JP4781871B2 - Non-contact IC label - Google Patents

Description

  The present invention relates to a non-contact type IC label capable of communicating in a non-contact state, and more particularly to a non-contact type IC label capable of communicating by selectively using a plurality of frequencies.

  In recent years, with the progress of the information society, information is recorded on a label attached to a product or the like, and the product or the like is managed using this label. In information management using such a label, a non-contact type IC label equipped with an IC capable of writing and reading information in a non-contact state with respect to the label is rapidly used due to its excellent convenience. Is spreading.

  In recent years, non-contact type IC labels that can write and read information in a non-contact state use a UHF band of 900 MHz to 1000 MHz and a frequency band of 2.45 GHz to ensure miniaturization and a communicable distance. Thus, a fine IC chip that performs communication is beginning to be used. When such a fine IC chip is used, the communicable distance of the IC chip can be extended by connecting a conductive antenna to the IC chip.

  FIG. 5 is a diagram showing an example of a non-contact type IC label on which an IC chip that performs communication using a frequency band of 2.45 GHz is mounted, (a) is a top view, and (b) is (a). It is AA 'sectional drawing shown in FIG.

  As shown in FIG. 5, the present configuration example is composed of two strip-shaped conductors 420a and 420b formed on a base substrate 440 made of resin, paper, or the like with a predetermined interval so as to be arranged in series with each other. An antenna portion 420 is formed, and an IC chip 410 capable of writing and reading information in a non-contact state is mounted so as to be connected to the two conductors 420a and 420b. One end of the two conductors 420a and 420b are feed points 421a and 421b, and the IC chip 410 is connected to the feed points 421a and 421b. Further, an adhesive 441 is applied to the entire back surface of the base substrate 440, and a release paper 460 is detachably attached.

  In the non-contact type IC label 400 configured as described above, the release paper 460 is peeled off and attached to an article, etc., and used in proximity to an information writing / reading device (not shown) provided outside. As a result, a current flows through the antenna unit 420 by radio waves from the information writing / reading device, and this current is supplied to the IC chip 410 via the feeding points 421a and 421b. Information is written to the IC chip 410 from the read / write device, and information written to the IC chip 410 is read by the information write / read device.

In a non-contact communication medium such as the above-described non-contact type IC label 400, the frequency at which information is written or read is set to the above-described 900 MHz to 1000 MHz UHF band, 2.45 GHz, or 13.56 MHz. . The difference between these frequencies is determined by the function of the IC chip and the shape of the antenna, but an IC chip that can handle a plurality of frequencies is mounted, and antennas that correspond to different frequencies are connected to the IC chip. Patent Document 1 discloses a non-contact communication medium that performs communication by selectively using a plurality of frequency bands by selectively using an antenna. In the non-contact communication medium disclosed in Patent Document 1, a cut line is formed on a sheet base material on which an antenna is formed, and a part of the antenna is cut using the cut line, thereby The antenna is selectively used.
JP 2005-284516 A

  As described above, when a cut line is formed on the sheet base material so that a part of the antenna can be cut, a cut line is also formed on the antenna. Disconnection may occur. Also, for example, when the cut line is formed so that the cut portion and the tie portion of the perforated cut portion and the tie portion are increased so that the cut portion does not reach the antenna, the sheet base material is cut using the cut line. There is a possibility that the cut portion will deviate from the cut line and a notch will be cut into an unintended portion.

  Therefore, by adjusting the shape of the cut line, it may be possible to avoid disconnection of the antenna or cutting into unintended parts, but if the antenna arrangement or shape is complicated, Since it is difficult to adjust the shape of the line, it is preferable that the communication frequency be selected more easily.

  The present invention provides a non-contact type IC label capable of communicating by selectively using a plurality of frequencies, and capable of easily realizing a configuration capable of selecting a communication frequency. Objective.

In order to achieve the above object, the present invention provides:
A base substrate on which an IC chip capable of communicating at the first and second frequencies is mounted, and a first antenna unit for the IC chip to communicate at the first frequency is formed;
A second antenna portion having a lower tensile rupture strength than the base substrate and connected to the first antenna portion to allow the IC chip to communicate at the second frequency is formed. A label substrate,
The base substrate is attached to the label substrate so that the first antenna portion and the second antenna portion are connected.

  In the present invention configured as described above, the first antenna portion and the second antenna portion are connected and mounted on the base substrate in a state where the first antenna portion is attached to the adherend. The IC chip performs communication at the second frequency via the first antenna unit and the second antenna unit. Then, when a tensile breaking force is applied such that the adherend is separated in the region where the second antenna portion is formed, or the region where the second antenna portion is formed, the tensile breaking force causes The label base material breaks and the second antenna portion is destroyed. On the other hand, since the base substrate on which the first antenna portion is formed has a stronger tensile breaking force than the broken label substrate, it is not broken even if a crack caused by the breakage of the label substrate reaches the base substrate. Thus, the first antenna part is not destroyed. Therefore, the IC chip communicates at the first frequency only through the first antenna unit.

Specifically, the first antenna portion is made of a metal foil laminated on the base substrate,
It is conceivable that the second antenna unit is made of a conductive ink applied on the label base material.

  As described above, in the present invention, the IC is attached to the adherend and after a tensile breaking force is applied so as to separate the region where the second antenna portion is formed from the state. Since the frequency used for chip communication changes, the communication frequency of the IC chip can be changed simply by applying a tensile breaking force from the state of being attached to the adherend, and a configuration that allows selection of the communication frequency is easily realized. can do.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
1A and 1B are diagrams showing a first embodiment of a non-contact type IC label according to the present invention. FIG. 1A is a diagram showing an internal structure, and FIG. FIG. 4C is a cross-sectional view taken along the line BB ′ shown in FIG.

  In this embodiment, as shown in FIG. 1, two conductors 120a and 120b constituting a bow tie antenna unit 120 serving as a first antenna unit are formed, and an IC capable of writing and reading information in a non-contact state. A film base material 150, which is a base base material on which the chip 110 is mounted, is attached to a film base material 140 on which two conductors 130a and 130b constituting the meander antenna part 130 serving as a second antenna part are formed. It is configured.

  The film substrate 150 is made of PET (polyethylene terephthalate), has two conductors 120a and 120b formed on one surface and an IC chip 110 mounted thereon, and an adhesive 151 is applied to the entire surface of the other surface. ing. The two conductors 120a and 120b each have an isosceles triangle shape, and a straight line connecting vertices formed by equal sides of the isosceles triangle is perpendicular to each of the bases of the isosceles triangle, and The film base 150 is formed so that the vertices have gaps. The two conductors 120a and 120b are provided with feeding points 121a and 121b at opposite vertices, and the IC chip 110 is connected to the feeding points 121a and 121b.

  The IC chip 110 is capable of writing and reading information in any frequency band of the first frequency of 2.45 GHz and the second frequency of 900 MHz to 1000 MHz in the UHF band.

  The conductors 120a and 120b constituting the bow tie antenna unit 120 have lengths from the feeding points 121a and 121b to the bases of the isosceles triangles, and information is written to and read from the IC chip 110 in a frequency band of 2.45 GHz. Such a length, that is, a length that resonates at a frequency of 2.45 GHz, and further, a broadband is realized by the shape of an isosceles triangle. The conductors 120a and 120b are formed by laminating a metal foil on the film base 150, and are formed on the film base 150 by etching.

  The film base 140 is made of PCV (polyvinyl chloride), and an adhesive 141 is applied to the entire surface of one surface, and two conductors 130a and 130b are formed thereon. The film base 140 and the adhesive 141 and the label base material. The PCV that is the material of the film substrate 140 is fragile and has a weaker tensile breaking force than the PET that is the material of the film substrate 150. Therefore, the label substrate composed of the film substrate 140 and the adhesive 141 is a film. The tensile breaking force is weaker than that of the substrate 150. The conductors 130a and 130b formed on the adhesive 141 are composed of conductive ink applied on the film base 140 by printing.

  In this way, the film substrate 150 on which the conductors 120a and 120b are formed and the IC chip 110 is mounted has the adhesive surface with the surface on which the conductors 120a and 120b are formed and the IC chip 110 is mounted. 141 is attached to the film substrate 140. One of two vertices on the base side of the isosceles triangle of each of the two conductors 120a and 120b formed on the film base 150 and one end of each of the two conductors 130a and 130b formed on the film base 140 Are adhered to the film substrate 140 so that they face each other. Accordingly, the two conductors 120a and 120b formed on the film base 150 and the two conductors 130a and 130b formed on the film base 140 are electrically connected to each other at the connection portions 131a and 131b. Become. Further, a release paper 160 is detachably attached to the surface of the film base 140 to which the film base 150 is attached.

  When the conductors 130a and 130b constituting the meander antenna unit 130 are connected to the two conductors 120a and 120b formed on the film base 150 as described above, the conductors 130a and 120b are connected via the conductors 120a and 120b. Thus, the length to the end opposite to the connection portions 131a and 131b is such a length that information is written to and read from the IC chip 110 in the UHF band of 900 MHz to 1000 MHz, that is, 900 MHz to 1000 MHz. The length resonates with the frequency of the UHF band.

  Below, the manufacturing method of the non-contact type IC label 100 comprised as mentioned above is demonstrated.

  First, a conductive metal made of, for example, copper, silver, or the like is deposited on the other surface of the film base 150 having the adhesive 151 applied on one surface, and a conductor layer is laminated. At this time, release paper (not shown) is detachably attached to the surface to which the adhesive 151 is applied.

  Next, on the conductor layer laminated on the film substrate 150, masking is performed in accordance with the shape of the conductors 120a and 120b, and then etching is performed to form the conductor layer in the shape of the conductors 120a and 120b. Then, the bow tie antenna unit 120 including the conductors 120a and 120b is formed on the film base 150.

  Next, a conductive adhesive is applied on the feeding points 121a and 121b of the film base 150, and the IC chip 110 is electrically connected to the conductors 120a and 120b by the conductive adhesive. Mount and fix to.

  Next, a conductive ink containing conductive particles is applied on the surface of the film base 140 having the adhesive 141 applied on one surface, and the conductors 130a and 130b are applied. The meander antenna unit 130 is formed by printing. Here, the conductive ink for printing the conductors 130a and 130b is mainly composed of conductive particles and a binder resin. By drying and fixing the printed conductive ink, the conductive ink is printed on the film substrate 140. Conductors 130a and 130b are formed on the substrate. In addition, when binder itself has electroconductivity, it is not necessary to make a binder contain electroconductive particle.

  Thereafter, the film substrate 150 on which the conductors 120a and 120b are formed and the IC chip 110 is mounted is used as the film substrate, and the surface on which the conductors 120a and 120b are formed and the IC chip 110 is mounted is used as the bonding surface. The film is adhered to the film substrate 140 by the adhesive 141 applied to the film 140. At this time, one of the two vertices on the base side of the isosceles triangle of each of the two conductors 120 a and 120 b formed on the film base 150 and the two conductors 130 a and 130 b formed on the film base 140. The film base 150 is attached to the film base 140 so that the respective one ends face each other. As a result, the bow tie antenna unit 120 formed on the film substrate 150 and the meander antenna unit 130 formed on the film substrate 140 are electrically connected by the connection units 131a and 131b.

  Then, the release paper attached to the film base 150 is peeled off, and the release paper 160 is peelably attached to the entire surface of the film base 140 on which the film base 150 is attached.

  Below, the usage method of the non-contact type IC label 100 mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining how to use the non-contact type IC label 100 shown in FIG.

  As shown in FIG. 2A, the conductor case 130a and 130b constituting the meander antenna portion 130 straddle the pedestal portion 172 and the lid portion 171 on the article case 170 in a state where the lid portion 171 is covered on the pedestal portion 172, respectively. In this way, the non-contact type IC label 100 is attached. In this state, the conductor 120a and the conductor 130a are connected by the connection portion 131a, and the conductor 120b and the conductor 130b are connected by the connection portion 131b. In addition, the bow tie antenna unit 120 and the meander antenna unit 130 formed on the film base 140 are connected. Here, the length from the feed points 121a and 121b of the bow tie antenna unit 120 to the end of the meander antenna unit 130 opposite to the connection units 131a and 131b via the connection units 131a and 131b is information on the IC chip 110. In this state, writing and reading of information to and from the IC chip 110 are performed in the UHF band of 900 MHz to 1000 MHz. become.

  From this state, when the lid portion 171 of the article case 170 is opened and the pedestal portion 172 and the lid portion 171 are separated, the film base material 140 on which the meander antenna portion 130 is formed is made of PCV having vulnerability. The non-contact type IC label 100 is not peeled off from the article case 170 but is broken at the boundary between the pedestal portion 172 and the lid portion 171 as shown in FIG. As a result, the conductors 130a and 130b disposed so as to straddle the base portion 172 and the lid portion 171 are destroyed. The crack due to the breakage of the film base 140 may reach the film base 150 attached to the film base 140, but the film base 150 is made of PET and is more tensile than the film base 140. Since the breaking force is strong, even if a crack due to the breakage of the film base material 140 reaches the film base material 150, the film base material 150 is not broken, whereby the conductors 120a and 120b formed on the film base material 150 are It will not be destroyed.

  When the lid portion 171 is completely separated from the pedestal portion 172, the film substrate 150 is not broken at all in the non-contact type IC label 100 adhered to the article case 170 as shown in FIG. As a result, the meander antenna part 130 is destroyed by the film base material 140 being broken. Therefore, in this state, information is written to and read from the IC chip 110 only through the bow tie antenna unit 120 connected to the IC chip 110 at the feeding points 121a and 121b. The conductors 120a and 120b constituting the bow tie antenna unit 120 have lengths from the feeding points 121a and 121b to the bases of the isosceles triangles, and information is written to and read from the IC chip 110 in a frequency band of 2.45 GHz. Thus, in this state, information is written to and read from the IC chip 110 in the 2.45 GHz frequency band.

  As described above, in the present embodiment, with respect to the article case 170 to which the non-contact type IC label 100 is attached, the lid portion 171 is covered with the pedestal portion 172, and the lid portion 171 is separated from the pedestal portion 172. Since the frequency at which information can be written to and read from the IC chip 110 differs depending on the state, for example, it is affixed to an article case containing a medicine or the like that requires management of expensive products or poisonous substances This can be detected when the stored article is illegally taken out, and the IC chip 110 can be detected even after the lid 171 is separated from the pedestal 172. Information can be written and read.

  In this embodiment, the conductors 120a and 120b constituting the bow tie antenna unit 120 are formed on the film substrate 150 by etching. However, the method for forming the conductors 120a and 120b is not limited to this, and the meander antenna unit 130 is not limited thereto. Similarly to the conductors 130a and 130b constituting the conductor, it may be formed by printing using conductive ink. However, when the conductors 120a and 120b constituting the bow tie antenna unit 120 are formed on the film base 150 by etching, the fixing force of the conductors 120a and 120b to the film base 150 and the cohesive force of the conductors 120a and 120b themselves. Therefore, it is preferable to configure the bow tie antenna unit 120 so as not to be broken as described above.

  In the present embodiment, the dipole type in which the two conductors 130a and 130b configuring the meander antenna unit 130 are respectively connected to the conductors 120a and 120b configuring the bow tie antenna unit 120 has been described as an example. It is also conceivable to realize a monopole type in which one meander-shaped conductor is connected to one of the conductors 120a and 120b constituting the portion 120.

(Second Embodiment)
3A and 3B are diagrams showing a second embodiment of the non-contact type IC label of the present invention, in which FIG. 3A is a diagram showing an internal structure, and FIG. FIG. 4C is a cross-sectional view taken along the line BB ′ shown in FIG.

  As shown in FIG. 3, in this embodiment, an IC chip which is formed with an antenna part 220 to be a first antenna part and has a communication antenna 211 and can write and read information in a non-contact state. A film base material 250, which is a base base material on which 210 is mounted, is attached to a film base material 240 on which two conductors 230a and 230b that constitute the meander antenna portion 230 serving as a second antenna portion are formed. Has been.

  The film substrate 250 is made of PET (polyethylene terephthalate). On one surface, writing and reading of information is performed in a UHF band of 2.45 GHz as a first frequency and 900 MHz to 1000 MHz as a second frequency. An IC chip 210 that can be used in any frequency band is mounted, and an antenna portion 220 is formed so as to surround the IC chip 210 on three sides, and an adhesive 251 is applied to the entire other surface. . The shape of the antenna unit 220 resonates with the antenna 211 provided in the IC chip 210, so that information is written to and read from the IC chip 110 in a frequency band of 2.45 GHz, that is, 2 It has a shape that resonates at a frequency of 45 GHz. The antenna section 220 is formed by laminating metal foils on the film base 250 and is formed on the film base 250 by etching.

  The film substrate 240 is made of PCV (polyvinyl chloride), and an adhesive 241 is applied to the entire surface of one surface, and two conductors 230a and 230b are formed thereon. 241 and the label base material. Since the PCV that is the material of the film base material 240 is brittle and has a lower tensile breaking force than the PET that is the material of the film base material 250, the label base material made of the film base material 240 and the adhesive 241 is a film. The tensile breaking force is weaker than that of the substrate 250. The conductors 230a and 230b formed on the adhesive 241 are made of conductive ink applied on the film base member 240 by printing.

  Thus, the film substrate 250 on which the antenna part 220 is formed and the IC chip 210 is mounted is formed by the adhesive 241 with the surface on which the antenna part 220 is formed and the IC chip 210 is mounted as a sticking surface. It is stuck on the film substrate 240. The film base 250 is formed so that the two corners of the antenna part 220 formed on the film base 250 and one ends of the two conductors 230a and 230b formed on the film base 240 face each other. 240 is attached. Thereby, the antenna part 220 formed in the film base material 250 and the two conductors 230a and 230b formed in the film base material 240 are electrically connected by the connection parts 231a and 231b, respectively. Further, a release paper 260 is detachably attached to the surface of the film base 240 to which the film base 250 is attached.

  When the conductors 230a and 230b constituting the meander antenna unit 230 are connected to the antenna unit 220 formed on the film base member 250 as described above, information is written to and read from the IC chip 210 at 900 MHz to 1000 MHz. The length is the same as that used in the UHF band, that is, the length resonates with the UHF band frequency of 900 MHz to 1000 MHz.

  Below, the manufacturing method of the non-contact type IC label 200 comprised as mentioned above is demonstrated.

  First, a conductive metal made of, for example, copper, silver, or the like is deposited on the other surface of the film substrate 250 having the adhesive 251 applied on one surface, and a conductor layer is laminated. At this time, release paper (not shown) is detachably attached to the surface to which the adhesive 251 is applied.

  Next, on the conductor layer laminated on the film substrate 250, masking is performed in accordance with the shape of the antenna part 220, and then etching is performed to pattern the conductor layer into the shape of the antenna part 220. The antenna part 220 is formed on the film substrate 250.

  Next, the area IC chip 210 surrounded by the antenna part 220 of the film base 250 is mounted and fixed with an adhesive or the like.

  Next, a conductive ink containing conductive particles is applied on the surface of the film base material 240 having the adhesive 241 applied on one surface, and the conductors 230a and 230b are applied. The meander antenna unit 230 is formed by printing. Here, the conductive ink for printing the conductors 230a and 230b is the same as that shown in the first embodiment.

  Thereafter, the film substrate 250 on which the antenna part 220 is formed and the IC chip 210 is mounted is used as a bonding surface, and the film substrate 250 on which the antenna part 220 is formed and the IC chip 210 is mounted is attached to the film substrate 240. The applied adhesive 241 is attached to the film substrate 240. At this time, the film base 250 is arranged such that the two corners of the antenna unit 220 formed on the film base 250 and the one ends of the two conductors 230a and 230b formed on the film base 240 face each other. Adhere to the film substrate 240. Thereby, the antenna part 220 formed in the film base material 250 and the meander antenna part 230 formed in the film base material 240 are electrically connected by the connection parts 231a and 231b.

  Then, the release paper attached to the film base material 250 is peeled off, and the release paper 260 is attached to the entire surface of the film base material 240 to which the film base material 250 is attached in a peelable manner.

  Below, the usage method of the non-contact type IC label 200 mentioned above is demonstrated.

  FIG. 4 is a view for explaining a method of using the non-contact type IC label 200 shown in FIG.

  As shown in FIG. 4A, the conductors 230a and 230b constituting the meander antenna portion 230 straddle the pedestal portion 272 and the lid portion 271 in the article case 270 with the pedestal portion 272 covered with the lid portion 271, respectively. In this way, the non-contact type IC label 200 is attached. In this state, since the antenna unit 220 and the conductors 230a and 230b are connected by the connection units 231a and 231b, respectively, the antenna unit 220 formed on the film base member 250 and the film base member 240 are formed. In addition, the meander antenna unit 230 is connected. Here, when the lengths of the conductors 230a and 230b constituting the meander antenna unit 230 are connected to the antenna unit 220 through the connection units 231a and 231b, writing and reading of information with respect to the IC chip 210 is performed in 900 MHz to 1000 MHz. Since the length is such that it is performed in the UHF band, in this state, information is written to and read from the IC chip 210 in the UHF band of 900 MHz to 1000 MHz.

  From this state, when the lid portion 271 of the article case 270 is opened and the pedestal portion 272 and the lid portion 271 are separated, the film base material 240 on which the meander antenna portion 230 is formed is made of a fragile PCV. The non-contact type IC label 200 is not peeled off from the article case 270 and is broken at the boundary between the pedestal portion 272 and the lid portion 271 as shown in FIG. As a result, the conductors 230a and 230b disposed so as to straddle the base portion 272 and the lid portion 271 are destroyed. Although the crack due to the breakage of the film base material 240 may reach the film base material 250 attached to the film base material 240, the film base material 250 is made of PET and is more tensile than the film base material 240. Since the breaking force is strong, even if a crack due to the breakage of the film base material 240 reaches the film base material 250, the film base material 250 is not broken, thereby breaking the antenna portion 220 formed on the film base material 250. Not.

  When the lid portion 271 is completely separated from the pedestal portion 272, as shown in FIG. 4C, the film base material 250 is not broken at all in the non-contact type IC label 200 adhered to the article case 270. As a result, the meander antenna portion 230 is destroyed when the film base material 240 is broken. Therefore, in this state, information is written to and read from the IC chip 210 only through the antenna 211 provided in the IC chip 210 and the antenna unit 220 that resonates with the antenna 211. The antenna unit 220 is shaped so that information is written to and read from the IC chip 210 in the 2.45 GHz frequency band by resonating with the antenna 211 provided in the IC chip 210. In this case, information is written to and read from the IC chip 210 in the 2.45 GHz frequency band.

  As described above, in the present embodiment, with respect to the article case 270 to which the non-contact type IC label 200 is attached, the lid portion 271 is covered with the pedestal portion 272, and the lid portion 271 is separated from the pedestal portion 272. Since the frequency at which information can be written to and read from the IC chip 210 differs depending on the state, for example, it is affixed to an article case containing chemicals that require management such as expensive products or poisonous substances It is possible to detect when the stored article is illegally taken out, and to the IC chip 210 even after the lid portion 271 is separated from the base portion 272. Information can be written and read.

  In this embodiment, the antenna unit 220 is formed on the film substrate 250 by etching. However, the method of forming the antenna unit 220 is not limited to this, and is the same as the conductors 230a and 230b constituting the meander antenna unit 230. It is also conceivable to form by printing using conductive ink. However, when the antenna part 220 is formed on the film base material 250 by etching, the fixing force of the antenna part 220 to the film base material 250 and the cohesive force of the antenna part 220 itself are stronger. It is preferable to configure so that 220 is not destroyed.

  Further, in this embodiment, the dipole type in which the two conductors 230a and 230b constituting the meander antenna unit 230 are connected to the antenna unit 220 has been described as an example, but one meander-shaped conductor is connected to the antenna unit 220. It is also possible to realize this by using a monopole type connected to each other.

  In the two embodiments described above, information can be written to and read from the IC chips 110 and 210 using a UHF band frequency of 900 MHz to 1000 MHz when the meander antenna units 130 and 230 are not destroyed. In the state where the meander antenna units 130 and 230 are destroyed, information can be written to and read from the IC chips 110 and 210 using a frequency of 2.45 GHz. The frequencies at which writing and reading can be performed are not limited to these, and information on the IC chips 110 and 210 is in a state where the meander antenna units 130 and 230 are not destroyed and a state where the meander antenna units 130 and 230 are destroyed. Can write and read Frequency may be any different from that.

  In addition, the shape of the antenna formed as the first antenna portion or the second antenna portion on the film bases 140, 150, 240, 250 is not limited to the two embodiments described above, and can be set as appropriate. it can.

It is a figure which shows 1st Embodiment of the non-contact-type IC label of this invention, (a) is a figure which shows an internal structure, (b) is AA 'sectional drawing shown to (a), (c ) Is a cross-sectional view along the line BB ′ shown in FIG. It is a figure for demonstrating the usage method of the non-contact-type IC label shown in FIG. It is a figure which shows 2nd Embodiment of the non-contact-type IC label of this invention, (a) is a figure which shows an internal structure, (b) is AA 'sectional drawing shown to (a), (c ) Is a cross-sectional view along the line BB ′ shown in FIG. It is a figure for demonstrating the usage method of the non-contact-type IC label shown in FIG. It is a figure which shows an example of the non-contact-type IC label with which the IC chip which communicates using a 2.45 GHz frequency band is mounted, (a) is a top view, (b) is A shown to (a). It is -A 'sectional drawing.

Explanation of symbols

100, 200 Non-contact type IC label 110, 210 IC chip 120 Bowtie antenna part 120a, 120b, 130a, 130b, 230a, 230b Conductor 121a, 121b Feed point 130, 230 Meander antenna part 131a, 131b, 231a, 231b Connection part 140 , 150, 240, 250 Film base 141, 151, 241, 251 Adhesive 160, 260 Release paper 170, 270 Article case 171, 271 Lid 172, 272 Pedestal part 211 Antenna 220 Antenna part

Claims (1)

A base substrate on which an IC chip capable of communicating at the first and second frequencies is mounted, and a first antenna unit for the IC chip to communicate at the first frequency is formed;
A second antenna portion having a lower tensile rupture strength than the base substrate and connected to the first antenna portion to allow the IC chip to communicate at the second frequency is formed. A label substrate,
A non-contact type IC label in which the base substrate is attached to the label substrate so that the first antenna unit and the second antenna unit are connected.

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