JP2001101376A - Ic card of contact/non-contact sharing type - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card of a contact/non-contact sharing type preventing non-contact communication from becoming impossible due to malfunction. SOLUTION: This IC card is provided with a terminal substrate 12 for forming plural contact terminals C1 to C8 to transfer data in contact with an external device on an insulated substrate 12b, a communication mode selecting means 12a for switching a contact communication mode and a non- contact communication mode with an input signal to the communication mode selecting terminal C1 in the terminals C1 to C8, and a non-contact communication antenna 13 which is connected to a side opposite to the contact terminals C2 to C4 and C6 to C8 except for the terminal C1 being a surface on a side opposite to the terminals C1 to C8 of the substrate 12 and transfers data without contact.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a contact communication mode,
The present invention relates to a contact / contactless shared type IC card which switches a contactless communication mode to exchange data with an external device.

[0002]

2. Description of the Related Art IC cards can be classified into contact IC cards that perform data communication through contact terminals and non-contact IC cards that perform data communication by electromagnetic induction through an antenna coil. Contact type IC cards are mainly
The contactless IC card is often used for payment, while the contactless IC card is often used mainly for gate access management of transportation systems. In recent years, a contact / non-contact type IC chip having both the function of a contact type IC card and the function of a non-contact type IC card in one IC chip has been developed. Has begun.

FIG. 3 is a diagram showing a conventional contact / non-contact common type IC card manufacturing method 1, and FIG.
It is a figure which shows the non-contact common use type IC card manufacturing method 2. 2. Description of the Related Art Conventionally, methods for manufacturing a contact / non-contact type IC card include the following methods.

[0004] In a manufacturing method 1, an IC mounting substrate 12 having an antenna coil 13 and a contact terminal C is mounted on a substrate 1 such as PVC.
4 (FIG. 3 (A)), and laminating into a card (FIG. 3 (B)).

In a manufacturing method 2, a card in which an antenna coil 13 is embedded is manufactured (FIG. 4A), and the card is
C is formed by machining or the like to form a loading portion for loading the IC mounting substrate 12, and at the same time, expose the coil terminals 13a and 13b (FIG. 4B), and mount the IC chip 12a.
Mounting substrate 12 (COT (Chip on Tape),
Antenna connection terminals 12c and 12d provided in a COB (Chip on Board);
3a and 13b are connected using a conductive adhesive such as solder, and an insulating adhesive is applied to areas other than the antenna connection terminals 12c and 12d (FIG. 4 (C)) to perform bonding and contact. / Make contactless shared IC card (Fig. 4
(D)).

[0006] IC used in manufacturing method 1 and manufacturing method 2
The mounting substrate 12 has the contact terminals C1 to C8 patterned on the front surface and the coil wiring 13 (manufacturing method 1) on the rear surface.
) Or antenna connection terminals 12c and 12d (in the case of manufacturing method 2). In general, a contact / non-contact type IC card is provided with means for selecting whether to perform contact or non-contact communication, and a specific terminal voltage value transmitted through the contact terminal or the non-contact terminal is provided. Is switched between the contact communication mode and the non-contact communication mode.

[0007]

FIG. 5 shows a conventional contact / switch.
FIG. 6 is an enlarged cross-sectional view of an IC mounting board mounted on a non-contact type IC card, and FIG. 6 is a plan view thereof. The IC mounting board 12 in the contact / non-contact type IC card has the contact terminals C (C1 to C8) on the front surface and the coil terminals 1 on the back surface.
In order to connect the terminals 3a and 13b, a capacitor is formed between the contact terminal C and the coil terminals 13a and 13b via the insulating substrate 12b. During non-contact communication, the reader
An AC signal is transmitted to the coil terminals 13a and 13b by electromagnetic induction between the writer-side coil and the card-side coil 13, and the AC signal is transmitted to the contact terminal C via the insulating substrate 12b. When the voltage of the contact terminal C generated by the AC signal applied to the antenna coil 13 exceeds a specific value, the contact / non-contact type IC enters the contact communication mode, and malfunctions such that the non-contact communication cannot be performed. There was a problem that would occur.

[0008] An object of the present invention is to provide a contact / non-contact type IC card which prevents non-contact communication from being disabled due to malfunction.

[0009]

The present invention solves the above-mentioned problems by the following means. In addition, in order to make it easy to understand, description is given with reference numerals corresponding to the embodiment of the present invention, but the present invention is not limited to this. In order to solve the above-mentioned problem, the invention according to claim 1 includes a plurality of contact terminals (C1 to C1) that perform data transfer by contacting with an external device.
8) is formed on an insulating substrate (12b).
2) a communication mode selection means (12a) for switching between a contact communication mode and a non-contact communication mode according to an input signal to a communication mode selection terminal (C1) among the contact terminals (C1 to C8); (12) Contact terminal (C1
To C8) and the contact terminals (C2 to C4, C6 to C2) other than the communication mode selection terminal (C1).
8) is a contact / non-contact type IC card including a non-contact communication antenna (13) connected to the opposite side of (8) and exchanging data in a non-contact manner.

According to a second aspect of the present invention, in the contact / non-contact type IC card according to the first aspect, the non-contact communication antenna (13) is used for future use in the contact terminals (C1 to C8). Contact / non-contact type IC connected to the opposite side of the spare terminals (C4, C8) provided
Card.

[0011] The invention of claim 3 is claim 1 or claim 2.
Wherein the non-contact communication antenna (13) is provided with the contact terminals (C1 to C1).
A contact / non-contact type IC card characterized by being connected by terminals (13a, 13b) smaller than C8).

[0012]

Embodiments of the present invention will be described below in more detail with reference to the drawings. (Embodiment) FIG. 1 is a plan view showing an embodiment of a contact / non-contact type IC card according to the present invention. FIG. 2 is an enlarged view of an IC mounting board used in the present embodiment.
2A is a front view, and FIG. 2B is a plan view. Note that the same reference numerals are given to portions that perform the same functions as in the above-described conventional example. The contact / non-contact type IC card 10 includes a card base material 11, an IC mounting substrate 12, an antenna coil 13, and a protective layer 14.

The card substrate 11 is a substrate serving as a carrier of the contact / non-contact type IC card 10. In consideration of heat resistance, strength, rigidity, etc., the card base material 11 is made of nylon,
Cellulose diacetate, cellulose triacetate,
It can be composed of a single or combination of materials appropriately selected from resins such as vinyl chloride, polystyrene, polyethylene, polypropylene, polyester, polyimide and polycarbonate, and materials such as paper and impregnated paper.

The IC mounting board 12 is a board for holding an IC chip 12a for storing data to be transmitted to and received from an external device (see FIG. 2). The IC mounting board 12 is formed by laminating copper foil on both sides of a glass epoxy board 12b, patterning the contact terminals C1 to C8 on the front surface by etching, and providing the antenna connection terminals 12c and 12d on the back surface.

The arrangement of the contact terminals C1 to C8 is standardized and is as follows. C1 is a VCC terminal of the circuit voltage. C2 is a reset signal RST terminal. C3 is a CLK terminal of a clock signal. C
4 is an RFU (Reserved) for future use.
for Future Use) terminal. C5 is
This is the ground GND terminal. C6 is a VPP terminal for the write supply voltage. C7 is the data input / output signal I
/ O terminal. C8 is an RFU for future use
(Reserved for Future Use)
Terminal. The VPP terminal (C6) is connected to the memory E
It is used when the write voltage VPP is different from the circuit voltage VCC, such as a PROM,
Not used for S-RAM. In this embodiment, as will be described later, since it is an EEPROM, the VPP terminal (C
6) is not used.

The IC chip 12a is a part that stores data exchanged with an external device and operates as communication mode selection means for performing a communication mode switching process between a contact communication mode and a non-contact communication mode. IC chip 1
2a includes an EEPROM for storing programs and data for performing such processing. In the present embodiment, the IC chip 12a uses the VCC terminal (C1) as a communication mode selection terminal for switching between the contact communication mode and the non-contact communication mode depending on the voltage value, and the voltage value of the VCC terminal (C1) is a specific value. If the voltage value is exceeded, switch to the contact communication mode. Antenna connection terminal 12c,
12d is a terminal for connecting the antenna coil 13.
The antenna connection terminals 12c and 12d are RFU terminals (C
4, C8).

The antenna coil 13 is a circuit for transmitting and receiving data without contacting an external device, and is formed on the card substrate 11. The antenna coil 13 can be formed by a conductive printing method such as screen printing, offset printing, gravure printing, or an etching method. The antenna coil 13 is printed in a shape as shown in FIG.
a and 13b. Coil terminals 13a, 13b
Are connected to the antenna connection terminals 12c and 12d. Antenna connection terminals 12c, 12d and / or coil terminal 1
3a and 13b are smaller than the contact terminals C1 to C8, and are desirably as small as possible. By doing so, the contact terminals C1 to C8 and the antenna connection terminals 12
This is because the electrostatic coupling with c and 12d is weakened and the contact terminal voltage generated by the AC signal generated at the coil end is reduced, so that the malfunction of switching to the non-contact communication mode can be reduced.

The antenna coil 13 is formed by printing with a conductive ink, for example, an ink using a silver paste containing 70 to 80% of silver powder using a thermoplastic resin or a thermosetting resin as a binder. I do. In addition, the resin binder (or the ink vehicle), in addition to the above,
Using butyral resin, vinyl chloride / vinyl acetate copolymer resin, urethane resin, polyester resin, cellulose resin, acrylic resin, styrene / maleic acid copolymer resin, epoxy resin, etc., if necessary, rubber such as nitrile rubber A resin to which a system resin or a urethane elastomer is added can also be used. Further, in consideration of heat resistance, a resin having a high glass transition temperature (Tg) such as polyamide, polyimide, or polyethersulfone, or a system in which Tg is increased by a curing reaction can be used. Surfactants, silane coupling agents, plasticizers, waxes, silicone oils, and the like may be added to the resin or ink vehicle as described above, if necessary. In addition, as the conductive ink, in addition to the silver paste, a paste containing copper powder or a carbon filler in the same binder resin as described above, or a paste in which silver powder or copper powder is mixed with a carbon filler, or the like can be used. .

The protective layer 14 is a layer formed over the entire surface of the card base 11 and protects the antenna coil 13. The protective layer 14 can be manufactured using the same material as the card base material 11.

According to the present embodiment, the coil terminals 13a,
13b are terminals C4 and C8 other than the communication mode selection terminal C1.
Since the signal (noise) applied to the communication mode selection terminal C1 via the insulating substrate 12b can be reduced, malfunction of the IC can be prevented. Further, by minimizing the size of the coil terminals 13a and 13b, malfunctions can be further reduced.

(Modifications) Various modifications and changes are possible without being limited to the embodiment described above, and they are also within the equivalent scope of the present invention. For example, in the above embodiment, the VCC terminal (C1) is used as the communication mode selection terminal, and the coil terminals 13a and 13b are connected to the RFU terminal (C4,
C8), but other terminals C2, C3,
Even if they are connected under C6 and C7, their terminals C2 and C7
3, C6, and C7 are not used for selecting the communication mode, and thus the same effect can be obtained. In addition, VCC terminal (C
Terminals other than 1) (RST terminal (C2), CLK terminal (C
3) When an IC having the I / O terminal (C7)) as the communication mode selection terminal is used, a similar effect can be obtained by connecting the coil terminal to the back surface of the terminal other than the communication mode selection terminal. . In any case, since the RFU terminals (C4, C8) and the VPP terminal (C6) are not used, if the coil terminals 13a and 13b are connected under these terminals, the communication mode selection terminal becomes Regardless of the terminal, the same effect can be obtained.

[0022]

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples. (Example) A glass epoxy substrate 12b having a thickness of 75 μm
A copper foil having a thickness of 35 μm is laminated on both sides of the RFU terminals, and the contact terminals C1 to C8 are patterned on the surface by etching, and the antenna connection terminals 12c and 12d are provided on the back surfaces of the RFU terminals (C4 and C8), and the coil terminals 13a and 13b
Connected. 13V at both ends of coil terminals 13a and 13b
When a pp AC signal was applied, the voltage between the VCC and GND terminals was 0.4 Vpp.

COMPARATIVE EXAMPLE In the same manner as in the example, a 35 μm thick copper foil was laminated on both sides of a glass epoxy substrate 12 b having a thickness of 75 μm, and the contact terminals C 1 to C 8 were patterned on the surface by etching. And VCC
Antenna connection terminals 12c and 12d are provided on the back surface of the terminal (C1) and the GND terminal (C5), and the coil terminals 13a and 13d are provided.
b was connected. 13 at both ends of the coil terminals 13a and 13b.
When a Vp-p AC signal was applied, the voltage between the VCC and GND terminals was 1.2 Vp-p.

As described above, in this embodiment, as compared with the comparative example, the voltage between the VCC and GND terminals can be reduced, so that IC malfunction during non-contact communication can be reduced.

[0025]

As described in detail above, according to the first aspect of the present invention, the contactless communication antenna is a contact terminal other than the communication mode selection terminal on the surface opposite to the contact terminal surface of the terminal board. , The signal (noise) applied to the communication mode selection terminal can be reduced, so that malfunction of the IC can be prevented.

According to the second aspect of the present invention, since the non-contact communication antenna is connected to the opposite side of the spare terminal for future use among the contact terminals, which terminal is the communication mode selection terminal? Irrespective of the above, malfunction of the IC can be prevented.

According to the third aspect of the present invention, since the non-contact communication antenna is connected by a terminal smaller than the contact terminal, a signal (noise) applied to the communication mode selection terminal is provided.
Can be further reduced, so that IC
Can be prevented from malfunctioning.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a contact / non-contact type IC card according to the present invention.

FIG. 2 is an enlarged view of an IC mounting board used in an embodiment of a contact / non-contact type IC card according to the present invention.

FIG. 3 is a diagram showing a conventional contact / non-contact type IC card manufacturing method 1;

FIG. 4 is a diagram showing a conventional contact / non-contact type IC card manufacturing method 2;

FIG. 5 is an enlarged cross-sectional view of an IC mounting substrate mounted on a conventional contact / non-contact type IC card.

FIG. 6 is a plan view of an IC mounting substrate mounted on a conventional contact / non-contact type IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Contact / non-contact type IC card 11 Card base material 12 IC mounting substrate 12a IC chip 12b substrate 12c, 12d Antenna connection terminals C, C1 to C8 Contact terminals 13 Antenna coils 13a, 13b Coil terminals 14 Protective layer

Claims (3)

[Claims] 1. A terminal board for forming a plurality of contact terminals on an insulative board for transmitting and receiving data in contact with an external device, and a contact communication mode by an input signal to a communication mode selection terminal among the contact terminals. A communication mode selecting means for switching a non-contact communication mode; and a surface opposite to the contact terminal surface of the terminal board, connected to the other side of the contact terminal other than the communication mode selection terminal, for non-contact data transfer. A contact / contactless shared type IC card including a contactless communication antenna for performing the following. 2. A contact / non-contact type I according to claim 1.
In the C card, the non-contact communication antenna is connected to a side of the non-contact communication antenna opposite to a spare terminal for future use among the contact terminals. 3. The contact / non-contact type IC card according to claim 1, wherein the non-contact communication antenna is connected by a terminal smaller than the contact terminal. / Non-contact type IC card.