JP2020027559A - Rfid tag buried object and manufacturing method of the same - Google Patents

Abstract

To provide an RFID tag buried object which is hardly influenced from a metal at communication with a reader and can be securely fixed to the surface of the metal, and a manufacturing method thereof.SOLUTION: The invention relates to an RFID tag buried object 1 which is fixed to a metal M, and includes a sheet 10 made of silicone based elastomer, and an RFID tag 15 which corresponds to non-metal and is inwardly buried from a surface of the sheet 10 to a position not reaching the surface of the metal M, and also relates to a manufacturing method of the same. In the RFID tag buried object 1, the RFID tag 15 includes one or two or more first fixation means 20 to be fixed to the sheet 10.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an embedded RFID tag and a method for manufacturing the same.

  An RFID tag is a component for recognizing information stored in the tag by short-range wireless communication. In recent years, for example, traceability of goods and the like in distribution, recording of producer information of agricultural products, and books in libraries and the like have been used in recent years. It is also used for management and other purposes. An RFID tag usually has an antenna and a memory, and further includes an active tag that has a built-in battery and can communicate by itself, a passive tag that can receive and receive radio waves from an external reader without a built-in battery, and both. Semi-active tags that combine the functions of Among these tags, passive tags have a simple configuration without a battery, and thus have been frequently used as inexpensive and easily miniaturized tags.

  By the way, when the RFID tag is fixed on a metal surface, the radio wave from the reader is reflected on the metal surface, and the radio wave radiated from the RFID tag generates an eddy current on the metal surface, so that the radio wave is reflected from the metal surface. There is a problem that waves are emitted and it is extremely difficult to detect radio waves from the RFID tag. In order to solve such a problem, various metal-compatible RFID tags have been conventionally developed.

  For example, a technique is known in which a magnetic material is sandwiched between an RFID tag and a metal surface, and magnetic flux emitted from the metal surface is drawn into the magnetic material, thereby reducing the effect of the metal (see Patent Document 1). ).

JP 2007-233824

  However, the above-described conventionally known metal-compatible RFID tags require the addition of a component called a magnetic material, which may increase the price of the RFID tags. On the other hand, when fixing a non-metallic RFID tag to a metal surface, it is necessary to fix the RFID tag with a sufficient distance between the RFID tag and the metal surface, such as a metal surface having irregularities or a metal having a large curvature. There is a problem that it is difficult to firmly fix to various metal surfaces such as surfaces.

  The present invention is based on the premise that a non-metallic RFID tag is used so as not to cause a high price due to the use of a metal-compatible RFID. An object of the present invention is to provide an embedded RFID tag that can be fixed firmly by using the same, and a method for manufacturing the same.

(1) In order to achieve the above object, an embedded RFID tag according to an embodiment of the present invention is an embedded RFID tag that is fixed to a metal, and includes a sheet of a silicone-based elastomer and an interior from the surface of the sheet. And a non-metal-compatible RFID tag that is buried to a position that does not reach the surface of the metal, and the RFID tag includes one or more first fixing means for fixing to the sheet.

(2) In the RFID tag embedded body according to another embodiment, preferably, the RFID tag includes a hole as the first fixing means, and at least a part including the hole is embedded in the sheet.

(3) In the RFID tag embedded body according to another embodiment, preferably, the RFID tag serves as the first fixing means on at least a part of a surface facing the metal, the first tag protruding in the metal direction. A projection is provided, and at least a part including the first projection is embedded in the sheet.

(4) In the RFID tag buried body according to another embodiment, preferably, the RFID tag serves as the first fixing means at least a portion of a surface opposite to a surface facing the metal and the metal is provided with the metal. A second protrusion protruding in the opposite direction is provided, and at least a portion including the second protrusion is embedded in the sheet.

(5) In the RFID tag embedded body according to another embodiment, preferably, the RFID tag includes, as the first fixing means, at least a part of a side surface of a third convex portion protruding outward from the side surface. At least a part including the third convex portion is embedded in the sheet.

(6) In the RFID tag embedded body according to another embodiment, preferably, the RFID tag includes, as the first fixing means, a screw portion spirally wound around a peripheral surface, and includes the screw portion. At least a portion is embedded in the sheet.

(7) The embedded RFID tag according to another embodiment preferably includes second fixing means for fixing the RFID tag to the sheet, and the second fixing means is a needle-like member.

(8) In the RFID tag embedded body according to another embodiment, preferably, the second fixing means is a non-metallic member.

(9) In the RFID tag embedded body according to another embodiment, preferably, the silicone-based elastomer is a moisture-cured silicone-based elastomer.

(10) A method for manufacturing an embedded RFID tag according to one embodiment of the present invention is a method for manufacturing an embedded RFID tag according to any one of the above, wherein a curable silicone-based adhesive layer is attached to a metal surface. An adhesive layer attaching step of attaching, and at least a portion of the non-metal-compatible RFID tag including the first fixing means to a position not reaching the surface of the metal from the surface of the curable silicone-based adhesive layer toward the inside. An RFID tag embedding step of embedding and a curing step of curing the curable silicone-based adhesive layer to form a silicone-based elastomer sheet are included.

(11) In the RFID tag embedded body according to another embodiment, preferably, the RFID tag is a method for manufacturing an RFID tag embedded body having a hole as the first fixing means, wherein the RFID tag embedding step includes: At least the hole portion of the RFID tag is completely embedded in the curable silicone-based adhesive layer.

(12) In a method of manufacturing an embedded RFID tag according to another embodiment, preferably, a fixing step of fixing the RFID tag embedded in the curable silicone-based adhesive layer to the adhesive layer by a second fixing means. In the curing step, the curable silicone adhesive layer to which the RFID tag is fixed by the second fixing means is cured to form a silicone elastomer sheet.

  According to the present invention, it is assumed that a non-metallic RFID tag is used so as not to cause a high price due to the use of a metal-compatible RFID. And an RFID tag embedded body that can be firmly fixed to the RFID tag and a method of manufacturing the same.

FIG. 1 shows a partially exploded perspective view (1A) of a situation where an embedded RFID tag according to the first embodiment of the present invention is provided on a metal surface, a top view (1B) of the embedded RFID tag, and a modification. A top view (1C) of the embedded RFID tag is shown. FIG. 2 is a cross-sectional view (2A) of the metal provided with the embedded RFID tag of FIG. 1 (1B) cut in the thickness direction thereof, and FIG. 2 is a cross-sectional view of the metal provided with the embedded RFID tag of FIG. 1 (1C). A cut-away cross-sectional view (2B) and a schematic transmission plan view (2C) of the RFID tag constituting the embedded RFID tag in FIG. 1 are shown, respectively. FIG. 3 is a flowchart (3A) of the method of manufacturing the embedded RFID tag according to the first embodiment of the present invention, a cross-sectional view (3B) of the manufacturing process of the embedded RFID tag of FIG. 1 (1B), and FIG. 1C) is a cross-sectional view (3C) of the manufacturing process of the RFID tag embedded body, respectively. FIG. 4 is a cross-sectional view (4A) of the embedded RFID tag according to the second embodiment of the present invention, which is the same as FIG. 2 (2A), and a cross-sectional view (4B) of the manufacturing process of the embedded RFID tag. . FIG. 5 is a cross-sectional view of the RFID tag-embedded body according to the third embodiment of the present invention, taken along the line of FIG. FIG. 6 shows a top view of the RFID tag embedded body according to the fourth embodiment of the present invention. FIG. 7 shows a cross-sectional view (7A) of the embedded RFID tag according to the fifth embodiment of the present invention, as viewed in FIG. 2 (2A), and a cross-sectional view (7B) of the manufacturing process of the embedded RFID tag. .

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each embodiment described below does not limit the invention according to the claims. In addition, not all of the elements and combinations described in the embodiments are essential to the solution of the present invention. In each of the embodiments, the same reference numerals are used for components having the same basic configuration and features over the embodiments, and description thereof may be omitted.

1. RFID tag embedded body (first embodiment)
FIG. 1 shows a partially exploded perspective view (1A) of a situation where an embedded RFID tag according to the first embodiment of the present invention is provided on a metal surface, a top view (1B) of the embedded RFID tag, and a modification. A top view (1C) of the embedded RFID tag is shown. FIG. 2 is a cross-sectional view (2A) of the metal provided with the embedded RFID tag of FIG. 1 (1B) cut in the thickness direction thereof, and FIG. 2 is a cross-sectional view of the metal provided with the embedded RFID tag of FIG. 1 (1C). A cut-away cross-sectional view (2B) and a schematic transmission plan view (2C) of the RFID tag constituting the embedded RFID tag in FIG. 1 are shown, respectively.

  The embedded RFID tag body 1 according to the first embodiment is a member fixed to a metal M, and includes a sheet 10 of a silicone-based elastomer and a position from the surface of the sheet 10 toward the inside and not reaching the surface of the metal M. A non-metallic RFID tag 15 to be embedded. Further, the RFID tag 15 includes a hole 20 for fixing the RFID tag to the sheet 10. Further, the embedded RFID tag body 1 may include a fixing member 25 (an example of a second fixing unit) for fixing the RFID tag 15 to the sheet 10. FIG. 1 shows a state in which the RFID tag 15 and the fixing member 25 are separated from the embedded RFID tag 1. Hereinafter, the sheet 10, the RFID tag 15, and the fixing member 25 will be described in detail.

1.1 Sheet The sheet 10 is made of a silicone elastomer. In FIG. 1, the sheet 10 has a rectangular shape in plan view, but there is no limitation on the shape. The sheet 10 is a member obtained by curing a curable silicone-based adhesive layer (hereinafter, may be simply referred to as “adhesive layer” or “adhesive” as appropriate). The sheet 10 can also be referred to as a cured body of a self-adhesive silicone rubber. The adhesive layer is a kind of a non-solvent silicone adhesive and has a high adhesive strength, and after curing, becomes a sheet 10 having heat stability, weather resistance, good water resistance, and excellent flexibility. The adhesive layer is a solid material that can maintain a self-supporting shape and has plasticity that can be deformed according to a pressing force. For this reason, the adhesive layer can be deformed in accordance with the unevenness or the curved surface of the place where it is arranged, and can be closely attached to the place where it is arranged.

  The adhesive layer in a state before the sheet 10 is cured preferably has a Williams plasticity at 25 ° C. in the range of 50 to 500. The Williams plasticity is measured using a parallel plate plasticity meter (Williams plastometer) according to the measurement method prescribed in JIS K 6249 "Testing methods for uncured and cured silicone rubber". The adhesive layer is a condensation-reaction-type curable silicone rubber composition, and can be cured preferably by a simple means of allowing it to react with moisture in the air by leaving it at room temperature. The silicone-based elastomer obtained by curing the adhesive layer is preferably a moisture-cured silicone-based elastomer. The adhesive layer is an addition-reaction-type curable silicone rubber composition, and may be a layer that is cured by heating. In that case, the sheet 10 is made of a heat-curable silicone-based elastomer. Hereinafter, the condensation reaction type curable silicone rubber composition and the addition reaction type curable silicone rubber composition serving as an adhesive layer will be described in detail.

(1) Condensation reaction type curable silicone rubber composition The condensation reaction type curable silicone rubber composition is mainly composed of the following components.

(1-1) Organopolysiloxane The organopolysiloxane is a main component of the condensation-curable silicone rubber composition, and is preferably a diorganopoly represented by the following chemical formula (1) or (2). Siloxane.

In the above chemical formulas (1) and (2), R is a monovalent hydrocarbon group. R represents an alkyl group (methyl group, ethyl group, propyl group, butyl group, 2-ethylbutyl group, octyl group, etc.), a cycloalkyl group (cyclohexyl group, cyclopentyl group, etc.), an alkenyl group (vinyl group, propenyl group, Butenyl, heptenyl, hexenyl, allyl, etc.), aryl (phenyl, tolyl, xylyl, naphthyl, diphenyl, etc.), aralkyl (benzyl, phenylethyl, etc.) Select from those in which at least a part of the hydrogen atom bonded to the carbon atom of the hydrogen group is substituted with a halogen, a cyano group, or the like (chloromethyl group, trifluoropropyl group, 2-cyanoethyl group, 3-cyanopropyl group, etc.). One or more hydrocarbon groups. The carbon number of R is preferably 1 to 12, more preferably 1 to 10. The above formula (1), in (2), A is an oxygen atom or - (m is 1-8) (including the methylene group) polymethylene group represented by - _{(CH 2)} m. A is preferably an oxygen atom or an ethylene group.

In the above chemical formulas (1) and (2), n is an arbitrary number that makes the kinematic viscosity at 25 ° C. of the component (1-1) within a range of 100 to 1,000,000 cm ² / s. More preferably, the kinematic viscosity is in the range of 500 to 500,000 cm ² / s.

  In the above chemical formulas (1) and (2), B is a hydrolyzable group. As B, an alkoxy group (methoxy group, ethoxy group, propoxy group, butoxy group, etc.), a ketoxime group (dimethyl ketoxime group, methyl ethyl ketoxime group, etc.), an acyloxy group (acetoxy group, etc.), an alkenyloxy group (isopropenyloxy group, etc.) Group, isobutenyloxy group, etc.). In the above chemical formulas (1) and (2), x is 2 or 3.

  The component (1-1) can be produced by a known method (for example, a method by an equilibrium reaction using a cyclic siloxane or a linear oligomer and an acid catalyst or a base catalyst).

When a branched structure is introduced into the diorganopolysiloxane as the component (1-1), a silane containing at least one of a SiO _3/2 unit and a SiO _4/2 unit during polymerization is _{usually used.} A method in which siloxane is added to such an extent that the diorganopolysiloxane does not gel can be used. The component (1-1) is preferably used after removing low-molecular siloxane by washing or the like in order to reduce dirt.

(1-2) Crosslinking Agent As the crosslinking agent, a silane having two or more, preferably three or more hydrolyzable groups in one molecule, or a partially hydrolyzed condensate of the silane is used. Examples of the hydrolyzable group include an alkoxy group (methoxy group, ethoxy group, butoxy group, etc.), a ketoxime group (dimethylketoxime group, methylethylketoxime group, etc.), an acyloxy group (acetoxy group, etc.), an alkenyloxy group (iso Examples thereof include a propenyloxy group, an isobutenyloxy group and the like, an amino group (N-butylamino group, an N, N-diethylamino group and the like), and an amide group (N-methylacetamido group and the like). Among these, it is preferable to use an alkoxy group, a ketoxime group, an acyloxy group, and an alkenyloxy group. The compounding amount of the crosslinking agent is preferably in the range of 1 to 50 parts by mass, more preferably in the range of 2 to 30 parts by mass, based on 100 parts by mass of the component (1-1). Even more preferably, it is in the range of 20 parts by mass.

(1-3) Curing Catalyst A curing catalyst is not essential, but by using a curing catalyst, curing of the curable silicone rubber composition can be promoted. Examples of the curing catalyst include alkyltin ester compounds (dibutyltin diacetate, dibutyltin dilaurate, dibutyltin dioctoate, etc.), titanate or titanium chelate compounds (tetraisopropoxytitanium, tetra-n-butoxytitanium, tetrakis (2- Ethylhexoxy) titanium, dipropoxybis (acetylacetona) titanium, titanium isopropoxyoctylene glycol, and other suitable organometallic compounds (zinc naphthenate, zinc stearate, zinc-2-ethyloctoate, iron-2) -Ethylhexoate, cobalt-2-ethylhexoate, manganese-2-ethylhexoate, cobalt naphthenate, alkoxyaluminum compound, etc.), aminoalkyl-substituted alkoxysilane (3-aminopropyltrie Xysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, etc.), amine compounds or salts thereof (hexylamine, dodecylamine phosphate, etc.), quaternary ammonium salts (benzyltriethylammonium acetate, etc.), alkali metals Lower fatty acid salts (eg, potassium acetate, sodium acetate, lithium oxalate), alkali metal lower fatty acid salts, dialkylhydroxylamine (dimethylhydroxylamine, diethylhydroxylamine, etc.), silane or siloxane having a guanidyl group (tetramethylg Anisylpropyltrimethoxysilane, tetramethylguanidylpropylmethyldimethoxysilane, tetramethylguanidylpropyltris (trimethylsiloxy) silane, etc.). These may be used alone or as a mixture of two or more. The amount of the curing catalyst is preferably in the range of 0 to 20 parts by mass, more preferably in the range of 0.001 to 10 parts by mass, per 100 parts by mass of the component (1-1). Even more preferably, it is in the range of 0.01 to 5 parts by mass.

(1-4) Filler The filler is not essential, but can be suitably used for the purpose of reinforcement or the like. Examples of fillers include reinforcing agents (fumed silica, precipitated silica, silica whose surface has been hydrophobized with an organosilicon compound, quartz powder, talc, zeolite, bentonite, etc.), and fibrous fillers ( Asbestos, glass fibers, organic fibers, etc.) and basic fillers (calcium carbonate, zinc carbonate, zinc oxide, magnesium oxide, celite, etc.). Among these, it is preferable to use silica, calcium carbonate and zeolite, and it is more preferable to use fumed silica and calcium carbonate whose surfaces have been subjected to hydrophobic treatment. The amount of the filler can be selected depending on the purpose and the kind of the filler, but is in the range of 1 to 90% by volume, and in the range of 5 to 60% by volume based on the component (1-1). Is preferred.

(1-5) Adhesiveness-imparting component The adhesiveness-imparting component is not essential but is preferably used. Examples of the adhesion-imparting component include amino-containing organoalkoxysilanes (such as γ-aminopropyltrimethoxysilane and γ- (2-aminoethyl) aminopropyltrimethoxysilane), and epoxy-containing organoalkoxysilanes (γ-glycol). Sidoxypropyltrimethoxysilane and the like), mercapto-containing organoalkoxysilanes (γ-mercaptopropyltrimethoxysilane and the like), and a reaction mixture of an amino group-containing organoalkoxysilane and an epoxy group-containing organoalkoxysilane can be exemplified. The compounding amount of the adhesion-imparting component is preferably in the range of 0.1 to 5 parts by mass with respect to 100 parts by mass of the component (1-1).

(2) Addition-curable curable silicone rubber composition When the sheet 10 is obtained by curing the addition-curable curable silicone rubber composition, the addition-curable curable silicone rubber composition mainly comprises the following: Consists of components.

(2-1) Organopolysiloxane An organopolysiloxane is a main component of an addition-curable curable silicone rubber composition, and has an average of two or more alkenyl groups in one molecule. Examples of alkenyl groups include vinyl, allyl, butenyl, pentenyl, hexenyl and heptenyl. Among these, it is preferable to use a vinyl group. In this component, examples of the organic group bonded to a silicon atom other than the alkenyl group include an alkyl group (eg, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group) and an aryl group (a phenyl group). , A tolyl group, a xylyl group, etc.) and a halogenated alkyl group (a 3-chloropropyl group, a 3,3,3-trifluoropropyl group, etc.). Among these, it is preferable to use a methyl group. Examples of the molecular structure of this component include linear, partially branched linear, branched, reticulated, and dendritic. The viscosity of this component at 25 ° C. is preferably at least 100,000 mPa · s, and more preferably at least 1,000,000 mPa · s.

Examples of the organopolysiloxane of this component include dimethylvinylsiloxy group-blocked polydimethylsiloxane at both molecular chain terminals, dimethylvinylsiloxy group-blocked dimethylsiloxane / methylvinylsiloxane copolymer at both molecular chain terminals, and trimethylsiloxy group at both molecular chain terminals. Blocked dimethylsiloxane / methylvinylsiloxane copolymer, a siloxane unit represented by (CH ₃ ) ₃ SiO _1/2 and a siloxane unit represented by (CH ₃ ) ₂ (CH ₂ ＣＨCH) SiO _1/2 , and SiO _{4 / An} organopolysiloxane comprising a siloxane unit represented by formula (2), wherein at least a part of a methyl group of these organopolysiloxanes is an alkyl group (ethyl group, propyl group, etc.), an aryl group (phenyl group, tolyl group, etc.), halogenated Alkyl group (3,3,3-trifluoro An organopolysiloxane substituted with a substituent selected from propyl groups and the like, an organopolysiloxane in which at least a part of the vinyl group of these organopolysiloxanes is substituted with an alkenyl group (an allyl group, a propenyl group, and the like), and Mixtures of two or more organopolysiloxanes can be used.

(2-2) Hydrogenated organopolysiloxane Hydrogenated organopolysiloxane acts as a curing agent for an addition-curable curable silicone rubber composition, and has an average of two or more silicon-bonded hydrogen atoms per molecule. Having. Examples of the organic group bonded to silicon in this component include an alkyl group (methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, etc.) and an aryl group (phenyl group, tolyl group, xylyl group, etc.) ) And halogenated alkyl groups (such as a 3-chloropropyl group and a 3,3,3-trifluoropropyl group). Among the above, it is preferable to use a methyl group. Examples of the molecular structure of this component include linear, partially branched linear, branched, reticulated, and dendritic. The viscosity of this component at 25 ° C. is not limited, but is preferably in the range of 1 to 1,000,000 mPa · s, and more preferably in the range of 1 to 10,000 mPa · s.

Examples of the hydrogenated organopolysiloxane of this component include polydimethylsiloxane having dimethylhydrogensiloxy groups at both ends of molecular chains, polymethylhydrogensiloxane having trimethylsiloxy groups at both ends, and dimethylsiloxane having trimethylsiloxy ends at both molecular chains. A methylhydrogensiloxane copolymer, a cyclic polymethylhydrogensiloxane, an organopolysiloxane comprising a siloxane unit represented by (CH ₃ ) ₂ HSiO _1/2 and a siloxane unit represented by SiO _4/2 , and an organopolysiloxane thereof. At least a part of the methyl group of the polysiloxane is an alkyl group (ethyl group, propyl group, etc.), an aryl group (phenyl group, tolyl group, etc.), a halogenated alkyl group (3,3,3-trifluoropropyl group, etc.). Replaced Ol Bruno polysiloxanes, and it may be used mixtures of two or more of these organopolysiloxanes. Among these, since the mechanical properties (especially elongation) of the obtained cured product are improved, an organopolysiloxane having silicon atom-bonded hydrogen atoms only at both ends of the molecular chain and a silicon atom bond in a molecular chain side chain are provided. It is preferred to use a mixture with an organopolysiloxane.

  The content of this component in the addition-curable curable silicone rubber composition is such that the molar ratio of silicon-bonded hydrogen atoms in this component to alkenyl groups in component (2-1) is in the range of 0.01 to 20. The amount is preferably in the range of 0.1 to 10, more preferably in the range of 0.1 to 5. The reason for setting the above range is that when the content of this component is equal to or more than the lower limit of the above range, the self-adhesive silicone rubber tends to be sufficiently cured, while the upper limit of the above range is equal to or less than the upper limit. In this case, the mechanical properties of the cured sheet 10 tend to be higher. When a mixture of an organopolysiloxane having a silicon-bonded hydrogen atom only at both molecular chain terminals and an organopolysiloxane having a silicon-bonded molecular side chain is used as the component, the former organopolysiloxane may be used. Is preferably such that the molar ratio of silicon-bonded hydrogen atoms in this component to alkenyl groups in component (2-1) is in the range of 0.01 to 10, preferably 0.1 to 10. The amount is more preferably in the range of 10 and even more preferably in the range of 0.1 to 5. The content of the latter organopolysiloxane is such that the molar ratio of silicon-bonded hydrogen atoms in this component to alkenyl groups in component (2-1) is in the range of 0.5 to 20. Is preferably in the range of 0.5 to 10, and more preferably in the range of 0.5 to 5.

(2-3) Curing Catalyst A curing catalyst is not essential, but a preferred example is a platinum-based catalyst for a hydrosilylation reaction. Examples of platinum-based catalysts for the hydrosilylation reaction include platinum fine powder, platinum black, chloroplatinic acid, alcohol-modified chloroplatinic acid, complexes of platinum and diketone, complexes of chloroplatinic acid and olefins, chloroplatinic acid and alkenylsiloxane. And those in which these are supported on a carrier (alumina, silica, carbon black, etc.). Among these, it is preferable to use a complex of chloroplatinic acid and alkenylsiloxane from the viewpoint of high catalytic activity. Further, it is more preferable to use a complex of chloroplatinic acid and divinyltetramethyldisiloxane. The compounding amount of this component is preferably in the range of 1 to 1000 parts by mass, and more preferably in the range of 1 to 100 parts by mass as platinum metal atom, based on 1,000,000 parts by mass of the component (2-1). Is more preferred.

(2-4) Filler The filler is preferably added in order to improve the mechanical strength of the addition-curable curable silicone rubber composition, and a known filler usually used for compounding silicone rubber is used. Compounds can be used. As this component, for example, fumed silica, precipitated silica, calcined silica, crushed quartz, and powder obtained by subjecting these silica powders to surface treatment with an organosilicon compound (organoalkoxysilane, organohalosilane, organosilazane, etc.) Can be mentioned. In particular, in order to sufficiently improve the mechanical strength of the cured sheet 10, it is preferable to use a silica powder having a BET specific surface area of 50 m ² / g or more as this component.

  In the addition-curable curable silicone rubber composition, the addition of this component is optional, but in order to improve the mechanical strength of the cured self-adhesive silicone rubber, the amount of this component is (2-1). It is preferably in the range of 1 to 1000 parts by mass, more preferably in the range of 1 to 400 parts by mass, based on 100 parts by mass of the component. In addition, the addition-curable curable silicone rubber composition may include, as other optional components, for example, fumed titanium oxide, diatomaceous earth, iron oxide, aluminum oxide, aluminosilicate, calcium carbonate, zinc oxide, aluminum hydroxide, and the like. And an inorganic filler and an organic filler. The addition-curable curable silicone rubber composition may contain a filler obtained by treating the surface of these fillers with the aforementioned organosilicon compound. The compounding amount of the filler can be selected depending on the purpose and the kind of the filler. Preferably, there is.

(2-5) Adhesiveness-imparting component This component is not essential, but is preferably used for imparting and improving the adhesiveness of the addition-curable curable silicone rubber composition in order to function as an adhesive. Can be done. Examples of this component include silane coupling agents and their partial hydrolysates (methyltrimethoxysilane, vinyltrimethoxysilane, allyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane) Silane, 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, bis (trimethoxysilyl) propane, bis (trimethoxysilyl) hexane, etc.), “epoxy group, acid Organic compounds having "anhydride group, α-cyanoacryl group", siloxane compounds having "epoxy group, acid anhydride group, α-cyanoacryl group", "epoxy group, acid anhydride group, α-cyanoacryl group" and alkoxysilyl Organic compounds or siloxane compounds having a group Compounds (tetraethyl titanate, tetrapropyl titanate, tetrabutyl titanate, tetra (2-ethylhexyl) titanate, titanium ethyl acetonate, titanium acetyl acetonate, etc.), aluminum compounds (ethyl acetoacetate aluminum diisopropylate, aluminum tris (ethyl acetoacetate) ), Alkyl acetoacetate aluminum diisopropylate, aluminum tris (acetylacetonate), aluminum monoacetylacetonate bis (ethylacetoacetate), zirconium compounds (zirconium acetylacetonate, zirconium butoxyacetylacetonate, zirconium bisacetylacetate) , Zirconium ethyl acetoacetate, etc.) In addition, as the above-mentioned siloxane compound, a lower aliphatic unsaturated group such as an alkenyl group, an acryloyl group, a methacryloyl group, or a compound having both of these and a hydrosilyl group can be expected to effectively contribute to the improvement of adhesiveness. The content of the adhesiveness-imparting component is not particularly limited, but is preferably in the range of 0.01 to 10 parts by mass with respect to 100 parts by mass of the component (2-1).

  Furthermore, in order to adjust the curability of the addition-curable curable silicone rubber composition, an acetylene compound (3-methyl-1-butyn-3-ol, 3,5-dimethyl-1-hexyne- 3-ol, 3-phenyl-1-butyn-3-ol, etc.), enein compounds (3-methyl-3-penten-1-yne, 3,5-dimethyl-3-hexen-1-yne, etc.), 1 Organosiloxane compounds having 5% by mass or more of vinyl groups in the molecule (1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,3,5,7-tetramethyl -1,3,5,7-tetrahexenylcyclotetrasiloxane, methylvinylsiloxane with silanol groups at both ends of molecular chain, methylvinylsiloxane / dimethylsilo with silanol groups at both ends of molecular chain San copolymers), other curing inhibitor (triazoles such as benzotriazole, phosphines, mercaptans, preferably contains a hydrazine or the like). The content of these is not limited, but is preferably in the range of 0.001 to 5 parts by mass with respect to 100 parts by mass of the component (2-1).

  The method for preparing the addition-curable curable silicone rubber composition is not limited, and can be prepared by mixing other optional components as necessary. 3) It is preferable to add the remaining components to the base compound prepared by heating and mixing the components. In addition, when adding other arbitrary components, they may be added when preparing a base compound, and when other arbitrary components are altered by heating and mixing, the components (2-2) and (2- 4) You may add at the time of adding a component. When preparing the base compound, the surface of the component (2-3) may be subjected to in-situ treatment by adding the above-mentioned organosilicon compound.

1.2 RFID Tag The RFID tag 15 is a non-metallic (non-metallic) RFID tag. The RFID tag 15 is completely embedded in the sheet 10 as shown in FIG. In addition, the RFID tag 15 is located at a position floating from the surface of the metal M, that is, a thickness t1 (0 <t1 <(thickness of the sheet 10−thickness of the RFID tag 15)) from the surface of the sheet 10 attached to the metal M. The sheet 10 is embedded inward from the upper surface of the sheet 10. The region having the thickness t1 upward from the surface of the sheet 10 to which the metal M is attached has a role of keeping the RFID tag 15 away from the surface of the metal M. As a result, the radio wave from the RFID tag 15 generates an eddy current in the metal M, and the radio wave is emitted from the metal M. As a result, the situation where the radio wave from the RFID tag 15 is relatively weakened can be reduced.

  As shown in FIG. 1 (1B), the RFID tag 15 has a hole 20, and the entire RFID tag 15 is completely embedded in the sheet 10 so as to fill the hole 20 with the sheet 10. As shown in FIG. 1C, the RFID tag embedded body is completely embedded at a position where a part of the RFID tag 15 including the hole 20 has moved from the substantially center to the end of the sheet 10 in plan view. The embedded RFID tag 1a may be used. By embedding the RFID tag 15 in the sheet 10 so that the hole 20 is filled with the sheet 10, the RFID tag embedded bodies 1 and 1 a can firmly fix the RFID tag 15 to the sheet 10.

  The RFID tag 15 includes an active tag that has a built-in battery and can communicate by itself, a passive tag that can receive and receive radio waves from an external reader without a built-in battery, and a semiconductor tag that has both functions. Any type of active tag may be used. The RFID tag 15 is preferably a passive tag having a structure shown in FIG. 2 (2C). This is because the configuration of the RFID tag 15 is simple, and it is easy to reduce the size and cost.

  When in the form of a passive tag, the RFID tag 15 includes a substrate 16, a coil (antenna) 17 formed on the substrate 16, and a memory (IC chip) 18 electrically connected to the coil 17. In this embodiment, the RFID tag 15 is preferably an electromagnetic induction type tag that transmits a signal by magnetically coupling a coil 17 of the RFID tag 15 with an antenna coil of an external reader. It may be a radio wave type tag for transmitting and receiving radio waves between the antenna and an external reader antenna. In addition, the position of the hole 20 provided in the RFID tag 15 is not limited to the position shown in FIG.

1.3 Fixing Member The fixing member 25 is preferably a needle-like member for fixing the RFID tag 15 to the sheet 10, and is a member positioned as an option. The fixing member 25 is preferably a non-metallic member such as a resin that can be adhered to the sheet 10, and is more preferably a silicone rubber. As shown in FIG. 1, the fixing member 25 is a needle-shaped member of a stapler (also referred to as a stapler or a stapler), and is embedded inward from the upper surface of the sheet 10 in which the RFID tag 15 is embedded. . In the first embodiment, the fixing members 25 are provided at two diagonal corners of the RFID tag 15. However, if the RFID tag 15 can be fixed to the sheet 10, the number of the fixing members 25 And the position is not limited to this. Further, the fixing member 25 may be a metal member as long as it is a very thin needle-like member that does not affect the detection of the radio wave from the RFID tag 15.

2. FIG. 3 is a flowchart (3A) of a method of manufacturing an embedded RFID tag according to the first embodiment of the present invention (3A), and a cross-sectional view of a manufacturing process of the embedded RFID tag of FIG. 1 (1B) ( 3B) and a cross-sectional view (3C) of the process of manufacturing the embedded RFID tag of FIG. 1 (1C), respectively.

  The method for manufacturing an embedded RFID tag according to this embodiment includes an adhesive layer attaching step (S110), an RFID tag embedding step (S120), a fixing step (S130), and a curing step (S140). Hereinafter, each step will be described.

2.1 Adhesive layer sticking step (S110)
The bonding layer bonding step is a step of bonding the bonding layer 30 to the surface of the metal M (see b1 and c1).

2.2 RFID tag embedding process (S120)
The RFID tag embedding step is a step of embedding the whole of the RFID tag 15 from the surface of the adhesive layer 30 to the inside to a position not reaching the surface of the metal M (see b2), or This is a step (see c2) of embedding a part of the RFID tag 15 including the hole 20 to a position not reaching the surface of the metal M. The RFID tag embedding step is a step of completely embedding at least the hole 20 portion of the RFID tag 15 in the adhesive layer 30 and filling the hole 20 with the adhesive layer 30. However, the hole 20 may not be completely buried in the adhesive layer 30 and a part of the hole 20 may be buried.

2.3 Fixing step (S130)
The fixing step is a step of fixing the RFID tag 15 to the adhesive layer 30 with the fixing member 25 from above the RFID tag 15 embedded in the adhesive layer 30 (see b3 and c3). In the fixing step, the fixing member 25 is driven from the upper surface of the adhesive layer 30 to a position where the RFID tag 15 can be engaged.

2.4 Hardening Step (S140)
The curing step is a step of curing the adhesive layer 30 to form the silicone elastomer sheet 10 (see b4 and c4). As a result, the RFID tag 15 is fixed to the sheet 10.

  By the above-described manufacturing method, the RFID tag 15 is at least partially embedded in the sheet 10 at least including the hole 20, so that the hole 20 is filled with the sheet 10, and thus, the RFID tag 15 is firmly fixed to the sheet 10.

(2nd Embodiment)
Next, an embedded RFID tag according to a second embodiment of the present invention will be described. In the second embodiment, description of portions common to the first embodiment will be appropriately omitted.

  FIG. 4 is a cross-sectional view (4A) of the embedded RFID tag according to the second embodiment of the present invention, which is the same as FIG. 2 (2A), and a cross-sectional view (4B) of the manufacturing process of the embedded RFID tag. .

  The RFID tag embedded body 1b according to the second embodiment is partially embedded in the sheet 10 in the thickness direction of the sheet 10, and the first convex portion 20b is provided on at least a part of the surface facing the metal M instead of the hole 20. Except for the point that the RFID tag embedding body 1 according to the first embodiment is provided, the configuration is common to the first embodiment. The seat 10 is the same as in the first embodiment.

  As shown in FIG. 4 (4A), the first convex portion 20b is a portion of the RFID tag 15b that protrudes in the metal M direction on a part of the surface facing the metal M. The first convex portion 20b is preferably located at a position excluding a region where the coil 17 and the memory 18 are arranged. The first protrusion 20b may be formed on the entire surface facing the metal M. The unevenness of the first convex portion 20b may be formed in a dot shape on a surface facing the metal M, or may be formed by a linear peak and a valley. Further, the first convex portion 20b may be provided with irregularities by subjecting a surface facing the metal M to a graining process. Various shapes such as a triangle and a quadrangle can be adopted as the shape of the first protrusion 20b. As shown in FIG. 4, preferably, a part of the RFID tag embedded body 1 b including the first protrusion 20 b of the RFID tag 15 b is embedded in the sheet 10 in the thickness direction of the sheet 10. In the RFID tag embedded body 1b, the RFID tag 15b may be completely embedded in the sheet 10. The embedded RFID tag 1b includes the first convex portion 20b of the surface of the RFID tag 15b facing the metal M, similarly to the embedded RFID tag 1a of the first embodiment (see FIG. 1C). A part may be embedded in the sheet 10.

  The manufacturing method of the RFID tag embedded body 1b is the same as the manufacturing method of the first embodiment (see FIG. 3A), the adhesive layer attaching step (S110), the RFID tag embedding step (S120), and the fixing step (S130). And a curing step (S140). Since the adhesive layer attaching step (S110) and the curing step (S140) are the same as the respective steps in the first embodiment, the description will be omitted. The RFID tag embedding step (S120) is a step of embedding a part of the RFID tag 15b from the surface of the adhesive layer 30 toward the inside to a position not reaching the surface of the metal M (see FIG. 4B2). . In the RFID tag embedding step (S120), it is preferable to embed the RFID tag 15b in the thickness direction of the adhesive layer 30 to at least a position where the first protrusion 20b is completely embedded in the adhesive layer 30. The fixing step (S130) is a step of driving the fixing member 25 from the upper surface of the RFID tag 15b to a position where the adhesive layer 30 can be engaged (see FIG. 4 (b3)).

  By embedding the first protrusion 20b in the sheet 10, the contact area between the sheet 10 and the RFID tag 15b can be increased, so that the adhesive strength between the sheet 10 and the RFID tag 15b can be further increased.

(Third embodiment)
Next, an embedded RFID tag according to a third embodiment of the present invention will be described. In the third embodiment, description of portions common to the above-described embodiments will be appropriately omitted.

  FIG. 5 is a cross-sectional view of the RFID tag-embedded body according to the third embodiment of the present invention, taken along the line of FIG.

  In the RFID tag embedded body 1c according to the third embodiment, the RFID tag 15c is completely embedded in the sheet 10, and the second convex portion 20c is formed on at least a part of the surface opposite to the surface facing the metal M. Except for the point provided, it is common to the embedded RFID tag 1b according to the second embodiment. The seat 10 is the same as in the second embodiment.

  As shown in FIG. 5, the second convex portion 20 c protrudes in a direction opposite to the metal M on a part of the surface opposite to the surface facing the metal M. The second convex portion 20c is preferably located at a position excluding a region where the coil 17 and the memory 18 are arranged. Note that the structure and shape of the second convex portion 20c are the same as those of the first convex portion 20b, and a description thereof will be omitted. Further, the first convex portion 20b and the second convex portion 20c may be formed at the same position in the plane of the RFID tag 15, or may be formed at different positions. As shown in FIG. 5, the RFID tag embedded body 1c preferably has the RFID tag 15c completely embedded in the sheet 10. Note that the RFID tag embedded body 1c is not completely embedded in the sheet 10 if at least a part of the second convex portion 20c is embedded in the sheet 10 in the thickness direction of the sheet 10. Is also good. In addition, the RFID tag embedded body 1c does not have the entire surface of the RFID tag 15c embedded in the sheet 10 like the RFID tag embedded body 1a of the first embodiment (see FIG. 1C). A part including the first protrusion 20b and the second protrusion 20c may be embedded in the sheet 10. The manufacturing method of the embedded RFID tag 1c is the same as the manufacturing method of the first embodiment (see FIG. 3 (3A)), and thus the description is omitted.

  By embedding the first protrusion 20b and the second protrusion 20c in the sheet 10, the contact area between the sheet 10 and the RFID tag 15c can be increased, so that the adhesive force between the sheet 10 and the RFID tag 15c can be reduced. Can be more enhanced. Note that the embedded RFID tag 1c does not have to include the first protrusion 20b.

(Fourth embodiment)
Next, an embedded RFID tag according to a fourth embodiment of the present invention will be described. In the fourth embodiment, description of portions common to the above-described embodiments will be appropriately omitted.

  FIG. 6 shows a top view of the RFID tag embedded body according to the fourth embodiment of the present invention.

  The embedded RFID tag body 1d according to the fourth embodiment is similar to the third embodiment except that a third convex portion 20d is provided on a part of the side surface of the RFID tag 15d instead of the first convex portion 20b and the second convex portion 20c. It is common to the RFID tag embedded body 1c according to the embodiment. The seat 10 is the same as in the third embodiment.

  As shown in FIG. 6, the third protrusions 20d protrude outward from a part of both side surfaces of the RFID tag 15d. Note that the structure and shape of the third convex portion 20d are the same as those of the first convex portion 20b and the second convex portion 20c, and a description thereof will be omitted. In addition, the third protrusion 20d may be formed at the same position on both opposing side surfaces of the RFID tag 15d, or may be formed at different positions. As shown in FIG. 6, the RFID tag embedded body 1d preferably has the RFID tag 15d completely embedded in the sheet 10. Note that the RFID tag embedded body 1d does not completely embed the RFID tag 15d in the sheet 10 if at least a part of the third protrusion 20d is embedded in the sheet 10 in the thickness direction of the sheet 10. Is also good. Further, the RFID tag embedded body 1d does not have the entire RFID tag 15d embedded in the sheet 10 as in the RFID tag embedded body 1a of the first embodiment (see FIG. 1 (1C)). A part including the third convex portion 20d may be embedded in the sheet 10. The manufacturing method of the embedded RFID tag 1d is the same as the manufacturing method of the first embodiment (see FIG. 3 (3A)), and thus the description is omitted.

  Since the contact area between the sheet 10 and the RFID tag 15d can be increased by embedding the third convex portion 20d in the sheet 10, the adhesive force between the sheet 10 and the RFID tag 15d can be further increased. The embedded RFID tag body 1d may include the first convex portion 20b on the surface facing the metal M, or may include the second convex portion 20c on the surface opposite to the surface. Further, the embedded RFID tag 1d may include a first protrusion 20b and a second protrusion 20c.

(Fifth embodiment)
Next, an embedded RFID tag according to a fifth embodiment of the present invention will be described. In the fifth embodiment, description of portions common to the above-described embodiments will be appropriately omitted.

  FIG. 7 shows a cross-sectional view (7A) of the embedded RFID tag according to the fifth embodiment of the present invention, as viewed in FIG. 2 (2A), and a cross-sectional view (7B) of the manufacturing process of the embedded RFID tag. .

  The embedded RFID tag 1e according to the fifth embodiment is the same as the embedded RFID tag 1c according to the third embodiment except that a screw 20e is provided instead of the first protrusion 20b and the second protrusion 20c. I do. The seat 10 is the same as in the third embodiment.

  The screw portion 20e is spirally wound around the peripheral surface of the RFID tag 15e, as shown in FIG. 7 (7A). As shown in FIG. 7 (7A), the RFID tag embedded body 1e preferably has the RFID tag 15e completely embedded in the sheet 10. Note that the RFID tag embedded body 1e does not need to completely embed the RFID tag 15e in the sheet 10 as long as at least a part of the screw portion 20e is embedded in the sheet 10.

  The manufacturing method of the RFID tag embedded body 1e is the same as the manufacturing method of the first embodiment (see FIG. 3A), the adhesive layer attaching step (S110), the RFID tag embedding step (S120), and the fixing step (S130). And a curing step (S140). Steps other than the RFID tag embedding step (S120) are the same as the respective steps in the first embodiment, and a description thereof will be omitted. The RFID tag embedding step (S120) is a step of embedding the RFID tag 15e from the surface of the adhesive layer 30 to the inside so as not to reach the surface of the metal M. Specifically, in the RFID embedding step (S120), as shown in FIG. 7B2, the RFID tag 15e is embedded in the adhesive layer 30 by screwing the RFID tag 15e from the side surface into the adhesive layer 30. Note that the RFID tag 15e may be screwed from another surface such as the upper surface (the surface perpendicular to the side surface) of the adhesive layer 30.

  By embedding the screw portion 20e in the sheet 10, the contact area between the sheet 10 and the RFID tag 15e can be increased, so that the adhesive strength between the sheet 10 and the RFID tag 15e can be further increased. In the RFID tag embedding step (S120), the RFID tag 15e may be buried by pushing the RFID tag 15e inward from the surface of the adhesive layer 30 as in the other embodiments.

3. Functions and Effects of Each Embodiment The embedded RFID tags 1, 1 a, 1 b, 1 c, 1 d, and 1 e according to the above-described embodiments are embedded RFID tags fixed to a metal M, and are made of a sheet of a silicone elastomer. And an RFID tag 15, 15b, 15c, 15d, 15e corresponding to a nonmetal which is buried from the surface of the sheet 10 toward the inside and does not reach the surface of the metal M. The RFID tags 15, 15 b, 15 c, 15 d, and 15 e include one or more first fixing means 20, 20 b, 20 c, 20 d, and 20 e for fixing to the sheet 10. The embedded RFID tag bodies 1, 1 a, 1 b, 1 c, 1 d, and 1 e having such a configuration can be configured at a lower price as compared with a case where a metal-compatible RFID is used, and furthermore, the influence of metal upon communication with the reader is reduced. It is hard to receive and can be firmly fixed to the surface of the metal M.

  Further, the RFID tags 15, 15b, 15c, 15d, and 15e include a hole 20, a first convex portion 20b, a second convex portion 20c, a third convex portion 20d, and a screw portion 20e as first fixing means. At least a part including the fixing means 20, 20b, 20c, 20d, 20e is embedded in the sheet 10. With these configurations, the contact area between the RFID tags 15, 15b, 15c, 15d, and 15e and the sheet 10 increases, so that the RFID tags 15, 15b, 15c, 15d, and 15e are firmly fixed to the sheet 10. . Therefore, the RFID tags 15, 15b, 15c, 15d, and 15e are firmly fixed to the sheet 10 by fixing such RFID tag embedded bodies 1, 1a, 1b, 1c, 1d, and 1e to the surface of the metal M. be able to.

  The embedded RFID tag bodies 1, 1 a, 1 b, 1 c, 1 d, 1 e may include a fixing member 25 for fixing the RFID tags 15, 15 b, 15 c, 15 d, 15 e to the sheet 10. The fixing member 25 is, for example, a needle-shaped member. Therefore, the RFID tags 15, 15b, 15c, 15d, 15e are more firmly fixed to the sheet 10.

  In addition, since the fixing member 25 is made of a non-metallic member, it is hardly affected by metal when communicating with the reader, and can be firmly fixed to the surface of the metal M.

  In the RFID tag embedded bodies 1, 1a, 1b, 1c, 1d, and 1e according to the above-described embodiments, the silicone-based elastomer may be a moisture-cured silicone-based elastomer. Thereby, the adhesive layer 30 can be easily cured only by leaving it in the air. Therefore, the RFID tag embedded bodies 1, 1a, 1b, 1c, 1d, 1e can be easily formed on the surface of the metal M.

  Further, in the method of manufacturing the embedded RFID tag according to the above-described embodiment, the adhesive layer attaching step (S100) of attaching the curable silicone-based adhesive layer 30 to the surface of the metal M; At least one of the non-metallic RFID tags 15, 15b, 15c, 15d, and 15e including the first fixing means 20, 20b, 20c, 20d, and 20e from the surface to the inside to the position not reaching the surface of the metal M. An RFID tag embedding step of embedding the portion (S120) and a curing step of curing the curable silicone-based adhesive layer 30 to form the silicone elastomer sheet 10 (S140). According to such a manufacturing method, the RFID 15 can be easily fixed to the metal M while securing the distance between the RFID tag 15 and the metal M without using a metal-compatible RFID tag. Moreover, by burying at least a part including the first fixing means 20, 20b, 20c, 20d, and 20e, the RFID tags 15, 15b, 15c, 15d, and 15e are firmly fixed to the sheet 10. Therefore, the RFID tags 15, 15b, 15c, 15d, and 15e are firmly fixed to the sheet 10 by fixing such RFID tag embedded bodies 1, 1a, 1b, 1c, 1d, and 1e to the surface of the metal M. be able to.

  Further, the RFID tag 15 according to the first embodiment includes a hole 20 as a first fixing unit. In the RFID tag embedding step (S120), at least a part of the hole 20 of the RFID tag 15 is completely embedded in the curable silicone-based adhesive layer. The RFID tag 15 is embedded in the sheet 10, and at least a part of the hole 20 is filled with the sheet 10. For this reason, the RFID tag 15 is firmly fixed to the sheet 10. As a result, the embedded RFID tags 1 and 1a are firmly fixed to the surface of the metal M.

  In the method for manufacturing an embedded RFID tag according to the above-described embodiment, the RFID tags 15, 15 b, 15 c, 15 d, and 15 e embedded in the curable silicone-based adhesive layer 30 are fixed to the adhesive layer 30 by the fixing member 25. Fixing step (S130). In the curing step (S140), the curable silicone adhesive layer 30 to which the RFID tag is fixed by the fixing member 25 is cured to form the silicone elastomer sheet 10. Therefore, the RFID tags 15, 15b, 15c, 15d, and 15e can be more firmly fixed to the sheet 10.

(Other embodiments)
As described above, the embodiments of the present invention have been described. However, the present invention is not limited to the above embodiments, and can be implemented in various modes without departing from the gist thereof. For example, the following modifications are possible.

  For example, as long as the RFID tag embedded bodies 1, 1a, 1b, 1c, 1d, 1e are fixed to the metal M with the sheet 10 interposed therebetween, not only the flat surface of the metal M but also the curved surface, concave portion, or convex portion of the metal M is used. Department or the like.

  Further, the embedded RFID tags 1, 1 a, 1 b, 1 c, 1 d, and 1 e do not have to include the fixing member 25. In this case, the manufacturing method of the embedded RFID tag may be such that the fixing step (S130) is omitted from the manufacturing method shown in FIG. 3 (3A).

  In the above-described embodiment, the fixing member 25 is a stapler-shaped member. However, the fixing member 25 is not limited to this as long as it can fix the RFID tags 15, 15b, 15c, 15d, and 15e to the sheet 10. . For example, the fixing member 25 may be a long needle-like member. In this case, for example, in the RFID tag embedded bodies 1 and 1a of the first embodiment, the RFID tag 15 may be fixed to the sheet 10 by inserting the fixing member 25 into the hole 20 of the RFID tag 15. In each of the above-described embodiments, the hole into which the fixing member 25, which is a long needle-like member, can be inserted is formed in the surface of the RFID tag embedded body 1, 1a, 1b, 1c, 1d, 1e (to face the metal M). The RFID tag 15, 15b, 15c, 15d, 15e and the sheet 10 may be fixed by the fixing member 25 by providing the fixing member 25 on the surface opposite to the surface) or the side surface. In addition, the hole in this case may be a cylindrical shape having both ends open such that it penetrates the RFID tags 15, 15b, 15c, 15d, and 15e, or a cup shape having one end open.

  Each component of each embodiment described above may be combined with each other. For example, the first and second protrusions 20b, 20c, and 20d may be provided by combining the third embodiment and the fourth embodiment of the RFID tag embedded body.

  INDUSTRIAL APPLICATION This invention can be utilized in the industry which installs the non-metal corresponding RFID tag in the metal.

1, 1a, 1b, 1c, 1d, 1e: embedded RFID tag, 10: sheet (silicone-based elastomer sheet), 15, 15b, 15c, 15d, 15e: RFID tag (non-metal compatible) , 20 ... hole (first fixing means), 20b ... first convex part (first fixing means), 20c ... second convex part (first fixing means), 20d ... -3rd convex part (1st fixing means), 20e ... screw part (1st fixing means), 25 ... fixing member (2nd fixing means).

Claims (12)

An embedded RFID tag fixed to metal,
A sheet of silicone-based elastomer,
A non-metallic RFID tag buried from the surface of the sheet toward the inside to a position that does not reach the surface of the metal,
With
The embedded RFID tag, wherein the RFID tag includes one or more first fixing means for fixing the RFID tag to the sheet. The RFID tag,
A hole as the first fixing means,
The embedded RFID tag according to claim 1, wherein at least a part including the hole is embedded in the sheet. The RFID tag,
As the first fixing means, a first convex portion protruding in the metal direction is provided on at least a part of a surface facing the metal,
2. The embedded RFID tag according to claim 1, wherein at least a part including the first convex portion is embedded in the sheet. 3. The RFID tag,
As the first fixing unit, at least a part of a surface opposite to the surface facing the metal includes a second protrusion protruding in a direction opposite to the metal,
4. The embedded RFID tag according to claim 1, wherein at least a part including the second convex portion is embedded in the sheet. 5. The RFID tag,
As the first fixing means, at least a part of the side surface includes a third convex portion protruding outward from the side surface,
The embedded RFID tag according to any one of claims 1, 3 and 4, wherein at least a part including the third convex portion is embedded in the sheet. The RFID tag,
As the first fixing means, a screw portion spirally wound around the peripheral surface is provided,
The embedded RFID tag according to claim 1, wherein at least a part including the screw portion is embedded in the sheet. A second fixing unit for fixing the RFID tag to the sheet;
The embedded RFID tag according to any one of claims 1 to 6, wherein the second fixing means is a needle-shaped member.   The embedded RFID tag according to claim 7, wherein the second fixing means is a non-metallic member.   The embedded RFID tag according to any one of claims 1 to 8, wherein the silicone-based elastomer is a moisture-cured silicone-based elastomer. A method for manufacturing an embedded RFID tag according to any one of claims 1 to 9,
An adhesive layer attaching step of attaching a curable silicone-based adhesive layer to a metal surface,
An RFID tag embedding step of embedding at least a part of the non-metal corresponding RFID tag including the first fixing means from the surface of the curable silicone-based adhesive layer to a position not reaching the surface of the metal toward the inside; ,
A curing step of curing the curable silicone-based adhesive layer to form a sheet of silicone-based elastomer,
A method for manufacturing an embedded RFID tag, comprising: The RFID tag includes a hole as the first fixing means,
The method of manufacturing an embedded RFID tag according to claim 10, wherein the RFID tag embedding step completely embeds at least the hole portion of the RFID tag in the curable silicone-based adhesive layer. A fixing step of fixing the RFID tag embedded in the curable silicone-based adhesive layer to the adhesive layer by second fixing means,
12. The sheet according to claim 10, wherein, in the curing step, the curable silicone-based adhesive layer to which the RFID tag is fixed by the second fixing unit is cured to form a silicone-based elastomer sheet. 13. A method for manufacturing an embedded RFID tag.