JP2003069216A - Method for connecting conductive connectors to each other - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for connecting conductive connectors to each other without interrupting an electrical connection even when an external force is concentrated at connecting conductive parts by rigidly conductively connecting the conductive connectors of an IC chip mounting interposer and an antenna carrier. SOLUTION: The method for connecting the conductive connectors to each other comprises the steps of bringing at least the conductive connectors 3 into contact with each other via an adhesive part 5 formed in a pattern-like state, and connecting the conductive connectors 3 to each other. Accordingly, a sufficient adhesion of the conductive connectors is obtained. The external force is concentrated at the connectors and yet the electrical connection is not disconnected. Even when a base is nut heat fusion bonded like paper or the like, a physical adhesion is obtained, and the connectors can be worked in a short time, its cost can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting electrically conductive connecting parts, and more specifically, non-contact I
R such as thin information transmission / reception type recording media such as C tag
F-ID (RadioFrequency IDent
The present invention relates to a method for connecting conductive connection parts of media, paper computers, disposable electric appliances, and the like.

[0002]

2. Description of the Related Art A conventional method of joining conductive connection portions of a wiring board using ultrasonic waves (Japanese Patent Laid-Open No. 2001-7511) will be described with reference to FIG. According to this joining method, the first wiring substrate 100 in which a conductor pattern 102 formed by etching a copper foil on a surface of a thin resin substrate 104 is adhered
And a second conductive pattern 202 formed by etching an aluminum foil on the surface of a thin resin substrate 204.
The wiring board 200, the first wiring board 100 and the second wiring board 200 are to be joined to each other on the conductor pattern 10
3, 203 are superposed in a face-to-face state so that they are aligned with each other, and in that state, the planned joining portions 103, 203 are sandwiched by a pair of ultrasonic welding tools 40, 41, and ultrasonic vibration is applied to the ultrasonic welding tools. The conductor metals located at the planned joining sites are fused together and the resin substrates are fused together to achieve electrical continuity. 40 is an ultrasonic horn, 41 is an anvil, 101,
201 is an electronic component, 300 is a contact interface, P is a pressure load,
V indicates ultrasonic vibration.

[0003]

SUMMARY OF THE INVENTION The above-mentioned joining method (Japanese Patent Laid-Open No. 2-212058)
No. 001-7511) does not use a separate member such as an adhesive and the processing time is a short time of about 0.5 seconds, so that there is an advantage such as cost reduction, but a metal having a matte surface, In the case of a conductive pattern formed by printing using a conductive silver paste, there is a problem that the planned joining portions 103 and 203 cannot be sufficiently bonded to each other.

An object of the present invention is to solve the conventional problems and to provide a conductive connection capable of sufficient adhesion even in the case of a metal having a matte surface or a conductive pattern formed by printing using a conductive silver paste. It is to provide a method for adhering parts to each other.

[0005]

Means for Solving the Problems As a result of intensive studies to solve the above problems, the inventors of the present invention have found that conductive connection parts are connected to each other through an adhesive part formed in a pattern. It was found that sufficient adhesion and conduction can be obtained by the above, and the present invention has been completed.

That is, in the method for connecting the conductive connecting portions to each other according to the first aspect of the present invention, at least the conductive connecting portions are brought into contact with each other via the adhesive portion formed in a pattern to connect the conductive connecting portions. It is characterized by

According to a second aspect of the present invention, there is provided a method for connecting electrically conductive connecting portions to each other according to the first aspect,
It is characterized in that the conductive connection portions are connected to each other using heat, pressure, ultrasonic waves, light, electromagnetic waves or a combination thereof.

According to the method of the present invention, even in the case of a metal having a matte surface or a conductive pattern formed by printing using a conductive silver paste, an adhesive portion having conductive connection portions formed in a pattern is formed. Since the conductive connecting portions are connected to each other via the contact, the adhesive portions formed in a pattern form sufficient adhesion between the conductive connecting portions, and sufficient conduction is obtained by direct contact between the conductive connecting portions. To be

[0009]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. First, the structure of an antenna circuit body is divided into an IC chip mounting interposer and an antenna holder, and the IC chip mounting interposer and the antenna holder are formed in advance, and when the antenna circuit body is formed using them. A method of connecting the conductive connecting portions will be described.

FIG. 1 shows a process of forming one of the IC chip mounting interposers. First, a base material 1 having a predetermined size is prepared so as to extend over the terminal portion of an antenna holder, which will be described later (a). Conductive part 2 for mounting IC chip on material 1
And a pair of conductive patterns 4 in which the conductive connection portion 3 is continuous
(B). Thereafter, the IC chip 5 is mounted so as to extend over the IC chip mounting conductive portion 2 to form the IC chip mounting interposer A (C), and at least the IC
An adhesive agent is applied in a pattern on the conductive connection section 3 (scheduled joining site) on which the chip 5 is mounted to form the adhesive section 6 (d).

FIG. 2 shows a process of forming the other antenna holder B. A base material 7 having a predetermined size is prepared (a), and the antenna conductive portion 8 and the antenna conductive portion 8 are provided on the base material 7. Conductive connection portion 9 located at the end of the terminal and serving as a terminal portion
The conductive pattern 10 composed of (the part to be joined) is provided (b), and thereby the antenna holder B is formed.
The conductive connecting portion 9 is provided so as to correspond to the conductive connecting portion 3 of the IC chip mounting interposer A. 1
Reference numeral 1 is an insulating portion.

The IC chip mounting interposer A
And the antenna holder B are overlapped so that the respective conductive connecting portions 3 and 9 face each other via the adhesive portion 6 formed in a pattern, and in that state, they are scheduled to be joined as shown in FIG. The site (conductive connection parts 3, 9) is sandwiched by a pair of ultrasonic welding tools 40, 41 with a pressure load P, ultrasonic vibration V is applied to the ultrasonic welding tool, and the conductive connection part 3 is located at a site to be joined, 9 is adhered via the adhesive portion 6 formed in a pattern, electrical continuity is achieved, and the IC chip mounting interposer A and the antenna holder B are joined together, so that the RF-ID medium C shown in FIG. Is obtained.

In these joinings, the shape, size, and size of the ultrasonic horn 40 and / or the anvil 41 of the ultrasonic welding tool shown in FIG.
It is preferable to appropriately select the shape of the contact surface to the planned joining site.

Although not shown, the IC chip 5 is used in (c) above.
After mounting, the IC chip 5 can be sealed with a sealing agent to form the IC chip mounting interposer A.

By the adhesive portion 6 formed in a pattern, I
Since the C chip mounting interposer A and the conductive connecting portions 3 and 9 of the antenna holder B are conductively joined, the joining becomes strong, and as a result, even if an external force is concentrated on the conductive connecting portions 3 and 9, electrical connection is achieved. Even if the connection is interrupted or the base materials 1 and 7 are thin paper or the like having low strength and rigidity, the interposer A is not peeled off.

The conductive connection between the IC chip mounting interposer and the opposing conductive connection portion of the conductive connection portion of the antenna holder is performed by aligning the conductive connection portions, and then connecting the planned joining portions as described above. The ultrasonic welding tool is sandwiched, and ultrasonic vibration is applied to the ultrasonic welding tool to bond the ultrasonic welding tool through the adhesive part formed in a pattern, and at the same time, the IC chip mounting interposer and the antenna holder are electrically connected. Although they are bonded, heat or electromagnetic wave energy may be applied if necessary.

In this embodiment, an example in which thermocompression bonding is performed by ultrasonic waves has been shown, but the method of fixing the conductive connection portion and conductively connecting is not limited to this, and a known method such as a pressure bonding method using a press may be used. In addition, a method using light, an electromagnetic wave, an electron beam or a combination thereof can be used.

In this embodiment, an example is shown in which the adhesive portion 6 formed in a pattern is formed on the conductive connecting portion 3 of the IC chip mounting interposer A, but the adhesive portion layer 6 is a corresponding portion on the antenna holder B2 side. It may be formed in a pattern at (the site to be joined), or may be formed on both the IC chip mounting interposer A side and the antenna holder B side.

The adhesive portion 6 may be formed in a pattern on the entire surface of the IC chip mounting interposer A side, and the corresponding portion on the side of the antenna holder B (scheduled joining portion).
Alternatively, it may be formed in a pattern, or may be formed in a pattern both on the entire surface on the IC chip mounting interposer A side and on the corresponding portion on the antenna holder B side.

Further, if the amount of the adhesive in the adhesive portion 6 is too small, sufficient adhesion cannot be obtained, and conversely, if the amount is too large, electrical conduction will be insufficient, so sufficient adhesion will be obtained and electrical connection will be achieved. It is desirable to select an amount that allows sufficient conduction.
The pattern of the adhesive portion 6 is not particularly limited, but a line,
Patterns such as dots, grids, and combs are preferred.

The material of the base material 1 or the base material 7 used in the present invention is a woven cloth, a non-woven cloth, a mat, a paper or a combination thereof made of an inorganic or organic fiber such as glass fiber, alumina fiber, polyester fiber or polyamide fiber. Or a composite substrate formed by impregnating these with resin varnish, a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate, an ethylene / vinyl alcohol copolymer group Material,
Polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin substrate, polyether sulfone resin Select from known plastic substrates such as substrates, or those that have undergone surface treatment such as corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma treatment and ozone treatment. Can be used.

The IC chip mounting interposer and the antenna carrier may be formed of the same base material or different base materials. Further, the IC chip mounting interposer and the antenna carrier may not be formed one by one, but may be formed in plural (and may be of the same kind or different kinds).

The formation of the conductive pattern 4 on the IC chip mounting interposer and the formation of the conductive pattern 10 on the antenna holder can be performed by known methods. For example, a method in which a conductive paste is printed by screen printing or inkjet printing to be dried and fixed, attachment of a coated or uncoated metal wire, etching, dispersion, metal foil attachment, direct vapor deposition of metal, metal vapor deposition film transfer, Examples thereof include formation of a conductive polymer layer, but are not limited thereto.

Further, in the antenna holder, the conductive pattern 10 is not necessarily limited to one side, but may be formed on the back side as well as on the inner layer as long as the connection which finally functions as the antenna is guaranteed. Further, it may be an antenna in which they are multiplexed. Further, it may be a pattern in which other lines are crossed by jumper lines as needed. It may be coated to protect the formed antenna.

The mounting of the IC chip in the process of forming the IC chip mounting interposer includes wire bonding (WB) and anisotropic conductive film (AC).
F), conductive paste (ACP), insulating resin (NCP),
The connection can be made by a known method such as using an insulating film (NCF) or a cream solder ball. If necessary, the connection portion may be protected and reinforced with a known underfill material or potting material.

The adhesive used in the present invention is not particularly limited as long as it can firmly and electrically bond the IC chip mounting interposer and the antenna holder to each other. Specifically, for example, a hot melt adhesive, Adhesives, thermoplastic resin adhesives, thermosetting resin adhesives, adhesives that are cured by ultraviolet rays, electron beams, etc., natural rubber adhesives, synthetic rubber adhesives, etc., or adhesives composed of combinations thereof, etc. On the other hand, there may be mentioned one in which a conductive powder is blended. As an adhesive, a tackifier (rosin and rosin derivative, polyterbene resin, terpene phenol resin, petroleum resin) to natural rubber or synthetic rubber,
A rubber system containing known additives such as softening agents (liquid polybutene, mineral oil, liquid polyisobutylene, liquid polyacrylic acid ester) and anti-aging agents, multiple acrylic acid esters with different glass transition temperatures and other functional monofunctional compounds. Acrylics copolymerized with a polymer, silicones composed of silicone rubber and resin, polyether or polyurethane adhesives can be preferably used. These adhesives and pressure-sensitive adhesives are, in addition to a solution type dissolved in a solution, an aqueous emulsion type, a hot-melt type that is solidified by cooling after heating and melting application, after applying a liquid oligomer or monomer, etc. Some of them can be cured by irradiation with radiation such as rays, but any of them can be used.

The adhesive used in the present invention may be either insulating or conductive. In this case, as the conductive powder to be blended with the conductive adhesive, the following a to j and the like can be exemplified. a. Silver powder Dowa Mining Co., Ltd. G-10,11,12,13,1
5-H, 15H, 18, Chemical Flake Co., Ltd. Tokuriki Main Store TCG-1, 1A, 5, 7, 11
N, 7V, TC-12, 20E, 20V, 25A, J-
20, E-20, G-1, H-1, AgF-5S, Ag
F-10S manufactured by Tanaka Kikinzoku Kogyo Co., Ltd. AY-6010, 6080 b. Conductive carbon black Mitsubishi Chemical Corporation Ketjen Black EC, EC-
600JD Denki Kagaku Co., Ltd. Acetylene Black Cabot Co., Ltd. Vulcan XC-72 Columbia Chemical Co., Ltd. Conductex-97
5, Conducttex-SC c. Copper powder Dowa Mining Co., Ltd. DC-50, 100, 200, 3
00 d. Nickel powder Dowa Mining Co., Ltd. DNI-20, 50 e. Gold powder Co., Ltd. Tokoriki main store TA-1, 2 f. Platinum powder Co., Ltd. Tokoriki main store TP-1, Tanaka Kikinzoku Kogyo Co., Ltd. AY-1010, 1020 g. Palladium powder TPd-1 manufactured by Tokoriki Head Office AY-4010, 4030 manufactured by Tanaka Kikinzoku Kogyo Co., Ltd. h. Silver-palladium alloy powder manufactured by Tokuriki Head Office AP-10, 30 i. Zinc powder j. Aluminum powder

The mixing ratio of the conductive powder is not particularly limited. However, 10 to 100 parts by mass of the above-mentioned adhesive (solid content) is mixed with 100 parts by mass of the above-mentioned conductive powder can be preferably used.

The adhesive used in the present invention may optionally contain
Insulating powders such as silica, alumina, glass, talc and various rubbers, or known additives such as release agents, surface treatment agents, fillers, pigments and dyes can be added.

The conductive connecting portion between the IC chip mounting interposer and the antenna holder may be made by any method that is easy to design and manufacture, and does not require the precision of the conductive portion for mounting the IC chip and has a processing tolerance. High structure is enough.

In the above embodiment, the RF-type used for a thin information transmission / reception type recording medium such as a non-contact IC tag.
Although the method of connecting the conductive connecting portions of the ID medium has been described, the connecting method of the present invention can also be applied to the connection of other conductive connecting portions. Specifically, for example, a paper computer, a disposable electric product, or the like. The present invention is also applicable to the connection between conductive connecting portions such as, for example, and the conductive connecting portions can be bonded to each other via an adhesive portion formed in a pattern and electrical conduction can be achieved.

Since the present invention is not limited to the above embodiment, various modifications can be made without departing from the spirit of the claims.

[0033]

The present invention will be described in more detail with reference to the following examples and comparative examples, but the present invention is not limited to these examples. (Embodiment 1) As shown in FIGS. 1 to 3, a conductive connection portion composed of shiny metals, matte surface metals, and conductive patterns formed by printing using a conductive silver paste. As a result of adhering 3 and 9 to each other via the adhesive portion 6 formed in a pattern and adhering them by a thermocompression bonding method using ultrasonic waves, the conductive connecting portions 3 and 9 are formed by the adhesive portion 6 formed in a pattern. Sufficient adhesion between them was obtained, and sufficient conduction between the conductive connection portions 3 and 9 was obtained.

(Embodiment 2) As shown in FIGS. 1 to 3, it comprises glossy metals, matte surface metals, and conductive patterns formed by printing using a conductive silver paste. As a result of contacting the conductive connecting portions 3 and 9 with each other through the adhesive portion 6 formed in a pattern and adhering them by thermocompression bonding by a pressing method, the conductive connecting portions 3 and 9 are formed by the adhesive portion 6 formed in a pattern. Sufficient adhesion between them was obtained, and sufficient conduction between the conductive connection portions 3 and 9 was obtained.

(Comparative Example 1) Example 1 is the same as Example 1 except that the pattern-formed adhesive portion 6 is not formed.
As a result of bonding by the thermocompression bonding method using ultrasonic waves in the same manner as above, the bonding and conduction between the conductive connecting portions 3 and 9 were insufficient.

(Comparative Example 2) Example 2 is the same as Example 2 except that the adhesive portion 6 formed in a pattern is not formed.
As a result of adhering by pressure bonding in the same manner as in,
Adhesion and conduction between the conductive connecting portions 3 and 9 were insufficient.

[0037]

According to the method of connecting the conductive connecting portions of the present invention, at least the conductive connecting portions are brought into contact with each other through the adhesive portion formed in the pattern to form the conductive connecting portions. Since it is connected, even in the case of a metal on the matte surface, a conductive pattern formed by printing using a conductive silver paste, etc., the conductive connecting parts are connected to each other via the adhesive part formed in a pattern. While sufficient adhesion is obtained, sufficient conduction between the conductive connection portions is obtained, external force is not concentrated on the conductive connection portions, and the electrical connection is not interrupted, and the base material does not heat-bond with paper or the like. Even physical objects can be physically bonded and can be processed in a short time,
It has a remarkable effect such as cost reduction.

[0038] According to the method for connecting the conductive connecting portions to each other according to claim 2 of the present invention, in the connecting method according to claim 1,
Since the conductive connecting portions are connected by using heat, pressure, ultrasonic waves, light, electromagnetic waves, or a combination thereof, the same effect as that of claim 1 can be obtained, and sufficient adhesion between the conductive connecting portions can be efficiently achieved in a short time. In addition to being obtained, sufficient conduction between the conductive connecting portions can be obtained, and a further remarkable effect that the cost can be further reduced can be obtained.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a process of forming an IC chip mounting interposer in an embodiment of a method of connecting conductive connection parts.

FIG. 2 is an explanatory diagram showing a process of forming an antenna holder in an embodiment of a method of connecting conductive connection parts.

FIG. 3 is an explanatory diagram showing an RF-ID medium in an embodiment of a method of connecting conductive connection portions.

FIG. 4 is an explanatory diagram showing a method of joining conductive connection portions of a conventional wiring board using ultrasonic waves.

[Explanation of symbols]

1 base material 2 IC chip mounting conductive part 3 Conductive connection 4 Conductive pattern 5 IC chip 7 Base material 8 Antenna conductive part 9 Conductive connection 10 Conductive pattern 11 Insulation part A IC chip mounting interposer B Antenna holder C RF-ID media

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2C005 MA19 MB06 NA09                 5B035 BA03 BB09 CA01 CA23                 5E319 AA03 AB01 AC03 BB16 CC12                       CC61 CD26 GG15 GG20                 5E344 AA01 AA22 BB02 BB05 BB10                       BB13 CD02 DD10 EE06 EE17                       EE21

Claims (2)

[Claims] 1. A method of connecting conductive connecting portions, wherein at least the conductive connecting portions are brought into contact with each other via an adhesive portion formed in a pattern to connect the conductive connecting portions. 2. The method for connecting conductive connection parts according to claim 1, wherein the conductive connection parts are connected to each other using heat, pressure, ultrasonic waves, light, electromagnetic waves or a combination thereof.