JP2003044814A - Combination type ic card and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the durability of a connection part between an IC module and an antenna. SOLUTION: In this combination type IC card in which the IC module 10 where information can be written and read in both a contact state and a non- contact state is mounted on a base material 20, and the antenna 30 connected electrically to the IC module 10 and for writing and reading information to/from the IC module in a non-contact state is formed on the base material 20, the IC module 10 is connected to the antenna 30 through a metallic spring 40 that is freely deformable by force applied from the outside.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention combines a contact type IC card capable of writing and reading information in a contact state and a non-contact type IC card capable of writing and reading information in a non-contact state. The present invention relates to a composite IC card, and more particularly to a combination type IC card capable of writing and reading information in a contact state or a non-contact state with respect to one IC module, and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, with the development of an information-oriented society, information is recorded on a card, and information management and payment using the card are performed.

Cards used for such information management and settlement include an IC card having an IC chip built therein, a magnetic card in which information is written by magnetism, and the like. Reading is performed.

Further, in an IC card, a contact type IC card for writing and reading information by bringing it into contact with a dedicated device and a non-contact type IC card for writing and reading information only by bringing it close to the dedicated device. There is a contact type IC card. These IC cards have higher security compared to magnetic cards and have a large amount of writable information, and since one card can be used for multiple purposes, its popularity in the market is increasing. . Further, among them, in the non-contact type IC card, when writing or reading information, there is no need to take out the card and insert it into a dedicated device, and it is convenient to handle, so that writing to the card and the card Devices for reading stored information are rapidly spreading.

Further, in recent years, a composite IC card in which a contact type IC card and a non-contact type IC card as described above are combined has become widespread, and an IC chip for writing and reading information in a contact state is not used. There are a hybrid IC card equipped with an IC chip that writes and reads information in a contact state, and one IC chip that can write and read information in both a contact state and a non-contact state. A combination type IC card installed is used.

FIG. 7 is a diagram showing an example of a conventional combination type IC card, (a) is a diagram showing its structure, and (b) is a sectional view.

As shown in FIG. 7, in this conventional example, a base material 120 composed of a plurality of layers is provided on the outer surface of the base material 120 and is an information document for writing and reading information in a contact state. An IC module 1 having a contact 111 for making electrical contact with a read / write device (not shown)
10 is fixed to the base material 120 with an insulating adhesive 125 in a state of being embedded, and is electrically connected to the IC module 110 via a stud 140 that is not deformable by an external force. A current is supplied to the IC module 110 by electromagnetic induction from an information writing / reading device (not shown) provided outside and for writing and reading information in a non-contact state. An antenna 130 for writing and reading information to and from an IC chip (not shown) built in the protrusion is formed so as to be sandwiched between a plurality of layers forming the base substrate 120. The antenna 130, the stud 140, and the stud 140
And the contact 112 of the IC module 110 are adhered to each other by a conductive adhesive (not shown). In addition, as described above, the antenna 130 does not need the stud 140.
In some cases, the contact 112 of the IC module 110 and the contact 112 are directly bonded by a conductive adhesive.

In the combination type IC card configured as described above, when the contact 111 of the IC module 110 electrically contacts the information writing / reading device for writing and reading information in the contact state. ,
Information is written to the IC chip in the IC module 110 via the contact 111, or information written in the IC chip in the IC module 110 is read out via the contact 111.

Further, when approaching an information writing / reading device for writing and reading information in a non-contact state, a current flows through the antenna 130 due to electromagnetic induction from the information writing / reading device, and this current flows. Are supplied to the IC module 110 via the studs 140 and the contacts 112, whereby information is written to or read from the IC chip in the IC module 110.

[0010]

In the conventional combination type IC card as described above, the IC module and the antenna are adhered to each other via the stud and the hardened adhesive which cannot be deformed by the force applied from the outside. Therefore, when an external force is applied in a direction in which the base material bends, the IC module and the stud or the antenna and the stud may be separated from each other or the stud may be damaged. However, there is a problem that it is electrically insulated.

The present invention has been made in view of the problems of the above-mentioned conventional techniques, and is a combination type IC card capable of improving the durability of the connecting portion between the IC module and the antenna. It is an object to provide a manufacturing method thereof.

[0012]

In order to achieve the above object, the present invention provides a base material composed of at least one layer, an antenna having a coil shape and formed on the base material, and an external part. An IC module which has a contact capable of making electrical contact, is mounted on the base substrate in a state of being electrically connected to the antenna, and is capable of writing and reading information via the contact or the antenna. In a combination type IC card having at least, the IC module and the antenna are connected via a conductive member that is deformable by a force applied from the outside.

Further, the conductive member is a stretchable metal spring.

Further, the conductive member is a deformable conductive rubber.

Further, the conductive member is made of a metal having a shape memory function.

Also, in the method of manufacturing the combination type IC card, the step of embedding the conductive member in the base material so as to be connected to the antenna, and the step I
C module is mounted on the base material so as to be connected to the conductive member.

(Operation) In the present invention configured as described above, a base substrate comprising at least one layer,
The antenna has a coil shape and is formed on the base material, and has a contact capable of making electrical contact with the outside. The antenna is mounted on the base material in a state of being electrically connected to the antenna, and the contact or the antenna. In a combination type IC card having at least an IC module capable of writing and reading information via the IC, the IC module and the antenna are connected via a conductive member that is deformable by a force applied from the outside. There is.

Here, an external force is applied to the combination type IC card in such a direction as to bend the base material,
When the IC module is peeled from the base material, the conductive member connected to the IC module follows the deformation of the base material while maintaining the electrical connection between the IC module and the antenna. Transforms into.

As a result, even when an external force is applied to the combination type IC card in such a direction that the base material is bent, the external force applied to the combination type IC card is absorbed by the conductive member. The electrical connection between the IC module and the antenna will be maintained.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIGS. 1A and 1B are views showing a first embodiment of a combination type IC card of the present invention, wherein FIG. 1A is a view showing the structure thereof, and FIG. It is a figure.

As shown in FIG. 1, in this embodiment, a base material 20 composed of a front surface layer 21, intermediate layers 22 and 23 and a back surface layer 24 is provided on the front surface of the base material 20 and is externally provided. Contact 11 for making electrical contact with an information writing / reading device (not shown) for writing and reading
The IC module 10 having the above is embedded and fixed to the base material 20 with an insulating adhesive 25, and further, the IC module 10 is provided via a metal spring 40 which is a stretchable conductive member. Electrically connected to
A current is supplied to the IC module 10 by electromagnetic induction from an information writing / reading device (not shown) provided outside and for writing and reading information in a non-contact state,
As a result, the I
An antenna 30 for writing and reading information to and from a C chip (not shown) includes an intermediate layer 22 and an intermediate layer 23.
It is formed in the intermediate layer 22 so as to be sandwiched between and. The antenna 30, the metal spring 40, and the metal spring 40
And the contact 12 of the IC module 10 are adhered to each other by a conductive adhesive (not shown).

In the combination type IC card configured as described above, the contact 1 of the IC module 10
When 1 electrically contacts an information writing / reading device for writing and reading information in a contact state, information is written to the IC chip in the IC module 10 via the contact 11 or the IC is written. Information written in the IC chip in the module 10 may be read out via the contact 11.

Further, when approaching an information writing / reading device for writing and reading information in a non-contact state, a current flows through the antenna 30 due to electromagnetic induction from the information writing / reading device, and this current Is supplied to the IC module 10 via the metal spring 40 and the contact 12, whereby information is written to or read from the IC chip in the IC module 10.

The combination type IC described above will be described below.
A method of manufacturing the card will be described.

FIG. 2 is a diagram for explaining a method of manufacturing the combination type IC card shown in FIG.

First, the surface layer 21 which is the surface of the combination type IC card, the intermediate layer 22 in which the antenna 30 having the coil shape as shown in FIG. The intermediate layer 23 having
And the back surface layer 24 which will be the back surface of the combination type IC card are sequentially laminated, thereby producing the base material 20 (FIG. 2A).

Next, a hole 26 for embedding the IC module 10 in the base material 20 formed by laminating the front surface layer 21, the intermediate layers 22, 23 and the back surface layer 24, and the contact 12 provided in the IC module 10. Hole 27 for embedding a metal spring 40 for electrically connecting the antenna 30 and the antenna 30
a and 27b are respectively formed (FIG. 2B). The hole 26 is formed in a shape and depth such that the IC module 10 is embedded in the base substrate 20, and the holes 27 a and 27 b are formed in the IC module 10 when the IC module 10 is embedded in the hole 26. Contact 12 provided on the
Is formed to a depth at which the antenna 30 is exposed at a position where is touched.

Next, the metal spring 40 is embedded in the holes 27a and 27b, and the metal spring 40 and the antenna 30 are bonded by a conductive adhesive (FIG. 2 (c)). As a result, the antenna 30 and the metal spring 40 are electrically connected. In addition, in the metal spring 40, its natural length is longer than the thickness of the intermediate layer 22, so that when it is embedded in the holes 27a and 27b formed in the intermediate layer 22, FIG. As shown in FIG.
It is in a state of protruding from the surface of.

Next, the IC module 10 is embedded in the hole 26, and the IC module 10 is fixed to the base substrate 20 with the adhesive 25 (FIG. 2 (d)). At this time, the metal spring 40 is pushed by the IC module 10 in a state of being in contact with the contact 12 of the IC module 10 and is moved from the natural length to the intermediate layer 22.
Shrink to the thickness of. In this state, the metal spring 40 is bonded to the contact 12 of the IC module 10 with a conductive adhesive. As a result, the antenna 30 and the IC module 10
And are electrically connected via the metal spring 40.

After that, the ends of the base material 20 are each cut to complete the combination type IC card (FIG. 2 (e)).

In this embodiment, the antenna 30 and the metal spring 40, and the metal spring 40 and the IC module 1 are used.
The contact 12 of 0 and the contact 12 of the IC module 10 are bonded to each other by a conductive adhesive, but the antenna 30 and the contact 12 of the IC module 10 form the metal spring 40 in addition to the bonding by the conductive adhesive. The bonding method is not limited to this as long as it is electrically connected via.

The operation when an external force is applied to the combination type IC card as described above in the bending direction of the base material 20 will be described below.

FIG. 3 is a diagram for explaining the action when an external force is applied to the combination type IC card shown in FIG. 1 in a direction in which the base material 20 bends.

As shown in FIG. 3, when an external force is applied to the combination type IC card shown in FIG. 1 in the bending direction of the base material 20, the base material 20 bends,
As a result, the portion of the IC module 10 where the contact 12 is provided tends to peel off from the base material 20.

At this time, the metal spring 40 connecting the contact 12 of the IC module 10 and the antenna 30 extends in accordance with the bending of the base material 20, whereby the antenna 3
The electrical connection between 0 and the contact 12 of the IC module 10 is maintained.

As a result, the peeling of the IC module 10 from the base material 20 is suppressed when an external force is applied in the bending direction of the base material 20.

(Second Embodiment) FIGS. 4A and 4B are views showing a second embodiment of the combination type IC card of the present invention, wherein FIG. 4A is a view showing the structure thereof, and FIG. It is a figure.

As shown in FIG. 4, in this embodiment, a base material 20 composed of a front surface layer 21, intermediate layers 22 and 23, and a back surface layer 24 is provided on the front surface of the base material 20 and is externally provided. Contact 11 for making electrical contact with an information writing / reading device (not shown) for writing and reading
The IC module 10 including the above is fixed to the base material 20 with an insulating adhesive 25 in a state of being embedded, and further, the IC module is provided through a conductive rubber 45 which is a deformable conductive member. An information writing / reading device (not shown) that is electrically connected to 10 and is provided outside and that writes and reads information in a non-contact state.
A current is supplied to the IC module 10 by electromagnetic induction from the antenna, and thereby the antenna 30 for writing and reading information to and from the IC chip (not shown) built in the convex portion of the IC module 10 is provided with the intermediate layer 22. The intermediate layer 22 is formed so as to be sandwiched between the intermediate layer 22 and the intermediate layer 23.
The antenna 30 and the conductive rubber 45, and the conductive rubber 45 and the contact 12 of the IC module 10 are bonded to each other by a conductive adhesive (not shown).

In the combination type IC card configured as described above, the contact 1 of the IC module 10
When 1 electrically contacts an information writing / reading device for writing and reading information in a contact state, information is written to the IC chip in the IC module 10 via the contact 11 or the IC is written. Information written in the IC chip in the module 10 may be read out via the contact 11.

Further, when approaching an information writing / reading device for writing and reading information in a non-contact state, a current flows through the antenna 30 due to electromagnetic induction from the information writing / reading device, and this current Is supplied to the IC module 10 via the conductive rubber 45 and the contact 12, whereby information is written to or read from the IC chip in the IC module 10.

The combination type IC described above will be described below.
A method of manufacturing the card will be described.

FIG. 5 is a diagram for explaining a method of manufacturing the combination type IC card shown in FIG.

First, the surface layer 21 which becomes the surface of the combination type IC card, the intermediate layer 22 in which the antenna 30 having the coil shape as shown in FIG. The intermediate layer 23 having
And a back surface layer 24 which will be the back surface of the combination type IC card are sequentially laminated, thereby producing the base material 20 (FIG. 5A).

Next, a hole 26 for embedding the IC module 10 in the base material 20 formed by laminating the front surface layer 21, the intermediate layers 22, 23 and the back surface layer 24, and the contact 12 provided in the IC module 10. 2 for embedding a conductive rubber 45 for electrically connecting the antenna 30 and the antenna 30
8a and 28b are formed (FIG. 5B). The hole 26 is formed in a shape and depth such that the IC module 10 is embedded in the base substrate 20, and the holes 28 a and 28 b are formed in the IC module 10 when the IC module 10 is embedded in the hole 26. Contact 12 provided on the
Has a diameter equal to that of the conductive rubber 45,
The antenna 30 is formed to a depth at which it is exposed.

Next, the conductive rubber 45 is placed in the holes 28a and 28b.
And the conductive rubber 45 and the antenna 30 are bonded by a conductive adhesive (FIG. 5C). As a result, the antenna 30 and the conductive rubber 45 are electrically connected. The length of the conductive rubber 45 is equal to the thickness of the intermediate layer 22, so that the surface of the conductive rubber 45 in the state of being embedded in the holes 28a and 28b formed in the intermediate layer 22 is As shown in FIG. 5 (c), the surface of the intermediate layer 22 coincides with the surface of the intermediate layer 22.
At this time, the conductive rubber 45 and the side surfaces of the holes 28a and 28b are not adhered.

Next, the IC module 10 is embedded in the hole 26, and the IC module 10 is fixed to the base substrate 20 with the adhesive 25 (FIG. 5 (d)). Further, the conductive rubber 45 is adhered to the contact 12 of the IC module 10 with a conductive adhesive. As a result, the antenna 30 and the IC module 10 are electrically connected via the conductive rubber 45.

After that, the edges of the base material 20 are cut, respectively, and the combination type IC card is completed (FIG. 5 (e)).

In the present embodiment, the antenna 30 and the conductive rubber 45, and the conductive rubber 45 and the contact 12 of the IC module 10 are bonded to each other by a conductive adhesive, but the conductive adhesive is used. In addition to adhesion by soldering, adhesion by antenna 30 and IC module 1
The bonding method is not limited to this as long as it is electrically connected to the contact 12 of 0 through the conductive rubber 45.

The operation when the external force is applied to the combination type IC card as described above in the bending direction of the base material 20 will be described below.

FIG. 6 is a diagram for explaining the action when an external force is applied to the combination type IC card shown in FIG. 4 in a direction in which the base material 20 bends.

As shown in FIG. 6, when an external force is applied to the combination type IC card shown in FIG. 4 in the bending direction of the base material 20, the base material 20 bends,
As a result, the portion of the IC module 10 where the contact 12 is provided tends to peel off from the base material 20.

At this time, the conductive rubber 45 connecting the contact 12 of the IC module 10 and the antenna 30 is deformed so as to extend following the curve of the base material 20, whereby the antenna 30 and the IC module are deformed. An electrical connection with the contacts 12 of the 10 will be maintained. This is because the conductive rubber 45 is not adhered to the side surfaces of the holes 28a, 28b and no external force is applied to the holes 28a, 28b.
It is an action that occurs because it is embedded in b.

As a result, the peeling of the IC module 10 from the base material 20 is suppressed when an external force is applied in the bending direction of the base material 20.

In this embodiment, the conductive rubber 45 is used.
The length of the conductive rubber 45 is equal to the thickness of the intermediate layer 22 in which the holes 28a and 28b are formed, and the diameter of the holes 28a and 28b is equal to the diameter of the conductive rubber 45. The length of the intermediate layer 2 in which the holes 28a and 28b are formed
2 and the holes 28a, 28b
The diameter of the conductive rubber 45 is larger than that of the conductive rubber 45.
When fixing the module 10 to the base material 20, the IC
If the conductive rubber 45 is compressed and embedded in the holes 28a and 28b by the module 10, the conductive rubber 45 easily follows the curve of the base material 20 when the base material 20 is curved. .

In the above-described embodiment, I
As the joining member for electrically connecting the contact 12 of the C module 10 and the antenna 30, the expandable metal spring 40 or the deformable conductive rubber 45 was used, but the present invention is not limited to this, and is covered with a metal. Any material that has conductivity and can be deformed by a force applied from the outside, such as a spring or a metal having a shape memory function, may be used.

[0057]

As described above, in the present invention,
In a state of being electrically connected to the antenna, it has a base substrate composed of at least one layer, an antenna having a coil shape and formed on the base substrate, and a contact capable of electrically contacting with the outside. It is mounted on the base material and allows writing and reading of information via contacts or antenna.
In a combination type IC card having at least a C module, the IC module and the antenna are connected via a conductive member that is deformable by a force applied from the outside. When an external force is applied in such a direction that the base substrate bends, the conductive member is deformed so as to follow the deformation of the base substrate, thereby maintaining the electrical connection between the IC module and the antenna. The durability of the connection portion between the module and the antenna can be improved.

[Brief description of drawings]

FIG. 1 is a first combination type IC card according to the present invention.
2A is a diagram showing an embodiment of the present invention, FIG. 3A is a diagram showing its structure, and FIG.

FIG. 2 is a diagram for explaining a manufacturing method of the combination type IC card shown in FIG.

FIG. 3 is a diagram for explaining an action when an external force is applied to the combination type IC card shown in FIG. 1 in a direction in which a base material is bent.

FIG. 4 is a second combination type IC card of the present invention.
2A is a diagram showing an embodiment of the present invention, FIG. 3A is a diagram showing its structure, and FIG.

FIG. 5 is a diagram for explaining a manufacturing method of the combination type IC card shown in FIG.

6A and 6B are diagrams for explaining the action when an external force is applied to the combination type IC card shown in FIG. 4 in a direction in which the base material is bent.

7A and 7B are diagrams showing an example of a conventional combination type IC card, FIG. 7A is a diagram showing its structure, and FIG. 7B is a sectional view.

[Explanation of symbols]

10 IC module 11, 12 contacts 20 base materials 21 surface layer 22,23 Middle layer 24 Back layer 25 adhesive 26, 27a, 27b, 28a, 28b holes 30 antenna 40 metal spring 45 Conductive rubber

Claims (5)

[Claims] 1. A base material comprising at least one layer, an antenna having a coil shape and formed on the base material, and a contact electrically contactable with the outside. A combination type IC card, which is mounted on the base material in a state of being electrically connected and has at least an IC module capable of writing and reading information via the contact point or the antenna, A combination type IC card, wherein the antenna and the antenna are connected via a conductive member that is deformable by a force applied from the outside. 2. The combination type I according to claim 1.
In the C card, the combination type IC card, wherein the conductive member is a stretchable metal spring. 3. The combination type I according to claim 1.
In the C card, the conductive member is a deformable conductive rubber, which is a combination type IC card. 4. The combination type I according to claim 1.
In the C card, the combination type IC card, wherein the conductive member is a metal having a shape memory function. 5. The combination type I according to claim 1.
A method of manufacturing a C card, comprising the step of embedding the conductive member in the base material so as to be connected to the antenna, and the IC module on the base material so as to be connected to the conductive member. A method of manufacturing a combination type IC card, comprising: