CN103577869A - Wire winding method for card - Google Patents
Wire winding method for card Download PDFInfo
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- CN103577869A CN103577869A CN201210272616.5A CN201210272616A CN103577869A CN 103577869 A CN103577869 A CN 103577869A CN 201210272616 A CN201210272616 A CN 201210272616A CN 103577869 A CN103577869 A CN 103577869A
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Abstract
The invention discloses a wire winding method for a card. The method comprises the following steps that after a first wire head of a wire is placed in a set region of a wire winding layer, the wire is placed in a first-time bending or multi-time bending mode in the set region; then the wire is led out of the set region, and the wire is placed in a winding mode at the portion, outside the set region, of the wire winding layer to set the number of turns; then the wire is led to the set region, and the wire is placed in a second-time bending or multi-time bending mode; then a second wire head of the wire is placed in the set region; then a covering layer is arranged on one side, with the wire, of the wire winding layer, and the covering layer and the wire winding layer are in press fit to obtain the card, wherein the bending angles formed at the bending positions are obtuse angles, or the radian of the circular arc formed at each bending position is M, the radius of each circular arc is R, 0<M<=pi, and 0.8mm<=R<=1.5mm. According to the card obtained though the wire winding method, the wire stored in the set region is long, the wire is easily broken off when picked, and the efficiency and the finished product rate are improved.
Description
Technical field
The present invention relates to moving communicating field, more particularly, relate to a kind of card method for winding.
Background technology
Along with infotech and economic develop rapidly all over the world, economy and information interchange between people are more and more frequent, people are also finding various communication media easily always simultaneously, the contact type CPU card (smart card) using from early stage magnetic card storage card, logic encryption card and now a lot of field finally.Smart card is also being brought into play irreplaceable effect in people's life at present, is that contact intelligent card or contact type intelligent card all have its merits and demerits separately, and the wearing and tearing between contact intelligent card and card machine tool, have shortened its serviceable life greatly.And non-contact card is in the occasion of Radio frequency interference (RFI) severity, its application is limited; Secondly owing to passing through coupling transferring energy, so require its power consumption very low; Moreover, due to now a lot of industries, as there is technology and the infrastructure of the application of a large amount of contact card in the industries such as finance, communication, they also will continue to use contact card, between this situation set the double-interface card of contact card and non-contact card advantage arise at the historic moment, the demand to double-interface card on market is increasing.
In prior art, the method for producing double-interface card generally comprises following steps:
1, chip is carried out to scolding tin for glue, with scolding tin on the predetermined solder joint of chip, and hot melt adhesive is welded on chip;
2, be built-in with groove milling knockout film trap position on the card of wire, chip groove exposes inner conductors in position;
3, choose two wire heads of inner conductors;
3, two wire heads were fallen, and made on two smooth cards outside chip groove position of wire head, thereby reserve operating space for the following boss groove position that mills out, while also avoiding milling, lost wire head;
4, (chip comprises sheet metal and the boss being fixedly electrically connected to sheet metal in chip groove position, to mill out the boss groove position of mating with the boss of chip, boss is chip body, the surface area of boss is less than the surface area of sheet metal, therefore, sheet metal is positioned in chip groove position, and boss is positioned in the boss groove position in chip groove position);
5, two wire head reasons are straight, make two wire heads all perpendicular to card;
6, two wire heads respectively with chip on predetermined solder joint on scolding tin weld, chip is placed in chip groove position, then encapsulates, with this, manufacture double-interface card.
About the card in above-mentioned step 2, its method for making comprises the following steps: on wire winding layer, around putting wire, conductor part is embedded and be fixed on wire winding layer; In wire winding layer one side of placing wire, overlayer is set, pressing overlayer and wire winding layer, make card., when milling out chip groove position and choosing two wire heads of inner conductors on card in chip groove position, there is following defect in card prepared by this method:
The length of the wire of placing in chip groove position is too short, causes choosing after wire head, and wire head and chips welding difficulty, this has just reduced production efficiency and product percent of pass;
While placing more wire in chip groove position, also have difficulties, the one, because of the region of chip groove position narrow and small, difficult wiring; The 2nd, because the bending angle of wire is difficult to hold or radian and the radius of the circular arc that the bending place of wire forms are difficult to hold, while causing wire to be subject to bending, produce metal fatigue, in above-mentioned steps 3, provoke in the process of wire head, wire very easily fractures, this has just caused wastage of material, has reduced production efficiency and product percent of pass.
Therefore, there is following defect in the method for making of card of the prior art: card mills out behind chip groove position, and the length of the wire of placing in chip groove position is too short; While placing more wire in chip groove position, also have difficulties; While making double-interface card by card, production efficiency is low, product percent of pass is low, have the phenomenon that wastes raw material.
Summary of the invention
The technical problem to be solved in the present invention is, for the above-mentioned defect of prior art: card mills out behind chip groove position, and the length of the wire of placing in chip groove position is too short; While placing more wire in chip groove position, also have difficulties; While making double-interface card by card, production efficiency is low, product percent of pass is low, have the phenomenon that wastes raw material, and a kind of card method for winding is provided.
The card that adopts card method for winding of the present invention to make, after milling out chip groove position, the wire of placing in chip groove position is longer, is beneficial to and chooses after wire head, wire head and chips welding; In setting regions (while also milling out chip groove position on chip, when the region of the wire winding layer corresponding with chip groove position) wire is placed in bending, the bending angle that bending place forms is that the radian of the circular arc that forms of obtuse angle or bending place is that the radius of M, circular arc is R, 0 < M≤π, 0.8 millimeter≤R≤1.5 millimeter, greatly reduced like this metal fatigue of wire, avoided wire when take-up to fracture, improve production efficiency and product percent of pass, saved raw material; First wire head is all substantially parallel with a limit of wire winding layer with second wire head, is beneficial to like this and when automatic take-up machine take-up, picks up respectively two wire heads.
The technical solution adopted for the present invention to solve the technical problems is: construct a kind of card method for winding, on wire winding layer, around putting wire, conductor part is embedded and be fixed on wire winding layer, comprise the following steps:
S1: place first wire head of wire in the setting regions of wire winding layer, first wire head is substantially parallel with a limit of wire winding layer;
S2: for the first time, repeatedly bend and place wire to increase the length at setting regions inside conductor in setting regions, the bending angle that wherein bending place forms is that the radian of the circular arc that forms of obtuse angle or bending place is that the radius of M, circular arc is R, 0 < M≤π, 0.8 millimeter≤R≤1.5 millimeter;
S3: wire is drawn to setting regions, on the wire winding layer outside setting regions, by wire around putting the setting number of turns;
S4: again wire is introduced to setting regions, in setting regions, for the second time, repeatedly bend and place wire to increase the length at setting regions inside conductor, the bending angle that wherein bending place forms is that the radian of the circular arc that forms of obtuse angle or bending place is that the radius of M, circular arc is R, 0 < M≤π, 0.8 millimeter≤R≤1.5 millimeter;
S5: after wire repeatedly bends for the second time in setting regions, place second wire head of wire in setting regions, second wire head is substantially parallel with first wire head;
S6: in wire winding layer one side of placing wire, overlayer is set, pressing overlayer and wire winding layer, make card.
In card method for winding of the present invention, on wire winding layer, around putting wire, conductor part is embedded and be fixed on wire winding layer, comprise the following steps:
S1: place first wire head of wire in the setting regions of wire winding layer, first wire head is substantially parallel with a limit of wire winding layer;
S2: twice bending placed wire to increase the length at setting regions inside conductor in setting regions, wherein, the radian of the circular arc that bending place forms is for the first time that the radius of π, circular arc is 0.9 millimeter, and the radian of the circular arc that bending place forms is for the second time that the radius of pi/2, circular arc is 1.2 millimeters;
S3: wire is drawn to setting regions, on the wire winding layer outside setting regions, by wire around putting the setting number of turns;
S4: again wire is introduced to setting regions, in setting regions, twice bending placed wire to increase the length at setting regions inside conductor again, wherein, the radian of the circular arc that bending place forms is for the first time that the radius of pi/2, circular arc is 1.2 millimeters, and the radian of the circular arc that bending place forms is for the second time that the radius of π, circular arc is 0.9 millimeter;
S5: place second wire head of wire in setting regions, second wire head is substantially parallel with first wire head;
S6: in wire winding layer one side of placing wire, overlayer is set, pressing overlayer and wire winding layer, make card.
In card method for winding of the present invention, on wire winding layer, when putting wire, adopt ultrasound wave, conductor part is embedded and be fixed on wire winding layer.
In card method for winding of the present invention, wire winding layer is rectangle, and in described step S1, first wire head is wide substantially parallel with wire winding layer.
In card method for winding of the present invention, in described step S3, setting the number of turns is 5 circles.
In card method for winding of the present invention, in described step S3, setting the number of turns is 6 circles.
In card method for winding of the present invention, described setting regions is while milling out chip groove position on card, the region of the wire winding layer corresponding with chip groove position.
In card method for winding of the present invention, the spacing of first wire head and second wire head is L, 3 millimeters≤L≤5 millimeter.
Implement card method for winding of the present invention, there is following beneficial effect: the card that adopts card method for winding of the present invention to make, after milling out chip groove position, the wire of placing in chip groove position is longer, is beneficial to and chooses after wire head, wire head and chips welding; In setting regions (while also milling out chip groove position on chip, when the region of the wire winding layer corresponding with chip groove position) wire is placed in bending, the bending angle that bending place forms is that the radian of the circular arc that forms of obtuse angle or bending place is that the radius of M, circular arc is R, 0 < M≤π, 0.8 millimeter≤R≤1.5 millimeter, greatly reduced like this metal fatigue of wire, avoided wire when take-up to fracture, improve production efficiency and product percent of pass, saved raw material; First wire head is all substantially parallel with a limit of wire winding layer with second wire head, is beneficial to like this and when automatic take-up machine take-up, picks up respectively two wire heads.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 be card method for winding embodiment of the present invention on wire winding layer around the structural representation of putting wire;
Fig. 2 is the partial enlarged drawing at A place in Fig. 1;
Fig. 3 is the structural representation of the card of card method for winding embodiment of the present invention;
Fig. 4 is along the cut-open view of B-B line in Fig. 3.
Embodiment
For technical characterictic of the present invention, object and effect being had more clearly, understand, now contrast accompanying drawing and describe the specific embodiment of the present invention in detail.
As shown in Figure 1, in card method for winding embodiment of the present invention, for the coiling of card inner conductors, when making to mill out chip groove position and choosing two aerial heads of wire on card in chip groove position, avoid aerial head to fracture, increase the length of the aerial head in chip groove position simultaneously
As shown in Figure 1 and Figure 2, in card method for winding embodiment of the present invention, on wire winding layer 1, around putting wire 2, make wire 2 be partially submerged into and be fixed on wire winding layer 1, comprise the following steps:
S1: place first wire head 21 of wire 2 in the setting regions 4 of wire winding layer 1, first wire head 21 is substantially parallel with a limit of wire winding layer 1.At this, it should be noted that, setting regions 4 is while milling out chip groove position on card, the region of the wire winding layer 1 corresponding with chip groove position, the card of card herein for finally making, also complete around putting wire 2 on wire winding layer 1, and make card after pressing overlayer 3 and wire winding layer 1.In the process of follow-up making double-interface card, can mill out chip groove position in this setting regions 4, so two wire heads of wire 2 must be arranged at setting regions 4.
S2: twice bending placed wire 2 to increase the length at setting regions 4 inside conductors 2 in setting regions 4, wherein, the radian of the circular arc that bending place 22 forms is for the first time that the radius of π, circular arc is 0.9 millimeter, and the radian of the circular arc that bending place 22 forms is for the second time that the radius of pi/2, circular arc is 1.2 millimeters.
S3: as shown in Figure 1 and Figure 2, wire 2 is drawn to setting regions 4, on the wire winding layer 1 outside setting regions 4, by wire 2 around putting the setting number of turns.As shown in Figure 4, in the present embodiment, setting the number of turns is 5 circles.Certainly, according to the requirement of the frequency height of double-interface card, also can corresponding adjustment set the numerical value of the number of turns, as also can be for 6 circles etc., also can adjust the spacing of adjacent wires 2 simultaneously.
S4: again wire 2 is introduced to setting regions 4, in setting regions 4, twice bending placed wire 2 to increase the length at setting regions 4 inside conductors 2 again, wherein, the radian of the circular arc that bending place 22 forms is for the first time that the radius of pi/2, circular arc is 1.2 millimeters, and the radian of the circular arc that bending place 22 forms is for the second time that the radius of π, circular arc is 0.9 millimeter.
It should be noted that, in Fig. 2, only indicate a bending place, place 22, the bending place for the first time 22 in S2 and for the second time bending place 22 are positioned at the top of Fig. 2, and the bending place for the first time 22 in S4 and for the second time bending place 22 are positioned at the below of Fig. 2.
S5: 23, the second wire heads 23 of second wire head of placing wire in setting regions 4 are substantially parallel with first wire head 21.In the present embodiment, preferably second wire head 23 be arranged in parallel with first wire head 21, certainly, if form 5 degree when both arrange with interior acute angle, also belongs to " substantially parallel "; " substantially parallel " in step S1 similarly, repeats no more.
S6: as shown in Figure 4, in wire winding layer 1 one sides of placing wire 2, overlayer 3 is set, pressing overlayer 3 and wire winding layer 1, make card.
About bending place 22, also should be noted that:
Above-mentioned step S2 can also be: in setting regions 4, for the first time, repeatedly bend and place wire to increase the length at setting regions 4 inside conductors 2, the bending angle that wherein bending place 22 forms is that the radian of the circular arc that forms of obtuse angle or bending place 22 is that the radius of M, circular arc is R, 0 < M≤π, 0.8 millimeter≤R≤1.5 millimeter.For example be formed with 4 bending places 22, wherein the radian of front 3 bending places 22 is π, and the radius of circular arc is 1.2 millimeters, and the radian of the 4th bending place 22 is pi/2, and the radius of circular arc is 1.5 millimeters.
Certainly, in other embodiments, repeatedly bending can be also bending 2 times, 3 times, 6 inferior other number of times, preferably 2 times or 3 times, because now the metal fatigue degree of wire 2 is less.In other embodiments, the bending angle that bending place 22 forms can be obtuse angle, and as 130 degree, 160 degree etc., other is identical with the present embodiment, repeats no more.In other embodiments, all right, the radian of the circular arc that bending place 22 forms is that the radius of M, circular arc is R, and M can be π/3, π/6 etc., and R can be 0.8 millimeter, 1.3 millimeters etc., and other is identical with the present embodiment, repeats no more.The above-mentioned set-up mode of bending place 22 of the present invention, not only can be increased in the length of setting regions 4 inside conductors 2, and the problem that wire 2 fractures while effectively having avoided causing take-up because of metal fatigue.
Above-mentioned step S4 can also be: again wire 2 is introduced to setting regions 4, in setting regions 4, for the second time, repeatedly bend and place wire to increase the length at setting regions 4 inside conductors, the bending angle that wherein bending place 22 forms is that the radian of the circular arc that forms of obtuse angle or bending place 22 is that the radius of M, circular arc is R, 0 < M≤π, 0.8 millimeter≤R≤1.5 millimeter.
Further, on the wire winding layer 1 of wire 2 outside setting regions 4 after putting 5 circles, again drawn back setting regions 4, in setting regions 4, be formed with 4 bending places 22, wherein the radian of the 1st bending place 22 is pi/2, the radius of circular arc is 1.5 millimeters, after the radian of 3 bending places 22 be π, the radius of circular arc is 1.2 millimeters.
Certainly, in other embodiments, repeatedly bending can be also bending 2 times, 3 times, 6 inferior other number of times, preferably 2 times or 3 times, because now the metal fatigue degree of wire 2 is less.In other embodiments, the bending angle that bending place 22 forms can be obtuse angle, and as 130 degree, 160 degree etc., other is identical with the present embodiment, repeats no more.In other embodiments, all right, the radian of the circular arc that bending place 22 forms is that the radius of M, circular arc is R, and M can be π/3, π/6 etc., and R can be 0.8 millimeter, 1.3 millimeters etc., and other is identical with the present embodiment, repeats no more.
Further tell about the present embodiment:
In the present embodiment:
S2: twice bending placed wire 2 to increase the length at setting regions 4 inside conductors 2 in setting regions 4, wherein, the radian of the circular arc that bending place 22 forms is for the first time that the radius of π, circular arc is 0.9 millimeter, and the radian of the circular arc that bending place 22 forms is for the second time that the radius of pi/2, circular arc is 1.2 millimeters.
S4: again wire 2 is introduced to setting regions 4, in setting regions 4, twice bending placed wire 2 to increase the length at setting regions 4 inside conductors 2 again, wherein, the radian of the circular arc that bending place 22 forms is for the first time that the radius of pi/2, circular arc is 1.2 millimeters, and the radian of the circular arc that bending place 22 forms is for the second time that the radius of π, circular arc is 0.9 millimeter.
The S2 of the present embodiment and this setup of S4, effectively reduce the metal fatigue of wire 2, make when take-up wire 2 greatly reduce because of the probability that self reason fractures, (wire 2 is complete for qualification rate during take-up, without fractureing) improved 23-30%, its qualification rate has also reached more than 98%, has also increased the length of setting regions 4 wires simultaneously, is beneficial to the operation of welding chip.
In the present embodiment, on wire winding layer 1, around the object of putting wire 2, comprise wire 2 is partially submerged into and is fixed on wire winding layer 1, therefore when putting wire 2, can adopt ultrasound wave, make wire 2 be partially submerged into and be fixed on wire winding layer 1.As shown in Figure 4, diameter is that 1.0 millimeters of wires 2 approximately embed interior 0.6 millimeter of wire winding layer 1.
In the present embodiment, wire winding layer 1 is rectangle, and in described step S1, first wire head is wide substantially parallel with wire winding layer 1.Be beneficial to like this and when automatic take-up machine take-up, pick up respectively two wire heads.
The spacing of first wire head and second wire head is L, 3 millimeters≤L≤5 millimeter.In the present embodiment, L equals 3 millimeters, and certainly, in other embodiments, L also can equal other satisfactory length such as 4 millimeters, 5 millimeters, and other is identical with the present embodiment, repeats no more.More than two wire head intervals reach 3mm (being greater than mechanical arm) apart, take-up function is provoked respectively the single wire head of card accurately automatically, has effectively avoided because of two wire heads at a distance of bad phenomenon too little and two wire heads of while take-up.
The card that adopts card method for winding of the present invention to make, after milling out chip groove position, the wire of placing in chip groove position is longer, is beneficial to and chooses after wire head, wire head and chips welding; In setting regions (while also milling out chip groove position on chip, when the region of the wire winding layer corresponding with chip groove position) wire is placed in bending, the bending angle that bending place forms is that the radian of the circular arc that forms of obtuse angle or bending place is that the radius of M, circular arc is R, 0 < M≤π, 0.8 millimeter≤R≤1.5 millimeter, greatly reduced like this metal fatigue of wire, avoided wire when take-up to fracture, improve production efficiency and product percent of pass, saved raw material; First wire head is all substantially parallel with a limit of wire winding layer with second wire head, is beneficial to like this and when automatic take-up machine take-up, picks up respectively two wire heads.
By reference to the accompanying drawings embodiments of the invention are described above; but the present invention is not limited to above-mentioned embodiment; above-mentioned embodiment is only schematic; rather than restrictive; those of ordinary skill in the art is under enlightenment of the present invention; not departing from the scope situation that aim of the present invention and claim protect, also can make a lot of forms, within these all belong to protection of the present invention.
Claims (8)
1. a card method for winding, is characterized in that, on wire winding layer, around putting wire, conductor part is embedded and be fixed on wire winding layer, comprises the following steps:
S1: place first wire head of wire in the setting regions of wire winding layer, first wire head is substantially parallel with a limit of wire winding layer;
S2: for the first time, repeatedly bend and place wire to increase the length at setting regions inside conductor in setting regions, the bending angle that wherein bending place forms is that the radian of the circular arc that forms of obtuse angle or bending place is that the radius of M, circular arc is R, 0 < M≤π, 0.8 millimeter≤R≤1.5 millimeter;
S3: wire is drawn to setting regions, on the wire winding layer outside setting regions, by wire around putting the setting number of turns;
S4: again wire is introduced to setting regions, in setting regions, for the second time, repeatedly bend and place wire to increase the length at setting regions inside conductor, the bending angle that wherein bending place forms is that the radian of the circular arc that forms of obtuse angle or bending place is that the radius of M, circular arc is R, 0 < M≤π, 0.8 millimeter≤R≤1.5 millimeter;
S5: after wire repeatedly bends for the second time in setting regions, place second wire head of wire in setting regions, second wire head is substantially parallel with first wire head;
S6: in wire winding layer one side of placing wire, overlayer is set, pressing overlayer and wire winding layer, make card.
2. card method for winding according to claim 1, is characterized in that, on wire winding layer, around putting wire, conductor part is embedded and be fixed on wire winding layer, comprises the following steps:
S1: place first wire head of wire in the setting regions of wire winding layer, first wire head is substantially parallel with a limit of wire winding layer;
S2: twice bending placed wire to increase the length at setting regions inside conductor in setting regions, wherein, the radian of the circular arc that bending place forms is for the first time that the radius of π, circular arc is 0.9 millimeter, and the radian of the circular arc that bending place forms is for the second time that the radius of pi/2, circular arc is 1.2 millimeters;
S3: wire is drawn to setting regions, on the wire winding layer outside setting regions, by wire around putting the setting number of turns;
S4: again wire is introduced to setting regions, in setting regions, twice bending placed wire to increase the length at setting regions inside conductor again, wherein, the radian of the circular arc that bending place forms is for the first time that the radius of pi/2, circular arc is 1.2 millimeters, and the radian of the circular arc that bending place forms is for the second time that the radius of π, circular arc is 0.9 millimeter;
S5: place second wire head of wire in setting regions, second wire head is substantially parallel with first wire head;
S6: in wire winding layer one side of placing wire, overlayer is set, pressing overlayer and wire winding layer, make card.
3. card method for winding according to claim 1 and 2, is characterized in that, adopts ultrasound wave on wire winding layer when putting wire, conductor part is embedded and be fixed on wire winding layer.
4. card method for winding according to claim 1 and 2, is characterized in that, wire winding layer is rectangle, and in described step S1, first wire head is wide substantially parallel with wire winding layer.
5. card method for winding according to claim 1 and 2, is characterized in that, in described step S3, setting the number of turns is 5 circles.
6. card method for winding according to claim 1 and 2, is characterized in that, in described step S3, setting the number of turns is 6 circles.
7. card method for winding according to claim 1 and 2, is characterized in that, described setting regions is while milling out chip groove position on card, the region of the wire winding layer corresponding with chip groove position.
8. card method for winding according to claim 1 and 2, is characterized in that, the spacing of first wire head and second wire head is L, 3 millimeters≤L≤5 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210272616.5A CN103577869A (en) | 2012-08-01 | 2012-08-01 | Wire winding method for card |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210272616.5A CN103577869A (en) | 2012-08-01 | 2012-08-01 | Wire winding method for card |
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| CN103577869A true CN103577869A (en) | 2014-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210272616.5A Pending CN103577869A (en) | 2012-08-01 | 2012-08-01 | Wire winding method for card |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105868823A (en) * | 2016-06-03 | 2016-08-17 | 广东楚天龙智能卡有限公司 | Coil for dual-interface IC card with high production yield, IC card adopting coil and production method of IC card |
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| US5809633A (en) * | 1994-09-05 | 1998-09-22 | Siemens Aktiengesellschaft | Method for producing a smart card module for contactless smart cards |
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| CN105868823A (en) * | 2016-06-03 | 2016-08-17 | 广东楚天龙智能卡有限公司 | Coil for dual-interface IC card with high production yield, IC card adopting coil and production method of IC card |
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Application publication date: 20140212 |