JP2003006602A - Method for forming rf-id media - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming RF-ID media, with which an electric connection is not cut off even when external forces are concentrated to a conductive part for connection by strongly conducting and bonding an interposer with packaged IC chip and an antenna holder. SOLUTION: A base material is provided with a conductive pattern equipped with the conductive part for connection at least, the interposer with packaged IC chip is formed by packaging an IC chip in the conductive part for connection, and the antenna holder is formed by providing the base material with the conductive pattern composed of an antenna conducting part and the conductive part for connection positioned at the terminal part of this antenna conducting part. Then, an insulating adhesive agent is applied to an area except the conductive part for connection, the interposer and the antenna holder are overlapped so that the respective conductive parts for connection can face each other, and the interposer and the antenna holder are conducted and bonded by using the insulating adhesive agent.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to RF-ID (Ra
dio Frequency IDentificat
ion) media forming method, and more particularly, to a RF-ID media forming method used for thin information transmission / reception type recording media such as non-contact IC tags.

[0002]

2. Description of the Related Art Recent methods for forming an RF-ID medium are those in which an IC chip is directly mounted on an antenna.
There is a tendency to adopt the interposer method. In this method, a conductive portion for connection corresponding to an antenna conductive portion (land portion) on the RF-ID medium substrate is formed on a small sheet,
Further, an IC chip mounted (interposer) is used.

A conventional method of forming an RF-ID medium (for example, Japanese Patent Laid-Open No. 2001-35989) will be described with reference to FIGS. In this method, the antenna circuit is IC
The structure is divided into a chip mounting interposer and an antenna holder, and the IC chip mounting interposer and the antenna holder are formed in advance, and an antenna circuit body is formed using them. FIG. 7 shows a process of forming one of the IC chip mounting interposers A1. First, a base material 1 having a predetermined size is prepared so as to cover a terminal portion of an antenna holder described later (a). IC chip mounting conductive part 2 and connection conductive part 3
A pair of conductive patterns 4 in which and are continuous are provided (B). After that, the IC chip 5 is mounted so as to straddle the conductive portion 2 for mounting the IC chip to form an IC chip mounting interposer A1 (c), and a conductive adhesive is applied to the entire one surface on which the IC chip 5 is mounted. Apply 6 (d).

FIG. 8 shows a process of forming the other antenna holder B1. A base material 7 having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive portion 8 are provided on the base material 7. A conductive pattern 10 including a conductive portion 9 for connection, which is a terminal portion, is provided at the end portion of (2), and the antenna holder B1 is formed by this. The connecting conductive portion 9 is provided so as to correspond to the connecting conductive portion 3 of the IC chip mounting interposer A1. Reference numeral 11 is an insulating portion. The IC chip mounting interposer A1
And the antenna holder B1 for connecting the conductive portions 3,
The IC chip mounting interposer A1 and the antenna holder B1 are bonded to each other by superimposing the conductive adhesive 6 so as to face each other, and the RF-ID medium C1 shown in FIG. 9 is obtained.

RF by such an interposer system
-The ID medium forming method has advantages such as improvement in yield and support for small-lot production of a wide variety of products, but the RF-ID medium C1 formed by the interposer method has an external force applied to the conductive portions 3 and 9 for connection. There is a problem that electrical connection may be interrupted due to concentration, and in particular, when the base materials 1 and 7 are thin paper or the like having low strength and rigidity, the interposer A1 is peeled off.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to solve the problems of the prior art, and to use the interposer system for RF-ID.
Even if a medium is formed, the electrical connection is interrupted when an external force is concentrated on the conductive portions 3 and 9 for connection, and even if the base materials 1 and 7 are thin paper or the like having low strength and rigidity, the interposer A1 is An object of the present invention is to provide a method for forming an RF-ID medium that does not come off.

[0007]

Means for Solving the Problems As a result of intensive studies to solve the above-mentioned problems, the inventors of the present invention applied an insulating adhesive to the area excluding the conductive portion for connection, and possessed an IC chip mounting interposer and an antenna. The inventors have found that the problem can be solved by making the conductive portions of the body face to face each other and conductively joining the two with an insulating adhesive, and completed the present invention.

That is, the RF- according to claim 1 of the present invention.
An ID medium is formed by providing a conductive pattern having at least a conductive portion for connection on a base material, mounting an IC chip on the conductive portion for connection to form an IC chip mounting interposer, an antenna conductive portion and this antenna. An antenna holder is formed by providing a conductive pattern composed of a conductive portion for connection located at an end of the conductive portion on a base material, and an insulating adhesive is applied to a region excluding the conductive portion for connection, and the interposer and the antenna are provided. It is characterized in that the holding body is superposed so that the conductive portions for connection face each other, and the interposer and the antenna holding body are conductively joined by using the insulating adhesive.

The method for forming an RF-ID medium according to a second aspect of the present invention is the method for forming an RF-ID medium according to the first aspect, in which a conductive adhesive is further applied to the conductive portion for connection to provide insulation. It is characterized in that the interposer and the antenna holder are electrically connected to each other by using an adhesive and a conductive adhesive.

According to the method of the present invention, an insulating adhesive is applied to a region excluding the conductive portion for connection, or a conductive adhesive is further applied to the conductive portion for connection, whereby the interposer and the antenna holder are attached. The IC chip mounting interposer is formed by stacking the conductive parts for connection so that they face each other, and using the insulating adhesive in the area excluding the conductive parts for connection or the conductive adhesive for the conductive parts for connection. Since the antenna holder and the antenna holder are conductively joined together, good continuity can be maintained and the joint becomes strong. Furthermore, even if an external force is concentrated on the conductive part for connection, the stress is dispersed on the non-conductive part, so the electrical connection is interrupted, and the interposer peels off even if the base material is thin paper or something with low strength and rigidity. There is no end.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a process of forming one of the IC chip mounting interposers A2. First, a base material 1 having a predetermined size is prepared so as to extend over a terminal portion of an antenna holder B2 described later (a). 1 is provided with a pair of conductive patterns 4 in which a conductive portion 2 for mounting an IC chip and a conductive portion 3 for connection are continuous (b). Thereafter, the IC chip 5 is mounted so as to straddle the conductive portion 2 for mounting the IC chip (C), and then the mounted IC chip 5 is sealed with the sealant 13.
After sealing with (d), the insulating adhesive 12 is applied to the entire area excluding the conductive portion 3 for connection and the conductive adhesive 14 is applied to the conductive portion 3 for connection to mount the IC chip mounting interposer A2.
To form (e).

FIG. 2 shows a process of forming the other antenna holder B2. A base material 7 having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive portion 8 are provided on the base material 7. A conductive pattern 10 including a conductive portion 9 for connection, which is a terminal portion, is provided at the end portion of (2), and thereby the antenna holder B2 is formed. The connecting conductive portion 9 is provided so as to correspond to the connecting conductive portion 3 of the IC chip mounting interposer A2. And I
C chip mounting interposer A2 and antenna holder B2
And the conductive parts 3 and 9 for connection are made to face each other, and the IC chip mounting interposer A2 and the antenna holder B2 are conductively bonded by using the insulating adhesive 12 and the conductive adhesive 14 to obtain the structure shown in FIG. RF-ID media C2 shown
Is obtained.

In this embodiment, the insulating adhesive 12 and the conductive adhesive 14 are used as the IC chip mounting interposer A2.
However, the insulating adhesive 12 and the conductive adhesive 14 may be applied to corresponding portions of the antenna holder B2 side, or the IC chip mounting interposer A2 side and the antenna holder B2 side. May be applied to both.

FIG. 4 shows the RF-ID medium C shown in FIG.
It is a cross-sectional explanatory view of the II line of FIG. Since the IC chip mounting interposer A2 and the antenna holder B2 are conductively joined by the insulating adhesive 12 and the conductive adhesive 14, good electrical continuity can be maintained and the joining can be strengthened. Even if an external force is concentrated on the conductive parts 3 and 9, the electrical connection is not interrupted, and the interposer A2 is not peeled off even if the base materials 1 and 7 are thin paper or the like having low strength and rigidity.

FIG. 5 is an explanatory diagram of another IC chip mounting interposer A3 used in the method of the present invention. In steps (a) to (d) shown in FIG. 1, the mounted IC chip 5 is sealed with a sealant 13, and then the conductive portion 3 for connection and the sealant 1 are used.
3, the IC chip mounting interposer A3 is formed by applying the insulating adhesive 12 to the entire area excluding the IC chip 5. Using this IC chip mounting interposer A3, as shown in FIG. 3, the IC chip mounting interposer A3 and the antenna holder B2 are conductively joined by the insulating adhesive 12 to form the RF-ID medium C2 shown in FIGS. RF-ID media having similar performance can be formed.

FIG. 6 is an explanatory diagram of another IC chip mounting interposer A4 used in the method of the present invention. In steps (a) to (d) shown in FIG. 1, after the mounted IC chip 5 is sealed with a sealing agent 13, a conductive adhesive 14 is applied to the conductive portion 3 for connection, and the sealing agent 13, An insulating adhesive 12 is applied onto the IC chip 5 to form an IC chip mounting interposer A4. This IC chip mounting interposer A4
3, the IC chip mounting interposer A4 and the antenna holder B2 are conductively joined by the insulating adhesive 12 and the conductive adhesive 14 as shown in FIG. 3 and the RF-ID medium C2 shown in FIGS. RF with similar performance
-It is possible to form ID media.

In the embodiment shown in FIGS. 5 and 6, the insulating adhesive 12 and the conductive adhesive 14 are applied to the IC chip mounting interposers A3 and A4 side, but the insulating adhesive 1
2 or the conductive adhesive 14 may be applied to the corresponding positions on the antenna holder B2 side, or may be applied to both the IC chip mounting interposers A3, 4 side and the antenna holder B2 side.

The material of the base material 1 or the base material 7 used in the present invention is a woven cloth, a non-woven cloth, a mat, a paper or a combination thereof made of an inorganic or organic fiber such as glass fiber, alumina fiber, polyester fiber or polyamide fiber. Or a composite substrate formed by impregnating these with resin varnish, a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate, an ethylene / vinyl alcohol copolymer group Material,
Polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin substrate, polyether sulfone resin Select from known plastic substrates such as substrates, or those that have undergone surface treatment such as corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma treatment and ozone treatment. Can be used.

The IC chip mounting interposer and the antenna holder may be formed of the same base material or different base materials. Further, the IC chip mounting interposer and the antenna carrier may not be formed one by one, but may be formed in plural (and may be of the same kind or different kinds).

The formation of the conductive pattern 4 on the IC chip mounting interposer and the formation of the conductive pattern 10 on the antenna holder can be carried out by known methods. For example, a method in which a conductive paste is printed by screen printing or inkjet printing to be dried and fixed, attachment of a coated or uncoated metal wire, etching, dispersion, metal foil attachment, direct vapor deposition of metal, metal vapor deposition film transfer, Examples thereof include formation of a conductive polymer layer, but are not limited thereto.

Further, in the antenna holder, the conductive pattern 10 is not necessarily limited to one side, but may be formed on the back side as well as on the inner layer as long as the connection which finally functions as the antenna is guaranteed. Further, it may be an antenna in which they are multiplexed. Further, it may be a pattern in which other lines are crossed by jumper lines as needed. It may be coated to protect the formed antenna.

The mounting of the IC chip in the process of forming the IC chip mounting interposer includes wire bonding (WB) and anisotropic conductive film (AC).
F), conductive paste (ACP), insulating resin (NCP),
The connection can be made by a known method such as using an insulating film (NCF) or a cream solder ball. If necessary, the connection portion may be protected and reinforced with a known underfill material or potting material.

The insulating adhesive used in the present invention is not particularly limited as long as it has an insulating property and can be used for the above-mentioned adhesion. Specific examples thereof include adhesives, hot melt type thermoplastic adhesives, thermosetting adhesives, and photocurable adhesives. Specific examples of the adhesive or the adhesive include, for example,
Natural rubber (NR), styrene / butadiene copolymer rubber (SBR), polyisobutylene (PIB), isobutylene / isoprene copolymer (butyl rubber, IIR), isoprene rubber, butadiene polymer (BR), styrene / butadiene copolymer (HSR), styrene / isoprene copolymer, styrene / isoprene / styrene block polymer (SIS), styrene / butadiene / styrene block polymer (SBS), chloroprene rubber (CR),
Butadiene / acrylonitrile copolymer rubber (NBR),
Butyl rubber, acrylic polymer, vinyl ether polymer, polyvinyl alcohol (PVA), polyvinyl butyral (PVB), polyvinyl pyrrolidone (PV
P), vinylpyrrolidone / vinyl acetate copolymer, dimethylaminoethyl / methacrylic acid / vinylpyrrolidone copolymer, polyvinylcaprolactam, polyvinylpyrrolidone, maleic anhydride copolymer, silicone-based adhesive (polyvinylsiloxane), polyurethane, poly Vinyl chloride, gelatin, shellac, gum arabic, rosin, rosin ester, ethyl cellulose, carboxymethyl cellulose, paraffin, tristearin, polyethylene, polypropylene, acrylic resin, vinyl resin,
One or a mixture of two or more of polyisobutene, polybutadiene, epoxy resin, phenol resin, polyurethane resin, polyester, polyamide, silicone, polystyrene, melamine resin and the like can be mentioned. To these, softening agents such as liquid polybutene, mineral oil, liquid polyisobutylene, and liquid polyacrylic acid ester, and tackifiers such as rosin, rosin derivative, polyterpene resin, terpene phenol resin, and petroleum resin can be added.

Specific examples of the photocurable adhesive include, for example, acrylate compounds, methacrylate compounds, propenyl compounds, allyl compounds, vinyl compounds, acetylene compounds, unsaturated polyesters, epoxy poly (meth) acrylates, poly (meth) ) Acrylate polyurethanes, polyester polyol poly (meth) acrylates, polyether polyol poly (meth) acrylates, phenoxyethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, styrene,
Examples thereof include one or a mixture of two or more kinds of α-alkylstyrene and the like, and a mixture of these with a known photopolymerization initiator, photopolymerization accelerator and the like. These photocurable adhesives include softening agents such as liquid polybutene, mineral oil, liquid polyisobutylene, and liquid polyacrylic acid esters, and tackifiers such as rosin, rosin derivatives, polyterpene resins, terpene phenol resins, and petroleum resins. It can be added. If necessary, it can be diluted with an organic solvent or a reactive organic solvent.

The epoxy resin of the thermosetting adhesive may be any resin having two or more epoxy groups in one molecule and can be cured into a resinous state. Specific examples are bisphenol A.
Type epoxy resin, bisphenol F type epoxy resin, tetrabromobisphenol A type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, glycidyl ester type epoxy resin, alicyclic epoxy resin, hydantoin type epoxy resin, etc. .

Examples of the curing agent include phenol resins, acid anhydrides and amine compounds. Examples of the phenol resin include phenol novolac resin, cresol novolac resin, naphthol modified phenol resin, dicyclopentadiene modified phenol resin, and paraxylene modified phenol resin.

A curing accelerator such as an imidazole-based compound, a tertiary amine-based compound, a phosphorus compound-based compound, or a mixture of two or more of these compounds may be added as necessary.

If desired, a solvent, a flame retardant such as a bromine compound or a phosphorus compound, an antifoaming agent such as a silicone compound, a coloring agent such as carbon black or an organic pigment, a coupling agent, etc. may be added. .

Further, silica, alumina, calcium carbonate,
One or more powders such as titanium oxide and carbon black can be added as a filler.

The conductive adhesive used in the present invention is the above IC
It is not particularly limited as long as it can firmly and electrically bond the chip mounting interposer and the antenna holder, and specifically, for example, the hot melt adhesive, the pressure sensitive adhesive, the thermoplastic resin adhesive, or the heat adhesive as described above. A curable resin adhesive or an adhesive that is hardened by ultraviolet rays, electron beams, etc., a natural rubber adhesive, a synthetic rubber adhesive, or an adhesive composed of a combination of these and conductive powder Can be mentioned.

Examples of the conductive powder used in the present invention include the following a to j. a. Silver powder Dowa Mining Co., Ltd. G-10,11,12,13,1
5-H, 15H, 18, Chemical Flake Co., Ltd. Tokuriki Main Store TCG-1, 1A, 5, 7, 11
N, 7V, TC-12, 20E, 20V, 25A, J-
20, E-20, G-1, H-1, AgF-5S, Ag
F-10S manufactured by Tanaka Kikinzoku Kogyo Co., Ltd. AY-6010, 6080 b. Conductive carbon black Mitsubishi Chemical Corporation Ketjen Black EC, EC-
600JD Denki Kagaku Co., Ltd. Acetylene Black Cabot Co., Ltd. Vulcan XC-72 Columbia Chemical Co., Ltd. Conductex-97
5, Conducttex-SC c. Copper powder Dowa Mining Co., Ltd. DC-50, 100, 200, 3
00 d. Nickel powder Dowa Mining Co., Ltd. DNI-20, 50 e. Gold powder Co., Ltd. Tokoriki main store TA-1, 2 f. Platinum powder Co., Ltd. Tokoriki main store TP-1, Tanaka Kikinzoku Kogyo Co., Ltd. AY-1010, 1020 g. Palladium powder TPd-1 manufactured by Tokoriki Head Office AY-4010, 4030 manufactured by Tanaka Kikinzoku Kogyo Co., Ltd. h. Silver-palladium alloy powder manufactured by Tokuriki Head Office AP-10, 30 i. Zinc powder j. Aluminum powder

The mixing ratio of the conductive powder is not particularly limited. However, 10 to 100 parts by mass of the above-mentioned adhesive (solid content) is mixed with 100 parts by mass of the above-mentioned conductive powder can be preferably used.

Insulating powders such as silica, alumina, glass, talc and various rubbers, or release agents, surface treatment agents, fillers, pigments, dyes, etc. may be added to the conductive adhesive used in the present invention, if necessary. Known additives can be added.

The method for applying the insulating adhesive or the conductive adhesive used in the present invention to a predetermined portion is not particularly limited, and for example, a manual coating method such as brush coating, or automatic printing or coating is applied. , A method of attaching a tape or the like can be mentioned.

In the present invention, the insulating layer is not always necessary, but on the IC chip mounting interposer side and / or
Alternatively, the insulating layer can be provided on the side of the antenna holder by a known method such as printing, coating, or tape sticking.

The conductive portion for connecting the IC chip mounting interposer and the antenna holder may be formed by any method that is easy to design and manufacture, and processing tolerance is not required to be as precise as the conductive portion for IC chip mounting. High structure is enough.

Since the present invention is not limited to the above embodiment, various modifications can be made without departing from the spirit of the claims.

[0038]

According to the method of forming an RF-ID medium according to claim 1 of the present invention, an insulating adhesive is applied to the area excluding the conductive portion for connection, and the interposer and the antenna holder are respectively provided. The conductive parts for connection are superposed so that they face each other, and by using the insulating adhesive, the IC chip mounting interposer and the antenna carrier are conductively bonded, so that good conductivity can be maintained and the bonding becomes strong, As a result, even if an external force is concentrated on the connecting conductive portion, the electrical connection is interrupted, and even if the base material is thin paper or the like having low strength and rigidity, the interposer does not peel off. Play.

According to the method for forming an RF-ID medium according to a second aspect of the present invention, in the method for forming an RF-ID medium according to the first aspect, a conductive adhesive is further applied to the conductive portion for connection, and an insulating adhesive and Since the interposer and the antenna holder are conductively joined by using a conductive adhesive, more excellent continuity can be maintained, and further remarkable joining effect is obtained.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a process of forming an IC chip mounting interposer in an embodiment of a method for forming an RF-ID medium according to the present invention.

FIG. 2 is an explanatory diagram showing a process of forming an antenna holder according to one embodiment.

FIG. 3 is an explanatory diagram showing an RF-ID medium.

FIG. 4 is an explanatory diagram schematically illustrating a cross section taken along line I-I of the RF-ID medium illustrated in FIG.

FIG. 5 is an explanatory diagram illustrating an IC chip mounting interposer formed by another method of the present invention.

FIG. 6 is an explanatory diagram illustrating an IC chip mounting interposer formed by another method of the present invention.

FIG. 7 is an explanatory diagram showing a process of forming an IC chip mounting interposer in a conventional method of forming an RF-ID medium.

FIG. 8 is an explanatory diagram showing a process of forming a conventional antenna holder.

FIG. 9 is an explanatory diagram showing a conventional RF-ID medium.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 base material 2 conductive part for mounting IC chip 3 conductive part for connection 4 conductive pattern 5 IC chip 7 base material 8 antenna conductive part 9 conductive part for connection 10 conductive pattern 11 insulating part 12 insulating adhesive 13 sealant 14 conductive Adhesives A1, A2, A3, A4 IC chip mounting interposers B1, B2 Antenna holders C1, C2 RF-ID media

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shingo Naoi             1-6, Kanda Surugadai, Chiyoda-ku, Tokyo             Within Toppan Forms Co., Ltd. F-term (reference) 2C005 MA10 NA08 NA31 NA34 NB03                       PA01                 5B035 AA07 BA05 BB09 CA02 CA08                       CA23

Claims (2)

[Claims] 1. A conductive pattern having at least a conductive portion for connection is provided on a base material, an IC chip is mounted on the conductive portion for connection to form an IC chip mounting interposer, and an antenna conductive portion and this antenna conductive portion are provided. An antenna holder is formed by providing a conductive pattern consisting of a connecting conductive portion located at the end of the base material on the base material, and an insulating adhesive is applied to a region excluding the connecting conductive portion, and the interposer and the antenna holder are provided. And the conductive parts for connection are overlapped with each other, and the interposer and the antenna holder are conductively joined by using the insulating adhesive. RF-using an insulating adhesive ID media forming method. 2. A conductive adhesive is further applied to the connecting conductive portion, and the interposer and the antenna holder are conductively joined by using an insulating adhesive and a conductive adhesive. A method for forming the described RF-ID medium.