JP3979873B2 - Non-contact data carrier manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact data carrier manufacturable at a cost lower than before and a method of manufacturing the data carrier. <P>SOLUTION: This non-contact data carrier includes a semiconductor element sealed with resin, and an antenna circuit. The electrode part of the semiconductor element is electrically connected to the end part of an antenna circuit by a wire or a flip chip bonding. The surface of the antenna circuit is protected by a protective layer. <P>COPYRIGHT: (C)2003,JPO

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention is a contactless data carrier.AIt relates to a manufacturing method.
[0002]
[Prior art]
Non-contact data carriers have a memory that can store various data and can communicate with external readers / writers in a non-contact manner, automatically sorting packages with data carriers, managing inventory, and preventing theft of products. It is used for various purposes such as production and distribution management.
[0003]
FIG. 1 shows an example of a contactless data carrier that has been widely used conventionally. In this non-contact type data carrier, a coiled antenna circuit 3 is formed on a base material 1 made of plastic or the like, and a resonance circuit is formed by this antenna coil and a capacitive element electrically connected to the coil to generate radio waves of a constant frequency. It is configured to be able to receive and transmit. In general, a frequency band of 125 kHz (medium wave), 13.56 MHz, 2.45 GHz (microwave) is used.
[0004]
  In the non-contact type data carrier shown in FIG. 1, the antenna circuit 3 forms a jumping circuit on the back surface of the substrate 1 by the conductive member 4, and the antenna connection terminal 3CAre electrically connected to the bumps on the back surface of the IC chip 2. In the example shown in FIG. 1, the capacitive element is an IC chip.2Built in.
[0005]
Such a non-contact data carrier is formed by forming an antenna circuit 3 by photoetching or forming a resist pattern by printing a metal foil such as an aluminum foil laminated on a resin base material by printing and then conducting a resist pattern. A jumping circuit is formed by electrical connection with the member 4 through a through hole, and an IC chip having a bump formed on the back side is aligned and arranged at a position corresponding to the antenna connection terminal, and between the bump and the antenna connection terminal. Can be formed by providing a coating for electrically connecting the antenna circuit 3 and the IC chip.
[0006]
[Problems to be solved by the invention]
  The non-contact type data carrier as described above connects the antenna circuit 3 to the conductive member.4A jumping circuit must be formed by electrical connection with through-holes, and an IC chip with bumps formed on the back side is aligned and positioned at a position corresponding to the antenna connection terminal. The connection terminals must be electrically connected. Furthermore, manufacturing the antenna and the IC chip separately increases the cost.
[0007]
Therefore, the manufacturing cost is high, and although the frequency band of 2.45 GHz (microwave) is used, the manufacturing cost is said to vary from $ 5 to $ 100 or more depending on the structure. (From "Micro Stamp presented by Mitsui & Co., Ltd. http://www.mbd.co.jp/mc/rfid.00.html")
[0008]
  An object of the present invention is a non-contact type data carrier that can be manufactured at a lower cost than conventional ones.AIt is to provide a manufacturing method.
[0015]
[Means for Solving the Problems]
  ContractClaim1The invention described in (1) solves the above-described problem relating to the method of manufacturing a non-contact type data carrier, and the first resist pattern in which a portion corresponding to the antenna circuit and the semiconductor element mounting portion is opened on one surface of the conductive substrate. Providing a second resist pattern having an opening corresponding to a jig hole on the other surface, and covering the side of the conductive substrate on which the first resist pattern is provided with a protective film; The process of forming a jig hole by etching the region of the conductive substrate exposed from the opening of the resist pattern, and the surface of the conductive substrate exposed from the opening of the first resist pattern after removing the protective film A process of forming an antenna circuit and a semiconductor element mounting portion by electrodepositing a metal on the substrate and then peeling off the first and second resist patterns, and mounting the formed semiconductor element The process of fixing the semiconductor element on the top, the process of electrically connecting the electrode part of the semiconductor element to the end of the antenna circuit from the wire, and then the semiconductor element and the antenna circuit fixed to the semiconductor element mounting part are sealed with resin And then removing the conductive substrate from the resin-sealed semiconductor element and antenna circuit by peeling or dissolving, and covering the antenna circuit surface and the semiconductor element mounting portion exposed from the resin-sealed portion with a protective layer The gist of the method of manufacturing a non-contact data carrier is characterized by including each process.
[0016]
  Claim2The invention described in (4) solves the above-described problem relating to the method of manufacturing a non-contact type data carrier, and is provided with a first resist pattern having openings corresponding to jig holes on both surfaces of a conductive substrate. The process of forming a jig hole by etching the region of the conductive substrate exposed from the opening of the first resist pattern differs from the conductive substrate in the entire surface of the conductive substrate in which the jig hole is formed. A process of covering with a metal layer, and providing a second resist pattern having an opening corresponding to the antenna circuit and the semiconductor element mounting portion on one surface of the conductive substrate whose surface is covered with the metal layer, The process of forming the antenna circuit and the semiconductor element mounting portion by electrodepositing metal on the surface of the conductive substrate exposed from the opening, and the process of fixing the semiconductor element on the formed semiconductor element mounting portion. A process of electrically connecting the electrode portion of the semiconductor element to the end of the antenna circuit by a wire, a process of resin-sealing the semiconductor element and the antenna circuit fixed to the semiconductor element mounting portion, and then the conduction The conductive substrate is separated from the resin-encapsulated semiconductor element and antenna circuit by dissolving the metal layer covering the conductive substrate, and the antenna circuit surface and the semiconductor element mounting part exposed from the resin-encapsulated part are covered with a protective layer The gist of the present invention is a method of manufacturing a non-contact type data carrier characterized by including each of the processes to be performed.
[0017]
  Claim3The invention described in (1) solves the above-described problem relating to the method of manufacturing a non-contact type data carrier. A first resist pattern having an opening corresponding to an antenna circuit is provided on one side of a conductive substrate, and the other side is provided. A process of providing a second resist pattern having an opening corresponding to a jig hole and a side of the conductive substrate on which the first resist pattern is provided are covered with a protective film, and then the second resist pattern is opened. The process of forming a jig hole by etching the region of the conductive substrate exposed from the portion, and electrodepositing metal on the surface of the conductive substrate exposed from the opening of the first resist pattern after peeling the protective film Thereafter, the first and second resist patterns are peeled off to form an antenna circuit, and a semiconductor element is placed on the formed antenna circuit, and an electrode portion of the semiconductor element is formed. The process of electrically connecting to the end of the antenna circuit by flip-chip bonding, the process of resin-sealing the semiconductor element and the antenna circuit, and then peeling the conductive substrate from the resin-encapsulated semiconductor element and antenna circuit Alternatively, a gist of a method for manufacturing a non-contact type data carrier, which includes each step of removing by melting and covering the antenna circuit surface exposed from the resin sealing portion with a protective layer.
[0018]
  Claim4The invention described in (4) solves the above-described problem relating to the method of manufacturing a non-contact type data carrier, and is provided with a first resist pattern having openings corresponding to jig holes on both surfaces of a conductive substrate. The process of forming a jig hole by etching the region of the conductive substrate exposed from the opening of the first resist pattern differs from the conductive substrate in the entire surface of the conductive substrate in which the jig hole is formed. A process of covering with the metal layer and a second resist pattern having an opening corresponding to the antenna circuit provided on one surface of the conductive substrate whose surface is covered with the metal layer are exposed from the opening of the second resist pattern. The process of forming an antenna circuit by electrodepositing metal on the surface of a conductive substrate, and placing a semiconductor element on the formed antenna circuit, and flipping the electrode part of the semiconductor element to the end of the antenna circuit A process of electrical connection by chip bonding, a process of resin-sealing the semiconductor element and the antenna circuit, and a semiconductor element sealed with resin by dissolving the metal layer covering the conductive substrate; The gist of the present invention is a method for manufacturing a non-contact type data carrier, which includes the steps of separating the conductive substrate from the antenna circuit and covering the antenna circuit surface exposed from the resin sealing portion with a protective layer.
[0019]
  Claim5The invention described in (1) solves the above-described problem relating to the method of manufacturing a non-contact type data carrier, and is a method of manufacturing a non-contact type data carrier in which a plurality of non-contact type data carriers are manufactured in a multifaceted manner. A first resist pattern having openings corresponding to a plurality of non-contact data carrier antenna circuits and a semiconductor element mounting portion provided on one surface of the conductive substrate, and a second portion corresponding to a jig hole being provided on the other surface; The process of providing the resist pattern and the side of the conductive substrate on which the first resist pattern is provided are covered with a protective film, and then the region of the conductive substrate exposed from the opening of the second resist pattern is etched. The process of forming a jig hole by this, and after peeling off the protective film, electrodepositing metal on the surface of the conductive substrate exposed from the opening of the first resist pattern Thereafter, the process of peeling the first and second resist patterns to form an antenna circuit and a semiconductor element mounting part of a plurality of data carriers, the process of fixing the semiconductor element on the formed semiconductor element mounting part, and the semiconductor element The process of electrically connecting the electrode part of the antenna circuit to the end of the antenna circuit from the wire, the process of resin-sealing the semiconductor element and the antenna circuit fixed to the semiconductor element mounting part, and then the resin element of the semiconductor element And a process of removing the conductive substrate from the antenna circuit by peeling or dissolving, and covering the antenna circuit surface and the semiconductor element mounting portion exposed from the resin sealing portion with a protective layer, and then each non-contact data carrier A gist of a method for manufacturing a non-contact type data carrier is characterized in that each step of cutting and separating is included.
[0020]
  Claim6The invention described in (1) solves the above-described problem relating to the method of manufacturing a non-contact type data carrier, and is a method of manufacturing a non-contact type data carrier in which a plurality of non-contact type data carriers are manufactured in a multifaceted manner. A first resist pattern having openings corresponding to jig holes is provided on both surfaces of the conductive substrate, and then the jig hole is formed by etching the region of the conductive substrate exposed from the opening of the first resist pattern. A process of forming, a process of coating the entire surface of the conductive substrate in which the jig hole is formed with a metal layer different from the conductive substrate, and a plurality of non-conductive surfaces on the surface of the conductive substrate coated with the metal layer. A second resist pattern having an opening corresponding to the antenna circuit and the semiconductor element mounting portion of the contact data carrier is provided, and a surface of the conductive substrate exposed from the opening of the second resist pattern is provided. Forming a plurality of non-contact data carrier antenna circuits and semiconductor element mounting portions by electrodepositing metal onto the semiconductor element, fixing the semiconductor elements on the formed semiconductor element mounting portions, and connecting the electrode portions of the semiconductor elements to the antenna The process of electrically connecting to the end of the circuit with a wire, the process of resin-sealing the semiconductor element and the antenna circuit fixed to the semiconductor element mounting part, and the metal layer covering the conductive substrate thereafter. By separating the conductive substrate from the resin-encapsulated semiconductor element and antenna circuit by covering the antenna circuit surface and covering the antenna circuit surface and the semiconductor element mounting portion exposed from the resin-encapsulated portion with a protective layer, and thereafter A gist of a method for manufacturing a non-contact type data carrier, comprising the steps of cutting and separating into a non-contact type data carrier.
[0021]
  Claim7The invention described in (1) solves the above-described problem relating to the method of manufacturing a non-contact type data carrier, and is a method of manufacturing a non-contact type data carrier in which a plurality of non-contact type data carriers are manufactured in a multifaceted manner. Providing a first resist pattern having openings corresponding to antenna circuits of a plurality of non-contact data carriers on one surface of the conductive substrate, and providing a second resist pattern having openings corresponding to jig holes on the other surface Then, the side of the conductive substrate on which the first resist pattern is provided is covered with a protective film, and then the region of the conductive substrate exposed from the opening of the second resist pattern is etched to form a jig hole. In the process of forming, after peeling off the protective film, a metal is electrodeposited on the surface of the conductive substrate exposed from the opening of the first resist pattern, and then the first and second The process of stripping the resist pattern to form a plurality of non-contact data carrier antenna circuits, placing a semiconductor element on the formed antenna circuit, and flip-chip bonding the electrode part of the semiconductor element to the end of the antenna circuit The process of electrical connection, the process of resin-sealing the semiconductor element and the antenna circuit, and the process of removing the conductive substrate from the resin-encapsulated semiconductor element and antenna circuit by peeling or dissolving the resin substrate A method for manufacturing a non-contact type data carrier comprising the steps of covering the antenna circuit surface exposed from the stop with a protective layer, and then cutting and separating into individual non-contact type data carriers. The gist.
[0022]
  Claim8The invention described in (1) solves the above-described problem relating to the method of manufacturing a non-contact type data carrier, and is a method of manufacturing a non-contact type data carrier in which a plurality of non-contact type data carriers are manufactured in a multifaceted manner. A first resist pattern having openings corresponding to jig holes is provided on both surfaces of the conductive substrate, and then the jig hole is formed by etching the region of the conductive substrate exposed from the opening of the first resist pattern. A process of forming, a process of covering the entire surface of the conductive substrate in which the jig hole is formed with a metal layer different from the conductive substrate, and a plurality of data on one surface of the conductive substrate coated with the metal layer A second resist pattern having an opening corresponding to an antenna circuit of the carrier is provided, and metal is electrodeposited on the surface of the conductive substrate exposed from the opening of the second resist pattern to form a plurality of non-conductive layers. The process of forming the antenna circuit of the tactile data carrier, the process of placing the semiconductor element on the formed antenna circuit, and electrically connecting the electrode part of the semiconductor element to the end of the antenna circuit by flip chip bonding, A process of resin-sealing the post-semiconductor element and the antenna circuit, and then separating the conductive substrate from the resin-encapsulated semiconductor element and antenna circuit by dissolving only the metal layer covering the conductive substrate, A method of manufacturing a non-contact type data carrier comprising the steps of covering the antenna circuit surface exposed from the sealing portion with a protective layer and then cutting and separating into individual non-contact type data carriers Is the gist.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
  FIG. 2 shows the present invention.Manufactured withA non-contact data carrier is shown. As shown in FIGS. 2A and 2B, in the non-contact type data carrier of the present invention, the semiconductor element 11 and the antenna circuit 12 are sealed with a sealing resin 13, and the electrode portion of the semiconductor element 11 has a wire 14. And electrically connected to both ends of the antenna circuit 12. The portion of the antenna coil 12 exposed from the resin sealing portion and the semiconductor element mounting portion 15 are protected by a protective layer 16 made of a solder resist.
[0025]
As is clear from FIG. 2, in the non-contact type data carrier of the present invention, the antenna circuit is electrically connected to the conductive member through the through hole to form a jumping circuit, or the bump formed on the IC chip is connected to the antenna. There is no need to place the bumps and the antenna connection terminals electrically connected to the positions corresponding to the terminals. It is only necessary to place the semiconductor element on the semiconductor element mounting portion and electrically connect the electrode portions of the semiconductor element to both ends of the antenna circuit with wires. Therefore, it can be manufactured at a lower cost than a conventional non-contact data carrier.
[0026]
  FIG. 3 shows the present invention.Manufactured with4 shows another embodiment of a contactless data carrier. The semiconductor element 11 and the linear antenna circuit 17 are sealed with a sealing resin 13, and the electrode portion of the semiconductor element 11 is electrically connected to the antenna circuit 17 by a wire 14. The antenna circuit 17 and the semiconductor element 11 exposed from the resin sealing portion are protected by a protective layer 16 made of a solder resist.
[0027]
  FIG. 4 shows the present invention.Manufactured with6 shows yet another embodiment of a contactless data carrier. The semiconductor element 11 and the rectangular antenna circuit 18 are sealed with a sealing resin 13, and the electrode portions of the semiconductor element 11 are electrically connected to both ends of the antenna circuit 18 by wires 14. The antenna circuit 18 and the semiconductor element 11 exposed from the resin sealing portion are protected by a protective layer 16 made of a solder resist.
[0028]
  FIG. 5 shows the present invention.Manufactured with6 shows yet another embodiment of a contactless data carrier. The semiconductor element 11 and the parallel antenna circuit 19 are sealed with a sealing resin 13, and the electrode portion of the semiconductor element 11 is electrically connected to the antenna circuit 19 by a wire 14. The antenna circuit 19 and the semiconductor element 11 exposed from the resin sealing portion are protected by a protective layer 16 made of a solder resist.
[0029]
  FIG. 6 shows the present invention.Manufactured with4 shows another embodiment of a contactless data carrier. The semiconductor element 11 and the linear antenna circuit 20 are sealed with a sealing resin 13, and the electrode portion of the semiconductor element 11 is electrically connected to the antenna circuit 20 via a bump 21 by a flip chip bonding method. The antenna circuit 20 exposed from the resin sealing portion is protected by a protective layer 16 made of a solder resist.
[0030]
  FIG. 7 shows the present invention.Manufactured with6 shows yet another embodiment of a contactless data carrier. The semiconductor element 11 and the linear antenna circuit 22 arranged on the straight line are sealed with a sealing resin 13, and the electrode part of the semiconductor element 11 is connected to the antenna circuit 22 via the bump 21 by a flip chip bonding method. Is electrically connected. The antenna circuit 22 exposed from the resin sealing portion is protected by a protective layer 16 made of a solder resist.
[0031]
  FIG. 8 shows the present invention.Manufactured with6 shows yet another embodiment of a contactless data carrier. The semiconductor element 11 and the antenna circuit 23 each having a projecting portion for connection and arranged in parallel to each other are sealed with a sealing resin 13, and the electrode portion of the semiconductor element 11 is interposed via a bump 21 by a flip chip bonding method. The antenna circuit 23 is electrically connected to the protruding portion. The antenna circuit 23 exposed from the resin sealing portion is protected by a protective layer 16 made of a solder resist.
[0032]
  The present inventionManufactured withNon-contact data carrierTheIt is also possible to form an antenna circuit set to an appropriate inductance on one or both of the sealing resin side and the surface side of the protective layer, and use this as a part of a booster antenna or a resonance circuit. In this case, it is possible to resonate by making electrical connection with the antenna to be added by forming a via or through hole between the antenna circuit, but it is suitable for an antenna to be added without via or through hole. It is also possible to form a resonance pattern by using a sealing resin or an insulating layer of a protective layer as a capacitive component by forming a simple pattern.
[0033]
  FIG.Is a bookinventionManufactured withFig. 4 schematically illustrates yet another embodiment of a non-contact data carrier. In this embodiment, a semiconductor element and an antenna circuit are sealed with resin, and an electrode portion of the semiconductor element is formed by a combination of a semiconductor package with antenna 51 and a booster antenna 52 which are electrically connected to an end portion of the antenna circuit. In this embodiment, it is also possible to resonate by establishing an electrical connection between the booster antenna to be added by forming a via or a through hole between the antenna circuit of the semiconductor package with antenna 51 and the booster antenna 52. However, it is also possible to resonate by coupling the sealing resin or the insulating layer of the protective layer as a capacitive component by forming an appropriate pattern on the antenna to be added without vias or through holes.
[0034]
FIG. 10 shows a method for manufacturing a non-contact data carrier according to the first aspect of the present invention. As shown in FIG. 10, first, a conductive substrate 24 made of copper alloy, 42 alloy, stainless steel (SUS430, SUS304) or the like is prepared, and surface treatment is performed to make the surface on the side where the antenna circuit is formed with sandblast. After that, the surface-treated surface is oxidized with a chromic acid solution to form an oxide film, and a conductive metal film and a sealing resin formed in a subsequent process thereon are easily peeled off from the conductive substrate. Processing is performed (FIG. 10 (1)).
[0035]
Next, a photosensitive resist layer is formed on both surfaces of the conductive substrate 24 using a dry film resist, and exposure, development processing, and the like are performed on the surface of the conductive substrate 24 on which the above-described processing (surface treatment and peeling treatment) has been performed. A first resist pattern 25 having an opening corresponding to an antenna circuit and a semiconductor element mounting portion of a contact data carrier is provided, and a second resist pattern 26 having an opening corresponding to a jig hole is provided on the other surface. FIG. 10 (2)).
[0036]
The dry film resist is generally composed of three layers: a film base material that supports the resist, a resist, and a protective coat film. It can be formed on the surface of the conductive substrate 24 by peeling off the protective coating film, bringing the resist surface into contact with the surface of the conductive substrate 24, and then peeling off the film base. .
[0037]
The first resist pattern 25 and the second resist pattern 26 may be formed by a printing technique such as screen printing or gravure printing.
[0038]
Next, the side on which the first resist pattern 25 of the conductive substrate is provided is covered with a corrosion-resistant protective film 27 made of a polyethylene terephthalate film or the like (FIG. 10 (3)).
[0039]
Thereafter, the jig hole 28 is formed by etching the region of the conductive substrate 24 exposed from the opening of the second resist pattern 26 (FIG. 10 (4)).
[0040]
Next, the protective film 27 is peeled to expose the first resist pattern 25 (FIG. 10 (5)), and Au, Ag, Cu, and the like are formed on the surface of the conductive substrate 24 exposed from the opening of the first resist pattern 25. Pd, Ni, or a multilayer plating 29 of these is applied (FIG. 10 (6)), and then the first resist pattern 25 is immersed in a stripping solution for stripping, followed by a cleaning process or the like to provide antenna circuit 12. And the semiconductor element mounting part 15 is formed (FIG. 10 (7)). Note that the second resist pattern 26 is peeled off when the first resist pattern 25 is peeled off.
[0041]
  Next, the semiconductor element 11 is placed on the formed semiconductor element mounting portion 15 and fixed to the semiconductor element mounting portion 15.(Fig. 10 (8)).
[0042]
Thereafter, the electrode portion of the semiconductor element 11 is connected to both ends of the antenna circuit 12 by a noble metal wire 14 such as Au (FIG. 10 (9)). Wire bonding can be performed using a wire bonding apparatus such as a thermobonding bonder that performs crimping only by heating, an ultrasonic thermobonding bonder that uses both thermocompression and ultrasonic waves, and a wedge bonder that crimps only by ultrasonic vibration at room temperature. it can.
[0043]
Next, the antenna circuit 12, the semiconductor element 11, and the wire 14 are sealed with a sealing resin 13 such as an epoxy resin (FIG. 10 (10)). In this sealing process, the metal film forming the antenna circuit 12 and the semiconductor element mounting portion 15 is surely attached to the conductive substrate 24 by performing a surface treatment to make the surface of the conductive substrate 24 uneven. It is in close contact and withstands the pressure at the time of molding of the sealing resin and does not cause peeling.
[0044]
Next, the conductive substrate 24 is separated from the sealed antenna circuit 12 and the semiconductor element 11 (FIG. 10 (11)). This peeling is made possible by the fact that the peeling is easy with respect to the force in the vertical direction by the surface treatment and the peeling treatment performed previously.
[0045]
Next, the surface of the antenna circuit 12 exposed from the resin sealing portion and the semiconductor element mounting portion 15 are covered with the protective layer 16 to obtain the non-contact type data carrier of the present invention (FIG. 10 (12)).
[0046]
Next, a modification of the embodiment of the first non-contact data carrier manufacturing method described above will be described. In this modified embodiment, a conductive substrate made of a copper alloy is used. And an antenna circuit and a semiconductor element mounting part form what consists of two layers of Cu / Pd. The conductive substrate is selectively dissolved using a solution that dissolves copper but does not dissolve Pd. Others are the same as those of the first embodiment of the manufacturing method of the first non-contact type data carrier.
[0047]
FIG. 11 shows a non-contact data carrier manufacturing method according to the second aspect of the present invention. First, a conductive substrate 24 made of stainless steel (SUS430) or the like is prepared (FIG. 11 (1)), and first resist patterns 30 and 31 having openings corresponding to jig holes on both surfaces of the conductive substrate 24 are formed. After that, a jig hole 28 is formed by etching the region of the conductive substrate exposed from the openings of the first resist patterns 30 and 31 (FIG. 11 (3)).
[0048]
Next, the entire surface of the conductive substrate 24 in which the jig hole 28 is formed is covered with a metal plating layer (copper plating layer) 32 different from the conductive substrate (FIG. 11 (4)).
[0049]
Next, a second resist pattern 33 made of an electrodeposition resist having openings corresponding to the antenna circuit and the semiconductor element mounting portion is provided on one surface of the conductive substrate 24 whose surface is covered with the metal plating layer 32 (FIG. 11 (5)). )), And by depositing gold, silver or the like 29 on the surface of the conductive substrate 24 exposed from the opening of the second resist pattern 33 (FIG. 11 (6)), the antenna circuit 12 and the semiconductor element mounting portion 15 are formed. (FIG. 11 (7)).
[0050]
Next, the semiconductor element 11 is fixed on the formed semiconductor element mounting portion 15 (FIG. 11 (8)), and the electrode portion of the semiconductor element 11 is further electrically connected to the end of the antenna circuit 12 by the wire 14 (FIG. 11). (9)).
[0051]
Thereafter, the semiconductor element 11 and the antenna circuit 12 fixed to the semiconductor element mounting portion 15 are sealed with a sealing resin 13 such as an epoxy resin (FIG. 11 (10)).
[0052]
Thereafter, the conductive substrate 24 is separated from the semiconductor element mounting portion 15 and the antenna circuit 12 which are resin-sealed by selectively dissolving only the metal layer 32 covering the conductive substrate 24 using a corrosive liquid. (FIG. 11 (11)), the non-contact type data carrier of the present invention is obtained by covering the antenna circuit 12 and the semiconductor element mounting portion 15 exposed from the resin sealing portion with the protective layer 16 (FIG. 11 (12)). ).
[0053]
Next, a non-contact data carrier manufacturing method according to the third aspect of the present invention will be described with reference to FIG.
[0054]
As shown in FIG. 12, first, a conductive substrate 24 made of copper alloy, 42 alloy, stainless steel (SUS430, SUS304) or the like is prepared, and surface treatment is performed so that the surface on which the antenna circuit is formed is roughened by sandblasting. After that, the surface-treated surface is oxidized with a chromic acid solution to form an oxide film, and a conductive metal film and a sealing resin formed in a subsequent process thereon are easily peeled off from the conductive substrate. Processing is performed (FIG. 12 (1)).
[0055]
Next, a photosensitive resist layer is formed on both surfaces of the conductive substrate 24 using a dry film resist, and exposure, development processing, and the like are performed on the surface of the conductive substrate 24 on which the above-described processing (surface treatment and peeling treatment) has been performed. A first resist pattern 34 having an opening corresponding to an antenna circuit of a contact type data carrier is provided, and a second resist pattern 35 having an opening corresponding to a jig hole is provided on the other surface (FIG. 12B). ).
[0056]
The dry film resist is generally composed of three layers: a film base material that supports the resist, a resist, and a protective coat film. In a state where the protective coat film is peeled off and the resist surface is exposed, the resist surface is brought into close contact with the surface of the conductive substrate 24, and then the film base material is peeled off to form a photosensitive resist layer on the surface of the conductive substrate 24. Can be formed.
[0057]
The first resist pattern 34 and the second resist pattern 35 may be formed by a printing technique such as screen printing or gravure printing.
[0058]
Next, the side on which the first resist pattern 34 of the conductive substrate is provided is covered with a corrosion-resistant protective film 36 made of a polyethylene terephthalate film or the like (FIG. 12 (3)).
[0059]
Thereafter, the jig hole 28 is formed by etching the region of the conductive substrate 24 exposed from the opening of the second resist pattern 36 (FIG. 12 (4)).
[0060]
Next, the protective film 36 is peeled to expose the first resist pattern 34 (FIG. 12 (4)), and Au, Ag, Cu, and the like are exposed on the surface of the conductive substrate 24 exposed from the opening of the first resist pattern 34. Pd, Ni, or the like or a multilayer plating 37 thereof is applied (FIG. 12 (5)), and then the first resist pattern 34 is immersed in a stripping solution for stripping, followed by a cleaning process or the like to perform antenna circuit 38. Is formed (FIG. 12 (6)). The second resist pattern 35 is peeled off when the first resist pattern 35 is peeled off.
[0061]
Next, the semiconductor element 11 is placed on the formed antenna circuit 38, and the antenna circuit 38 is electrically connected to the semiconductor element 11 through the bumps 21 by a flip chip bonding method (FIG. 12 (7)).
[0062]
Next, the antenna circuit 38 and the semiconductor element 11 are sealed with a sealing resin 13 such as an epoxy resin (FIG. 12 (8)). In this sealing process, the surface of the conductive substrate 24 is subjected to a surface treatment so that the metal film forming the antenna circuit 38 is in close contact with the conductive substrate 24 and the sealing resin. Withstands the pressure during molding and does not cause peeling.
[0063]
Next, the conductive substrate 24 is separated from the sealed antenna circuit 38 and the semiconductor element 11 (FIG. 12 (9)). This peeling is made possible by the fact that the peeling is easy with respect to the force in the vertical direction by the surface treatment and the peeling treatment performed previously.
[0064]
Next, the surface of the antenna circuit 38 exposed from the resin sealing portion is covered with the protective layer 16 to obtain the non-contact type data carrier of the present invention (FIG. 12 (10)).
[0065]
Next, a modification of the embodiment of the third method for manufacturing a non-contact data carrier will be described. In this modified embodiment, a conductive substrate made of a copper alloy is used. And an antenna circuit and a semiconductor element mounting part form what consists of two layers of Cu / Pd. The conductive substrate is selectively dissolved using a solution that dissolves copper but does not dissolve Pd. Others are the same as those of the first embodiment of the manufacturing method of the first non-contact type data carrier.
[0066]
FIG. 13 shows a non-contact data carrier manufacturing method according to the fourth aspect of the present invention. First, a conductive substrate 24 made of stainless steel (SUS430) or the like is prepared (FIG. 13 (1)), and first resist patterns 30 and 31 having openings corresponding to jig holes on both surfaces of the conductive substrate 24 are formed. After that, a jig hole 28 is formed by etching the region of the conductive substrate exposed from the openings of the first resist patterns 30 and 31 (FIG. 13 (3)).
[0067]
Next, the entire surface of the conductive substrate 24 in which the jig hole 28 is formed is covered with a metal plating layer (copper plating layer) 32 different from the conductive substrate (FIG. 13 (4)).
[0068]
Next, a second resist pattern 33 made of an electrodeposition resist having an opening corresponding to the antenna circuit is provided on one surface of the conductive substrate 24 whose surface is covered with the metal plating layer 32 (FIG. 13 (5)). Gold, silver or the like 37 is electrodeposited on the surface of the conductive substrate 24 exposed from the openings of the resist pattern 33 (FIG. 13 (6)) to form the antenna circuit 38 (FIG. 13 (7)).
[0069]
Next, the semiconductor element 11 is placed on the formed antenna circuit 38, and the antenna circuit 38 is electrically connected to the semiconductor element 11 through the bumps 21 by a flip chip bonding method (FIG. 13 (8)).
[0070]
Thereafter, the semiconductor element 11 and the antenna circuit 38 are sealed with a sealing resin 13 such as an epoxy resin (FIG. 13 (9)).
[0071]
Thereafter, the conductive substrate 24 is separated from the resin-sealed antenna circuit 38 by selectively dissolving only the metal plating layer 32 covering the conductive substrate 24 using a corrosive liquid (FIG. 13 (10)). )) By covering the surface of the antenna circuit 38 exposed from the resin sealing portion with the protective layer 16, the non-contact type data carrier of the present invention is obtained (FIG. 13 (11)).
[0072]
14 and 15 show a method of manufacturing a non-contact type data carrier in which a plurality of non-contact type data carriers are manufactured by multiple imposition. First, as shown in FIG. 14, after preparing a conductive substrate 41 made of copper alloy, 42 alloy, stainless steel (SUS430), etc., and performing surface treatment to make the surface on which the antenna circuit is to be formed by sand blasting, The surface-treated surface is oxidized with chromic acid solution to form an oxide film, and then a peeling process is performed to facilitate peeling of the conductive metal film and sealing resin formed in the subsequent process from the conductive substrate. (FIG. 14 (1)).
[0073]
Next, a photosensitive resist layer is formed on both surfaces of the conductive substrate 41 using a dry film resist, and exposure, development processing, and the like are performed on the surfaces of the conductive substrate 41 subjected to the above processing (surface treatment and peeling treatment). The first resist pattern 42 having an opening corresponding to the antenna circuit and the semiconductor element mounting portion of the non-contact type data carrier is provided, and the second resist pattern 43 having an opening corresponding to the jig hole is provided on the other surface. Provided (FIG. 14 (2)).
[0074]
The first resist pattern 42 and the second resist pattern 43 may be formed by a printing technique such as screen printing or gravure printing.
[0075]
Next, the side on which the first resist pattern 42 of the conductive substrate is provided is covered with a corrosion-resistant protective film 44 made of a polyethylene terephthalate film or the like (FIG. 14 (3)).
[0076]
Thereafter, the jig hole 45 is formed by etching the region of the conductive substrate 41 exposed from the opening of the second resist pattern 43 (FIG. 14 (4)).
[0077]
Next, the protective film 44 is peeled off to expose the first resist pattern 42 (FIG. 14 (5)), and the surface of the conductive substrate 41 exposed from the opening of the first resist pattern 42 is Au, Ag, Cu, Pd. Then, Ni plating or multilayer plating 46 is applied (FIG. 14 (6)), and then the first resist pattern 42 is immersed in a stripping solution for stripping, and then a cleaning process or the like is performed for the antenna circuit 12 and The semiconductor element mounting portion 15 is formed (FIG. 14 (7)) The second resist pattern 43 is peeled off when the first resist pattern 42 is peeled off.
[0078]
Next, the semiconductor element 11 is placed and fixed on the formed semiconductor element mounting portion 15 (FIG. 15 (1)).
[0079]
Thereafter, the electrode part of the semiconductor element 11 is electrically connected to both ends of the antenna circuit 12 by a noble metal wire 14 such as Au (FIG. 15B).
[0080]
Next, the antenna circuit 12, the semiconductor element 11, and the wire 14 are sealed with a sealing resin 13 such as an epoxy resin (FIG. 15 (3)).
[0081]
Next, the protective layer 47 formed by peeling the conductive substrate 41 from the sealed antenna circuit 12 and the semiconductor element 11 and then applying the solder paste or the like to the antenna circuit 12 and the semiconductor element mounting portion 15 exposed from the resin sealing portion. (FIG. 15 (4)).
[0082]
  Thereafter, it is cut and separated into individual non-contact data carriers (FIG. 15 (5)).
[0083]
According to the manufacturing method described above, a large number of non-contact data carriers can be efficiently manufactured with multiple impositions.
[0084]
Furthermore, to manufacture a plurality of non-contact data carriers by multi-sided attachment, a first resist pattern having openings corresponding to jig holes is provided on both sides of a conductive substrate, and then the first resist pattern is formed. A jig hole is formed by etching a region of the conductive substrate exposed from the opening, and the entire surface of the conductive substrate in which the jig hole is formed is covered with a metal layer different from the conductive substrate. A second resist pattern having openings corresponding to antenna circuits and semiconductor element mounting portions of a plurality of non-contact data carriers is provided on one surface of a conductive substrate whose surface is covered with a layer, from the opening portion of the second resist pattern. A plurality of non-contact data carrier antenna circuits and semiconductor element mounting portions are formed by electrodepositing metal on the surface of the exposed conductive substrate, and the semiconductor elements are formed on the formed semiconductor element mounting portions. The process of electrically connecting the electrode portion of the semiconductor element to the end of the antenna circuit with a wire, and then sealing the semiconductor element and the antenna circuit fixed to the semiconductor element mounting portion with resin, and then the conductivity The conductive substrate is separated from the resin-encapsulated semiconductor element and antenna circuit by dissolving only the metal layer covering the substrate, and the antenna circuit surface exposed from the resin-encapsulated portion is covered with a protective layer, and then individually It can also be performed by cutting and separating into non-contact data carriers.
[0085]
Furthermore, manufacturing a plurality of non-contact type data carriers in a multi-sided manner includes providing a first resist pattern having openings corresponding to antenna circuits of a plurality of non-contact data carriers on one side of a conductive substrate, A second resist pattern having an opening corresponding to a jig hole is provided, and the side of the conductive substrate on which the first resist pattern is provided is covered with a protective film, and then the opening of the second resist pattern. A region of the conductive substrate exposed from the substrate is etched to form a jig hole, and after removing the protective film, a metal is electrodeposited on the surface of the conductive substrate exposed from the opening of the first resist pattern. After that, the first and second resist patterns are peeled off to form a plurality of non-contact data carrier antenna circuits, and a semiconductor element is placed on the formed antenna circuit. Are electrically connected to the end of the antenna circuit by flip-chip bonding, and then the semiconductor element and the antenna circuit are sealed with resin, and then the conductive substrate is peeled from the resin-sealed semiconductor element and antenna circuit. Alternatively, it can also be performed by removing by dissolving, covering the antenna circuit surface exposed from the resin sealing portion with a protective layer, and then cutting and separating into individual non-contact data carriers.
[0086]
Furthermore, to manufacture a plurality of non-contact data carriers by multi-sided attachment, a first resist pattern having openings corresponding to jig holes is provided on both sides of a conductive substrate, and then the first resist pattern is formed. A jig hole is formed by etching a region of the conductive substrate exposed from the opening, and the entire surface of the conductive substrate in which the jig hole is formed is covered with a metal layer different from the conductive substrate. The surface of the conductive substrate exposed from the opening of the second resist pattern is provided with a second resist pattern having openings corresponding to antenna circuits of a plurality of data carriers provided on one surface of the conductive substrate whose surface is covered with a layer. A plurality of non-contact data carrier antenna circuits are formed by electrodepositing metal on the semiconductor circuit, a semiconductor element is placed on the formed antenna circuit, and the electrode portion of the semiconductor element is fitted to the end of the antenna circuit. The semiconductor element and the antenna which are electrically connected by up-chip bonding, and then the resin is sealed with the semiconductor element and the antenna circuit, and then only the metal layer covering the conductive substrate is dissolved. It can also be carried out by separating the conductive substrate from the circuit, covering the antenna circuit surface exposed from the resin sealing portion with a protective layer, and then cutting and separating into individual non-contact data carriers.
[0088]
【The invention's effect】
  As explained in detail above,Non-contact data carrier according to the present inventionAccording to the manufacturing methodAs in the conventional non-contact type data carrier, the antenna circuit is electrically connected to the conductive member through the through hole to form a jumping circuit, or the bump formed on the IC chip is placed at a position corresponding to the antenna connection terminal. It can be manufactured at a lower cost than the conventional one without aligning and arranging the bump and the antenna connection terminal electrically.
[Brief description of the drawings]
FIG. 1 is a plan view showing an example of a conventional non-contact type data carrier.
FIG. 2Manufactured with2A is a plan view, and FIG. 2B is a cross-sectional view.
FIG. 3Manufactured withThe other embodiment of the non-contact-type data carrier is shown, (A) is a top view, (B) is sectional drawing.
FIG. 4 The present inventionManufactured with3A and 3B show still another embodiment of the non-contact type data carrier, wherein FIG. 5A is a plan view and FIG.
FIG. 5 shows the present invention.Manufactured with3A and 3B show still another embodiment of the non-contact type data carrier, wherein FIG. 5A is a plan view and FIG.
FIG. 6Manufactured with3A and 3B show still another embodiment of the non-contact type data carrier, wherein FIG. 5A is a plan view and FIG.
FIG. 7Manufactured with3A and 3B show still another embodiment of the non-contact type data carrier, wherein FIG. 5A is a plan view and FIG.
FIG. 8Manufactured with3A and 3B show still another embodiment of the non-contact type data carrier, wherein FIG. 5A is a plan view and FIG.
FIG. 9Manufactured withFIG. 10 is a plan view showing still another embodiment of the non-contact type data carrier.
FIG. 10 is a cross-sectional view showing the steps of the first non-contact data carrier manufacturing method of the present invention.
FIG. 11 is a cross-sectional view showing a process of the second non-contact data carrier manufacturing method of the present invention.
FIG. 12 is a cross-sectional view showing a process of a third non-contact type data carrier manufacturing method of the present invention.
FIG. 13 is a cross-sectional view showing a process of a fourth non-contact data carrier manufacturing method according to the present invention.
FIG. 14 is a cross-sectional view showing a process of a fifth non-contact data carrier manufacturing method of the present invention.
15 is a cross-sectional view showing a step of the fifth non-contact data carrier manufacturing method of the present invention following the step shown in FIG. 14; FIG.
[Explanation of symbols]
  11 Semiconductor elements
  12 Antenna circuit
  13 Sealing resin
  14 wires
  15 Semiconductor device mounting part
  16 Protective layer
  17 Antenna circuit
  18 Antenna circuit
  19 Antenna circuit
  20 Antenna circuit
  21 Bump
  22 Antenna circuit
  23 Antenna circuit
  24 conductive substrate
  25 First resist pattern
  26 Second resist pattern
  27 Protective film
  28 Jig hole
  29 Au, Ag, Cu, Pd, Ni plating or multilayer plating
  30, 31 First resist pattern
  32 Metal plating layer
  33 Second resist pattern
  34 First resist pattern
  35 Second resist pattern
  36 Protective film
  37 Au, Ag, Cu, Pd, Ni plating, etc. or their multi-layer plating
  38 Antenna circuit
  41 Conductive substrate
  42 First resist pattern
  43 Second resist pattern
  44 protective film
  45 Jig hole
  46 Au, Ag, Cu, Pd, Ni plating or multilayer plating
  47 Protective layer
  51 Semiconductor package with antenna
  52 Booster Antenna

Claims (8)

  Providing a first resist pattern having an opening corresponding to an antenna circuit and a semiconductor element mounting portion on one surface of a conductive substrate, and providing a second resist pattern having an opening corresponding to a jig hole on the other surface; Then, a side of the conductive substrate on which the first resist pattern is provided is covered with a protective film, and then a jig hole is formed by etching the region of the conductive substrate exposed from the opening of the second resist pattern. And, after peeling off the protective film, electrodepositing metal onto the surface of the conductive substrate exposed from the opening of the first resist pattern, and then peeling off the first and second resist patterns to form the antenna circuit and The process of forming the semiconductor element mounting part, the process of fixing the semiconductor element on the formed semiconductor element mounting part, and the electrode part of the semiconductor element from the wire to the end of the antenna circuit The process of air connection, the process of resin-sealing the semiconductor element and the antenna circuit fixed to the semiconductor element mounting portion, and the process of peeling or dissolving the conductive substrate from the semiconductor element and the antenna circuit sealed with resin. A method of manufacturing a non-contact type data carrier, comprising the steps of covering the antenna circuit surface exposed from the resin sealing portion and the semiconductor element mounting portion with a protective layer.   A first resist pattern having portions corresponding to jig holes opened on both surfaces of the conductive substrate is provided, and then a region of the conductive substrate exposed from the opening of the first resist pattern is etched to thereby form a jig hole. A process of covering the entire surface of the conductive substrate in which the jig hole is formed with a metal layer different from the conductive substrate, and an antenna circuit on one surface of the conductive substrate whose surface is coated with the metal layer. And a second resist pattern having an opening corresponding to the semiconductor element mounting portion, and a metal is electrodeposited on the surface of the conductive substrate exposed from the opening of the second resist pattern. A process of fixing the semiconductor element on the formed semiconductor element mounting part, and a process of electrically connecting the electrode part of the semiconductor element to the end of the antenna circuit with a wire. After that, the process of resin-sealing the semiconductor element and the antenna circuit fixed to the semiconductor element mounting portion, and then conducting the conduction from the resin-sealed semiconductor element and the antenna circuit by dissolving the metal layer covering the conductive substrate. A method for manufacturing a non-contact type data carrier comprising: separating the conductive substrate and covering the antenna circuit surface exposed from the resin sealing portion and the semiconductor element mounting portion with a protective layer.   Providing a first resist pattern having an opening corresponding to an antenna circuit on one surface of a conductive substrate and providing a second resist pattern having a portion corresponding to a jig hole on the other surface; A process of forming a jig hole by covering the side provided with the first resist pattern with a protective film, and then etching the region of the conductive substrate exposed from the opening of the second resist pattern; A process of electrodepositing a metal on the surface of the conductive substrate exposed from the opening of the first resist pattern after peeling the film, and then peeling the first and second resist patterns to form an antenna circuit; A process of placing a semiconductor element on the formed antenna circuit and electrically connecting the electrode portion of the semiconductor element to the end of the antenna circuit by flip chip bonding; The process of resin-sealing the semiconductor element and the antenna circuit, and then removing the conductive substrate from the resin-sealed semiconductor element and antenna circuit by peeling or dissolving to protect the antenna circuit surface exposed from the resin-sealed portion A method of manufacturing a non-contact type data carrier comprising the steps of coating with a layer.   A first resist pattern having portions corresponding to jig holes opened on both surfaces of the conductive substrate is provided, and then a region of the conductive substrate exposed from the opening of the first resist pattern is etched to thereby form a jig hole. A process of covering the entire surface of the conductive substrate in which the jig hole is formed with a metal layer different from the conductive substrate, and an antenna circuit on one surface of the conductive substrate whose surface is coated with the metal layer. A process of forming an antenna circuit by providing a second resist pattern having an opening corresponding to the above and electrodepositing metal on the surface of the conductive substrate exposed from the opening of the second resist pattern, and the formed antenna circuit A process of placing a semiconductor element on top and electrically connecting an electrode portion of the semiconductor element to an end of the antenna circuit by flip chip bonding, and then the semiconductor element and the antenna circuit An antenna circuit in which a conductive substrate is separated from a resin-sealed semiconductor element and an antenna circuit by dissolving a metal layer covering the conductive substrate and then the resin layer is sealed, and then exposed from the resin-sealed portion A method of manufacturing a non-contact type data carrier comprising the steps of coating a surface with a protective layer.   A non-contact type data carrier manufacturing method for manufacturing a plurality of non-contact type data carriers with multiple mountings, and a portion corresponding to an antenna circuit and a semiconductor element mounting portion of a plurality of non-contact type data carriers on one surface of a conductive substrate Providing a first resist pattern having an opening and providing a second resist pattern having an opening corresponding to a jig hole on the other surface, and protecting the side of the conductive substrate on which the first resist pattern is provided The process of forming a jig hole by coating with a film and then etching the region of the conductive substrate exposed from the opening of the second resist pattern, and the opening of the first resist pattern after removing the protective film A metal is electrodeposited on the surface of the conductive substrate exposed from the portion, and then the first and second resist patterns are peeled off to form antenna circuits and a plurality of data carriers. A process of forming the semiconductor element mounting part, a process of fixing the semiconductor element on the formed semiconductor element mounting part, a process of electrically connecting the electrode part of the semiconductor element to the end of the antenna circuit from the wire, and thereafter The process of resin-sealing the semiconductor element and the antenna circuit fixed to the semiconductor element mounting portion, and then removing the conductive substrate from the resin-sealed semiconductor element and antenna circuit by peeling or dissolving, and removing from the resin sealing portion. Production of a non-contact type data carrier comprising the steps of covering the exposed antenna circuit surface and the semiconductor element mounting portion with a protective layer and then cutting and separating into individual non-contact type data carriers Method.   A non-contact type data carrier manufacturing method for manufacturing a plurality of non-contact type data carriers by multi-sided attachment, wherein a first resist pattern having openings corresponding to jig holes is provided on both sides of a conductive substrate. The process of forming a jig hole by etching the region of the conductive substrate exposed from the opening of the first resist pattern and the entire surface of the conductive substrate in which the jig hole is formed are defined as a conductive substrate. A process of covering with a different metal layer, and a second resist pattern having openings corresponding to antenna circuits and semiconductor element mounting portions of a plurality of non-contact data carriers on one surface of a conductive substrate whose surface is covered with the metal layer A plurality of non-contact data carrier antenna circuits and semiconductor element mounting portions are formed by electrodepositing metal on the surface of the conductive substrate exposed from the opening of the second resist pattern The process of fixing the semiconductor element on the formed semiconductor element mounting part, the process of electrically connecting the electrode part of the semiconductor element to the end of the antenna circuit with a wire, and then fixing to the semiconductor element mounting part A process of resin-sealing the semiconductor element and the antenna circuit, and then separating the conductive substrate from the resin-encapsulated semiconductor element and antenna circuit by dissolving only the metal layer covering the conductive substrate, Non-contact type characterized in that it includes a process of covering the antenna circuit surface exposed from the sealing part and the semiconductor element mounting part with a protective layer and then cutting and separating into individual non-contact type data carriers. Data carrier manufacturing method.   A non-contact type data carrier manufacturing method for manufacturing a plurality of non-contact type data carriers with multiple attachments, wherein a portion corresponding to an antenna circuit of a plurality of non-contact data carriers is opened on one surface of a conductive substrate. A process of providing a resist pattern and providing a second resist pattern having an opening corresponding to a jig hole on the other surface, and covering the side of the conductive substrate on which the first resist pattern is provided with a protective film. The process of forming a jig hole by etching the region of the conductive substrate exposed from the opening of the second resist pattern and the conductivity exposed from the opening of the first resist pattern after removing the protective film Forming a plurality of non-contact data carrier antenna circuits by electrodepositing a metal on the surface of the substrate and then peeling off the first and second resist patterns; A process of placing a semiconductor element on the formed antenna circuit, electrically connecting the electrode portion of the semiconductor element to the end of the antenna circuit by flip-chip bonding, and then sealing the semiconductor element and the antenna circuit with resin And then removing the conductive substrate from the resin-encapsulated semiconductor element and antenna circuit by peeling or dissolving, and covering the antenna circuit surface exposed from the resin-encapsulated portion with a protective layer; A method of manufacturing a non-contact type data carrier comprising the steps of cutting and separating into a non-contact type data carrier.   A non-contact type data carrier manufacturing method for manufacturing a plurality of non-contact type data carriers by multi-sided attachment, wherein a first resist pattern having openings corresponding to jig holes is provided on both sides of a conductive substrate. A process of forming a jig hole by etching a region of the conductive substrate exposed from the opening of the first resist pattern, and a conductive substrate covering the entire surface of the conductive substrate in which the jig hole is formed A process of covering with a different metal layer, and a second resist pattern having openings corresponding to antenna circuits of a plurality of data carriers provided on one surface of the conductive substrate whose surface is covered with the metal layer; Forming a plurality of non-contact data carrier antenna circuits by electrodepositing metal on the surface of the conductive substrate exposed from the opening of the semiconductor element, and a semiconductor element on the formed antenna circuit The process of mounting and electrically connecting the electrode part of the semiconductor element to the end of the antenna circuit by flip chip bonding, the process of resin-sealing the semiconductor element and the antenna circuit, and then the conductive substrate The process of separating the conductive substrate from the resin-encapsulated semiconductor element and antenna circuit by dissolving only the covering metal layer, and covering the antenna circuit surface exposed from the resin-encapsulated portion with a protective layer, and then individually A method for manufacturing a non-contact type data carrier comprising the steps of cutting and separating the non-contact type data carrier.

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