JP2003283120A - Method of mutually connecting electrically conductive connecting sections - Google Patents
Method of mutually connecting electrically conductive connecting sectionsInfo
- Publication number
- JP2003283120A JP2003283120A JP2002083588A JP2002083588A JP2003283120A JP 2003283120 A JP2003283120 A JP 2003283120A JP 2002083588 A JP2002083588 A JP 2002083588A JP 2002083588 A JP2002083588 A JP 2002083588A JP 2003283120 A JP2003283120 A JP 2003283120A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- adhesive
- portions
- conductive connection
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、導電接続部同士の
接続方法に関するものであり、さらに詳しくは非接触Ｉ
Ｃタグなどの薄形の情報送受信型記録メディアなどのＲ
Ｆ−ＩＤ（ＲａｄｉｏＦｒｅｑｕｅｎｃｙ ＩＤｅｎｔ
ｉｆｉｃａｔｉｏｎ）メディア、ペーパーコンピュー
タ、使い捨て電気製品などの導電接続部同士の接続方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting electrically conductive connecting parts, and more specifically, non-contact I
R such as thin information transmission / reception type recording media such as C tag
F-ID (RadioFrequency IDent
The present invention relates to a method for connecting conductive connection parts such as an information medium, a paper computer, and a disposable electric product.
【０００２】[0002]
【従来の技術】本発明者は先に導電接続部同士をパター
ン状に形成した接着剤部を介して対接させて接続する方
法を提案した（特願２００１−２６０００９号明細
書）。次に、図５〜７によりアンテナ回路体がＩＣチッ
プ実装インターポーザとアンテナ所持体とに構成が区分
けされていて、このＩＣチップ実装インターポーザとア
ンテナ所持体とが予め形成され、これらを用いてアンテ
ナ回路体（電気回路）を形成する場合の導電接続部同士
の接続方法について説明する。2. Description of the Related Art The inventor of the present invention has previously proposed a method in which conductive connecting portions are brought into contact with each other through an adhesive portion formed in a pattern to connect them (Japanese Patent Application No. 2001-260009). Next, the structure of the antenna circuit body is divided into an IC chip mounting interposer and an antenna holder by FIGS. 5 to 7, and the IC chip mounting interposer and the antenna holder are formed in advance, and the antenna circuit is formed by using these. A method of connecting the conductive connection portions when forming the body (electrical circuit) will be described.
【０００３】図５は一方のＩＣチップ実装インターポー
ザの形成過程を示していて、まず後述するアンテナ所持
体の端子部分に亘るように所定の大きさとした基材１を
用意し（イ）、この基材１にＩＣチップ実装用導電部２
と導電接続部３とが連続している一対の導電パターン４
を設ける（ロ）。この後、前記ＩＣチップ実装用導電部
２に跨るようにしてＩＣチップ５を実装してＩＣチップ
実装インターポーザＡを形成し（ハ）、少なくともＩＣ
チップ５が実装されている導電接続部３（接合予定部
位）の上に接着剤をパターン状に塗布して接着剤部６を
形成する（ニ）。FIG. 5 shows a process of forming one of the IC chip mounting interposers. First, a base material 1 having a predetermined size is prepared so as to extend over a terminal portion of an antenna holder, which will be described later (a). Conductive part 2 for mounting IC chip on material 1
And a pair of conductive patterns 4 in which the conductive connection portion 3 is continuous
(B). Thereafter, the IC chip 5 is mounted so as to extend over the IC chip mounting conductive portion 2 to form the IC chip mounting interposer A (C), and at least the IC
An adhesive agent is applied in a pattern on the conductive connection section 3 (scheduled joining site) on which the chip 5 is mounted to form the adhesive section 6 (d).
【０００４】図６は他方のアンテナ所持体Ｂの形成過程
を示していて、所定の大きさとした基材７を用意し
（イ）、この基材７にアンテナ導電部８とこのアンテナ
導電部８の端部に位置して端子部分である導電接続部９
（接合予定部位）とからなる導電パターン１０を設け
（ロ）、これによってアンテナ所持体Ｂが形成される。
前記導電接続部９は上記ＩＣチップ実装インターポーザ
Ａの導電接続部３と対応するように設けられている。１
１は絶縁部である。FIG. 6 shows a process of forming the other antenna holder B. A base material 7 having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive portion 8 are provided on the base material 7. Conductive connection portion 9 located at the end of the terminal and serving as a terminal portion
The conductive pattern 10 composed of (the part to be joined) is provided (b), and thereby the antenna holder B is formed.
The conductive connecting portion 9 is provided so as to correspond to the conductive connecting portion 3 of the IC chip mounting interposer A. 1
Reference numeral 1 is an insulating portion.
【０００５】そして、ＩＣチップ実装インターポーザＡ
とアンテナ所持体Ｂとをそれぞれの導電接続部３、９が
パターン状に形成された接着剤部６を介して相対するよ
うに重ね合わせて、導電接続部３、９をパターン状に形
成された接着剤部６を介して接着するとともに電気的導
通を図り、ＩＣチップ実装インターポーザＡとアンテナ
所持体Ｂとを接合することで、図７に示すＲＦ−ＩＤメ
ディアＣが得られるというものである。The IC chip mounting interposer A
And the antenna holder B are overlapped with each other so that the conductive connecting portions 3 and 9 face each other via the adhesive portion 6 having the pattern formed, and the conductive connecting portions 3 and 9 are formed in the pattern. The RF-ID medium C shown in FIG. 7 can be obtained by bonding the IC chip mounting interposer A and the antenna holder B by bonding them through the adhesive portion 6 and achieving electrical conduction.
【０００６】[0006]
【発明が解決しようとする課題】しかし、この方法によ
ると、塗布する接着剤のパターンを工夫したり、塗布す
る接着剤の塗工量を精度よくコントロールする必要があ
り、適性な接着剤のパターンや接着剤の適性塗工量を採
用しないと、導電接続部同士の接着はよいが、導電接続
部同士の導通が不十分であったり、逆に、導電接続部同
士の導通はよいが、導電接続部同士の接着が不十分であ
ったりする問題があり、両方とも満足する結果を得るの
は難しいという問題があった。本発明の目的は、従来の
問題を解決し、塗布する接着剤のパターンを工夫した
り、塗布する接着剤の塗工量を精度よくコントロールし
なくても、導電接続部同士の良好な接着および導通が得
られる導電接続部同士の接続方法を提供することであ
る。However, according to this method, it is necessary to devise the pattern of the adhesive to be applied and to accurately control the coating amount of the adhesive to be applied. If the appropriate coating amount of the adhesive or the adhesive is not adopted, adhesion between the conductive connecting portions is good, but conduction between the conductive connecting portions is insufficient, or conversely, conduction between the conductive connecting portions is good, but conductive There is a problem that adhesion between the connecting portions is insufficient, and it is difficult to obtain satisfactory results for both. The object of the present invention is to solve the conventional problems, devise the pattern of the adhesive to be applied, or to control the coating amount of the adhesive to be applied with good accuracy and to achieve good adhesion between the conductive connecting portions and An object of the present invention is to provide a method of connecting conductive connection parts that can obtain continuity.
【０００７】[0007]
【課題を解決するための手段】本発明者は前記課題を解
決すべく鋭意研究を重ねた結果、前記導電接続部とし
て、特定の形状を有する導電接続部を用い、少なくとも
一方の導電接続部面に接着剤を塗布し、超音波などを用
いて熱圧着することにより、導電接続部同士の良好な接
着および導通が得られることを見出し、本発明を完成す
るに至った。As a result of intensive studies to solve the above-mentioned problems, the present inventor has used a conductive connecting portion having a specific shape as the conductive connecting portion, and has at least one conductive connecting portion surface. It has been found that good adhesion and conduction between the conductive connecting portions can be obtained by applying an adhesive to the above and thermocompression-bonding it by using ultrasonic waves, etc., and completed the present invention.
【０００８】すなわち、本発明の請求項１記載の導電接
続部同士の接続方法は、基材上に形成された電気回路の
櫛型または格子型の形状の導電接続部同士の接続方法で
あって、少なくとも一方の導電接続部面に接着剤を塗布
し、更に熱圧着して接続することを特徴とする。That is, the method for connecting the conductive connecting portions to each other according to claim 1 of the present invention is a method for connecting the conductive connecting portions having a comb shape or a lattice type of an electric circuit formed on the base material. It is characterized in that an adhesive is applied to at least one of the surfaces of the electrically conductive connecting portion, and then thermocompression bonding is performed for connection.
【０００９】本発明の請求項２記載の導電接続部同士の
接続方法は、請求項１記載の導電接続部同士の接続方法
において、前記接着剤が絶縁性接着剤であることを特徴
とする。According to a second aspect of the present invention, there is provided a method for connecting conductive connecting portions with each other, wherein the adhesive is an insulating adhesive.
【００１０】本発明の請求項３記載の導電接続部同士の
接続方法は、請求項１あるいは請求項２記載の導電接続
部同士の接続方法において、前記基材が紙基材であるこ
とを特徴とする。According to a third aspect of the present invention, there is provided a method of connecting electrically conductive connecting portions with each other, wherein the base material is a paper base material. And
【００１１】本発明においては、導電部と非導電部が混
在している櫛型や格子型の凹凸形状を有する導電接続部
を用い、そして少なくとも一方の導電接続部面に絶縁性
接着剤や導電性接着剤などの接着剤を塗布し、更に熱圧
着して接続する。例えば、前記ＩＣチップ実装インター
ポーザＡとアンテナ所持体Ｂの導電接続部をそれぞれ櫛
型や格子型の凹凸形状を有する導電接続部とし、少なく
とも一方の導電接続部面に絶縁性接着剤や導電性接着剤
などの接着剤を塗布し、両方の導電接続部が接着剤を介
して相対するように重ね合わせて、超音波やプレスなど
を用いて熱圧着すると、凸部に介在していた接着剤は流
れて導電接続部の周辺や凹部に移行するため、接着剤と
して絶縁性接着剤を用いても凸部同士は接着剤を介さず
に直接接触して良好な電気的導通が得られるとともに、
導電接続部の周辺や凹部には移行してきた接着剤を含め
て多量の接着剤が介在するので導電接続部同士の良好な
接着が容易に得られる。接着剤をパターン状に塗布する
従来法に較べて作業が容易である。基材が紙基材である
と、導電接続部の周辺にはみ出したり凹部に移行してき
た接着剤の少なくとも一部を紙基材が浸透、吸収するの
で導電接続部同士のより良好な接着が得られる。In the present invention, a comb-shaped or lattice-shaped conductive connecting portion having a conductive portion and a non-conductive portion mixed is used, and an insulating adhesive or a conductive material is formed on at least one conductive connecting surface. Apply an adhesive such as a conductive adhesive, and then thermocompression-bond it. For example, the conductive connecting portions of the IC chip-mounted interposer A and the antenna holder B are respectively made into comb-shaped or lattice-shaped uneven conductive portions, and at least one of the conductive connecting portions has an insulating adhesive or conductive adhesive. Apply adhesive such as adhesive, superimpose so that both conductive connection parts face each other through the adhesive, and thermocompression-bond using ultrasonic waves or a press. Since it flows and migrates to the periphery of the conductive connection portion or to the concave portion, even if an insulating adhesive is used as the adhesive, the convex portions directly contact with each other without an adhesive, and good electrical continuity can be obtained.
Since a large amount of the adhesive including the adhesive that has migrated is present around the conductive connection portion and in the recess, good adhesion between the conductive connection portions can be easily obtained. The work is easier than the conventional method of applying the adhesive in a pattern. When the base material is a paper base material, the paper base material permeates and absorbs at least part of the adhesive that has squeezed out into the periphery of the conductive connection part or that has migrated to the concave part, so that better adhesion between the conductive connection parts is obtained. To be
【００１２】[0012]
【発明の実施の形態】以下、図面を用いて本発明の実施
の一形態を説明する。図１〜３によりアンテナ回路体
（電気回路）がＩＣチップ実装インターポーザとアンテ
ナ所持体とに構成が区分けされていて、このＩＣチップ
実装インターポーザとアンテナ所持体とが予め形成さ
れ、これらを用いてアンテナ回路体（電気回路）を形成
する場合の導電接続部同士の接続方法について説明す
る。図１は一方のＩＣチップ実装インターポーザの形成
過程を示していて、まず後述するアンテナ所持体の端子
部分に亘るように所定の大きさとした紙基材１Ａを用意
し（イ）、この紙基材１ＡにＩＣチップ実装用導電部２
と櫛型の形状を有する導電接続部３Ａとが連続している
一対の導電パターン４を設ける（ロ）。この後、前記Ｉ
Ｃチップ実装用導電部２に跨るようにしてＩＣチップ５
を実装してＩＣチップ実装インターポーザＡを形成し
（ハ）、少なくともＩＣチップ５が実装されている導電
接続部３Ａ（接合予定部位）の上に絶縁性接着剤を塗布
して接着剤部６Ａを形成する（ニ）。導電接続部３Ａ
は、複数の導電部１２と、導電部１２の間に複数の非導
電部１３が混在している。導電部１２は基材上に導電性
ペーストを用いて印刷法により形成されたり、金属箔を
エッチングするなどして形成され凸部となっている。一
方、非導電部１３は導電部１２が形成されていない箇所
であり、凹部となっている。DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. 1 to 3, the antenna circuit body (electric circuit) is divided into an IC chip mounting interposer and an antenna holder, and the IC chip mounting interposer and the antenna holder are formed in advance. A method of connecting the conductive connection portions when forming a circuit body (electric circuit) will be described. FIG. 1 shows a process of forming one of the IC chip mounting interposers. First, a paper base material 1A having a predetermined size is prepared so as to extend over a terminal portion of an antenna holder to be described later (a). Conductor 2 for mounting IC chip on 1A
And a pair of conductive patterns 4 in which the conductive connecting portions 3A having a comb shape are continuous (B). After this, I
The IC chip 5 is arranged so as to straddle the conductive portion 2 for mounting the C chip.
To form the IC chip mounting interposer A (C), and at least the conductive connecting portion 3A (scheduled joining portion) on which the IC chip 5 is mounted is coated with an insulating adhesive to form the adhesive portion 6A. Form (D). Conductive connection part 3A
The plurality of conductive parts 12 and the plurality of non-conductive parts 13 are mixed between the conductive parts 12. The conductive portion 12 is formed on the base material by a printing method using a conductive paste, or is formed by etching a metal foil to form a convex portion. On the other hand, the non-conductive portion 13 is a portion where the conductive portion 12 is not formed and is a recess.
【００１３】図２は他方のアンテナ所持体Ｂの形成過程
を示していて、所定の大きさとした紙基材７Ａを用意し
（イ）、この紙基材７Ａにアンテナ導電部８とこのアン
テナ導電部８の端部に位置して端子部分である、導電接
続部３Ａと類似の櫛型の形状を有する導電接続部９Ａ
（接合予定部位）とからなる導電パターン１０を設け
（ロ）、これによってアンテナ所持体Ｂが形成される。
前記導電接続部９Ａは上記ＩＣチップ実装インターポー
ザＡの導電接続部３Ａと櫛形が直交して対応するように
設けられている。１１は絶縁部である。FIG. 2 shows a process of forming the other antenna holder B, in which a paper base material 7A having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive material are provided on the paper base material 7A. A conductive connection portion 9A having a comb shape similar to the conductive connection portion 3A, which is a terminal portion located at an end portion of the portion 8.
The conductive pattern 10 composed of (the part to be joined) is provided (b), and thereby the antenna holder B is formed.
The conductive connection portion 9A is provided so that the comb shape is orthogonal to and corresponds to the conductive connection portion 3A of the IC chip mounting interposer A. Reference numeral 11 is an insulating portion.
【００１４】そして、ＩＣチップ実装インターポーザＡ
とアンテナ所持体Ｂとをそれぞれの導電接続部３Ａ、９
Ａが接着剤部６Ａを介して相対するように重ね合わせて
熱圧着すると、導電接続部３Ａ上の絶縁性接着剤は流れ
て導電接続部３Ａ、９Ａの周辺にはみ出したり非導電部
１３に移行するため、導電性接続部同士は絶縁性接着剤
を介さずに直接接触して良好な電気的導通が得られると
ともに、導電接続部３Ａ、９Ａの周辺にはみ出した絶縁
性接着剤が存在し、非導電部１３には移行してきた多量
の絶縁性接着剤が存在し、これらの絶縁性接着剤の少な
くとも一部が紙基材１Ａ、７Ａに浸透、吸収するので、
導電接続部同士のより良好な接着が得られる。このよう
にしてＩＣチップ実装インターポーザＡとアンテナ所持
体Ｂとを接合することで、図３に示すＲＦ−ＩＤメディ
アＣが得られる。The IC chip mounting interposer A
And the antenna holder B are respectively connected to the conductive connection portions 3A and 9A.
When A is superposed so as to face each other via the adhesive portion 6A and thermocompression-bonded, the insulating adhesive on the conductive connection portion 3A flows out and sticks out to the periphery of the conductive connection portions 3A and 9A or moves to the non-conductive portion 13. Therefore, the conductive connecting portions are directly contacted with each other without an insulating adhesive to obtain good electrical continuity, and the insulating adhesive protruding around the conductive connecting portions 3A and 9A exists. A large amount of the insulating adhesive that has migrated to the non-conductive portion 13 exists, and at least a part of these insulating adhesives permeates and absorbs into the paper base materials 1A and 7A.
Better adhesion between the conductive connections is obtained. By joining the IC chip mounting interposer A and the antenna holder B in this manner, the RF-ID medium C shown in FIG. 3 is obtained.
【００１５】熱圧着する方法は特に限定されるものでは
ない。例えば熱、圧力、超音波、光、電磁波あるいはそ
れらの組み合わせを用いて熱圧着できる。超音波を用い
て熱圧着する方法の例について説明する。ＩＣチップ実
装インターポーザＡとアンテナ所持体Ｂとをそれぞれの
導電接続部３Ａ、９Ａが接着剤部６Ａを介して相対する
ように重ね合わせて、その状態で接合予定部位（導電接
続部３Ａ、９Ａ）を公知の一対の超音波溶接具で圧力負
荷Ｐで挟みつけ、超音波溶接具に超音波振動Ｖを与えて
接合予定部位に位置する導電接続部３Ａ、９Ａを上記の
ように接着するとともに電気的導通を図り、ＩＣチップ
実装インターポーザＡとアンテナ所持体Ｂとを接合する
ことで、図３に示すＲＦ−ＩＤメディアＣを得る。接合
予定部位にマッチするように、超音波溶接具の超音波ホ
ーンおよび／またはアンビルの形状、寸法、接合予定部
位への接触表面の形態などを適宜選定することが好まし
い。The method of thermocompression bonding is not particularly limited. For example, thermocompression bonding can be performed using heat, pressure, ultrasonic waves, light, electromagnetic waves, or a combination thereof. An example of a method of thermocompression bonding using ultrasonic waves will be described. The IC chip mounting interposer A and the antenna holder B are overlapped so that the respective conductive connecting portions 3A and 9A face each other via the adhesive portion 6A, and in that state, the portions to be joined (conductive connecting portions 3A and 9A) Is sandwiched by a pair of known ultrasonic welding tools with a pressure load P, and ultrasonic vibration V is applied to the ultrasonic welding tools to bond the conductive connecting portions 3A, 9A located at the planned joining site as described above and to electrically connect them. By electrically connecting the IC chip mounting interposer A and the antenna holder B to each other, the RF-ID medium C shown in FIG. 3 is obtained. It is preferable to appropriately select the shape and size of the ultrasonic horn and / or anvil of the ultrasonic welding tool, the shape of the contact surface with the planned welding site, and the like so as to match the planned welding site.
【００１６】上記の実施形態においては、導電接続部３
Ａ、９Ａのいずれもが櫛型の形状を有する例を示した
が、格子型でもよく、両者は同じ形状を有する導電接続
部でもよいが、一方が櫛型の形状で、他方が格子型でも
よい。In the above embodiment, the conductive connecting portion 3
Although both A and 9A have a comb shape, they may be a lattice type, and both may be conductive connecting portions having the same shape, but one may have a comb shape and the other may have a lattice shape. Good.
【００１７】図４（イ）〜（ニ）は、本発明で用いる他
の格子型、櫛型の形状の導電接続部を模式的に示す説明
図である。図４（イ）は、格子型の形状を有する導電接
続部を示す。導電接続部１４は、複数の導電部１５と、
導電部１５の間に複数の非導電部１６が混在している形
状を有する。図４（ロ）は、他の格子型の形状を有する
導電接続部を示す。導電接続部１７は、複数の導電部１
５と、導電部１５の間に複数の非導電部１６が混在して
いる形状を有する。図４（ハ）は、他の櫛型の形状を有
する導電接続部を示す。導電接続部１８は、複数の導電
部１５と、導電部１５の間に複数の非導電部１６が混在
している形状を有する。図４（ニ）は、他の格子型の形
状を有する導電接続部を示す。導電接続部１９は、複数
の導電部１５と、導電部１５の間に複数の非導電部１６
が混在している形状を有する。FIGS. 4A to 4D are explanatory views schematically showing another lattice-shaped or comb-shaped conductive connecting portion used in the present invention. FIG. 4A shows a conductive connection portion having a lattice type shape. The conductive connection portion 14 includes a plurality of conductive portions 15 and
It has a shape in which a plurality of non-conductive portions 16 are mixed between the conductive portions 15. FIG. 4B shows a conductive connecting portion having another lattice type shape. The conductive connection portion 17 includes a plurality of conductive portions 1.
5 and the plurality of non-conductive portions 16 are mixed between the conductive portions 15. FIG. 4C shows another conductive connection portion having a comb shape. The conductive connection portion 18 has a shape in which a plurality of conductive portions 15 and a plurality of non-conductive portions 16 are mixed between the conductive portions 15. FIG. 4D shows a conductive connecting portion having another lattice type shape. The conductive connection portion 19 includes a plurality of conductive portions 15 and a plurality of non-conductive portions 16 between the conductive portions 15.
Have a mixed shape.
【００１８】上記実施形態では導電接続部３Ａ全面に絶
縁性接着剤を塗布して接着剤部６Ａを形成した例を示し
たが、パターン状に形成してもよく、また接着部層６Ａ
はアンテナ所持体Ｂ側の対応する箇所（接合予定部位）
に形成してもよく、あるいはＩＣチップ実装インターポ
ーザＡ側とアンテナ所持体Ｂ側の両方に形成してもよ
い。In the above embodiment, an example in which an insulating adhesive is applied to the entire surface of the conductive connecting portion 3A to form the adhesive portion 6A has been described, but it may be formed in a pattern or the adhesive portion layer 6A.
Is the corresponding location on the antenna holder B side (site to be joined)
Or on both the IC chip mounting interposer A side and the antenna holder B side.
【００１９】本発明で用いる基材の素材としては、ガラ
ス繊維、アルミナ繊維、ポリエステル繊維、ポリアミド
繊維などの無機または有機繊維からなる織布、不織布、
マット、紙あるいはこれらを組み合わせたもの、あるい
はこれらに樹脂ワニスを含浸させて成形した複合基材、
ポリアミド系樹脂基材、ポリエステル系樹脂基材、ポリ
オレフィン系樹脂基材、ポリイミド系樹脂基材、エチレ
ン・ビニルアルコール共重合体基材、ポリビニルアルコ
ール系樹脂基材、ポリ塩化ビニル系樹脂基材、ポリ塩化
ビニリデン系樹脂基材、ポリスチレン系樹脂基材、ポリ
カーボネート系樹脂基材、アクリロニトリルブタジエン
スチレン共重合系樹脂基材、ポリエーテルスルホン系樹
脂基材などのプラスチック基材、あるいはこれらにコロ
ナ放電処理、プラズマ処理、紫外線照射処理、電子線照
射処理、フレームプラズマ処理およびオゾン処理などの
表面処理を施したもの、などの公知のものから選択して
用いることができる。Materials for the substrate used in the present invention include woven and non-woven fabrics made of inorganic or organic fibers such as glass fibers, alumina fibers, polyester fibers and polyamide fibers.
Matt, paper or a combination of these, or a composite base material formed by impregnating these with resin varnish,
Polyamide resin substrate, polyester resin substrate, polyolefin resin substrate, polyimide resin substrate, ethylene / vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, poly Vinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin substrate, polyether sulfone resin substrate or other plastic substrate, or corona discharge treatment, plasma It is possible to select and use from known ones such as treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, surface treatment such as flame plasma treatment and ozone treatment.
【００２０】本発明において用いられる紙基材は、例え
ば通常の紙、上質紙、上質コート紙、中質紙、中質コー
ト紙などでよく特に限定されるものではない。通常の紙
としては、木材パルプと顔料を主成分として構成され
る。木材パルプとしてはＬＢＫＰ、ＮＢＫＰ、などの化
学パルプ、ＧＰ、ＰＧＷ、ＲＭＰ、ＴＭＰ、ＣＴＭＰ、
ＣＭＰ、ＣＧＰなどの機械パルプ、ＤＩＰなどの古紙パ
ルプなどのパルプを含み、必要に応じて従来の顔料やバ
インダーおよびサイズ剤や定着剤、歩留り向上剤、カチ
オン化剤、紙力増強剤などの各種添加剤を１種以上用い
て混合し、長網抄紙機、円網抄紙機、ツインワイヤ抄紙
機などの各種装置で製造が可能であり、酸性、中性、ア
ルカリ性で抄造できる。具体的には、例えば広葉樹パル
プ（例えば広葉樹晒クラフトパルプ（ＬＢＫＰ）、短繊
維）を６５±５質量％含み、残部が針葉樹パルプ（例え
ば針葉樹晒クラフトパルプ（ＮＢＫＰ）、長繊維）から
なる製紙用パルプを、３００〜６００ｍｌＣ．Ｓ．Ｆ．
に叩解し、これにクレー、カオリン、炭酸カルシウム、
二酸化チタン等のフィラー、澱粉、ＰＶＡ、ポリアクリ
ルアマイドなどの紙力増強剤、湿潤紙力増強剤、ロジン
系サイズ剤、アルキルケテンダイマー系サイズ剤等のサ
イズ剤、蛍光増白剤、着色染顔料、定着剤などを適宜添
加し、円網抄紙機や長網抄紙機などの公知の抄紙機を使
用して常法に基づき、通常４０〜１５０ｇ／ｍ2 で抄紙
することで製造された紙基材を挙げることができる。The paper substrate used in the present invention may be, for example, ordinary paper, high-quality paper, high-quality coated paper, medium-quality paper, medium-quality coated paper, etc., and is not particularly limited. Ordinary paper is mainly composed of wood pulp and pigment. As wood pulp, chemical pulp such as LBKP and NBKP, GP, PGW, RMP, TMP, CTMP,
Including mechanical pulp such as CMP and CGP, pulp such as waste paper pulp such as DIP, and various conventional pigments and binders and sizing agents, fixing agents, yield improving agents, cationizing agents, paper strengthening agents, etc. It is possible to use one or more kinds of additives and mix them, and manufacture with various devices such as a Fourdrinier paper machine, a cylinder paper machine, a twin wire paper machine, etc., and it is possible to perform papermaking with acidity, neutrality, and alkalinity. Specifically, for example, for papermaking, which contains 65 ± 5% by mass of hardwood pulp (for example, hardwood bleached kraft pulp (LBKP), short fibers) and the balance is softwood pulp (for example, softwood bleached kraft pulp (NBKP), long fibers). The pulp was mixed with 300-600 ml C.I. S. F.
Beat it into clay, kaolin, calcium carbonate,
Filler such as titanium dioxide, paper strength enhancer such as starch, PVA, polyacrylic amide, wet strength enhancer, rosin sizing agent, sizing agent such as alkyl ketene dimer sizing agent, optical brightening agent, coloring dye and pigment A paper base produced by making paper at a rate of usually 40 to 150 g / m 2 based on a conventional method using a known paper machine such as a cylinder paper machine or a Fourdrinier paper machine, by appropriately adding a fixing agent and the like. I can list materials.
【００２１】ＩＣチップ実装インターポーザとアンテナ
所持体とは同じ素材からなる基材を用いて形成してもよ
いし、異なる基材でもよい。またＩＣチップ実装インタ
ーポーザ、アンテナ所持体それぞれに関する形成は１個
ずつでなくともよく、それぞれ複数個（しかも同種でも
異種でもよい）でも構わない。The IC chip mounting interposer and the antenna carrier may be formed of the same base material or different base materials. Further, the IC chip mounting interposer and the antenna carrier may not be formed one by one, but may be formed in plural (and may be of the same kind or different kinds).
【００２２】上記ＩＣチップ実装インターポーザでの導
電パターン４の形成、アンテナ所持体での導電パターン
１０の形成は、それぞれ公知の方法で行うことができ
る。例えば、導電ペーストをスクリーン印刷やインクジ
ェット方式印刷により印刷して乾燥固定化する方法、被
覆あるいは非被覆金属線の貼り付け、エッチング、デイ
スペンス、金属箔貼り付け、金属の直接蒸着、金属蒸着
膜転写、導電高分子層形成などが挙げられるがこの限り
でない。The formation of the conductive pattern 4 on the IC chip mounting interposer and the formation of the conductive pattern 10 on the antenna holder can be performed by known methods. For example, a method in which a conductive paste is printed by screen printing or inkjet printing to be dried and fixed, attachment of a coated or uncoated metal wire, etching, dispersion, metal foil attachment, direct vapor deposition of metal, metal vapor deposition film transfer, Examples thereof include formation of a conductive polymer layer, but are not limited thereto.
【００２３】またアンテナ所持体において、導電パター
ン１０は必ずしも片面に限られることはなく、裏面に
も、さらに最終的にアンテナとして働く接続が保証され
るならば内層に形成されてもよい。またそれらを多重に
複合させたアンテナでもよい。さらに必要に応じてジャ
ンパー線によって他の線を跨いだパターンでもよい。形
成したアンテナを保護するためにコーティングしてもよ
い。Further, in the antenna holder, the conductive pattern 10 is not necessarily limited to one side, and may be formed on the back side as well as on the inner layer as long as the connection which finally functions as an antenna is guaranteed. Further, it may be an antenna in which they are multiplexed. Further, it may be a pattern in which other lines are crossed by jumper lines as needed. It may be coated to protect the formed antenna.
【００２４】ＩＣチップ実装インターポーザを形成する
プロセスでのＩＣチップの実装は、ワイヤーボンデイン
グ（ＷＢ）を始めとして、異方性導電フィルム（ＡＣ
Ｆ）、導電ペースト（ＡＣＰ）、絶縁樹脂（ＮＣＰ）、
絶縁フィルム（ＮＣＦ）、クリーム半田ボールを用いた
ものなど、公知の方法で接続できる。必要であれば、公
知のアンダーフィル材あるいはポッティング材による接
続部の保護・補強を行ってもよい。The mounting of the IC chip in the process of forming the IC chip mounting interposer includes wire bonding (WB) and anisotropic conductive film (AC).
F), conductive paste (ACP), insulating resin (NCP),
The connection can be made by a known method such as using an insulating film (NCF) or a cream solder ball. If necessary, the connection portion may be protected and reinforced with a known underfill material or potting material.
【００２５】本発明で用いる接着剤は、前記ＩＣチップ
実装インターポーザとアンテナ所持体を強固に導通接合
できるものであれば絶縁性接着剤でも導電性接着剤でも
よく特に限定されるものではない。具体的には、例え
ば、ホットメルト接着剤、粘着剤、熱可塑性樹脂接着剤
あるいは熱硬化性樹脂接着剤あるいは紫外線、電子線な
どにより硬化する接着剤、天然ゴム系接着剤、合成ゴム
系接着剤など、あるいはこれらの組み合わせからなる絶
縁性接着剤を挙げることができる。これらの絶縁性接着
剤に銀、アルミニウムなどを配合して導電性を付与した
導電性接着剤や導電性高分子からなる導電性接着剤など
を挙げることができる。これらの中でも絶縁性接着剤は
より良好な高い接着強度が得られるので好ましく使用で
きる。粘着剤としては天然ゴムや合成ゴムに粘着付与剤
（ロジンおよびロジン誘導体、ポリテルベン樹脂、テル
ペンフェノール樹脂、石油樹脂）、軟化剤（液状ポリブ
テン、鉱油、液状ポリイソブチレン、液状ポリアクリル
酸エステル）、老化防止剤などの公知の添加剤を混合し
たゴム系、ガラス転移温度の異なる複数のアクリル酸エ
ステルと他種官能性単量体とを共重合したアクリル系、
シリコーンゴムと樹脂からなるシリコーン系、ポリエー
テルやポリウレタン系粘着剤などは好ましく使用でき
る。これらの接着剤や粘着剤は、溶液に溶かした溶液型
のほか、水系エマルジョン型、加熱溶融塗布後冷却で固
化するホットメルト型、液状オリゴマーや単量体などを
塗布後、加熱や紫外線、電子線などの放射線の照射によ
り硬化するものなどがあるが、いずれも使用できる。The adhesive used in the present invention is not particularly limited and may be an insulating adhesive or a conductive adhesive as long as the IC chip mounting interposer and the antenna holder can be firmly conductively joined. Specifically, for example, hot melt adhesives, pressure sensitive adhesives, thermoplastic resin adhesives or thermosetting resin adhesives, adhesives that are cured by ultraviolet rays, electron beams, etc., natural rubber adhesives, synthetic rubber adhesives Etc., or an insulating adhesive composed of a combination thereof. Examples of the insulating adhesive include a conductive adhesive obtained by blending silver, aluminum or the like with conductivity to give conductivity, or a conductive adhesive made of a conductive polymer. Among these, the insulating adhesive can be preferably used because it can obtain better high adhesive strength. As adhesives, tackifiers (rosin and rosin derivatives, polyterbene resins, terpene phenol resins, petroleum resins) on natural and synthetic rubbers, softeners (liquid polybutene, mineral oil, liquid polyisobutylene, liquid polyacrylates), aging A rubber system in which a known additive such as an inhibitor is mixed, an acrylic system in which a plurality of acrylic acid esters having different glass transition temperatures and other functional monomers are copolymerized,
Silicone-based adhesives composed of silicone rubber and resin, polyether or polyurethane-based adhesives, etc. can be preferably used. These adhesives and pressure-sensitive adhesives are, in addition to a solution type dissolved in a solution, an aqueous emulsion type, a hot-melt type that is solidified by cooling after heating and melting application, after applying a liquid oligomer or monomer, etc. Some of them can be cured by irradiation with radiation such as rays, but any of them can be used.
【００２６】本発明で用いる接着剤に、必要に応じて、
シリカ、アルミナ、ガラス、タルク、各種ゴムなどの絶
縁性粉末、あるいは離型剤、表面処理剤、充填剤、顔
料、染料などの公知の添加剤を添加したりすることがで
きる。The adhesive used in the present invention may optionally contain
Insulating powders such as silica, alumina, glass, talc and various rubbers, or known additives such as release agents, surface treatment agents, fillers, pigments and dyes can be added.
【００２７】上記ＩＣチップ実装インターポーザとアン
テナ所持体との導電接続部は、設計上製造加工し易い任
意の方法でつくればよく、ＩＣチップ実装用導電部ほど
の精密さが必要ない加工許容度の高い構造でよい。The conductive connecting portion between the IC chip mounting interposer and the antenna holder may be formed by an arbitrary method that is easy to manufacture and process in terms of design, and does not require the precision of the conductive portion for mounting the IC chip and has a processing allowance. High structure is enough.
【００２８】上記実施形態では非接触ＩＣタグなどの薄
形の情報送受信型記録メディアなどに用いられるＲＦ−
ＩＤメディアの導電接続部同士の接続について説明した
が、他の導電接続部同士の接続にも適用することがで
き、具体的には、例えば、ペーパーコンピュータ、使い
捨て電気製品などの導電接続部同士の接続などにも適用
して接着剤部を介して接着するとともに電気的導通を図
ることができる。In the above embodiment, the RF-type used in a thin information transmission / reception type recording medium such as a non-contact IC tag.
Although the connection between the conductive connection portions of the ID medium has been described, the present invention can be applied to the connection between other conductive connection portions, and specifically, for example, between the conductive connection portions such as a paper computer and a disposable electric product. It can also be applied to a connection or the like to be adhered via an adhesive portion and to achieve electrical conduction.
【００２９】なお、上記実施形態の説明は、本発明を説
明するためのものであって、特許請求の範囲に記載の発
明を限定し、或は範囲を減縮するものではない。又、本
発明の各部構成は上記実施形態に限らず、特許請求の範
囲に記載の技術的範囲内で種々の変形が可能である。The above description of the embodiments is for explaining the present invention and does not limit the invention described in the claims or reduce the scope thereof. Further, the configuration of each part of the present invention is not limited to the above embodiment, and various modifications can be made within the technical scope described in the claims.
【００３０】[0030]
【実施例】以下実施例によって、本発明をさらに詳細に
説明するが、本発明はこれらの実施例に限定されるもの
ではない。
（実施例１）
（Ａ）ＰＥＴ基材および紙基材面に導電インク（ＬＳ４
１５Ｃ−Ｋ、アサヒ化学研究所製）を用いて、アンテナ
部を印刷し、１５０℃、３０分の加熱して図２に示した
櫛型の形状の導電接続部（線巾０．３ｍｍ、線間距離
０．３ｍｍ）および図４（イ）に示した格子型の形状の
導電接続部（線巾０．３ｍｍ、線間距離０．３ｍｍ）を
作成した。
（Ｂ）ＰＥＴ基材および紙基材面にエッチング法を用い
て、図１に示した櫛型の形状の導電接続部（線巾０．３
ｍｍ、線間距離０．３ｍｍ）および図４（イ）に示した
格子型の形状の導電接続部（線巾０．３ｍｍ、線間距離
０．３ｍｍ）を作成し、ホットメルト接着剤を適量全面
に塗布した。（Ａ）と（Ｂ）の導電接続部同士を重ね合
わせ、２００℃、０．１ＭＰａ、２０秒熱圧着して接着
した。ＰＥＴ基材を用いた場合の接着強度は２５００ｇ
／ｃｍ2 であり、（Ａ）と（Ｂ）の導電接続部同士が良
好に接着するとともに、良好に電気的に導通していた。
紙基材を用いた場合は剥離すると紙基材が剥離する材料
破壊が起こり導電接続部同士が良好に接着するととも
に、良好に電気的に導通していた。The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples. (Example 1) (A) Conductive ink (LS4) on the surface of PET substrate and paper substrate
15C-K, manufactured by Asahi Chemical Laboratory Co., Ltd., the antenna part is printed and heated at 150 ° C. for 30 minutes, and the comb-shaped conductive connection part (line width 0.3 mm, line) shown in FIG. (Distance between 0.3 mm) and a grid-shaped conductive connecting portion (line width: 0.3 mm, line spacing: 0.3 mm) shown in FIG. (B) By using an etching method on the surfaces of the PET base material and the paper base material, the comb-shaped conductive connection portion (line width 0.3
mm, line distance 0.3 mm) and the grid-shaped conductive connection part (line width 0.3 mm, line distance 0.3 mm) shown in FIG. 4 (a), and an appropriate amount of hot melt adhesive. It was applied to the entire surface. The conductive connection portions of (A) and (B) were overlapped with each other, and thermocompression-bonded at 200 ° C. and 0.1 MPa for 20 seconds to bond them. Adhesive strength when using PET substrate is 2500g
/ Cm 2 , and the conductive connection portions of (A) and (B) were favorably adhered to each other and were electrically conducted well.
When the paper base material was used, the paper base material was peeled off when peeled, resulting in material breakage, good adhesion between the conductive connecting portions, and good electrical continuity.
【００３１】（実施例２）紙基材面に導電インク（ＬＳ
４１５Ｃ−Ｋ、アサヒ化学研究所製）を用いて、アンテ
ナ部を印刷し、１５０℃、３０分の加熱して図２に示し
た櫛型の形状の導電接続部（線巾０．３ｍｍ、線間距離
０．３ｍｍ）を作成し、導電接続部以外のアンテナ部は
絶縁性インクを印刷して絶縁加工を行い、そして導電接
続部全面に絶縁性接着剤［ケミタイトＴＮＰ０１００、
東芝ケミカル社製］を印刷して塗布した。一方、紙基材
面に銅エッチング法を用いて、図１に示した櫛型の形状
の導電接続部（線巾０．３ｍｍ、線間距離０．３ｍｍ）
を備えたインターポーザを作成した。両者の導電接続部
同士が絶縁性接着剤部を介して相対するように重ね合わ
せて４ｋｇ／ｃｍ2 、２００℃、３０秒の条件で熱圧着
して接着するとともに電気的導通を図り、ＩＣチップ実
装インターポーザとアンテナ所持体とを接合すること
で、図３に示すＲＦ−ＩＤメディアを作製した。これを
ＮＩＰに貼り合わせた状態で８５℃、８５％ＲＨの環境
に放置したが、導電接続部同士は良好に接着しており、
通信状態に変化はなく、良好な状態が維持された。(Example 2) Conductive ink (LS) was applied to the surface of a paper base material.
415C-K, manufactured by Asahi Chemical Laboratory Co., Ltd., the antenna part is printed and heated at 150 ° C. for 30 minutes, and the comb-shaped conductive connection part (line width 0.3 mm, line) shown in FIG. (Distance 0.3 mm) is made, the antenna part other than the conductive connection part is printed with an insulating ink for insulation processing, and an insulating adhesive [Chemite TNP0100,
Toshiba Chemical Co., Ltd.] was printed and applied. On the other hand, using a copper etching method on the surface of the paper base material, the comb-shaped conductive connection portion shown in FIG. 1 (line width 0.3 mm, line spacing 0.3 mm)
I created an interposer with. The conductive connection parts of both are superposed so that they face each other via the insulating adhesive part, and thermocompression-bonded under the conditions of 4 kg / cm 2 , 200 ° C., and 30 seconds for adhesion, and electrical conduction is achieved. The mounting interposer and the antenna holder were joined together to produce the RF-ID medium shown in FIG. Although this was left in an environment of 85 ° C. and 85% RH in a state of being attached to NIP, the conductive connection parts were well adhered to each other,
There was no change in communication status and good condition was maintained.
【００３２】（実施例３）紙基材［上質紙（三菱製紙社
製、金菱３５）面に導電インク（Ｎ−５８４５−１、昭
栄化学工業社製）を用いて、アンテナ部を印刷し、１６
０℃、３０分の加熱して図２に示した櫛型の形状の導電
接続部（線巾０．３ｍｍ、線間距離０．３ｍｍ）を作成
し、導電接続部以外のアンテナ部は絶縁性インクを印刷
して絶縁加工を行い、そして導電接続部全面に異方性絶
縁性接着剤［ケミタイトＸＡＰ０１００、東芝ケミカル
社製］をデイスペンサーにより塗布した。一方、紙基材
面に銅エッチング法を用いて、図１に示した櫛型の形状
の導電接続部（線巾０．３ｍｍ、線間距離０．３ｍｍ）
を備えたインターポーザを作成した。両者の導電接続部
同士が異方性絶縁性接着剤部を介して相対するように重
ね合わせて４ｋｇ／ｃｍ2 、２００℃、３０秒の条件で
熱圧着して接着するとともに電気的導通を図り、ＩＣチ
ップ実装インターポーザとアンテナ所持体とを接合する
ことで、図３に示すＲＦ−ＩＤメディアを作製した。こ
れをＮＩＰに貼り合わせた状態で８５℃、８５％ＲＨの
環境に放置したが、導電接続部同士は良好に接着してお
り、通信状態に変化はなく、良好な状態が維持された。Example 3 A paper substrate [a high-quality paper (manufactured by Mitsubishi Paper Mills, Kinryo 35) surface was printed with an antenna portion using conductive ink (N-5845-1, manufactured by Shoei Chemical Industry Co., Ltd.). , 16
By heating at 0 ° C. for 30 minutes, the comb-shaped conductive connection portion (line width 0.3 mm, line spacing 0.3 mm) shown in FIG. 2 is formed, and the antenna portion other than the conductive connection portion is insulating. An ink was printed for insulation, and an anisotropic insulating adhesive [Chemite XAP0100, manufactured by Toshiba Chemical Co.] was applied to the entire surface of the conductive connection portion by a dispenser. On the other hand, using a copper etching method on the surface of the paper base material, the comb-shaped conductive connection portion shown in FIG. 1 (line width 0.3 mm, line spacing 0.3 mm)
I created an interposer with. The conductive connecting parts of both are superposed so as to face each other via the anisotropic insulating adhesive part, and thermocompression-bonded under the conditions of 4 kg / cm 2 , 200 ° C. and 30 seconds for adhesion and electrical conduction. By joining the IC chip mounting interposer and the antenna holder, the RF-ID medium shown in FIG. 3 was produced. This was left in an environment of 85 ° C. and 85% RH in a state of being bonded to NIP, but the conductive connection portions were well adhered to each other, and the communication state did not change, and the good state was maintained.
【００３３】[0033]
【発明の効果】本発明の請求項１記載の導電接続部同士
の接続方法は、基材上に形成された電気回路の櫛型また
は格子型の形状の導電接続部同士の接続方法であって、
少なくとも一方の導電接続部面に接着剤を塗布し、更に
熱圧着して接続することを特徴とするものであり、両方
の導電接続部が接着剤を介して相対するように重ね合わ
せて、超音波やプレスなどを用いて熱圧着すると、導電
部（凸部）に介在していた接着剤は流れたりはみだした
りして導電接続部の周辺および非導電部（凹部）に移行
するため、接着剤として絶縁性接着剤を用いても凸部同
士は接着剤を介さずに直接接触して良好な電気的導通が
得られるとともに、導電接続部の周辺および凹部には移
行してきた接着剤を含めて多量の接着剤が介在するので
導電接続部同士の良好な接着が容易に得られるという顕
著な効果を奏する。また、接着剤をパターン状に塗布す
る従来法に較べて作業が容易になる効果がある。According to the first aspect of the present invention, there is provided a method for connecting conductive connecting portions to each other, which is a method for connecting conductive connecting portions having a comb-like or lattice-like shape of an electric circuit formed on a base material. ,
An adhesive is applied to at least one of the conductive connection surfaces, and further thermocompression bonding is performed for connection, and both conductive connection parts are superposed so that they face each other via the adhesive. When thermocompression bonding is performed using a sound wave or a press, the adhesive that has been present in the conductive part (convex part) flows or spills out and migrates to the periphery of the conductive connection part and the non-conductive part (concave part). As a result, even if an insulating adhesive is used, the convex parts directly contact each other without an adhesive to obtain good electrical conduction, and the adhesive that has migrated to the periphery of the conductive connection part and the concave part is included. Since a large amount of adhesive intervenes, it is possible to easily obtain good adhesion between the conductive connection portions. Further, there is an effect that the work becomes easier as compared with the conventional method of applying the adhesive in a pattern.
【００３４】本発明の請求項２記載の導電接続部同士の
接続方法は、請求項１記載の導電接続部同士の接続方法
において、前記接着剤が絶縁性接着剤であるので、請求
項１記載の導電接続部同士の接続方法と同じ効果を奏す
る上、導電接続部同士のより良好な接着が容易に得られ
るというさらなる顕著な効果を奏する。According to a second aspect of the present invention, in the method for connecting the conductive connection portions to each other, the adhesive is an insulating adhesive in the method for connecting the conductive connection portions to each other. In addition to the same effect as the method of connecting the conductive connection portions, the further remarkable effect that better adhesion between the conductive connection portions can be easily obtained is obtained.
【００３５】本発明の請求項３記載の導電接続部同士の
接続方法は、請求項１あるいは請求項２記載の導電接続
部同士の接続方法において、前記基材が紙基材であるの
で、請求項１記載の導電接続部同士の接続方法と同じ効
果を奏する上、導電接続部の周辺にはみ出したり凹部に
移行してきた接着剤の少なくとも一部を紙基材が浸透、
吸収するので導電接続部同士のより良好な接着が得られ
るというさらなる顕著な効果を奏する。According to a third aspect of the present invention, there is provided a method for connecting electrically conductive connecting portions with each other, wherein the base material is a paper base material. In addition to exhibiting the same effect as the method of connecting the conductive connecting portions with each other according to item 1, the paper base material penetrates at least a part of the adhesive protruding to the periphery of the conductive connecting portions or having migrated to the recesses,
Since it absorbs, a further remarkable effect is obtained in that better adhesion between the conductive connection portions can be obtained.
【図１】（イ）〜（ニ）は本発明の導電接続部同士の接
続方法を説明するためのＩＣチップ実装インターポーザ
の形成過程を示す説明図である。1A to 1D are explanatory views showing a process of forming an IC chip mounting interposer for explaining a method of connecting conductive connection portions of the present invention.
【図２】（イ）〜（ロ）は本発明の導電接続部同士の接
続方法を説明するためのアンテナ所持体の形成過程を示
す説明図である。2A to 2B are explanatory views showing a process of forming an antenna holder for explaining a method of connecting conductive connection portions of the present invention.
【図３】ＲＦ−ＩＤメディアを示す説明図である。FIG. 3 is an explanatory diagram showing an RF-ID medium.
【図４】（イ）〜（ニ）は本発明で用いる他の櫛型また
は格子型の形状の導電接続部を示す説明図である。4A to 4D are explanatory views showing another comb-shaped or lattice-shaped conductive connection portion used in the present invention.
【図５】（イ）〜（ニ）は従来の導電接続部を備えたＩ
Ｃチップ実装インターポーザの形成過程を示す説明図で
ある。5 (a) to (d) are I equipped with a conventional conductive connecting portion.
It is explanatory drawing which shows the formation process of a C-chip mounting interposer.
【図６】（イ）〜（ロ）は従来の導電接続部を備えたア
ンテナ所持体の形成過程を示す説明図である。6A to 6B are explanatory views showing a process of forming an antenna holder having a conventional conductive connecting portion.
【図７】従来のＲＦ−ＩＤメディアを示す説明図であ
る。FIG. 7 is an explanatory diagram showing a conventional RF-ID medium.
１ 基材 １Ａ 紙基材 ２ ＩＣチップ実装用導電部 ３、３Ａ 導電接続部 ４ 導電パターン ５ ＩＣチップ ６、６Ａ 接着剤部 ７ 基材 ７Ａ 紙基材 ８ アンテナ導電部 ９、９Ａ、１４、１７、１８、１９ 導電接続部 １０ 導電パターン １１ 絶縁部 １２、１５ 導電部 １３、１６ 非導電部 Ａ ＩＣチップ実装インターポーザ Ｂ アンテナ所持体 Ｃ ＲＦ−ＩＤメディア 1 base material 1A Paper base 2 IC chip mounting conductive part 3, 3A conductive connection 4 Conductive pattern 5 IC chip 6,6A Adhesive part 7 Base material 7A Paper base material 8 Antenna conductive part 9, 9A, 14, 17, 18, 19 Conductive connection part 10 Conductive pattern 11 Insulation part 12, 15 Conductive part 13, 16 Non-conductive part A IC chip mounting interposer B Antenna holder C RF-ID media
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5B035 BA03 BB09 CA01 CA08 CA23 5E317 AA04 AA11 GG03 5E344 AA02 AA22 BB02 BB14 CC23 CD01 CD02 CD28 CD38 DD10 DD14 DD16 EE08 EE17 EE23 5J046 AA02 AA09 AA10 AB11 PA07 ─────────────────────────────────────────────────── ─── Continued front page F term (reference) 5B035 BA03 BB09 CA01 CA08 CA23 5E317 AA04 AA11 GG03 5E344 AA02 AA22 BB02 BB14 CC23 CD01 CD02 CD28 CD38 DD10 DD14 DD16 EE08 EE17 EE23 5J046 AA02 AA09 AA10 AB11 PA07
Claims (3)
は格子型の形状の導電接続部同士の接続方法であって、
少なくとも一方の導電接続部面に接着剤を塗布し、更に
熱圧着して接続することを特徴とする導電接続部同士の
接続方法。1. A method for connecting comb-shaped or lattice-shaped conductive connecting portions of an electric circuit formed on a base material, comprising:
A method for connecting conductive connection parts, characterized in that an adhesive is applied to at least one conductive connection part surface, and then thermocompression bonding is performed for connection.
特徴とする請求項１記載の導電接続部同士の接続方法。2. The method for connecting electrically conductive connecting portions with each other according to claim 1, wherein the adhesive is an insulating adhesive.
る請求項１あるいは請求項２記載の導電接続部同士の接
続方法。3. The method for connecting conductive connection portions according to claim 1, wherein the base material is a paper base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002083588A JP2003283120A (en) | 2002-03-25 | 2002-03-25 | Method of mutually connecting electrically conductive connecting sections |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002083588A JP2003283120A (en) | 2002-03-25 | 2002-03-25 | Method of mutually connecting electrically conductive connecting sections |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003283120A true JP2003283120A (en) | 2003-10-03 |
Family
ID=29231300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002083588A Pending JP2003283120A (en) | 2002-03-25 | 2002-03-25 | Method of mutually connecting electrically conductive connecting sections |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003283120A (en) |
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