JP2009122783A - Ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag having flexibility which is high in strength and durability against an external force, which is high in bonding strength, and which is excellent in thermal resistance, water resistance, chemical resistance, environmental resistance, and weather resistance. <P>SOLUTION: An inlet 2 equipped with an IC chip 11 and an antenna 12 is held by vertically arranging fiber configuring body sheets 3 and 4 configured by orienting fiber raw elements as reinforcing members. Furthermore, elastic body sheets 5 and 6 made of rubber materials as protecting members are vertically arranged and covered. Then, the inlet 2 and the fiber configuring bodies 3 and 4 and the elastic body sheets 5 and 6 are bonded by elastic adhesive, and an IC tag having flexibility is configured as a laminate body. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an IC tag that is flexible to bending and pulling and has high adhesive strength, and further to an IC tag excellent in heat resistance, water resistance, chemical resistance, environmental resistance, and weather resistance.

  In recent years, electronic tags that can read and write information from the outside by wireless communication, so-called IC tags, are used for various purposes. The IC tag generally has an inlet composed of an IC chip having a memory function and an antenna, and is used in a form that is secondarily processed according to the application. For example, what was hard-processed by enclosing an inlet in a synthetic resin such as ABS or polyethylene terephthalate (PET) has been put into practical use as a product tag or an ID (IDentifier) card.

Here, when the IC tag is attached to the surface of a flexible article such as a document, clothing, etc., or wound around a leg of a pig, cow, etc. like a band, and managing individual information thereof. The secondary processed product of the IC tag needs to be flexible, that is, flexible.
Conventionally, such an IC tag is one in which an inlet is encapsulated in an elastic body such as a synthetic resin or rubber having flexibility, and a laminate (pouch) processed by sandwiching the inlet with a thin synthetic resin sheet (Patent Document) 1) is known.

JP 2006-341903 A

  However, as described above, the one in which the inlet is encapsulated in the elastic body and the one laminated with the synthetic resin sheet are frequently applied when a strong external force such as bending or pulling is applied to the IC tag. There was a problem in strength and durability against external force, such as the inlet being easily broken.

  In addition, when an IC tag is attached to the surface of an article and used, the conventional IC tag has a smooth surface, so it is difficult to increase the adhesive strength. There was a problem that the adhesive strength was reduced and the film was peeled off.

  Furthermore, when exposed to steam, chemicals, etc. that disinfects and cleans clothing, etc., it is exposed to high heat resistance, water resistance, chemical resistance, etc. in an environment where it comes into contact with feed, manure, etc. In some cases, high environmental resistance is required, and when used outdoors, weather resistance against ultraviolet rays and ozone is required. However, since conventional IC tags are coated with a synthetic resin such as PET or rubber, there are problems in heat resistance, chemical resistance, environmental resistance, weather resistance, and the like.

  The present invention has been made in view of the above-described conventional problems, and has high strength and durability against external forces such as bending and pulling, and high adhesive strength, as well as heat resistance, water resistance, chemical resistance, An object of the present invention is to provide a flexible IC tag excellent in environmental resistance and weather resistance.

  The inventor firstly has a flexible IC tag which is excellent in strength and durability against external forces such as bending and pulling, and excellent in heat resistance, water resistance, chemical resistance, environmental resistance and weather resistance. The new structure of this was studied earnestly.

As a result, the inventor focused on an elastic sheet excellent in heat resistance and chemical resistance as having flexibility, and examined its application as an inlet protective material.
On the other hand, from the viewpoint of improving the strength and durability against external force, the inventors have conceived of providing a reinforcing material for the elastic sheet, and studied the use of a fiber component sheet as the reinforcing material.

  Next, further examination was conducted on how to apply the elastic sheet and the fiber structure sheet to the inlet to form a flexible IC tag.

  As a result, the inventor of the present invention, the elastic adhesive (binder) soaks into the voids of the fiber structure sheet due to its unique wettability, and suitably covers the inlet, and the elastic sheet and the fiber structure sheet As a result of finding out that it can be suitably bonded, it has been found that an integrally molded product obtained by laminating an inlet, a fiber component sheet, and an elastic sheet can be produced, and the present invention has been conceived.

  That is, the IC tag of the present invention is formed by integrally forming an inlet with a fiber component sheet as a reinforcing material and an elastic sheet as a protective material, and adhering and laminating them with an elastic adhesive (binder). It is characterized by composing a product.

  Hereinafter, a preferred embodiment of an IC tag of the present invention will be specifically described with reference to the drawings.

  As shown in FIGS. 1 to 3, an IC tag 1 according to an embodiment of the present invention includes an inlet 2, fiber constituent sheets 3 and 4, elastic sheets 5 and 6, and adhesive layers 7, 8, 9, and 10. Composed.

  As shown in FIG. 2, the inlet 2 includes an IC chip 11 having a memory function and an antenna 12 in which a conductive wire 13 such as copper is wound in a coil shape. The other end is bent inward, and the IC chip 11 is fixed thereto.

As shown in FIGS. 2 to 4, the fiber component sheets 3 and 4 are formed by cutting a woven sheet material 14 formed by weaving a fiber bundle 15 in which a plurality of fiber materials are bundled vertically and horizontally into a circular shape. .
The fiber structure sheets 3 and 4 have the same structure, but when the IC tag 1 is configured, as shown in FIG. 5, the orientation directions of the fiber materials constituting the fiber structure sheets 3 and 4 are It is offset by 45 °.

  As the fiber material constituting the woven sheet material 14, polyester fiber, polyamide fiber, polypropylene fiber, polyvinyl chloride fiber, polyethylene fiber, aramid fiber, carbon fiber, glass fiber, etc., which are non-elastic bodies, can be used. In particular, it is preferable to use an aramid fiber or glass fiber. Further, not only one kind of these fibers but also a plurality of kinds may be mixed and used.

  As shown in FIGS. 2, 3 and 6, the elastic sheets 5 and 6 are obtained by cutting the elastic sheet material 16 into a disk shape.

  Examples of the elastic sheet material 16 include heat resistance, water resistance, chemical resistance, environmental resistance, weather resistance, etc., such as thermoplastic elastomers such as butyl rubber, acrylic rubber, silicon rubber, ethylene propylene copolymer elastomer, and styrene butadiene elastomer. Although it is possible to use an excellent rubber material, it is particularly preferable to use silicon rubber.

  As shown in FIG. 3, the adhesive layers 7, 8, 9, and 10 harden the elastic adhesive (binding agent) to bond the inlet 2, the fiber constituent sheets 3 and 4, and the elastic sheets 5 and 6. It is formed by making it.

  As an elastic adhesive (binder), synthetic rubber adhesives such as chloroprene rubber adhesives and nitrile rubber adhesives, silicon rubber adhesives, etc. can be used. It is preferable to use an agent.

  The IC tag 1 of the present invention has the above-described configuration and can be manufactured as follows.

  First, as shown in FIG. 7, from above and below the inlet 2, the woven sheet materials 141 and 142 coated with an elastic adhesive are brought into contact with the surface on the abutting side, and the inlet 2 is woven with the woven sheet materials 141 and 142. Hold it.

  Next, as shown in FIG. 7, from the upper side of the woven sheet material 141, the elastic sheet material 161 having an elastic adhesive applied to the surface on the abutting side is applied to the surface on the abutting side from the lower side of the woven sheet material 142. An elastic sheet material 162 coated with an elastic adhesive is brought into contact with the fabric sheet materials 141 and 142, and the elastic sheet materials 161 and 162 are sandwiched between the elastic sheet materials 161 and 162. As shown in FIG. Constitute.

  Finally, the IC tag 1 can be manufactured as shown in FIG. 9 by punching the IC tag laminated sheet material 17 into a disk shape by a punching die.

Since the IC tag 1 of the present invention has a structure in which the inlet 2 is covered with the fiber constituent sheets 3 and 4 and the elastic sheets 5 and 6, the elastic sheets 5 and 6 can ensure sufficient flexibility. In addition, the fiber component sheets 3 and 4 can sufficiently reinforce the external force.
Therefore, even when an external force such as bending or pulling is applied, the stress is dispersed and the force applied to the IC chip 11 that is weakest against the external force can be relaxed, and the strength and durability against external force and impact can be reduced. It can be greatly improved.

The woven fabric has a small elongation rate with respect to the external force in the fiber orientation direction, but deforms due to the displacement of the external force in the direction of 45 ° with respect to the fiber orientation direction. In order to solve this drawback, in the two upper and lower fiber constituent sheets 3 and 4 made by weaving warp and weft made of a fiber material having a low elongation rate, the fibers constituting the respective fiber constituent sheets 3 and 4 The orientation direction of the material was configured to deviate by 45 °. With this configuration, the fiber material is oriented in the vertical direction, the horizontal direction, and the oblique 45 ° direction, and the elongation can be reduced with respect to the tensile force in any direction. Can be minimized.
Therefore, a situation in which a tensile force is applied to the inlet 2 and the inlet 2 is easily damaged does not occur.

As shown in FIG. 10, when the IC tag 1 of the present invention is bent, the fiber component sheets 3 and 4 and the elastic sheet 5 and 6 have sufficient flexibility, and the effect of their thickness is also achieved. In addition, the radius of curvature of the bent portion is sufficiently large. Therefore, the minimum bending radius r of the inlet 2 arranged in the center can be suppressed to almost half of the thickness d of the IC tag 1, and only bending stress within an allowable range is generated in the inlet 2.
Therefore, an excessive stress is not applied to the coupling portion between the IC chip 11 and the antenna 12, and the coupling is not cut, and the inlet 2 can be protected from damage.

  The above-described effects are particularly remarkable in the inlet 2 in a form in which the IC chip 11 and the wound antenna 12 are coupled. Since the inlet 2 having the wound antenna 12 has no base material for fixing the IC chip 11 and the antenna 12, when the external force is applied to the coupling portion between the IC chip 11 and the antenna 12, the coupling portion is easily formed. This is because they are peeled off and cut off.

  In the IC tag 1 according to the present invention, since the fiber constituent sheets 3 and 4 and the elastic body sheets 5 and 6 are bonded by the elastic adhesive, the elastic adhesive soaks into the space between the textures of the fiber constituent sheets 3 and 4. The fiber constituent sheets 3 and 4 and the elastic body sheets 5 and 6 are completely integrated, and each layer does not peel off.

  The IC tag 1 of the above embodiment is configured by laminating the inlet 2, the fiber constituent sheets 3 and 4 and the elastic body sheets 5 and 6, but as shown in FIG. Alternatively, the IC tag 21 may be configured by laminating the inlet 2, the fiber component sheets 3 and 4, and the elastic sheet 6.

  In the IC tag 21, when the elastic adhesive is cured without completely soaking into the spaces between the textures of the fiber constituent sheet 3 exposed on the surface, and the adhesive is applied to the surface later, the fiber constituent sheet 3 You may make it leave the room where an adhesive penetrate | infiltrates easily in the space between these weaves.

  According to this, when the IC tag 21 is attached to the surface of the article as the adherend with the elastic adhesive, the elastic adhesive easily soaks into the space between the textures of the fiber constituent sheet 3. The adhesive strength between the tag 21 and the article that is the adherend can be increased.

  In addition, as shown in FIG. 12, the IC tag 31 may be configured by laminating the inlet 2 and the fiber component sheets 3 and 4 without using both the elastic sheets 5 and 6.

  In the IC tag 31, it is preferable that the elastic adhesive is completely infiltrated into the space between the textures of at least one of the fiber constituent sheets 3 and 4, and furthermore, at least one of the fiber constituent sheets 3 and 4. You may make it apply | coat an elastic body adhesive agent on the surface of this.

  According to this, in place of the presence of the elastic body sheets 5 and 6, the elastic body soaked in the space between the weaves of the fiber constituent sheets 3 and 4 or applied to the surface of the fiber constituent sheets 3 and 4 The presence of the adhesive can impart flexibility to the IC tag 31.

  Further, as shown in FIG. 13, both the elastic sheets 5 and 6 are not used, but the inlet 2, the coarse fiber structure sheets 3A and 4A, and the fine fiber structure sheets 3B and 4B are laminated. Thus, the IC tag 41 may be configured.

  In the IC tag 41, it is preferable that the elastic adhesive is completely infiltrated into the space between the textures of the coarse fiber structure sheets 3A and 4A, and further, the fine fiber structure of at least one of the textures. An elastic adhesive may be applied to the surfaces of the body sheets 3B and 4B.

  According to this, instead of the presence of the elastic sheets 5 and 6, the fiber structure sheet 3 </ b> B soaked in the space between the textures of the coarse fiber structure sheets 3 </ b> A and 4 </ b> A, or the fine textured fiber structure sheet 3 </ b> B, Flexibility can be imparted to the IC tag 41 by the presence of the elastic adhesive applied to the surface of 4B.

  As shown in FIGS. 14 and 15, an IC tag 51 according to another embodiment of the present invention includes an inlet 52, fiber constituent sheets 53 and 54, elastic sheets 55 and 56, and an adhesive layer interposed therebetween. Is done.

  As shown in FIG. 15, the inlet 52 includes an IC chip 57 having a memory function and an antenna 58 in which a highly conductive wiring pattern 59 such as aluminum is printed on a synthetic resin film 60 such as PET. An IC chip 57 is fixed to one end and the other end of the pattern 59.

  As shown in FIG. 15, the fiber component sheets 53 and 54 are obtained by cutting the fabric sheet material 14 having the same configuration as the IC tag 1 into a band shape. As with the IC tag 1, when the IC tag 51 is configured, the orientation directions of the fiber materials constituting the fiber component sheets 53 and 54 are shifted by 45 °.

  As shown in FIG. 15, the elastic sheets 55 and 56 are formed by cutting the elastic sheet material 16 having the same configuration as the IC tag 1 into a band shape.

  The adhesive layer is formed by curing the elastic adhesive and bonding the inlet 52, the fiber constituent sheets 53 and 54, and the elastic sheets 55 and 56 together.

  The IC tag 51 of the present invention has the above-described configuration, and can be manufactured through the same process as the IC tag 1 described above.

  The IC tag 51 of the present invention can also exhibit the same operations and effects as the IC tag 1 and can constitute a modification similar to the IC tag 1.

Since the inlet 52 having a band shape in which the antenna 58 including the wiring pattern 59 is printed on the synthetic resin film 60 and the IC chip 57 is mounted has a drawback that it is weak against a tensile force in the longitudinal direction, the fiber constituent sheet 53, Instead of 54, it is sufficient to orient the fiber material made of inelastic material in the longitudinal direction.
However, considering the ease of manufacture of the IC tag 51, it is preferable to use the fiber component sheets 53 and 54.

  The fiber component sheets 3 and 4 do not necessarily need to be formed from the woven sheet material 14 formed by weaving the fiber bundle 15 in which a plurality of fiber materials are bundled vertically and horizontally, for example, a fiber made of an inelastic material. You may make it form from the open sheet material which impregnated the synthetic resin to what orientated the raw material in one direction, and was hardened.

  Furthermore, if an elastic sheet that abuts the inlets 2 and 52 is added, and a recess for accommodating the IC chips 2 and 57 is formed in the elastic sheet, a structure that further enhances resistance to external force can be obtained. .

If the identification numbers of the inlets 2 and 52 are engraved on the surface of the IC tags 1 and 51, even if the inlets 2 and 52 are damaged and the internal data cannot be read, the IC The tags 1 and 51 can be specified.
Even when a new IC tag is exchanged, data can be recovered by associating the identification number of the new IC tag with the corresponding data on the server.

  Note that a manufacturer provides a unique ID (UID) that is a read-only ID for uniquely identifying an IC tag when the IC chip is manufactured. If this UID is used as an identification number, this number is convenient because there is only one in the world.

[Example 1]
As shown in FIG. 13, the diameter of the test piece E was obtained by bonding and laminating the inlet 2, the coarse fiber structure sheets 3 </ b> A and 4 </ b> A, and the fine fiber structure sheets 3 </ b> B and 4 </ b> B with an elastic adhesive. An IC tag 41 having a thickness of 18 mm and a thickness of 1.2 mm was produced.
The inlet 2 has a wound antenna, and an RFID inlet having a transmission frequency of 13.56 MHz and a diameter of 12.7 mm was used. Coarse fiber structure sheet 3A textured, 4A is a glass fiber woven vertically and horizontally, thickness 0.24 mm, having a mass 198 g / ^{m 2,} a fine fiber structure sheet 3B textured, 4B are glass fibers Was used which had a thickness of 0.18 mm and a mass of 203 g / m ² . The elastic adhesive used was an RTV silicone rubber adhesive.

[Comparative Example 1]
An IC tag having a diameter of 18 mm and a thickness of 1.2 mm, in which the inlet 2 and the elastic sheets 5 and 6 were bonded and laminated with an adhesive, was prepared as the product C to be tested.
The inlet 2 has a wound antenna, and an RFID inlet having a transmission frequency of 13.56 MHz and a diameter of 12.7 mm was used. As the elastic sheets 5 and 6, urethane rubber having a thickness of 0.5 mm was used. The adhesive used was a urethane rubber adhesive.

[Tensile strength test]
When EUT was pulled by a tensile testing machine, it was not damaged up to 343 N / 25 mm in the vertical direction and 294 N / 25 mm in the horizontal direction. Moreover, when the communicable distance of the product E to be tested was measured with a tag reader, it was good at 53 mm before and after the test.
The product under test C was pulled in the same manner, but was broken before reaching the load.

[Bending strength test]
As shown in FIG. 14, when the E to-be-tested product was bent left and right, it was not damaged even if it was bent 250 times each left and right. Moreover, when the communicable distance of the product E to be tested was measured with a tag reader, it was good at 53 mm before and after the test.
The product under test C was also bent in the same manner, and it was not damaged even if it was bent 250 times to the left and right. However, when the communicable distance of the product under test C was measured with a tag reader, it was not possible to communicate after the test.

[Heat resistance test]
When the product E was left in air at 200 ° C. for 200 hours, there was no particular problem in appearance without melting or deformation. Moreover, when the communicable distance of the product E to be tested was measured with a tag reader, it was good at 53 mm before and after the test.
In the same way, when the product to be tested C was left in the air at 200 ° C., it soon became melted and deformed and could not be used.

[Water resistance test]
When the product E to be tested was immersed in a container filled with pure water and washed with an ultrasonic cleaner for 1 hour, there was no particular problem in appearance without melting or deformation. Moreover, when the communicable distance of the product E to be tested was measured with a tag reader, it was good at 53 mm before and after the test.
Similarly, the product under test C was cleaned with an ultrasonic cleaner for 1 hour. As a result, the surface of the product C collapsed and became unusable.

(A) of the IC tag of one Example of this invention is a top view, (B) is a front view. It is the top view which decomposed | disassembled the IC tag shown in FIG. 1 into each structural member. It is a partial expanded sectional view of the IC tag shown in FIG. It is a partially expanded plan view of a woven fabric sheet material that is a constituent material of an IC tag. It is a partially expanded plan view which shows the relationship of the orientation direction of the fiber raw material in the fiber structure sheet | seat arrange | positioned up and down. It is a perspective view of the elastic body sheet material which is a constituent material of an IC tag. It is the perspective view disassembled into each constituent material required when manufacturing the IC tag shown in FIG. It is a perspective view of the lamination sheet material for IC tags used as the material at the time of manufacturing the IC tag shown in FIG. It is a perspective view of the IC tag shown in FIG. It is sectional drawing of the state which bent the IC tag shown in FIG. 1 in the center. In the IC tag shown in FIG. 1, (A) of the IC tag configured without using one elastic sheet is a plan view, and (B) is a plan view disassembled into each component. In the IC tag shown in FIG. 1, (A) of the IC tag configured without using both elastic sheets is a plan view, and (B) is a plan view disassembled into each component. In the IC tag shown in FIG. 1, (A) is a plan view and (B) is a plan view of an IC tag configured by laminating fiber constituent sheets having different mesh roughness without using both elastic sheets. It is the top view decomposed | disassembled into the structural member. (A) of the IC tag of the other Example of this invention is a top view, (B) is a front view. It is the top view which decomposed | disassembled the IC tag shown in FIG. 14 into each structural member. It is explanatory drawing which shows the method of the bending strength test of an IC tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC tag 2 Inlet 3, 4 Fiber structure sheet 5, 6 Elastic body sheet 7, 8, 9, 10 Adhesive layer 11 IC chip 12 Antenna 14 Textile sheet material 15 Fiber bundle 21 IC tag 31 IC tag 41 IC tag 3A , 4A Coarse-textured fiber constituent sheet 3B, 4B Fine-textured fiber constituent sheet 51 IC tag 52 Inlet 53, 54 Fiber constituent sheet 55, 56 Elastic body sheet 57 IC chip 58 Antenna

Claims (12)

  An inlet comprising an IC chip and an antenna is sandwiched by arranging a fiber structure sheet formed by orienting the fiber material up and down, and an elastic sheet made of a rubber material is arranged up and down to cover the inlet. The IC tag is characterized in that the inlet, the fiber component sheet, and the elastic sheet are bonded with an elastic adhesive to form a laminate.   An inlet comprising an IC chip and an antenna is sandwiched by vertically arranging a fiber component sheet formed by orienting fiber materials, and an elastic sheet made of a rubber material is disposed on either the upper or lower side. The IC tag is characterized in that a laminated body is formed by coating the inlet, the fiber component sheet, and the elastic sheet with an elastic adhesive.   An inlet comprising an IC chip and an antenna, a fiber constituent sheet formed by orienting a fiber material is vertically disposed and sandwiched, and the inlet and the fiber constituent sheet are bonded by an elastic adhesive, An IC tag comprising a laminated body.   4. The IC tag according to claim 1, wherein the fiber component sheet is made of a woven sheet material formed by weaving a fiber bundle obtained by bundling a plurality of fiber materials vertically and horizontally.   5. The IC tag according to claim 1, wherein the fiber material is a fiber material having excellent heat resistance, chemical resistance, environmental resistance, weather resistance, and the like and having a small elastic coefficient.   The fiber material is one of glass fiber, polyester fiber, polyamide fiber, polypropylene fiber, polyvinyl chloride fiber, polyethylene fiber, aramid fiber or carbon fiber, or a mixture of a plurality of types. The IC tag according to claim 5.   7. The IC tag according to claim 1, wherein the rubber material is a rubber material excellent in heat resistance, chemical resistance, environment resistance, weather resistance, and the like.   8. The IC tag according to claim 7, wherein the rubber material is a thermoplastic elastomer such as silicon rubber, butyl rubber, acrylic rubber, ethylene propylene copolymer elastomer, or styrene butadiene elastomer. 9.   9. The IC tag according to claim 1, wherein the elastic adhesive is a synthetic rubber adhesive such as a silicon rubber adhesive, a chloroprene rubber adhesive, or a nitrile rubber adhesive.   The IC tag according to any one of claims 1 to 9, wherein the fiber constituent sheet is disposed so that an orientation direction of a fiber material constituting each fiber constituent sheet disposed above and below is shifted by 45 °.   11. The IC tag according to claim 1, wherein the two fiber constituent sheets are arranged vertically, and the texture of the two fiber constituent sheets is made different. 11. .   The space between the textures of the fiber composition sheet exposed on the surface is cured without completely soaking the elastic adhesive, and when the adhesive is applied from the surface later, the space between the textures of the fiber structure sheet The IC tag according to any one of claims 2 to 11, wherein there remains room for the adhesive to soak.

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