JP2000207518A - Contact/noncontact type bifunctional ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card preventing an IC module from being peeled from a card substrate in a contact/noncontact type bifunctional IC card and to provide the manufacture method. SOLUTION: The contact/noncontact type bifunctional IC cad has an outer device connection terminal 112, an antenna coil 13 buried in a card substrate and an antenna coil connection terminal 14. In this card, an ID module having both functions is installed on a recessed part for installation 18, and an IC module-side antenna coil connection terminal 114 and a card substrate side antenna coil connection terminal 14 are connected in the recessed part. A stress absorbing groove 184 for giving the bending resistance to the card is formed on the outer periphery of the recessed part for IC module installation. The contact/noncontact type IC card can be manufactured by forming the stress absorbing groove 184 at the periphery of the recessed part for IC module installation 18 and installing the IC module.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention realizes, with a single IC chip, the functions of a contact type IC card which performs communication via an external device connection terminal and a non-contact type IC card which performs non-contact communication by electromagnetic induction. The present invention relates to a highly reliable IC card that prevents peeling of an IC module against a bending load of the card and a method for manufacturing the same.

[0002]

2. Description of the Related Art IC cards are classified into a contact type IC card which performs data communication with an external device through a connection terminal and a non-contact type IC card which performs communication by electromagnetic induction through a coil. The card is used for settlement purposes, and the non-contact type IC card is used for gate access control in a transportation system or the like. In recent years, an IC chip having both the function of a contact IC card and the function of a non-contact IC card in one IC chip has been developed. Conventionally, the function of a contact type IC card using this IC chip and a non-contact type IC
In manufacturing a high-performance information recording medium that combines the functions of a card, the contact type IC unit and the non-contact type IC unit are separately mounted on a single card, and the contact / non-contact common IC unit is integrated with the antenna. After that,
A method 2 is used in which a card is formed by laminating with a base material such as vinyl chloride, and a method 3 in which a contact / non-contact common IC portion is embedded and integrated into a card with an antenna.

FIG. 6 is a diagram showing an embodiment (method 1) of a conventional contact-type non-contact common IC card, and FIG. 7 is another embodiment of a contact-type non-contact common IC card (method 2). FIG.
FIG. 9 is a view showing still another embodiment (method 3) of a contact-type non-contact type shared IC card. However, in the case of the above-described method 1, as shown in FIG. 6A, the contact type IC unit 41 having the external device connection terminal 411 and the non-contact type IC unit 44 having the antenna coil 43 are separated and exist independently. There is a problem that both memories cannot be shared. In addition,
FIG. 6B shows a cross section along the line AA in FIG. 6A.

In the case of method 2, as shown in FIG.
First, an IC module-mounted board 521 on which an IC module 51, an antenna coil 53 and an antenna coil connection terminal 54 are integrated is prepared, and the board is combined with a core sheet 522 having an IC mounting opening 58 formed thereon. The oversheets 523 and 524 for protecting the core sheet are laminated, and are pressed and heated by a press machine with or without an adhesive to form the integrated card base 52 (FIG. 7).
(B)). In this case, there is an advantage that there is no detachment of the connection terminal surface. However, since the IC is mounted and then formed into a card by a hot press, the IC is subjected to heat and pressure load applied during card processing.
There is a problem that the malfunction of the device easily occurs. In addition, there are problems that it is difficult to provide various additional functions necessary for the card and that the mass productivity is poor. FIG. 7C is a plan view of the card shown in FIG. 7B.

In the case of method 3, as shown in FIG. 8A, first, an antenna coil 63 and an antenna coil connection terminal 64 are connected.
Is prepared, the oversheets 623 and 624 are laminated on the center core sheet 621 and formed on the integrated card base 62 with or without an adhesive (FIG. 8B). The concave portion 68 for mounting the IC module 61 is cut to expose the antenna coil connection terminal 64 in the card base (FIG. 8C), and the connection terminal 614 provided on the IC chip mounting substrate is connected to the antenna coil on the base side. The terminal 64 is connected with a conductive adhesive such as solder, and an insulating adhesive is applied to the bonding area other than the connection terminal portion. Then, the IC module 61 is loaded, connected and bonded, and the contact type non-contact type is performed. A shared IC card is manufactured (FIG. 8D). FIG. 8E is a plan view of the card shown in FIG. However, in this case, since the antenna coil connection terminal 64 is on the IC module bonding surface, there is a problem that a sufficient bonding area cannot be obtained and the bending resistance is weak.

[0006]

Therefore, in the present invention,
A contact-type and non-contact type common-use IC card having both functions of a contact type and a non-contact type IC card, realizes an IC card having excellent physical strength against bending load, and has excellent mass productivity in a manufacturing process. An object of the present invention is to provide a manufacturing method in which various additional functions necessary for a card can be easily provided.

[0007]

SUMMARY OF THE INVENTION A first aspect of the present invention for solving the above problems is a contact type non-contact having an external device connection terminal, an antenna coil embedded inside a card base, and an antenna coil connection terminal. In a shared-type IC card, an IC module having both functions of a contact type and a non-contact type is fitted and mounted in a concave portion for mounting an IC module, and an antenna coil connection terminal on an IC module side and an antenna coil connection terminal on a card base side. Are connected in the concave portion, and a stress absorbing groove is formed on the outer periphery of the concave portion for mounting the IC module to impart bending resistance to the card. On the card. Since such a contact-type non-contact type shared IC card is used, a card having high resistance to bending load of the card and preventing peeling of the IC module can be obtained.

In the first aspect of the present invention, the lowermost surface of the stress absorbing groove has a depth that does not reach the antenna coil forming sheet surface, and the antenna coil forming sheet surface of the card base passes through the center of the card base to reach the card surface. It is preferable that the external device connection terminal is located at least in a region opposite to the parallel plane. This is because the stress absorbing groove is formed at a depth at which the intended effect is exhibited without cutting the antenna coil. Preferably, the antenna coil connection terminal on the IC module side and the antenna coil connection terminal on the card base are connected by a conductive adhesive, and the contact surface between the IC module and the card base is bonded by an insulating adhesive. As a result, conduction between the antenna coil connection terminals can be maintained, and sufficient strength of the IC module can be ensured in the concave portion.

A second aspect of the present invention for solving the above problems has an external device connection terminal, an antenna coil embedded inside the card base, and an antenna coil connection terminal.
The antenna coil connection terminal and the antenna coil connection terminal on the IC module side are connected by fitting and mounting an IC module having both functions of a contact type and a non-contact type in the recess for mounting the IC module. In a method for manufacturing a contact-type common IC card, the step of forming an antenna coil and an antenna coil connection terminal on a core sheet and the step of forming an integrated card base by laminating an oversheet on the core sheet are performed. With respect to the coil forming surface, a step of selecting and stacking the sheet thickness so that the sheet thickness on the external device connection terminal surface side is thicker than the sheet thickness on the opposite surface side, and integrally forming Cutting the first recess to a depth at which the external connection terminal of the IC module can be mounted on the card base, and mounting both antenna cores in the first recess. Further cutting to IC between Le connection terminals
Cutting the second recess to a depth at which the mold resin portion of the module can be embedded; and forming the third recess at a depth around the second recess and above the antenna coil connection terminal of the card base to reach the connection terminal surface. Excavating, excavating a stress absorbing groove in the outer periphery of the first recess, filling the third recess with a conductive adhesive, and applying or applying an insulating adhesive to the recess other than the third recess. And a step of temporarily mounting an insulating adhesive sheet and mounting an IC module having both functions of a contact type and a non-contact type. With this manufacturing method, it is possible to manufacture a card that is highly resistant to the bending load of the card and that prevents peeling of the IC module.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the IC card of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing one embodiment of a contact type non-contact type shared IC card of the present invention. FIG. 2 is a partially enlarged sectional view taken along line AA of FIG. In the plan view of FIG.
Since it is a C card, it has external device connection terminals 112 on the card surface, but the terminal pattern shape and the like are omitted.
The appearance of a chain line around the card indicates that the antenna coil 13 exists inside the card. The antenna coil connection terminals 14 are formed so as to face the IC module mounting portion concave portion 18 for connecting both ends of the antenna coil and the connection terminals 114 of the IC module substrate.

As shown in FIG. 2, in the contact type non-contact type common IC card of the present invention, the IC
A stress absorbing groove 184 is provided on the outer periphery of the concave portion for mounting the IC module in order to reduce the bending stress applied to the module bonding portion and prevent the IC module from peeling or falling off. Accordingly, the antenna coil forming surface of the core sheet 121 on which the antenna coil 13 is formed is at least flush with a plane passing through the center of the card base and parallel to the card surface and at least flush with the center. Is preferably formed so as to belong to a region opposite to the external device connection terminal 112. This is because the stress absorbing groove is formed without any difficulty in the depth at which the desired effect can be obtained without cutting the antenna coil.

Also, the IC side antenna coil connection terminal 11
4 and the card base side antenna coil connection terminal 14
The conductive adhesive 19 is filled in the small-diameter third concave portion 183 excavated in the C-module mounting concave portion 18 to thereby achieve conduction. Parts other than the two connection terminals are bonded with a normal insulating adhesive 20. In the contact-type and non-contact type shared IC card 10 of FIG. 2, the antenna coil 13 is formed on the core sheet 121, the core sheets 122, 123, and 124 are laminated on the core sheet 121, and the oversheets 125 and 126 are further laminated on the sheet. Of the base sheet. The core sheet 122 plays a role of adjusting the card thickness, and the core sheets 123 and 124 can be printed and protected by the oversheets 125 and 126. Although FIG. 2 shows an example in which the card base is formed of a six-layer base sheet, the card base is not limited to six layers and may have a structure of two to five layers.

FIG. 3 is a diagram showing a recess for mounting an IC module. FIG. 3A is a plan view, and FIG.
2A shows a cross section taken along line AA. The concave portion 18 for the IC module mounting portion is formed at two levels, and the first concave portion 181 is formed at a depth at which the external device connection terminal 112 can be embedded and an adhesive can be applied or laid. The second recess 1 has a size and depth substantially at the center of the first recess so that 115 parts of the mold resin of the IC module can be accommodated.
82 is formed by cutting. Further, a stress absorbing groove 184 is formed in the outer peripheral region of the first concave portion so as to be excavated to a depth that does not reach the antenna coil connection terminal. Further, a third concave portion 183 for connecting an antenna coil connection terminal is formed by excavation at two places in the first concave portion and around the second concave portion. This depth is a depth at which the surface of the antenna coil connection terminal 14 is exposed and does not penetrate. As mentioned above, the third
By filling the concave portion with a conductive adhesive, conduction between the IC side connection terminal and the card base side connection terminal is achieved. Although the third concave portion 183 is shown in a circular shape in FIG. 3, the shape is not limited to the circular shape but may be a rectangular shape or a square shape, or may be a shape connected to the second concave portion.

FIG. 4 is a diagram showing an example of an IC module using a contact type non-contact type common IC chip. FIG. 4 (A)
FIG. 4B is a diagram showing a substrate surface of an external device connection terminal, FIG.
Is a view showing the back surface of the substrate, and FIG. 4C is a cross-sectional view along the bonding wires 113 of the IC module. As shown in FIG. 4A, the surface of the external device connection terminal 112 has an IS
Eight terminals C1 to C8 are formed based on the O standard. Of these, the terminals C4 and C8 are for future use and are not actually used at present. Each terminal is separated by a separation groove. The module side terminal connected to the antenna is usually provided separately from C1 to C8, C9,
It is formed at the terminal of C10. However, in the case of a non-contact type IC module with a board, C1
It does not have the terminal pattern of C8. The external device connection terminals are usually formed in a rectangular shape as shown in FIG. 4A, and are arranged such that the long sides of the card and the terminals are parallel as shown in FIG.

[0015] As shown in FIG.
9 and C10 terminals are connected to the I
It is connected to the C-side antenna coil connection terminal 114.
If there are C1 to C8 terminals, they are similarly connected to the board surface side terminal plate by wire bonding, through holes, etc., but their details are omitted in FIG. After bonding, IC chip 111, bonding wire 1
The portion 13 is covered and protected by the mold resin 115 (FIG. 4C).

The terminal board of such an IC module is
Paste copper foil on both sides of an insulating substrate such as glass epoxy, polyimide, polyester, BT resin, etc., use etching or other processing on the copper foil, draw external device contact terminals on the front surface, and coil connection terminals on the rear surface , And then plating with nickel, copper, gold, etc. The IC chip 111 is mounted on this substrate, and the connection between the IC chip and the connection wiring provided in the substrate is performed by a bonding wire 113 such as a gold wire. Further, the periphery of the IC chip is sealed using a mold resin 115 such as an epoxy resin.

It is preferable that the metal material of the terminal 114 connected to the antenna coil of the IC module and the metal material of the base-side antenna coil connection terminal 14 be the same. This is because if the same material is used, the material selection range of the conductive adhesive is widened, and a material that can be strongly bonded can be used.
In general, a material obtained by plating a copper material with nickel under plating and gold plating is preferably used.

Next, a method for manufacturing the contact type non-contact type shared IC card of the present invention will be described. FIG. 5 is a diagram illustrating a manufacturing process of a contact-type non-contact type shared IC card. FIG. 5 illustrates the case of a four-card structure. The manufacturing method of the present invention is basically the same as the conventional method 3 described above.
However, there is a feature not found in the conventional method in the formation of the concave portion for mounting the IC module and the mounting method of the IC module. First, as shown in FIG.
A core sheet 121 made of vinyl chloride, polyethylene terephthalate (PET) or the like, in which the layout 3 and the antenna coil connection terminals 14 are drawn by photo-etching or printing with conductive ink or the like, is prepared. In addition to the above, the antenna coil is formed by transferring the transfer foil on which the antenna pattern is formed to the core sheet, embedding the winding coil, and drawing while fusing the conductor with the coated resin to the base material with a weld bonder. And the like.

If a vinyl chloride material is used for the core sheets 123 and 124 on the front and back surfaces, normal printing and various special printings described later can be performed. Further, it is preferable to print registration marks for alignment on the core sheet 121, all the other core sheets, and the oversheet. It is also preferable that the core sheet 124 be provided with a mark indicating a position for cutting the concave portion for mounting an IC module and a hitting rule indicating a card punching position.

Next, the core sheet 122 and the oversheets 125 and 126 are laminated thereon to form an integrated card base (FIG. 5B). At this time, the surface of the core sheet 122 is preliminarily printed with a pattern for decorating the card, necessary display, and the like.
The printing may be provided on the back side of the card. In the case of the card base having the six-layer structure shown in FIG. 2, printing can be provided on the surface of the core sheets 123 and 124. In the case of transferring a magnetic tape, after transferring the magnetic tape to the surface of the oversheet 126, if it is a vinyl chloride material, the card base material can be integrated by hot pressing. If it is not a vinyl chloride material, attach it using an adhesive material.

After hot pressing, punching is performed into individual card shapes based on the hitting rule. Thereafter, the mounting concave portion 18 for mounting the IC module 11 is provided.
The concave portion including the concave portion 181, the second concave portion 182, the third concave portion 183, and the stress absorbing groove 184 is formed by cutting and excavating by counterbore processing, NC processing, or the like. The bottom surface of the third recess should be excavated to just expose the surface of the antenna coil connection terminal 14 in the card base, and should not penetrate it (FIG. 5C). In addition, the stress absorbing groove 184
Must not reach the depth of the third recess. This is because if the depth is greater than the third concave portion, the antenna coil 13 and the connection terminal 14 may be cut.

Next, the third concave portion 183 is filled with the conductive adhesive 19, and the other portion of the first concave portion where the IC module contacts the card base is coated with a normal insulating adhesive. Alternatively, an adhesive sheet punched into a predetermined shape is temporarily placed on the IC module substrate side, and a laminate seal is performed by heat (FIG. 5D). The conductive adhesive may be a thermosetting or hot-melt adhesive in which conductive metal particles or the like are dispersed in a resin, or may be a solder paste, a silver paste, or a metal solder that is melted by heat. The IC module is fitted into the mounting recess so that the antenna coil connection terminal 114 of the IC module 11 contacts the third recess filled with these materials. Next, when a heater block (not shown) is applied to the external device connection terminal 112 and heated and pressurized (for example, at 200 ° C. for 30 seconds), the hot-melt adhesive or solder is melted,
If the block is removed and cooled, the antenna coil connection terminals are connected with a conductive adhesive, and the IC module is fixed to the bottom of the first recess by bonding with an insulating adhesive. In the above, preferably, the material of the antenna coil connection terminal provided in the card and the material of the connection terminal provided in the IC chip mounting board are the same, so that the optimum adhesive is always selected and used without being changed. be able to.

(Examples of Other Materials) <Card substrate> Various materials other than vinyl chloride resin and PET can be used for the card substrate. For example, PET-G, polypropylene resin, polycarbonate resin, acrylic resin Resins, polystyrene resins, ABS resins, polyamide resins, polyacetal resins, and the like. <Conductive adhesive> In addition to the solder paste and silver paste as described above, the conductive adhesive may be a conductive adhesive sheet, a paste of copper, carbon, or the like, a metal solder, an anisotropic conductive film. Etc. can be used. <Insulating Adhesive> As the insulating adhesive, various hot-melt or thermosetting adhesives such as an epoxy-based or polyester-based adhesive or an adhesive sheet can be used. Further, an adhesive sheet, cold glue, or the like may be used. The application of the adhesive or the temporary placement of the adhesive sheet is performed on the IC even if the IC card is on the card substrate side.
It may be on the chip side.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a contact-type non-contact type shared IC card according to the present invention will be described below with reference to FIGS. (Example) As shown in FIG.
As 1, a base material in which a 35 μm thick copper foil is laminated on a 180 μm thick white rigid vinyl chloride sheet,
The antenna coil 13 and the antenna coil connection terminal 14 were formed by using a photoetching technique. This core sheet is used as a core sheet 122 for thickness adjustment.
μm white hard vinyl chloride sheet and printed white hard vinyl chloride sheets 123 and 124 with a thickness of 1
Use two 80 μm pieces, and oversheet 125,
A transparent vinyl chloride sheet 2 having a thickness of 50 μm as 126
The sheets are laminated on the top and bottom of the core sheet and hot-pressed (150 °
C, 20 kgf / cm ² , 30 minutes) to produce a card base 12 with an antenna coil embedded therein. The antenna coil 13 had a line width of 500 μm and was formed so as to be wound substantially four times around the outer periphery of the card base.

Next, the first concave portion 181 was cut to a depth corresponding to the total thickness of the IC module substrate and the adhesive sheet by NC cutting at the IC module mounting portion of the card base having the coil embedded therein. At this stage, the size of the first concave portion is 13 mm × 11.8 mm (the radius of curvature of the corner is 2.5 mm).
mm) and the depth was 180 μm. Subsequently, the distance between both antenna coil connection terminals is approximately 8 mm × 8.
mm and a depth of 600 μm.
82 is set to a depth that allows 115 parts of the mold resin of the IC module to be embedded. Around the second concave portion and two places above the antenna coil connection terminal 14 of the card base, φ2 mm
The third concave portion was drilled with a drill so that the antenna coil connection terminal surface appeared. Further, the entire periphery of the first concave portion was excavated with the same size and curvature as the first concave portion and further with a width of 0.5 mm to form a stress absorbing groove 184 having a depth of 350 μm (FIG. 3B). .

On the other hand, an IC chip 111 having a common function of a contact type and a non-contact type and a 150 μm-thick glass epoxy substrate (size: 13 mm × 12 mm (curvature radius of corners: 2.5 mm)) with double-sided copper foil attached. Was prepared. An antenna coil connection terminal 114 is formed on the IC chip side of the substrate, nickel and gold plating is applied to the terminal portion, and a contact type non-contact type common IC chip is mounted on the substrate. Connection with the device connection terminal was performed, and wire bonding with the antenna coil connection terminal was performed using the gold wire 113. Furthermore, I
The periphery of the C chip was sealed with an epoxy resin 115 (FIG. 4C).

Third recess 18 of the recess for mounting the IC module
3 is filled with a solder paste of 0.1 cc each, and a hot-melt conductive adhesive sheet made of a polyester resin and punched into a predetermined shape at a bottom portion of the first concave portion other than the third concave portion is temporarily placed. did. The IC module 11 prepared as described above was fitted into the concave portion 18, and heated and pressed by a heater block (200 ° C., 30 seconds) to mount the IC module (FIG. 2). Thereby, the card thickness of 820 μm
And non-contact common I which is excellent in surface properties and physical strength
C card was obtained.

[0028]

According to the present invention, since the stress absorbing groove is formed around the recess for mounting the IC module, the physical strength of the IC card against bending stress is improved. In addition, a contact-type non-contact type common IC having an antenna coil and a connection terminal in a card base generally.
Although it is difficult to form a stress absorbing groove in a card, the manufacturing method of the present invention can regulate the position of the antenna coil in the card base, and can solve the problem. Further, since the connection portion is sealed with a polyester-based resin adhesive sheet or the like, it has excellent environmental resistance to moisture, oil, and the like. There is an advantage that various additional functions required for the card can be easily provided.

[Brief description of the drawings]

FIG. 1 shows a contact-type non-contact type shared IC card 1 of the present invention.
It is a top view showing an embodiment.

FIG. 2 is a partially enlarged cross-sectional view taken along line AA of FIG.

FIG. 3 is a view showing an IC module mounting recess.

FIG. 4 is a diagram illustrating an example of an IC module using a contact-type non-contact type common IC chip.

FIG. 5 is a diagram illustrating a manufacturing process of a contact-type non-contact type shared IC card.

FIG. 6 is a diagram showing an embodiment (method 1) of a conventional contact-type non-contact type shared IC card.

FIG. 7 is a diagram showing another embodiment (method 2) of a contact-type non-contact type shared IC card.

FIG. 8 is a diagram showing still another embodiment (method 3) of a contact-type non-contact type shared IC card.

[Explanation of symbols]

 Reference Signs List 10 IC card 11 IC module 12 Card base 13 Antenna coil 14 Antenna coil connection terminal 18 IC module mounting recess 19 Conductive adhesive 20 Adhesive 41 IC module 42 IC chip 52, 62 Card base 43, 53, 63 Antenna coil 44 , 54, 64 Antenna coil connection terminals

Claims (4)

[Claims] 1. A contactless non-contact type shared IC card having an external device connection terminal, an antenna coil embedded in a card base, and an antenna coil connection terminal, wherein an IC module having both functions of a contact type and a non-contact type is provided. The IC module-side antenna coil connection terminal and the card substrate side antenna coil connection terminal are connected in the recess while being fitted and mounted in the IC module mounting recess. Is a contact-type non-contact type shared IC card, in which a stress absorbing groove for imparting bending resistance to the card is formed. 2. The card according to claim 1, wherein the bottom surface of the stress absorbing groove has a depth that does not reach the antenna coil forming sheet surface, and the antenna coil forming sheet surface of the card base passes through the center of the card base and is parallel to the card surface. 2. The contactless non-contact type shared IC card according to claim 1, wherein the contactless non-contact type shared IC card is located at least in a region opposite to the external device connection terminal. 3. An IC module side antenna coil connection terminal and a card base side antenna coil connection terminal are connected by a conductive adhesive, and a contact surface between the IC module and the card base is bonded by an insulating adhesive. 3. The contactless non-contact type shared IC card according to claim 1 or claim 2. 4. An external device connection terminal, an antenna coil embedded inside the card base, and an antenna coil connection terminal, wherein the antenna coil connection terminal and the IC module side antenna coil connection terminal are not in contact with the contact type. A method for manufacturing a contact-type non-contact type shared IC card which is connected by fitting and mounting an IC module having a mold and both functions in a recess for mounting an IC module, comprising: a core sheet having an antenna coil and an antenna coil connection terminal; And forming the oversheet on the core sheet to form an integrated card substrate. When the antenna coil forming surface of the core sheet is formed, the sheet thickness on the external device connection terminal surface side is set to the opposite side. The process of selecting the sheet thickness so that it is thicker than the thickness of the sheet on the side, laminating and integrating, and the integrated card Cutting the first recess to a depth at which the external device connection terminal of the IC module can be mounted on the base; further cutting the connection terminals of both antenna coils in the first recess to bury the mold resin portion of the IC module Cutting the second recess to a depth that can be achieved, excavating the third recess to a depth around the second recess on the antenna coil connection terminal of the card base and reaching the connection terminal surface, Excavating a stress absorbing groove in the outer periphery of the concave portion, filling the third concave portion with a conductive adhesive, applying an insulating adhesive to the concave portion other than the third concave portion, or temporarily attaching the insulating adhesive sheet. Placing the IC module having both functions of a contact type and a non-contact type, and a method of manufacturing a contact type non-contact type common IC card.