JP2000132657A - Ic card and manufacture of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an IC card capable of being manufactured at a reduced cost and having wiring layers which are formed on the front and rear surface of a substrate and are connected by means of a stable through-hole, and its manufacturing method. SOLUTION: The IC card is provided with a first core sheet 10, a first through-hole TH1 opened by a laser beam irradiation to penetrate the first core sheet 10, a first through-hole wiring layer 12 which is formed to be buried in the first through-hole TH1, a first wiring layer 11 which is formed on one surface of the first core sheet 10 and connected to the first through-hole wiring layer 12 and a second wiring layer 13 which is formed on the other surface of the first core sheet 10 and connected to the first through-hole wiring layer 12. An IC chip 14 is fixed onto the first core sheet 10 by connection to the first wiring layer 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device (IC)
Chip) and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, IC cards equipped with semiconductor elements (IC chips) for recording and processing data have become widespread from the viewpoint of efficiency of information processing and security. Such an IC card includes a contact system for transmitting and receiving data by connecting an external terminal of the card and a terminal of an external processing device, an antenna coil for transmitting and receiving data by electromagnetic waves, and a semiconductor element for data processing. There is a non-contact type in which a read / write operation with a built-in IC card external device such as a reader / writer is realized by a so-called wireless method. Further, as a non-contact type, a type in which driving power of an IC circuit is supplied by electromagnetic induction and a battery is not built in has been developed.

The structure of the above-mentioned non-contact type IC card is as follows.
Connects an antenna coil for transmitting and receiving data signals and power to and from a reader / writer that reads and writes data, an electronic component such as an IC chip for processing the above signal, and an antenna coil and an electronic component And a holding plastic substrate. As the form of the antenna coil, a winding coil formed by circling a copper wire or the like, a coil formed by bonding a copper or aluminum foil to a plastic substrate and etching into a coil shape, and a conductive ink on a plastic substrate by a conductive ink It is roughly divided into three types of coils formed by printing.

[0004] Of the above three types of coils, wound coils are excellent in characteristics and have the advantage that they can be manufactured relatively inexpensively, but the connection work of electronic parts is complicated, and it is difficult to make the IC card thinner. There is a disadvantage that it is. So IS
In order to manufacture an IC card thinned to a thickness conforming to the O standard, a method of forming an antenna coil on a plastic substrate by the above-described etching method or printing method has been widely used. I have.
Since the etching method requires a complicated process of etching, a printing method that can be manufactured more easily has become an important technique in the development of IC cards.

[0005] In the case of forming a circuit such as an antenna coil for an IC card and a terminal for connecting and holding an IC chip on an insulating substrate such as plastic using the above-mentioned etching method or printing method, for example, Japanese Patent Application Laid-Open No. 8-
As described in JP-A-216570 or JP-A-9-1970, in order to obtain a high-performance antenna coil with small power loss, an antenna coil is formed on each of the front and back surfaces of the substrate, and a through-hole penetrating the substrate is formed. A method of reducing the circuit resistance by connecting in parallel via a hole to increase the inductance value, or a method of connecting in series and increasing the number of turns to increase the inductance value are adopted.

Further, depending on the position where the IC chip is arranged, it is necessary to approach connection terminals from both ends of the antenna. In this case, a method of connecting a jumper wire from the back surface so as not to interfere with the antenna coil is required. Is taken. In some cases, an electrostatic plate corresponding to a capacitor is formed on a substrate in order to further adjust the resonance region. However, when an electrostatic plate is arranged on the front and back of the substrate and connected to an antenna coil, the antenna is similarly formed. It is necessary to arrange the wiring so as not to interfere with the coil. As described above, in any of the above cases, means for connecting the wiring layers formed on the front and back surfaces of the substrate via the through holes is employed.

[0007]

However, in the above-mentioned conventional method of manufacturing an IC card using the etching method, necessary circuits including an antenna coil are formed on the front and back surfaces of an insulating substrate made of plastic or the like. Then, a hole is made in a place where a contact is to be provided, and the inside of the through hole is filled with a conductor by a plating process, and the connection of the wiring layer formed on the front and back surfaces of the substrate is completed, but the manufacturing process is complicated. In addition, there is a disadvantage that the manufacturing cost is high.

In a method of manufacturing an IC card using a printing method, conductive ink is screen-printed on the front and back surfaces of a substrate provided with through holes by punching in advance while embedding the through holes in the antenna coil. However, when the through hole is formed by the above punching, the conductive ink embedded in the through hole may flow out due to the large opening diameter of the through hole, and a stable connection through the through hole may be formed. There was a problem that became difficult.

The above problem is not limited to the problem as an antenna coil in a non-contact type IC card, but is a problem common to the case where a wiring layer built in the IC card and connected to the IC chip is formed.

The present invention has been made in view of the above circumstances, and the present invention has a wiring layer formed on the front and back surfaces of a substrate and connected by stable through holes, and is manufactured at a reduced cost. It is an object of the present invention to provide an IC card capable of performing the method and a manufacturing method thereof.

[0011]

In order to achieve the above object, an IC card according to the present invention comprises an IC chip and the IC.
An IC card including a wiring layer connected to a chip, comprising: a first core sheet; a first through hole opened by irradiating a laser beam so as to penetrate the first core sheet; A first through-hole wiring layer formed by embedding a first wiring sheet; a first wiring layer formed on one surface of the first core sheet and connected to the first through-hole wiring layer; A second wiring layer formed on the other surface of the one-core sheet and connected to the first through-hole wiring layer; and connected to the first wiring layer on the first core sheet. , The IC chip is fixed.

According to the IC card of the present invention, the first
A first wiring layer and a second wiring layer are respectively formed on the front and back surfaces of the core sheet, and they are connected by a first through-hole wiring layer embedded in the first through-hole. The through-hole is formed by irradiating the first core sheet with a laser beam, and it is possible to easily open a plurality of fine-diameter holes as compared with the punching method. When the conductive ink is embedded in the through hole, the conductive ink is prevented from oozing out to the back surface of the core sheet, and a stable connection through the through hole can be realized. In addition, the formation of the wiring layer by the printing method enables the thinning as in the case of the conventional etching method, and can further reduce the cost to produce an IC card.

The above-mentioned IC card of the present invention is preferably
The opening diameter of the first through hole is 10 to 300 μm. If the opening diameter of the through hole is smaller than 10 μm, it may be difficult to embed with the conductive ink. If the opening diameter is larger than 300 μm, the conductive ink tends to bleed.

The above-mentioned IC card of the present invention is preferably
The first through-hole includes a plurality of sub-through-hole groups formed side by side with respect to one connection point, and the first through-hole wiring layer embeds the plurality of sub-through-hole groups. The first wiring layer and the second wiring layer
It is formed so as to connect the wiring layers. By forming a through-hole for one connection point from a plurality of sub-through-hole groups and embedding them to form a through-hole wiring layer, the first through-hole wiring layer and the first wiring layer or the first through-hole are formed. The contact area between the hole wiring layer and the second wiring layer can be increased, and the reliability of connection between the first wiring layer and the second wiring layer by the through-hole wiring layer can be improved.

The above-mentioned IC card of the present invention is preferably
The first and second wiring layers and the through-hole wiring layer constitute an antenna for performing non-contact communication between the IC card and the external device for the IC card. More preferably, the first wiring layer forms a first antenna, the second wiring layer forms a second antenna, and the first antenna and the second antenna are connected in parallel, or The first antenna and the second antenna are connected in series. Antennas are formed on the front and back of the board, respectively, and the circuit resistance is reduced by connecting them in parallel through through-holes penetrating the board to increase the inductance value, or by connecting in series and increasing the number of turns to increase the inductance value. By increasing the value, it is possible to reliably transmit and receive information to and from an external device for an IC card such as a reader / writer.

The above-mentioned IC card of the present invention is preferably
A second core sheet is laminated on the first wiring layer forming surface of the first core sheet, and penetrates the second core sheet to reach the first wiring layer or the first through-hole wiring layer. The second opened by laser light irradiation
A second through-hole wiring layer formed by burying the second through-hole and connecting to the first wiring layer or the first through-hole wiring layer;
A third wiring layer formed on the back surface of the core sheet to be laminated with the first core sheet, the third wiring layer being connected to the second through-hole wiring layer; This makes it possible to form a more complicated wiring layer having a three-layer structure. In particular, when the wiring layer is used as an antenna for a non-contact IC card, the inductance value can be further increased. is there.

Further, in order to achieve the above object, a method of manufacturing an IC card according to the present invention comprises the steps of:
A method of manufacturing an IC card including a wiring layer connected to a chip, the method comprising: irradiating a first core sheet with a laser beam to open a first through hole penetrating the first core sheet; Forming a first wiring layer on one surface of the first core sheet by a screen printing method using a conductive ink, and forming the first wiring layer on the other surface of the first core sheet by a screen printing method using a conductive ink. Second on the surface
Forming a wiring layer, and connecting the IC chip to the first core sheet by connecting the IC chip to the first wiring layer, and forming the first wiring layer and / or In the step of forming the two wiring layers, the conductive ink is buried in the first through holes to form a first through hole wiring layer for connecting the first wiring layer and the second wiring layer.

The method of manufacturing an IC card according to the present invention is as follows.
The first core sheet is irradiated with a laser beam to open a first through hole penetrating the first core sheet, and the first core sheet is printed on one surface of the first core sheet by screen printing using a conductive ink. One wiring layer is formed, and a second wiring layer is formed on the other surface of the first core sheet by a screen printing method using a conductive ink. Next, the IC chip is fixed on the first core sheet by connecting to the first wiring layer. Here, in the step of forming the first wiring layer and / or the step of forming the second wiring layer, a conductive ink is buried in the first through hole to connect the first wiring layer and the second wiring layer. One through-hole wiring layer is formed.

According to the IC card manufacturing method of the present invention, the first wiring layer and the second wiring layer are formed on the front and back surfaces of the first core sheet.
Wiring layers are formed, and they are connected by a first through-hole wiring layer embedded in the first through-hole. By irradiating the first core sheet with a laser beam to form the above-mentioned through-holes, it is possible to easily open a plurality of fine-diameter holes as compared with the punching method. When the ink is buried in the through hole, the conductive ink is prevented from oozing out, and a stable connection through the through hole can be realized. Further, since the wiring layer is formed by screen printing, the thickness can be reduced as in the case of the conventional etching method, and the cost can be further reduced to manufacture an IC card.

The method of manufacturing an IC card according to the present invention is as follows.
Preferably, in the step of opening the first through hole, the first through hole is opened so that the opening diameter is 10 to 300 μm. Opening diameter of through hole is 10μm
If the diameter is smaller than this, it may be difficult to embed the conductive ink, and if the diameter is larger than 300 μm, the conductive ink may easily ooze to the back surface of the substrate.

The method of manufacturing an IC card according to the present invention is as follows.
Preferably, the first and second wiring layers and the through-hole wiring layer form an antenna for performing non-contact communication between the IC card and the external device for the IC card.
More preferably, the first wiring layer forms a first antenna, the second wiring layer forms a second antenna, and the first wiring layer forms a second antenna.
The antenna is formed by connecting the antenna and the second antenna in parallel, or the antenna is formed by connecting the first antenna and the second antenna in series. Antennas are formed on the front and back of the board, respectively, and the circuit resistance is reduced by connecting them in parallel through through-holes penetrating the board to increase the inductance value, or by connecting in series and increasing the number of turns to increase the inductance value. By increasing the value, it is possible to reliably transmit and receive information to and from an external device for an IC card such as a reader / writer.

The method of manufacturing an IC card according to the present invention is as follows.
Preferably, after the step of fixing the IC chip, a step of laminating a second core sheet on the first wiring layer forming surface of the first core sheet, and irradiating the second core sheet with laser light. And the first core sheet penetrates the second core sheet.
A step of opening a wiring layer or a second through hole reaching the first through hole wiring layer, and embedding the conductive ink in the second through hole by a screen printing method using a conductive ink; Or a second through-hole wiring layer connected to the first through-hole wiring layer, and the second through-hole wiring layer is formed on the back surface of the surface of the second core sheet laminated with the first core sheet. Connecting to form a third wiring layer. This makes it possible to form a more complicated three-layered wiring layer. In particular, when the wiring layer is formed as an antenna for a non-contact type IC card, the inductance value can be further increased. It is possible.

[0023]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a configuration of a non-contact type IC card according to the present embodiment. First core sheet 10,
The second core sheet 20 and the protection sheets 30a and 30b are laminated via an adhesive layer (not shown) and laminated to form a non-contact type IC card. In the first core sheet 10, a wiring layer is formed on each of the front and back surfaces, and a wiring layer pattern formed on the front surface is shown on the left side in the drawing, and a wiring layer pattern formed on the back surface is shown on the right side in the drawing. Each is shown.

On the surface of the first core sheet 10, a conductive ink is printed in a pattern of the antenna coil, and
A wiring layer (first antenna and chip connection terminal) 11 is formed. On the other hand, also on the back surface of the first core sheet 10,
Conductive ink is printed on the pattern of the antenna coil to form a second wiring layer (second antenna) 13. The first wiring layer 11 and the second wiring layer 13 are connected to each other via a first through-hole wiring layer 12 formed by burying a first through-hole TH1 penetrating the first core sheet 10. An IC chip 14 is fixed on the surface of the first core sheet 10 by, for example, an anisotropic conductive film (not shown) so as to be connected to the first wiring layer 11.

On the surface of the second core sheet 20, a third wiring layer 21 is formed by printing conductive ink in a jumper line pattern. The third wiring layer 21 is formed via a second through-hole wiring layer 22 formed by burying a second through-hole TH2 penetrating the second core sheet 20.
First wiring layer 1 formed on the surface of first core sheet 10
1 connected.

In the above-mentioned non-contact type IC card, the first antenna and the second antenna forming the antenna coil are connected in parallel as viewed from the IC chip 14. Thus, by reducing the resistance of the antenna and increasing the inductance value, it is possible to reliably transmit and receive information to and from an external device for an IC card such as a reader / writer.

A method for manufacturing the above-mentioned non-contact type IC card will be described. First, for example, a fundamental wave of a YAG laser (oscillation wavelength 1.064 μm) is applied to the first core sheet 10.
m, output 10W, irradiation for 0.3 seconds)
Penetrates the first core sheet 10 and has an opening diameter of 10 to 300 μm
m (for example, about 100 μm) first through hole TH1
Open. The laser used for opening the above-mentioned through hole is CO ₂ (oscillation wavelength 10.2 μm)
Other lasers, such as lasers, can be used. Next, conductive ink is screen-printed on the surface of the first core sheet 10 to form the first wiring layer 11 having the first antenna and the terminal for chip connection. At this time,
The inside of the first through hole TH1 is filled with, for example, about half of the conductive ink 12a. Alternatively, the entire inside of the first through hole TH1 may be buried. Next, a conductive ink is screen-printed on the back surface of the first core sheet 10 to form a second wiring layer 13 having a second antenna.
To form At this time, the other half of the first through hole TH1 is filled with conductive ink to form the first through hole wiring layer 12 connecting the first wiring layer 11 and the second wiring layer 13. When the entire first through hole TH1 is buried in the step of forming the first wiring layer 11, the second wiring layer 13 may be formed so as to be connected to the first through hole wiring layer 12.

Next, an anisotropic conductive film (not shown) is transferred and attached (temporarily press-bonded) to a terminal portion for chip connection of the first wiring layer, and the IC chip 14 is placed on the anisotropic conductive film (not shown). And then press-fit (finally press-fit) from above.
The IC chip 14 is connected to and fixed to the first wiring layer 11. Next, the second core sheet 20 having the IC chip holes 23 previously opened is fitted with the IC chip into the IC chip holes 23, and the first wiring layer of the first core sheet 10 is bonded via an adhesive or the like. 11 is laminated on the formation surface. Next, the second core sheet 20 is irradiated with, for example, a fundamental wave of a YAG laser in the same manner as described above, penetrates the second core sheet 20, reaches the first wiring layer 11, and has an opening diameter of 10 to 300 μm ( A second through hole TH2 (for example, about 100 μm) is opened. Next, conductive ink is screen-printed on the surface of the second core sheet 20 to form a third wiring layer (jumper line) 21.
To form At this time, the conductive ink is entirely buried in the second through-hole TH2, and a second through-hole wiring layer 22 connecting the first wiring layer 11 and the third wiring layer 21 is formed.

Next, protective sheets 30a and 30b are respectively laminated on the upper layer of the second core sheet 20 and the lower layer of the first core sheet 10 via an adhesive, and laminated.
Further, the desired non-contact type IC card is punched out to a card size.

In the method of manufacturing a non-contact type IC card according to the present embodiment, the first through hole TH1 opened in the first core sheet 10 and the second through hole TH2 opened in the second core sheet 20 are: Each is formed by irradiating a laser beam such as a YAG laser.
It is possible to open a through hole having a fine diameter of 0 μm. Thereby, when the conductive ink is embedded in the through hole by the screen printing method, it is possible to suppress the conductive ink from oozing to the back surface of the core sheet, and to realize a stable connection by the through hole.

First core sheet 10, second core sheet 2
No particular limitation is imposed on the resin constituting the protective sheets 30a and 30b, and polyethylene terephthalate (PET), polyvinyl chloride (PVC), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polypropylene (PP), polyethylene (PE), copolymerized polyester (such as PETG), polyamide, polyethylene naphthalate (PE
It is possible to use a resin sheet such as N). As the adhesive, a thermosetting resin-based adhesive such as an epoxy resin or a thermoplastic resin-based adhesive such as a polyester resin can be used. It is also possible to perform lamination by performing hot-press lamination without using an adhesive.

In the above embodiment, the first
A first through hole TH1 opened in the core sheet 10,
Alternatively, the second through-hole TH2 opened in the second core sheet 20 is constituted by a plurality of sub-through-hole groups formed side by side with respect to one connection point. A first through-hole wiring layer or a second through-hole wiring layer can be formed by embedding a conductor. FIG. 2 (a) shows one through hole.
FIG. 4 is an enlarged cross-sectional view of a through-hole wiring layer portion in the case of being constituted by a plurality of openings. First wiring layer 11 and second wiring layer 13
Is the first through hole T opened in the first core sheet 10
H, the first through-hole wiring layer 12 is embedded,
The wiring layer 11 and the second wiring layer 13 are connected. On the other hand, FIG. 2B is an enlarged cross-sectional view of a through-hole wiring layer portion when the through-hole is formed of three openings (sub through-holes). The first wiring layer 11 and the second wiring layer 13
A plurality of sub through holes T opened in the core sheet 10
H ′ is embedded with the sub through-hole wiring layer 12 ′,
A through-hole wiring layer 12 is formed, and connects the first wiring layer 11 and the second wiring layer 13. Here, the opening diameter of each of the sub through holes is 10 to 300 μm.
By doing so, it is possible to suppress the bleeding of the conductive ink into the back surface of the core sheet in each of the sub through holes, and to realize a stable connection through the through holes. Further, the first through-hole wiring layer 12 and the first wiring layer 11 or the first through-hole wiring layer 12 and the second wiring layer 13
Therefore, the reliability of connection between the first wiring layer and the second wiring layer by the through-hole wiring layer can be improved.

Embodiment 1 The non-contact type IC card of this embodiment has an antenna coil on the front surface of a first core sheet, a jumper wire on the back surface, and a wiring layer in which both are connected by through holes. Built-in I
The first core sheet, which is a C card and a main part thereof, will be described with reference to FIG. FIG. 3A is a plan view of the first core sheet 10 from the front side, and FIG.
FIG. 3C is a sectional view taken along line XX ′ in FIG.
Is a plan view from the back side of the first core sheet 10, and XX ′ in the figure corresponds to the position of XX ′ in FIG.

On the surface of the first core sheet 10, a conductive ink is printed in a pattern of the antenna coil, and
A wiring layer (antenna and chip connection terminal) 11 is formed. On the other hand, the second wiring layer (jumper line) 13 is also formed on the back surface of the first core sheet 10 by pattern printing of the conductive ink. First wiring layer 11 and second wiring layer 11
The wiring layers 13 are connected to each other via a first through-hole wiring layer 12 formed by burying a first through-hole TH <b> 1 penetrating the first core sheet 10. Also,
The IC chip 14 is fixed on the surface of the first core sheet 10 by, for example, an anisotropic conductive film 14 so as to be connected to the chip connecting portion of the first wiring layer 11.

A method for manufacturing the above-mentioned non-contact type IC card will be described. First, as shown in FIG.
The YAG laser fundamental wave (wavelength 1.064 μm, output 10 W, irradiation for 0.3 seconds) is focused and irradiated on the first core sheet 10 made of 50 μm PET, and penetrates the first core sheet 10. A first through hole TH1 having an opening diameter of 100 μm was opened. Next, as shown in FIG. 4B, a conductive ink was screen-printed on the surface of the first core sheet 10 to form a first wiring layer 11 having an antenna coil and a terminal for chip connection. At this time, the inside of the first through hole TH1 was filled with, for example, about half of the conductive ink 12a. The conductive ink was satisfactorily embedded in the through hole TH1 having the opening diameter as described above, and the embedded conductive ink did not ooze to the back surface of the core sheet.

After the first wiring layer 11 is dried, FIG.
As shown in (c), a conductive ink was screen-printed on the back surface of the first core sheet 10 to form a second wiring layer 13 serving as a jumper line. At this time, the first half of the first through-hole wiring layer 12 is embedded in the first through-hole TH1 by embedding the other half of the first through-hole TH1 with conductive ink.
Was formed, and conduction between the first wiring layer 11 and the second wiring layer 13 was achieved. First wiring layer 11 formed as described above
When the circuit resistance between the chip connection terminals was measured for the antenna coil composed of the second wiring layer 13 and
It is about 10Ω and the inductance value is 1.4μH
It turned out that it has sufficient characteristics.

Next, as shown in FIG. 5D, an anisotropic conductive film 1 is provided on the terminal portion for chip connection of the first wiring layer.
5 is transferred and affixed (temporary pressure bonding), the IC chip 14 is placed on the anisotropic conductive film 15, and pressure-bonded (main pressure bonding) from above to connect the IC chip 14 to the first wiring layer 11. And fixed. Next, as shown in FIG. 5E, a second core sheet 20 made of PET having a thickness of 250 μm in which holes for IC chips are opened in advance,
The chip was fitted and laminated on the first wiring layer 11 forming surface of the first core sheet 10 via the adhesive 40. Here, the thickness of the adhesive 40 was 20 μm. Next, FIG.
As shown in (f), adhesives 41 and 42 are provided on the upper layer of the second core sheet 20 and the lower layer of the first core sheet 10, respectively.
Are laminated on each other with a thickness of 100 μm, and protective sheets 30 a and 30 b made of white PET each having a thickness of 20 μm, laminated by a hot-press plane press, and punched into a card size to obtain an IC card having a thickness of 760 μm. Was.

Embodiment 2 The contactless IC card of this embodiment has a first wiring layer having a first antenna on the front surface of a first core sheet and a second wiring layer having a second antenna on the back surface. Further, a wiring layer having a third wiring layer serving as a jumper line connected to the first wiring layer on a second core sheet laminated on the first core sheet and connecting the first to third wiring layers with through holes is provided. A first core sheet and a second core sheet, which are built-in IC cards and are essential parts thereof, will be described with reference to FIG. FIG. 6A is a plan view of the second core sheet 20 from the front surface (the surface on which the third wiring layer is formed), and FIG. 6B is XX ′ in FIG. 6A.
FIG. FIG. 6C shows the first core sheet 1.
FIG. 6D is a plan view from the front side of FIG.
FIG. 6C is a sectional view taken along line YY ′ in FIG.
Is a plan view from the back side of the first core sheet 10, and YY ′ in the figure corresponds to the position of YY ′ in FIG. 6C.

A conductive ink is printed on the surface of the first core sheet 10 in a pattern of the antenna coil, and
A wiring layer (first antenna and chip connection terminal) 11 is formed. On the other hand, also on the back surface of the first core sheet 10,
Conductive ink is printed on the pattern of the antenna coil to form a second wiring layer (second antenna) 13. The first wiring layer 11 and the second wiring layer 13 are connected to each other via a first through-hole wiring layer 12 formed by burying a first through-hole TH1 penetrating the first core sheet 10. On the surface of the first core sheet 10, for example, an anisotropic conductive film 14 is used.
The IC chip 14 is fixed so as to be connected to the chip connecting portion of the wiring layer 11.

On the surface of the second core sheet 20, a third wiring layer 21 is formed by printing conductive ink in a jumper line pattern. The third wiring layer 21 is formed via a second through-hole wiring layer 22 formed by burying a second through-hole TH2 penetrating the second core sheet 20.
First wiring layer 1 formed on the surface of first core sheet 10
1 connected.

In the above-mentioned non-contact type IC card, the first antenna and the second antenna forming the antenna coil are printed with the same coil pattern (number of turns, line thickness, line width), and are parallel as viewed from the IC chip 14. It is connected to the. As a result, the resistance of the antenna is reduced and the inductance value is increased, so that an IC such as a reader / writer can be provided.
It is possible to reliably transmit and receive information to and from the card external device.

A method for manufacturing the above-mentioned non-contact type IC card will be described. First, as shown in FIG.
The YAG laser fundamental wave (wavelength 1.064 μm, output 10 W, irradiation for 0.3 seconds) is focused and irradiated on the first core sheet 10 made of 50 μm PET, and penetrates the first core sheet 10. A first through hole TH1 having an opening diameter of 100 μm was opened. Next, as shown in FIG. 7B, a conductive ink was screen-printed on the surface of the first core sheet 10 to form a first wiring layer 11 having a first antenna and a terminal for chip connection. At this time, the first
The inside of the through hole TH1 is filled with, for example, about half of the conductive ink 12a. The conductive ink was satisfactorily embedded in the through hole TH1 having the opening diameter as described above, and the embedded conductive ink did not ooze to the back surface.

After the first wiring layer 11 is dried, FIG.
As shown in (c), a conductive ink was screen-printed on the back surface of the first core sheet 10 to form a second wiring layer 13 having a second antenna. At this time, the first through-hole wiring layer 12 is formed in the first through-hole TH1 by embedding the other half of the first through-hole TH1 with conductive ink. Continuity has been achieved. For the antenna coil composed of the first wiring layer 11 and the second wiring layer 13 formed as described above, the circuit resistance between the chip connection terminal and the first through-hole wiring layer 12 formed inside the coil is determined. The measured value was about 5Ω, and the inductance value was 1.4.
At μH, it was found to have sufficient characteristics.

Next, as shown in FIG. 7D, the anisotropic conductive film 15 is transferred and attached (temporarily compressed) to the chip connecting terminal portion of the first wiring layer, and the IC chip 14 is attached. It is placed on the anisotropic conductive film 15 and pressed from above (finally pressed) to obtain I
The C chip 14 was connected and fixed to the first wiring layer 11.
Next, as shown in FIG. 8 (e), a second core sheet 20 made of PET having a thickness of 250 μm, in which holes for IC chips are previously opened, is fitted into the holes 23 for IC chips, and The first of the first core sheet 10 via the adhesive 40
It was laminated on the wiring layer 11 forming surface. Here, the adhesive 40
Was applied at a thickness of 20 μm.

Next, as shown in FIG. 8F, the second core sheet 20 is irradiated with the fundamental wave of the YAG laser in the same manner as described above, and penetrates the second core sheet 20 to form the first wiring. A second through-hole TH2 having an opening diameter of 150 μm was opened to reach the layer 11. Next, as shown in FIG. 8G, a third wiring layer (jumper wire) 21 was formed on the surface of the second core sheet 20 by screen printing of a conductive ink.
At this time, the inside of the second through-hole TH2 was entirely buried with conductive ink to form the second through-hole wiring layer 22 connecting the first wiring layer 11 and the third wiring layer 21.

Next, as shown in FIG. 8 (h), adhesives 41 and 42 are applied to the upper layer of the second core sheet 20 and the lower layer of the first core sheet 10, respectively, to a thickness of 20 μm and a thickness of 100 μm. The protective sheets 30a, 30b made of white PET were laminated, laminated by a hot-press flat press, and punched into a card size to obtain an IC card having a thickness of 760 μm.

Embodiment 3 The non-contact type IC card of this embodiment has a first wiring layer having a first antenna on the front surface of a first core sheet and a second wiring layer having a second antenna on the back surface. Further, a wiring layer having a third wiring layer serving as a jumper line connected to the first wiring layer on a second core sheet laminated on the first core sheet and connecting the first to third wiring layers with through holes is provided. A first core sheet and a second core sheet which are built-in IC cards and which are main parts thereof will be described with reference to FIG. FIG. 9A is a plan view of the second core sheet 20 from the front surface (the surface on which the third wiring layer is formed), and FIG. 9B is XX ′ in FIG. 9A.
FIG. FIG. 9C shows the first core sheet 1.
FIG. 9D is a plan view from the front side of FIG.
It is sectional drawing in YY 'in (c), FIG.
Is a plan view from the back side of the first core sheet 10, and YY 'in the figure corresponds to the position of YY' in FIG. 9C.

On the surface of the first core sheet 10, conductive ink is printed in a pattern of the antenna coil, and
A wiring layer (first antenna and chip connection terminal) 11 is formed. On the other hand, also on the back surface of the first core sheet 10,
Conductive ink is printed on the pattern of the antenna coil to form a second wiring layer (second antenna) 13. The first wiring layer 11 and the second wiring layer 13 are connected in series via a first through-hole wiring layer 12 formed by burying a first through-hole TH1 penetrating the first core sheet 10. On the surface of the first core sheet 10, for example, an anisotropic conductive film 14 is used.
The IC chip 14 is fixed so as to be connected to the chip connecting portion of the wiring layer 11.

On the surface of the second core sheet 20, a third wiring layer 21 is formed by printing a conductive ink in a jumper pattern. The third wiring layer 21 is formed via a second through-hole wiring layer 22 formed by burying a second through-hole TH2 penetrating the second core sheet 20.
First wiring layer 1 formed on the surface of first core sheet 10
1 connected.

A method for manufacturing the above-mentioned non-contact type IC card will be described. First, as shown in FIG. 10A, a fundamental wave (wavelength: 1.064 μm, output: 10 W, irradiation for 0.3 seconds) of a YAG laser is collected on a first core sheet made of PET having a thickness of 250 μm. Irradiated with light, penetrated the first core sheet 10, and opened a first through hole TH1 having an opening diameter of 100 μm. Next, as shown in FIG. 10B, a conductive ink was screen-printed on the surface of the first core sheet 10 to form a first wiring layer 11 having a first antenna and a chip connection terminal. At this time, the inside of the first through hole TH1 was filled with, for example, about half of the conductive ink 12a. The conductive ink was satisfactorily embedded in the through hole TH1 having the opening diameter as described above, and the embedded conductive ink did not ooze to the back surface.

After the first wiring layer 11 is dried,
As shown in (c), a conductive ink is screen-printed on the back surface of the first core sheet 10 to form a second wiring layer 13 having a second antenna so as to be connected in series with the first wiring layer. did. At this time, the first half of the first through hole TH1 is filled with conductive ink to form the first through hole wiring layer 12 in the first through hole TH1.
The conduction between the first wiring layer 11 and the second wiring layer 13 was achieved.
When the DC resistance between the antenna terminals of the antenna coil composed of the first wiring layer 11 and the second wiring layer 13 formed as described above was measured, it was about 110Ω, and the inductance value was 4.2 μH. Thus, it is possible to increase the inductance value by connecting the antennas in series.

Next, as shown in FIG. 10D, the anisotropic conductive film 15 is transferred and affixed (temporarily compressed) to the chip connecting terminal portion of the first wiring layer, and the IC chip 14 is attached. The IC chip 14 was mounted on the anisotropic conductive film 15 and pressed (mainly pressed) from above to connect and fix the IC chip 14 to the first wiring layer 11. Next, as shown in FIG.
A second core sheet 20 made of PET having a thickness of 250 μm, in which a hole for a chip is previously opened, is fitted with an IC chip into a hole 23 for an IC chip, and the first core sheet 10 of the first core sheet 10 is It was laminated on the wiring layer 11 forming surface. Here, the thickness of the adhesive 40 was 20 μm.

Next, as shown in FIG. 11F, the second core sheet 20 is irradiated with the fundamental wave of the YAG laser in the same manner as described above, and penetrates the second core sheet 20 to form the first wiring. Reaches the layer 11 or the first through-hole wiring layer 12,
A second through hole TH2 having an opening diameter of 150 μm was opened. Next, as shown in FIG. 11G, a third wiring layer (jumper line) 21 was formed on the surface of the second core sheet 20 by screen printing of a conductive ink. At this time, the inside of the second through-hole TH2 was entirely buried with conductive ink to form the second through-hole wiring layer 22 connecting the first wiring layer 11 and the third wiring layer 21.

Next, as shown in FIG. 11 (h), adhesives 41 and 42 were respectively applied to the upper layer of the second core sheet 20 and the lower layer of the first core sheet 10 in a thickness of 20 μm to a thickness of 100 μm. The protective sheets 30a, 30b made of white PET were laminated, laminated by a hot-press flat press, and punched into a card size to obtain an IC card having a thickness of 760 μm.

The present invention is not limited to the above embodiment. For example, the first to third wiring layers can be used as ordinary wiring layers other than constituting an antenna coil for a non-contact type IC card. I with complex multilayer wiring
A wiring layer for a C card can be formed. The laser beam irradiated to open the through hole is not limited to the fundamental wave (1.064 μm) of the YAG laser, but may be light obtained by wavelength conversion by a non-linear effect such as a second harmonic (532 nm) or CO _2. Other lasers such as lasers, excimer lasers and ion lasers can also be used. The through-holes are composed of a plurality of sub-through-hole groups formed side by side with respect to one connection point, and a conductor is embedded in the plurality of sub-through-hole groups to form a through-hole wiring layer. can do.

The IC card may be a non-contact type or a hybrid type having a contact type IC module mounted thereon. In addition, functions such as recording information by providing a magnetic stripe or the like, printing a face photograph by sublimation transfer printing or the like, hologram, embossing, and the like can be provided. Further, the IC card of the present invention includes a rectangular or coin-shaped medium such as a tag, and is applicable to various shapes.

[0058]

According to the non-contact type IC card of the present invention,
A first wiring layer and a second wiring layer are respectively formed on the front and back surfaces of the first core sheet, and they are connected by a first through-hole wiring layer embedded in the first through-hole. Since this through hole is formed by irradiating the first core sheet with a laser beam, it is possible to easily open a plurality of fine-diameter holes as compared with the punching method. When the conductive ink is embedded in the through-hole, it is possible to suppress the conductive ink from oozing out, and to realize a stable connection through the through-hole. In addition, the formation of the wiring layer by the printing method enables the thinning as in the case of the conventional etching method, and can further reduce the cost to produce an IC card.

Further, according to the method of manufacturing a non-contact type IC card of the present invention, a first wiring layer and a second wiring layer are formed on the front and back surfaces of the first core sheet, respectively, and the first and second wiring layers are formed in the first through holes. Since the first core sheet is irradiated with laser light to form the above-mentioned through-holes when the first through-holes are connected by the first through-hole wiring layer embedded therein, the first core sheet has a finer diameter than the punching method. A plurality of holes can be easily opened, and when the conductive ink is embedded in the through-hole by the screen printing method, the conductive ink is prevented from oozing out, and a stable connection through the through-hole is realized. be able to. Further, since the wiring layer is formed by screen printing, the thickness can be reduced as in the case of the conventional etching method, and the cost can be further reduced to manufacture an IC card.

[Brief description of the drawings]

FIG. 1A is a perspective view illustrating a configuration of a non-contact type IC card according to the present embodiment.

FIG. 2 is an enlarged sectional view of a through-hole wiring layer portion in the non-contact type IC card according to the embodiment;
(A) is a case where the through hole is formed of one opening, and (b) is a case where the through hole is formed of three openings (sub through holes).

FIG. 3 is a diagram illustrating a main part of the non-contact type IC card according to the first embodiment, and FIG.
FIG. 3B is a plan view from the front side of FIG.
FIG. 3C is a sectional view taken along line XX ′ in FIG.
FIG. 3 is a plan view of the first core sheet 10 from the back side.

FIGS. 4A and 4B are cross-sectional views illustrating a manufacturing process of the method for manufacturing the non-contact type IC card according to the first embodiment, where FIG. 4A illustrates a process until a first through hole is opened, and FIG. (C) shows up to the step of forming the second wiring layer.

FIG. 5 shows a step that follows the step shown in FIG. 4;
Until the step of fixing the chip, (e) shows the step of laminating the second core sheet, and (f) shows the step of laminating the protective sheet.

FIG. 6 is a view for explaining a main part of a non-contact type IC card according to a second embodiment. FIG.
0 is a plan view from the front surface (third wiring layer formation surface) side of FIG.
FIG. 6B is a cross-sectional view taken along line XX ′ in FIG. 6C is a plan view from the front surface side of the first core sheet, FIG. 6D is a cross-sectional view taken along line YY ′ in FIG. 6C, and FIG. It is a top view from the back side of 1 core sheet.

FIGS. 7A and 7B are cross-sectional views illustrating a manufacturing process of a method for manufacturing a non-contact type IC card according to the second embodiment, in which FIG. 7A illustrates a process up to opening a first through hole, and FIG. Until the step of forming the wiring layer, (c) shows the step of forming the second wiring layer, and (d) shows the step of fixing the IC chip.

FIG. 8 shows a step that follows the step shown in FIG. 7, and FIG.
Until the step of laminating the core sheet, (f) shows the step of opening the second through hole, (g) shows the step of forming the third wiring layer, and (h) shows the step of laminating the protective sheet.

FIG. 9 is a diagram illustrating a main part of a non-contact type IC card according to a third embodiment. FIG. 9A illustrates a second core sheet 2.
0 is a plan view from the front surface (third wiring layer formation surface) side of FIG.
FIG. 9B is a cross-sectional view taken along line XX ′ in FIG. 9A. 9C is a plan view from the front surface side of the first core sheet, FIG. 9D is a cross-sectional view taken along the line YY ′ in FIG. 9C, and FIG. It is a top view from the back side of 1 core sheet.

FIGS. 10A and 10B are cross-sectional views illustrating a manufacturing process of a method for manufacturing a non-contact type IC card according to the third embodiment, where FIG. 10A illustrates a process up to opening a first through hole, and FIG. Until the step of forming the wiring layer, (c) shows the step of forming the second wiring layer, and (d) shows the step of fixing the IC chip.

FIG. 11 shows a step that follows the step shown in FIG. 10;
Up to the step of laminating the second core sheet, (f) up to the step of opening the second through hole, (g) up to the step of forming the third wiring layer, and (h) up to the step of laminating the protective sheet. Is shown.

[Explanation of symbols]

10: first core sheet, 11: first wiring layer, 12: first
Through-hole wiring layer, 13: second wiring layer, 14: IC chip, 15: anisotropic conductive film, 20: second core sheet, 2
DESCRIPTION OF SYMBOLS 1 ... 3rd wiring layer, 22 ... 2nd through-hole wiring layer, 23
... IC chip holes, 30a, 30b ... Protective sheet, 40
... adhesive, TH1 ... first through hole, TH2 ... second through hole.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C005 MB10 NA02 NA09 NA31 NA35 NA36 PA03 PA18 PA27 QC12 QC16 RA04 RA09 RA11 TA21 TA22 5B035 AA00 AA04 BA05 BB05 BB09 BC03 CA01 CA08 CA23 CA25

Claims (13)

[Claims] 1. An IC card having a built-in IC chip and a wiring layer connected to the IC chip, comprising: a first core sheet; and a first core sheet opened by laser light irradiation so as to penetrate the first core sheet. A first through-hole, a first through-hole wiring layer formed by embedding the first through-hole, and a first through-hole formed on one surface of the first core sheet;
A first wiring layer formed by being connected to the through-hole wiring layer; and a first wiring layer formed on the other surface of the first core sheet.
An IC card having a second wiring layer formed connected to the through-hole wiring layer, wherein the IC chip is fixed on the first core sheet connected to the first wiring layer. 2. An opening diameter of said first through hole is 10 to 10.
The IC card according to claim 1, which has a thickness of 300 µm. 3. The first through-hole comprises a plurality of sub-through-hole groups formed side by side with respect to one connection point, and the first through-hole wiring layer comprises a plurality of sub-through-hole wiring layers. 3. The semiconductor device according to claim 1, wherein a through hole group is buried to connect the first wiring layer and the second wiring layer.
2. The IC card according to 1. 4. The antenna according to claim 1, wherein the first and second wiring layers and the through-hole wiring layer form an antenna for performing non-contact communication between the IC card and an external device for the IC card. The IC card according to any one of the above. 5. The first wiring layer forms a first antenna, the second wiring layer forms a second antenna, and the first antenna and the second antenna are connected in parallel. The described IC card. 6. The first wiring layer forms a first antenna, the second wiring layer forms a second antenna, and the first antenna and the second antenna are connected in series. The described IC card. 7. A first core sheet, wherein a second core sheet is laminated on the first wiring layer forming surface of the first core sheet, and the first wiring layer or the first through hole penetrates the second core sheet. A second through hole opened by laser light irradiation so as to reach the wiring layer; and a second through hole formed by filling the second through hole and connecting to the first wiring layer or the first through hole wiring layer. The semiconductor device further includes a through-hole wiring layer, and a third wiring layer formed on the back surface of the surface of the second core sheet laminated with the first core sheet and connected to the second through-hole wiring layer. Claim 1
7. The IC card according to any one of claims 1 to 6. 8. A method for manufacturing an IC card including an IC chip and a wiring layer connected to the IC chip, wherein the first core sheet is irradiated with laser light.
A step of opening a first through hole penetrating the core sheet; a step of forming a first wiring layer on one surface of the first core sheet by a screen printing method using a conductive ink; Forming a second wiring layer on the other surface of the first core sheet by a screen printing method using, and connecting the IC chip to the first core sheet by connecting to the first wiring layer Forming the first wiring layer and / or forming the second wiring layer.
In the step of forming a wiring layer, manufacturing of an IC card in which the conductive ink is buried in the first through hole and a first through hole wiring layer for connecting the first wiring layer and the second wiring layer is formed. Method. 9. The method for manufacturing an IC card according to claim 8, wherein in the step of opening the first through hole, the first through hole is opened so that the opening diameter becomes 10 to 300 μm. 10. The antenna according to claim 8, wherein the first and second wiring layers and the through-hole wiring layer form an antenna for performing non-contact communication between the IC card and the external device for the IC card. 3. The method for manufacturing an IC card according to item 1. 11. The first wiring layer forms a first antenna, the second wiring layer forms a second antenna, and is formed by connecting the first antenna and the second antenna in parallel. 11. The method for manufacturing an IC card according to item 10. 12. The first wiring layer forms a first antenna, the second wiring layer forms a second antenna, and is formed by connecting the first antenna and the second antenna in series. 11. The method for manufacturing an IC card according to item 10. 13. A step of laminating a second core sheet on the first wiring layer forming surface of the first core sheet after the step of fixing the IC chip, and applying a laser beam to the second core sheet. Irradiating the second
The first wiring layer or the first wiring layer extends through a core sheet.
A step of opening a second through-hole reaching the through-hole wiring layer, and embedding the conductive ink in the second through-hole by a screen printing method using a conductive ink to form the first wiring layer or the first through-hole. Forming a second through-hole wiring layer connected to the hole wiring layer, and connecting the second through-hole wiring layer to the third wiring on the back surface of the surface of the second core sheet laminated with the first core sheet; The method for manufacturing an IC card according to claim 8, further comprising a step of forming a layer.