JP3600137B2 - Circuit device manufacturing method - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing a circuit device, and more particularly to a method for manufacturing a thin circuit device that does not require a support substrate.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a circuit device set in an electronic device is used for a mobile phone, a portable computer, and the like, and therefore, a reduction in size, thickness, and weight is required.
[0003]
For example, taking a semiconductor device as an example of a circuit device, a general semiconductor device is a packaged semiconductor device sealed with a conventional transfer mold. This semiconductor device is mounted on a printed circuit board PS as shown in FIG.
[0004]
In this package type semiconductor device, the periphery of the semiconductor chip 2 is covered with a resin layer 3, and lead terminals 4 for external connection are led out from the side of the resin layer 3.
[0005]
However, in this package type semiconductor device 1, the lead terminals 4 are protruded from the resin layer 3, so that the overall size is large, and the size, thickness, and weight are not satisfied.
[0006]
For this reason, companies have competed to develop various structures in order to realize miniaturization, thinning and weight reduction, and recently called a CSP (chip size package), a wafer scale CSP equivalent to the chip size, or chip size A CSP with a size slightly larger than that has been developed.
[0007]
FIG. 11 shows a CSP 6 that employs a glass epoxy substrate 5 as a support substrate and is slightly larger than the chip size. Here, description will be made assuming that the transistor chip T is mounted on the glass epoxy substrate 5.
[0008]
A first electrode 7, a second electrode 8, and a die pad 9 are formed on the front surface of the glass epoxy substrate 5, and a first back electrode 10 and a second back electrode 11 are formed on the back surface. The first electrode 7 and the first back electrode 10 are electrically connected to each other, and the second electrode 8 and the second back electrode 11 are electrically connected to each other through the through hole TH. The bare transistor chip T is fixed to the die pad 9, the emitter electrode of the transistor is connected to the first electrode 7 via a thin metal wire 12, and the base electrode of the transistor and the second electrode 8 are connected to the thin metal wire 12. Connected through. Further, a resin layer 13 is provided on the glass epoxy substrate 5 so as to cover the transistor chip T.
[0009]
Although the CSP 6 employs the glass epoxy substrate 5, unlike the wafer scale CSP, the extending structure from the chip T to the back surface electrodes 10 and 11 for external connection is simple and has an advantage that it can be manufactured at low cost.
[0010]
The CSP 6 is mounted on a printed circuit board PS as shown in FIG. The printed circuit board PS is provided with electrodes and wiring constituting an electric circuit, and the CSP 6, the package type semiconductor device 1, the chip resistor CR or the chip capacitor CC and the like are electrically connected and fixed.
[0011]
The circuit formed by the printed circuit board is mounted in various sets.
[0012]
Next, a method of manufacturing the CSP will be described with reference to FIGS.
[0013]
First, a glass epoxy substrate 5 is prepared as a base material (support substrate), and Cu foils 20 and 21 are pressure-bonded to both surfaces thereof via an insulating adhesive. (See FIG. 12A above)
Subsequently, Cu foils 20 and 21 corresponding to the first electrode 7, the second electrode 8, the die pad 9, the first back surface electrode 10 and the second back surface electrode 11 are coated with an etching-resistant resist 22, The foils 20 and 21 are patterned. The patterning may be performed separately on the front and back sides. (See FIG. 12B above)
Subsequently, a hole for the through hole TH is formed in the glass epoxy substrate by using a drill or a laser, and the hole is plated to form the through hole TH. The first electrode 7 and the first back electrode 10 and the second electrode 8 and the second back electrode 10 are electrically connected by the through hole TH. (See FIG. 12C above)
Although not shown in the drawings, the first electrode 7 and the second electrode 8 serving as bonding posts are plated with Au, and the die pads 9 serving as die bonding posts are plated with Au, and the transistor chip T is die-bonded. I do.
[0014]
Finally, the emitter electrode of the transistor chip T and the first electrode 7, and the base electrode of the transistor chip T and the second electrode 8 are connected via a thin metal wire 12 and covered with a resin layer 13. (See FIG. 12D above)
By the above manufacturing method, a CSP type electric element using the support substrate 5 is completed. This manufacturing method is the same even when a flexible sheet is used as the support substrate.
[0015]
On the other hand, a manufacturing method using a ceramic substrate is shown in the flow of FIG. After a ceramic substrate as a support substrate is prepared, through holes are formed, and thereafter, front and rear electrodes are printed and sintered using a conductive paste. After that, until the resin layer of the previous manufacturing method is covered, the manufacturing method is the same as that of FIG. 12, except that the ceramic substrate is very fragile, and unlike a flexible sheet or a glass epoxy substrate, the ceramic substrate is immediately chipped and a mold is used. There is a problem that can not be molded. Therefore, after potting and hardening the sealing resin, polishing for flattening the sealing resin is performed, and finally, individual separation is performed using a dicing apparatus.
[0016]
Further, in the above-described microcircuit device such as the CSP type, it is general that the marking such as the product number is performed after being individually separated.
[0017]
[Problems to be solved by the invention]
In FIG. 11, the transistor chip T, the connection means 7 to 12 and the resin layer 13 are necessary components for electrical connection to the outside and protection of the transistor. It has been difficult to provide a circuit element that realizes reduction in thickness, thickness, and weight.
[0018]
Further, the glass epoxy substrate 5 serving as a support substrate is not necessary as described above. However, due to the manufacturing method, the glass epoxy substrate 5 was employed as a support substrate for bonding the electrodes, and the glass epoxy substrate 5 could not be eliminated.
[0019]
Therefore, the use of the glass epoxy substrate 5 increases the cost, and further, the glass epoxy substrate 5 is thick, so that the circuit element becomes thick, and there is a limit in reducing the size, thickness, and weight.
[0020]
Further, a through-hole forming step for connecting electrodes on both surfaces is indispensable for a glass epoxy substrate or a ceramic substrate, and there is a problem that the manufacturing process becomes long.
[0021]
Furthermore, since marking on individual circuit devices is performed after individual separation, it is necessary to determine the direction and front and back of the circuit device before performing the marking. There was also a problem that it took time to work.
[0022]
[Means for Solving the Problems]
The present invention has been made in view of the above-described many problems, prepares a conductive foil, and has a shallower than the thickness of the conductive foil on the conductive foil in a region excluding a conductive pattern forming at least a large number of circuit element mounting portions. Forming a separation groove to form a conductive pattern, fixing a circuit element to each of the mounting portions of the desired conductive pattern, and covering the circuit element of each mounting portion at a time; A step of performing common molding with an insulating resin so as to be filled in, a step of marking the surface of the insulating resin, and a step of separating the insulating resin by dicing for each mounting portion. And
[0023]
In the present invention, the conductive foil forming the conductive pattern is the starting material, and the conductive foil has a supporting function until the insulating resin is molded, and the insulating resin has the supporting function after the molding. The substrate can be eliminated, and the conventional problem can be solved.
[0024]
Further, in the present invention, since molding, marking and dicing can be performed for each block, a large number of circuit devices can be mass-produced, and the conventional problems can be solved.
[0025]
BEST MODE FOR CARRYING OUT THE INVENTION
First, a method for manufacturing a circuit device according to the present invention will be described with reference to FIG.
[0026]
The present invention provides a conductive foil, and forms a conductive pattern by forming a separation groove shallower than the thickness of the conductive foil in the conductive foil in a region excluding a conductive pattern in which at least a plurality of circuit element mounting portions are formed. A step of fixing circuit elements to the respective mounting portions of the desired conductive pattern, and a step of covering the circuit elements of the respective mounting portions collectively and using an insulating resin to fill the separation grooves. The method includes a step of molding, a step of marking the surface of the insulating resin, and a step of separating the insulating resin by dicing for each mounting portion.
[0027]
Although the flow shown in FIG. 1 does not coincide with the above-described steps, the formation of the conductive pattern is performed by three flows of Cu foil, Ag plating, and half etching. The bonding of the circuit element to each mounting portion and the connection of the electrode of the circuit element and the conductive pattern are performed by two flows of die bonding and wire bonding. In the transfer mold flow, a common mold using an insulating resin is performed. In the marking flow, marking is performed on the surface of the insulating resin for each block. In the flow for removing the back surface Cu foil, the conductive foil in the thickness portion having no separation groove is etched. In the flow of the back surface processing, the electrode processing of the conductive pattern exposed on the back surface is performed. In the dicing flow, individual circuit elements are separated from the insulating resin by dicing.
[0028]
Hereinafter, each step of the present invention will be described with reference to FIGS.
[0029]
In the first step of the present invention, as shown in FIGS. 2 to 4, a conductive foil 60 is prepared, and a conductive foil 60 is applied to at least the conductive foil 60 in a region excluding the conductive pattern 51 where a large number of mounting portions for the circuit elements 52 are formed. The purpose is to form a conductive pattern 51 by forming a separation groove 61 shallower than the thickness of the foil 60.
[0030]
In this step, first, as shown in FIG. 2A, a sheet-shaped conductive foil 60 is prepared. The material of the conductive foil 60 is selected in consideration of the adhesiveness, bonding property, and plating property of the brazing material. As the material, a conductive foil mainly containing Cu, a conductive foil mainly containing Al, or Fe -A conductive foil made of an alloy such as Ni is employed.
[0031]
The thickness of the conductive foil is preferably about 10 μm to 300 μm in consideration of the later etching, and here, a copper foil of 70 μm (2 oz) was employed. However, it is basically good to be 300 μm or more and 10 μm or less. As will be described later, it is only necessary that the separation groove 61 shallower than the thickness of the conductive foil 60 can be formed.
[0032]
In addition, the sheet-shaped conductive foil 60 is prepared by being wound in a roll shape with a predetermined width, for example, 45 mm, and may be conveyed to each step described later, or may be a strip shape cut to a predetermined size. The conductive foil 60 may be prepared and transported to each step described later.
[0033]
Specifically, as shown in FIG. 2B, four or five blocks 62 on which a large number of mounting portions are formed are arranged on the strip-shaped conductive foil 60 at a distance. Slits 63 are provided between the blocks 62 to absorb the stress of the conductive foil 60 generated by a heat treatment in a molding process or the like. Index holes 64 are provided at regular intervals at the upper and lower peripheral edges of the conductive foil 60, and are used for positioning in each step.
[0034]
Subsequently, a conductive pattern is formed.
[0035]
First, as shown in FIG. 3, a photoresist (etching mask) PR is formed on the Cu foil 60, and the photoresist PR is patterned so as to expose the conductive foil 60 excluding a region to be the conductive pattern 51. Then, as shown in FIG. 4A, the conductive foil 60 is selectively etched via the photoresist PR.
[0036]
The depth of the separation groove 61 formed by etching is, for example, 50 μm, and the side surface thereof is roughened, so that the adhesiveness to the insulating resin 50 is improved.
[0037]
The side wall of the separation groove 61 is schematically shown as a straight line, but has a different structure depending on the removing method. This removal step can employ wet etching, dry etching, laser evaporation, and dicing. In the case of wet etching, ferric chloride or cupric chloride is mainly used as an etchant, and the conductive foil is dipped in the etchant or showered with the etchant. Here, since the wet etching is generally performed non-anisotropically, the side surface has a curved structure.
[0038]
In the case of dry etching, anisotropic and non-anisotropic etching is possible. At present, it is said that it is impossible to remove Cu by reactive ion etching, but it can be removed by sputtering. In addition, anisotropic and non-anisotropic etching can be performed depending on sputtering conditions.
[0039]
In the case of a laser, the separation groove 61 can be formed by directly irradiating a laser beam. In this case, the side surface of the separation groove 61 is formed straight.
[0040]
In FIG. 3, a conductive film (not shown) having corrosion resistance to an etching solution may be selectively coated instead of the photoresist. When the conductive film is selectively applied to a portion to be a conductive path, the conductive film serves as an etching protective film, and the separation groove can be etched without employing a resist. Materials that can be considered as the conductive film include Ag, Ni, Au, Pt, and Pd. Moreover, these corrosion-resistant conductive films have a feature that they can be used as they are as die pads and bonding pads.
[0041]
For example, the Ag film adheres to Au and also adheres to the brazing material. Therefore, if the Au film is coated on the back surface of the chip, the chip can be thermocompression-bonded to the Ag film on the conductive path 51 as it is, and the chip can be fixed via a brazing material such as solder. Since the Au thin wire can be bonded to the Ag conductive film, wire bonding is also possible. Therefore, there is an advantage that these conductive films can be used as die pads and bonding pads as they are.
[0042]
FIG. 4B shows a specific conductive pattern 51. This figure corresponds to an enlarged one of the blocks 62 shown in FIG. 2B. One of the portions painted black is one mounting portion 65, which constitutes the conductive pattern 51, and one block 62 has a large number of mounting portions 65 arranged in a matrix of 5 rows and 10 columns. The same conductive pattern 51 is provided every 65. A frame-shaped pattern 66 is provided around each block, and a positioning mark 67 at the time of dicing is provided inside the pattern 66 slightly apart therefrom. The frame-shaped pattern 66 is used for fitting with a mold and has a function of reinforcing the insulating resin 50 after the back surface etching of the conductive foil 60.
[0043]
In the second step of the present invention, as shown in FIG. 5, the circuit elements 52 are fixed to the respective mounting portions 65 of the desired conductive patterns 51, and the electrodes of the circuit elements 52 of the respective mounting portions 65 and the desired conductive patterns 51 are formed. Is to form a connecting means for electrically connecting.
[0044]
The circuit element 52 is a semiconductor element such as a transistor, a diode, or an IC chip, or a passive element such as a chip capacitor or a chip resistor. Although the thickness is increased, a face-down semiconductor element such as CSP or BGA can be mounted.
[0045]
Here, a bare transistor chip 52A is die-bonded to the conductive pattern 51A, and an emitter electrode and the conductive pattern 51B, and a base electrode and the conductive pattern 51B are fixed by ball bonding by thermocompression bonding or wet bonding by ultrasonic waves or the like. Connected via 55A. Reference numeral 52B denotes a chip capacitor or a passive element, which is fixed with a brazing material such as solder or a conductive paste 55B.
[0046]
In this step, since a large number of conductive patterns 51 are integrated in each block 62, there is an advantage that the fixing of the circuit element 52 and the wire bonding can be performed very efficiently.
[0047]
In the third step of the present invention, as shown in FIG. 6, the circuit elements 52 of each mounting portion 63 are collectively covered, and are commonly molded with the insulating resin 50 so as to fill the separation grooves 61. .
[0048]
In this step, as shown in FIG. 6A, the insulating resin 50 completely covers the circuit elements 52A, 52B and the plurality of conductive patterns 51A, 51B, 51C. 50 is fitted to the curved structure on the side surface of the conductive patterns 51A, 51B, 51C filled therein, and is firmly coupled. The conductive pattern 51 is supported by the insulating resin 50.
[0049]
Also, this step can be realized by transfer molding, injection molding, or dipping. As the resin material, a thermosetting resin such as an epoxy resin can be realized by transfer molding, and a thermoplastic resin such as a polyimide resin and polyphenylene sulfide can be realized by injection molding.
[0050]
Further, when performing transfer molding or injection molding in this process, as shown in FIG. 6B, each block 62 is provided with the mounting portion 63 in one common mold, and one block of common insulating resin 50 is used for each block. Mold. For this reason, compared with a conventional method of individually molding each mounting portion such as transfer molding, the amount of resin can be significantly reduced, and a common mold can be used.
[0051]
The thickness of the insulating resin 50 coated on the surface of the conductive foil 60 is adjusted so as to cover about 100 μm from the top of the fine metal wire 55A of the circuit element 52. This thickness can be increased or reduced in consideration of strength.
[0052]
The feature of this step is that the conductive foil 60 serving as the conductive pattern 51 becomes a support substrate until the insulating resin 50 is covered. Conventionally, as shown in FIG. 12, the conductive paths 7 to 11 are formed by using the support substrate 5 which is not originally required. However, in the present invention, the conductive foil 60 serving as the support substrate is required as an electrode material. Material. Therefore, there is a merit that the operation can be performed while omitting the constituent materials as much as possible, and the cost can be reduced.
[0053]
Further, since the separation grooves 61 are formed shallower than the thickness of the conductive foil, the conductive foils 60 are not individually separated as the conductive patterns 51. Therefore, it can be handled as a sheet-shaped conductive foil 60 integrally, and when the insulating resin 50 is molded, it has a feature that the work of transporting to the mold and mounting on the mold becomes very easy.
[0054]
The fourth step of the present invention is to make a mark on the surface of the insulating resin 50 as shown in FIG.
[0055]
In this step, as shown in FIG. 7A, in a state in which four to five insulating resins 50 that are commonly molded are arranged at intervals in each of the blocks 62 where a large number of mounting portions are formed on the strip-shaped conductive foil 60. Then, the upper and lower peripheral edges of the conductive foil 60 are positioned by index holes 64, and the laser printing machine is used to mark the product number and the lot number.
[0056]
FIG. 7B is an enlarged view of the index hole 64, which has already been associated with the conductive pattern 51 of each mounting portion 65 in the first step described above. In this case, marking (ISB and printing in the figure) can be automatically performed on the surface of the insulating resin 50 of each mounting section 65.
[0057]
The feature of this process is that this marking can be performed for each block 62, and the alignment can be efficiently performed by simple alignment such as inserting a guide pin of a laser printer into the index hole 64. In addition, if the strip-shaped conductive foil 60 is used, large-scale printing can be performed in units of the strip-shaped conductive foil 60 by providing the laser printer with a feeding function for each block.
[0058]
In this step, since the marking is performed before the back surface of the conductive foil 60 is removed in the next step, the conductive foil 60 is also strong, there is little possibility of deformation, and even if impurities adhere during marking, it can be removed in the next step.
[0059]
In the fifth step of the present invention, as shown in FIG. 6, the thickness of the conductive foil 60 where the separation groove 61 is not provided is removed.
[0060]
In this step, the back surface of the conductive foil 60 is chemically and / or physically removed and separated as the conductive pattern 51. This step is performed by polishing, grinding, etching, laser metal evaporation, or the like.
[0061]
In the experiment, the entire surface was shaved by about 30 μm with a polishing device or a grinding device, and the insulating resin 50 was exposed from the separation groove 61. This exposed surface is indicated by a dotted line in FIG. As a result, the conductive patterns 51 having a thickness of about 40 μm are separated. Alternatively, the entire surface of the conductive foil 60 may be wet-etched before the insulating resin 50 is exposed, and then the entire surface may be ground by a polishing or grinding device to expose the insulating resin 50. Furthermore, the entire surface of the conductive foil 60 may be wet-etched to the dotted line to expose the insulating resin 50.
[0062]
As a result, a structure in which the back surface of the conductive pattern 51 is exposed to the insulating resin 50 is obtained. That is, the surface of the insulating resin 50 filled in the separation groove 61 and the surface of the conductive pattern 51 have a structure substantially coincident with each other. Therefore, since the circuit device 53 of the present invention does not have a step unlike the conventional back electrodes 10 and 11 shown in FIG. 11, the circuit device 53 has a feature that it can be horizontally moved by the surface tension of solder or the like during mounting and can be self-aligned. Have.
[0063]
Further, the back surface treatment of the conductive pattern 51 is performed to obtain the final structure shown in FIG. That is, a conductive material such as solder is applied to the exposed conductive pattern 51 as necessary to form the back electrodes 56A, 56B and 56C, thereby completing the circuit device.
[0064]
In the sixth step of the present invention, as shown in FIG. 9, the plurality of blocks 62 are attached to the adhesive sheet 80 with the surface of the insulating resin 50 in contact.
[0065]
After etching the back surface of the conductive foil 60 in the previous step, each block 62 is separated from the conductive foil 60. Since the block 62 is connected to the remaining portion of the conductive foil 60 by the insulating resin 50, it can be achieved by mechanically peeling off the remaining portion of the conductive foil 60 without using a cutting die.
[0066]
This step is a characteristic step of the present invention, in which the periphery of the adhesive sheet 80 is attached to a stainless steel ring-shaped metal frame 81, and four blocks 62 are attached to the central part of the adhesive sheet 80 at the time of dicing. The insulating resin 50 is affixed so as to be in contact with the insulating resin 50 at an interval such that the resin does not contact. As the adhesive sheet 80, a UV sheet (manufactured by Lintec Corporation) is used. Since each block 62 is made of the insulating resin 50 and has mechanical strength, an inexpensive dicing sheet can be used.
[0067]
In the seventh step of the present invention, as shown in FIG. 10, the insulating resin 50 of the block 62 is separated for each mounting portion 65 by dicing while being attached to the adhesive sheet 80.
[0068]
In this step, the plurality of blocks 62 stuck on the adhesive sheet 80 are sucked in vacuum on a mounting table of a dicing device, and the dicing blade 69 is used to insulate the separation grooves 61 along the dicing lines 70 between the mounting portions 65. The conductive resin 50 is diced and separated into individual circuit devices 53.
[0069]
In this step, the dicing blade 69 completely cuts the insulating resin 50, performs dicing at a cutting depth reaching the surface of the pressure-sensitive adhesive sheet, and completely separates each mounting portion 65. At the time of dicing, the positioning mark 67 inside the frame-shaped pattern 66 around each block previously provided in the first step is recognized, and dicing is performed based on this. As is well known, in dicing, after dicing all dicing lines 70 in the vertical direction, the mounting table is rotated by 90 degrees and dicing is performed according to the dicing lines 70 in the horizontal direction.
[0070]
Further, in this process, since only the insulating resin 50 filled in the separation groove 61 is present in the dicing line 70, the dicing blade 69 has a small amount of wear and does not generate metal burrs. .
[0071]
Further, even after this step and after dicing, the adhesive sheet 80 does not disintegrate into individual circuit devices due to the function of the pressure-sensitive adhesive sheet 80, so that the subsequent taping step can be performed efficiently. In other words, the circuit device integrally supported by the adhesive sheet 80 can identify only non-defective products and can be detached from the adhesive sheet 80 and accommodated in the accommodating hole of the carrier tape. For this reason, there is a feature that even a minute circuit device is not separated into pieces even before taping.
[0072]
【The invention's effect】
In the present invention, the conductive foil itself, which is the material of the conductive pattern, functions as a support substrate, and the whole is supported by the conductive foil until the separation groove is formed, the circuit element is mounted, and the insulating resin is attached. When the foil is separated as each conductive pattern, the insulating resin functions as a supporting substrate. Therefore, the circuit element, the conductive foil, and the insulating resin can be manufactured with the minimum necessary. As described in the conventional example, a support substrate is not required for originally configuring the circuit device, and the cost can be reduced. In addition, there is no need for a supporting substrate, the conductive pattern is embedded in the insulating resin, and the thickness of the insulating resin and the conductive foil can be adjusted, so that a very thin circuit device can be formed. There is also.
[0073]
Further, in the present invention, the marking can be performed for each block in a state where the insulating resin commonly molded for each block where a large number of mounting portions are formed on the strip-shaped conductive foil is arranged at a distance of 4 to 5 pieces. Thus, a large amount of printing can be performed for each block. Further, processing in units of the strip-shaped conductive foil 60 is also possible, and furthermore, mass printing can be performed.
[0074]
Further, in the present invention, since the upper and lower peripheral edges of the conductive foil are positioned and marked by the index holes, the laser printing apparatus having no identification function can be sufficiently performed.
[0075]
Further, there is an advantage that the processing can be performed with a plurality of blocks attached to the pressure-sensitive adhesive sheet in the dicing step. Further, in the dicing process, there is an advantage that the dicing line can be quickly and reliably recognized using the alignment mark. Furthermore, dicing may be performed by cutting only the insulating resin layer. By not cutting the conductive foil, the life of the dicing blade can be extended, and there is no generation of metal burrs generated when the conductive foil is cut.
[0076]
Furthermore, by adhering a plurality of blocks to the adhesive sheet 80, a minute circuit device can be processed without being broken up to the end, and a manufacturing method with extremely high mass production effect can be realized.
[0077]
Finally, as is clear from FIG. 14, the step of forming a through hole, the step of printing a conductor (in the case of a ceramic substrate), and the like can be omitted. Have the advantages that can be. In addition, no frame mold is required at all, and this is a manufacturing method with a very short delivery time.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a manufacturing flow of the present invention.
FIG. 2 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 3 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 4 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 5 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 6 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 7 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 8 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 9 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 10 is a diagram illustrating a method for manufacturing a circuit device according to the present invention.
FIG. 11 is a diagram illustrating a mounting structure of a conventional circuit device.
FIG. 12 is a diagram illustrating a conventional circuit device.
FIG. 13 is a diagram illustrating a conventional circuit device manufacturing method.
FIG. 14 is a diagram illustrating a method for manufacturing a conventional circuit device.
[Explanation of symbols]
Reference Signs List 50 insulating resin 51 conductive pattern 52 circuit element 53 circuit device 61 separation groove 62 block 64 index hole 80 adhesive sheet

Claims (7)

Forming a plurality of conductive patterns and alignment patterns on the conductive foil ,
Fixing a circuit element to each mounting portion of the conductive pattern of each block ;
A step of common mold with the insulation resin and the covering collectively the circuit elements of the mounting part for each block,
Exposing the conductive pattern and the alignment pattern of each block from the back surface,
Separating the common molded blocks,
Affixing the plurality of blocks to an adhesive sheet, separating the insulating resin by dicing using the alignment pattern provided on each block, and separating the insulating resin into individual circuit devices. A method for manufacturing a circuit device, comprising: The method according to claim 1, wherein the conductive pattern and the alignment pattern are formed by etching the conductive foil. 3. The method according to claim 1, wherein the alignment pattern is provided around each of the blocks so as to surround the conductive pattern. 4. 2. The method according to claim 1, wherein one or both of a semiconductor bare chip and a chip circuit component are fixed to the circuit element. 2. The method according to claim 1, wherein the insulating resin is attached by transfer molding. 2. The method according to claim 1, wherein a plurality of blocks in which a plurality of conductive patterns forming at least a plurality of circuit element mounting portions are arranged in a matrix are arranged on the conductive foil. The method according to claim 5, wherein the insulating resin is attached to each of the blocks by transfer molding.

Images