JP2004165531A - Double-sided wiring antenna circuit member for noncontact data carrier - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an antenna circuit member for a noncontact data carrier in which interconnections are provided on both sides of a resin base material, the interconnection of both sides are connected, an antenna material are less constrained in kind and thickness, neither wiring nor connection with IC chips are complicated, and besides the interconnections of both sides are comparatively simply connected. <P>SOLUTION: There is provided a double-sided antenna circuit member in which at least the antenna interconnections are provided on one side of the resin circuit board, the interconnections for connection between both sides are provided on the other side, both the interconnections for antenna on the one side and those for the connection on the other side are connected electrically with each other via a front side and backside conducting portion provided in a through hole that penetrates at least the resin circuit board. The antenna interconnections on the one side comprise metallic patterns formed by etching, while the interconnections for connection on the other side comprise an electrically conductive resin and besides in the front side and backside conducting portion, an inside of the through hole is filled with the electrically conductive resin. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a double-sided wiring antenna circuit member for a non-contact data carrier.
[0002]
[Prior art]
While IC cards are gradually becoming popular from the aspect of information confidentiality, in recent years, non-contact type IC cards that exchange information without contacting a read / write device (reader / writer) have been proposed. A system in which signal exchange with a device or signal exchange and power supply is performed by electromagnetic waves is being put to practical use.
On the other hand, on the other hand, in recent years, various non-contact IC tags in the form of a sheet or a tag, in which an IC carrying data is connected to an antenna coil, have been proposed and attached to products, packaging boxes, etc., and shoplifting has been carried out. It has been used for prevention, distribution systems, product management, etc.
[0003]
In such a non-contact type data carrier such as an IC card and an IC tag, an antenna wiring is provided on one side of a resin substrate, a connection wiring is provided on an opposite side, and wirings on both sides are connected. An antenna circuit member having a double-sided wiring structure in which an IC chip is connected to a connection wiring may be used.
In this case, the wiring or the connecting portion is not complicated for connection with the IC chip, but it is necessary to connect the front and back wiring.
As a method of connecting the wiring on the front and back, a method of forming and connecting a through hole as a conductive portion on the front and back and connecting the wiring, and a method of causing the wiring on the front and back to penetrate the resin base material by caulking to make contact.
However, the method of forming the through-holes by plating and connecting the wiring on the front and back sides has a limitation that the plating process is complicated, the cost is high, and the material is limited due to the compatibility between the wiring and the plating.
The method of connecting the front and back wiring by caulking has restrictions on the type and thickness of the base material and the wiring, and cannot cope with miniaturization and narrow pitch of the antenna wiring.
Generally, it can be applied to connection of Al wiring, but connection of Cu wiring is difficult, so it is difficult to apply to fine antenna circuit portions formed by etching of Cu foil, Cu plating and the like.
[0004]
Further, in an antenna circuit member for arranging an antenna wiring and an IC chip on one side of a resin base material and electrically connecting the antenna wiring and the IC chip, both ends of the antenna wiring are formed with an insulating layer as a lower layer. A method in which the upper layer is used as a conductive layer and a printed pattern formed by printing is used as a jumper line to connect to the IC chip via the jumper wire, or a part of the antenna wiring is narrowed and passed under the IC chip to connect the IC chip. Although a method of connecting the antenna wiring and the IC chip over the antenna with the terminal is adopted, any connection method has a problem that a wiring or a connection portion with the IC chip is complicated.
Furthermore, in the case of a method of connecting a printed pattern as a jumper wire, it is necessary to provide an insulating layer, connection with a small-sized antenna circuit requires high-precision alignment, and variation in characteristics due to the thickness of the insulating layer. Also occurs.
Further, in the case of a method of connecting an antenna wire across an IC chip, the space between chip terminals becomes narrower due to the miniaturization of the IC chip, and its application becomes more difficult as the pitch of the terminals of the IC chip becomes narrower.
[0005]
[Patent Document 1]
JP-A-11-134458 (FIG. 1 shows a jumper pattern connection, and FIG. 3 shows a through-hole connection).
[Patent Document 2]
JP-A-2002-174411 (FIG. 1 shows a caulking connection).
[Patent Document 3]
Japanese Patent Application Laid-Open No. 2001-156110 (FIG. 5 shows a method of connecting over an antenna with connection terminals of an IC chip).
[0006]
[Problems to be solved by the invention]
As described above, the antenna wiring is provided on one side of the resin base material, the connection wiring is provided on the opposite side, and the wiring on both sides is connected, and the IC chip is connected to the connection wiring. In the case of an antenna circuit member for a data carrier, the connection between the front and back using a through-hole is complicated in manufacturing, the cost is high, and the material is limited. In addition, in the case of an antenna circuit member for a data carrier in which an antenna wiring and an IC chip are arranged on one side of a resin base material to electrically connect the antenna wiring and the IC chip, The connection method also has the problem of complicating the wiring or the connection portion with the IC chip. In addition, in the case of jumper wire connection, it is necessary to provide an insulating layer, and characteristic variations due to the thickness of the insulating layer also occur. Further, when connecting straddle the antenna line in IC chips, support for narrower pitches of the IC chip terminals by miniaturization of IC chips has become more difficult.
The present invention corresponds to these, specifically, an antenna circuit member for a non-contact type data carrier having a structure in which wiring is provided on both surfaces of a resin base material and the wirings on both surfaces are connected, Provided is a non-contact type data carrier antenna circuit member that has relatively few restrictions on the type and thickness of the antenna coil material, does not complicate wiring and connection with an IC chip, and can connect wiring on both sides relatively easily. What you are trying to do.
In particular, in manufacturing a small-sized (fine) antenna circuit, an antenna circuit member for a non-contact type data carrier that can obtain a connection with stable characteristics without complicating a connection portion relatively easily. It is intended to provide.
[0007]
[Means for Solving the Problems]
The double-sided wiring antenna circuit member for a non-contact data carrier of the present invention is provided with at least an antenna wiring on one side of the resin substrate, a wiring for connection on the opposite side, and the antenna wiring on the one side. The wiring for connection on the opposite surface side is electrically connected via a front and back conducting portion provided in a through hole portion penetrating at least the resin substrate, an antenna circuit member of a double-sided wiring, The antenna wiring on one side is made of a metal pattern formed by etching, the wiring for connection on the opposite side is made of a conductive resin, and the front and back conductive portions are filled with a conductive resin inside the through holes. It is characterized by being made.
In the above description, the front and back conductive portion is provided in a through-hole portion that penetrates the resin substrate and a wiring at a portion electrically connected to the front and back conductive portion on the antenna wiring forming side, and is provided on the antenna wiring forming side. An insulating film is formed to cover the front and back conductive portions.
In the above, the metal pattern is a Cu pattern.
[0008]
Further, in the above, the IC chip is connected to the wiring on the one side or the opposite side.
In the above, the IC chip is connected to the wiring for connection via a non-conductive resin layer formed on the wiring for connection made of the conductive resin on the opposite surface side by a flip chip. It is characterized by being connected by a system.
[0009]
[Action]
The double-sided wiring antenna circuit member for a non-contact type data carrier of the present invention is provided with at least an antenna wiring on one side of the resin substrate and a connection wiring on the opposite side by using the above-described configuration. The antenna wiring on one side and the connection wiring on the opposite side are electrically connected to each other via a front-back conduction portion provided at least in a through-hole portion penetrating the resin substrate. A non-contact wiring antenna circuit member that has few restrictions on the type and thickness of the base material and antenna coil material, does not complicate the connection with the wiring and IC chip, and can connect the wiring on both sides relatively easily. It is possible to provide an antenna circuit member for a data carrier of a type.
In particular, in manufacturing a small-sized (fine) antenna circuit, an antenna circuit member for a non-contact type data carrier that can obtain a connection with stable characteristics without complicating a connection portion relatively easily. Can be provided.
Specifically, the antenna wiring on one side is made of a metal pattern formed by etching, the wiring for connection on the opposite side is made of a conductive resin, and the front / back conduction part is inside the through hole. This is achieved by being filled with a conductive resin.
That is, the antenna wiring on one side is made of a metal pattern formed by etching, so that a fine antenna circuit can be manufactured with high productivity, and the wiring for connection on the opposite side is made of conductive resin, In addition, since the front and back conducting portions are formed by filling the through holes with a conductive resin, the wiring for connection and the front and back conducting portions can be collectively formed by printing. The wiring on both sides can be connected relatively easily without complicating the wiring and the connection with the IC chip.
[0010]
In addition, since an insulating film covering the through-hole portion is formed on the antenna wiring forming side, the connection reliability is increased. Further, when the insulating film is a resist film, particularly, It can be said that the structure is easy to manufacture and suitable for mass production.
When the front and back conductive portions are formed by printing, it is possible to prevent the conductive resin from protruding to the side where the antenna wiring is formed, and it is not necessary to perform a flattening process such as polishing on the protruding portions, thereby improving the connection reliability.
Further, by using an insulating film as the resist film at the time of forming the antenna wiring by etching, it is not necessary to peel off the resist film, the manufacturing thereof is facilitated, and the antenna wiring can be sufficiently protected.
[0011]
In addition, since the metal pattern is a Cu pattern, it can be particularly adapted to miniaturization of wiring.
[0012]
As the double-sided wiring antenna circuit member for the non-contact type data carrier of the present invention, there is a member having an IC chip connected to the antenna wiring, or a member having an IC chip connected to the connection wiring.
In any case, it is possible to adopt a structure in which the wiring and the connection to the IC chip are not complicated, and the wiring on both sides can be connected relatively easily.
[0013]
More specifically, the IC chip is connected to the connection wiring by a flip chip method via a non-conductive resin layer formed on the connection wiring made of the conductive resin on the opposite side. If you have
In particular, the wiring on both sides can be connected relatively easily without complicating the wiring and the connection with the IC chip, and the structure is relatively simple and suitable for mass production.
As the non-contact data carrier using the non-contact data carrier antenna circuit member of the present invention, a non-contact data carrier whose communication range conforms to ISO15693 (proximity type) specification or ISO14443 (proximity type) specification can be used.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the drawings.
FIG. 1A is a sectional view of a first example of an embodiment of a double-sided wiring antenna circuit member for a non-contact type data carrier according to the present invention, and FIG. 1B is a sectional view of the first example shown in FIG. FIG. 2 is an enlarged view of the connection portion of the IC chip of the example of FIG. 1, and FIG. 2 is a non-contact type using the double-sided wiring antenna circuit member for the non-contact type data carrier of the first example shown in FIG. FIG. 3 is a cross-sectional view of a second example of a double-sided wiring antenna circuit member for a non-contact type data carrier according to the present invention, and FIG. FIG. 4B is a cross-sectional view of a modified example of the double-sided wiring antenna circuit member for a non-contact type data carrier of the example of FIG. FIG. 5 is a cross-sectional view of one example of a non-contact data carrier using members, and FIG. 5 is a non-contact data carrier of a first example. It is a manufacturing process sectional view of the double-sided wiring antenna circuit member for carriers.
1 to 5, 110 is a resin base material, 120 is an antenna wiring, 120A is a metal layer (copper foil), 130 is a front / back conduction part, 140 is a connection wiring, 140a is a connection part,
150 is an IC chip, 151 is a pad, 155 is a non-conductive adhesive, 160 is a through hole, 170 is an insulating film (resist), 181 and 182 are heat-sealing resin base materials, 185 is a heat-sealing portion, 210 Is a resin substrate, 220 is an antenna wiring, 225 is a wiring for connecting an IC chip, 225a is a connecting portion, 231 and 232 are front and back conductive portions, 240 is a connecting wiring, 250 is an IC chip, 251 is a pad, and 255 is a non-connecting portion. It is a conductive adhesive.
[0015]
First, a first example of an embodiment of a double-sided wiring antenna circuit member for a non-contact type data carrier of the present invention will be described with reference to FIG.
The double-sided wiring antenna circuit member for a non-contact type data carrier of the first example has an antenna wiring 120 provided on one side on a resin substrate 110 and a cross-section on the opposite side as shown in FIG. A connection wiring 140 is provided, and the one-side antenna wiring 120 and the opposite-side connection wiring 140 are connected to the resin substrate 110 and a wiring at a location A1 electrically connected to the resin substrate 110 (the antenna wiring 120). This is an antenna circuit member for a double-sided wiring IC tag, which is electrically connected via a front / back conduction portion 130 provided in a through hole portion penetrating through the end wiring of the IC tag.
The one-sided antenna wiring 120 is made of a metal pattern formed by etching, the opposite-sided connecting wiring 140 is made of a conductive resin, and the front / back conduction part 130 is formed inside the through hole. Is filled with a conductive resin.
Further, in this example, the IC chip is connected via the non-conductive resin layer 155 formed on the end wiring 140a of the connection wiring 140 made of the conductive resin on the opposite side. The wiring is connected by a flip chip method.
[0016]
Examples of the resin substrate 110 include PET (polyethylene terephthalate), polypropylene (PP), polyethylene, ABS, styrene, polyimide, glass epoxy, PETG, polycarbonate, paper, PVC, and acrylic. PET (polyethylene terephthalate) or polyimide having chemical properties is preferable.
The thickness of the resin substrate 110 is usually 25 μm to 200 μm.
As a metal pattern for forming the antenna wiring 120, there are a Cu pattern, an Al pattern, and the like, but a Cu pattern is preferable for miniaturization and a narrow pitch of the antenna wiring.
From the electrical characteristics, the thicknesses of the Cu pattern and the Al pattern are preferably 10 to 50 μm and 15 to 50 μm, respectively.
The connection wiring 140 and the conductive resin for forming the front and back conductive portions 130 are obtained by mixing, dispersing, and curing conductive particles in an epoxy resin, and usually mixing and dispersing the conductive particles in the epoxy resin. After that, this is printed and formed on the wiring forming portion for connection by printing, and is filled into the inside of the through hole for forming the front and back conductive portion 130, and further cured.
The epoxy resin in which conductive particles are mixed and dispersed is also referred to as conductive ink.
As the conductive particles, carbon, graphite, silver powder, aluminum powder, or a mixture thereof is used.
The IC chip 150 usually has a size of 1.5 mm × 1.5 mm square and a thickness of about 180 μm.
[0017]
As an IC tag using the double-sided wiring antenna circuit member for a non-contact type data carrier of the first example, for example, as shown in FIG. 2, a heat-sealing resin base material 181 disposed on the front and back thereof, 182 is bonded by heat fusion, and the antenna circuit member of the first example is buried during the bonding.
As the heat-sealing resin base materials 181 and 182, PVC (polyvinyl chloride), PETG (non-crystalline polyester), polyimide, polypropylene, polyethylene and the like are used, but PETG (non-crystalline polyester) is used in terms of strength, heat resistance and the like. ) Etc. are mainly used.
The thickness of the heat-sealing resin base materials 181 and 182 is usually 50 to 100 μm.
[0018]
As a modified example of the double-sided wiring antenna circuit member for the non-contact data carrier of the first example, for example, in the first example shown in FIG. One having a structure in which an insulating film 170 that covers the wiring formation side is provided.
In the antenna circuit member for a non-contact type data carrier of the modified example, the insulating film 170 is a resist pattern (hereinafter, simply referred to as a resist) when the antenna wiring 120 is formed. It is used as it is for a non-contact data carrier.
FIG. 4B is an example of a non-contact type data carrier using a double-sided wiring antenna circuit member for a non-contact type data carrier according to a modified example.
In the non-contact data carrier shown in FIG. 4B, the components other than the insulating film 170 are the same as those in the first example.
[0019]
Next, an example of a method of manufacturing the double-sided wiring antenna circuit member for the non-contact type data carrier of the first example will be briefly described with reference to FIG.
First, a metal layer 120A made of Cu foil for forming antenna wiring is formed on one surface of a resin base material. (FIG. 5 (a))
Usually, a commercially available single-sided Cu foil laminated substrate is used.
Next, a through-hole 160 that penetrates the resin base material 110 and the Cu foil 120A is formed at a location where the front and back conductive portions are formed by a drill or a laser beam. (FIG. 5 (b))
Next, a resist pattern 170 for forming an antenna wiring is formed so as to cover a region where the antenna wiring is to be formed and the through-hole portion on the antenna wiring forming side. (FIG. 5 (c))
As the resist for forming the resist pattern 170, a resist having a predetermined resolution and withstanding the subsequent etching process, and having good processability is preferable.
Usually, a commercially available liquid photoresist, dry film resist, or the like is used.
Next, the antenna wiring 140 is formed by etching. (FIG. 5 (d))
Ferric chloride (FeCl ₃ ) or the like is used as an etchant.
After the etching, if necessary, after performing a cleaning process or the like, a conductive pattern is formed on the wiring portion area for connection on the side opposite to the antenna wiring 140 forming side of the resin base 110 by printing with the resist pattern 170 attached. A resin is applied and formed, and the through hole 160 is filled with a conductive resin. (FIG. 5 (e))
Examples of the printing method include offset printing, gravure printing, silk screen printing, flexographic printing, and the like.
Next, the resist pattern 170 is removed with a predetermined stripper.
After that, the conductive resin is cured to form the connection wiring 140 and the front / back conduction portion 130. (FIG. 5 (f))
Next, a non-conductive adhesive 155 for mounting the IC chip is formed by potting coating or the like so as to cover the connection portion 140a between the IC chip and the IC chip at the end of the wiring 140 for connection. (FIG. 5 (g))
Next, the bumps 151 of the IC chip 150 are connected by the flip chip method while being aligned with the connection portion 140a of the end of the connection wiring 140 with the IC chip (FIG. 5H). (FIG. 5 (i))
Thereby, the antenna circuit member for the non-contact type data carrier of the first example is formed.
[0020]
As a method of manufacturing the double-sided wiring antenna circuit member for the non-contact type data carrier shown in FIG. 4 of the modification of the first example, for example, in the manufacturing method of the first example shown in FIG. 5 (g) without performing the resist pattern peeling step (FIG. 5 (f)) from the step (c).
[0021]
Next, a second embodiment of the double-sided wiring antenna circuit member for a non-contact type data carrier of the present invention will be described with reference to FIG.
The double-sided wiring antenna circuit member for a non-contact type data carrier of the second example has an antenna wiring 220 and an IC chip connection wiring 225 on one side of a resin substrate 210 and a connection wiring 240 on the opposite side. The wiring at the point B1 where the antenna wiring 220 and the IC chip connection wiring 225 on one side are connected to the connection wiring 240 on the opposite side and the resin substrate 210 (the end of the antenna wiring 220). Wiring) or the wiring at the point B2 (the wiring for the IC chip connection 225) connected to the resin substrate 210) is electrically connected to the front and back conductive parts 231 and 232 provided in the through holes. , An antenna circuit member for an IC tag.
The one-sided antenna wiring 220 and the IC chip connection wiring 225 are made of a metal pattern formed by etching, and the opposite-side connection wiring 240 is made of a conductive resin. The parts 231 and 232 are formed by filling a conductive resin into the through holes.
In the case of this example, unlike the first example, the antenna wiring 220 and the IC chip 250 are formed or mounted on the same surface side of the resin substrate 210.
About each part, the same thing as the thing of the 1st example can be applied, and the manufacturing method can basically apply the same manufacturing process as the manufacturing method of the 1st example, and these explanations are omitted. I do.
[0022]
As a modification of the second example, as shown in FIG. 3, in the second example, the insulation covering the antenna wiring 220, the IC chip connecting wiring 225, and the antenna wiring forming side of the front / back conduction portion 230 is provided. Having a structure having a conductive film.
As a manufacturing method of the modified example of the second example, there is basically a method of the same process as the manufacturing method of the modified example of the first example described above.
Also in this case, the insulating film is a resist pattern (hereinafter, simply referred to as a resist) when the antenna wiring 220 and the IC chip connecting wiring 225 are formed. It is used for a carrier.
It should be noted that the present invention is not limited to the above embodiments and modifications.
The present invention is not limited to a non-contact type IC tag, and may be applied to a non-contact type IC card or the like.
[0023]
【The invention's effect】
The present invention is, as described above, an antenna circuit member for a non-contact data carrier having a structure in which wiring is provided on both surfaces of a resin base material and the wirings on both surfaces are connected, and the type of the base material and the antenna coil material and It is possible to provide an antenna circuit member for a non-contact type data carrier which has a relatively small thickness, does not complicate wiring and connection with an IC chip, and can relatively easily connect wiring on both surfaces.
In particular, in producing a small-sized (fine) antenna circuit, a non-contact type data carrier antenna circuit member capable of obtaining a connection with stable characteristics without complicating the connection portion relatively easily. Provided.
[Brief description of the drawings]
FIG. 1A is a sectional view of a first example of an embodiment of a double-sided wiring antenna circuit member for a non-contact type data carrier according to the present invention, and FIG. 1B is a sectional view of FIG. FIG. 3 is an enlarged view showing a connection portion of the IC chip of the first example shown in FIG.
FIG. 2 is a cross-sectional view of one example of a non-contact data carrier using the double-sided wiring antenna circuit member for the non-contact data carrier of the first example shown in FIG.
FIG. 3 is a cross-sectional view of a second example of the embodiment of the double-sided wiring antenna circuit member for a non-contact type data carrier of the present invention.
4A is a cross-sectional view of a modified example of the double-sided wiring antenna circuit member for the non-contact type data carrier of the first example, and FIG. 4B is a modified example shown in FIG. 4A. 1 is a cross-sectional view of an example of a non-contact data carrier using the double-sided wiring antenna circuit member for the non-contact data carrier of FIG.
FIG. 5 is a sectional view showing a manufacturing process of the double-sided wiring antenna circuit member for the non-contact type data carrier of the first example.
[Explanation of symbols]
110 resin base material 120 antenna wiring 120A metal layer (copper foil)
130 Front / back conduction section 140 Wiring 140a for connection Connection section 150 IC chip 151 Pad 155 Non-conductive adhesive 160 Through hole 170 Insulating film (resist)
181, 182 Heat-fused resin base material 185 Heat-fused part 210 Resin base material 220 Antenna wiring 225 Wiring for IC chip connection 225a Connection parts 231 and 232 Front and back conduction part 240 Wiring for connection 250 IC chip 251 Pad 255 Non-conductive adhesive

Claims (6)

At least antenna wiring is provided on one side of the resin substrate, and connection wiring is provided on the opposite side, and the antenna wiring on one side and the connection wiring on the opposite side penetrate at least the resin substrate. Electrically connected via the front and back conducting portions provided in the through-hole portion, a double-sided wiring antenna circuit member, wherein the one-sided antenna wiring is formed of a metal pattern formed by etching, The wiring for connection on the opposite surface side is made of a conductive resin, and the front and back conductive portions are formed by filling the inside of the through-hole with a conductive resin, for a non-contact type data carrier. Double-sided wiring antenna circuit member. In claim 1, the front and back conductive portions are provided in a through-hole portion that penetrates the resin substrate and a wiring electrically connected to the front and back conductive portions on the antenna wiring forming side, and is provided on the antenna wiring forming side. A double-sided wiring antenna circuit member for a non-contact type data carrier, wherein an insulating film is formed to cover the front and back conductive portions. 3. The double-sided wiring antenna circuit member for a non-contact data carrier according to claim 2, wherein the insulating film is a resist film. 4. The double-sided wiring antenna circuit member for a non-contact type data carrier according to claim 1, wherein the metal pattern is a Cu pattern. 4. The double-sided wiring antenna circuit member for a non-contact data carrier according to claim 1, wherein an IC chip is connected to the wiring on the one side or the opposite side. 6. The IC chip according to claim 5, wherein the IC chip is connected to the connection wiring by a flip chip method via a non-conductive resin layer formed on the connection wiring made of the conductive resin on the opposite surface side. A double-sided wiring antenna circuit member for a non-contact type data carrier, characterized in that:

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