CN105868823A - Coil for dual-interface IC card with high production yield, IC card adopting coil and production method of IC card - Google Patents
Coil for dual-interface IC card with high production yield, IC card adopting coil and production method of IC card Download PDFInfo
- Publication number
- CN105868823A CN105868823A CN201610386063.4A CN201610386063A CN105868823A CN 105868823 A CN105868823 A CN 105868823A CN 201610386063 A CN201610386063 A CN 201610386063A CN 105868823 A CN105868823 A CN 105868823A
- Authority
- CN
- China
- Prior art keywords
- take
- coil
- card
- connecting portion
- interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process
Abstract
The invention creatively provides a coil for a dual-interface IC card with the high production yield, an IC card adopting the coil and a corresponding take-up method. The coil is composed of a connecting portion, a standby welding point and a take-up portion. In the take-up process, the take-up portion can be taken up at first, and end points of the take-up portion are adopted as welding points to be welded to bonding pads; if a wire is broken when taken up, due to the fact that the take-up portion and the connecting portion are connected, the broken point is in the take-up portion ordinarily, and the connecting portion is not affected; due to the fact that the connecting portion is long enough to enable the standby welding point to be welded to the bonding pad for controlling the coil, at the moment, the connecting portion can be taken up again, and the connecting portion and the bonding pad are welded through the standby welding portion. Accordingly, compared with the prior art, the created coil has the advantage that when a wire is broken in the take-up process, another take-up process can be performed again, and therefore the phenomenon that the card is scrapped due to one-time take-up failure is avoided.
Description
Technical field
The invention relates to double-interface IC card technical field, produces the high double-interface IC card coil of yield, the IC-card using this coil and production method thereof particularly to a kind of.
Background technology
Double-interface IC card is the smart card integrating contact with non-contact interface, as the term suggests, it has two operation interfaces, existing two kinds of access modes, and the first is accessed by the contact of contact, and another kind is then to be accessed by Non-contact radio-frequency.To this end, double-interface IC card i.e. needs contact IC chip, it is also desirable to have coil (i.e. radio-frequency antenna), and overhang needs to be welded to contact on IC chip.
In the production process of double-interface IC card, coil is first to be embedded in card, in order to make coil with contact IC chip welding, need use etching machines be etched in the end of coil, then with take-up equipment, overhang is provoked, and be welded to contact in IC chip.But, owing to the line footpath of coil is the least, during automation take-up, automatic machinery and easily overhang being broken, and once line is broken, then coil shortens, overhang curtailment is to carry out being soldered to contact IC chip, so now card will be scrapped.Therefore in production process, scrappage is high, and yield is low.For solving this problem, be the most all the probability being reduced by improvement take-up equipment and breaking line, such as technology disclosed in Chinese patent CN201210211686.X patent.But if simple angle in terms of equipment is improved, being limited to the reason such as precision of equipment, its improvement effect is limited all the time.
Summary of the invention
The purpose of the invention is to avoid above-mentioned weak point of the prior art to provide a kind of also being able in the case of equipment precision is limited to avoid directly resulting in the double-interface IC card coil that IC-card is scrapped because breaking line, use the card of this coil take-up method accordingly, thus improve production yield.
The purpose of the invention is achieved through the following technical solutions:
Provide and a kind of produce the double-interface IC card coil that yield is high, including winding section, also include connecting portion, standby solder joint and take-up portion, described connecting portion prolongs raw to standby solder joint from winding section, the length of described connecting portion be enough to make standby solder joint be soldered to the pad with control coil, connection is intersected with connecting portion at standby solder joint in one end, described take-up portion, and the other end is as pad.
Wherein, described take-up portion is vertical at standby solder joint with described connecting portion is connected.
Wherein, described take-up portion and the described connecting portion angle of intersection at standby solder joint is obtuse angle.
Wherein, described connecting portion includes bending redundancy portion.
Wherein, described bending redundancy portion is arranged near standby solder joint.
Wherein, described bending redundancy portion connects standby solder joint.
Wherein, described bending redundancy portion is curved.
Also providing for a kind of producing the double-interface IC card that yield is high, including coil and the control chip that welds with coil, described coil is any one described coil above-mentioned.
A kind of method also providing for double-interface IC card for producing described in claim 8, the method is when welding, take-up portion is provoked and makes take-up portion be perpendicular to card to establish so that pad approaches the pad of control chip, if take-up success, then use ultrasonic wave butt-joint, make pad be soldered to the pad of control chip, if take-up portion disconnects when provoking take-up portion, then provoke connecting portion, make standby solder joint approach the pad of control chip, use the standby solder joint of ultrasonic wave butt-joint order to be soldered to the pad of control chip.
The beneficial effect of the invention: the invention provides a kind of and produces the double-interface IC card coil that yield is high, and uses the IC-card of this coil and corresponding take-up method.The coil of the invention is due to connecting portion, standby solder joint and take-up portion, during take-up, can first provoke take-up portion, and with the end points in take-up portion as pad and pad solder, if take-up breaks, owing to connection is intersected in take-up portion with connecting portion, therefore cut-off point typically betides take-up portion, will not extend to connecting portion, be enough to make standby solder joint be soldered to the pad with control coil due to the length of connecting portion again, the most now can again provoke connecting portion, weld with pad with standby solder joint.Therefore, compared with prior art, the Coil technique of the invention there occurs during take-up and once breaks, and it also has the chance carrying out take-up again, will not unsuccessfully result in card because of a take-up and scrap.Although and existing equipment limited precision, but the probability that the failed probability of double take-up is greatly failed less than take-up, therefore use this coil can significantly improve the production yield in production process.
Accompanying drawing explanation
Utilize accompanying drawing that the invention is described further, but the embodiment in accompanying drawing does not constitute any restriction to the invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to the following drawings.
Fig. 1 is the structural representation that the invention produces the high double-interface IC card of yield.
Include in FIG:
1 winding section, 2 connecting portions, 3 for solder joint, 4 take-up portions, 5 bending redundancy portions.
Detailed description of the invention
With the following Examples the invention is further described.
The invention produces the detailed description of the invention of the high double-interface IC card of yield, as shown in Figure 1, including: coil and the control chip welded with coil, coil includes winding section 1, connecting portion 2, standby solder joint 3 and take-up portion 4, described connecting portion 2 prolongs raw to standby solder joint 3 from winding section 1, the length of described connecting portion 2 be enough to make standby solder joint 3 be soldered to the pad with control coil, and one end, described take-up portion 4 is vertical with connecting portion 2 at standby solder joint 3 to be connected, and the other end is as pad.
In production process, during welding, take-up portion 4 is provoked and makes take-up portion 4 be perpendicular to card to establish so that pad approaches the pad of control chip, if take-up success, then use ultrasonic wave butt-joint to make pad be soldered to the pad of control chip, if take-up portion 4 disconnects when provoking take-up portion 4, then provoke connecting portion 2, make standby solder joint 3 approach the pad of control chip, use the standby solder joint 3 of ultrasonic wave butt-joint order to be soldered to the pad of control chip.Compared with prior art, the Coil technique of the invention there occurs during take-up and once breaks, and it also has the chance carrying out take-up again, will not unsuccessfully result in card because of a take-up and scrap.Although and existing equipment limited precision, but the probability that the failed probability of double take-up is greatly failed less than take-up, therefore use this coil can significantly improve the production yield in production process.
Wherein, one end, take-up portion 4 is vertical with connecting portion 2 at standby solder joint 3 to be connected primarily to the line length provoked when avoiding and take-up portion 4 is carried out take-up extends to connecting portion 2, and the possibility of fracture occurs at connecting portion 2 when therefore avoiding first time take-up.Certainly, take-up portion 4 and described connecting portion 2 angle of intersection at standby solder joint 3 is obtuse angle or acute angle also can reach similar effect, but is then probably connecting portion 2 if acute angle and take-up portion 4 is too close together, thus can increase the difficulty of take-up.The angle advising preferred connecting portion 2 and take-up portion 4 is 90 degree, and obtuse angle takes second place.
Further, length in order to ensure connecting portion 2 be enough to make standby solder joint 3 be soldered to the pad with control coil, bending redundancy portion 5 can be set at connecting portion 2, this makes it possible to guarantee that connecting portion 2 is also not result in while having enough redundant lengths that connecting portion 2 excessively deviates welding position, preferably, this bending redundancy portion 5 should be arranged near standby solder joint 3, as the present embodiment the most directly neck bending redundancy portion 5 is connected with standby solder joint 3, so can easily bending redundancy portion 5 be stretched when needs carry out take-up to connecting portion 2, so that standby solder joint 3 extends to pad.The present embodiment is total, and bending redundancy portion 5 is set to arc, is so easy to produce, certainly, according to specific needs, it is also possible to be set to other shapes such as polyline shaped.
Finally should be noted that; above example is only in order to illustrate the technical scheme of the invention; rather than the restriction to the invention protection domain; although having made to explain to the invention with reference to preferred embodiment; it will be understood by those within the art that; the technical scheme of the invention can be modified or equivalent, without deviating from the spirit and scope of the invention technical scheme.
Claims (9)
1. one kind produces the double-interface IC card coil that yield is high, including winding section, it is characterized in that: also include connecting portion, standby solder joint and take-up portion, described connecting portion prolongs raw to standby solder joint from winding section, the length of described connecting portion be enough to make standby solder joint be soldered to the pad with control coil, connection is intersected with connecting portion at standby solder joint in one end, described take-up portion, and the other end is as pad.
A kind of produce the double-interface IC card coil that yield is high, it is characterised in that: described take-up portion is vertical at standby solder joint with described connecting portion to be connected.
A kind of produce the double-interface IC card coil that yield is high, it is characterised in that: described take-up portion and the described connecting portion angle of intersection at standby solder joint is obtuse angle.
A kind of produce the double-interface IC card coil that yield is high, it is characterised in that: described connecting portion includes bending redundancy portion.
A kind of produce the double-interface IC card coil that yield is high, it is characterised in that: described bending redundancy portion is arranged near standby solder joint.
A kind of produce the double-interface IC card coil that yield is high, it is characterised in that: described bending redundancy portion connects standby solder joint.
A kind of produce the double-interface IC card coil that yield is high, it is characterised in that: described bending redundancy portion is curved.
8. produce the double-interface IC card that yield is high, including coil and the control chip that welds with coil, it is characterised in that: described coil is the coil that in claim 1 to 7, any one is described.
9. the method being used for producing the double-interface IC card described in claim 8, it is characterized in that: during welding, take-up portion is provoked and makes take-up portion be perpendicular to card to establish so that pad approaches the pad of control chip, if take-up success, then use ultrasonic wave butt-joint to make pad be soldered to the pad of control chip, if take-up portion disconnects when provoking take-up portion, then provoke connecting portion, make standby solder joint approach the pad of control chip, use the standby solder joint of ultrasonic wave butt-joint order to be soldered to the pad of control chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610386063.4A CN105868823A (en) | 2016-06-03 | 2016-06-03 | Coil for dual-interface IC card with high production yield, IC card adopting coil and production method of IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610386063.4A CN105868823A (en) | 2016-06-03 | 2016-06-03 | Coil for dual-interface IC card with high production yield, IC card adopting coil and production method of IC card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105868823A true CN105868823A (en) | 2016-08-17 |
Family
ID=56676068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610386063.4A Pending CN105868823A (en) | 2016-06-03 | 2016-06-03 | Coil for dual-interface IC card with high production yield, IC card adopting coil and production method of IC card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105868823A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090095818A1 (en) * | 2007-10-10 | 2009-04-16 | Patrick Smith | Wireless Devices Including Printed Integrated Circuitry and Methods for Manufacturing and Using the Same |
| CN103577869A (en) * | 2012-08-01 | 2014-02-12 | 东莞市锐祥智能卡科技有限公司 | Wire winding method for card |
| CN105488558A (en) * | 2015-11-26 | 2016-04-13 | 深圳市源明杰科技有限公司 | Production method of double-interface smart card and double-interface smart card |
| CN205983522U (en) * | 2016-06-03 | 2017-02-22 | 广东楚天龙智能卡有限公司 | High two interfaces of production yield are coil, two interfaces IC -card for IC -card |
-
2016
- 2016-06-03 CN CN201610386063.4A patent/CN105868823A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090095818A1 (en) * | 2007-10-10 | 2009-04-16 | Patrick Smith | Wireless Devices Including Printed Integrated Circuitry and Methods for Manufacturing and Using the Same |
| CN103577869A (en) * | 2012-08-01 | 2014-02-12 | 东莞市锐祥智能卡科技有限公司 | Wire winding method for card |
| CN105488558A (en) * | 2015-11-26 | 2016-04-13 | 深圳市源明杰科技有限公司 | Production method of double-interface smart card and double-interface smart card |
| CN205983522U (en) * | 2016-06-03 | 2017-02-22 | 广东楚天龙智能卡有限公司 | High two interfaces of production yield are coil, two interfaces IC -card for IC -card |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101382679B (en) | Liquid crystal display panel | |
| US10108894B2 (en) | Anti-counterfeit label having increased security | |
| CN107978668A (en) | The method of the conductor wire of LED component, LED light and processing LED component | |
| CN104037099A (en) | Automatic rework processes for non-stick conditions in wire bonding operations | |
| CN103869513A (en) | Liquid crystal display panel and wire repair method thereof | |
| CN105224978A (en) | Edge crack detection system | |
| CN205983522U (en) | High two interfaces of production yield are coil, two interfaces IC -card for IC -card | |
| CN201302726Y (en) | A dual-interface smart card | |
| CN105868823A (en) | Coil for dual-interface IC card with high production yield, IC card adopting coil and production method of IC card | |
| US6623885B1 (en) | Power source element having connecting terminals | |
| CN200988133Y (en) | Spot welding head capable of automatic breaking line | |
| CN107293500A (en) | A kind of system in package routing method and device | |
| CN101420070B (en) | Connection method for antenna and intelligent card and double interface smart card | |
| CN104217837B (en) | Electric expansion valve and its coil device and the frock for the coil device | |
| CN104517132A (en) | Method for anti-counterfeit intelligent RIFD electronic tag chip | |
| CN105206396A (en) | Inductance element, air-conditioner and winding method | |
| CN105271683B (en) | A kind of glass cutting method | |
| CN103886357A (en) | RFID electronic tag and processing method thereof | |
| CN209002259U (en) | A kind of pad structure and circuit board | |
| CN203025753U (en) | RFID (Radio Frequency Identification Device) electronic tag | |
| CN207424248U (en) | Connector, ultrasonic sensor and vehicle | |
| CN212541403U (en) | Wire end winding structure of non-contact IC card capable of improving welding quality | |
| CN209447214U (en) | A kind of RFID antifalsification label of drinks | |
| CN214898315U (en) | Inner cap of tubular fuse | |
| CN206639242U (en) | A kind of double-interface smart card using single interface band |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Su Chen Inventor after: Jiang Quming Inventor after: Peng Haoyi Inventor after: Guo Shuchao Inventor after: Xie Pan Inventor after: Wu Liang Inventor before: Su Chen Inventor before: Peng Haoyi Inventor before: Xie Pan Inventor before: Wu Liang |
|
| COR | Change of bibliographic data | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160817 |
|
| RJ01 | Rejection of invention patent application after publication |