JP2003163432A - Conductive connection part formed on adhesive sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conductive connection part formed on an adhesive sheet by which a board with a mounted IC chip and a conductive connection part for another electrical circuit can be continuity-bonded strongly in the conductive connection part, in which a high-temperature curing conductive ink or the like can be used when a heat-resistant substrate such as a polyimide substrate is used a substrate for a release sheet, whose costs can be lowered because an electrical circuit formed on the release sheet can be transferred to an adhesive layer for the adhesive sheet using a low-cost substrate such as a sheet of paper or the like by a transfer method, which can obtain a satisfactory electrical continuity, and which can be bonded satisfactorily. <P>SOLUTION: In the conductive connection part for the electrical circuit formed on the adhesive sheet, the problem can be solved by the conductive connection part in which a conductive part and a nonconductive part exist so as to be mixed, and which comprises a shape such as a comb shape, a lattice shape or the like. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive connecting portion formed on an adhesive sheet, and more particularly to an RF-ID (Radio Frequency) of a thin information transmission / reception recording medium such as a non-contact IC tag.
IDentification) media, paper computer, disposable electrical appliances, and the like.

[0002]

2. Description of the Related Art An antenna circuit body (electrical circuit) used for a thin information transmission / reception type recording medium according to FIGS.
Are divided into an IC chip-mounted interposer and an antenna holder, and the IC chip-mounted interposer and the antenna holder are formed in advance. The connection method will be described.

FIG. 5 shows a process of forming one of the IC chip mounting interposers. First, a base material 1 having a predetermined size is prepared so as to extend over a terminal portion of an antenna holder, which will be described later (a). Conductive part 2 for mounting IC chip on material 1
And a pair of conductive patterns 4 in which the conductive connection portion 3 is continuous
(B). Thereafter, the IC chip 5 is mounted so as to extend over the IC chip mounting conductive portion 2 to form the IC chip mounting interposer A (C), and at least the IC
A conductive adhesive is applied on the conductive connection portion 3 (scheduled joining portion) on which the chip 5 is mounted to form the adhesive portion 6 (d).

FIG. 6 shows a process of forming the other antenna holder B. A base material 7 having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive portion 8 are provided on the base material 7. Conductive connection portion 9 located at the end of the terminal and serving as a terminal portion
The conductive pattern 10 composed of (the part to be joined) is provided (b), and thereby the antenna holder B is formed.
The conductive connecting portion 9 is provided so as to correspond to the conductive connecting portion 3 of the IC chip mounting interposer A. 1
Reference numeral 1 is an insulating portion.

The IC chip mounting interposer A
And the antenna holder B are overlapped so that the conductive connecting portions 3 and 9 face each other via the adhesive portion 6, and the conductive connecting portions 3 and 9 are bonded via the adhesive portion 6 and electrically. By connecting the IC chip mounting interposer A and the antenna holder B to each other for conduction, the RF-
ID medium C is obtained.

The antenna conductive portion 8, the conductive connecting portion 9, the insulating portion 11 and the like on the base material 7 are printed by screen printing using thermosetting conductive ink or thermosetting conductive paste, and are heated to a high temperature. Since it is often formed by curing, the base material 7 has to be made of heat-resistant material such as polyimide, polyamide, polyethylene naphthalate, glass epoxy, etc., resulting in cost increase. was there.

Therefore, in order to solve this problem, FIG.
As shown in (1), a method has been proposed in which the conductive pattern 10 is once formed on the release sheet and then the conductive pattern 10 is transferred to an adhesive sheet. That is, first, a release sheet 13 in which a release agent layer 12 is formed on a heat resistant base material made of polyimide, polyamide, polyethylene naphthalate, glass epoxy or the like having a predetermined size is prepared (a), and the release sheet 13 is prepared. Similarly, a conductive pattern 10 including an antenna conductive portion 8 and a conductive connecting portion 9 (a portion to be joined) that is a terminal portion and is located at an end of the antenna conductive portion 8 is provided and heated to a high temperature to be solidified. (B),
The antenna holder B1 is formed. Reference numeral 11 is an insulating portion.
Next, a pressure-sensitive adhesive sheet 1 in which a pressure-sensitive adhesive layer 14 is provided on an inexpensive base material 7 such as paper or polyester that does not have high heat resistance but is inexpensive.
The adhesive layer 14 of No. 5 and the conductive pattern 10 of the antenna holder B1 are superposed so as to face each other, and are pressure-bonded (C), and the solidified conductive pattern 10 including the insulating portion 11 is all adhered to the adhesive sheet 15. It is transferred to the surface of the agent layer 14 and both are peeled off (d). As a result, the antenna holder B is formed (e). Then, the IC chip mounting interposer A and the antenna holder B are overlapped with each other so that the conductive connecting portions 3 and 9 face each other to electrically connect the conductive connecting portions 3 and 9 with each other. By bonding the antenna holder B with the adhesive layer 14 of the adhesive sheet 15, RF- shown in FIG.
ID medium C is obtained. According to this method, the release sheet 13 in which the release agent layer 12 is formed on the heat resistant base material made of polyimide, polyamide, polyethylene naphthalate, glass epoxy or the like can be repeatedly used, and as the base material 7, inexpensive paper, Since polyester or the like can be used, the problem of cost increase can be avoided.

[0008]

However, according to this method, the conductive connecting portion 3 and the conductive connecting portion 9 are bonded by using a conductive adhesive containing a powder of silver, aluminum or the like.
If the adhesive force is insufficient and the external force is concentrated on the conductive connecting portions 3 and 9, there is a problem that the electrical connection is partially interrupted and the electrical resistance is increased or the electrical connection is interrupted. An object of the present invention is to solve the conventional problems, to obtain a good conduction between conductive connection parts by using a method of once forming a conductive pattern on a release sheet and then transferring this conductive pattern to an adhesive sheet. Another object of the present invention is to provide a conductive connecting portion of an electric circuit formed on a pressure-sensitive adhesive sheet that can obtain good adhesion.

[0009]

Means for Solving the Problems As a result of intensive studies to solve the above problems, the present inventor has found that by using a conductive connecting part having a specific shape as the conductive connecting part, The inventors have found that good adhesion and conduction can be obtained, and completed the present invention.

That is, the conductive connecting portion formed on the pressure-sensitive adhesive sheet according to claim 1 of the present invention is a conductive connecting portion of an electric circuit formed on the pressure-sensitive adhesive sheet, and the conductive portion and the non-conductive portion are mixed. It is characterized by having a curved shape.

The conductive connecting portion formed on the pressure-sensitive adhesive sheet according to claim 2 of the present invention is characterized in that, in the conductive connecting portion according to claim 1, the shape is selected from a comb type and a lattice type. To do.

In the present invention, a conductive connecting portion having a shape such as a comb shape or a lattice shape, in which a conductive portion and a non-conductive portion are mixed, is formed on the adhesive sheet. For example, I
At least one of the board on which the C chip is mounted and the conductive connection portion of another electric circuit is formed on the adhesive sheet as a conductive connection portion having a shape such as a comb shape or a lattice shape so that both conductive connection portions face each other. When they are overlapped with each other and pressed or heated, the conductive connecting portions directly contact with each other at a large number of contact portions without passing through an adhesive to obtain good electrical continuity and also to obtain good adhesion due to the adhesive. .

[0013]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. 1A to 1E are explanatory views showing a process of forming a conductive connecting portion formed on the pressure-sensitive adhesive sheet of the present invention. A release sheet 13 having a release agent layer 12 formed on a heat-resistant base material made of polyimide, polyamide, polyethylene naphthalate, glass epoxy or the like having a predetermined size is prepared (a), and the release sheet 13 is provided with a conductive ink or the like. A conductive pattern 10 composed of an antenna conductive portion 8 and a conductive connecting portion 9A (planned joining portion) having a comb-like shape which is a terminal portion and is located at an end portion of the antenna conductive portion 8 is provided by using It is heated and solidified to form the antenna holder B1 (b). Reference numeral 11 is an insulating portion. In the conductive connection portion 9A, a plurality of conductive portions 20 and a plurality of non-conductive portions 21 are mixed between the conductive portions 20. The conductive portion 20 is formed on the base material by a printing method using conductive ink or the like, or is formed by etching a metal foil. On the other hand, the non-conductive part 21 is a part where the conductive part 20 is not formed.

Next, the pressure-sensitive adhesive layer 14 of the pressure-sensitive adhesive sheet 15 in which the pressure-sensitive adhesive layer 14 is provided on the base material 7 such as paper and polyester which is not so heat resistant but is inexpensive, and the conductive pattern 10 of the antenna holder B1 face each other. Thus, the conductive pattern 10 including the insulating portion 11 is transferred to the surface of the pressure-sensitive adhesive layer 14 of the pressure-sensitive adhesive sheet 15, and the two are peeled off (d). As a result, an antenna holder B having a conductive connecting portion formed on the adhesive sheet of the present invention is formed (e).

FIG. 2 shows a process of forming an IC chip mounting interposer. First, a base material 1 such as a paper having a predetermined size is prepared so as to extend over the terminal portion of the antenna holder B (a). A conductive portion 2 for mounting an IC chip on the material 1;
A pair of conductive patterns 4 in which the conductive connection portion 9A and the conductive connection portion 3A having a comb shape similar to that of the conductive connection portion 9 are continuous are provided (b). After that, the IC chip 5 is mounted so as to extend over the IC chip mounting conductive portion 2 to form the IC chip mounting interposer A (C).

The IC chip mounting interposer A
And the antenna holder B are respectively connected to the conductive connection portions 3A and 9A.
The RF-ID shown in FIG. 3 is obtained by stacking so that A faces each other, adhering them through the adhesive layer 14 and achieving electrical conduction, and joining the IC chip mounting interposer A and the antenna holder B. Media C is obtained. That is, when the conductive connection portions 3A and 9A of the IC chip mounting interposer A and the antenna holder B are overlapped with each other so as to face each other, and are pressed and heated, the conductive portions 20 do not contact each other with a large number of contacts. Are directly contacted with each other to obtain good electrical conduction, and a large number of non-conductive portions 21 are adhered to each other by the pressure-sensitive adhesive layer 14 to obtain good adhesion.
The joint between the IC chip mounting interposer A and the antenna holder B is strengthened, and as a result, for example, the conductive connecting portion 3A,
Even if the external force is concentrated on 9A, the electrical connection is not interrupted, and the interposer A is not peeled off even if the base materials 1 and 7 are thin paper or the like having low strength and rigidity.

In the above embodiment, the conductive connecting portion 3
Although both A and 9A have shown the example of the conductive connection part having a comb shape, they may be a grid type, a net type, or the like, and both may be conductive connection parts having the same shape, but different shape conductive connection parts. The other may be a conductive connecting portion having a conventional shape instead of the conductive connecting portion of the present invention.

A length of 20 mm × 5 formed on a paper substrate,
The line width of the conductive part 12 with a line distance of 0.6 mm is 0.10 mm.
Bonded (0.4MPm, thickness: 20μm, Chemitite TNP0300, Toshiba Chemical Co., Ltd.) with copper foil (before etching) changed to ~ 0.60mm.
a, 150 ° C., 10 minutes), and a direct current electric resistance was measured by applying a tester to the wire pattern and the copper foil. Table 1 shows the relationship between the line width and the DC electric resistance. Table 1 shows the measured values before and after the 85 ° C., 85% RH slow / fast test.

[0019]

[Table 1]

When the line width of the conductive portion 12 is 0.1 mm or less,
The printing was poor and could not be tested. It can be seen from Table 1 that the conductive portion 12 having a line width of 0.2 mm or more has a low DC electric resistance, good stability, and practicality.

Therefore, the line width of the conductive portion 12 is fixed at 0.5 mm, and the line width of the conductive portion 12 spread to a length of 20 mm × line width of 10 mm is set to 0.3 m as a line distance (width of the non-conductive portion 13).
What was changed from m to 0.60 mm was bonded (0.4MP) with copper foil (before etching) and adhesive (Chemite TNP0300, Toshiba Chemical Co., thickness 20 μm).
a, 200 ° C., 10 seconds), and a direct current electrical resistance was measured by applying a tester to the wire pattern and the copper foil. Table 1 shows 85 ℃, 8
The measured values before and after the 5% RH grading test are shown.

[0022]

[Table 2]

From Table 2, it can be seen that if the distance between the lines is 0.3 mm or more, the direct current electric resistance is low, the stability is good, and the practicality is obtained.

FIGS. 4 (a) to 4 (b) are explanatory views schematically showing conductive connecting portions having other shapes according to the present invention. Figure 4 (a)
Indicates a conductive connecting portion having a lattice type shape. The conductive connection portion 16 has a shape in which a plurality of conductive portions 20 and a plurality of non-conductive portions 21 are mixed between the conductive portions 20. Figure 4
(B) shows a conductive connection portion having another lattice type shape. The conductive connection part 17 includes a plurality of conductive parts 20 and a conductive part 2.
It has a shape in which a plurality of non-conductive portions 21 are mixed between 0.

The method of conductively connecting the IC chip mounting interposer and the antenna holder is not particularly limited. For example, after the conductive connection portions are aligned with each other, a known method such as thermocompression bonding or press bonding may be used. In addition, any method such as a method using light, an electromagnetic wave, an electron beam or a combination thereof, a method of sandwiching with an ultrasonic welding tool and conductively connecting with an ultrasonic wave may be used.

In this embodiment, the conductive connection portions 3A and 9A are conductively connected without using an adhesive. However, in the present invention, the conductive connection may be performed by appropriately interposing an adhesive or an adhesive.

The material of the base material 1 or base material 7 used in the present invention is a woven fabric, a non-woven fabric, a mat, a paper or a combination thereof made of an inorganic or organic fiber such as glass fiber, alumina fiber, polyester fiber or polyamide fiber. Or a composite substrate formed by impregnating these with resin varnish, a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate, an ethylene / vinyl alcohol copolymer group Material,
Polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin substrate, polyether sulfone resin Select from known plastic substrates such as substrates, or those that have undergone surface treatment such as corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma treatment and ozone treatment. Can be used.

The IC chip mounting interposer and the antenna carrier may be formed of the same base material or different base materials. Further, the IC chip mounting interposer and the antenna carrier may not be formed one by one, but may be formed in plural (and may be of the same kind or different kinds).

The formation of the conductive pattern 4 on the IC chip mounting interposer and the formation of the conductive pattern 10 on the antenna holder can be carried out by known methods. For example, a method in which a conductive paste is printed by screen printing or inkjet printing to be dried and fixed, attachment of a coated or uncoated metal wire, etching, dispersion, metal foil attachment, direct vapor deposition of metal, metal vapor deposition film transfer, Examples thereof include formation of a conductive polymer layer, but are not limited thereto.

Further, in the antenna holder, the conductive pattern 10 is not necessarily limited to one side, but may be formed on the back side as well as on the inner layer as long as the connection which finally functions as the antenna is guaranteed. Further, it may be an antenna in which they are multiplexed. Further, it may be a pattern in which other lines are crossed by jumper lines as needed. It may be coated to protect the formed antenna.

The mounting of the IC chip in the process of forming the IC chip mounting interposer includes wire bonding (WB) and anisotropic conductive film (AC).
F), conductive paste (ACP), insulating resin (NCP),
The connection can be made by a known method such as using an insulating film (NCF) or a cream solder ball. If necessary, the connection portion may be protected and reinforced with a known underfill material or potting material.

The pressure-sensitive adhesives and adhesives used in the present invention are the same as those described in I.
The C-chip mounting interposer and the antenna holder are not particularly limited as long as they can be firmly conductively joined to each other. Specifically, for example, a hot melt adhesive, a pressure sensitive adhesive, a thermoplastic resin adhesive or a thermosetting adhesive is used. Examples thereof include resin adhesives, adhesives that are cured by ultraviolet rays, electron beams, etc., natural rubber adhesives, synthetic rubber adhesives, and the like, and pressure-sensitive adhesives and adhesives composed of combinations thereof. Further, a conductive adhesive in which silver, aluminum or the like is added to these pressure-sensitive adhesives or adhesives to impart conductivity is also usable. As an adhesive, a tackifier (rosin and rosin derivative, polyterbene resin,
Rubber system containing known additives such as terpene phenol resin, petroleum resin), softening agent (liquid polybutene, mineral oil, liquid polyisobutylene, liquid polyacrylate), anti-aging agent, etc., multiple acrylics with different glass transition temperatures Acrylics obtained by copolymerizing acid esters and other functional monomers, silicones made of silicone rubber and resin, polyethers and polyurethane adhesives can be preferably used. These adhesives and pressure-sensitive adhesives are, in addition to a solution type dissolved in a solution, an aqueous emulsion type, a hot-melt type that is solidified by cooling after heating and melting application, after applying a liquid oligomer or monomer, etc. Some of them can be cured by irradiation with radiation such as rays, but any of them can be used.

Insulating powders such as silica, alumina, glass, talc and various rubbers, or mold release agents, surface treatment agents, fillers, pigments, dyes may be added to the pressure-sensitive adhesives and adhesives used in the present invention, if necessary. Known additives such as the above can be added.

The conductive connecting portion between the IC chip mounting interposer and the antenna holder may be formed by any method that is easy to design and manufacture, and has a processing tolerance that does not require the precision of the conductive portion for mounting the IC chip. High structure is enough.

In the above embodiment, the RF-type used in a thin information transmission / reception type recording medium such as a non-contact IC tag.
Although the connection between the conductive connection portions of the ID medium has been described, the present invention can be applied to the connection between other conductive connection portions, and specifically, for example, between the conductive connection portions such as a paper computer and a disposable electric product. It can also be applied to connections and the like.

The above description of the embodiments is for explaining the present invention and does not limit the invention described in the claims or reduce the scope thereof. Further, the configuration of each part of the present invention is not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims.

[0037]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples. (Example 1) An antenna portion was printed on a release paper (SP-8K AO, manufactured by Lintec Co., Ltd.) using a conductive ink (LS415C-K, manufactured by Asahi Chemical Laboratory), and 150
After heating at ℃ for 30 minutes, tack paper (copy tack, manufactured by Toppan Forms Co., Ltd.) is attached using a rubber roller (2 kg / cm ² , 40 ° C.), the antenna part is transferred to the tack paper side, and the paper substrate is used. An antenna was produced on the above, and an antenna holder (adhesive sheet provided with a conductive connecting portion of the present invention) shown in FIG. 1 was produced. The shape of the conductive connection is 0.3 m between lines
m, and a line width of 0.3 mm.
On the other hand, the IC is mounted on the conductive portion (land portion) for mounting the IC chip printed on NIP (non-impact printer) compatible paper (230 ° C., 0.4 MPa, 2 seconds), and I shown in FIG.
A C chip mounting interposer was produced. The antenna holder and the IC chip mounting interposer thus manufactured are overlapped with each other so that the conductive connecting portions face each other via the adhesive portion, and are bonded and electrically connected to each other, and the IC chip mounting interposer and the antenna are mounted. The RF-ID medium C shown in FIG.
Was produced. 85 with this attached to NIP
Although it was left in the environment of 85 ° C. and 85% RH, there was no change in the communication state and the good state was maintained. Further, even when the RF-ID medium C shown in FIG. 3 was manufactured by using the IC chip mounting interposer shown in FIG. 1 manufactured by the copper foil etching method, the same good condition was maintained.

Example 2 An antenna portion was printed on a peeled polyamide film with a conductive ink (N-5845-1, manufactured by Shoei Chemical Industry Co., Ltd.), and after heating at 180 ° C. for 30 minutes, both sides were printed. Tape (No.500, manufactured by Nitto Denko Corporation)
Using a rubber roller for bonding (2 kg / cm ² , 4
(0 ° C.), the antenna part was transferred to the double-sided tape side to produce an antenna on a paper base material, and the antenna holder shown in FIG. 1 was produced. The shape of the conductive connection portion is 0.3 mm between lines and has a line width of 0.
It had a comb shape of 3 mm. On the other hand, NIP
(Non-impact printer) Mount the IC on the conductive part (land part) for mounting the IC chip printed on compatible paper (230
(° C, 0.4 MPa, 2 seconds), an adhesive was applied to the conductive connection portion to produce the IC chip mounting interposer shown in FIG. The antenna holder and the IC chip mounting interposer thus manufactured are overlapped with each other so that the conductive connecting portions face each other via the adhesive portion, and are bonded and electrically connected to each other, and the IC chip mounting interposer and the antenna are mounted. By connecting with the holder, R shown in Fig. 3
F-ID media C was produced. This was left in an environment of 85 ° C. and 85% RH while being attached to NIP.
There was no change in communication status and good condition was maintained.

[0039]

The conductive connection portion formed on the pressure-sensitive adhesive sheet according to claim 1 of the present invention is a conductive connection portion of an electric circuit formed on the pressure-sensitive adhesive sheet, and the conductive portion and the non-conductive portion are mixed. Since a heat-resistant base material made of polyimide, polyamide, polyethylene naphthalate, glass epoxy, etc. is used as the base material for the release sheet (release paper), it has a high temperature conductive property for forming conductive patterns. Ink and conductive paste can be used, and the electric circuit formed on the release sheet (release paper) can be transferred onto the adhesive layer of inexpensive paper or an adhesive sheet using a substrate such as polyester by the transfer method. It is possible to avoid the problem of cost increase. For example, at least one of the conductive connecting portions of the IC chip mounting interposer A and the antenna holder B is of a comb type or a lattice type. Is formed on the adhesive sheet as a conductive connection portion having a shape conductive portion and the nonconductive portion are mixed, both the conductive connection portion is superposed so as to face the pressing-
When heated or the like, the conductive connecting portions directly contact with each other at a large number of contact portions without the interposition of a pressure-sensitive adhesive to obtain good electrical continuity, and there is a remarkable effect that good adhesion can be obtained by the pressure-sensitive adhesive.

The conductive connecting portion formed on the pressure-sensitive adhesive sheet according to claim 2 of the present invention is the conductive connecting portion according to claim 1, wherein the shape is selected from a comb type and a lattice type. In addition to having the same effect as the conductive connection part described in 1,
It has a further remarkable effect that the structure is simple and easy to manufacture at low cost, and that better electric conduction is obtained and better adhesion is obtained.

[Brief description of drawings]

1A to 1E are explanatory views showing a process of forming a conductive connecting portion formed on an adhesive sheet of the present invention.

2A to 2C are explanatory views showing a process of forming an IC chip mounting interposer.

FIG. 3 is an explanatory diagram showing an RF-ID medium.

FIG. 4 is an explanatory view showing the shape of another conductive connection portion of the present invention.

5A to 5D are explanatory views showing a process of forming a conventional IC chip mounting interposer.

6A to 6B are explanatory views showing a process of forming an antenna holder having a conventional conductive connecting portion.

FIG. 7 is an explanatory diagram showing a conventional RF-ID medium.

8A to 8F are conventional RF-Is by a transfer method.
It is explanatory drawing which shows the formation process of D media.

[Explanation of symbols]

1 base material 2 IC chip mounting conductive part 3, 3A conductive connection 4 Conductive pattern 5 IC chip 6 Adhesive part 7 Base material 8 Antenna conductive part 9, 9A conductive connection 10 Conductive pattern 11 Insulation part 12 Release agent layer 13 Release sheet 14 Adhesive layer 15 Adhesive sheet 16, 17 Conductive connection 20 Conductive part 21 Non-conductive part A IC chip mounting interposer B Antenna holder C RF-ID media

Claims (2)

[Claims] 1. A conductive connection portion of an electric circuit formed on a pressure-sensitive adhesive sheet, which has a shape in which a conductive portion and a non-conductive portion are mixed, and a conductive connection formed on the pressure-sensitive adhesive sheet. Department. 2. The conductive connecting portion according to claim 1, wherein the shape is selected from a comb type and a lattice type.