JP2007148866A - Substrate sheet for ic tag and method for manufacturing substrate sheet for ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate sheet for an IC tag for mounting an IC chip immediately after manufacturing and a method for manufacturing the substrate sheet for the IC tag. <P>SOLUTION: This substrate sheet 1 for the IC is provided with a base 10 formed like a sheet, an antenna part 20 formed on at least one surface section of the base 10 and an antistatic part 30 formed on a surface section on which the antenna part 20 of the base 10 is formed of conductive materials separately from the antenna part 20. Also, the antenna part 20 and the antistatic part 30 are simultaneously formed by etching. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC tag base sheet and a method for producing an IC tag base sheet.

The IC tag is also referred to as RFID (Radio Frequency Identification), and can write data to the IC chip and read data held by the IC chip in a non-contact state by wireless communication.
Such an IC tag includes, for example, a base sheet formed of a dielectric material such as PET, and an antenna is formed on the base sheet and an IC chip is mounted.
Here, when the IC tag is manufactured, the antenna part is formed and the IC chip is mounted while unwinding the roll-formed base sheet, and the upper layer side base sheet and the lower layer side base sheet are When peeling off, static electricity may be generated on the surface of the base sheet. This static electricity may reach about 10 kV in some cases, and the IC chip may be destroyed by the charged static electricity.
As an IC tag having such a function of preventing electrostatic charge, an IC tag obtained by adding an antistatic agent to a base sheet of an IC tag has been known (for example, see Patent Document 1).

  However, this conventional IC tag may take at least several hours or even several days until the antistatic agent bleeds and the base sheet can reliably exhibit the antistatic function. For this reason, there was a problem that the IC chip could not be mounted immediately after the base sheet was manufactured.

JP 2003-288560 A

  The subject of this invention is providing the manufacturing method of the base sheet for IC tags which can mount | wear with an IC chip immediately after manufacture, and the base sheet for IC tags.

The present invention solves the above problems by the following means.
According to a first aspect of the present invention, there is provided a base portion formed in a sheet shape, an antenna portion provided on at least one surface portion of the base portion, and a surface portion where the antenna portion of the base portion is formed of a conductive material. And a base sheet for an IC tag comprising an antistatic portion provided apart from the antenna portion.

The invention according to claim 2 is the substrate sheet for IC tag according to claim 1, wherein at least a part of the antistatic portion is provided at an edge portion of the base portion. It is a sheet.
According to a third aspect of the present invention, in the base sheet for an IC tag according to the first or second aspect, the antistatic portion extends in a direction substantially parallel to the winding axis direction of the base portion. The base sheet for an IC tag is characterized in that both end portions thereof are formed at both edge portions in the winding axis direction of the base portion, respectively.
According to a fourth aspect of the present invention, in the substrate sheet for an IC tag according to any one of the first to third aspects, the antenna portion and the antistatic portion are formed of the same metal material. It is the base sheet for IC tags.

According to the invention of claim 5, an antenna portion is provided on at least one surface portion of the sheet material, and the sheet material is charged with a conductive material at a position away from the antenna portion on the surface portion where the antenna portion is provided. In the manufacturing method of the base sheet for IC tag which provides a prevention part, the said antenna part and the said antistatic part are formed simultaneously using the same material, The manufacturing method of the base sheet for IC tags characterized by the above-mentioned.
The invention of claim 6 is the method for manufacturing a base sheet for IC tag according to claim 5, wherein the antenna part and the antistatic part are formed by etching. Is the method.

  As described above, according to the present invention, since the surface portion of the base portion is provided with the antistatic portion formed of the conductive material, the area of the surface portion of the base portion is reduced. Can be reduced. Since the antistatic portion can exhibit an antistatic function immediately after being formed on the base portion, the IC tag machine base sheet can be immediately mounted with an IC chip after manufacturing.

  An object of the present invention is to provide a base sheet for an IC tag and a method for manufacturing the base sheet for an IC tag, which can be mounted immediately after manufacture, and a strip-like shape extending in the width direction of the base film. This is realized by forming an antistatic part between a plurality of antenna parts. Further, this is realized by simultaneously forming the antenna portion and the antistatic portion by etching aluminum.

Hereinafter, with reference to the drawings, examples of the base sheet for IC tag and the base sheet for IC tag of the present invention will be described in more detail.
FIG. 1 is a plan view showing a base sheet for an IC tag according to an embodiment, in which a region (A) shows a state before mounting an IC chip, and a region (B) has an IC chip (interposer) mounted thereon. The later state is shown. FIG. 2 is an enlarged view of a region C in FIG.

The base sheet for IC tag 1 of this embodiment is combined with an interposer 40 on which an IC chip 43 is mounted, and includes a base film 10, an antenna unit 20, and an antistatic unit 30. Moreover, the IC tag manufactured using this base sheet 1 for IC tags is a well-known non-contact IC tag which transmits / receives data using a radio wave of UHF band (for example, 952 to 954 Hz).
The base film 10 is a base portion of the base sheet 1 for an IC tag formed in a sheet shape having a thickness direction dimension of, for example, about 25 to 100 μm by a synthetic resin material such as polyethylene terephthalate (PET). The material of the base film 10 is not limited to the above, and may be other polyester resins such as polyethylene naphthalate (PEN), polycarbonate (PC), and the like.
The base film 10 is formed in a belt shape and wound in a roll shape with the width direction (direction perpendicular to the longitudinal direction) taken as the winding axis direction (see FIG. 3).

  The antenna unit 20 is a planar dipole antenna provided by forming a conductive wire on one surface portion (hereinafter referred to as “circuit surface portion”) of the base film 10 by etching of aluminum. The length is about ¼, ３, ½, etc. of the wavelength of the radio wave. A pair of the conductive wires are provided for each antenna unit 20, and one end of each of the conductive wires is disposed to face the other, and an IC chip 43 (to be described later) is attached to these ends.

In the antenna unit 20, for example, the three antenna units 20 are spaced apart and arranged in a direction substantially parallel to the width direction of the base film 10. Further, a plurality of these antenna portions 20 are arranged separately from each other in the longitudinal direction of the base film 10.
The antenna pattern of the antenna unit 20 is not particularly limited, and is formed, for example, by bending the above-described conductive wire into a rectangular wave (square wave) (not shown).

The antistatic part 30 is formed at the same time as the antenna part 20 by etching of aluminum in the same manner as the antenna part 20.
The antistatic portion 30 is formed in a strip shape extending substantially in parallel with the width direction of the base film 10, and is between a pair of antenna portions 20 adjacent to each other in the longitudinal direction of the base film 10. 20 are separated from each other.
Further, the antistatic portion 30 is formed at both ends of the base film 10 in the width direction, and is exposed to the side end surfaces when the base film 10 is rolled. Note that the dimension of the antistatic part 30 in the width direction (longitudinal direction of the base film 10) is such that, for example, the weight of the antistatic part 30 makes the whole weight of the IC tag base sheet 1 form the antistatic part 30. It is set so that it does not become excessively heavy compared with the case where it does not.

The interposer 40 is attached to the IC tag base sheet 1.
The interposer 40 is a known one used to simplify the work when the IC chip 43 is mounted on the IC tag base sheet 1, and includes an interposer base 41, an electrode unit 42, and the IC chip 43. ing.
The interposer base material 41 is formed in a rectangular sheet shape from a synthetic resin material such as PET, like the base film 10 of the IC tag base material sheet 1.
The electrode part 42 is formed by etching a pair of, for example, aluminum along the longitudinal direction of the interposer base 41 corresponding to the electrode (not shown) of the IC chip 43 and the antenna part 20. The pair of electrode portions 42 are respectively joined to the pair of copper wires of the antenna portion 20 by, for example, ultrasonic welding or the like via a metal terminal (bump) and an adhesive (not shown).

The IC chip 43 is provided so as to straddle the pair of electrode parts 42, and an electrode (not shown) is connected to the electrode part 42, and the electrode part 42 is joined to the antenna part 20, so that the electrode part 42 is interposed via the electrode part 42. It is indirectly joined to the antenna unit 20.
The IC chip 43 can record various data such as an EPC (Electronic Product Code) code.

Hereinafter, the manufacturing process of the base sheet 1 for IC tags will be described.
FIG. 3 is a diagram showing a manufacturing process of an IC tag base sheet, (I) shows a side view of the IC tag base sheet formed in a roll shape, and (II) shows each step. It is sectional drawing of the base sheet for IC tags, Comprising: It is sectional drawing of the part containing an antistatic part.
As shown in FIG. 3 (I), the base film 10 is formed in a roll shape and is unwound from one end side in the longitudinal direction, and in step (i), a gel-like adhesive is formed on one surface portion thereof. Is applied. Although the kind of this adhesive agent is not specifically limited, For example, it is a urethane type adhesive agent, and it hardens | cures after sticking the aluminum sheet 12 mentioned later, and the adhesive bond layer 11 is formed.
In addition, in the step (ii), the base film 10 is bonded with an aluminum sheet 12 formed in a band shape having substantially the same width direction dimension as the base film 10 via the adhesive layer 11.

Next, in step (iii), the aluminum sheet 12 is provided with an etching resist 13 in a portion where the antenna unit 20 and the antistatic unit 30 are formed. The etching resist 13 is formed by printing with a rotary printing machine using acid-resistant ink.
In the step (iv), the aluminum sheet 12 is dissolved and removed at portions other than the portion where the etching resist 13 is formed by an acidic solution. At this time, the etching resist 13 formed with acid-resistant ink functions as a protective material for the antenna unit 20 and the antistatic unit 30, and the aluminum sheet 12 remains in the base film 10 in substantially the same shape as the etching resist 13.

Thereafter, in step (v), the etching resist 13 is dissolved and removed with an alkaline solution. On the other hand, since the aluminum sheet 12 is not dissolved by the alkaline solution, it remains on the base film 10, thereby forming the antenna part 20 and the antistatic part 30.
The base sheet 1 for IC tag is wound up in a roll shape like the base film 10 and is transported to a place where an IC chip 43 (interposer 40) mounting process is performed. As described above, the IC tag base sheet 1 is formed in a roll shape so that both end portions of the antistatic portion 30 are exposed on both end surfaces thereof.

  When the IC chip 43 is mounted, the IC tag base sheet 1 is unwound from the rolled state, wound up again after the IC chip 43 is mounted, and transported to a place where the subsequent cutting process is performed. Is done. When forming the IC tag inlet by cutting the IC tag base sheet 1, the antistatic part 30 may or may not be included in the IC tag inlet, but when included in the IC tag. The IC tag inlet also has an antistatic function. In this case, the distance between the antistatic unit 30 and the antenna unit 20 is set so that the antistatic unit 30 does not impair the radio wave transmission / reception function of the antenna unit 20.

As explained above, according to the manufacturing method of the base sheet 1 for IC tags and the base sheet 1 for IC tags of the present embodiment, the following effects can be obtained.
(1) Since the antistatic portion 30 formed of aluminum as a conductor is provided on the base film 10 formed of PET as a dielectric, the area of the PET portion in the circuit surface portion of the base film 10 is reduced. Static electricity generated on the circuit surface portion of the film 10 can be reduced. Further, since the antistatic part 30 is formed in a band shape and provided between the adjacent antenna parts 20, for example, the manufacture of the base sheet 1 for an IC tag is compared with the case where an antistatic layer is provided over the entire surface of the base film 10. Cost can be reduced.
(2) Since the antistatic portion 30 is formed by etching at the same time as the antenna portion 20, the number of manufacturing steps can be reduced and the cost can be reduced. Moreover, since the thickness of the antistatic part 30 is the same as the thickness of the antenna part 20, the base sheet 1 for IC tags does not become thick compared with the case where a layered antistatic part is provided, for example.
(3) Since the antistatic portion 30 is formed at both ends in the width direction of the base film 10, this portion easily comes into contact with other conductors such as a transport device, and the antistatic portion 30 is grounded. It will be in the state. Here, the base film 10 is made of PET, which is a dielectric material, but conducts electricity when a high voltage of several kV such as static electricity is applied. Flows to the antistatic part 30 in a grounded state. Therefore, static electricity generated in the base film 10 can be attenuated.
(4) Since the antistatic part 30 is formed at a position separated from the antenna part 20, the possibility of impairing the radio wave transmission / reception function of the antenna part is reduced.
(5) If the antistatic part 30 is not formed, the part other than the antenna part 20 of the aluminum sheet 12 is a part discarded by etching, and since the antistatic part 30 is formed in this part, generation of waste Can be suppressed. Moreover, since the quantity which melt | dissolves an aluminum sheet is reduced, a manufacturing speed improves.

(Modification)
The present invention is not limited to the embodiments described above, and various modifications and changes are possible, and these are also within the equivalent scope of the present invention.
(1) In the base sheet for an IC tag of the example, the antistatic portion is provided on both ends in the width direction of the base film. However, the configuration of the antistatic portion is not limited to this, for example, It may be formed in a strip shape extending between a part of the end portion of the base film and the inner portion of the base film. Moreover, what was formed in strip | belt shape along the edge part of a base film may be used.
Furthermore, the antistatic part may not be formed at the end of the base film. Even in this case, the base sheet for IC tag has the antistatic effect of the base film. Further, the antistatic portion may be formed in the longitudinal direction of the base film together with the embodiment, and may be formed in a lattice shape as a whole.
(2) Although the antenna unit of the embodiment is a dipole antenna, the shape of the antenna unit is not limited to this, and may be, for example, a planar antenna commonly called a patch antenna or a planar loop antenna.
(3) In the embodiment, the antenna portion is made of aluminum, but the antenna portion is not limited to this as long as it is made of a conductive material. Here, the “conductive material” is not limited to a single conductive material such as aluminum in the embodiment, but, for example, an entire material such as an ink to which a metal such as silver or graphite is added. It shall include those having conductivity.
(4) The base sheet for an IC tag of the example was used when a plurality of antenna parts were formed and a large number of IC tags were manufactured. However, the present invention is not limited to this, and one antenna part is formed. Only the IC tag inlet may be used.
(5) The IC tag base sheet of the example has an IC chip attached to the antenna part via an interposer. However, the present invention is not limited thereto, and for example, a conductive adhesive is applied to the antenna part. The IC chip may be directly attached (adhered) by using.

It is a top view which shows the base material sheet for IC tags of an Example. It is an enlarged view of the area | region C of FIG. It is a figure which shows the manufacture process of the base material sheet for IC tags.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base sheet for IC tags 10 Base film 11 Adhesive layer 12 Aluminum sheet 13 Etching resist 20 Antenna part 30 Antistatic part 40 Interposer

Claims (6)

A base formed in a sheet shape;
An antenna portion provided on at least one surface portion of the base portion;
A base sheet for an IC tag, comprising: an antistatic portion formed on a surface portion of the base portion where the antenna portion is formed with a conductive material, and provided at a distance from the antenna portion. In the base sheet for IC tags according to claim 1,
The base sheet for an IC tag, wherein at least a part of the antistatic part is provided at an edge of the base part. In the base sheet for IC tags according to claim 1 or 2,
The antistatic portion is provided so as to extend in a direction substantially parallel to the winding axis direction of the base portion, and both end portions thereof are formed at both edges of the base portion in the winding axis direction, respectively. An IC tag base material sheet. In the base sheet for IC tags according to any one of claims 1 to 3,
The base sheet for an IC tag, wherein the antenna portion and the antistatic portion are formed of the same metal material. For an IC tag in which an antenna portion is provided on at least one surface portion of a sheet material, and an antistatic portion is provided by a conductive material at a position away from the antenna portion in the surface portion of the sheet material on which the antenna portion is provided. In the method for producing a base sheet,
The method for producing a base sheet for an IC tag, wherein the antenna part and the antistatic part are simultaneously formed using the same material. In the manufacturing method of the base sheet for IC tags of Claim 5,
The method of manufacturing a base sheet for an IC tag, wherein the antenna portion and the antistatic portion are formed by etching.

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