JP2005018402A - Ic module for compound ic card - Google Patents

Ic module for compound ic card Download PDF

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Publication number
JP2005018402A
JP2005018402A JP2003182273A JP2003182273A JP2005018402A JP 2005018402 A JP2005018402 A JP 2005018402A JP 2003182273 A JP2003182273 A JP 2003182273A JP 2003182273 A JP2003182273 A JP 2003182273A JP 2005018402 A JP2005018402 A JP 2005018402A
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module
card
contact
chip
antenna
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JP4090950B2 (en
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Katsumi Ozaki
勝美 尾崎
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

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  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC module for a compound IC card which can increase the reliability of connection between the module and an antenna in the card substrate. <P>SOLUTION: The IC module 1 for the compound IC card is an IC module for an IC card with a built-in IC chip having the both of contact and contactless interfaces. The IC module which has eight ISO7816-defined terminal groups on the surface of a printed circuit board on which the IC chip is mounted, and has the IC chip 3, for both of contacting and contactless applications, which is mounted on the backside of the printed circuit board with a joining terminal of the IC chip being connected to the metal layer of the terminals on the surface thereof. In the IC module, a face, which contacts conductive binding material for two terminal boards 24, 25 for connecting to the antenna which are provided on the backside of the printed circuit board for connecting to the antenna in the card substrate, is composed of a metal layer having a plurality of recessed holes perforated which extend to a depth reaching the insulating layer of the printed circuit board. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
この発明は、複合ＩＣカード用ＩＣモジュールに関する。
詳しくは、接触と非接触の両用の機能を持つＩＣチップが内蔵された複合ＩＣカード用ＩＣモジュールにおいて、カード基体内のアンテナとの接着強度を高めることができるＩＣモジュールに関する。
したがって、本発明の利用分野は、複合ＩＣカード用ＩＣモジュールの製造や複合ＩＣカードの製造や利用の分野に関する。
【０００２】
【従来技術】
接触と非接触の両方のインターフェースを持つ複合ＩＣカード用ＩＣチップが登場している。通常、このＩＣチップを使ったＩＣモジュールはカード基体内の非接触用アンテナとの接続をプリント基板裏面のアンテナ接続用端子板を介して行っている。当該接続用端子板とカード基体内のアンテナとが導電性材料によって接着されてＩＣチップの非接触通信機能部に導通する。
一方、カード表面には６個ないし８個のＩＳＯ７８１６接触方式の端子群が設けられていて接触通信を行う。
これらにより、接触、非接触の両用となるようにされている。
【０００３】
かかるＩＣモジュールとカード基体内のアンテナとの接続方法を記載する先行技術には、特許文献１、特許文献２、等の多数があるが、具体的な内容を図面を参照して説明することとする。
図４は、従来の接触型ＩＣカードの平面図、図５は、従来の接触、非接触両用ＩＣカードの平面図、図６は、ＩＣモジュールの接触端子の端子群を表わす平面図、図７は、従来の複合ＩＣカード用ＩＣモジュールの裏面のボンディング状態を表わす図、図８は、図７の複合ＩＣモジュールをカード基体に装着した接触、非接触両用ＩＣカードの断面図、である。
【０００４】
従来の接触型ＩＣカード１１は、図４のように均一な薄板状のカード基体１１ｂに接触型ＩＣモジュール１４を埋設した周知の形態のものである。
ＩＳＯの規格に基づき、基板１１ｂのサイズは、５３．９８×８５．６０ｍｍ、厚みは、０．６８〜０．８４ｍｍの範囲、通常０．７６ｍｍにされている。
接触、非接触両用の複合ＩＣカード１２も同一形状の基板であって、図５のように、カード基体１２ｂ内にアンテナコイル２１を有している。
アンテナコイル２１は破線で示しているが、実際にはカード基体内に埋設されていて見えないので外観上は、接触型ＩＣカード１１と異なるものではない。
アンテナコイル２１の両端は、接触、非接触両用の複合ＩＣカード用ＩＣモジュール１５のアンテナ接続用端子板に接続するようにされている。
【０００５】
従来の接触型ＩＣモジュール１４の端子群は、図６のように、ＩＳＯ７８１６の規格によりＣ１〜Ｃ８の８つの端子が規定されている。
なお、Ｃ１はＶＣＣ（供給電圧）、Ｃ２はＲＳＴ（リセット信号）、Ｃ３はＣＬＫ（クロック信号）、Ｃ５はＧＮＤ（接地）端子で通常、ＩＣモジュール１４の端子板中心部分と電気的につながって形成されている。Ｃ６はＶＰＰ（可変供給電圧；プログラム供給電圧など）、Ｃ７はＩ／Ｏ（データ入出力）である。
Ｃ４とＣ８は、ＲＦＵ（予備端子）であって現在は使用していない。
【０００６】
従来の複合ＩＣカード用ＩＣモジュール１５の裏面のボンディング状態は、図７のようになっている。
Ｃ１，Ｃ２，Ｃ３，Ｃ５，Ｃ７端子板背面の絶縁基板には、ワイヤボンディング基板側パッド２６が形成されていて、当該パッドを介して、それぞれＩＣチップ３側の接続端子（パッド）にボンディングワイヤ２７で接続されている。
Ｃ４，Ｃ８端子板は予備端子なので基板側パッドは設けられていない。Ｃ６のＶＰＰも使用しない場合が多い。
Ｃ２，Ｃ３端子とＣ６，Ｃ７端子の背面を利用してアンテナ接続用端子板２４，２５が設けられ、Ｃ４，Ｃ８端子の背面を通る回路を介して、ＩＣチップ３の非接触インターフェース部Ａ１，Ａ２にボンディングされている。
ＩＣモジュールのＩＣチップ３やボンディングワイヤ２７部分は樹脂モールドされて実装されている。
【０００７】
図８は、図７のＩＣモジュール１５をカード基体１２ｂに装着した接触、非接触両用ＩＣカードの断面図である。アンテナ接続用端子板２４，２５を横切りボンディングワイヤ２７に沿う断面が示されている。
ＩＣモジュール１５は、プリント基板のカード表面側に接触端子群を有しカード内面側にＩＣチップ３とワイヤボンディング部を有している。
ＩＣモジュールの装着は、まず予めアンテナコイル２１が形成され埋設されているカード基体１２ｂの当該カード基体表面からアンテナコイル両端の接続用端子面が現われるようにＩＣモジュール装着用凹部５を掘削する。
次に、凹部５内にＩＣモジュール１５を装填して、接続用端子面とＩＣモジュール側のアンテナ接続用端子板２４，２５間を導電性接着剤６で導通させる。
同時に、当該導電性接着剤、あるいは通常の接着剤も併用してＩＣモジュール１５を装着用凹部５内に固定する。
複合ＩＣカード用ＩＣモジュール１５の樹脂モールド部７は、一段と深く切削された装着用凹部５の中央部分に嵌合するようにされている。
【０００８】
【特許文献１】特開平９−１２３６５４号公報
【特許文献２】特開平１１−３２８３５５号公報
【０００９】
【発明が解決しようとする課題】
従来の複合ＩＣカード用のＩＣモジュール１５は、上述のようにしてアンテナ接続用端子板が、ＩＣチップの非接触インターフェース部に接続しているが、アンテナ接続用端子板が平面な金属板であるため、曲げなどの外部応力が加わることによって、導電性材料との間で剥離が生じることがあった。
そこで本発明は、この欠点を改善した複合ＩＣカード用ＩＣモジュールの構造を研究して本発明の完成に至ったものである。
【００１０】
【課題を解決するための手段】
上記課題を解決するための本発明の要旨は、接触、非接触の両方のインターフェースを持つＩＣチップが内蔵されたＩＣカード用ＩＣモジュールであって、該ＩＣチップを搭載するプリント基板の表面はＩＳＯ７８１６が規定する８つの端子群を有し、該プリント基板の裏面には接触、非接触両用のＩＣチップが搭載され、ＩＣチップの接続端子と表面の端子の金属層とが接続されているＩＣモジュールにおいて、カード基体内のアンテナと接続するためのプリント基板裏面に設けられた２つのアンテナ接続用端子板の導電性接着材料と接する面は、プリント基板の絶縁層に達する深さの複数の凹孔が穿孔さた金属層からなることを特徴とする複合ＩＣカード用ＩＣモジュール、にある。
【００１１】
上記複合ＩＣカード用ＩＣモジュールにおいて、アンテナ接続用端子板の金属層の厚みを、３５μｍから７０μｍの範囲である、ようにすることができ、複数の凹孔が規則的に配列した格子凹孔として、アンテナ接続用端子板の平面外観が格子形状である、ようにすることもできる。
【００１２】
【発明の実施の形態】
本発明は、複合ＩＣカード用ＩＣモジュール（以下、「複合ＩＣモジュール」とも表現する。）において、アンテナ接続用端子板の導電性材料との接触面を格子状等の接触面積の大きい形状にし、かつ可能な限り端子板厚みを厚くすることにより、接続の信頼性向上を図ろうとするものである。
以下、本発明の複合ＩＣモジュールについて図面を参照して説明する。図１は、本発明の複合ＩＣモジュールの実施形態を示す背面図、図２は、アンテナ接続用端子板を示す図、図３は、従来のアンテナ接続用端子板を示す図、である。
【００１３】
図１は、本発明の複合ＩＣモジュール１の実施形態を示し、裏面のボンディング状態が表れている。図１（Ａ）は背面平面図、図１（Ｂ）は、図１（Ａ）のＢ−Ｂ線断面図、図１（Ｃ）は、図１（Ａ）のＣ−Ｃ線断面図である。図示方法が多少異なるが、図１自体は、図７の従来例と実質的に同一のものである。
Ｃ１，Ｃ２，Ｃ３，Ｃ５，Ｃ７端子板背面の絶縁基板には、ワイヤボンディング基板側パッド２６１，２６２，２６３，２６５，２６７が形成されていて、当該パッドを介して、それぞれＩＣチップ３側の接続端子（パッド）にワイヤ接続されている。Ｃ４，Ｃ８端子板は予備端子なので基板側パッドは設けられていない。Ｃ６のＶＰＰも使用しない場合が多く同様にされている。
各ワイヤボンディング基板側パッドは、プリント基板８の絶縁層材料に予め貫通孔を空けておいてから銅箔８Ａ，８ｃとラミネートして形成するものであるが、絶縁層と表裏の銅箔間をスルーホールで導通させるものであってもよい。
【００１４】
アンテナ接続用端子板２４，２５は、ボンディングワイヤ２７によって回路２４１，２５１に接続し、さらにＩＣチップ３の非接触インターフェース部Ａ１，Ａ２にワイヤ接続されている。アンテナ接続用端子板２４，２５と回路２４１，２５１は、図７のように連続した回路板であっても良い。
なお、ＩＣチップ３とボンディングワイヤ２７接続部は点線で囲った樹脂モールド部７となっている。
【００１５】
図１（Ｂ）（Ｃ）のように、ワイヤボンディング基板側パッド２６３，２６５，２６７は、複合ＩＣモジュールの表面側銅箔からＩＣチップ３にワイヤ接続されており、回路２５１は裏面側銅箔からＩＣチップ３の非接触通信機能部Ａ２に通じるようにされている。
【００１６】
図２は、アンテナ接続用端子板２４の拡大図であって、図２（Ａ）は平面図、図２（Ｂ）は図２（Ａ）のＡ−Ａ線断面図である。なお、端子板２５も同様であるので図示していない。図３は、同様に従来例のアンテナ接続用端子板２４の平面図（Ａ）と断面図（Ｂ）である。
アンテナ接続用端子板自体の大きさは、本発明のものも従来例のものも同様であって、Ｌ＝２〜３ｍｍ、Ｗ＝３〜４ｍｍ程度である。
従来例のアンテナ接続用端子板が、単に平面な金属板であるのに対し、本発明のアンテナ接続用端子板２４，２５は、例えば、矩形状の凹孔９が規則的に空けられていて、全体として格子状にされている特徴がある。
図２（Ａ）の場合、２列の平行格子列にされているが、列状でなくてもよく、３列でも４列であっても良い。
【００１７】
アンテナ接続用端子板２４のプリント基板８は、ガラスエポキシ基材等の絶縁材料８ｂの両面に銅箔８ａ，８ｃを接着剤等でラミネートした基板から構成されている。銅箔８ａ，８ｃは表面側をニッケル下地めっきしてから硬質金めっきする処理が通常されている。銅箔８ａは、前記ＩＳＯで規定する８個の端子板側であり、銅箔８ｃは、アンテナ接続用端子板２４，２５側のものである。
従来例のアンテナ接続用端子板２４，２５は、図３（Ｂ）のように、銅箔８ａと銅箔８ｃが、ほぼ同一の厚みにされていたが、本発明では端子板側の銅箔８ｃを銅箔８ａよりも厚くすることが好ましい。これは、端子板を格子状等することと同様に、導電性接着剤で接着する場合に凹孔側面部による接着面積を広くして接合強度を高くする目的のためである。
【００１８】
従来の銅箔８ａ，８ｃの厚みは、１８μｍから３５μｍ程度であるが、本発明では銅箔８ｃの厚みＤを３５μｍから７０μｍ程度にするのが好ましい。銅箔８ａは従来どおりの厚みであってよい。
凹孔９の幅、長さ、ピッチ等は自由に設定できる。矩形状に限らず円形や不定形状であってもよい。接着面積を広くする目的から凹孔９の数は２〜３個ないしは数個以上の数であることが好ましい。
凹孔９を例えば、矩形状の格子凹孔として規則的に開口する場合は、図２のように、その平面外観は格子形状を呈するようになる。ただし、平面外観は格子形状に限らず、波形状であっても、規則的な水玉状または散点状に凹孔が形成されたものであっても良い。
【００１９】
このような凹孔を設けた端子板は、単に導電性接着剤との接着面積を拡大するだけの効果ではなく、凹孔９内の底面では、例えば絶縁材料であるガラスエポキシ樹脂が露出するので、ガラスエポキシ樹脂と導電性ペーストが接着する組み合わせになり、銅箔との接着よりも接着性の高い材料間の接合が得られ、剥離強度を高度に高くすることができる。
【００２０】
このように本発明の複合ＩＣカード用ＩＣモジュール１は、独自構造のアンテナ接続用端子板２４，２５を有するので、ＩＣカード基体内のアンテナコイルと高い強度で接続させることができる。
【００２１】
このような複合ＩＣモジュールの製造は、まずＩＣモジュール用プリント基板８の準備から行う。これには、絶縁性基材の基板側パッド２６の各位置に、予め貫通孔（穴部）を形成したものを用いて製造する。絶縁性基材としては、例えば、厚さ７５〜１００μｍ程度のガラスエポキシフィルム、ポリエステルフィルム、ポリイミドフィルム、ビスマレイド−トリアジン樹脂フィルムなどのフィルムと熱硬化性接着シートを接着したものを用いる。
【００２２】
所定の位置に貫通孔（穴部）を形成した後、絶縁性基材の両面に銅箔をヒートプレスにより接着して一体化する。これを、通常のフォトエッチング法により表面側端子群（Ｃ１〜Ｃ８）や背面側のアンテナ接続用端子板２４，２５を形成することによりパターニングを行う。
【００２３】
アンテナ接続用端子板２４，２５のパターニングは、裏面の銅箔８ｃに対して所定の端子板形状を残すフォトエッチングと同時の工程で、あるいは別個の工程で、アンテナ接続用端子板２４，２５の表面を必要な格子形状または波形形状等にするフォトエッチング工程を行う。これには所定形状を備えたフォトマスクパターンを使用する。
レジスト剥離後、残存する銅箔層を電極として、表面側端子群と背面のアンテナ接続用端子板２４，２５に対してニッケルメッキ及び金めっき処理を行う。
【００２４】
複合ＩＣカード用ＩＣチップ３をエポキシダイ接着剤によりプリント基板８にダイボンディングし、ＩＣチップ３の各接続端子（パッド）と基板側の各パッド（穴部）２６間および回路２４１，２５１間のワイヤボンディングを行う。
最後に、ＩＣチップ３、ボンディングワイヤ２７部分をトランスファーモールディング法、キャスティング法等により樹脂モールドし、更に必要に応じて裏面側を研磨して厚みを整えて、複合ＩＣモジュール１が完成する。
【００２５】
【実施例】
図１、図２、図３等を参照して本発明の実施例、比較例を説明する。
（実施例）
複合ＩＣモジュール１用のプリント基板８として、厚み１００μｍのガラスエポキシ材料８ｂに厚み３５μｍの表面側銅箔８ａと、厚み７０μｍの背面側銅箔８ｃを積層したものを使用した。なお、ガラスエポキシ材料８ｂには、ワイヤボンディング基板側パッド２６を予め必要個数穿孔したものを使用した。
このプリント基板８に対して、表面側端子板と、背面側アンテナ接続用端子板２４，２５、回路２４１，２５１をフォトエッチング工程で形成した。
アンテナ接続用端子板２４，２５のサイズは、Ｌ＝３．０ｍｍ×Ｗ＝２．０ｍｍになるようにし、各アンテナ接続用端子板２４，２５には、図２（Ａ）のように幅２００μｍ、長さ６００μｍの凹孔９が２００μｍ間隔で各６個並ぶようにし、このものが２列に並列するようにした。凹孔９の深さは、ガラスエポキシ材料８ｂに達する深さとした。
その結果、端子板は図２（Ａ）のように格子状の平面外観となった。
【００２６】
エッチング後、表裏の銅箔に対して、ニッケルめっき２μｍ、金めっき０．２μｍを施した。
その後、図１のように、表面側接触端子（ワイヤボンディング基板側パッド２６）につなげるボンディングワイヤ５本と非接触通信機能部Ａ１，Ａ２に接続するボンディングワイヤ２本の合計７本を打ち込みし、最後に、ＩＣチップ３とワイヤ部を樹脂封止して複合ＩＣモジュール１を完成した。
【００２７】
（比較例）
プリント基板８として、厚み１００μｍのガラスエポキシ材料８ｂに厚み３５μｍの表面側銅箔８ａは実施例と同一にしたが、背面側銅箔８ｃには厚み３５μｍのものを使用した。
このプリント基板８に対して、実施例と同一の条件で、表面側端子板と、背面側アンテナ接続用端子板２４，２５、回路２４１，２５１をフォトエッチング工程で形成し、アンテナ接続用端子板２４，２５のサイズは、Ｌ＝３．０ｍｍ×Ｗ＝２．０ｍｍになるようにして形成した。ただし、アンテナ接続用端子板２４，２５に凹孔９を設けず、平面な状態のままの銅箔とした（図３）。
その後、実施例と同様に、ワイヤ接続し樹脂封止して比較例の複合ＩＣモジュールを完成した。
【００２８】
導電性接着剤６として、導電性ペースト（パナソニックファクトリーソリューションズ製「ＬＡＣ３００Ｄ」）を使用して、実施例と比較例の複合ＩＣモジュールの各１０枚を、アンテナコイル埋め込み済みのＩＣカード基板にＩＣモジュール埋設用凹部５を掘削してから装着した（図８参照）。
【００２９】
複合ＩＣモジュール装着後、ＩＣカードの耐久性の比較試験を行った。
試験は、ＩＳＯ７８１６−１に基づく「曲げ試験（合計１０００回の動的曲げ試験）」を行った。
その結果、比較例では、１０枚中２枚の導電ペーストの剥離が生じたが、実施例では、全数剥離を生じることは無かった。
【００３０】
【発明の効果】
上述のように、本発明の複合ＩＣモジュールは、アンテナ接続用端子板表面には、プリント基板の絶縁層に達する深さの複数の凹孔が穿孔されているので、導電性接着剤との接合を強固にすることができ、ＩＣカードの通信信頼性を高いものとすることができる。
【図面の簡単な説明】
【図１】本発明の複合ＩＣモジュールの実施形態を示す背面図である。
【図２】アンテナ接続用端子板を示す平面図である。
【図３】従来のアンテナ接続用端子板を示す図である。
【図４】従来の接触型ＩＣカードの平面図である。
【図５】従来の接触、非接触両用ＩＣカードの平面図である。
【図６】ＩＣモジュールの接触端子の端子群を表わす平面図である。
【図７】従来の複合ＩＣモジュールの裏面のボンディング状態を表わす図である。
【図８】複合ＩＣモジュールをカード基体に装着した接触、非接触両用ＩＣカードの断面図である。
【符号の説明】
１ 複合ＩＣカード用ＩＣモジュール、複合ＩＣモジュール
３ ＩＣチップ
５ 凹部
６ 導電性接着剤
７ 樹脂モールド部
８ プリント基板
９ 凹孔
１１ 接触型ＩＣカード
１２ 接触、非接触両用ＩＣカード
１４ 接触型ＩＣモジュール
１５ 複合ＩＣカード用ＩＣモジュール（従来品）
２１ アンテナコイル
２４，２５ アンテナ接続用端子板
２６ ワイヤボンディング基板側パッド
２７ ボンディングワイヤ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC module for a composite IC card.
More specifically, the present invention relates to an IC module for a composite IC card in which an IC chip having both a contact function and a non-contact function is incorporated, and which can increase the adhesive strength with an antenna in a card substrate.
Therefore, the field of use of the present invention relates to the field of manufacture of IC modules for composite IC cards and the manufacture and use of composite IC cards.
[0002]
[Prior art]
IC chips for composite IC cards that have both contact and non-contact interfaces have appeared. Usually, an IC module using this IC chip is connected to a non-contact antenna in the card base via an antenna connection terminal plate on the back surface of the printed board. The terminal board for connection and the antenna in the card base are bonded by a conductive material and are conducted to the non-contact communication function part of the IC chip.
On the other hand, six to eight ISO7816 contact type terminal groups are provided on the card surface to perform contact communication.
As a result, both contact and non-contact are used.
[0003]
There are many prior arts that describe a method for connecting such an IC module and an antenna in a card base, such as Patent Document 1, Patent Document 2, etc., and the specific contents will be described with reference to the drawings. To do.
4 is a plan view of a conventional contact IC card, FIG. 5 is a plan view of a conventional contact / non-contact IC card, FIG. 6 is a plan view showing a terminal group of contact terminals of an IC module, and FIG. FIG. 8 is a view showing a bonding state of the back surface of a conventional IC module for a composite IC card, and FIG. 8 is a sectional view of a contact / non-contact IC card in which the composite IC module of FIG. 7 is mounted on a card substrate.
[0004]
The conventional contact type IC card 11 has a known form in which a contact type IC module 14 is embedded in a uniform thin plate-like card base 11b as shown in FIG.
Based on the ISO standard, the size of the substrate 11b is 53.98 × 85.60 mm, and the thickness is in the range of 0.68 to 0.84 mm, usually 0.76 mm.
The contact and non-contact composite IC card 12 is also a substrate having the same shape, and has an antenna coil 21 in the card base 12b as shown in FIG.
Although the antenna coil 21 is indicated by a broken line, the antenna coil 21 is actually embedded in the card base and cannot be seen, so that the appearance is not different from the contact type IC card 11.
Both ends of the antenna coil 21 are connected to an antenna connection terminal plate of the IC module 15 for a composite IC card for both contact and non-contact.
[0005]
As shown in FIG. 6, the terminal group of the conventional contact IC module 14 has eight terminals C1 to C8 defined by the ISO7816 standard.
C1 is VCC (supply voltage), C2 is RST (reset signal), C3 is CLK (clock signal), and C5 is a GND (ground) terminal, which is usually electrically connected to the central portion of the terminal plate of the IC module 14. Is formed. C6 is VPP (variable supply voltage; program supply voltage, etc.), and C7 is I / O (data input / output).
C4 and C8 are RFUs (reserved terminals) and are not currently used.
[0006]
The bonding state of the back surface of the conventional IC module 15 for a composite IC card is as shown in FIG.
A wire bonding substrate side pad 26 is formed on the insulating substrate on the back surface of the C1, C2, C3, C5, C7 terminal plate, and bonding wires are respectively connected to connection terminals (pads) on the IC chip 3 side through the pads. 27.
Since the C4 and C8 terminal boards are spare terminals, no board-side pads are provided. C6 VPP is often not used.
The antenna connection terminal plates 24 and 25 are provided using the back surfaces of the C2, C3 terminals and the C6 and C7 terminals, and the non-contact interface part A1, IC1 of the IC chip 3 is connected via a circuit passing through the back surfaces of the C4 and C8 terminals. Bonded to A2.
The IC chip 3 and the bonding wire 27 portion of the IC module are resin-molded and mounted.
[0007]
FIG. 8 is a cross-sectional view of a contact / non-contact IC card in which the IC module 15 of FIG. 7 is mounted on the card base 12b. A cross section along the bonding wire 27 is shown across the antenna connection terminal plates 24 and 25.
The IC module 15 has a contact terminal group on the card surface side of the printed circuit board, and has an IC chip 3 and a wire bonding part on the card inner surface side.
For mounting the IC module, first, the IC module mounting recess 5 is excavated so that the connection terminal surfaces at both ends of the antenna coil appear from the surface of the card base 12b in which the antenna coil 21 is previously formed and embedded.
Next, the IC module 15 is loaded in the recess 5, and the conductive terminal 6 and the antenna connection terminal plates 24 and 25 on the IC module side are electrically connected by the conductive adhesive 6.
At the same time, the IC module 15 is fixed in the mounting recess 5 by using the conductive adhesive or a normal adhesive in combination.
The resin mold portion 7 of the IC module 15 for the composite IC card is fitted into the central portion of the mounting recess 5 that is cut deeper.
[0008]
[Patent Document 1] JP-A-9-123654 [Patent Document 2] JP-A-11-328355
[Problems to be solved by the invention]
In the conventional IC module 15 for a composite IC card, the antenna connection terminal plate is connected to the non-contact interface portion of the IC chip as described above, but the antenna connection terminal plate is a flat metal plate. Therefore, peeling may occur between the conductive material and the external stress such as bending.
Therefore, the present invention has been completed by studying the structure of an IC module for a composite IC card which has improved this drawback.
[0010]
[Means for Solving the Problems]
The gist of the present invention for solving the above problems is an IC card IC module in which an IC chip having both contact and non-contact interfaces is built, and the surface of the printed circuit board on which the IC chip is mounted is ISO7816. IC module in which an IC chip for both contact and non-contact is mounted on the back surface of the printed circuit board, and a connection terminal of the IC chip and a metal layer of the terminal on the surface are connected The surfaces of the two antenna connection terminal boards provided on the back surface of the printed circuit board for connection with the antenna in the card base are in contact with the conductive adhesive material, and the plurality of concave holes having a depth reaching the insulating layer of the printed circuit board. Is an IC module for a composite IC card, characterized by comprising a perforated metal layer.
[0011]
In the IC module for a composite IC card, the thickness of the metal layer of the antenna connection terminal plate can be in the range of 35 μm to 70 μm, and the lattice concave holes in which a plurality of concave holes are regularly arranged The planar appearance of the antenna connection terminal plate may be a lattice shape.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
In the IC module for a composite IC card (hereinafter, also referred to as “composite IC module”), the contact surface of the terminal board for antenna connection with the conductive material has a shape with a large contact area such as a lattice shape. In addition, by increasing the thickness of the terminal board as much as possible, it is intended to improve the connection reliability.
The composite IC module of the present invention will be described below with reference to the drawings. FIG. 1 is a rear view showing an embodiment of a composite IC module of the present invention, FIG. 2 is a view showing an antenna connection terminal plate, and FIG. 3 is a view showing a conventional antenna connection terminal plate.
[0013]
FIG. 1 shows an embodiment of a composite IC module 1 of the present invention, and shows a bonding state on the back surface. 1A is a rear plan view, FIG. 1B is a cross-sectional view taken along line BB in FIG. 1A, and FIG. 1C is a cross-sectional view taken along line CC in FIG. is there. Although the method of illustration is somewhat different, FIG. 1 itself is substantially the same as the conventional example of FIG.
Wire bonding substrate side pads 261, 262, 263, 265, and 267 are formed on the insulating substrate on the back side of the C1, C2, C3, C5, and C7 terminal boards, and the IC chip 3 side is provided through the pads. Wire connection is made to the connection terminal (pad). Since the C4 and C8 terminal boards are spare terminals, no board-side pads are provided. In many cases, C6 VPP is not used.
Each wire bonding substrate side pad is formed by previously forming a through hole in the insulating layer material of the printed circuit board 8 and then laminating it with the copper foils 8A and 8c. It may be one that conducts through a through hole.
[0014]
The antenna connection terminal plates 24 and 25 are connected to the circuits 241 and 251 by bonding wires 27 and further connected to the non-contact interface portions A 1 and A 2 of the IC chip 3. The antenna connection terminal plates 24 and 25 and the circuits 241 and 251 may be continuous circuit plates as shown in FIG.
The connecting portion of the IC chip 3 and the bonding wire 27 is a resin mold portion 7 surrounded by a dotted line.
[0015]
As shown in FIGS. 1B and 1C, the wire bonding substrate side pads 263, 265, and 267 are wire-connected to the IC chip 3 from the front surface side copper foil of the composite IC module, and the circuit 251 is connected to the back surface side copper foil. To the non-contact communication function unit A2 of the IC chip 3.
[0016]
2A and 2B are enlarged views of the antenna connection terminal plate 24. FIG. 2A is a plan view, and FIG. 2B is a cross-sectional view taken along the line AA in FIG. The terminal board 25 is not shown because it is the same. FIG. 3 is a plan view (A) and a cross-sectional view (B) of the antenna connection terminal plate 24 of the conventional example.
The size of the antenna connection terminal plate itself is the same for both the present invention and the conventional example, with L = 2 to 3 mm and W = 3 to 4 mm.
Whereas the antenna connection terminal plate of the conventional example is simply a flat metal plate, the antenna connection terminal plates 24 and 25 of the present invention have, for example, rectangular recess holes 9 regularly formed. As a whole, there is a feature of being in a lattice shape.
In the case of FIG. 2 (A), two parallel grid rows are used, but they may not be in a column shape, and may be three rows or four rows.
[0017]
The printed circuit board 8 of the antenna connection terminal board 24 is composed of a substrate obtained by laminating copper foils 8a and 8c with adhesive or the like on both surfaces of an insulating material 8b such as a glass epoxy base material. The copper foils 8a and 8c are usually treated with a hard gold plating after the surface side is plated with nickel. The copper foil 8a is on the side of the eight terminal boards defined by the ISO, and the copper foil 8c is on the antenna connection terminal boards 24 and 25 side.
As shown in FIG. 3B, the conventional antenna connection terminal plates 24 and 25 have the copper foil 8a and the copper foil 8c having substantially the same thickness. However, in the present invention, the copper foil on the terminal plate side is used. It is preferable to make 8c thicker than the copper foil 8a. This is for the purpose of increasing the bonding strength by widening the bonding area by the side surfaces of the concave holes when bonding with a conductive adhesive, as in the case where the terminal board is formed in a lattice shape or the like.
[0018]
The thickness of the conventional copper foils 8a and 8c is about 18 μm to 35 μm, but in the present invention, the thickness D of the copper foil 8c is preferably about 35 μm to 70 μm. The copper foil 8a may have a conventional thickness.
The width, length, pitch and the like of the concave holes 9 can be freely set. The shape is not limited to a rectangular shape, and may be a circular shape or an indefinite shape. For the purpose of widening the bonding area, the number of the concave holes 9 is preferably 2 to 3 or several or more.
When the concave holes 9 are regularly opened as rectangular lattice concave holes, for example, as shown in FIG. 2, the planar appearance has a lattice shape. However, the planar appearance is not limited to the lattice shape, and may be a wave shape or may have a regular polka dot shape or a dotted shape with concave holes.
[0019]
The terminal board provided with such a concave hole is not merely an effect of expanding the adhesion area with the conductive adhesive, but, for example, glass epoxy resin as an insulating material is exposed at the bottom surface in the concave hole 9. It becomes a combination in which the glass epoxy resin and the conductive paste are bonded to each other, so that the bonding between the materials having higher adhesiveness than the bonding with the copper foil is obtained, and the peel strength can be highly increased.
[0020]
Thus, the IC module 1 for a composite IC card of the present invention has the antenna connection terminal plates 24 and 25 having a unique structure, so that it can be connected to the antenna coil in the IC card base with high strength.
[0021]
Such a composite IC module is manufactured by first preparing the IC module printed circuit board 8. This is manufactured by using a substrate in which through holes (holes) are formed in advance at each position of the substrate-side pad 26 of the insulating base material. As the insulating substrate, for example, a glass epoxy film, a polyester film, a polyimide film, a bismaleide-triazine resin film or the like having a thickness of about 75 to 100 μm and a thermosetting adhesive sheet are used.
[0022]
After a through hole (hole) is formed at a predetermined position, a copper foil is bonded and integrated on both surfaces of the insulating base material by heat press. This is patterned by forming the front-side terminal groups (C1 to C8) and the rear-side antenna connection terminal plates 24 and 25 by a normal photoetching method.
[0023]
The patterning of the antenna connection terminal plates 24 and 25 is performed at the same time as the photoetching that leaves a predetermined terminal plate shape with respect to the copper foil 8c on the back surface, or in a separate process. A photo-etching process is performed to make the surface a necessary lattice shape or corrugated shape. For this, a photomask pattern having a predetermined shape is used.
After the resist is peeled off, nickel plating and gold plating are performed on the front-side terminal group and the antenna connection terminal plates 24 and 25 on the back side using the remaining copper foil layer as an electrode.
[0024]
The IC chip 3 for the composite IC card is die-bonded to the printed circuit board 8 with an epoxy die adhesive, and between each connection terminal (pad) of the IC chip 3 and each pad (hole) 26 on the board side and between the circuits 241 and 251. Wire bonding is performed.
Finally, the IC chip 3 and the bonding wire 27 are resin-molded by a transfer molding method, a casting method, or the like, and the back surface side is polished and the thickness is adjusted as necessary to complete the composite IC module 1.
[0025]
【Example】
Examples of the present invention and comparative examples will be described with reference to FIG. 1, FIG. 2, FIG.
(Example)
As the printed circuit board 8 for the composite IC module 1, a glass epoxy material 8b having a thickness of 100 μm and a surface-side copper foil 8a having a thickness of 35 μm and a back-side copper foil 8c having a thickness of 70 μm stacked thereon were used. As the glass epoxy material 8b, a wire bonding substrate side pad 26 having a necessary number of holes perforated in advance was used.
On the printed circuit board 8, the front side terminal plate, the rear side antenna connection terminal plates 24 and 25, and the circuits 241 and 251 were formed by a photoetching process.
The size of the antenna connection terminal plates 24 and 25 is L = 3.0 mm × W = 2.0 mm, and each antenna connection terminal plate 24 and 25 has a width of 200 μm as shown in FIG. Six recesses 9 each having a length of 600 μm are arranged at intervals of 200 μm, and these are arranged in two rows. The depth of the concave hole 9 was set to a depth reaching the glass epoxy material 8b.
As a result, the terminal board had a lattice-like planar appearance as shown in FIG.
[0026]
After etching, nickel plating of 2 μm and gold plating of 0.2 μm were applied to the front and back copper foils.
Thereafter, as shown in FIG. 1, a total of seven bonding wires, five bonding wires connected to the surface side contact terminals (wire bonding substrate side pads 26) and two bonding wires connected to the non-contact communication function units A1, A2, are driven. Finally, the IC chip 3 and the wire part were sealed with resin to complete the composite IC module 1.
[0027]
(Comparative example)
As the printed circuit board 8, a glass epoxy material 8b having a thickness of 100 μm and a surface-side copper foil 8a having a thickness of 35 μm were the same as those in the example, but a copper foil having a thickness of 35 μm was used as the back-side copper foil 8c.
On this printed circuit board 8, the front-side terminal board, the rear-side antenna connection terminal boards 24 and 25, and the circuits 241 and 251 are formed in a photoetching process under the same conditions as in the embodiment, and the antenna connection terminal board The sizes 24 and 25 were formed so that L = 3.0 mm × W = 2.0 mm. However, the concave holes 9 were not provided in the antenna connection terminal plates 24 and 25, and the flat copper foil was used (FIG. 3).
Thereafter, in the same manner as in the example, the composite IC module of the comparative example was completed by wire connection and resin sealing.
[0028]
Using conductive paste (“LAC300D” manufactured by Panasonic Factory Solutions) as the conductive adhesive 6, each of the composite IC modules of the example and the comparative example is placed on the IC card substrate in which the antenna coil is embedded in the IC module. The embedding recess 5 was excavated and then mounted (see FIG. 8).
[0029]
After mounting the composite IC module, a comparative test of the durability of the IC card was performed.
In the test, a “bending test (a total of 1000 dynamic bending tests)” based on ISO 7816-1 was performed.
As a result, in the comparative example, two of the ten conductive pastes were peeled off, but in the examples, the whole number was not peeled off.
[0030]
【The invention's effect】
As described above, the composite IC module of the present invention has a plurality of concave holes reaching the insulating layer of the printed circuit board on the surface of the terminal board for antenna connection. The communication reliability of the IC card can be increased.
[Brief description of the drawings]
FIG. 1 is a rear view showing an embodiment of a composite IC module of the present invention.
FIG. 2 is a plan view showing an antenna connection terminal plate.
FIG. 3 is a diagram showing a conventional antenna connection terminal plate;
FIG. 4 is a plan view of a conventional contact IC card.
FIG. 5 is a plan view of a conventional contact and non-contact IC card.
FIG. 6 is a plan view showing a terminal group of contact terminals of an IC module.
FIG. 7 is a diagram illustrating a bonding state of the back surface of a conventional composite IC module.
FIG. 8 is a cross-sectional view of a contact / non-contact IC card in which a composite IC module is mounted on a card substrate.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 IC module for composite IC cards, composite IC module 3 IC chip 5 Recess 6 Conductive adhesive 7 Resin mold part 8 Printed circuit board 9 Recessed hole 11 Contact type IC card 12 Contact / non-contact use IC card 14 Contact type IC module 15 IC module for compound IC card (conventional product)
21 Antenna Coils 24, 25 Antenna Connection Terminal Board 26 Wire Bonding Board Side Pad 27 Bonding Wire

Claims (3)

接触、非接触の両方のインターフェースを持つＩＣチップが内蔵されたＩＣカード用ＩＣモジュールであって、該ＩＣチップを搭載するプリント基板の表面はＩＳＯ７８１６が規定する８つの端子群を有し、該プリント基板の裏面には接触、非接触両用のＩＣチップが搭載され、ＩＣチップの接続端子と表面の端子の金属層とが接続されているＩＣモジュールにおいて、カード基体内のアンテナと接続するためのプリント基板裏面に設けられた２つのアンテナ接続用端子板の導電性接着材料と接する面は、プリント基板の絶縁層に達する深さの複数の凹孔が穿孔された金属層からなることを特徴とする複合ＩＣカード用ＩＣモジュール。An IC module for an IC card in which an IC chip having both contact and non-contact interfaces is incorporated, and the surface of the printed board on which the IC chip is mounted has eight terminal groups defined by ISO7816, A printed circuit board for connecting to the antenna in the card substrate in an IC module in which a contact and non-contact IC chip is mounted on the back surface of the substrate, and a connection layer of the IC chip is connected to a metal layer of the surface terminal. The surfaces of the two antenna connection terminal plates provided on the back surface of the substrate that are in contact with the conductive adhesive material are formed of a metal layer having a plurality of recessed holes with a depth reaching the insulating layer of the printed circuit board. IC module for compound IC card. アンテナ接続用端子板の金属層の厚みが、３５μｍから７０μｍの範囲であることを特徴とする請求項１記載の複合ＩＣカード用ＩＣモジュール。2. The IC module for a composite IC card according to claim 1, wherein the thickness of the metal layer of the antenna connection terminal plate is in the range of 35 [mu] m to 70 [mu] m. 複数の凹孔が規則的に配列した格子凹孔であって、アンテナ接続用端子板の平面外観が格子形状であることを特徴とする請求項１または請求項２記載の複合ＩＣカード用ＩＣモジュール。3. The IC module for a composite IC card according to claim 1, wherein the plurality of concave holes are lattice concave holes regularly arranged, and the planar appearance of the antenna connection terminal plate is a lattice shape. .
JP2003182273A 2003-06-26 2003-06-26 IC module for compound IC card Expired - Lifetime JP4090950B2 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007172592A (en) * 2005-11-25 2007-07-05 Semiconductor Energy Lab Co Ltd Semiconductor device
US7630209B2 (en) 2005-07-14 2009-12-08 Samsung Electronics Co., Ltd. Universal PCB and smart card using the same
JP2014521164A (en) * 2011-07-12 2014-08-25 アエスカ エス．ア． Hybrid contact-contactless smart card with enhanced electronic module
JP2018197942A (en) * 2017-05-23 2018-12-13 凸版印刷株式会社 Ic card having a non-contact communication function
WO2024029250A1 (en) * 2022-08-04 2024-02-08 デクセリアルズ株式会社 Smart card

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KR101272042B1 (en) 2010-11-08 2013-06-07 주식회사 포스코이에스엠 Lithuium manganese complex oxide and the manufacturing method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7630209B2 (en) 2005-07-14 2009-12-08 Samsung Electronics Co., Ltd. Universal PCB and smart card using the same
US7855895B2 (en) 2005-07-14 2010-12-21 Samsung Electronics Co., Ltd. Universal PCB and smart card using the same
JP2007172592A (en) * 2005-11-25 2007-07-05 Semiconductor Energy Lab Co Ltd Semiconductor device
JP2014521164A (en) * 2011-07-12 2014-08-25 アエスカ エス．ア． Hybrid contact-contactless smart card with enhanced electronic module
JP2018197942A (en) * 2017-05-23 2018-12-13 凸版印刷株式会社 Ic card having a non-contact communication function
WO2024029250A1 (en) * 2022-08-04 2024-02-08 デクセリアルズ株式会社 Smart card

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