CN206774526U - Lead frame for four-way audio frequency power amplifier encapsulated circuit - Google Patents
Lead frame for four-way audio frequency power amplifier encapsulated circuit Download PDFInfo
- Publication number
- CN206774526U CN206774526U CN201720424705.5U CN201720424705U CN206774526U CN 206774526 U CN206774526 U CN 206774526U CN 201720424705 U CN201720424705 U CN 201720424705U CN 206774526 U CN206774526 U CN 206774526U
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- CN
- China
- Prior art keywords
- pin
- lead frame
- fin
- slide glass
- power amplifier
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a kind of lead frame for four-way audio frequency power amplifier encapsulated circuit, belong to field of semiconductor manufacture.The lead frame includes fin and n pin；Slide glass area is provided with the fin；The fin and the pin are located at Different Plane；Solve the problems, such as that the radiating efficiency of circuit encapsulating structure in correlation technique is not high；The effect for accelerating radiating rate is reached.
Description
Technical field
The utility model embodiment is related to field of semiconductor manufacture, and more particularly to a kind of four-way audio frequency power amplifier that is used for encapsulates
The lead frame of circuit.
Background technology
In ic manufacturing process, it is necessary to be assembled and encapsulated to chip after the completion of chip manufacturing；Assembling
When, chip is pasted on the lead frames, then with wire by the pressure point of chip surface and the lead frame for providing chip electric pathway
Pin interconnection get up, after the completion of assembling again by chip be enclosed in one protection shell in, complete integrated antenna package.
Greatly increase with lead frame densification, the power of integrated circuit as integrated level improves, correspondingly need to dissipate
The unit volume heat of hair is also more, but the rate of heat dissipation of existing circuit encapsulating structure is not high, and integrated circuit is easily damaged.
Utility model content
In order to solve problem of the prior art, the utility model embodiment provides a kind of four-way audio frequency power amplifier that is used for and sealed
Fill the lead frame of circuit.The technical scheme is as follows：
First aspect, there is provided a kind of lead frame for four-way audio frequency power amplifier encapsulated circuit, lead frame include
Fin and n pin；
Slide glass area is provided with the fin；
The fin and the pin are located at Different Plane.
Optionally, the n pin is divided into 1 interim pins and n-1 side pin；
The interim pins are connected with the slide glass area, and the end set of the interim pins has middle bonding region；
The side pin is located at the outside edges in the slide glass area, and the end set of the side pin has pin bonding
Area；
The side pin is connected with the interim pins by dowel.
Optionally, outermost pin is provided with a fixing hole, and since the outermost pin, every one
Pin, a fixing hole is provided with the pin.
Optionally, when the slide glass area is provided with chip, the chip pressure point of the chip passes through wire and the centre
The middle bonding region of pin and the pin bonding region of the side pin are bonded respectively.
Optionally, it is provided with positioning hole on the fin.
The beneficial effect brought of technical scheme that the utility model embodiment provides is：
This is used for the lead frame of four-way audio frequency power amplifier encapsulated circuit, including fin and pin, fin and pin
Positioned at Different Plane；Slide glass area is provided with fin；The radiating efficiency for solving circuit encapsulating structure in correlation technique is not high
The problem of；The effect for accelerating radiating rate is reached.
Pin and fin are in Different Plane, fin and slide glass area are arranged into an entirety, after ensureing plastic packaging
Electronic component there is enough heat sinking functions, reduce unnecessary spillage of material, it is cost-effective.
Brief description of the drawings
, below will be to needed for embodiment description in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
The accompanying drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some realities of the present utility model
Example is applied, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is a kind of lead frame for four-way audio frequency power amplifier encapsulated circuit according to an exemplary embodiment
Structural representation；
Fig. 2 is a kind of lead frame for four-way audio frequency power amplifier encapsulated circuit according to an exemplary embodiment
Side view before plastic packaging.
Embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Following description is related to
During accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represent same or analogous key element.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the utility model.On the contrary, they be only with such as
The example of the consistent apparatus and method of some aspects being described in detail in appended claims, of the present utility model.
Fig. 1 is a kind of lead frame for four-way audio frequency power amplifier encapsulated circuit according to an exemplary embodiment
Structural representation；Fig. 2 is a kind of drawing for four-way audio frequency power amplifier encapsulated circuit according to an exemplary embodiment crucial point
Side view of the wire frame before plastic packaging.
As shown in figure 1, the lead frame 2 for being used for four-way audio frequency power amplifier integrated circuit includes fin 3 and n pin
14；Fin 3 and pin 14 are located at Different Plane, and slide glass area 4 is provided with fin 3.
Optionally, fin is copper sheet.
Slide glass area 4 is used for the chip for carrying electronic component.Slide glass area can be provided with chip.Optionally, slide glass area is set
Type, the quantity for the chip put determine according to the function of the four-way audio frequency power amplifier integrated circuit of reality.
It should be noted that before being packaged using plastic-sealed body to lead frame, n pin is generally aligned in the same plane,
Fin and pin on lead frame are located at Different Plane, as shown in Figure 2；Plastic packaging is being carried out to lead frame using plastic-sealed body
Afterwards, pin is bended by group, two groups of pins are located at Different Plane, namely now fin, two groups of pins point after bending
Wei Yu not three planes.
Such as：Lead frame includes 15 pins, is used for four-way audio frequency power amplifier encapsulated circuit to this utilizing plastic-sealed body
Lead frame plastic packaging before, the 1-15 pin is generally aligned in the same plane, and the fin of the lead frame and 15 pins point
Wei Yu not two planes；Utilize seal body to this be used for four-way audio frequency power amplifier encapsulated circuit lead frame plastic packaging after, it is right
Pin is bended by group, and pin is divided into two groups, and first group of pin includes the 1st, 3,5,7,9,11,13,15 pin, and
One group of pin is located at the first plane, and second group of pin includes the 2nd, 4,6,8,10,12,14 pin, and second group of pin is located at
Second plane, now first group of pin, second group of pin and fin are located at three planes respectively.
In summary, the lead frame for four-way audio frequency power amplifier encapsulated circuit that the utility model embodiment provides,
Including fin and pin, fin and pin are located at Different Plane；Slide glass area is provided with fin；Solves correlation technique
The problem of radiating efficiency of middle circuit encapsulating structure is not high；The effect for accelerating radiating rate is reached.
Pin and fin are in Different Plane, fin and slide glass area are arranged into an entirety, after ensureing plastic packaging
Electronic component there is enough heat sinking functions, reduce unnecessary spillage of material, it is cost-effective.
In the alternative embodiment based on embodiment illustrated in fig. 1, n pin in lead frame is divided into 1 interim pins
With n-1 side pin；
Interim pins are located at the centre position of all pins, such as：The lead frame has 15 pins, then has 1 centre
Pin and 14 side pins, interim pins are the 8th pin, and side pin is respectively the 1st to 7 pin, and the 9th to 15
Pin.
As shown in figure 1, interim pins 6 are connected with slide glass area 4, the end set of interim pins 6 has middle bonding region 9；
Side pin 7 is located at the outside edges in slide glass area 4, and the end set of side pin 7 has pin bonding region 10；
Side pin 7 and interim pins 6 are connected by dowel 13.
Optionally, a fixing hole is equipped with set by outermost pin, and since outermost pin, every a pipe
Pin, a fixing hole is provided with pin.
As shown in figure 1, the lead frame there are 15 pins, from left side or right side, one is provided with the 1st pin admittedly
Determine hole 11, fixing hole is not provided with the 2nd pin, a fixing hole 11 ... ..., the 15th pipe are provided with the 3rd pin
A fixing hole 11 is provided with pin；That is, it is each provided with a fixing hole on the 1st, 3,5,7,9,11,13,15 pin.
The pin for being provided with fixing hole is side pin.
In addition, fixing hole plays firm effect, specifically, when using plastic-sealed body to lead frame plastic packaging, plastic-sealed body can be filled out
It is charged into fixing hole 11 so that the combination of lead frame and plastic-sealed body is more firm.
Fixing hole is also prevented from because side pin is long, the problem of deformation in punching and encapsulation, it also avoid
Because side pin is long deform upon cause side pin to be contacted with chip caused by short circuit the problem of, improve integrated antenna package
Yield rate.
In the alternative embodiment based on embodiment illustrated in fig. 1, when the slide glass area of lead frame is provided with chip, chip
Chip pressure point be bonded respectively with middle muscle bonding region and pin bonding region by some wires.
Optionally, slide glass area bonds a chip, or, slide glass area bonds two chips.
Optionally, wire is copper cash.
In the alternative embodiment based on embodiment illustrated in fig. 1, positioning hole is provided with fin.
As shown in figure 1, it is provided with positioning hole 5 on fin 3 on lead frame.
Positioning hole is used to make the product for being packaged with the lead frame for being used for four-way audio frequency power amplifier encapsulated circuit final
It is adjacent to during assembling with radiator, product is preferably radiated.
After being electroplated to pin, dowel 13 is cut off, then interim pins 6 and side pin 7 are bended, can
So that the electronic component after encapsulating is welded on corresponding object by interim pins 6 and side pin 7.
The embodiment provided shown in the utility model, is connected as one interim pins and fin by middle muscle, simultaneously
Interim pins are made to be in from fin in different planes, side pin is also at different planes from fin, and reduction need not
The spillage of material wanted, realize cost-effective effect.
It is that the product after guarantee plastic packaging has foot with integral copper sheet that the fin of exhausted large scale, which is arranged on slide glass area,
Enough heat sinking functions, and the bonding lead on pin and extraneous welding function are not influenceed.
Above-mentioned the utility model embodiment sequence number is for illustration only, does not represent the quality of embodiment.
Preferred embodiment of the present utility model is the foregoing is only, it is all in this practicality not to limit the utility model
Within new spirit and principle, any modification, equivalent substitution and improvements made etc., guarantor of the present utility model should be included in
Within the scope of shield.
Claims (5)
1. a kind of lead frame for four-way audio frequency power amplifier encapsulated circuit, it is characterised in that the lead frame includes dissipating
Backing and n pin；
Slide glass area is provided with the fin；
The fin and the pin are located at Different Plane.
2. lead frame according to claim 1, it is characterised in that the n pin is divided into 1 interim pins and n-1
Individual side pin；
The interim pins are connected with the slide glass area, and the end set of the interim pins has pin bonding region；
The side pin is located at the outside edges in the slide glass area, and the end set of the side pin has pin bonding region；
The side pin is connected with the interim pins by dowel.
3. lead frame according to claim 2, it is characterised in that outermost pin is provided with a fixing hole, and
Since the outermost pin, every being provided with a fixing hole on a pin, the pin.
4. lead frame according to claim 2, it is characterised in that when the slide glass area is provided with chip, the core
The chip pressure point of piece passes through wire and the middle muscle bonding region of the interim pins and the pin bonding region of the side pin
It is bonded respectively.
5. lead frame according to claim 1, it is characterised in that be provided with positioning hole on the fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720424705.5U CN206774526U (en) | 2017-04-21 | 2017-04-21 | Lead frame for four-way audio frequency power amplifier encapsulated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720424705.5U CN206774526U (en) | 2017-04-21 | 2017-04-21 | Lead frame for four-way audio frequency power amplifier encapsulated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206774526U true CN206774526U (en) | 2017-12-19 |
Family
ID=60635093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720424705.5U Expired - Fee Related CN206774526U (en) | 2017-04-21 | 2017-04-21 | Lead frame for four-way audio frequency power amplifier encapsulated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206774526U (en) |
-
2017
- 2017-04-21 CN CN201720424705.5U patent/CN206774526U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171219 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |