of the dual-interface card.
Drawings
FIG. 1 is a schematic diagram of a dual interface card in the prior art;
FIG. 2 is a schematic structural diagram of an intermediate layer in a dual interface card in the prior art;
fig. 3 is a schematic flow chart illustrating a method for manufacturing a dual interface card according to an embodiment of the present invention;
fig. 4 is a schematic flowchart illustrating a method for manufacturing a dual interface card according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a card substrate with multiple antennas manufactured during a printed circuit manufacturing process used in an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a dual interface card according to an embodiment of the present invention.
Detailed Description
The embodiment of the invention provides a method for manufacturing a dual-interface card, which is adopted to ensure that two ends of an antenna are respectively provided with a metal connection point; and the metal connection points are exposed after the groove milling process, and when the double-interface card module is packaged in the groove, the antenna connection points on the double-interface card can be directly contacted with the metal connection points respectively to realize electric connection. Therefore, the method omits the operation of manual thread picking, reduces the card waste rate of the dual-interface card caused by human errors, and improves the production efficiency of the dual-interface card. As shown in fig. 3, a method for manufacturing a dual interface card according to an embodiment of the present invention includes:
step 31, manufacturing an antenna required by the dual-interface card; two ends of the antenna are respectively provided with a metal connecting point;
step 32, respectively arranging an upper layer material and a lower layer material on the upper part and the lower part of the antenna, and manufacturing a card base by adopting a laminating process;
step 33, milling grooves at corresponding positions of the card base to form grooves for accommodating the double-interface card module, and exposing the metal connection points;
and step 34, packaging the double-interface card module into the groove, so that the antenna connection points are respectively contacted with the metal connection points to realize electric connection.
Specifically, the antenna required for manufacturing the dual-interface card specifically includes:
manufacturing the coil of the antenna and the metal connection point on the antenna substrate at one time by adopting a printed circuit board process; or,
arranging two metal connection points for each antenna on an antenna substrate, manufacturing a coil of the antenna by adopting a winding process by taking one of the metal connection points as a starting point and the other metal connection point as an end point, and fixedly connecting two ends of the coil with the two metal connection points respectively; or,
the coil of the antenna is manufactured on the antenna substrate by adopting a winding process, metal connection points are respectively arranged at two ends of the coil, so that the two ends of the coil are electrically connected with the metal connection points, and the metal connection points are fixed on the antenna substrate.
Specifically, when the antennas required by the dual-interface card are manufactured at one time, after the card base is manufactured by using the lamination process, the method further includes: and cutting each card base conforming to the ISO7816 standard from the card base.
Specifically, before the card base is manufactured, the method further comprises the following steps:
and electroplating the metal connecting points to enable the metal connecting points to occupy a preset area and have a preset thickness.
Specifically, before the dual interface card module is packaged in the groove, the method further includes:
paving conductive adhesive on the metal connecting points; or,
paving conductive adhesive on the antenna connection point; or,
and conductive adhesive is paved on the antenna connection point and the metal connection point.
The embodiment of the invention provides a method for manufacturing a dual-interface card, wherein the dual-interface card comprises a dual-interface card module, the dual-interface card module comprises a carrier band and a chip, two antenna connection points, namely contact points on the carrier band, are arranged on the carrier band, and as shown in fig. 4, the method specifically comprises the following steps:
step 41, manufacturing an antenna required by the dual-interface card, wherein two ends of the antenna are respectively provided with a metal connection point;
the step may be to fabricate the antenna as one of the following methods:
firstly, a coil of the antenna and the metal connecting points can be manufactured on an antenna substrate at one time by adopting a printed circuit board process;
secondly, two metal connection points are arranged on an antenna substrate for each antenna, one of the metal connection points is used as a starting point, the other metal connection point is used as an end point, a coil of the antenna is manufactured by adopting a winding process, and two ends of the coil are respectively and fixedly connected with the two metal connection points;
thirdly, a coil of the antenna is manufactured on an antenna substrate by adopting a winding process, metal connection points are respectively arranged at two ends of the coil, so that the two ends of the coil are electrically connected with the metal connection points, and the metal connection points are fixed on the antenna substrate.
Preferably, the positions of the metal connection points correspond to the positions of the chip related to the card in the ISO7816 specification;
in this step, the metal connection points need to be respectively corresponding to one contact point, namely an antenna connection point, as shown in fig. 2;
the method for manufacturing the metal connecting point in the step can comprise the following two steps:
firstly, the two ends of the antenna are respectively subjected to the addition plating operation to respectively form metal connection points occupying a certain area and a certain height.
Secondly, two ends of the antenna are respectively connected with a metal sheet, and the metal sheets are respectively subjected to addition plating operation to respectively form metal connection points occupying a certain area and a certain height.
Preferably, the thickness is less than or equal to 0.25 mm;
step 42, respectively arranging an upper layer material and a lower layer material on the upper part and the lower part of the antenna, and manufacturing a card base by adopting a laminating process;
43, cutting the card base;
in this step, when the antenna is manufactured by using the first printed circuit board method, when a plurality of antennas 51 required by the dual interface card are manufactured at a time, a single card base 53 conforming to the ISO7816 standard is cut from the card base 52. As shown in fig. 5
This step can be omitted if only one antenna is made on the antenna substrate at a time; this step is required if multiple antennas are to be fabricated on the substrate at one time;
step 44, arranging milling groove position marks at positions near the metal connecting points;
specifically, this step may be performed before step 43;
step 45, performing groove milling operation on the card base at the position corresponding to the groove milling position mark; forming a groove for accommodating the double-interface card module and exposing the metal connecting point;
step 46, coating conductive adhesive; this step may select one of the following methods:
firstly, paving a conductive adhesive on the metal connecting point;
secondly, paving a conductive adhesive on the antenna connecting point;
thirdly, conductive adhesive is laid on the antenna connection point and the metal connection point.
And step 47, packaging the double-interface card module into the groove, so that the antenna connection points are respectively contacted with the metal connection points to realize electric connection.
In this step, the packaging of the dual interface card module into the groove specifically includes the following two methods:
firstly, conductive adhesive in the same direction is laid in the groove, and the dual-interface card module is adhered in the groove through hot pressing operation.
And secondly, adhering anisotropic conductive adhesive on the back surface of the double-interface card module, and adhering the double-interface card module in the groove through hot pressing operation.
Preferably, in the step, no matter the equidirectional conductive adhesive is laid or the anisotropic conductive adhesive is pasted, a large amount of manpower and material resources can be saved, and the production efficiency of the dual-interface card is improved;
48, pressing C4 and C8 points on the chip and contact points on the two carrier tapes respectively through base line marking operation, and then conducting operation can be carried out;
and step 49, respectively pressing the upper layer PVC board and the lower layer PVC board on the upper surface and the lower surface of the double-interface card obtained after the step 48 is finished through laminating operation.
As shown in fig. 6, an embodiment of the present invention provides another dual-interface card, where a dual-interface card module 61 is disposed on the dual-interface card; be provided with two antenna connection points 65 on the dual interface card module 61, the dual interface card still includes:
the antenna is provided with two metal connection points 67 at two ends; the antenna connection points 65 are in contact with the metal connection points 67, respectively;
the card base comprises the antenna, an upper layer material 62 and a lower layer material 63 and is manufactured by adopting a laminating process; the upper layer material 62 and the lower layer material 63 are respectively arranged on the upper part and the lower part of the antenna;
the groove 68 is arranged at the position of a milled groove on the card base and is used for accommodating the dual-interface card module 61; and said metal connection points 67 are exposed within the grooves 68;
the antenna connection points 65 on the dual-interface card module 61 are respectively in contact with the metal connection points 67 to realize electrical connection.
The antenna and the metal connection point 67 are arranged on an antenna substrate;
the antenna further comprises a coil 64;
both ends of the coil 64 are electrically connected to the metal connection points 67.
The antenna is obtained by a printed circuit board process at one time.
The metal connection points 67 occupy a predetermined area and have a predetermined thickness.
A conductive glue 66 is laid between the metal connection point 67 and the antenna connection point 65.
The upper and lower sides of the dual interface card also include PVC plates 69 to protect the dual interface card.
In conclusion, the beneficial effects are that:
by adopting the method provided by the embodiment of the invention, two ends of the antenna are respectively provided with a metal connection point occupying a certain area and a certain height; and the metal connection points are exposed after the groove milling process, and when the double-interface card module is packaged in the groove, the antenna connection points on the double-interface card can be directly contacted with the metal connection points respectively to realize electric connection. Therefore, the method saves the operation of manual thread picking, reduces the card waste rate of the dual-interface card caused by human errors, and improves the production efficiency of the dual-interface card;
preferably, no matter the equidirectional conductive adhesive is laid or the anisotropic conductive adhesive is pasted, a large amount of manpower and material resources can be saved, and the production efficiency of the dual-interface card is improved.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A manufacturing method of a dual-interface card is provided, wherein a dual-interface card module is arranged on the dual-interface card; the dual-interface card module is provided with two antenna connection points, and is characterized in that the method comprises the following steps:
manufacturing an antenna required by the dual-interface card, wherein two ends of the antenna are respectively provided with a metal connection point;
respectively arranging an upper layer material and a lower layer material on the upper part and the lower part of the antenna, and manufacturing a card base by adopting a laminating process;
milling grooves at corresponding positions of the card base to form grooves for accommodating the double-interface card module and expose the metal connecting points;
and packaging the double-interface card module into the groove, so that the antenna connection points are respectively contacted with the metal connection points to realize electric connection.
2. The method of claim 1, wherein the antenna required for manufacturing the dual interface card specifically comprises:
manufacturing the coil of the antenna and the metal connection point on the antenna substrate at one time by adopting a printed circuit board process; or,
arranging two metal connection points for each antenna on an antenna substrate, manufacturing a coil of the antenna by adopting a winding process by taking one of the metal connection points as a starting point and the other metal connection point as an end point, and fixedly connecting two ends of the coil with the two metal connection points respectively; or,
the coil of the antenna is manufactured on the antenna substrate by adopting a winding process, metal connection points are respectively arranged at two ends of the coil, so that the two ends of the coil are electrically connected with the metal connection points, and the metal connection points are fixed on the antenna substrate.
3. The method according to claim 1 or 2, when the antennas required for manufacturing a plurality of dual interface cards at a time, further comprising, after the manufacturing of the card substrate by using the lamination process:
and cutting each card base conforming to the ISO7816 standard from the card base.
4. The method of claim 1 or 2, further comprising, prior to making the card base:
and electroplating the metal connecting points to enable the metal connecting points to occupy a preset area and have a preset thickness.
5. The method of claim 1 or 2, further comprising, prior to said encapsulating said dual interface card module into said recess:
paving conductive adhesive on the metal connecting points; or,
paving conductive adhesive on the antenna connection point; or,
and conductive adhesive is paved on the antenna connection point and the metal connection point.
6. A dual-interface card is provided with a dual-interface card module; be provided with two antenna connection points on the dual interface card module, its characterized in that, dual interface card still includes:
the antenna comprises an antenna, wherein two ends of the antenna are respectively provided with a metal connecting point; the antenna connection points are respectively in contact with the metal connection points;
the card base comprises the antenna, an upper layer material and a lower layer material and is manufactured by adopting a laminating process; the upper layer material and the lower layer material are respectively arranged on the upper part and the lower part of the antenna;
the groove is arranged at the position of the milling groove on the card base and is used for accommodating the double-interface card module; and the metal connection points are exposed in the grooves;
and the antenna connection points on the dual-interface card module are respectively contacted with the metal connection points to realize electric connection.
7. The dual interface card of claim 6 wherein,
the antenna with the metal connection point sets up on the antenna substrate, the antenna still includes the coil, the both ends of coil with the metal connection point electricity is connected.
8. The dual interface card of claim 6 wherein said antenna is obtained in one pass by printed circuit board technology.
9. The dual interface card of any of claims 6-8 wherein said metal contact pads occupy a predetermined area and have a predetermined thickness.
10. The dual interface card of any of claims 6-8, wherein a conductive adhesive is disposed between the metal connection points and the antenna connection points.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104144662A CN102567766A (en) | 2011-12-13 | 2011-12-13 | Method for manufacturing dual-interface card and dual-interface card |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011104144662A CN102567766A (en) | 2011-12-13 | 2011-12-13 | Method for manufacturing dual-interface card and dual-interface card |
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| CN102567766A true CN102567766A (en) | 2012-07-11 |
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| CN2011104144662A Pending CN102567766A (en) | 2011-12-13 | 2011-12-13 | Method for manufacturing dual-interface card and dual-interface card |
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Cited By (8)
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| CN103310270A (en) * | 2012-11-30 | 2013-09-18 | 薛渊 | Dual-interface smart card and manufacturing technique thereof |
| CN103447598A (en) * | 2013-05-31 | 2013-12-18 | 东莞市曙光自动化设备科技有限公司 | Groove-milling and antenna-erecting method and device for double-interface card |
| CN103545595A (en) * | 2012-07-13 | 2014-01-29 | 东莞市锐祥智能卡科技有限公司 | Automatic line-picking method and automatic line-picking device for built-in card antennas |
| CN103577869A (en) * | 2012-08-01 | 2014-02-12 | 东莞市锐祥智能卡科技有限公司 | Wire winding method for card |
| CN107423801A (en) * | 2017-03-31 | 2017-12-01 | 深圳市文鼎创数据科技有限公司 | Smart card and its manufacture method |
| CN109409486A (en) * | 2018-10-31 | 2019-03-01 | 江苏恒宝智能系统技术有限公司 | A kind of smart card and its processing method |
| CN110033071A (en) * | 2019-04-17 | 2019-07-19 | 深圳华创兆业科技股份有限公司 | A kind of fingerprint recognition card and preparation method thereof |
| CN115456130A (en) * | 2022-09-02 | 2022-12-09 | 东信和平科技股份有限公司 | Double-interface chip card manufacturing process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103545595A (en) * | 2012-07-13 | 2014-01-29 | 东莞市锐祥智能卡科技有限公司 | Automatic line-picking method and automatic line-picking device for built-in card antennas |
| CN103545595B (en) * | 2012-07-13 | 2015-05-27 | 东莞市锐祥智能卡科技有限公司 | Automatic line-picking method and automatic line-picking device for built-in card antennas |
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| CN103447598A (en) * | 2013-05-31 | 2013-12-18 | 东莞市曙光自动化设备科技有限公司 | Groove-milling and antenna-erecting method and device for double-interface card |
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| CN107423801A (en) * | 2017-03-31 | 2017-12-01 | 深圳市文鼎创数据科技有限公司 | Smart card and its manufacture method |
| CN109409486A (en) * | 2018-10-31 | 2019-03-01 | 江苏恒宝智能系统技术有限公司 | A kind of smart card and its processing method |
| CN110033071A (en) * | 2019-04-17 | 2019-07-19 | 深圳华创兆业科技股份有限公司 | A kind of fingerprint recognition card and preparation method thereof |
| CN115456130A (en) * | 2022-09-02 | 2022-12-09 | 东信和平科技股份有限公司 | Double-interface chip card manufacturing process |
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Application publication date: 20120711 |