CN210295169U - Smart card with fingerprint identification function - Google Patents
Smart card with fingerprint identification function Download PDFInfo
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- CN210295169U CN210295169U CN201921545175.5U CN201921545175U CN210295169U CN 210295169 U CN210295169 U CN 210295169U CN 201921545175 U CN201921545175 U CN 201921545175U CN 210295169 U CN210295169 U CN 210295169U
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Abstract
The utility model relates to a bank card technical field specifically is an intelligent card with fingerprint identification function, including fingerprint identification module, contact chip and surface course, Inlay layer and bottom, contact chip and fingerprint identification module all locate in the surface course, Inlay layer is including circuit substrate and last sealing layer, intermediate level, hollow frame layer and lower sealing layer, and circuit substrate is connected through first contact subassembly and first conductive adhesive linkage with fingerprint identification module, and circuit substrate and contact chip are connected through second contact subassembly and the conductive adhesive linkage of second within a definite time. The introduction of the two sets of contact blade assemblies can reduce the height difference between the connecting contact and the card surface on the circuit substrate, and the fingerprint identification module and the contact chip are bonded with the contact blade assemblies by means of conductive adhesive, so that the mounting precision and the firmness can be ensured. The smart card replaces the traditional soldering process with the surface mounting and bonding process in the manufacturing process, so that the manufacturing difficulty is reduced, and the packaging quality is stable and controllable.
Description
Technical Field
The utility model relates to a bank card technical field specifically is a smart card with fingerprint identification function.
Background
At present, the domestic bank system has basically completed the upgrade and update of the bank card from the magnetic stripe card to the smart card, the smart card is usually a contact type IC card, and the smart card is still the mainstream technology in the domestic related fields for a long time in the future due to mature technology, higher safety and convenient application and popularization. But in fact, any security technology has the possibility of being broken through, and now some lawless persons have succeeded in breaking the related technical barriers and realizing the imitation of the smart cards and the stealing of payment passwords. The introduction of the fingerprint identification function is a feasible means for improving the safety of the card at the present stage, and the specific method is to introduce a fingerprint identification module on the surface of the card and connect the fingerprint identification module into an internal circuit of the card, wherein the area of the fingerprint identification module is usually larger than that of the contact chip.
Because the components and parts on the surface of the card have certain height difference with the circuit board inside the card, the components and parts are connected with a plurality of corresponding contacts on the circuit board in a brazing mode. The shape and thickness of the brazing filler metal at a plurality of welding points are strictly controlled to ensure the packaging quality of the card, and the operation difficulty is high. The area that every solder joint department brazing filler metal can cover is limited to the side surface is the arc of evagination under the effect of surface tension when brazing filler metal melts, and two terminal surface actual area as the contact surface after solidifying still need a bit less. Therefore, the reliability of the connection between the circuit board and the fingerprint identification module with a large area is difficult to ensure through a conventional soldering mode, and the packaging quality of the card is also difficult to ensure.
Disclosure of Invention
The utility model aims to provide a stable controllable smart card that has a fingerprint identification function of packaging quality.
In order to achieve the above object, the utility model provides a smart card with fingerprint identification function, including fingerprint identification module, contact chip and from top to bottom surface course, Inlay layer and the bottom stacked gradually, contact chip and fingerprint identification module all locate in the surface course. The Inlay layer comprises a circuit substrate, an upper sealing layer, a middle layer, a hollow frame layer and a lower sealing layer which are sequentially stacked from top to bottom, the hollow frame layer and the circuit substrate are equal in thickness, a substrate hole matched with the circuit substrate is formed in the middle of the hollow frame layer, and the circuit substrate is located in the substrate hole.
The circuit substrate is provided with a first contact piece assembly and a second contact piece assembly which are as thick as the middle layer on the upper surface, the middle layer is provided with a first accommodating through hole matched with the first contact piece assembly and a second accommodating through hole matched with the second contact piece assembly, the upper sealing layer is provided with a first avoiding hole in a region corresponding to the first contact piece assembly and a second avoiding hole in a region corresponding to the second contact piece assembly, the surface layer is provided with a first through hole communicated with the first avoiding hole, the surface layer is further provided with a second through hole communicated with the second avoiding hole, the fingerprint identification module is located in the first through hole, and the contact chip is located in the second through hole. The first downthehole first conductive adhesive linkage that dodges that is equipped with, first conductive adhesive linkage upper surface and fingerprint identification module laminating, first conductive adhesive linkage lower surface and the laminating of first contact subassembly, the downthehole second conductive adhesive linkage that dodges is dodged to the second, the laminating of second conductive adhesive linkage upper surface and contact chip, the laminating of second conductive adhesive linkage lower surface and second contact subassembly.
According to the scheme, the two groups of contact plate assemblies are made of metal sheets, are fixed in shape and thickness and convenient to process, and are more stable and controllable than brazing filler metal. The two groups of contact blade components can be arranged on the circuit substrate by adopting a conventional surface mounting process, and the installation is more convenient. The introduction of the two sets of contact blade assemblies can reduce the height difference between the connecting contact and the card surface on the circuit substrate, and the fingerprint identification module and the contact chip are bonded with the contact blade assemblies by means of conductive adhesive, so that the mounting precision and the firmness can be ensured. The smart card replaces the traditional soldering process with the surface mounting and bonding process in the manufacturing process, so that the manufacturing difficulty is reduced, and the packaging quality is stable and controllable.
The circuit substrate is provided with a first contact piece assembly, a second contact piece assembly, a third accommodating through hole and a third accommodating through hole, wherein the first contact piece assembly is arranged on the circuit substrate, and the second contact piece assembly is arranged on the circuit substrate.
It can be seen from above that, set up electronic components on circuit substrate with the same one side of two sets of contact pieces help reducing the whole thickness of card, set the thickness of two sets of contact piece subassemblies to the thickness equal with electronic components and can guarantee the reliable encapsulation on Inlay layer.
Further, the first contact piece assembly and the second contact piece assembly are respectively arranged at two ends of the upper surface of the circuit substrate, and the electronic component is arranged between the first contact piece assembly and the second contact piece assembly.
It is from top to bottom visible, set up circuit substrate's both ends with two sets of contact subassemblies and be convenient for carry out fingerprint identification operation behind the plug-in card, set up electronic components and part between two sets of contact subassemblies then the circuit layout of card is more reasonable.
The further scheme is that the first conductive adhesive layer and the second conductive adhesive layer are both made of conductive double-sided adhesive tape.
Therefore, the conductive double-sided adhesive has uniform thickness, is easy to die-cut and process, does not need to be cured after glue application, has stable and reliable bonding performance and conductive performance of two conductive bonding layers formed by the conductive double-sided adhesive, and has simpler related bonding process.
Drawings
Fig. 1 is a structural diagram of an embodiment of the smart card with fingerprint recognition function of the present invention.
Fig. 2 is an exploded view of the smart card with fingerprint recognition function according to the present invention.
The present invention will be further explained with reference to the drawings and examples.
Detailed Description
Referring to fig. 1 and fig. 2, the utility model provides a smart card with fingerprint identification function includes fingerprint identification module 1, contact chip 2 and from top to bottom stacks gradually surface course 3, Inlay layer 4 and bottom 5, and contact chip 1 and fingerprint identification module 2 all locate in surface course 3. The Inlay layer 4 comprises a circuit substrate 41, and an upper sealing layer 42, an intermediate layer 43, a hollow frame layer 44 and a lower sealing layer 45 which are sequentially stacked from top to bottom, wherein the hollow frame layer 44 and the circuit substrate 41 have the same thickness, a substrate hole 441 matched with the circuit substrate 41 is arranged in the middle of the hollow frame layer 44, and the circuit substrate 41 is located in the substrate hole 441.
The circuit substrate 41 is provided with a first contact piece assembly 411 and a second contact piece assembly 412 which are as thick as the middle layer 43 on the upper surface, the middle layer 43 is provided with a first accommodating through hole 431 matched with the first contact piece assembly 411 and a second accommodating through hole 432 matched with the second contact piece assembly 412, the upper sealing layer 42 is provided with a first avoiding hole 421 in a region corresponding to the first contact piece assembly 411 and a second avoiding hole 422 in a region corresponding to the second contact piece assembly 412, the surface layer 3 is provided with a first through hole 31 communicated with the first avoiding hole 421, the surface layer 3 is further provided with a second through hole 32 communicated with the second avoiding hole 422, the fingerprint identification module 1 is positioned in the first through hole 31, and the contact chip 2 is positioned in the second through hole 32. Be equipped with first conductive adhesive linkage 423 in the first hole 421 of dodging, first conductive adhesive linkage 423 upper surface and the laminating of fingerprint identification module 1, first conductive adhesive linkage 423 lower surface and the laminating of first contact subassembly 411, the second dodge and be equipped with the conductive adhesive linkage 424 of second in the hole 422, the conductive adhesive linkage 424 upper surface of second and the laminating of contact chip 2, the conductive adhesive linkage 424 lower surface of second and the laminating of second contact subassembly 412.
The first contact piece assembly 411 and the second contact piece assembly 412 are both made of metal sheets, and are fixed in shape and thickness, convenient to process and more stable and controllable than brazing filler metal. The two sets of contact assemblies can be arranged on the circuit substrate 41 by adopting a conventional surface mounting process, and the installation is convenient. The height difference between the connecting contact and the card surface on the circuit substrate 41 can be reduced by introducing two sets of contact blade assemblies, and the fingerprint identification module 1 and the contact chip 2 are bonded with the contact blade assemblies by conductive adhesive, so that the mounting precision and firmness can be ensured. The intelligent card replaces the traditional brazing process with the surface mounting and bonding process in the manufacturing process, so that the manufacturing difficulty is reduced, and the assembling quality is stable and controllable.
In this embodiment, the first contact piece assembly 411 is a set of metal pieces with equal thickness, the specific shape is set according to the shape of the connection contact on the fingerprint identification module 1, the thickness of the metal piece in the second contact piece assembly 412 is the same as the thickness of the first contact piece assembly 411, and the specific shape is set according to the shape of the connection contact on the contact chip 2. In the present embodiment, both the top sheet 3 and the bottom sheet 5 may be a composite layer composed of a coating film and a printing sheet.
The core circuit of card is packed to Inlay layer 4 internal packaging, belongs to the relatively independent packaging structure in the card, and inner structure is comparatively compact, can make alone as a whole. The Inlay layer 4 can ensure the packaging quality and the packaging precision of the circuit substrate 41 and the two sets of contact assemblies through the external upper sealing layer 42, the middle layer 43, the hollow frame layer 44 and the lower sealing layer 45. The first through hole 31 and the first avoiding hole 421, and the second through hole 32 and the second avoiding hole 422 are milled together on the surface of the pressed and molded card blank.
The circuit substrate 41 is further provided with an electronic component 413 on the upper surface, the thickness of the electronic component 413 is equal to that of the first contact assembly 411, and the middle layer 43 is provided with a third accommodating through hole 433 matched with the electronic component 413.
Arranging the electronic component 413 on the same side of the circuit substrate 41 as the two sets of contacts helps to reduce the overall thickness of the card, and arranging the thickness of the two sets of contact assemblies equal to the thickness of the electronic component 413 ensures reliable packaging of the Inlay layer 4.
The first contact assembly 411 and the second contact assembly 412 are located at both ends of the upper surface of the circuit substrate 41, and the electronic component 413 is located between the first contact assembly 411 and the second contact assembly 412.
The arrangement of the two sets of contact assemblies at the two ends of the circuit board 41 facilitates fingerprint recognition operations after insertion of the card, and the arrangement of the electronic component 413 between the two sets of contact assemblies makes the circuit layout of the card more reasonable.
The first conductive bonding layer 423 and the second conductive bonding layer 424 are both made of conductive double-sided adhesive, the conductive double-sided adhesive is uniform in thickness and easy to die-cut and process, curing is not needed after glue application, the bonding performance and the conductivity of the two conductive bonding layers formed by the conductive double-sided adhesive are stable and reliable, and the related bonding process is simple.
Claims (4)
1. The utility model provides a smart card with fingerprint identification function, includes fingerprint identification module, contact chip and from top to bottom stacks gradually surface course, Inlay layer and bottom, contact chip with fingerprint identification module all locates in the surface course, Inlay layer includes circuit substrate and from top to bottom stacks gradually last seal coat, intermediate level, hollow frame layer and lower seal coat, the hollow frame layer with circuit substrate is uniform thick, hollow frame layer middle part be equipped with circuit substrate complex base plate hole, circuit substrate is located in the base plate hole, its characterized in that:
the circuit substrate is provided with a first contact piece assembly and a second contact piece assembly which are as thick as the middle layer on the upper surface, the middle layer is provided with a first containing through hole matched with the first contact piece assembly and a second containing through hole matched with the second contact piece assembly, the upper sealing layer is provided with a first avoiding hole in a region corresponding to the first contact piece assembly and a second avoiding hole in a region corresponding to the second contact piece assembly, the surface layer is provided with a first through hole communicated with the first avoiding hole and a second through hole communicated with the second avoiding hole, the fingerprint identification module is positioned in the first through hole, the contact chip is positioned in the second through hole, a first conductive bonding layer is arranged in the first avoiding hole, the upper surface of the first conductive bonding layer is attached to the fingerprint identification module, the first conductive bonding layer lower surface with the laminating of first contact subassembly, the downthehole second conductive bonding layer that is equipped with is dodged to the second, the second conductive bonding layer upper surface with the laminating of contact chip, the second conductive bonding layer lower surface with the laminating of second contact subassembly.
2. The smart card with fingerprint recognition function of claim 1, wherein:
the circuit substrate is characterized in that an electronic component is further arranged on the upper surface of the circuit substrate, the thickness of the electronic component is equal to that of the first contact piece assembly, and a third accommodating through hole matched with the electronic component is formed in the middle layer.
3. The smart card with fingerprint recognition function of claim 2, wherein:
the first contact piece assembly and the second contact piece assembly are respectively arranged at two ends of the upper surface of the circuit substrate, and the electronic component is positioned between the first contact piece assembly and the second contact piece assembly.
4. A smart card with fingerprint identification capability as claimed in any one of claims 1 to 3 wherein:
the first conductive adhesive layer and the second conductive adhesive layer are both made of conductive double-sided adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921545175.5U CN210295169U (en) | 2019-09-17 | 2019-09-17 | Smart card with fingerprint identification function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921545175.5U CN210295169U (en) | 2019-09-17 | 2019-09-17 | Smart card with fingerprint identification function |
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| Publication Number | Publication Date |
|---|---|
| CN210295169U true CN210295169U (en) | 2020-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921545175.5U Active CN210295169U (en) | 2019-09-17 | 2019-09-17 | Smart card with fingerprint identification function |
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| CN (1) | CN210295169U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112672536A (en) * | 2020-12-29 | 2021-04-16 | 江苏恒宝智能系统技术有限公司 | Fingerprint identification card and preparation method thereof |
-
2019
- 2019-09-17 CN CN201921545175.5U patent/CN210295169U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112672536A (en) * | 2020-12-29 | 2021-04-16 | 江苏恒宝智能系统技术有限公司 | Fingerprint identification card and preparation method thereof |
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