JP2000227954A - Hybrid ic card and ic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate the electric connection of a terminal part and an IC module by inserting a projection part formed in an IC module into the terminal part of a coil or an antenna connected to the IC module and joining them. SOLUTION: The hybrid IC card 1 has a card base material 5 formed on upper/lower heat-plastic synthetic resin sheets 3 and 4 and incorporates an antenna arranged on the heat-plastic synthetic resin sheet 3. In the IC card, an IC module 2 is installed in a recessed part 7 positioned on the antenna. The IC module 2 has an IC chip 8 and the IC chip 8 is directly/electrically connected to an outer connection terminal 11 by the conduction wiring of a substrate 9. The card surface of the IC card 1 and the outer connection terminal 11 are incorporated so that they become similar heights. Projection parts 13 which are electrically connected to the IC chip 8 are formed in the wiring part of the substrate 9 of the IC module 2, and they bite into the terminal parts 14 of the antenna and they are closely stuck to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a system in which power is supplied from the outside and communication with the outside is performed by directly connecting terminals.
A hybrid including both a method of performing connection in a non-contact state (that is, power supply and communication with the outside without performing connection with an external device by an external connection terminal) using a coil or an antenna. It relates to a type IC card.

[0002]

2. Description of the Related Art In recent years, IC cards include, for example, cash cards, credit cards, ID cards, electronic currencies,
It is configured to perform various operations such as bank card transactions, payment of fees, communication by telephone, or various types of identification operations, such as telephone cards or public transportation, especially bus and rail commuter passes, and information about individuals and financial information. Important information is being recorded and processed, and its use in various fields has begun. These operations are performed between the IC module of the IC card and the terminal device that reads and writes information by a contact method using direct electrical coupling between external connection terminals and a non-contact method using indirect electrical coupling using electromagnetic waves. It is performed by one of two types of contact method. The method is selected according to the use of the IC card. However, depending on the use of the IC card, it is more convenient to use a single card having both the contact method and the non-contact method. Cards are already on the market under the name of hybrid IC cards or combination cards.

[0003] Current IC cards are manufactured as portable media having standardized dimensions. Normal IS
The O standard 7810 specifies a card having a standard form of 85 mm in length, 54 mm in width, and 0.76 mm in thickness. The configuration of a non-contact type IC card includes a thermoplastic resin sheet and an IC (integrated circuit), respectively. Chip) and an IC module including the card body.
An induction coil type antenna is connected to the chip.
However, in the case of a non-contact type IC card, it is often thicker than a contact type IC card.

[0004] In general, a method of producing a non-contact type IC card by a lamination technique is known. In this method, a plurality of thermoplastic sheets are stacked and arranged between two plates of a press, and a non-contact type IC module is arranged therebetween. This IC module is electrically connected in advance to a coil or an antenna surrounding the IC chip, control circuit, and the like. After the arrangement, a plurality of thermoplastic sheets are welded by applying heat and pressure to integrate the IC module and the thermoplastic sheet.

[0005] In the laminating method using heat, there is a difference in the coefficient of expansion of the materials used. Therefore, due to the effects of pressure and temperature during laminating, residual deformation occurs between the card surface and the IC module, resulting in impact and torsion. Regions with different tolerances are created, making the IC card look distorted. That is, to prevent this,
It is necessary to increase the thickness of the C card, and unless this is done, the appearance of the obtained IC card is not satisfactory. According to this, the standard thickness of the above standard is 0.7
This indicates that it may be difficult to manufacture a card having a size of 6 mm. Therefore, the production efficiency of such a method is low, and moreover, IC cards regarded as defective products have
Since the C module and the coil or the antenna are built in, there is a problem that the production cost becomes high if disposed as it is.

In addition, a rectangular frame suitable for the size of the card is placed between the thermoplastic sheets, and an IC module connected to a coil or an antenna in advance is placed in a cavity formed by this frame and an intermediate sheet. A non-contact type IC in which a thermosetting resin is injected into the cavity, and then the cavity is covered with the thermoplastic sheet.
There is a method for manufacturing a card. However, this IC card has a thickness exceeding the above-mentioned standard or the edge of the card is distorted, resulting in a bad appearance.

Furthermore, a hybrid IC card combining both a contact type and a non-contact type is a single IC card so that the functions of both can be selected as appropriate according to the application. Since it is arranged on one card substrate, the card structure becomes complicated and the manufacturing process becomes complicated. For example, as shown in FIG. 7, a coil or antenna (not shown) is sealed in the card base material 20 by a lamination method or an injection molding method, and an end of the coil or antenna (not shown) is provided with an IC. A terminal portion 22 electrically connected to the module 23 is provided. The card base 20 is provided with a concave portion 24 for accommodating the IC module 23 so that the terminal portion 22 of the coil or the antenna (not shown) is exposed, and the terminal portion 22 is provided with the IC module 23 accommodated in the concave portion 24. Then, it is connected to the connection terminal section 26 of the IC module 23.
The IC module 23 has a contact type external connection terminal 25 and a connection terminal portion 26 connected to a coil or an antenna (not shown) built in the card substrate 20. These contact type and non-contact type are IC chips. 21 shared,
If you select one of the methods,
It supplies power and inputs and outputs information from the outside.

[0008]

In the method of manufacturing the card base material 20, in the laminating method, a coil or an antenna (not shown) is provided between thermoplastic resin sheets, and then the thermoplastic resin sheets are integrated by heating and pressing. In the injection molding method, a resin sheet and a coil or an antenna are formed on the resin sheet in a mold molded into the shape of the card substrate 20.
After installing the (not shown) 21, the mold is closed to inject a molten resin into a mold interior space formed to mold the card base material 20. The method of providing the concave portion 24 in the card base material 20 is usually formed by counterbore processing using a drill for cutting, and it is necessary to expose the terminal portion 22. Therefore, it is necessary to accurately grasp the position of the terminal portion 22. However, in the conventional method for manufacturing a card base material, the position of the coil or the antenna (not shown) is not always at a fixed position.
In order to reliably form the concave portion 24 for accommodating the C module 23, a thin card base material may be used.
Since strict accuracy is required and expensive manufacturing equipment with high processing accuracy is required, processing of the card base material is costly, time-consuming, and difficult to mass-produce.

Further, soldering 2 is used to connect and connect the connection terminal 26 of the IC module fitted into the recess 24 of the card base material 20 and the terminal 22 exposed in the recess 24.
7, the fixation by soldering 27 also contributed to complicating the process.

The present invention has been made in view of the above circumstances, and can be used in both a contact type and a non-contact type. An object of the present invention is to provide a hybrid IC card which facilitates connection with a connection terminal portion of an IC module and which is excellent in manufacturing cost and mass productivity which does not require a high degree of manufacturing process.

[0011]

According to an aspect of the present invention, there is provided an IC card according to the present invention, wherein at least an external connection terminal is mounted on a substrate and an external connection terminal mounted on a back surface of the substrate. An IC module having an IC chip electrically connected to the IC card, and a coil or antenna connected to the IC chip via a terminal portion to supply power and / or communicate in a non-contact state with the outside, inside the card base material. In the hybrid type IC card provided in the above, the IC chip and the terminal portion are electrically connected by electrically connecting the IC chip and piercing the protrusion formed on the substrate into the terminal portion. It is a hybrid type IC card characterized by the following.

According to a second aspect of the present invention, in the hybrid IC card according to the first aspect, at least a part of a coil or an antenna terminal disposed inside the card base accommodates the IC module. It is characterized by being exposed or present in the recess.

According to a third aspect of the present invention, in the hybrid type IC card according to the second aspect, the recess accommodates the plate, and the surface of the external connection terminal and the surface of the card base are substantially the same. And a second concave portion for accommodating a resin-sealed IC chip mounted on the substrate.

According to a fourth aspect of the present invention, in the hybrid type IC card according to the first aspect, at least a part of the terminal portion is exposed at or near the first recess for accommodating the IC module. Features.

According to a fifth aspect of the present invention, in the hybrid IC card according to the first aspect, the shape of the projection is a needle shape, a wavy shape, a stud shape, or an uneven shape.

The invention according to claim 6 is the invention according to claims 1 to 4
3. The hybrid IC card according to item 1, wherein the connection terminal has heat shrinkability.

According to a seventh aspect of the present invention, there is provided an IC chip electrically connected to at least an external connection terminal on a substrate and the external connection terminal mounted on a back surface of the substrate.
An IC module characterized in that a protrusion electrically connected to a chip is formed on the substrate.

According to an eighth aspect of the present invention, in the IC module according to the sixth aspect, the shape of the projection is a needle shape, a wavy shape, a stud shape, or an uneven shape.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a front view of the hybrid IC card of the present invention, and FIG. 2 is a front view of a card base material used for the hybrid IC card of the present invention.
FIG. 3 is a partially enlarged cross-sectional view taken along line BB ′ of FIG. 2, FIG. 4 is a schematic view of a coil used in the hybrid IC card of the present invention, and FIGS. FIGS. 6A and 6B are cross-sectional views of the IC module of the present invention. FIGS. 6A and 6B are AA ′ of the hybrid IC card of the present invention.
It is a partial expanded sectional view in a line.

The hybrid IC card 1 shown in FIG. 1 has a card base 5 formed of a thermoplastic resin sheet 3 on the lower surface and a thermoplastic resin sheet 4 on the upper surface as shown in FIG. An antenna 6 disposed on the plastic resin sheet 3 is incorporated. The antenna 6 is arranged between the thermoplastic resin sheet 3 and the thermoplastic resin sheet 4 as shown in FIG. The hybrid IC card 1 further has the IC module 2 in the concave portion 7 located on the antenna 6.

The IC module 2 will be described with reference to FIG. The IC module 2 has an IC chip 8,
The IC chip 8 is directly connected to the external connection terminals 11 constituting a metal part (for example, a copper thin film, a copper foil, a copper plating, or the like) made of, for example, metal, for example, copper by the conductive wiring 10 of the substrate 9. It is electrically connected. The external connection terminal 11 is, for example, an independent terminal pad 12 which is electrically insulated by eight division lines. The IC module 2 is disposed in the recess 7 and the hybrid IC card 1
And the external connection terminals 11 are arranged at the same height. These are arranged on the hybrid IC card 1 so as to satisfy the ISO standard 7816 which defines the arrangement of the contact terminals of the IC card. The lower surface of the terminal pad 12 of the external connection terminal 11 is in close contact with a substrate 9, which is made of, for example, glass / epoxy, polyester, polyimide, or any suitable polymer. The above terminal pad 12
Denotes an IC on the back surface of the substrate 9, that is,
The part electrically connected to the chip is electrically connected to the wiring part 10 via a through hole (not shown) formed in the substrate 9.

In the wiring section 10 of the substrate 9 of the IC module 2, a projection 13 electrically connected to the IC chip 8 like the terminal pad 12 is formed. These projections 13 connect the IC chip 8 to the two terminals 14 of the antenna 6 shown in FIGS. The protrusion 13 is made of a conductive material, for example, a metal material,
The material is not particularly limited as long as it is a single metal such as copper, silver, gold, iron, nickel, or aluminum, or an alloy containing them, or a material having conductivity and hardness. The protruding portion 13 is formed by shaving a layer of a conductive material into a protruding shape or by implanting a protruding protruding shape. One or more protruding portions can be provided. Any structure is possible as long as it has a structure such as a stud shape protruding from the substrate 9 and can bite into and adhere to the terminal portion 14. The length and size of the protruding portion 13 are not particularly limited.
Determined by card thickness.

In correspondence with this, the terminal portion 14 is
It is desirable that the conductive material be capable of penetrating or piercing, and that can be in close contact with the projection 13.
For example, conductive rubber, silver paste, or a conductive metal thin film may be used.

The antenna 6 is composed of a metal or metal foil formed on a substrate in a coil shape, a coil formed of a metal sheet or a metal wire formed in a coil shape. It can be produced by various methods, in particular by chemical etching or stamping, respectively, or by winding the wire into a coil. Further, it can be formed by applying an adhesive to a thermoplastic resin sheet by a screen printing method and performing metal evaporation. In FIG. 4, the antenna 6 is arranged in a triple spiral, and its two ends, that is, the terminal portions 14, have one inside the spiral, the other outside the spiral, and one end at each end of the antenna. Connected terminal 1
4 is formed large.

The antenna 6 can take any geometric shape. The number of turns of the spiral is only given as a guide. Further, when formed on a thermoplastic resin sheet, antennas can be provided on both surfaces thereof, and a spiral can be formed on the other surface. In this specific example, a double-sided printed circuit board technology (dual-face printed circuit technology) is used, or a sheet is cut and pressed so as to bind the metal layers on both sides, thereby making the metal layers on both sides conductive. it can. Instead of forming a double-sided circuit, it is also possible to perform screen printing several times in succession to form a multi-layer spiral.

It is preferable that the outer periphery of the antenna 6 substantially coincides with the outer periphery of the hybrid IC card 1. The range and the receiving capacity of the antenna 6 depend on the surface area of the magnetic flux covered by the antenna 6, and are maximized in that case.
Therefore, the spiral shape of the antenna 6 is a hybrid type I
It is a rectangle similar to the C card 1.

In the present embodiment, the thermoplastic resin sheets 3 and 4 have a thickness which satisfies a thickness of 0.78 mm when a standard IC card corresponding to the ISO standard 7810 of an IC card is manufactured by a thermal lamination method. About 180 μm
It is. Examples of the thermoplastic resin sheets 3 and 4 include PVC (polyvinyl chloride), PC (polycarbonate), ABS (acrylonitrile-butadiene-styrene), PET (polyethylene), PETG (polyethylene terephthalate glycol), and PVDF (polyvinylidene fluoride). ) Or any other thermoplastic resin film having equivalent properties.

The antenna 6 arranged on the thermoplastic resin sheet 3 is formed by forming the antenna on a resin sheet with a metal foil, and this can be fixed on the thermoplastic resin sheet 3 by using an adhesive. . Thermoplastic resin sheet 3,
4, an antenna 6 is disposed therebetween, and the thermoplastic resin material is softened by heating and pressurizing due to the laminating process, whereby the mutual bonding is performed, and the card base material 5 as shown in FIG. 2 is obtained. The method of manufacturing the card base 5 is the above-described thermal lamination method, the injection molding method using a mold, and the resin filling in which an antenna 6 is arranged between resin sheets and is filled with resin to produce an IC card. A known method such as a method can be used.

As shown in FIGS. 2 and 3, the card base 5 is formed with a recess 7 for accommodating the IC module 2. The recess 7 is a second recess 16 for accommodating an IC chip of the embodiment shown in FIG.
And a first recess 15 for accommodating the substrate 9 of the IC module 2
The terminal portion 14 is present in the vicinity of the first concave portion 15, and when the projection portion 13 formed around the substrate 9 of the IC module 2 is pushed in, the projection portion 13 bites into or penetrates the terminal portion 14. Good. Therefore, if this condition is satisfied, the terminal portion 14 does not need to be exposed on the surface of the first concave portion.

The method for forming the concave portion 7 is as follows: the card base material 5 is formed by so-called counterboring using a known cutting tool.
It can be easily implemented by shaving from If the terminal portion 14 is not completely removed, the terminal portion 1
There is no problem if 4 is exposed. In the injection molding method among the methods of manufacturing the card base material 5 described above, processing is performed so that the structure of the concave portion 7 is formed in advance in the mold, and the antenna 6 is mounted in the mold during injection molding. By performing the processing, it is possible to omit the counterbore processing as the post-processing described above.

The structure of the recess 7 differs depending on the shape of the IC module 2 to be housed.
The projection 13 formed on the IC module 2 which is electrically connected to the IC chip 8 is pierced into the terminal 14 of the antenna 6 so that the connection between the two can be easily performed and the reliable conduction can be ensured. Any shape can be used as long as the above can be achieved.

As described above, the antenna 6 is previously arranged on the card base material 5 and the terminal portion 14 of the antenna 6 is inserted into at least the back surface of the substrate 9 of the IC module 2, that is, the IC chip 2. The first concave portion 15 is formed on the mounting surface so as to partially overlap the protrusion 13 electrically connected to the IC chip, and the second concave portion 16 for accommodating the IC chip 8 is formed by counterbore processing. In this counterboring process, even if the terminal portion 14 is exposed on the bottom surface of the first concave portion 15 or even if the terminal portion 14 is covered with the layer of the card base material 5, the terminal portion can be easily inserted by piercing the projection portion 13. Part 1
It only needs to be thick enough to reach 4 and be joined. The IC module 2 is fitted into the recess 7, and the protrusion 1 is
3 and stabbed and joined, hybrid type I
The C card is completed.

In order to securely fix the IC module 2 in the recess 7, a known adhesive such as a thermosetting adhesive or a pressure-sensitive adhesive is used for the area other than the projection 13, and the IC module 2 is fixed in the recess 7.
The C module 2 can be fixed.

[0034]

According to the hybrid IC card and the IC module of the present invention, the terminal formed in the IC module is inserted into the terminal of the coil or the antenna connected to the IC module, and the terminal is recessed. It is not necessary to always expose when counterbore processing, the coil or antenna of the card base for exposing the terminal part, the precision of the position setting of the terminal part and the processing precision of the counterbore processing are not high precision. Since the structure is such that the protrusions bite into the terminals, the bonding area between the terminals and the protrusions is increased, the conductivity is improved, and the adhesive force between the IC module and the card base material is increased. The physical peel strength from the card base material is improved.

Further, when the terminal portion is not exposed from the concave portion, the terminal portion does not come into direct contact with the atmosphere, so that the terminal portion can be prevented from deteriorating during storage of the card base material or storage of the hybrid IC card. Even if the card base material is stored in stock, the card can be manufactured stably, and the hybrid IC card can be used without any trouble due to deterioration of the function due to aging.

[Brief description of the drawings]

FIG. 1 is a front view of a hybrid IC card according to the present invention.

FIG. 2 is a front view of a card base material used for the hybrid IC card of the present invention.

FIG. 3 is a partially enlarged sectional view taken along line BB ′ of FIG. 2;

FIG. 4 is a schematic diagram of a coil used in the hybrid IC card of the present invention.

FIGS. 5A and 5B are cross-sectional views of the IC module of the present invention.

FIGS. 6 (a) and (b) show hybrid type I of the present invention.
It is a partial expanded sectional view in the AA 'line of a C card.

FIG. 7 is a sectional view of a conventional hybrid IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Hybrid type IC card 2 IC module 3 Thermoplastic resin sheet 4 Thermoplastic resin sheet 5 Card base material 6 Coil or antenna 7 Concave part 8 IC chip 9 Substrate 10 Wiring 12 Terminal pad 13 Projection part 14 Terminal part 15 First concave part 16 First 2 recesses

Claims (8)

[Claims] An IC module having at least an external connection terminal on a substrate and an IC chip mounted on the back surface of the substrate and electrically connected to the external connection terminal, and via an IC chip and a terminal unit. A hybrid IC card comprising a coil or an antenna connected to perform power supply and / or communication in a non-contact state with the outside inside a card base material, electrically connected to the IC chip and formed on the substrate A hybrid IC card, wherein the IC chip and the terminal portion are electrically connected by inserting the projected portion into the terminal portion. 2. The method according to claim 1, wherein at least a part of a terminal of the coil or the antenna disposed inside the card base is exposed or present in a recess for accommodating the IC module. The hybrid IC card according to the above. 3. The concave portion accommodates the plate, and has a first concave portion in which the surface of the external connection terminal and the surface of the card base are substantially the same, and a resin seal mounted on the substrate. The hybrid IC card according to claim 2, comprising a second recess for accommodating an IC chip. 4. An integrated circuit according to claim 1, wherein at least a part of said terminal portion is an IC.
4. The hybrid IC card according to claim 3, wherein the hybrid IC card is exposed to or near the first recess for housing a module. 5. The shape of the projection is needle-like, wavy, tack-like,
2. The hybrid IC card according to claim 1, wherein the hybrid IC card has an uneven shape. 6. The hybrid IC card according to claim 1, wherein the terminal has heat shrinkability. 7. An IC chip electrically connected to at least an external connection terminal on a substrate and the external connection terminal mounted on a back surface of the substrate, and a protrusion electrically connected to the IC chip. An IC module formed on the substrate. 8. The shape of the projection is needle-like, wavy, tack-like,
The IC module according to claim 7, wherein the IC module has an uneven shape.