JP2008250484A - Ic module, ic card, and communication device - Google Patents

Ic module, ic card, and communication device Download PDF

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JP2008250484A
JP2008250484A JP2007088832A JP2007088832A JP2008250484A JP 2008250484 A JP2008250484 A JP 2008250484A JP 2007088832 A JP2007088832 A JP 2007088832A JP 2007088832 A JP2007088832 A JP 2007088832A JP 2008250484 A JP2008250484 A JP 2008250484A
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card
terminal
substrate
contact
side contact
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JP5019207B2 (en
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Akira Komatsu
朗 小松
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Toshiba Corp
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Toshiba Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

<P>PROBLEM TO BE SOLVED: To deal with an even larger number of functions by providing contact terminals for other functions, not only on the front, but on the back of a card base material. <P>SOLUTION: An IC card includes a card base material K; a storage recess part 2 provided on one side of the card base material K; an IC module M including a base 9, front contact terminals C1 to C8 provided on one side of the base 9, an IC 10 provided on the other side of the base 9 for electrical connection to the front contact terminals C1 to C8, and terminals 12, 13 for electrical connection to the IC 10, the IC module M being stored in the storage recess part 2 in the card base material K from the side of the IC 10; and back contact terminals 3, 4 provided in positions on the other side of the card base material K opposite to the storage recess part 2 and electrically connected to the terminals 12, 13 on the other side of the base 9 of the IC module M. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、例えば、接触式、非接触式、或いはこれら両方式でのデータ通信を可能とするICカードに用いられるICモジュール、ICカード、及び通信装置に関する。   The present invention relates to an IC module, an IC card, and a communication device used for an IC card that enables data communication using, for example, contact type, non-contact type, or both.

ICカードには、接触式のもの、非接触式(無線)のもの、また、接触式と非接触式(無線)の機能を有するもの(コンビカード)、さらに、接触式の機能とICモジュールの空き端子C4,C8に無線機能を搭載して外部アンテナに接続するもの(C4,C8対応カード)、また、SUB接続されるもの(空き端子C4,C8を使用予定)等がある。   IC cards include contact type, non-contact type (wireless) type, contact type and non-contact type (wireless) type (combination card), contact type function and IC module There are ones in which the wireless terminals C4 and C8 have a wireless function and are connected to an external antenna (C4 and C8 compatible cards), and those that are SUB connected (the empty terminals C4 and C8 will be used).

ICカードはそのカード基材の表面側に収納用凹部を設け、この収納用凹部内にICモジュールを収納している。ICモジュールは、通常、その基板の表面側に8個の接触用端子C1〜C8を有し、基板の裏面側にはICを実装している。   The IC card is provided with a storage recess on the surface side of the card base, and the IC module is stored in the storage recess. The IC module usually has eight contact terminals C1 to C8 on the front surface side of the substrate, and the IC is mounted on the back surface side of the substrate.

例えば、C4,C8対応カードでは、ICモジュールの基板の裏面側に設けた非接触機能用端子と空き端子C4,C8とを金属ワイヤで接続し、この端子C4,C8と外部アンテナとを接続している(例えば、特許文献1参照。)。
特表2004−537816号公報
For example, in a C4 and C8 compatible card, the non-contact function terminal provided on the back side of the IC module substrate and the empty terminals C4 and C8 are connected by a metal wire, and the terminals C4 and C8 are connected to an external antenna. (For example, refer to Patent Document 1).
JP-T-2004-537816

しかしながら、従来おいては、ICモジュールが8個の接触用端子(C1〜C8)しか備えていないため、上記したようにICカードが接触式、無線式、USB接続、さらに、これらを組み合わせたものなどと多機能化し、今後、さらに、多機能化が進んだ場合には、従来のインターフェースの個数では、対応しきれなくなる虞がある。   However, in the past, since the IC module has only eight contact terminals (C1 to C8), as described above, the IC card is a contact type, wireless type, USB connection, and a combination thereof. If the number of functions is increased and the number of functions is further increased in the future, the number of conventional interfaces may not be able to cope with them.

本発明は上記事情に着目してなされたもので、カード基材の表面側のみならず、裏面側にも別機能のための裏面側接触端子を設けることにより、さらなる多機能化に対応できるようにしたICカードを提供することを目的する。   The present invention has been made paying attention to the above circumstances, and by providing backside contact terminals for different functions not only on the front side of the card base material but also on the back side, it is possible to cope with further multifunctionalization. The purpose is to provide an IC card.

上記課題を解決するため、請求項1記載のものは、基板と、この基板の一面側に設けられた接触端子と、前記基板の他面側に設けられ、前記接触端子に電気的に接続されるIC、及びこのICに電気的に接続される端子とを具備したことを特徴とする。   In order to solve the above-mentioned problem, a device according to claim 1 is provided with a substrate, a contact terminal provided on one surface side of the substrate, and provided on the other surface side of the substrate, and is electrically connected to the contact terminal. And a terminal electrically connected to the IC.

請求項2記載のものは、カード基材と、このカード基材の一面側に設けられた収納用凹部と、基板と、この基板の一面側に設けられた表面側接触端子と、前記基板の他面側に設けられ前記表面側接触端子に電気的に接続するICと、このICに電気的に接続される端子とを有して構成され、前記IC側から前記カード基材の収納用凹部内に収納されるICモジュールと、前記カード基材の他面側に前記収納用凹部の反対側に位置して設けられ、前記ICモジュールの基板の他面側の端子に電気的に接続される裏面側接触端子とを具備したことを特徴とする。   According to a second aspect of the present invention, there is provided a card base, a storage recess provided on one side of the card base, a substrate, a surface side contact terminal provided on the one side of the substrate, An IC provided on the other surface side and electrically connected to the surface-side contact terminal, and a terminal electrically connected to the IC, the concave portion for storing the card base from the IC side An IC module housed inside, and provided on the other surface side of the card base on the opposite side of the housing recess and electrically connected to a terminal on the other surface side of the substrate of the IC module And a back-side contact terminal.

請求項5記載のものは、カード基材と、このカード基材の一面側に設けられた収納用凹部と、基板と、この基板の一面側に設けられた表面側接触端子と、前記基板の他面側に設けられ前記表面側接触端子に電気的に接続するICと、このICに電気的に接続される端子とを有して構成され、前記IC側から前記カード基材の収納用凹部内に収納されるICモジュールと、前記カード基材の他面側に前記収納用凹部の反対側とは異なる位置に設けられ、前記ICモジュールの基板の他面側の端子に導電経路を介して電気的に接続される裏面側接触端子とを具備したことを特徴とする。   According to a fifth aspect of the present invention, there is provided a card base, a storage recess provided on one side of the card base, a substrate, a surface side contact terminal provided on the one side of the substrate, An IC provided on the other surface side and electrically connected to the surface-side contact terminal, and a terminal electrically connected to the IC, the concave portion for storing the card base from the IC side The IC module stored in the card base is provided on the other side of the card base at a position different from the opposite side of the storing recess, and the terminal on the other side of the substrate of the IC module is connected to the terminal via a conductive path. It has the back surface side contact terminal electrically connected.

請求項6記載のものは、カード基材と、このカード基材の一面側に設けられた収納用凹部と、基板と、この基板の一面側に設けられた表面側接触端子と、前記基板の他面側に設けられ前記表面側接触端子に電気的に接続されるICと、この前記ICに電気的に接続される裏面側接触端子とを有して構成され、前記IC側から前記カード基材の収納用凹部内に収納されるICモジュールと、前記カード基材に設けられ、前記ICモジュールの裏面側接触端子を前記カード基材の裏面側に連通させる貫通孔とを具備したことを特徴とする。   According to a sixth aspect of the present invention, there is provided a card base, a storage recess provided on one side of the card base, a substrate, a surface side contact terminal provided on the one side of the substrate, An IC provided on the other surface side and electrically connected to the front surface side contact terminal; and a back surface side contact terminal electrically connected to the IC. An IC module housed in a recess for housing material, and a through-hole provided in the card base material for communicating a back side contact terminal of the IC module with the back side of the card base material And

請求項7記載のものは、請求項2記載のICカードを挿入させてデータ通信する通信装置で、前記ICカードを挿入させる装置本体と、この装置本体内に設けられ、前記ICカードが前記装置本体内に挿入されるのに基いて前記ICカードの表面側接触端子に接触する第1の端子部、及び前記ICカードの裏面側接触端子に接触する第2の端子部とを具備することを特徴とする。   According to a seventh aspect of the present invention, there is provided a communication apparatus for performing data communication by inserting the IC card according to the second aspect, the apparatus main body for inserting the IC card, and the IC card provided in the apparatus main body. A first terminal portion that contacts the front surface side contact terminal of the IC card based on being inserted into the body, and a second terminal portion that contacts the back surface side contact terminal of the IC card. Features.

請求項10記載のものは、請求項5記載のICカードを挿入させてデータ通信する通信装置で、前記ICカードを挿入させる装置本体と、この装置本体の一内壁面部に設けられた端子部とを具備し、前記ICカードがその表側接触端子を前記装置本体の一内壁面部に沿う状態で挿入されるのに基づいて前記表側接触端子を前記端子部に接触させ、前記ICカードがその裏側接触端子を前記装置本体の一内壁面部に沿う状態で挿入されるのに基づいて前記裏側接触端子を前記端子部に接触させることを特徴とする。   According to a tenth aspect of the present invention, there is provided a communication apparatus for performing data communication by inserting the IC card according to the fifth aspect, an apparatus main body for inserting the IC card, and a terminal portion provided on one inner wall surface of the apparatus main body. The IC card is inserted in a state where the front side contact terminal is along the inner wall surface of the apparatus main body, the front side contact terminal is brought into contact with the terminal part, and the IC card is contacted on the back side. The back-side contact terminal is brought into contact with the terminal portion based on the terminal being inserted in a state along one inner wall surface of the apparatus main body.

請求項11記載のものは、請求項6記載のICカードを挿入させてデータ通信する通信装置で、前記ICカードを挿入させる装置本体と、この装置本体内の一内壁面部に前記ICカードの挿入方向と直交する方向に沿って配設された第1の端子部、及び第2の端子部とを具備し、前記ICカードがその表側接触端子を前記装置本体の一内壁面部に沿う状態で挿入されるのに基づいて前記表側接触端子を前記第1の端子部に接触させ、前記ICカードがその裏側接触端子を前記装置本体の一内壁面部に沿う状態で挿入されるのに基づいて前記第2の端子部をカード基材の貫通孔を介して前記裏側接触端子に接触させることを特徴とする。   According to a eleventh aspect of the present invention, there is provided a communication device for data communication by inserting the IC card according to the sixth aspect, the device main body for inserting the IC card, and insertion of the IC card into one inner wall surface portion in the device main body. A first terminal portion disposed along a direction orthogonal to the direction, and a second terminal portion, and the IC card is inserted with the front side contact terminal along one inner wall surface portion of the apparatus main body. The first contact portion is brought into contact with the first contact portion, and the IC card is inserted in a state where the back contact pin is fitted along one inner wall surface portion of the apparatus main body. 2 terminal parts are made to contact the said back side contact terminal through the through-hole of a card | curd base material.

請求項12記載のものは、請求項6記載のICカードを挿入させてデータ通信する通信装置で、前記ICカードを挿入させる装置本体と、この装置本体内の一内壁面部に設けられた第1の端子部、及びこの第1の端子部と離間対向する位置に設けられた第2の端子部とを具備し、前記ICカードがその表側接触端子を前記装置本体内の一内壁面部に沿う状態で挿入されるのに基づいて前記表側接触端子に前記第1の端子部を接触させるとともに、前記第2の端子部をカード基材の貫通孔を介して前記裏側接触端子に接触させることることを特徴とする。   According to a twelfth aspect of the present invention, there is provided a communication device for performing data communication by inserting the IC card according to the sixth aspect. And a second terminal portion provided at a position facing and away from the first terminal portion, and the IC card has its front side contact terminal along one inner wall surface portion in the apparatus main body. The first terminal portion is brought into contact with the front-side contact terminal based on the insertion of the first terminal portion, and the second terminal portion is brought into contact with the back-side contact terminal through the through hole of the card base. It is characterized by.

本発明によれば、カード基材の裏面側に設けた裏面側接触端子の個数だけ、通信のためのインターフェースを増大させることができ、多機能化に対応することが可能となる。   According to the present invention, the number of interfaces for communication can be increased by the number of back surface side contact terminals provided on the back surface side of the card base material, and it becomes possible to cope with multi-functionality.

以下、本発明の実施の形態を図面を参照して詳細に説明する。
図1は、本発明の第1の実施の形態である接触式のICカード1を示す平面図である。
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a plan view showing a contact IC card 1 according to a first embodiment of the present invention.

このICカード1は、カード基材KとICモジュールMとによって構成されている。   The IC card 1 includes a card base K and an IC module M.

図2は、図1中A−A線に沿って示す断面図で、図3は図1中B−B線に沿って示す断面図である。   2 is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 3 is a cross-sectional view taken along the line BB in FIG.

カード基材Kの表面側には収納用凹部2が設けられ、この収納用凹部2内にICモジュールMが収納される。また、カード基材Kの裏面側には、収納用凹部2の反対側に位置して裏面側接触端子3,4が配設されている。さらに、カード基材Kには、裏面側接触端子3,4と後述するICモジュールMの基板9の裏面側の端子12,13とを連通させる貫通孔6,7が穿設されている。貫通孔6,7内には導電性の接着剤16が充填され、この導電性の接着剤16を介してICモジュールMの裏面側の端子12,13とカード基材Kの裏面側接触端子3,4とが電気的に接続される。   A storage recess 2 is provided on the front side of the card substrate K, and the IC module M is stored in the storage recess 2. Further, on the back side of the card base K, the back side contact terminals 3 and 4 are disposed on the opposite side of the storing recess 2. Further, the card base K is provided with through holes 6 and 7 for communicating the back side contact terminals 3 and 4 with terminals 12 and 13 on the back side of the substrate 9 of the IC module M to be described later. The through holes 6 and 7 are filled with a conductive adhesive 16, and the back side terminals 12 and 13 of the IC module M and the back side contact terminals 3 of the card base K are connected via the conductive adhesive 16. , 4 are electrically connected.

ICモジュールMは厚さ100pmのガラスエポキシ製の基板9を有し、この基板9の表面側には、図4に示すように通信用の外部コンタクト端子(以下、表面側接触端子という)C1〜C3、C5、C7、及び通常の接触方式では使用しない予備用の端子C4と端子C8が配設されている。   The IC module M has a substrate 10 made of glass epoxy having a thickness of 100 pm, and on the surface side of the substrate 9, as shown in FIG. 4, external contact terminals for communication (hereinafter referred to as surface side contact terminals) C1 to C1. C3, C5, C7 and spare terminals C4 and C8 that are not used in the normal contact system are provided.

端子C1はVCC(供給電圧)、C2はRST(リセット信号)、C3はCLK(クロック信号)、C5はGND(接地)、C6はVPP(可変供給電圧)、C7はI/O(データ入出力)用の端子である。端子C4とC8はRFU(予備端子)となっている。   Terminal C1 is VCC (supply voltage), C2 is RST (reset signal), C3 is CLK (clock signal), C5 is GND (ground), C6 is VPP (variable supply voltage), and C7 is I / O (data input / output) ) Terminal. Terminals C4 and C8 are RFUs (spare terminals).

また、基板3の裏面側には図5に示すように厚さ250μmのIC10が実装され、このIC10と表面側接触端子C1〜C3、C5、C7とは金ワイヤ11を介して電気的に接続されている。表面側接触端子C4、C6、C8は、IC10には接続されていない。   An IC 10 having a thickness of 250 μm is mounted on the back side of the substrate 3 as shown in FIG. 5, and the IC 10 and the surface side contact terminals C 1 to C 3, C 5, C 7 are electrically connected via the gold wire 11. Has been. The front side contact terminals C4, C6, C8 are not connected to the IC10.

基板3の裏面側には2個の端子12、13が配設され、これら端子12,13も金ワイヤ11を介してIC10に電気的に接続されている。この端子12,13には、上記したようにカード基材Kの裏面側接触端子3,4が電気的に接続されるため、裏面側接触端子3,4は、端子12,13を介してIC10に電気的に接続され、追加の端子として機能するようになっている。   Two terminals 12 and 13 are disposed on the back side of the substrate 3, and these terminals 12 and 13 are also electrically connected to the IC 10 through the gold wire 11. Since the back surface side contact terminals 3 and 4 of the card base K are electrically connected to the terminals 12 and 13 as described above, the back surface side contact terminals 3 and 4 are connected to the IC 10 via the terminals 12 and 13. It is electrically connected to and functions as an additional terminal.

IC実装部はエポキシ樹脂15でモールドされて保護され、厚さ630μmのICモジュールMが構成されている。   The IC mounting portion is molded and protected with an epoxy resin 15 to form an IC module M having a thickness of 630 μm.

なお、IC10と表面側接触端子C1〜C3、C5、C7との接続を金ワイヤ11を用いたワイヤーボンディング方式としたが、これに限られることなく、他の接続方式でも構わない。   The connection between the IC 10 and the surface side contact terminals C1 to C3, C5, and C7 is a wire bonding method using the gold wire 11, but is not limited to this, and other connection methods may be used.

ICモジュールMは、図2に示すようにそのIC実装部側からカード基材Kの収納用凹部2内に収納されてICカード1が構成される。   As shown in FIG. 2, the IC module M is housed in the housing recess 2 of the card base K from the IC mounting portion side to form the IC card 1.

上記したICカード1は、図6に示すようにインターフェース(表面側接触端子C1〜C8、及び裏面側接触端子3,4によって構成される)17をリーダライタ18の端子部に接触させることにより、CPU19と外部端末20との間で通信を行なうことができるようになっている。   As shown in FIG. 6, the above-described IC card 1 is configured by bringing the interface (configured by the front surface side contact terminals C1 to C8 and the back surface side contact terminals 3 and 4) 17 into contact with the terminal portion of the reader / writer 18. Communication between the CPU 19 and the external terminal 20 can be performed.

ICカード1は、図7(a)に示すように表向きの状態、即ち、ICモジュール側を表向きにして図8及び図9に示すようにリーダライタ18に挿入され、或いは、図7(b)に示すように、裏向きの状態、即ち、裏面側接触端子3,4を表向きにして図10及び図11に示すようにリーダライタ18に挿入される。   The IC card 1 is inserted into the reader / writer 18 as shown in FIGS. 8 and 9 with the IC module side facing up, as shown in FIG. 7A, or as shown in FIG. 7B. As shown in FIG. 10, it is inserted into the reader / writer 18 as shown in FIG. 10 and FIG. 11 with the back side contact terminals 3, 4 facing up.

リーダ/ライタ18はケーシング23を有し、このケーシング23の前面部には挿入口23aが設けられている。ケーシング23内の一内壁面部としての天井部の一側部側には、複数本(8本)の接触ピン24aからなる第1の端子部24が設けられ、天井部の他側部側には、複数本(8本)の接触ピン25aからなる第2の端子部25が設けられている。   The reader / writer 18 has a casing 23, and an insertion port 23 a is provided on the front surface of the casing 23. A first terminal portion 24 including a plurality of (eight) contact pins 24a is provided on one side portion of the ceiling portion as one inner wall surface portion in the casing 23, and on the other side portion side of the ceiling portion. A second terminal portion 25 including a plurality (eight) of contact pins 25a is provided.

ICカード1が図8及び図9に示すように表向きの状態で天井部に沿ってリーダライタ18に挿入された場合には、ICモジュールMの表面側接触端子C1〜C8がケーシング23内の天井部の一側部側の第1の端子部24の接触ピン24aに接触されて通信可能な状態になる。   When the IC card 1 is inserted into the reader / writer 18 along the ceiling in a face-up state as shown in FIGS. 8 and 9, the surface side contact terminals C <b> 1 to C <b> 8 of the IC module M are in the ceiling in the casing 23. The first contact portion 24a of the first terminal portion 24 on one side of the contact portion is brought into contact with the contact pin 24a.

ICカード1が図10及び図11に示すように裏向きの状態で天井部に沿ってリーダライタ18に挿入された場合には、裏面側接触端子3,4がケーシング23内の天井部の他側部側の第2の端子部25の接触ピン25aに接触されて通信可能な状態になる。   When the IC card 1 is inserted into the reader / writer 18 along the ceiling in a state of facing down as shown in FIGS. 10 and 11, the back surface side contact terminals 3, 4 are connected to the ceiling portion in the casing 23. The contact pin 25a of the second terminal portion 25 on the side portion side is brought into a state where communication is possible.

この実施の形態によれば、カード裏面に裏面側接触端子3,4を配設するため、裏面側からの通信も可能となり、インターフェースを増加させることができ、多機能化に対応することができる。   According to this embodiment, since the back side contact terminals 3 and 4 are arranged on the back side of the card, communication from the back side is also possible, the number of interfaces can be increased, and multi-functionalization can be accommodated. .

図12及び図13は、本発明の第2の実施の形態を示すものである。   12 and 13 show a second embodiment of the present invention.

なお、以下に示す各実施の形態において、上記した実施の形態で示した部分と同一部分については、同一番号を付してその詳細な説明を省略する。   In the following embodiments, the same parts as those shown in the above-described embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.

上記した第1の実施の形態では、リーダ/ライタ18のケーシング23内の天井部の一側部側に第1の端子部24、他側部側に第2の端子部25を配設したが、この第2の実施の形態では、リーダ/ライタ30のケーシング31内の天井部の一側部側に第1の端子部32を設け、底面部の一側部側に第1の端子部32と離間対向する状態で第2の端子部33を設けている。   In the first embodiment described above, the first terminal portion 24 is disposed on one side of the ceiling portion in the casing 23 of the reader / writer 18, and the second terminal portion 25 is disposed on the other side. In the second embodiment, the first terminal portion 32 is provided on one side of the ceiling portion in the casing 31 of the reader / writer 30 and the first terminal portion 32 is provided on one side of the bottom surface portion. The second terminal portion 33 is provided so as to face and separate from the second terminal portion 33.

ICカード1は、リーダ/ライタ30のケーシング31内に挿入されることにより、表面側接触端子C1〜C8が第1の端子部32の各接触ピン32aに接触され、裏面側接触端子3,4が第2の端子部33の接触ピン33aに接触されて通信可能な状態になる。   When the IC card 1 is inserted into the casing 31 of the reader / writer 30, the surface side contact terminals C1 to C8 are brought into contact with the contact pins 32a of the first terminal portion 32, and the back surface side contact terminals 3 and 4 are contacted. Is brought into contact with the contact pin 33a of the second terminal portion 33 to enable communication.

この実施の形態によれば、リーダ/ライタ30の第1の端子部32と第2の端子部33に対してICカード1の表面側接触端子C1〜C8と裏面側接触端子3,4を同時に接触させることができ、リーダ/ライタ30への挿入時におけるICカード1の表裏反転動作を不要とすることができる。   According to this embodiment, the front-side contact terminals C1 to C8 and the back-side contact terminals 3 and 4 of the IC card 1 are simultaneously connected to the first terminal portion 32 and the second terminal portion 33 of the reader / writer 30. The IC card 1 can be brought into contact with each other, and the front / back reversing operation of the IC card 1 when inserted into the reader / writer 30 can be made unnecessary.

図14乃至図21は本発明の第3の実施の形態を示すものである。   14 to 21 show a third embodiment of the present invention.

図14はICカード1Bを示す平面図で、図15は図14中C−C線に沿って示す断面図で、図16は図14中D−D線に沿って示す断面図である。   14 is a plan view showing the IC card 1B, FIG. 15 is a sectional view taken along the line CC in FIG. 14, and FIG. 16 is a sectional view taken along the line DD in FIG.

上記した第1の実施の形態では、裏面側接触端子3,4をカード基材Kの裏面側の一側部側にICモジュールMの反対側に位置して配設したが、この第3の実施の形態では、図14〜図16に示すように裏面側接触端子34,35をICモジュールMの反対側の位置とは異なるICカード1A裏面の他側部側に配設し、これら裏面側接触端子34,35を導電経路36a,36bを介してICモジュールMの基板裏面側の端子12,13に電気的に接続している。   In the first embodiment described above, the back side contact terminals 3 and 4 are disposed on one side of the back side of the card base K so as to be located on the opposite side of the IC module M. In the embodiment, as shown in FIGS. 14 to 16, the back surface side contact terminals 34 and 35 are arranged on the other side of the back surface of the IC card 1 </ b> A different from the position on the opposite side of the IC module M. The contact terminals 34 and 35 are electrically connected to the terminals 12 and 13 on the back side of the substrate of the IC module M through the conductive paths 36a and 36b.

ICカード1Aは、図17(a)に示すように、表向の状態で図18及び図19に示すようにリーダライタ37に挿入される。また、ICカード1Aは、図17(b)に示すように、裏向きの状態で図20及び図21に示すようにリーダライタ37に挿入される。   As shown in FIG. 17A, the IC card 1A is inserted into the reader / writer 37 as shown in FIGS. Further, as shown in FIG. 17B, the IC card 1A is inserted into the reader / writer 37 as shown in FIGS.

リーダ/ライタ37はケーシング38内の天井部の一側部側に、複数本(8本)の接触ピン39aからなる端子部39を設けている。   The reader / writer 37 is provided with a terminal portion 39 including a plurality of (eight) contact pins 39 a on one side of the ceiling portion in the casing 38.

ICカード1Aが図18及び図19に示すように表向きの状態でリーダライタ37に挿入された場合には、表面側接触端子C1〜C8がケーシング38内の天井部の端子部39の接触ピン39aに接触されて通信可能な状態になる。   When the IC card 1A is inserted into the reader / writer 37 in a face-up state as shown in FIGS. 18 and 19, the surface side contact terminals C1 to C8 are contact pins 39a of the terminal portion 39 of the ceiling portion in the casing 38. It becomes a state where it can communicate by touching.

ICカード1Aが図20及び図21に示すように裏向きの状態でリーダライタ37に挿入された場合には、裏面側接触端子34,35がケーシング38内の天井部の端子部39の接触ピン39aに接触されて通信可能な状態になる。   When the IC card 1A is inserted into the reader / writer 37 in the face-down state as shown in FIGS. 20 and 21, the back-side contact terminals 34 and 35 are contact pins of the terminal portion 39 of the ceiling portion in the casing 38. It will be in the state which can be communicated by contacting 39a.

この実施の形態によれば、リーダライタ37の一箇所に設けた端子部39に表面側接触端子C1〜C8、或いは裏面側接触端子34,35を選択的に接触させて通信することができ、端子部の共用化が可能になる。   According to this embodiment, the front side contact terminals C1 to C8 or the back side contact terminals 34 and 35 can be selectively brought into contact with the terminal portion 39 provided in one place of the reader / writer 37, and can be communicated. The terminal part can be shared.

図22〜図29は本発明の第4の実施の形態を示すものである。   22 to 29 show a fourth embodiment of the present invention.

図22はICカード1Bを示す平面図で、図23は図22中E−E線に沿って示す断面図で、図24は図22中F−F線に沿って示す断面図である。   22 is a plan view showing the IC card 1B, FIG. 23 is a cross-sectional view taken along the line EE in FIG. 22, and FIG. 24 is a cross-sectional view taken along the line FF in FIG.

上記した各実施の形態においては、カード基材Kの裏面側に裏面側接触端子3,4を配設したが、この実施の形態では、ICモジュールMの基板9の裏面側に設けた端子を裏面側接触端子43,44としている。この裏面側接触端子43,44はカード基材Kに穿設された貫通穴46,47を介してカード基材Kの裏面側に連通されている。   In each of the above-described embodiments, the back-side contact terminals 3 and 4 are disposed on the back side of the card base K. In this embodiment, the terminals provided on the back side of the substrate 9 of the IC module M are provided. The back side contact terminals 43 and 44 are provided. The back surface side contact terminals 43 and 44 communicate with the back surface side of the card base material K through through holes 46 and 47 formed in the card base material K.

ICカード1Bは、図25(a)に示すように、表向の状態で図26及び図27に示すようにリーダライタ51に挿入される。また、ICカード1Bは、図25(b)に示すように、裏向の状態で図28及び図29に示すようにリーダライタ51に挿入される。   As shown in FIG. 25A, the IC card 1B is inserted into the reader / writer 51 as shown in FIGS. Further, as shown in FIG. 25B, the IC card 1B is inserted into the reader / writer 51 as shown in FIGS.

リーダ/ライタ51はケーシング52を有し、このケーシング52の前面部には挿入口52aが設けられている。ケーシング52内の一内壁面部としての天井部の一側部側には、複数本(8本)の接触ピン53aからなる第1の端子部53が設けられ、天井部の他側部側には、複数本(8本)の接触ピン54aからなる第2の端子部54が設けられている。   The reader / writer 51 has a casing 52, and an insertion port 52 a is provided in the front surface portion of the casing 52. A first terminal portion 53 including a plurality of (eight) contact pins 53a is provided on one side portion of the ceiling portion as one inner wall surface portion in the casing 52, and on the other side portion side of the ceiling portion. A second terminal portion 54 including a plurality (eight) of contact pins 54a is provided.

第2の端子部54の接触ピン54aは第1の端子部53の接触ピン53aよりも貫通穴46,47の長さ分だけ長くされており、後述するように貫通穴46,47内に挿入されたときその先端部を裏面側接触端子43,44に接触できるようになっている。   The contact pin 54a of the second terminal portion 54 is longer than the contact pin 53a of the first terminal portion 53 by the length of the through holes 46 and 47, and is inserted into the through holes 46 and 47 as will be described later. When this is done, the front end can be brought into contact with the back-side contact terminals 43 and 44.

ICカード1が図26及び図27に示すように表向きの状態でリーダライタ51に挿入された場合には、表面側接触端子C1〜C8が第1の端子部53の各接触ピン53aに接触されて通信可能な状態になる。また、ICカード1が図28及び図29に示すように裏向きの状態でリーダライタ51に挿入された場合には、第2の端子部54の接触ピン54aがカード基材Kの貫通孔46,47内に挿入されて裏面側接触端子43,44に接触され通信可能な状態になる。   When the IC card 1 is inserted into the reader / writer 51 in the face-up state as shown in FIGS. 26 and 27, the surface side contact terminals C <b> 1 to C <b> 8 are brought into contact with the contact pins 53 a of the first terminal portion 53. To be able to communicate. 28 and 29, when the IC card 1 is inserted into the reader / writer 51 in the face-down state, the contact pin 54a of the second terminal portion 54 is inserted into the through hole 46 of the card base K. , 47 and is in contact with the back-side contact terminals 43, 44 so that communication is possible.

図30及び図31は本発明の第5の実施の形態を示すものである。   30 and 31 show a fifth embodiment of the present invention.

上記した第4の実施の形態では、リーダ/ライタ51のケーシング52内の天井部の一側部側に第1の端子部53、他側部側に第2の端子部54を配設したが、この第5の実施の形態では、リーダ/ライタ56のケーシング57内の天井部の一側部側に第1の端子部58を設け、底面部の一側部側に第1の端子部58と離間対向する状態で第2の端子部59を設けている。   In the fourth embodiment described above, the first terminal portion 53 is disposed on one side of the ceiling portion in the casing 52 of the reader / writer 51, and the second terminal portion 54 is disposed on the other side. In the fifth embodiment, the first terminal portion 58 is provided on one side of the ceiling portion in the casing 57 of the reader / writer 56, and the first terminal portion 58 is provided on one side of the bottom surface portion. The second terminal portion 59 is provided in a state of being opposed to each other.

第2の端子部59の接触ピン59aは第1の端子部58の接触ピン58aよりもカード基材Kの貫通孔46,47の長さ分だけ長くされており、後述するように貫通孔46,47内に挿入されたときその先端部を裏面側接触端子43,44に接触できるようになっている。   The contact pin 59a of the second terminal portion 59 is made longer than the contact pin 58a of the first terminal portion 58 by the length of the through holes 46 and 47 of the card base K, and will be described later. , 47 can be contacted with the back-side contact terminals 43, 44 at the tip.

ICカード1Bは、表向きの状態でリーダ/ライタ56のケーシング57内に挿入されることにより、表面側接触端子C1〜C8には第1の端子部58の各接触ピン58aが接触され、裏面側接触端子43,44にはカード基材Kの貫通孔46,47内に挿通される第2の端子部59の接触ピン59aが接触されて通信可能な状態になる。   When the IC card 1B is inserted into the casing 57 of the reader / writer 56 in the face-up state, the contact pins 58a of the first terminal portion 58 are brought into contact with the front surface side contact terminals C1 to C8, and the back surface side. Contact pins 43a of the second terminal portion 59 inserted into the through holes 46, 47 of the card base K are brought into contact with the contact terminals 43, 44 so that communication is possible.

この第5の実施の形態によれば、リーダ/ライタ56の第1の端子部58、第2の端子部59に対してICカード1Bの表裏反転動作を必要とすることなく、表裏面側の接触端子C1〜C8、43,44を同時に接触させることができる。   According to the fifth embodiment, the first and second terminal portions 58 and 59 of the reader / writer 56 do not require the front / back reversing operation of the IC card 1B, and the front / back surface side is not required. The contact terminals C1 to C8, 43, and 44 can be contacted simultaneously.

図32はICモジュールMの端子12,13とカード基材Kの裏面側接触端子3,4とを電気的に接続する他の接続例を示すものである。   FIG. 32 shows another connection example in which the terminals 12 and 13 of the IC module M and the back surface side contact terminals 3 and 4 of the card base K are electrically connected.

上記した第1の実施の形態では、導電性接着剤16によってICモジュールMの端子12,13とカード基材Kの裏面側接触端子3,4とを電気的に接続したが、図32に示す接続例では、カード基材Kの貫通孔6,7の内周面に沿って銅などの導電体61,62を形成し、この導電体61,62を介してICモジュールMの端子12,13とカード基材Kの裏面側接触端子3,4とを電気的に接続する。   In the first embodiment described above, the terminals 12 and 13 of the IC module M and the back-side contact terminals 3 and 4 of the card base K are electrically connected by the conductive adhesive 16, as shown in FIG. In the connection example, conductors 61 and 62 such as copper are formed along the inner peripheral surfaces of the through holes 6 and 7 of the card base K, and the terminals 12 and 13 of the IC module M are connected via the conductors 61 and 62. And the back side contact terminals 3 and 4 of the card base K are electrically connected.

図33はICモジュールMの他の例を示すものである。   FIG. 33 shows another example of the IC module M.

図33のICモジュールMは、その基板9の裏面側に端子12,13に加えて非接触機能のための端子65,66を配設し、これら端子65,66を金ワイヤ11を介してIC10に接続している。端子12,13には裏面側接触端子3,4が電気的に接続される。   33, in addition to the terminals 12 and 13, terminals 65 and 66 for a non-contact function are arranged on the back side of the substrate 9, and these terminals 65 and 66 are connected to the IC 10 via the gold wire 11. Connected to. The back side contact terminals 3 and 4 are electrically connected to the terminals 12 and 13.

図34は、ICモジュールMのさらなる他の例を示すものである。   FIG. 34 shows still another example of the IC module M.

図34のICモジュールMは、その基板9の裏面側に端子12,13を配設するとともに、他機能のための外部接触端子C4,C8を金ワイヤ11を介してIC10に接続している。端子12,13には、裏面側接触端子3,4が電気的に接続される。   In the IC module M of FIG. 34, terminals 12 and 13 are disposed on the back side of the substrate 9, and external contact terminals C 4 and C 8 for other functions are connected to the IC 10 via gold wires 11. The backside contact terminals 3 and 4 are electrically connected to the terminals 12 and 13.

なお、この発明は、上述した実施の形態そのままに限定されるものではなく、実施段階ではその要旨を逸脱しない範囲で構成要素を変形して具体化できる。また、上述した実施の形態に開示されている複数の構成要素の適宜な組み合わせにより種々の発明を形成できる。例えば、上述した実施の形態に示される全構成要素から幾つかの構成要素を削除しても良い。更に、異なる実施の形態に亘る構成要素を適宜組み合わせても良い。   Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiments. For example, you may delete some components from all the components shown by embodiment mentioned above. Furthermore, you may combine the component covering different embodiment suitably.

本発明の第1の実施の形態を示すICカードの平面図。The top view of the IC card which shows the 1st Embodiment of this invention. 図1中A−Aに沿って示す断面図。Sectional drawing shown along AA in FIG. 図1中B−Bに沿って示す断面図。Sectional drawing shown along BB in FIG. 図1のICモジュールを表面側から示す図。The figure which shows the IC module of FIG. 1 from the surface side. 図1のICモジュールを裏面側から示す図。The figure which shows the IC module of FIG. 1 from the back side. 図1のICカードと通信する外部端末を示す図。The figure which shows the external terminal which communicates with the IC card of FIG. 図1のICカードがリーダライタに挿入される際の表裏の向きを示す図。The figure which shows direction of the front and back when the IC card of FIG. 1 is inserted in a reader / writer. 図1のICカードが表向きの状態でリーダライタに挿入された状態を示す平面図。FIG. 2 is a plan view showing a state where the IC card of FIG. 1 is inserted into the reader / writer in a face-up state. 図1のICカードが表向きの状態でリーダライタに挿入された状態を示す側断面図。FIG. 2 is a side sectional view showing a state in which the IC card of FIG. 1 is inserted into the reader / writer in a face-up state. 図1のICカードが裏向きの状態でリーダライタに挿入された状態を示す平面図。FIG. 2 is a plan view showing a state where the IC card of FIG. 1 is inserted into the reader / writer in a face-down state. 図1のICカードが裏向きの状態でリーダライタに挿入された状態を示す側断面図。FIG. 2 is a side cross-sectional view showing a state where the IC card of FIG. 1 is inserted into the reader / writer in a face-down state. 本発明の第2の実施の形態を示すリーダライタとICカードの平面図。The top view of the reader / writer and IC card which show the 2nd Embodiment of this invention. 図12のリーダライタとICカードを示す側断面図。FIG. 13 is a side sectional view showing the reader / writer and IC card of FIG. 12. 本発明の第3の実施の形態を示すICカードの平面図。The top view of the IC card which shows the 3rd Embodiment of this invention. 図14中C−Cに沿って示す断面図。Sectional drawing shown along CC in FIG. 図14中D−Dに沿って示す断面図。Sectional drawing shown along DD in FIG. 図14のICカードがリーダライタに挿入される際の表裏の向きを示す図。The figure which shows direction of the front and back when the IC card of FIG. 14 is inserted in a reader / writer. 図14のICカードが表向きの状態でリーダライタに挿入された状態を示す平面図。FIG. 15 is a plan view showing a state where the IC card of FIG. 14 is inserted into the reader / writer in a face-up state. 図18のリーダライタ及びICカードを示す側断面図。FIG. 19 is a side sectional view showing the reader / writer and IC card of FIG. 18. 図14のICカードが裏向きの状態でリーダライタに挿入された状態を示す平面図。FIG. 15 is a plan view showing a state where the IC card of FIG. 14 is inserted into the reader / writer in a face-down state. 図20のリーダライダ及びICカードを示す側断面図。FIG. 21 is a side sectional view showing the reader / rider and IC card of FIG. 20. 本発明の第4の実施の形態を示すICカードの平面図。The top view of the IC card which shows the 4th Embodiment of this invention. 図22中E−E線に沿って示す断面図。Sectional drawing shown along the EE line in FIG. 図22中F−F線に沿って示す断面図。Sectional drawing shown along the FF line in FIG. 図22のICカードがリーダライタに挿入される際の表裏の向きを示す図。The figure which shows direction of the front and back when the IC card of FIG. 22 is inserted in a reader / writer. 図22のICカードが表向きの状態でリーダライタに挿入された状態を示す平面図。FIG. 23 is a plan view showing a state where the IC card of FIG. 22 is inserted into the reader / writer in a face-up state. 図26のリーダライタ及びICカードを示す側断面図。FIG. 27 is a side sectional view showing the reader / writer and IC card of FIG. 26. 図22のICカードが裏向きの状態でリーダライタに挿入された状態を示す平面図。FIG. 23 is a plan view showing a state where the IC card of FIG. 22 is inserted into the reader / writer in a face-down state. 図28のリーダライタ及びICカードを示す側断面図。FIG. 29 is a side sectional view showing the reader / writer and IC card of FIG. 28. 本発明の第5の実施の形態を示すリーダライタとICカードの平面図。The top view of the reader / writer and IC card which show the 5th Embodiment of this invention. 図30のリーダライタ及びICカードを示す側断面図。FIG. 31 is a side sectional view showing the reader / writer and IC card of FIG. 30. 本発明のICモジュールの他の接続例を示す図。The figure which shows the other example of a connection of IC module of this invention. 本発明の他の例であるICモジュールを示す裏面図。The back view which shows the IC module which is the other example of this invention. 本発明のさらに他の例であるICモジュールを示す裏面図。The back view which shows the IC module which is further another example of this invention.

符号の説明Explanation of symbols

1…ICカード、K…カード基材、M…ICモジュール、C1〜C8…(表面側接触端子)、2…収納用凹部、9…基板、16…導電性接着剤、10…IC、12,13…端子
3,4、34,35、43,44…裏面側接触端子、6,7、…貫通孔、32,53、58…第1の端子部、33,54,59…第2の端子部。
DESCRIPTION OF SYMBOLS 1 ... IC card, K ... Card base material, M ... IC module, C1-C8 ... (surface side contact terminal), 2 ... Storage recessed part, 9 ... Board | substrate, 16 ... Conductive adhesive, 10 ... IC, 12, 13 ... Terminals 3, 4, 34, 35, 43, 44 ... Back side contact terminals, 6, 7, ... Through holes, 32, 53, 58 ... First terminal portions, 33, 54, 59 ... Second terminals Department.

Claims (12)

基板と、
この基板の一面側に設けられた接触端子と、
前記基板の他面側に設けられ、前記接触端子に電気的に接続されるIC、及びこのICに電気的に接続される端子と
を具備したことを特徴とするICモジュール。
A substrate,
Contact terminals provided on one side of the substrate;
An IC module, comprising: an IC provided on the other surface side of the substrate and electrically connected to the contact terminal; and a terminal electrically connected to the IC.
カード基材と、
このカード基材の一面側に設けられた収納用凹部と、
基板と、この基板の一面側に設けられた表面側接触端子と、前記基板の他面側に設けられ前記表面側接触端子に電気的に接続するICと、このICに電気的に接続される端子とを有して構成され、前記IC側から前記カード基材の収納用凹部内に収納されるICモジュールと、
前記カード基材の他面側に前記収納用凹部の反対側に位置して設けられ、前記ICモジュールの基板の他面側の端子に電気的に接続される裏面側接触端子と
を具備したことを特徴とするICカード。
A card substrate;
A concave portion for storage provided on one side of the card substrate;
A substrate, a surface-side contact terminal provided on one surface side of the substrate, an IC provided on the other surface side of the substrate and electrically connected to the surface-side contact terminal, and electrically connected to the IC An IC module configured to have a terminal, and housed in the recessed portion for housing the card base from the IC side,
A back surface side contact terminal provided on the other surface side of the card base and positioned on the opposite side of the housing recess and electrically connected to a terminal on the other surface side of the substrate of the IC module. IC card characterized by
前記ICモジュールの端子と前記裏面側接触端子とは、前記カード基材に設けられた貫通孔内に充填された導電性の接着剤を介して接続されたことを特徴とする請求項2記載のICカード。   The terminal of the said IC module and the said back surface side contact terminal are connected through the conductive adhesive with which it filled in the through-hole provided in the said card | curd base material. IC card. 前記ICモジュールの端子と前記裏面側接触端子とは、前記カード基材に設けられた貫通孔の内周面に沿って設けられた導電材を介して接続されたことを特徴とする請求項2記載のICカード。   3. The terminal of the IC module and the back-side contact terminal are connected via a conductive material provided along an inner peripheral surface of a through hole provided in the card base material. IC card of description. カード基材と、
このカード基材の一面側に設けられた収納用凹部と、
基板と、この基板の一面側に設けられた表面側接触端子と、前記基板の他面側に設けられ前記表面側接触端子に電気的に接続するICと、このICに電気的に接続される端子とを有して構成され、前記IC側から前記カード基材の収納用凹部内に収納されるICモジュールと、
前記カード基材の他面側に前記収納用凹部の反対側とは異なる位置に設けられ、前記ICモジュールの基板の他面側の端子に導電経路を介して電気的に接続される裏面側接触端子と
を具備したことを特徴とするICカード。
A card substrate;
A concave portion for storage provided on one side of the card substrate;
A substrate, a surface-side contact terminal provided on one surface side of the substrate, an IC provided on the other surface side of the substrate and electrically connected to the surface-side contact terminal, and electrically connected to the IC An IC module configured to have a terminal, and housed in the recessed portion for housing the card base from the IC side,
Back side contact provided on the other side of the card base at a position different from the opposite side of the recess for storage and electrically connected to a terminal on the other side of the substrate of the IC module via a conductive path An IC card comprising: a terminal.
カード基材と、
このカード基材の一面側に設けられた収納用凹部と、
基板と、この基板の一面側に設けられた表面側接触端子と、前記基板の他面側に設けられ前記表面側接触端子に電気的に接続されるICと、この前記ICに電気的に接続される裏面側接触端子とを有して構成され、前記IC側から前記カード基材の収納用凹部内に収納されるICモジュールと、
前記カード基材に設けられ、前記ICモジュールの裏面側接触端子を前記カード基材の裏面側に連通させる貫通孔と、
を具備したことを特徴とするICカード。
A card substrate;
A concave portion for storage provided on one side of the card substrate;
A substrate, a surface-side contact terminal provided on one surface side of the substrate, an IC provided on the other surface side of the substrate and electrically connected to the surface-side contact terminal, and electrically connected to the IC An IC module configured to have a back-side contact terminal to be stored in the storage recess of the card substrate from the IC side;
A through-hole provided in the card base material for communicating the back side contact terminal of the IC module with the back side of the card base;
An IC card comprising:
請求項2記載のICカードを挿入させてデータ通信する通信装置で、
前記ICカードを挿入させる装置本体と、
この装置本体内に設けられ、前記ICカードが前記装置本体内に挿入されるのに基いて前記ICカードの表面側接触端子に接触する第1の端子部、及び前記ICカードの裏面側接触端子に接触する第2の端子部と
を具備することを特徴とする通信装置。
A communication apparatus for performing data communication by inserting the IC card according to claim 2,
An apparatus body for inserting the IC card;
A first terminal portion that is provided in the apparatus main body and contacts the front surface side contact terminal of the IC card when the IC card is inserted into the apparatus main body, and the back surface side contact terminal of the IC card And a second terminal portion in contact with the communication device.
前記第1の端子部と前記第2の端子部は、前記装置本体の一内壁面に前記ICカードの挿入方向と直交する方向に沿って配設され、前記ICカードがその表側接触端子を前記装置本体の一内壁面部に沿う状態で挿入されるのに基づいて前記表側接触端子を前記第1の端子部に接触させ、前記ICカードがその裏側接触端子を前記装置本体の一内壁面部に沿う状態で挿入されるのに基づいて前記裏側接触端子を前記第2の端子部に接触させることを特徴とする請求項7記載の通信装置。   The first terminal portion and the second terminal portion are disposed on one inner wall surface of the apparatus main body along a direction orthogonal to the insertion direction of the IC card, and the IC card has the front contact terminal as the front side contact terminal. The front contact terminal is brought into contact with the first terminal portion based on being inserted in a state along one inner wall surface portion of the apparatus body, and the IC card has its back contact terminal along one inner wall surface portion of the apparatus body. 8. The communication apparatus according to claim 7, wherein the back-side contact terminal is brought into contact with the second terminal portion based on being inserted in a state. 前記第1の端子部は前記装置本体内の一内壁面部に設けられ、前記第2の端子部は前記第1の端子部に離間対向する状態で設けられ、前記ICカードがその表側接触端子を前記装置本体内の一内壁面部に沿う状態で挿入されるのに基づいて前記表側接触端子を前記第1の端子部に接触させるとともに、前記裏側接触端子を前記第2の端子部に接触させることを特徴とする請求項7記載の通信装置。   The first terminal portion is provided on one inner wall surface portion in the apparatus main body, the second terminal portion is provided in a state of being opposed to the first terminal portion, and the IC card has its front side contact terminal. The front side contact terminal is brought into contact with the first terminal part based on being inserted in a state along one inner wall surface part in the apparatus main body, and the back side contact terminal is brought into contact with the second terminal part. The communication apparatus according to claim 7. 請求項5記載のICカードを挿入させてデータ通信する通信装置で、
前記ICカードを挿入させる装置本体と、
この装置本体の一内壁面部に設けられた端子部とを具備し、
前記ICカードがその表側接触端子を前記装置本体の一内壁面部に沿う状態で挿入されるのに基づいて前記表側接触端子を前記端子部に接触させ、前記ICカードがその裏側接触端子を前記装置本体の一内壁面部に沿う状態で挿入されるのに基づいて前記裏側接触端子を前記端子部に接触させることを特徴とする通信装置。
A communication device for data communication by inserting the IC card according to claim 5,
An apparatus body for inserting the IC card;
A terminal portion provided on one inner wall surface of the apparatus main body,
The front side contact terminal is brought into contact with the terminal part based on the IC card being inserted with the front side contact terminal along one inner wall surface of the device main body, and the IC card places the back side contact terminal in the device. A communication device, wherein the back-side contact terminal is brought into contact with the terminal portion based on being inserted in a state along one inner wall surface portion of the main body.
請求項6記載のICカードを挿入させてデータ通信する通信装置で、
前記ICカードを挿入させる装置本体と、
この装置本体内の一内壁面部に前記ICカードの挿入方向と直交する方向に沿って配設された第1の端子部、及び第2の端子部とを具備し、
前記ICカードがその表側接触端子を前記装置本体の一内壁面部に沿う状態で挿入されるのに基づいて前記表側接触端子を前記第1の端子部に接触させ、前記ICカードがその裏側接触端子を前記装置本体の一内壁面部に沿う状態で挿入されるのに基づいて前記第2の端子部をカード基材の貫通孔を介して前記裏側接触端子に接触させることを特徴とする通信装置。
A communication device for data communication by inserting the IC card according to claim 6,
An apparatus body for inserting the IC card;
A first terminal portion disposed along a direction perpendicular to the insertion direction of the IC card, and a second terminal portion on one inner wall surface portion in the apparatus main body;
The front side contact terminal is brought into contact with the first terminal portion based on the IC card being inserted with the front side contact terminal along one inner wall surface of the apparatus main body, and the IC card is brought into contact with the back side contact terminal. Is inserted in a state along one inner wall surface of the apparatus main body, the second terminal portion is brought into contact with the back-side contact terminal through a through hole of the card base.
請求項6記載のICカードを挿入させてデータ通信する通信装置で、
前記ICカードを挿入させる装置本体と、
この装置本体内の一内壁面部に設けられた第1の端子部、及びこの第1の端子部と離間対向する位置に設けられた第2の端子部とを具備し、
前記ICカードがその表側接触端子を前記装置本体内の一内壁面部に沿う状態で挿入されるのに基づいて前記表側接触端子に前記第1の端子部を接触させるとともに、前記第2の端子部をカード基材の貫通孔を介して前記裏側接触端子に接触させることを特徴とする通信装置。
A communication device for data communication by inserting the IC card according to claim 6,
An apparatus body for inserting the IC card;
A first terminal portion provided on one inner wall surface portion in the apparatus main body, and a second terminal portion provided at a position facing and away from the first terminal portion;
The IC card causes the first terminal portion to contact the front side contact terminal based on the front side contact terminal being inserted in a state along one inner wall surface in the apparatus main body, and the second terminal portion. Is brought into contact with the back-side contact terminal through the through hole of the card base.
JP2007088832A 2007-03-29 2007-03-29 IC card and communication device Expired - Fee Related JP5019207B2 (en)

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JPH05342424A (en) * 1992-06-12 1993-12-24 Nippon Signal Co Ltd:The Ic card system
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JP2000227954A (en) * 1999-02-05 2000-08-15 Toppan Printing Co Ltd Hybrid ic card and ic module
JP2003216899A (en) * 2002-01-22 2003-07-31 Hitachi Cable Ltd Portable radio terminal and information transfer system using the same
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Publication number Priority date Publication date Assignee Title
JPS639590A (en) * 1986-06-30 1988-01-16 イビデン株式会社 Printed wiring board for ic card
JPH05342424A (en) * 1992-06-12 1993-12-24 Nippon Signal Co Ltd:The Ic card system
JPH11353439A (en) * 1998-06-04 1999-12-24 Dainippon Printing Co Ltd Noncontact type ic card and its manufacture, and base body for noncontact ic card
JP2000227954A (en) * 1999-02-05 2000-08-15 Toppan Printing Co Ltd Hybrid ic card and ic module
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