JPH11296633A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card easy to manufacture, improved in productivity and coping with both systems of a contact type and a non-contact type by obtaining high inductance. SOLUTION: A module substrate 6 where a contact terminal 8 and a land 7 are formed, an IC chip 5 connected to the land 7 for coping with both systems of the contact type and the non-contact type and a winding wire coil 3 connected to the land 7 are installed on a card base body 4. Since the winding wire coil 3 is connected on the module substrate 6 where the contact terminal 8 is formed, an existing contact type module substrate is used. Also, since the entire card area excluding an IC module 2 is used for a space for housing the winding wire coil 3, a wire diameter and a winding number or the shape of the winding wire coil 3 itself is freely changed corresponding to the use of the inductance and the high inductance is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an external device, an IC,
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card for transmitting information such as data or signals between cards, and relates to an IC card that can support both a contact type and a non-contact type.

[0002]

2. Description of the Related Art FIG. 7 shows a conventional IC having a contact-type terminal.
It is a top view of a card. In FIG. 7, the IC card 101
Is composed of an IC module 102 and a card base 104.

FIG. 8 is a sectional view taken along the line B, B 'in FIG. 7, and is a sectional view of a conventional contact type IC module. In FIG. 7, the IC module 102 is the IC chip 1
05, and a module substrate 106 for connecting the IC chip 105.
However, the contact terminal 108 exists on the back surface,
A through hole 109 is provided for electrical connection between the contact terminal 7 and the contact terminal 108. In addition, the IC chip 105 and the land 107 are connected by a gold wire 110 to achieve electrical conduction. Further, the IC module 102 is a mold resin 1
11 protected. In the operation method of the IC card 101, data is exchanged between the IC chip 105 and an external device by connecting the contact terminal 108 to a read / write device.

FIG. 9 is a plan view of an IC module used for a conventional non-contact type IC card. In FIG. 9, the IC module 112 includes an IC chip 115,
It is composed of a coil 113 connected to the C chip 115. The IC module 112 is embedded in the card base. Further, the operation method is, for example, the coil
Data is exchanged between the IC chip 115 and the external device by electromagnetic induction between the IC chip 115 and the coil of the read / write device. In this case, an inductance or the like for data transfer with an external device is determined in advance according to a customer's request.

For example, as shown in FIG. 10, a contact type IC module 121 and a non-contact type
IC card or patent 02724
Japanese Patent Publication No. 366 discloses an IC chip corresponding to both a contact type and a non-contact type, and Japanese Patent Application Laid-Open No. 7-239922 discloses an IC card corresponding to both a contact type and a non-contact type. The module substrate used in this IC card has a coil pattern (not shown) on the surface thereof that matches a predetermined inductance.

[0006] The inductance depends on the number of turns or the pattern shape of the coil pattern. The higher the inductance, the better the responsiveness of data transfer. However,
The number of turns or the pattern shape of the coil pattern is limited by the area of the module substrate.

[0007]

SUMMARY OF THE INVENTION The above conventional I
As shown in FIG. 10, the C card has different IC chips corresponding to the contact-type IC module or the non-contact-type IC module, so that the built-in data cannot be used in common. Even if it is supported, there is a problem that the number of turns or the pattern shape of the coil pattern is limited by the area of the module substrate, and a high inductance cannot be obtained. Accordingly, an object of the present invention is to obtain an IC card which can obtain a high inductance, is easy to manufacture and has improved productivity, and is compatible with both the contact type and the non-contact type.

[0008]

An IC card according to the present invention has a module substrate having contact terminals formed on one plane and lands formed on a plane opposite to the one plane.
An IC card which is connected to a land of a module substrate and has an IC chip having a logic circuit corresponding to both the contact type and the non-contact type on a card base, wherein the IC chip is connected to a land of the module substrate. Are provided with a winding coil for establishing electrical continuity with a logic circuit corresponding to.

Also, a contact terminal is formed on one plane,
A card substrate is provided with a module substrate forming a land on a plane opposite to one of the planes, and an IC chip connected to the land of the module substrate and having logic circuits corresponding to both a contact type and a non-contact type. The IC card includes a winding coil connected in a flip-chip manner by a land of the module substrate and an IC chip.

[0010] Further, a contact board is formed on one plane, and a land is formed on a plane opposite to the one plane.
In an IC card in which an IC chip having a logic circuit corresponding to both the contact type and the non-contact type is provided on a card base, the module substrate has substantially the same plane area as the card base and a surface on which lands are formed. And a coil pattern for exchanging data between the IC chip and an external device by electromagnetic induction.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an IC card according to the first embodiment. 1, an IC card 1 includes an IC module 2, a winding coil 3, a card base 4, and a card cover 12. This IC card 1
Is approximately 86mm long, 54mm wide and 0.8m thick
m. FIG. 2 is a sectional view taken along line A and A 'in FIG. 1, and is a sectional view of the IC module 2 used for this IC card. FIG. 3 is a plan view of the IC module 2 as viewed from the direction of the IC chip 5. 2 and 3, the IC module 2 includes an IC chip 5 having logic circuits corresponding to both the contact type and the non-contact type, and a module substrate 6 for connecting the IC chip 5 to the module.
Lands 7 and 7a are provided on the front surface, and contact terminals 8 are provided on the back surface. Through holes 9 are provided for electrical connection between the lands 7a and the contact terminals 8. The land 7 is connected with the winding coil 3.

The winding coil 3 is formed by winding a nichrome wire having a wire diameter of about 0.5 mm in the lateral direction so as not to be thickened about 10 to 20 times. The tip is linearly extended to facilitate soldering to the land 7. However, the wire diameter and the number of turns or the shape of the winding coil 3 itself can be changed according to the use of the inductance. FIG. 4 is a plan view of such a winding coil. In FIG. 4, the winding coil 3a has a rectangular shape, and the tips 3b and 3c are linearly extended to facilitate soldering to the land.

The land 7 connected to the winding coil 3 does not need to be electrically connected to the contact terminal 8. However, it is necessary to establish electrical conduction with the non-contact type logic circuit of the IC chip 5. The land 7a must be electrically connected to the contact-type logic circuit of the IC chip 5. Also,
The IC chip 5 and the land 7 are connected by a gold wire 10 to achieve electrical conduction. The IC chip 5 is protected by the mold resin 11. The mold resin 11 also has a function of bonding the IC module 2 to the card base 4. Further, the card cover 12 is bonded to the card base 4.

The winding coil 3 and the IC module 2 may be installed at predetermined positions of the card base 4 and may be integrally molded instead of the card cover 12 by injection molding or transfer molding.

According to the first embodiment, since the winding coil 3 is connected to the module substrate 6 on which the contact terminals 8 are formed, an existing contact-type module substrate can be used, and the winding coil 3 is housed. As the space can use the entire card area excluding the IC module 2, the wire diameter and the number of turns or the shape of the winding coil 3 itself can be freely changed according to the application of the inductance, and a high inductance can be obtained. It is possible.

Embodiment 2 FIG. 5 is a sectional view of an IC module according to the second embodiment. In FIG. 5, this I
The C module 22 has an IC chip 25 provided with logic circuits corresponding to both the contact type and the non-contact type. By providing bumps 25 a on connection pads of the IC chip 25, the winding coil 23 is mounted on the module substrate. 26 and can be connected to each other via a land 27. The connection between the bump 25a and the winding coil 23 and the connection between the bump 25a and the land 27 are made by a flip chip method. For example, connection can be made by using a solder, a conductive paste, an anisotropic conductive sheet, or the like. In addition, contact terminals 28 are provided on the surface of the module substrate 25 opposite to the surface of the lands 27 so as to achieve electrical continuity with each other.

According to the second embodiment, by using the flip-chip method, the lands and the winding coils connected to the contact terminals, which are the existing contact-type module substrates, can be connected to the IC chip collectively. It has a simple structure, is easy to manufacture, and improves productivity.

Embodiment 3 FIG. 6 is a sectional view of an IC card according to the third embodiment. In FIG. 6, this IC card 31 is formed by, for example, copper foil etching instead of a winding coil, and provided with a coil pattern 33a for exchanging data between an IC chip 35 and an external device by electromagnetic induction. A module substrate 36, which is substantially the same as the base 34, and an IC chip 35 provided with a logic circuit corresponding to both the contact type and the non-contact type are mounted on the module substrate 3.
Connect to 6. An IC card is formed by attaching the module substrate 36 to the card base 34. In other words, the lands 33 which need to be connected to the contact terminals 38 are connected via the through holes 39, and the coil pattern 33a, which replaces the winding coil, is formed at the same time by copper foil etching, thereby reducing costs. Also, since the module board has a structure exposed on the card surface,
Use a material that can be a card base material such as PET.

According to the third embodiment, since the lands and the coils are formed by etching or the like, no labor for connection is required, and the material of the module substrate becomes a part of the card base. You can get a card. Further, since the area of the module substrate 36 is large, the number of turns or the pattern shape of the coil pattern can be freely changed, and a high inductance can be obtained.

[0020]

The IC card according to the present invention is connected to a module substrate having contact terminals formed on one plane and lands formed on a plane opposite to the one plane, and a land on the module substrate. In an IC card in which an IC chip having a logic circuit corresponding to both a contact type and a non-contact type is provided on a card base, a logic circuit corresponding to the non-contact type of the IC chip is connected to a land of a module substrate, By providing a winding coil for conducting, an existing contact-type module substrate can be used, and a space for accommodating the winding coil can use the entire card area excluding the IC module. The wire diameter and number of turns or the shape of the winding coil itself can be freely changed, and the contact method with high inductance and non- IC that may correspond to both systems of touch type
You can get a card.

Further, a contact terminal is formed on one plane,
A card substrate is provided with a module substrate forming a land on a plane opposite to one of the planes, and an IC chip connected to the land of the module substrate and having logic circuits corresponding to both a contact type and a non-contact type. In the IC card, the land and the winding coil connected to the contact terminal which is the existing contact type module substrate are collectively provided by providing the land of the module substrate and the winding coil connected by the flip chip method by the IC chip. , An IC card which has a simple structure, is easy to manufacture and has improved productivity, and which can be used in both a contact type and a non-contact type.

Further, a module substrate having contact terminals formed on one plane and lands formed on a plane opposite to the one plane; and a land connected to the module substrate,
In an IC card in which an IC chip having a logic circuit corresponding to both the contact type and the non-contact type is provided on a card base, the module substrate has substantially the same plane area as the card base and a surface on which lands are formed. A coil pattern for exchanging data between an IC chip and an external device by electromagnetic induction is provided on the same surface as the space used for etching the coil pattern. Therefore, the number of turns or the shape of the coil pattern itself can be freely changed according to the application of the inductance, and an IC card that can support both the contact type and the non-contact type with a high inductance can be obtained.

[Brief description of the drawings]

FIG. 1 is a plan view of an IC card according to Embodiment 1 of the present invention.

FIG. 2 is a sectional view taken along line A and A 'of the IC module according to the first embodiment of the present invention.

FIG. 3 is a plan view of the IC module according to the first embodiment of the present invention.

FIG. 4 is a plan view of the winding coil according to the first embodiment of the present invention.

FIG. 5 is a sectional view of an IC module according to a second embodiment of the present invention.

FIG. 6 is a sectional view of an IC card according to Embodiment 3 of the present invention.

FIG. 7 is a plan view of a conventional IC card having a contact-type terminal.

FIG. 8 is a sectional view of a conventional contact type IC module taken along line B and B '.

FIG. 9 shows an IC used for a conventional non-contact type IC card.
It is a top view of a module.

FIG. 10 is a plan view of a conventional IC card in which a contact-type IC module and a non-contact-type IC module are put into one card.

[Explanation of symbols]

Reference Signs List 3 winding coil 4 card base 6 module substrate 7 land 7a land 8 contact terminal 23 winding coil 25 IC chip 26 module substrate 27 land 28 contact terminal 33 land 33a coil pattern 36 module substrate 38 contact terminal

Claims (3)

[Claims] A module substrate that forms contact terminals on one plane and forms a land on a plane opposite to the one plane; and a land connected to the module substrate.
An IC card having an IC chip having a logic circuit corresponding to both a contact type and a non-contact type on a card base, wherein the logic circuit is connected to a land of the module substrate and corresponds to the non-contact type of the IC chip. An IC card comprising a winding coil for achieving electrical continuity. 2. A module substrate, wherein a contact terminal is formed on one plane and a land is formed on a plane opposite to the one plane, and a land is connected to the module substrate.
An IC card in which an IC chip having a logic circuit corresponding to both a contact type and a non-contact type is provided on a card base, comprising a land on the module substrate and a winding coil connected in a flip-chip manner by the IC chip. An IC card, characterized in that: 3. A module substrate that forms a contact terminal on one plane and forms a land on a plane opposite to the one plane, and is connected to the land of the module substrate.
An IC card in which an IC chip having a logic circuit corresponding to both a contact type and a non-contact type is provided on a card base, wherein the module substrate has substantially the same plane area as the card base, and the land is formed. A coil pattern for exchanging data between the IC chip and an external device by electromagnetic induction on the same surface as the selected surface.
C card.