JP2000311225A - Non-contact ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact IC card which can protect an IC chip without deteriorating the flexibility that is necessary for the IC card. SOLUTION: This non-contact IC card has a constitution where an antenna is formed on a sheet, a resin sheet 3 is prepared on one or both sides of an inlet sheet 2 containing an IC chip 1 which is electrically connected to the antenna, a recess part or a through-hole 5 is formed at the position of the chip 1 of the sheet 3, a metallic reinforcement body 6 is fit into the recess part or the through-hole 5 and a surface sheet 4 is laminated on an outer layer. In such a constitution, the chip 1 is never cracked, the connection is never cut between the chip 1 and the antenna and furthermore swelling due to the thickness of the chip is not caused on the surface of the card 1 when the card is finished even when the card is bent or the concentrated pressure is applied to the card.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC having a built-in IC chip and performing external power supply and communication with the outside in a non-contact state using a coil or an antenna.
About the card.

[0002]

2. Description of the Related Art In recent years, IC cards include, for example, cash cards, credit cards, ID cards, electronic currencies,
It is configured to perform various operations such as bank card transactions, telephone communications, and various types of identity confirmation operations, such as telephone cards or public transportation, especially bus and rail commuter passes, and important information such as personal information and financial information Has been recorded and processed, and its use in various fields has begun. These operations are performed between the IC module of the IC card and the terminal device that reads and writes information by a contact method using direct electrical coupling between external connection terminals and a non-contact method using indirect electrical coupling using electromagnetic waves. It is performed by one of the two contact methods. The method is selected according to the use of the IC card. However, depending on the use of the IC card, it is more convenient to use a single card having both the contact method and the non-contact method. Cards are already on the market under the name of hybrid IC cards or combination cards.

[0003] Current IC cards are manufactured as portable media having standardized dimensions. Normal IS
The O standard 7810 specifies a card having a standard form of 85 mm in length, 54 mm in width, and 0.76 mm in thickness. The configuration of a non-contact type IC card includes a thermoplastic sheet and an integrated circuit chip, respectively. It has a card body constructed by assembling an electronic module, and an induction coil type antenna is connected to the chip.

[0004] In general, a method of producing a non-contact type IC card by a lamination technique is known. In this method, a plurality of thermoplastic sheets are stacked and arranged between two plates of a press, and a non-contact type IC module is arranged therebetween. This IC module is electrically connected in advance to a coil or an antenna surrounding the IC chip, control circuit, and the like. After the disposition, a plurality of thermoplastic sheets are welded by applying heat and pressure to integrate the IC module and the thermoplastic sheet.

[0005] In the laminating method using heat, there is a difference in the coefficient of expansion of the materials used. Therefore, due to the effects of pressure and temperature during laminating, residual deformation occurs between the card surface and the IC module, resulting in impact and torsion. Regions with different tolerances are created, making the IC card look distorted. That is, to prevent this,
It is necessary to increase the thickness of the C card, and unless this is done, the appearance of the obtained IC card is not satisfactory. According to this, the standard thickness of the above standard is 0.7
This indicates that it may be difficult to manufacture a card having a size of 6 mm. Therefore, the production efficiency of such a method is low, and moreover, IC cards regarded as defective products have
Since the C module and the coil or the antenna are built in, there is a problem that the production cost becomes high if disposed as it is.

In addition, a rectangular frame suitable for the size of the card is placed between the thermoplastic sheets, and an IC module connected to a coil or an antenna in advance is placed in a cavity formed by this frame and an intermediate sheet. A non-contact type IC in which a thermosetting resin is injected into the cavity, and then the cavity is covered with the thermoplastic sheet.
There is a method of manufacturing a card. This IC card has an inlet sheet on which an IC chip is mounted on a sheet on which an antenna having a thickness exceeding the above-mentioned standard is formed, and at least one or more resin sheets above and below the inlet sheet. The non-contact type IC card is superposed and laminated.

[0007]

When a non-contact type IC card is bent or a concentrated pressure is applied to a part of the non-contact type IC card, the built-in IC chip is cracked or the connection between the IC chip and the antenna is cut off. The problem of the malfunction of the card was occurring. Accordingly, an object of the present invention is to provide a non-contact type IC card capable of protecting an IC chip without impairing the flexibility required for the IC card.

[0008]

In order to achieve the above object, according to the present invention, there is provided a contactless IC card according to the first aspect of the present invention, wherein an antenna is formed on a sheet and electrically connected to the antenna. A non-contact type IC card in which a resin sheet is laminated on one or both sides of an inlet sheet on which an IC chip is mounted and a topsheet is laminated on the outer layer thereof, and the resin sheet on the inlet sheet is Provide a recess or through hole at the IC chip position,
It is characterized in that a metal reinforcing body is fitted into the recess or through hole.

Further, the non-contact type IC card according to claim 2 is
2. The non-contact type IC card according to claim 1, wherein the metal reinforcement has the same shape as the recess or the through hole.

Further, a non-contact type IC card according to a third aspect is characterized in that, in the non-contact type IC card according to the first aspect, the metal reinforcing member is not in contact with the IC chip.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a non-contact type I showing the appearance of the present invention.
FIG. 2 is a plan view of a C card, FIG. 2 is a schematic sectional view showing an embodiment of the non-contact type IC card of the present invention taken along line AA in FIG. 1, and FIG. 3 is a sectional view taken along line AA in FIG. FIG. 7 is a schematic sectional view showing another embodiment of the non-contact type IC card of the present invention.

The non-contact type IC card of the present invention shown in FIG. 1 has no characteristic in appearance, and its AA
As shown in the cross section of the line, the non-contact type IC card 10 of the present invention shown in FIG. 2 is electrically connected to the IC chip 1 and supplies power between the IC chip and an external device by electromagnetic waves or the like. And an inlet sheet 2 in which a coil or an antenna (not shown) that mediates transmission and reception of signals such as commands and data is formed on a sheet, and a core sheet 3 and a top sheet 4 are respectively laminated. A through hole 5 is provided at a position corresponding to the position of the IC chip 1, and a metal reinforcing member 6 having substantially the same shape as the through hole 5 and having a thickness not exceeding the thickness of the core sheet 1 together with the IC chip 1. Are fitted. When the non-contact type IC card 10 is bent or partially pressed by the metal reinforcing member 6 provided on the IC chip 1, it functions as a protective material.

The metal reinforcement 6 is made of iron, aluminum,
Titanium, copper, chromium, nickel, zinc, tin and alloys thereof, or a composite material thereof, and preferably has rigidity as a characteristic. The shape is IC
It is preferable that the size is larger than the chip size. For example, the shape can be arbitrarily selected such as the same shape as the formed through hole or concave portion, or a circular shape, an elliptical shape, a rectangular shape, or the like. Also, the shape may be larger than the through hole. In the present embodiment, a metal reinforcing member 6 having the same shape as the through hole 5 is formed on the surface sheet 4 side. The IC chip 1 is arbitrarily selected according to the purpose of use of the non-contact type IC card, and is not particularly limited. This IC chip 1
Are bonded to the inlet sheet 2 with an adhesive or the like. The inlet sheet 2 preferably has heat resistance and adhesiveness, and examples thereof include various resins such as PET, PET-G, ABS, and polyimide, which can be arbitrarily selected. If the above conditions are satisfied,
It is not limited to these.

Next, a coil or an antenna (not shown) formed on the inlet sheet 2 together with the IC chip 1
A coil formed of metal or metal foil, or a coil formed of a metal sheet or metal wire formed in a coil shape is formed on the inlet sheet 2.
These can be manufactured by various methods, in particular by chemical etching or stamping, respectively, or by winding the wire into a coil. Further, it can be formed by applying an adhesive to a thermoplastic resin sheet by a screen printing method and performing metal evaporation.

[0015] The coil or antenna can take any geometric shape. The number of turns of the spiral is set according to the function. Further, when formed on a thermoplastic resin sheet, antennas can be provided on both surfaces thereof, and a spiral can be formed on the other surface. By using via holes by dual-face printed circuit technology, or by cutting and pressing the sheet so that the metal layers on both sides are bound, it is possible to conduct the metal layers on both sides, Instead of forming, it is also possible to perform screen printing several times in succession to form a multi-layer spiral. By the way, in the present invention, the coil or the antenna can have any material, structure and configuration according to the purpose of use.

The outer shape of the coil or antenna is
Preferably, it substantially coincides with the outer periphery of the IC card. That is, since the range and the receiving capacity of the coil or the antenna depend on the surface area of the magnetic flux covered by the coil or the antenna,
In that case, it becomes maximum. Therefore, the spiral shape of the coil or the antenna is a rectangle similar to the IC card shape.

In this embodiment, the core sheet 3 and the top sheet 4 are prepared by using a standard IC card corresponding to the ISO standard 7810 of an IC card manufactured by a heat lamination method.
The thickness is selected so as to satisfy the total thickness of 0.78 mm. Examples of the core sheet 3 and the top sheet 4 include PVC (polyvinyl chloride), PC
(Polycarbonate), ABS (acrylonitrile-butadiene-styrene), PET (polyethylene), PE
TG (polyethylene terephthalate glycol), PV
It can be formed of DF (polyvinylidene fluoride) or any other thermoplastic resin film having equivalent properties.

In particular, the core sheet 3 is provided with a through hole 5 or a concave portion into which the metal reinforcing member 6 is fitted, and it is necessary that the core sheet 3 be at least sized to receive the IC chip 1. The method of forming the through hole 5 or the concave portion may be a known method, the through hole may be a punching method, and the concave portion is easily formed by shaving out the core sheet 3 by so-called counterboring using a cutting tool. can do. ,

In this embodiment, the antenna disposed on the inlet sheet 2 is formed by forming a metal foil on a resin sheet and fixing the antenna on the inlet sheet 2 with an adhesive. An inlet sheet 2 having an antenna is arranged on a core sheet 3 and surface sheets 4 are further formed on both outer surfaces thereof, and these are formed by softening of a thermoplastic resin material caused by heating and pressing by lamination.
Non-contact type IC as shown in FIG.
The card 10 is obtained. The non-contact IC card is manufactured by an injection molding method using a mold in addition to the above-described thermal lamination method, an antenna is arranged between resin sheets, and the antenna is filled with resin to manufacture an IC card. A known method such as a resin filling method can be used.

Next, in another embodiment of the present invention shown in FIG. 3, the appearance is the same as that of FIG. 1, but in a sectional view taken along the line A--A, as shown in FIG.
The core sheets 3 and 7 having the through holes 5 on both sides of the core sheet 3 are provided. The metal reinforcing members 6 ′ are disposed in the through holes 5 of the core sheet 3 and the through holes 5 ′ of the core sheet 7, respectively. The contactless IC card 11 is provided in the same manner as described above. In this embodiment, the space 8 exists in the through hole 6 ′ in addition to the metal reinforcing member 6 ′.
The gap 8 may be prevented from being generated by setting the thickness to be equal to the above. Further, the metal reinforcement 6 ′ of the through hole 5 ′ of the core sheet 7 on the side where the IC chip 1 does not exist may be arranged on the inlet sheet 2.

[0021]

According to the present invention, by employing the above structure, even if a non-contact type IC card is bent or concentrated pressure is applied, the IC chip is cracked or the connection between the IC chip and the antenna is lost. A non-contact type IC card free from problems such as breakage and having no swelling due to the thickness of the IC chip on the finished card surface.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a non-contact type IC card showing an appearance of the present invention.

FIG. 2 is a non-contact type IC of the present invention along the line AA in FIG. 1;
It is a schematic sectional drawing which shows the Example of a card.

FIG. 3 is a non-contact type IC of the present invention along the line AA in FIG. 1;
It is a schematic sectional drawing which shows the other Example of a card.

[Explanation of symbols]

 1 IC chip 2 Inlet sheet 3, 7 Core sheet 4 Surface sheet 5, 5 'Through hole 6, 6' Metal reinforcement 8 Air gap 10, 11 Non-contact IC card

Claims (3)

[Claims] A resin sheet on one or both sides of an inlet sheet on which an antenna is formed and an IC chip electrically connected to the antenna is mounted;
In a non-contact type IC card formed by laminating a surface sheet on the outer layer, a concave portion or a through hole is provided at an IC chip position of the resin sheet on the inlet sheet, and a metal reinforcing member is provided in the concave portion or the through hole. A non-contact type IC card characterized by being fitted. 2. The non-contact type IC card according to claim 1, wherein the metal reinforcing member has the same shape as the concave portion or the through hole. 3. The non-contact type IC card according to claim 1, wherein the metal reinforcing member is not in contact with the IC chip.