CN103729675B - A kind of Non-contact intelligent identification card INLAY layer and preparation method thereof - Google Patents
A kind of Non-contact intelligent identification card INLAY layer and preparation method thereof Download PDFInfo
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Abstract
The present invention provides a kind of Non-contact intelligent identification card INLAY layer and preparation method thereof, the preparation method comprises the following steps: 1) providing IC module, IC bearing bed and antenna bearing bed, in opening up the first punching on IC bearing bed, and in being opened up on antenna bearing bed for exposing outside IC module and the second punching corresponding with the first punching, and IC module is filled in the first punching；2) antenna bearing bed and IC bearing bed filled with IC module are overlapped and is bound up and down and be formed as one blank；3) in coiled antenna on blank, so that antenna is formed on antenna bearing bed；4) antenna that coiling is completed is electrically connected with IC module, to form Non-contact intelligent identification card INLAY layer.Compared with existing technology, the initiative welding by materials at two layers or trilaminate material coiled antenna stapled together, IC module and antenna reduces cumbersome process, improves production efficiency the present invention.
Description
Technical field
The present invention relates to the preparation fields of non-contact intelligent identification card, more particularly to a kind of non-contact intelligent identification card
INLAY layers and preparation method thereof.
Background technique
It is contactless on non-contact intelligent identification card or apparatus surface, pass through nothing between intelligent recognition card or device and reader
Line mode (emitting and receive electromagnetic wave) is communicated, and the core of non-contact intelligent identification card or device is INLAY layers,
INLAY includes that IC module and IC bearing bed, antenna and antenna bearing bed, IC module will be welded to be formed and be electrically connected with antenna.
The processing technology of present INLAY mainly has the following two kinds:
The first are as follows: IC module opsition dependent requires to fill out on IC bearing bed, has punching on IC bearing bed, makes the black of IC module
Glue is just filled out in punching；Then enameled wire is wound on IC bearing bed using ultrasonic wave on special equipment, forms antenna；
Finally IC module is electrically connected with the formation of day wire bonding.This method is IC bearing bed and antenna bearing bed is same layer.
The thickness of current IC module is that have developed to 0.3 millimeter be mainstream to mainstream from 0.4 millimeter, and IC module is caused to be held in this way
Carrier layer thickness also needs thinning, need to be reduced to 0.2 millimeter by original 0.3 millimeter, but only on the antenna bearing bed of 0.2 millimeters thick
Coiled antenna device rate can will be greatly reduced in this way production efficiency than reducing half on the bearing bed of 0.3 millimeters thick.This
Be due to: the coiling of antenna is enameled wire to be embedded into antenna bearing bed, when in thickness by the vibration of ultrasonic wave sunk cord head
When lower than 0.3 millimeter antenna bearing bed coiled antenna, due to the rigid workbench below ultrasonic wave sunk cord head and bearing bed away from
Close from relatively, so that the vibration amplitude of ultrasonic wave sunk cord head can be lost, the depth for causing enameled wire to be embedded into bearing bed reduces, and leads
Coil sections (especially corner part) is caused to be easy to fall off from bearing bed, to generate waste product.In addition such method
INLAY, IC module are exposed outside, inadequate to the protection of module without protective layer, can be right if any external force in the process in rear road
The problem of IC module and the welding quality of antenna impact, be easy to cause desoldering, rosin joint.
Second are as follows: IC bearing bed is separated with antenna bearing bed, is double-layer structure, and processing method is as follows:
Firstly, IC module is filled out on IC bearing bed, there is hole on IC bearing bed, makes IC module black glue completely in hole；
Then, by antenna bearing bed coiled antenna, this process will carry out on special equipment, be pressed enameled wire with ultrasonic wave
It is required that being embedded on antenna bearing bed, there is punching on antenna bearing bed, the initial and end lines of antenna are exposed above hole, are convenient for
It is welded with module；
Then two layers (IC bearing bed and antenna bearing bed), above is spot-welded together, and IC bearing bed is under, antenna carrying
Layer guarantees that module is exposed at completely in the hole of antenna bearing bed, the initial and end lines of antenna are just in the weldering of IC module upper
Panel；
It is welded finally, two layers of bearing bed is put on welding equipment, welds antenna and IC module, form electrical connection.
Above-mentioned second method is layered structure, and IC bearing bed is separated with antenna bearing bed, because antenna carries
The problem of thickness degree is than relatively thin, and similarly as above method, the speed of coiled antenna is slow, encounters inefficiency,
In addition such method, process is comparatively laborious, needs to sunken cord and weld two equipment, or on sunken cord twice welded machine equipment,
Efficiency is also very low！There are also welding sequences also to need artificial take-up, guarantee antenna initial and end lines module pad
Then welding region welds again, greatly reduce production efficiency！
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of non-contact intelligent identification cards
INLAY layers and preparation method thereof, the problems such as solving existing production technology low efficiency.
In order to achieve the above objects and other related objects, the present invention provides a kind of Non-contact intelligent identification card INLAY layer
Preparation method, the preparation method comprises the following steps: 1) an IC module, an IC bearing bed and an antenna bearing bed are provided,
In opening up the first punching for filling the IC module on the IC bearing bed, and in opening up use on the antenna bearing bed
In exposing outside the IC module and the second punching corresponding with first punching, and the IC module is filled in described
In one punching；2) the antenna bearing bed and IC bearing bed filled with IC module are overlapped and is bound up and down and be formed as one base
Material；3) in coiled antenna on the blank, so that the antenna is formed on the antenna bearing bed；4) day for completing coiling
Line is electrically connected with the IC module, to form Non-contact intelligent identification card INLAY layer.
It preferably, further include providing one to level up layer in the step 1)；In the step 2, further including will be described
Leveling is placed under the IC bearing bed, by the antenna bearing bed, IC bearing bed and is leveled up layer, is sequentially overlapped and fill up and down
It orders and is formed as one blank.Specifically, in the step 2, by the antenna bearing bed, IC bearing bed and level up layer, according to
Sequence folds merga pass spot-welding technology up and down and three's bookbinding is formed as one blank.
Preferably, in the step 1), the IC module is filled in first punching via bonding or bonding process
In.
Preferably, in the step 2, the antenna bearing bed and the IC bearing bed filled with IC module are folded up and down
The two bookbinding is formed as one blank by merga pass spot-welding technology.
Preferably, in the step 3), the antenna that the antenna is wound on the blank is held by a ultrasonic device
In carrier layer.Specifically, the opposite sides of second punching is crossed in the beginning of the antenna through coiling and end respectively, and divides
It is not corresponding with the pad of IC module two sides.
Preferably, in the step 4), the antenna that coiling is completed is formed with the IC module by resistance-welding process
It is electrically connected.
The present invention also provides a kind of Non-contact intelligent identification card INLAY layers prepared via above-mentioned preparation method, comprising: IC
Module, including IC chip, encapsulate the packaging body of the IC chip, and are electrically connected the IC chip lead and from the encapsulation
Two pads that body opposite sides each extends over out；IC bearing bed offers the first punching for filling the IC module；Antenna
Bearing bed, is superimposed on the IC bearing bed and binds with it and be integrated, offer for expose outside the IC module and with institute
State corresponding second punching of the first punching；Antenna is wound on the antenna bearing bed, and institute is crossed in beginning and end respectively
The opposite sides of the second punching is stated, and electric connection corresponding with the pad of IC module two sides respectively.
Non-contact intelligent identification card INLAY layer of the invention further includes leveling up layer, is superimposed under the IC bearing bed, and with
The antenna bearing bed and the bookbinding of IC bearing bed are integrated.
As described above, Non-contact intelligent identification card INLAY layer and preparation method thereof of the invention, with existing technology
It compares, the initiative welding by materials at two layers or trilaminate material coiled antenna stapled together, IC module and antenna improves
The efficiency of coiled antenna；IC module layer and antenna stack are layered structures, because there is punching identical with IC module size on antenna stack
Hole makes IC module completely in hole, preferably protects IC module not destroyed by external force in this way, substantially increases INLAY performance
Reliability.In addition, two layers or trilaminate material it is spot-welded together, can directly be completed in welding integrated primary property of sunkening cord,
Reduce cumbersome process, substantially increases production efficiency！
Detailed description of the invention
Fig. 1 to Fig. 4 is shown as in a kind of embodiment of preparation method of Non-contact intelligent identification card INLAY layer of the invention
Existing status diagram.
Fig. 5 to Fig. 7 is shown as in the preparation method another kind embodiment of Non-contact intelligent identification card INLAY layer of the invention
The status diagram of presentation.
Component label instructions
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.
It should be noted that the basic conception that only the invention is illustrated in a schematic way is illustrated provided in the present embodiment,
Then only shown in schema with it is of the invention in related component rather than component count, shape and size when according to actual implementation draw
System, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its assembly layout kenel can also
It can be increasingly complex.
The present invention provides a kind of preparation method of Non-contact intelligent identification card INLAY layer, and the preparation method sequentially includes
Following steps:
Fig. 1 and Fig. 2 is please referred to, is shown as in the preparation method step 1 of Non-contact intelligent identification card INLAY layer of the invention
The status diagram of presentation.As shown, step 1 is first carried out, an IC module 11, an IC bearing bed 12 and one day are provided
Line bearing bed 13, in opening up the first punching 121 for filling the IC module 11 on the IC bearing bed 12, and in described
It is opened up on antenna bearing bed 13 for exposing outside the IC module 11 and second punching corresponding with first punching 121
131, and the IC module 11 is filled in first punching 121；In this present embodiment, the IC module 11 includes IC core
Piece 111, encapsulates the packaging body 112 of the IC chip 111, and is electrically connected 111 lead 114 of IC chip and from the envelope
Two pads 113 that dress 112 opposite sides of body each extends over out；First punching 121 be and 112 size phase of IC module packaging body
Same through-hole, so that wherein, the IC module 11 is via bonding or bonding process (such as glue bonding) the filling of IC module 11
It is filled in first punching 121.Second punching 131 is through-hole identical with the whole size of IC module 11.
Referring to Fig. 3, being shown as presenting in the preparation method step 2 of Non-contact intelligent identification card INLAY layer of the invention
Status diagram.As shown, then executing step 2, the antenna bearing bed 13 and the IC filled with IC module 11 are held
About 12 carrier layer, which is overlapped and bound, is formed as one blank；In the present embodiment, IC bearing bed 12 and 13 points of antenna bearing bed
It is welded and orders, and correspond the module protection hole on two layers, that is, by the antenna bearing bed 13 and filled with IC module 11
About 12 IC bearing bed folds merga pass spot-welding technology (such as utilizing Electric heating) and the two bookbinding is formed as one blank.
Since the second punching 131 of antenna bearing bed 13 is through-hole identical with the whole size of IC module 11, when antenna bearing bed 13 with
When about the 12 IC bearing bed filled with IC module 11 overlaps, IC module 11 is just exposed.In addition, containing upper layer is antenna
Bearing bed 13, lower layer are that the blank overall thickness that IC bearing bed 12 has two layers altogether is more than 0.3mm, so that it is unlikely to too thin, so may be used
To ensure that the efficiency of coiled antenna can be improved in the technique of subsequent coiled antenna.
Referring to Fig. 4, be shown as in the preparation method step 3 and 4 of Non-contact intelligent identification card INLAY layer of the invention be in
Existing status diagram.As shown, step 3 is then executed, in coiled antenna 14 on the blank, so that 14 shape of the antenna
At on the antenna bearing bed 13；In the present embodiment, the antenna 14 is wound on by the blank by a ultrasonic device
Antenna bearing bed 13 on.Specifically, second punching 131 is crossed in the beginning of the antenna through coiling and end respectively
Opposite sides, and it is corresponding with the pad 113 of 11 two sides of IC module respectively.The coiled antenna 14 on stapled blank,
Stapled materials at two layers to be put into coiled antenna 14 on special equipment (ultrasonic device), the Outside Dimensions of antenna 14, circle number,
Line spacing can be according to requiring to make, and the connection of antenna 14 and antenna bearing bed 13 is realized by ultrasonic wave.
Step 4 is finally executed, the antenna 14 that coiling is completed is electrically connected with the IC module 11, to form non-connect
INLAY layers of intelligent recognition card of touching.In this present embodiment, the antenna 14 completed coiling by resistance-welding process and the IC module
11 are electrically connected.IC module 11 and antenna 14 weld, and form electrical connection, IC module 11 and the connection that is electrically connected of antenna 14 are logical
Cross what the mode of electric resistance welding was realized, electric resistance welding is to form enameled wire leads and pad 113 reliably by the high-energy of moment
Connection, and then the starting end of antenna 14 is made to form reliable be electrically connected with end with two pads 113 of 11 two sides of IC module.
In actual generation technique, primary piece Zhang Zhonghui is laid with the unit that can much form non-contact intelligent identification card, thus,
It will will include very to one-to-one IC module 11 and antenna 14, thus, in the step of being finally electrically connected, it is to be ensured that every
A antenna 14 will be formed with corresponding IC module 11 and is electrically connected, i.e., guarantee IC module 11 carries all IC modules 11 on synusia
It to be formed and be electrically connected with corresponding antenna 14.
Fig. 5 to Fig. 7 is shown as in the preparation method another kind embodiment of Non-contact intelligent identification card INLAY layer of the invention
The status diagram of presentation.As shown, the present invention needs further to state, it is into one in another embodiment
Step ensures the thickness (i.e. blank overall thickness is more than 0.3mm) of blank, in piece thickness deficiency or it is relatively thin in the case where, can be with
In above-mentioned step 1, provide a leveling layer, it is corresponding, described in above-mentioned step 2 formed blank the step of be,
The leveling is placed under the IC bearing bed 12, by the antenna bearing bed 13, IC bearing bed 12 and levels up layer 15
It sequentially overlaps and binds up and down and be formed as one blank.I.e. by the antenna bearing bed 13, IC bearing bed 12 and leveling layer 15
Sequentially three is bound and is formed as one blank by folded merga pass spot-welding technology up and down.Then in step 3, on the blank
Coiled antenna 14, so that the antenna 14 is formed on the antenna bearing bed 13；That is, the coiled antenna on stapled blank
14, it is stapled trilaminate material to be put into coiled antenna 14 on special equipment (ultrasonic device), Outside Dimensions, the circle of antenna 14
Number, line spacing can be according to requiring to make, and the connection of antenna 14 and antenna bearing bed 13 is realized by ultrasonic wave, so can be with
Ensure to can be improved the efficiency of coiled antenna 14 in the technique of subsequent coiled antenna 14.
The present invention also provides a kind of non-contact intelligent identification cards prepared via above-mentioned preparation method referring to FIG. 1 to FIG. 4,
INLAY layers, comprising: IC module 11, IC bearing bed 12, antenna bearing bed 13 and antenna 14.
The IC module 11 includes IC chip 111, encapsulates the packaging body 112 of the IC chip 111, and be electrically connected institute
State 111 lead 114(of IC chip i.e. gold thread) and two pads 113 being each extended over out from 112 opposite sides of packaging body.
The IC bearing bed 12 offers the first punching 121 for filling the IC module 11；Specifically, described first
Punching 121 is through-hole identical with 112 size of IC module packaging body, so that IC module 11 is inserted wherein, the IC module 11
It is filled in first punching 121 via bonding or bonding process (such as glue bonding).
The antenna bearing bed 13 is superimposed on the IC bearing bed 12 and binds with it and is integrated, and offers for exposed
The IC module 11 and second punching 131 corresponding with first punching 121 out；Second punching 131 be and IC mould
The identical through-hole of the whole size of block 11.The antenna bearing bed 13 and filled with IC module 11 about 12 IC bearing bed overlapping simultaneously
The two bookbinding is formed as one blank by spot-welding technology (such as utilizing Electric heating).Due to the of antenna bearing bed 13
Two punchings 131 are through-hole identical with the whole size of IC module 11, when antenna bearing bed 13 and the IC filled with IC module 11 are held
When about 12 carrier layer overlaps, IC module 11 is just exposed.In addition, containing upper layer is antenna bearing bed 13, lower layer holds for IC
The blank overall thickness that carrier layer 12 has two layers altogether is more than 0.3mm, so that it is unlikely to too thin, so may insure in coiled antenna 14
The efficiency of coiled antenna 14 can be improved in technique.
The antenna 14 is wound on the antenna bearing bed 13, and second punching is crossed in beginning and end respectively
131 opposite sides, and electric connection corresponding with the pad 113 of 11 two sides of IC module respectively.In this present embodiment, institute
Stating antenna 14 will be wound on the antenna bearing bed 13 of the blank by a ultrasonic device, the antenna 14 through coiling
Beginning and end cross over the opposite sides of second punching 131, and the pad with 11 two sides of IC module respectively respectively
113 is corresponding.The coiled antenna 14 on stapled blank is stapled materials at two layers to be put into special equipment (ultrasound is set
It is standby) on coiled antenna 14, the Outside Dimensions of antenna 14, circle number, line spacing can be according to requiring to make.
Referring to Fig. 7, in another embodiment, to further ensure that (i.e. blank overall thickness is more than the thickness of blank
0.3mm), in the case that thickness is insufficient or relatively thin in piece, non-contact intelligent identification card of the invention can also include leveling up
Layer 15, is superimposed under the IC bearing bed 12, and being integrated with the antenna bearing bed 13 and the bookbinding of IC bearing bed 12 can be with
The blank of coiled antenna 14.
In conclusion Non-contact intelligent identification card INLAY layer and preparation method thereof of the invention, with existing technology
It compares, the initiative welding by materials at two layers or trilaminate material coiled antenna stapled together, IC module and antenna improves
The efficiency of coiled antenna；IC module layer and antenna stack are layered structures, because there is punching identical with IC module size on antenna stack
Hole makes IC module completely in hole, preferably protects IC module not destroyed by external force in this way, substantially increases INLAY layers of property
The reliability of energy.In addition, two layers or trilaminate material it is spot-welded together, can be directly complete in welding integrated primary property of sunkening cord
At reducing cumbersome process, substantially increase production efficiency！So the present invention effectively overcome it is in the prior art various
Disadvantage and have high industrial utilization value.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (9)
1. a kind of preparation method of Non-contact intelligent identification card INLAY layer, which is characterized in that the preparation method includes following step
It is rapid:
1) an IC module, an IC bearing bed and an antenna bearing bed are provided, opened up on the IC bearing bed for filling
State the first punching of IC module, and in being opened up on the antenna bearing bed for exposing outside the IC module and with described first
Corresponding second punching of punching, and the IC module is filled in first punching；
2) the antenna bearing bed and IC bearing bed filled with IC module are overlapped and is bound up and down and be formed as one blank；
3) in coiled antenna on the blank, so that the antenna is formed on the antenna bearing bed；
4) antenna that coiling is completed is electrically connected with the IC module, to form Non-contact intelligent identification card INLAY layer.
2. the preparation method of Non-contact intelligent identification card INLAY layer according to claim 1, it is characterised in that: in described
It further include providing one to level up layer in step 1)；It further include that the leveling is placed on the IC bearing bed in the step 2)
Under, by the antenna bearing bed, IC bearing bed and layer is leveled up, sequentially overlaps and bind and be formed as one blank up and down.
3. the preparation method of Non-contact intelligent identification card INLAY layer according to claim 2, it is characterised in that: in described
In step 2), by the antenna bearing bed, IC bearing bed and level up layer, sequentially up and down folded merga pass spot-welding technology by three
Bookbinding is formed as one blank.
4. the preparation method of Non-contact intelligent identification card INLAY layer according to claim 1, it is characterised in that: in described
In step 1), the IC module is filled in first punching via bonding or bonding process.
5. the preparation method of Non-contact intelligent identification card INLAY layer according to claim 1, it is characterised in that: in described
In step 2), the antenna bearing bed and the IC bearing bed filled with IC module are folded into merga pass spot-welding technology for the two up and down
Bookbinding is formed as one blank.
6. the preparation method of Non-contact intelligent identification card INLAY layer according to claim 1, it is characterised in that: in described
In step 3), the antenna is wound on the antenna bearing bed of the blank by a ultrasonic device.
7. the preparation method of Non-contact intelligent identification card INLAY layer according to claim 1, it is characterised in that: in described
In step 3), the opposite sides of second punching is crossed at the beginning and end of the antenna through coiling respectively, and respectively with
The pad of IC module two sides is corresponding.
8. the preparation method of Non-contact intelligent identification card INLAY layer according to claim 1, it is characterised in that: in described
In step 4), the antenna that coiling is completed is electrically connected with the IC module by resistance-welding process.
9. a kind of Non-contact intelligent identification card INLAY layer of preparation method preparation according to any one of claims 1 to 8,
It is characterised by comprising:
IC module, including IC chip, encapsulate the packaging body of the IC chip, and are electrically connected the IC chip lead and from institute
State two pads that packaging body opposite sides each extends over out；
IC bearing bed offers the first punching for filling the IC module；
Antenna bearing bed, is superimposed on the IC bearing bed and binds with it and be integrated, and offers for exposing outside the IC mould
Block and the second punching corresponding with first punching；
Antenna is wound on the antenna bearing bed, and the opposite sides of second punching is crossed in beginning and end respectively, and
Electric connection corresponding with the pad of IC module two sides respectively；
Further include leveling up layer, be superimposed under the IC bearing bed, and is integrated with the antenna bearing bed and the bookbinding of IC bearing bed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310648041.7A CN103729675B (en) | 2013-12-04 | 2013-12-04 | A kind of Non-contact intelligent identification card INLAY layer and preparation method thereof |
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| CN201310648041.7A CN103729675B (en) | 2013-12-04 | 2013-12-04 | A kind of Non-contact intelligent identification card INLAY layer and preparation method thereof |
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| CN103729675A CN103729675A (en) | 2014-04-16 |
| CN103729675B true CN103729675B (en) | 2018-12-28 |
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Families Citing this family (2)
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| FR3026529B1 (en) * | 2014-09-30 | 2017-12-29 | Linxens Holding | METHOD FOR MANUFACTURING CHIP CARD AND CHIP CARD OBTAINED THEREBY |
| CN106339749B (en) * | 2016-11-07 | 2023-06-30 | 东莞市锐祥智能卡科技有限公司 | Processing device and processing method for INLAY layer of smart card |
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| US6378774B1 (en) * | 1997-11-14 | 2002-04-30 | Toppan Printing Co., Ltd. | IC module and smart card |
| CN101944188A (en) * | 2009-07-08 | 2011-01-12 | 北京中安特科技有限公司 | Process for manufacturing non-contact IC card |
| CN101946254A (en) * | 2008-02-22 | 2011-01-12 | 凸版印刷株式会社 | Transponder and book form |
| CN102622639A (en) * | 2011-01-28 | 2012-08-01 | 北京中安特科技有限公司 | Production process of electronic passport element layer |
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2013
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6378774B1 (en) * | 1997-11-14 | 2002-04-30 | Toppan Printing Co., Ltd. | IC module and smart card |
| CN101946254A (en) * | 2008-02-22 | 2011-01-12 | 凸版印刷株式会社 | Transponder and book form |
| CN101944188A (en) * | 2009-07-08 | 2011-01-12 | 北京中安特科技有限公司 | Process for manufacturing non-contact IC card |
| CN102622639A (en) * | 2011-01-28 | 2012-08-01 | 北京中安特科技有限公司 | Production process of electronic passport element layer |
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| CN103729675A (en) | 2014-04-16 |
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