CN102915994A - Carrier band for ultrathin non-contact module, non-contact module and encapsulation method - Google Patents
Carrier band for ultrathin non-contact module, non-contact module and encapsulation method Download PDFInfo
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- CN102915994A CN102915994A CN2012103770593A CN201210377059A CN102915994A CN 102915994 A CN102915994 A CN 102915994A CN 2012103770593 A CN2012103770593 A CN 2012103770593A CN 201210377059 A CN201210377059 A CN 201210377059A CN 102915994 A CN102915994 A CN 102915994A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a carrier band for an ultrathin non-contact module, a non-contact module and an encapsulation method. Each carrier in the carrier band is 0.06mm-0.07mm in thickness and all the carriers are connected to form the carrier band in the thickness of 0.06mm-0.07mm. Non-contact chips in the non-contact module are arranged in chip bearing regions of the carriers, function bonding pads on the non-contact chips are connected with chip welding wire regions on the carriers through lead wires, the non-contact chips are encapsulated on the carriers through a molding body to form the ultrathin non-contact module in the thickness of 0.24mm-0.26mm. During encapsulation, the non-contact chips are mounted in the chip bearing regions of the carriers at first, and then the function bonding pads of the non-contact chips and corresponding pin bonding pads on the carriers for bearing are connected together and finally encapsulated through molding. The module formed by encapsulation can reach the total thickness of 0.26mm, is stable and reliable in performance, and not only reaches the general standard with a conventional non-contact module tag but also meets peculiar application requirements, such as passport e-tags, visa e-tags and the like.
Description
Technical field
The present invention relates to semiconductor microelectronics encapsulation technology field, particularly for the carrier band of contactless smart card module package, the module and the corresponding method for packing that utilize this carrier band encapsulation to form.
Background technology
Along with the continuous progress of integrated antenna package technology, the integrated level of integrated circuit improves day by day, and function is more and more abundanter.The user, requires integrated antenna package enterprise can design novel packing forms and cooperates new demand for the new application demand of continuous appearance day by day ultrathin, the microminiaturization of demand of product.
At present, the abrasive disc thickness of chip was 0.15mm when traditional non-contact modular was made, beam thickness is 0.075mm-0.085mm, its module gross thickness is 0.30mm-0.40mm, it can't satisfy special application needs, such as application such as passport electronic tag, visa electronic tags, traditional non-contact modular can not effectively be brought into play its effect, certainly will need to realize by new ultra-thin non-contact modular form.Therefore, the exploitation of ultra-thin non-contact modular is extremely urgent.
The applied field of present non-contact modular is confined in smart card and the common intelligent label, and can overcome the problem that thickness exceeds standard for ultra-thin non-contact modular, be applied in the environment various high requests, harsh, and all be blank at present in the world.
Summary of the invention
The gross thickness that the present invention is directed to existing non-contact modular is too high, can't satisfy the needs according to special applications such as electronic tag, visa electronic tags, and a kind of carrier band be used to encapsulating ultra-thin non-contact modular is provided.Can be packaged into the ultrathin module that satisfies the special applications demand based on this carrier band.
In order to achieve the above object, the present invention adopts following technical scheme:
A kind of ultra-thin non-contact modular carrier band, described carrier band is joined by some array of carriers and forms, be provided with chip bearing district and some chip bonding wires zone on each carrier, the thickness of described carrier is 0.06mm-0.07mm, and the formation thickness that joins thus is the carrier band of 0.06mm-0.07mm.
In the preferred embodiment of carrier band scheme, offer location hole between the body along whenever listing of its Width distribution on the described carrier band, the up and down both sides of carrier band arrange even apart from being provided with some location holes along its length direction simultaneously.
Further, some bonding wires zone is symmetrically distributed in two ends, chip bearing zone on the described carrier.
Further, the bonding wire zone at two ends, described chip bearing zone is continuous step-like structure.
Further, described chip bearing zone around be distributed with some encapsulation through holes.
Further, on the described through hole edge in nearly chip bearing district for etching partially structure.
Further, described is the platoon coil structure at carrier band.
As the second purpose of the present invention, the present invention also provides a kind of ultra-thin non-contact modular, described non-contact modular comprises the noncontact chip, is used for the carrier of carries chips and the moulding bodies that is used for encapsulation, wherein, carrier adopts above-mentioned carrier, described noncontact chip placing is in the chip bearing district of carrier, function pads on the noncontact chip is joined by the chip bonding wire zone on lead-in wire and the carrier, and it is the ultra-thin non-contact modular of 0.24mm-0.26mm that described moulding bodies forms thickness with the noncontact chip package at carrier.
In the preferred embodiment of ultra-thin non-contact modular scheme, the thickness of described noncontact chip is 0.05mm-0.07mm.
Further, described noncontact chip is placed in the chip bearing district of carrier by bonding agent.
Be electrically connected by ultra-sonic welded when further, described noncontact chip joins by lead-in wire and carrier.
Further, described moulding bodies adopts Shooting Technique to realize the encapsulation of noncontact chip and carrier.
Further, described moulding bodies is rectangular, and four angles are fillet, and thickness is 0.26mm, and package area is 72mm*75mm, and package area accounts for 55% of carrier surface area
As the 3rd purpose of the present invention, the present invention also provides a kind of method for packing of ultra-thin non-contact modular, and the method comprises the steps:
(1) the noncontact chip is installed in the chip bearing district of each carrier on the carrier band with automatic chip charging appliance (Die Bonder), bonds by binding agent between the chip bearing district of noncontact chip and carrier;
(2) will link together securely with the function pads of noncontact chip with for corresponding pin pad on the carrier of carrying by the ultrasonic wave mode with automatic bonding equipment (Wire Bonder);
(3) will weld good chip and carrier puts in the injection mold on the molded packages equipment and carries out molded packages, be injected into after by HTHP moulding compound being melted in the molded packages equipment in the molding cavity in the injection mold, noncontact chip, lead-in wire and carrier are encapsulated in the moulding bodies, Deng the encapsulation product of moulding compound cooling curing rear demoulding formation, and unnecessary moulding compound.
In the scheme of molded packages method, described binding agent adopts conductive silver glue or non-conductive elargol or chip attach film.
Further, the injection mold of molded packages process using comprises upper die and lower die in the described step (3), the smooth smooth carrier band of finishing chip and respective carrier welding for placement of described counterdie; Described patrix and counterdie cooperate and form the corresponding molding cavity of chip to be packaged on some and the carrier band, offer some injection moulding windows in the patrix simultaneously, and each injection moulding window is corresponding to each molding cavity.
Further, when described step (3) was carried out molded packages, the moulding compound filler particles of employing was of a size of 1um-53um.
Further, when described step (3) was carried out injection molding packaging, the temperature of moulding compound was that 175 ℃ of-185 ℃ of injection pressures are 35kg/cm
2-45kg/cm
2, the solidifying pressure during the moulding compound cooling curing is 60kg/cm
2-70kg/cm
2, be 35s-45s curing time.
Can encapsulate the ultra-thin non-contact modular of formation according to scheme provided by the invention, this module can overcome the problem that thickness exceeds standard, and can be applied in the environment various high requests, harsh.Efficiently solve because the module general thickness is excessively thin, key technology reaches the problem that method reaches in the actual production.
Simultaneously, it is stable and reliable for performance for non-contact modular provided by the invention, and can reach 0.26mm on general thickness, can either reach the universal standard with existing non-contact modular label, can satisfy again special application needs, such as application such as passport electronic tag, visa electronic tags.
Description of drawings
Further specify the present invention below in conjunction with the drawings and specific embodiments.
Fig. 1 is the structural representation of carrier band among the present invention;
Fig. 2 is the structural representation of single carrier among the present invention;
Fig. 3 is that Fig. 2 is at the cutaway view of B-B direction;
Fig. 4 is the structural representation of non-contact modular among the present invention;
Fig. 5 is that Fig. 4 is at the cutaway view of A-A direction;
Fig. 6 is the flow chart of module package among the present invention.
Embodiment
For technological means, creation characteristic that the present invention is realized, reach purpose and effect is easy to understand, below in conjunction with concrete diagram, further set forth the present invention.
Referring to Fig. 1, ultra-thin non-contact modular provided by the invention adopts the mode of array to join by some carriers 101 and forms with carrier band 100, this carrier band 100.
Whole carrier band 100 is the platoon web-like, is convenient to so follow-up processed and applied, speed that can the Effective Raise module package.As shown in Figure 1, carrier band 100 among the present invention is along being divided into from top to bottom three rows on its bearing of trend, corresponding carrier 101 is equally spaced among every row, spacing between every row equates simultaneously, the carrier band that forms thus can be protected corresponding operating in follow-up paster and packaging process precision, reduce error, the cost rate of Effective Raise product.
Further, required trepanning and location hole 102 when the present invention offers each procedure and makes along whenever listing of distributing of its Width on carrier band 100 between the body, it is of a size of 1.42mm*1.42mm according to the needs of equipment.
Simultaneously the up and down both sides of carrier band are even apart from being provided with some position correct direction identifying holes 103 whether when putting into for the identification carrier band along its length direction, if position or poor direction were true when carrier band was put into, when equipment recognizes these positions, hole automatically, will report to the police.
Figure 2 shows that the carrier 101 that forms carrier band 100 agent structures, carrier 101 is used for carrying corresponding chip, and it mainly comprises chip bearing district 101a and some chip bonding wires zone 101b.Chip bearing district 101a is used for carrying corresponding chip, and chip bonding wire zone 101b is used for joining with the function pads that is placed in chip in the chip bearing district 101a, and the realization carrier is associated with chip.
For the ease of the installation of chip, chip bearing district 101a is positioned at the centre position of carrier 101, and some chip bonding wires zones 101b be distributed in chip bearing district 101a around, make function pads on the chip chip bonding wire zone on can both corresponding carrier.
The thickness of carrier 101 is 0.06mm-0.07mm in the present invention, and the formation thickness that joins thus is that its function of carrier band of 0.06mm-0.07mm is moulding compound and carrier band more effectively can be combined.
For further improving the performance of carrier band, some bonding wires zone 101b is symmetrically distributed in the two ends of chip bearing zone 101a among the present invention, and the bonding wire zone at 101a two ends, chip bearing zone is continuous step-like structure (as shown in Figure 3), moulding compound and carrier more effectively can be combined by this continuous step-like structure, the carrier that forms thus can guarantee the stability of the module that follow-up encapsulation forms.
Further, be distributed with some encapsulation through hole 101c around the chip bearing zone, and closely the edge in chip bearing district is for etching partially structure on these through holes, further raising encapsulates the stability that forms module thus.
The carrier band 100 that is formed by above-mentioned carrier 101 in practice, its material can adopt copper metal or copper alloy, and adopts electrosilvering technique to make.
Based on above-mentioned carrier band 100, the present invention improves a kind of non-contact modular 200 that utilizes above-mentioned carrier band encapsulation to form.Shown in Figure 4 and 5, the carrier 202(that this module 200 comprises noncontact chip 201, be used for carries chips is carrier 101 described above) and the moulding bodies 203 that is used for encapsulation.
As shown in Figure 5, noncontact chip 201 is used for the processing of information data, and it is placed on the chip bearing district of carrier 202 202a, the function pads on the simultaneously noncontact chip 201 by go between 204 with carrier 202 on chip bonding wire zone 202b join.Adopt in the present invention spun gold as the pad on the lead-in wire realization carrier band and the bonding of chip bonding pad.
For guaranteeing that encapsulation forms the ultrathin type of module, the thickness of this noncontact chip is 0.05mm-0.07mm.
For the reliability that guarantees to join between noncontact chip 201 and the carrier 202, noncontact chip 201 is placed on the chip bearing district 202a of carrier 202 by bonding agent 205 among the present invention.Be electrically connected by ultra-sonic welded when simultaneously, noncontact chip 201 joins by lead-in wire and carrier.
When encapsulation forms module, can adopt Shooting Technique to realize the encapsulation of noncontact chip and carrier.
For guaranteeing the ultra-thin property of module 200, moulding bodies 203 among the present invention is rectangular, four angles are fillet, thickness is 0.26mm, and package area is 72mm*75mm, and package area accounts for 55% of carrier surface area, moulding bodies 203 thickness that forms by this structure is its stable performance of ultra-thin non-contact modular of 0.24mm-0.26mm, reliably, effectively solve existing non-contact modular under the stable and reliable prerequisite of guaranteed performance, can't realize the problem of non-contact modular thickness ultrathin.For above-mentioned ultra-thin non-contact modular, the present invention also provides corresponding method for packing, and as shown in Figure 6, this method for packing mainly comprises the steps:
(1) the noncontact chip is installed in the chip bearing district of each carrier on the carrier band with automatic chip charging appliance (Die Bonder), confirm corresponding silver paste points glue position in the chip bearing district now when mounted, corresponding elargol on this silver paste points glue location point is installed to chip to be installed in the corresponding chip bearing district with certain pressure again.By the automatic chip charging appliance concrete silver paste points glue position and silver paste points glue amount are set during concrete operations, concrete chip installation site are set afterwards again, are placed on the dynamics on the elargol, namely can be mass behind the save routine after setting is finished.In this step, elargol is as binding agent between the chip bearing district of noncontact chip and carrier, and it can adopt conductive silver glue or non-conductive elargol.
In the operating process of reality, also can adopt the chip attach film to replace elargol, in order to guarantee the ultra-thin property of module, can adopt thickness is the chip attach film of 10um-20um.
(2) will link together securely with the function pads of noncontact chip with for corresponding pin pad on the carrier of carrying by the ultrasonic wave mode with automatic bonding equipment (Wire Bonder).
When utilizing the ultrasonic wave mode to weld in this step, at first on the function pads on the chip, grow salient point by the ultrasonic wave mode, namely adopt the ultrasonic wave in the automatic bonding equipment to form the gold thread thawing spherical, again this gold goal is installed in combination electrical with it on the chip bonding pad, the salient point of again the pin pad of carrier band being connected with chip on the function pads directly connects by ultrasonic wave, concrete operation step is as follows, adopt the ultrasonic wave in the automatic bonding equipment to form the gold thread thawing spherical, again this gold goal is installed in combination electrical with it on the pad of respective carrier, and this moment, gold thread and gold goal did not disconnect, gold thread is pulled to gold goal place on the chip bonding pad just now, by ultrasonic wave gold thread and gold goal on the chip bonding pad are electrically connected mutually again, have so just finished the operation that the function pads of chip and respective pad on the carrier are electrically connected mutually.
(3) will weld in the molding cavity that good chip and carrier put into the injection mold in the molded packages equipment and carry out molded packages, in the molded packages equipment moulding compound is heated, make its fusing, and continue heating and make its temperature reach 175 ℃-185 ℃ and pressure to reach 35kg/cm
2-45kg/cm
2, the moulding compound that reaches again after the condition HTHP is injected in the molding cavity, and noncontact chip, lead-in wire and carrier are encapsulated in the moulding bodies; After injection moulding is finished, be cured, the manipulator in the equipment grabs the carrier band of injection formed to consolidation zone, and utilize briquetting the packaging area of each carrier on the carrier band to be carried out pressing, solidifying pressure 60kg/cm this moment
2-70kg/cm
2, and lasting curing time 35s-45s, the encapsulation product that wait moulding compound cooling curing rear demoulding to form, and unnecessary moulding compound.
The injection mold of molded packages process using is corresponding with corresponding product in this step, is alloy sheets, and the temperature influence distortion is less, is divided into upper die and lower die; Counterdie smooth smooth be mainly used in placing beaten the carrier band that gold thread is treated injection moulding; Patrix and counterdie cooperate and form the corresponding mold cavity of chip to be packaged on some and the carrier band, offer some injection moulding windows in the patrix simultaneously, and each injection moulding window is corresponding to each molding cavity.
In order to guarantee that injection moulding forms the thickness ultrathin of module, and guarantee the stable and reliable of chip performance, the patrix dimensional thickness is 177um-203um, and the package area of patrix is 72mm*75mm simultaneously.
Thus when injection molding packaging, the carrier band of having beaten gold thread is put on the counterdie, after the patrix counterdie tight closure, the moulding compound particle in equipment, melt and reach relevant temperature and pressure after be injected in the corresponding molding cavity by the injection moulding window on the patrix, the module in it is wrapped up.
In order to reach better effects, the moulding compound filler particles that the present invention adopts is of a size of 1um-53um.
Encapsulate thus the module that forms, can reach 0.26mm on the general thickness, and it is stable and reliable for performance, can either reaches the universal standard with existing non-contact modular label, can satisfy again special application needs, such as application such as passport electronic tag, visa electronic tags.
More than show and described basic principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; that describes in above-described embodiment and the specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (18)
1. ultra-thin non-contact modular carrier band, described carrier band is joined by some array of carriers and forms, be provided with chip bearing district and some chip bonding wires zone on each carrier, it is characterized in that, the thickness of described carrier is 0.06mm-0.07mm, and the formation thickness that joins thus is the carrier band of 0.06mm-0.07mm.
2. a kind of ultra-thin non-contact modular carrier band according to claim 1, it is characterized in that, offer location hole between the body along whenever listing of its Width distribution on the described carrier band, the up and down both sides of carrier band arrange even apart from being provided with some location holes along its length direction simultaneously.
3. a kind of ultra-thin non-contact modular carrier band according to claim 1 is characterized in that, some bonding wires zone is symmetrically distributed in two ends, chip bearing zone on the described carrier.
4. a kind of ultra-thin non-contact modular carrier band according to claim 3 is characterized in that, the bonding wire zone at two ends, described chip bearing zone is continuous step-like structure.
5. a kind of ultra-thin non-contact modular carrier band according to claim 1 is characterized in that, is distributed with some encapsulation through holes around the described chip bearing zone.
6. a kind of ultra-thin non-contact modular carrier band according to claim 5 is characterized in that, the edge in nearly chip bearing district is for etching partially structure on the described through hole.
7. a kind of ultra-thin non-contact modular carrier band according to claim 1 is characterized in that, described is the platoon coil structure at carrier band.
8. ultra-thin non-contact modular, described non-contact modular comprises the noncontact chip, is used for the carrier of carries chips and the moulding bodies that is used for encapsulation, it is characterized in that, described carrier adopts each described carrier in the claim 1 to 6, described noncontact chip placing is in the chip bearing district of carrier, function pads on the noncontact chip is joined by the chip bonding wire zone on lead-in wire and the carrier, and it is the ultra-thin non-contact modular of 0.24mm-0.26mm that described moulding bodies forms thickness with the noncontact chip package at carrier.
9. a kind of ultra-thin non-contact modular according to claim 8 is characterized in that, the thickness of described noncontact chip is 0.05mm-0.07mm.
10. a kind of ultra-thin non-contact modular according to claim 8 is characterized in that, described noncontact chip is placed in the chip bearing district of carrier by bonding agent.
11. a kind of ultra-thin non-contact modular according to claim 8 is characterized in that, is electrically connected by ultra-sonic welded when described noncontact chip joins by lead-in wire and carrier.
12. a kind of ultra-thin non-contact modular according to claim 8 is characterized in that, described moulding bodies adopts Shooting Technique to realize the encapsulation of noncontact chip and carrier.
13. a kind of ultra-thin non-contact modular according to claim 8 is characterized in that described moulding bodies is rectangular, four angles are fillet, and thickness is 0.26mm, and package area is 72mm*75mm, and package area accounts for 55% of carrier surface area.
14. the method for packing of a ultra-thin non-contact modular is characterized in that, described method comprises the steps:
(1) the noncontact chip is installed in the chip bearing district of each carrier on the carrier band with automatic chip charging appliance (Die Bonder), bonds by binding agent between the chip bearing district of noncontact chip and carrier;
(2) will link together securely with the function pads of noncontact chip with for corresponding pin pad on the carrier of carrying by the ultrasonic wave mode with automatic bonding equipment (Wire Bonder);
(3) will weld good chip and carrier puts in the injection mold on the molded packages equipment and carries out molded packages, be injected into after by HTHP moulding compound being melted in the molded packages equipment in the molding cavity in the injection mold, noncontact chip, lead-in wire and carrier are encapsulated in the moulding bodies, Deng the encapsulation product of moulding compound cooling curing rear demoulding formation, and unnecessary moulding compound.
15. the method for packing of a kind of ultra-thin non-contact modular according to claim 14 is characterized in that, described binding agent adopts conductive silver glue or non-conductive elargol or chip attach film.
16. the method for packing of a kind of ultra-thin non-contact modular according to claim 14, it is characterized in that, the injection mold of molded packages process using comprises upper die and lower die in the described step (3), the smooth smooth carrier band of finishing chip and respective carrier welding for placement of described counterdie; Described patrix and counterdie cooperate and form the corresponding molding cavity of chip to be packaged on some and the carrier band, offer some injection moulding windows in the patrix simultaneously, and each injection moulding window is corresponding to each molding cavity.
17. the method for packing of a kind of ultra-thin non-contact modular according to claim 14 is characterized in that, when described step (3) was carried out molded packages, the moulding compound filler particles of employing was of a size of 1um-53um.
18. the method for packing of a kind of ultra-thin non-contact modular according to claim 14 is characterized in that, when described step (3) was carried out injection molding packaging, the temperature of moulding compound was that 175 ℃ of-185 ℃ of injection pressures are 35kg/cm
2-45kg/cm
2, the solidifying pressure during the moulding compound cooling curing is 60kg/cm
2-70kg/cm
2, be 35s-45s curing time.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103770593A CN102915994A (en) | 2012-09-28 | 2012-09-28 | Carrier band for ultrathin non-contact module, non-contact module and encapsulation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103770593A CN102915994A (en) | 2012-09-28 | 2012-09-28 | Carrier band for ultrathin non-contact module, non-contact module and encapsulation method |
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| CN102915994A true CN102915994A (en) | 2013-02-06 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016107298A1 (en) * | 2014-12-30 | 2016-07-07 | 上海仪电智能电子有限公司 | Molding packaged mini mobile phone intelligent card, and packing method |
| CN109074507A (en) * | 2016-04-11 | 2018-12-21 | 株式会社村田制作所 | The manufacturing method of carrier band and its manufacturing method and RFID tag |
| CN113241314A (en) * | 2021-05-08 | 2021-08-10 | 中电智能卡有限责任公司 | Production and processing system and production and processing method of ultrathin non-contact smart card module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201725972U (en) * | 2010-04-22 | 2011-01-26 | 中国人民解放军总后勤部军需装备研究所 | Portable computer module fastener with connecting cable fixing function |
| CN102013419A (en) * | 2009-09-08 | 2011-04-13 | 上海长丰智能卡有限公司 | Carrier band for packaging minitype radio-frequency module |
| CN102074534A (en) * | 2009-11-24 | 2011-05-25 | 上海长丰智能卡有限公司 | Micro PCB radio frequency module and packaging method thereof |
| CN102013418B (en) * | 2009-09-08 | 2012-09-05 | 上海长丰智能卡有限公司 | Novel PCB (Printed Circuit Board) carrier tape for SIM card package |
| CN102693954A (en) * | 2012-06-06 | 2012-09-26 | 上海长丰智能卡有限公司 | Carrier tape for ultra-thin non-contact module |
| CN202855731U (en) * | 2012-09-28 | 2013-04-03 | 上海长丰智能卡有限公司 | Carrier tape for ultrathin non-contact module and non-contact module |
-
2012
- 2012-09-28 CN CN2012103770593A patent/CN102915994A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102013419A (en) * | 2009-09-08 | 2011-04-13 | 上海长丰智能卡有限公司 | Carrier band for packaging minitype radio-frequency module |
| CN102013418B (en) * | 2009-09-08 | 2012-09-05 | 上海长丰智能卡有限公司 | Novel PCB (Printed Circuit Board) carrier tape for SIM card package |
| CN102074534A (en) * | 2009-11-24 | 2011-05-25 | 上海长丰智能卡有限公司 | Micro PCB radio frequency module and packaging method thereof |
| CN201725972U (en) * | 2010-04-22 | 2011-01-26 | 中国人民解放军总后勤部军需装备研究所 | Portable computer module fastener with connecting cable fixing function |
| CN102693954A (en) * | 2012-06-06 | 2012-09-26 | 上海长丰智能卡有限公司 | Carrier tape for ultra-thin non-contact module |
| CN202855731U (en) * | 2012-09-28 | 2013-04-03 | 上海长丰智能卡有限公司 | Carrier tape for ultrathin non-contact module and non-contact module |
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