WO2004023386A1 - Combination-type ic card and method of manufacturing the combination-type ic card - Google Patents
Combination-type ic card and method of manufacturing the combination-type ic card Download PDFInfo
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- WO2004023386A1 WO2004023386A1 PCT/KR2003/000832 KR0300832W WO2004023386A1 WO 2004023386 A1 WO2004023386 A1 WO 2004023386A1 KR 0300832 W KR0300832 W KR 0300832W WO 2004023386 A1 WO2004023386 A1 WO 2004023386A1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The present invention provides with a combination-type IC card, that can remove badness fundamentally and epochally and be manufactured easily and inexpensively. The combination-type IC card is characterized by comprising: a front sheet (50) and an intermediate sheet (60) each having an insertion opening (51 or 61) into which a board (12 or 32) and an IC chip (11a or 31a) are inserted, each contact terminal (72) of a loof antenna (70) being arranged so as to be in electrical contact with each of the loop antenna contact portions (16 or 36) of the board (12 or 32) when the board (12 or 32) and the IC chip (11a or 31a) are inserted into the insertion openings (51) and (61).
Description
Title of Invention
Combination-type IC card and method of manufacturing the combination-type IC card Technical Field The present invention relates generally to a combination-type IC card and method of manufacturing the combination-type IC card, ■ and more particularly to a combination-type electronic integrated circuit card, i.e., smart card, that can remove badness fundamentally and epochally and be manufactured easily and inexpensively. Background Art
The prior art technology for manufacturing a conventional prior combination-type smart card (IC card) comprises the following processes as a manner using a mechanical milling process and electrically conductive adhesive. That is, 1) a process for manufacturing an inletted portion of a loof-type RF antenna, 2) a process for laminating a plurality of plastic films on the upper and lower surfaces of the inletted portion, 3) a process for joining the laminated plastic films by heat compression, 4) a process for milling a heat compressed plastic card at a
predetermined portion by a predetermined depth so as for the inletted portion of the antenna to be exposed and be able to be connected to an IC chip module, 5) a process for printing image, hologram, etc. , on the exterior and/or back surface of the plastic card, and, 6) a process for applying conductive adhesive on the milled portion and connecting the inletted portion and the IC chip module.
In Fig. 1 shown as one example of a conventional prior art combination-type IC chip module 10, an IC chip 11a is installed on a board 12 so as to form electrical contacts with exterior sides and an interior loof antenna 70. That is, external terminal contact portions 15 are formed on one surface of the board 12 and the IC chip 11a is arranged on another surface of the board 12, a plurality of through holes 14 are formed around the IC chip 11a and wires 14a are installed through the through holes 14 so as to electrically connect the IC chip 11a to the external terminal contact portions 15 for connecting the IC chip 11a outside. And, for the combination-type, as shown in Fig. 1, opposite loop antenna contact portions 16 are formed on said board 12 around the IC chip 11a and wires 13 connect the IC chip 11a to the opposite
loop antenna contact portions 16. Then, a molding portion lib is formed and an IC chip module 10 is completed. The reference numeral "11" indicates an IC chip molding assembly comprising the IC chip 11a and the molding portion lib with the wires 13 and 14a built in.
The IC chip module 10 is inserted into a milled cavity and is electrically connected to opposite jigjag-shaped contact terminals of the internal loof antenna at the loop antenna contact portions 16 by means of conductive adhesive. Thus, the IC card manufactured as explained above has the following problems.
One problem is that an electrical connection between the IC chip and the antenna becomes bad, which is a fatal problem to destroy a noncontact function of the combination-type card and is mainly caused by badness in smoothness of the inletted portion, accuracy of milling work, electrically conductive adhesive, etc.
Another problem is that the IC chip breaks away from the IC card. That is, the IC chip attached in the milled cavity by adhesive only is to be separated from the card during carrying or using of the card, which is mainly caused by badness in conductive
and nonconductive adhesive, repeated usage, weather state such as temperature, humidity, etc.
Badness in the electrical connection during such manufacturing processes amounts to several tens per cent, thereby becoming a main factor for raising the production cost.
Particularly, most of the IC chips to be decided to be bad cannot be reclaimed, which becomes decisive factor for raising a price.
Also, such problems are some of main factors for raising the production cost and the product price and for preventing the spread of smart cards.
Disclosure of Invention
Accordingly, the present invention is made in order to solve the above problems of the prior art smart cards and the prior art manufacturing technique, and one object of the present invention is to provide a combination-type IC card and a method of manufacturing the combination-type IC card which can remove badness fundamentally and epochally and be manufactured easily and inexpensively.
To accomplish the object of this invention, a combination-type IC card is provided in accordance with one
embodiment of the present invention, which comprises a plurality of sheets to be laminated with a loof antenna and an IC chip module built in, said IC chip module comprising an IC chip molding assembly having an IC chip inside and a board having external terminal contact portions for electrically connecting the IC chip outside and a pair of loop antenna contact portions to be electrically contacted with each of contact terminals of loop antenna for connection between the IC chip and the loof antenna, said combination-type IC card being characterized by further comprising'- a front sheet and an intermediate sheet each having an insertion opening into which the board and the IC chip are inserted, each contact terminal of the loof antenna being arranged so as to be in electrical contact with each of the loop antenna contact portions of the board when the board and the IC chip are inserted into the insertion openings.
In this case, the front sheet, the intermediate sheet and the IC chip module are assembled and compressed with heat added, thereby being electrically more stabilized. Furthermore, it is preferred that the loof antenna is formed of an inletted portion, the inletted portion being formed on the intermediate sheet with
the contact terminals being exposed to the insertion opening of the front sheet between the front sheet and the intermediate sheet. Still furthermore, the external terminal contact portion is formed smaller in size than the board and an overlay layer has an insertion opening smaller in size than the insertion opening of the front sheet, the external terminal contact portions being inserted into the insertion opening of the overlay layer, and whereby the IC chip module is prevented from being easily separated from the front sheet due to external force, and the electrical connection between the contact terminals of the loof antenna and the loop antenna contact portions of the board being electrically more stabilized. Also, it has various advantages that each of the contact terminals of the loof antenna is formed of a straight line, which passes on each of the loop antenna contact portions of the board with being in contact therewith.
Furthermore, the present invention is to provide one embodiment of a method of manufacturing a combination-type IC card which comprises a plurality of sheets to be laminated with a loof antenna and an IC chip module built in, said IC chip module comprising an IC chip molding assembly having an IC chip inside
and a board having external terminal contact portions for electrically connecting the IC chip outside and a pair of loop antenna contact portions to be electrically contacted with each of contact terminals of loop antenna for connection between the IC chip and the loof antenna, the method being characterized by comprising the steps of: forming insertion openings at the front sheet and the intermediate sheet respectively in correspondence to the board and the IC chip; arranging the loof antenna so that each of the contact terminals of the loof antenna can be in electrical contact with each of the loop antenna contact portions of the board when the board and the IC chip are inserted into the insertion openings after the front sheet and the intermediate sheet are laminated; laminating the front sheet and the intermediate sheet so that the insertion openings are arranged to insert the IC chip module thereinto; and, inserting the IC chip module into the insertion openings of the front sheet and the intermediate sheet laminated, so that the IC chip of the IC chip module is inserted into the insertion opening of the intermediate sheet and the board is inserted into the insertion opening of the front sheet.
Still another embodiment of a method of manufacturing a combination-type IC card according to the present invention, is characterized in that: for stabilized and economic electric connections between the IC chip module and an inletted portion, insertion openings for the combination-type IC chip module are formed in at least two sheets by a sheet-punching method, which replaces a milling process in the prior art method of manufacturing the prior art combination-type IC card. Still further another embodiment of a method of manufacturing a combination-type IC card according to the present invention, is characterized in that: at least two sheets and an IC chip module constituting a combination-type IC card are assembled prior to a heat compression process(lamination process), which is one of the card manufacturing processes, and said at least two sheets and the IC chip module assembled are fixedly joined together in the heat compression process(lamination process). Brief Description of Drawings
Fig. 1 is a sectional view of the prior art combination-ype IC chip; Fig. 2 is a sectional view of one combination-type IC chip
module in accordance with the present invention;
Fig. 3a is a sectional view for illustrating a configuration of a combination-type IC card according to one embodiment of the present invention which the combination-type IC chip module of Fig. 1 is applied to, and Fig. 3b is a sectional view for illustrating a configuration of a combination-type IC card according to another embodiment of the present invention which the combination-type IC chip module of Fig. 2 is applied to; Fig. 4 is a plan view of a combination-type IC card in accordance with the present invention;
Figs. 5 to 9 are schematical process charts for explaining the method of manufacturing a combination-type IC card in accordance with the present invention.
Best Mode for Carrying out the Invention Now, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
In Figs. 3a and 3b, sectional configurations of a combination-type IC card according to embodiments of the present invention are illustrated. In Figs. 3a and 3b, the combination-type IC cards all
comprise a plurality of sheets laminated and a loof antenna 70, said sheets being characterized by comprising a front sheet 50 and an intermediate sheet 60, each having an insertion opening 51 or 61 into which the board 12 or 32 and an IC chip 11a or 31a are inserted, each contact terminal 72 of the loof antenna 70 being arranged so as to be in electrical contact with each of the loop antenna contact portions 16 or 36 of the board 12 or 32 when the board 12 or 32 and the IC chip 11a or 31a are inserted into the insertion openings 51 and 61. In the combination-type IC cards having such configurations, electrical signals are inputted and outputted through external terminal contact portions 15 or 35 formed on the experior surface of the board 12 or 32 of the combination-type IC chip module 10 or 30. In the manufacturing, the prior art milling process, adhering process, etc. , are not necessary from such configurations. Also, the IC chip module is not simply attached with adhesive, but the board 12 or 32 for supporting the IC chip module is structurally buried in the interior of plastic sheets (the front sheet 50, the intermediate sheet 60 and a back sheet 81) by a particular insertion and built-in structure and
heat-compression, and thus, the problems of electrical connection badness or separation of the IC chip module are fundamentally removed and product reliability increases. Also, manufacturing processes can be simplified and automated. A difference between the combination-type IC cards shown in Figs. 3a and 3b is that the combination-type IC card shown in Fig. 3a is constituted using the prior art combination-type IC chip module 10 of Fig. 1, and, in Fig. 3b, the combination-type IC chip module 30 of a structure shown in Fig. 2 is applied to the combination-type IC card. In Fig. 2, the combination-type IC chip module 30 comprises connection terminals thereon similar to those of Fig. 1, and a plurality of through holes 34 are formed around the IC chip 31a in the board 32 arranged on one surface of the IC chip 31a. The external terminal contact portions 35 are connected to the contact terminals on the IC chip 31a by means of each wire 34a passing through the through holes 34 of the board 12 or 32 so as to electrically connect the IC chip 31a outside. As shown in Fig. 2, a pair of loop antenna contact portions 36 are formed on one surface of the board 32 around the IC chip 31a, being connected into the IC chip 31a by means of wire 33. In the IC chip
module 30 as described above, a molding portion 31b is formed around the IC chip 31a and the wire 33 and 34a, which completes an IC chip molding assembly 31, thereby being capable of keeping the connection stable and protecting the IC chip 31a. However, a point different from one of Fig. 1 is such that the external terminal contact portions 35 to be formed on another surface of the board 32 has an area smaller than the board 32. In case of the IC chip module 30 as shown in Fig. 3b, after the IC chip molding assembly 31 and the board 32 are inserted into the insertion openings 51 and 61 of the front sheet 50 and the intermediate sheet 60, an overlay layer 55 is formed with an insertion opening 56 for inserting the external terminal contact portions 35, the insertion opening 56 being formed with an area smaller than the insertion opening 51 of the front sheet 50. Thus, the combination-type IC card shown in Fig. 3 has an advantage that separation of the IC chip 31a is fundamentally prevented, besides advantages of Fig. 3a.
Furthermore, while the inletted portion 71 is formed on one surface of the intermediate sheet 60, the contact terminals 72 of the loof antenna 70 are arranged on the one surface of the
intermediate sheet 60 so as to be in contact with, and be electrically connected to, the loop antenna contact portions 16 or 36 of the board 12 or 32, and thus the loof antenna 70 can be easily formed. Still furthermore, at least one layer of a back sheet 81 is laminated on another surface of the intermediate sheet 60 and joined by heat compression, and thus the IC chip module 12 or 30 can be still more prevented from being easily separated from the front sheet 50 due to external force and the electrical connection between the contact terminals 72 "of the loof antenna 70 and the loop antenna contact portions 16 or 36 of the board 12 or 32 being electrically far more guaranteed.
Meanwhile, although the insertion opening 51 or 61 is formed by punching, etc. , it is very difficult and uneconomical to form such an opening in case of the front sheet 50 and the intermediate sheet 60 having 0.15mm or below in thickness.
Still furthermore, in the structure of the combination-type IC card according to the present invention, each of the contact terminals 72 of the loof antenna 70 is formed of a straight line as shown in Fig. 4, which ensures an electrical connection by passing on each of the loop antenna contact portions 16 or 36 of
the board 12 or 32 with being in contact therewith, different from the prior art in which jigjag-shaped contact terminals of the loof antenna after milling are connected to the loop antenna contact portions. Therefore, the manufacturing processes can be far more simplified.
Figs. 5 to 9 illustrate schematical process charts for explaining the method of manufacturing a combination-type IC card of Fig. 3b. The structure of Fig. 3a is also manufactured in a similar manner. In Fig. 5, the step of forming insertion openings 51 and 61 at the front sheet 50 and the intermediate sheet 60 is first performed by punching, etc. , so as for each insertion opening 51 or 61 to be respectively in correspondence to the board 32 and the IC chip 31a, and then the loof antenna 70 is arranged. The loof antenna 70 can be formed by embedding coil into the intermediate sheet 60, and according to circumstances, the loof antenna 70 of a film type or a wound-coil type can be prepared so as to be inserted between the front sheet 50 and the intermediate sheet 60, or according to the structure the loof antenna 70 can be formed after some plastic sheets are laminated. The loof antenna 70 is
formed or arranged so that each of the contact terminals 72 of the loof antenna 70 can be in electrical contact with each of the loop antenna contact portions 36 of the board 32 when the board 32 and the IC chip 31a are inserted into the insertion openings 51 and 61 after the front sheet 50 and the intermediate sheet 60 are laminated.
Then, as shown in Fig. 6, the front sheet 50 and the intermediate sheet 60 are laminated with the insertion openings 51 and 61 arranged so as for the IC chip module 30 to be inserted thereinto. As shown in Fig. 7, the IC chip module 30 is inserted into the insertion openings 51 and 61 of the front sheet 50 and the intermediate sheet 60 laminated, so that the IC chip 31a of the combination-type IC chip module 30 is inserted into the insertion opening 61 of the intermediate sheet 60, and the board 32 is inserted into the insertion opening 51 of the front sheet 50. Thus, the basic combination-type IC card is completed. However, it is preferable that, as shown in Fig. 8, an overlay layer 55 and at least one layer of the back sheet 81 are laminated respectively on each of opposite outer surfaces of the front sheet 50 and the intermediate sheet 60 laminated. As shown in Fig. 9,
the front sheet 50, the intermediate sheet 60, the overlay layer 55, and the back sheet 81 are completely joined by being compressed with heat added after being laminated.
In the above, it is preferable to inspect characteristics of connection prior to the heat compression, and for mass production, one combination-type IC card can be manufactured by manufacturing one large sheet including large quantity of combination-type IC cards at the same time and by cutting it into the individual combination-type IC cards of a certain size. A process such as printing, embossing, etc. , for forming determined image, hologram, letters, etc. , can be performed after a white card is manufactured, and image, hologram, letters, etc. , can be formed even on the front sheet 50, etc.
By virtue of the configuration and acting of the combination-type IC cards and method of manufacturing the combination-type IC cards in accordance with the embodiments of the present invention described above, the factors of badness in an electrical connection between the IC chip and the antenna can be fundamentally removed, and therefore, efficiency in production can be remarkably increased.
Also, the chip is not to be simply attached with adhesive, but the combination-type IC chip module 10 or 30 is structurally buried in the interior of plastic sheets, and thus, the problems of electrical connection badness or separation of the IC chip module are fundamentally removed and product reliability increases.
Furthermore, manufacturing processes can be simplified and automatization can be facilitated since the manufacture method of the present invention does not comprise the milling process, the application process of conductive or non-conductive adhesive, etc. , as described above.
Conclusively, the production cost and the price of the product can be substantially reduced, and therefore the demand and its market can be explosively increased.
Claims
1. A combination-type IC card which comprises a plurality of sheets to be laminated with a loof antenna (70) and an IC chip module (10 or 30) built in, said IC chip module (10 or 30) comprising an IC chip molding assembly (11 or 31) having an IC chip (11a or 31a) inside and a board (12 or 32) having external terminal contact portions (15 or 35) for electrically connecting the IC chip (11a or 31a) outside and a pair of loop antenna contact portions (16 or 36) to be electrically contacted with each of contact terminals (72) of loop antenna (70) for connection between the IC chip (11a or 31a) and the loof antenna (70), said combination-type IC card being characterized by further comprising: a front sheet (50) and an intermediate sheet (60) each having an insertion opening (51 or 61) into which the board (12 or 32) and the IC chip (11a or 31a) are inserted, each contact terminal (72) of the loof antenna (70) being arranged so as to be in electrical contact with each of the loop antenna contact portions (16 or 36) of the board (12 or 32) when the board (12 or 32) and the IC chip (11a or 31a) are inserted into the insertion openings (51) and (61).
2. The combination-type IC card according to claim 1, wherein the front sheet (50), the intermediate sheet (60) and the IC chip module (10 or 30) are assembled and compressed with heat added, thereby being electrically more stabilized.
3. The combination-type IC card according to claim 1, wherein the loof antenna (70) is formed of an inletted portion (71), the inletted portion (71) being formed on the intermediate sheet (60) with the contact terminals (72) being exposed to the insertion opening (51) of the front sheet (50) between the front sheet (50) and the intermediate sheet (60).
4. The combination-type IC card according to claim 1, wherein the external terminal contact portion (35) is formed smaller in size than the board (32) and an overlay layer (55) has an insertion opening (56) smaller in size than the insertion opening (51) of the front sheet (50), the external terminal contact portions (15 or 35) being inserted into the insertion opening (56) of the overlay layer (55), and whereby the IC chip module (30) is prevented from being easily separated from the front sheet (50) due to external force and the electrical connection between the contact terminals (72) of the loof antenna (70) and the loop antenna contact portions (36) of the board (32) being electrically more stabilized.
5. A combination-type IC card which comprises a plurality of sheets to be laminated with a loof antenna (70) and an IC chip module (10 or 30) built in, said IC chip module (10 or 30) comprising an IC chip molding assembly (11 or 31) having an IC chip (11a or 31a) inside and a board (12 or 32) having external terminal contact portions (15 or 35) for electrically connecting the IC chip (11a or 31a) outside and a pair of loop antenna contact portions (16 or 36) to be electrically contacted with each of contact terminals (72) of loop antenna (70) for connection between the IC chip (11a or 31a) and the loof antenna (70), said combination-type IC card being characterized in that: each of the contact terminals (72) of the loof antenna (70) is formed of a straight line, which passes on each of the loop antenna contact portions (16 or 36) of the board (12 or 32) with being in contact therewith.
6. A method of manufacturing a combination-type IC card which comprises a plurality of sheets to be laminated with a loof antenna (70) and an IC chip module (10 or 30) built in, said IC chip module (10 or 30) comprising an IC chip molding assembly (11 or 31) having an IC chip (11a or 31a) inside and a board (12 or 32) having external terminal contact portions (15 or 35) for electrically connecting the IC chip (11a or 31a) outside and a pair of loop antenna contact portions (16 or 36) to be electrically contacted with each of contact terminals (72) of loop antenna (70) for connection between the IC chip (11a or 31a) and the loof antenna (70), the method being characterized by comprising the steps of: forming insertion openings (51) and (61) at the front sheet (50) and the intermediate sheet (60) respectively in correspondence to the board (12 or 32) and the IC chip (11a or 31a); arranging the loof antenna (70) so that each of the contact terminals (72) of the loof antenna (70) can be in electrical contact with each of the loop antenna contact portions (16 or 36) of the board (12 or 32) when the board (12 or 32) and the IC chip (11a or 31a) are inserted into the insertion openings (51) and (61) after laminating the front sheet (50) and the intermediate sheet (60); laminating the front sheet (50) and the intermediate sheet (60) so that the insertion openings (51) and (61) are arranged to insert the IC chip module (10 or 30) thereinto; and, inserting the IC chip module (10 or 30) into the insertion openings (51) and (61) of the front sheet (50) and the intermediate sheet (60) laminated, so that the IC chip (11a or 31a) of the IC chip module (10 or 30) is inserted into the insertion opening (61) of the intermediate sheet (60) and the board (12 or 32) is inserted into the insertion openings (51) of the front sheet (50).
7. The method of manufacturing a combination-type IC card according to claim 6, wherein said method is characterized by further comprising the steps of: laminating an overlay layer (55) and at least one layer of a back sheet (81) respectively on the exterior surfaces of the front sheet (50) and the intermediate sheet (60) which are laminated and of which the combination-type IC chip module (10 or 30) is inserted into the insertion openings (51) and (61); and compressing, with adding heat, the front sheet (50), the intermediate sheet (60), the overlay layer (55) and the back sheet (81) which are laminated.
8. A method of manufacturing a combination-type IC card, said method being characterized in that: for stabilized and economic electric connections between the IC chip module (10 or 30) and an inletted portion (71), insertion openings (51) and (61) for the combination-type IC chip module (10 or 30) are formed in at least two sheets by a sheet-punching method, which replaces a milling process in the prior art method of manufacturing the prior art combination-type IC card.
9. A method of manufacturing a combination-type IC card, said method being characterized in that: at least two sheets and an IC chip module constituting a combination-type IC card are assembled prior to a heat compression process(lamination process), which is one of the card manufacturing processes, and said at least two sheets and the IC chip module assembled are fixedly joined together in the heat compression process(lamination process).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2003223130A AU2003223130A1 (en) | 2002-09-03 | 2003-04-24 | Combination-type ic card and method of manufacturing the combination-type ic card |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020052758A KR100385660B1 (en) | 2002-02-06 | 2002-09-03 | Combination ic card |
| KR10-2002-0052758 | 2002-09-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2004023386A1 true WO2004023386A1 (en) | 2004-03-18 |
Family
ID=31973632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2003/000832 WO2004023386A1 (en) | 2002-09-03 | 2003-04-24 | Combination-type ic card and method of manufacturing the combination-type ic card |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU2003223130A1 (en) |
| WO (1) | WO2004023386A1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007065404A3 (en) * | 2005-12-05 | 2007-08-02 | Smartrac Technology Ltd | Chip card and method for production of a chip card |
| CN102376012A (en) * | 2011-11-01 | 2012-03-14 | 上海祯显电子科技有限公司 | Novel double-interface intelligent card |
| US8146828B2 (en) * | 2008-01-10 | 2012-04-03 | Trüb AG | Method for producing a card-type data carrier, and data carrier produced according to this method |
| CN102653041A (en) * | 2011-03-04 | 2012-09-05 | 上海一芯智能科技有限公司 | Welding process of non-contact intelligent card antenna |
| WO2013026248A1 (en) * | 2011-08-25 | 2013-02-28 | 上海一芯智能科技有限公司 | Gsm mobile phone communication card, and method and device for packaging same |
| CN103093271A (en) * | 2013-01-08 | 2013-05-08 | 上海浦江智能卡系统有限公司 | Double-interface intelligent card manufacture process and double-interface intelligent card |
| CN103811445A (en) * | 2012-11-09 | 2014-05-21 | 王海泉 | Intelligent card-used wafer prepared by paster technology |
| CN112334912A (en) * | 2018-06-20 | 2021-02-05 | 卡诺爱股份有限公司 | Method for manufacturing metal card |
| CN112352246A (en) * | 2018-06-20 | 2021-02-09 | 卡诺爱股份有限公司 | Method for manufacturing metal card |
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| JPH03112690A (en) * | 1989-09-28 | 1991-05-14 | Toppan Printing Co Ltd | Ic card and manufacture thereof |
| JPH11216974A (en) * | 1998-02-05 | 1999-08-10 | Toppan Printing Co Ltd | Composite type ic card, and its manufacture |
| JP2000132657A (en) * | 1998-10-28 | 2000-05-12 | Dainippon Printing Co Ltd | Ic card and manufacture of the same |
| JP2001109865A (en) * | 1999-10-12 | 2001-04-20 | Fujitsu Ltd | Combination card, module for ic card, and manufacturing method of combination card |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007065404A3 (en) * | 2005-12-05 | 2007-08-02 | Smartrac Technology Ltd | Chip card and method for production of a chip card |
| CN101341499A (en) * | 2005-12-05 | 2009-01-07 | 斯迈达Ip有限公司 | Chip card and method for production of a chip card |
| US8146828B2 (en) * | 2008-01-10 | 2012-04-03 | Trüb AG | Method for producing a card-type data carrier, and data carrier produced according to this method |
| CN102653041A (en) * | 2011-03-04 | 2012-09-05 | 上海一芯智能科技有限公司 | Welding process of non-contact intelligent card antenna |
| WO2013026248A1 (en) * | 2011-08-25 | 2013-02-28 | 上海一芯智能科技有限公司 | Gsm mobile phone communication card, and method and device for packaging same |
| CN102955972A (en) * | 2011-08-25 | 2013-03-06 | 上海一芯智能科技有限公司 | GSM (global system for mobile communications) mobile phone communication card and package method and device therefor |
| CN102955972B (en) * | 2011-08-25 | 2015-11-18 | 上海一芯智能科技有限公司 | A kind of gsm mobile telephone address card and method for packing thereof and equipment |
| CN102376012A (en) * | 2011-11-01 | 2012-03-14 | 上海祯显电子科技有限公司 | Novel double-interface intelligent card |
| CN103811445A (en) * | 2012-11-09 | 2014-05-21 | 王海泉 | Intelligent card-used wafer prepared by paster technology |
| CN103093271A (en) * | 2013-01-08 | 2013-05-08 | 上海浦江智能卡系统有限公司 | Double-interface intelligent card manufacture process and double-interface intelligent card |
| CN112334912A (en) * | 2018-06-20 | 2021-02-05 | 卡诺爱股份有限公司 | Method for manufacturing metal card |
| CN112352246A (en) * | 2018-06-20 | 2021-02-09 | 卡诺爱股份有限公司 | Method for manufacturing metal card |
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| Publication number | Publication date |
|---|---|
| AU2003223130A1 (en) | 2004-03-29 |
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