JP2008250673A - Mounting structure for ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the mounting structure of an IC tag for accurately achieving communication between an IC tag and a reader/writer, and for preventing a communication distance from being deteriorated even when an inexpensive and general-purpose IC tag is mounted on metallic materials. <P>SOLUTION: Silicon system sealing materials 3 with a silicon polymer as a main component are applied to a surface of metal 1, and an IC tag 5 is loaded on the sealing materials 3 to be attached in such a state that the sealing materials 3 are not hardened. The IC tag 5 is a wirelessly communicatable IC tag which is inexpensive and available even under a high temperature environment to be generally used for cleaning or the like. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an IC tag that can be read and written in a non-contact manner, and relates to an IC tag mounting structure that can be suitably used by suppressing communication hindrance when mounted on a metal product.

IC tags record and hold information and can exchange information by communicating with external devices in a non-contact manner. In recent years, IC tags are frequently used as recognition media in transportation and logistics, or for various purposes such as product quality control and inventory management. It is becoming.
Such an IC tag is composed of an IC chip on which information is recorded and a wireless antenna, and is used by being affixed or embedded in an object. When reading information recorded on an IC chip, simply hold the reader (reader / writer) over the IC tag to communicate with the reader / writer, and contactlessly record information on the IC chip. Read.

However, generally, when an IC tag is attached to a metal, it becomes difficult to transmit / receive data to / from a reader / writer due to the influence of the metal, and the communication distance is significantly reduced.
Therefore, as a technique that does not reduce the communication distance even if it is attached to a metal, a method of arranging an electromagnetic shield member on the metal side surface of the IC tag is known (Patent Document 1).
However, in the method in which the electromagnetic shielding member is disposed between the IC tag and the metal, the members must be integrated with an adhesive, and the mounting work becomes complicated.

Also, an IC tag that changes the configuration of the IC tag to a metal-dedicated one and avoids the influence of the metal is commercially available, but the metal-dedicated IC tag is expensive. Sealed metal IC tags are also commercially available, but cannot be used in high temperature environments.
JP 2006-202318 A

Therefore, the present inventors have intensively studied in view of the above problems, and as a result, found that the influence of the metal can be avoided by interposing a sealing material between the metal and the IC tag, leading to the present invention. .
That is, the object of the present invention is to provide a simple and economical IC tag mounting structure that can provide a sufficient communication distance even when an existing general-purpose IC tag is used for metal, can be used in a high temperature environment. There is to do.

  The present invention is a structure for attaching an IC tag to a metal, wherein the IC tag is attached to a metal via a sealing material.

  The present invention makes it possible to attach an inexpensive general-purpose IC tag to a metal material while ensuring good original communication characteristics, and can be used in a high-temperature environment. A significant IC tag mounting structure can be provided.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an explanatory diagram of an IC tag mounting structure according to the first embodiment of the present invention. Fig.1 (a) is a top view, FIG.1 (b) is AA arrow sectional drawing in Fig.1 (a).

  In the present embodiment, a sealing material 3 is applied to the surface of the metal 1, and an IC tag 5 is mounted on the sealing material 3. By attaching the IC tag to the metal via the sealing material, it is possible to suppress the influence of the metal and to perform good communication between the IC tag and the reader / writer.

  The sealant 3 used in the present invention is a commercially available silicone sealant.

  The coating amount of the sealing material 3 is not particularly limited, but it is preferable that the coating thickness is about 1 cm and the coating range is about 1 cm larger than the tag size.

  As the IC tag 5, a general-purpose wireless IC tag can be used, and when used in a high temperature environment, an IC tag developed for heat resistance and cleaning can be preferably used.

  In attaching the IC tag in this embodiment, first, the sealing material 3 is applied to the surface of the metal 1 in a range slightly wider than the attachment surface of the IC tag to be attached, and the applied sealing material 3 is in an uncured state. This is done by placing the IC tag 5 on the top and sticking it.

  According to the first embodiment, even an existing general-purpose IC tag can be used by being attached to metal while ensuring good original communication characteristics.

FIG. 2 is an explanatory diagram of an IC tag mounting structure according to the second embodiment of the present invention. 2A is a plan view, and FIG. 2B is a cross-sectional view taken along the line AA in FIG. 2A.
In the components in the second embodiment, the same members as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In this embodiment, an IC tag 5 covered with a sealing material 3 is mounted on a metal 1. By covering and mounting the IC tag with a sealing material, it is possible to satisfactorily perform communication between the IC tag and the reader / writer while suppressing the influence of metal.

  The coating amount of the sealing material 3 is not particularly limited, but it is preferable that the coating thickness is about 1 cm and the coating range is about 1 cm larger than the tag size.

  In attaching the IC tag in the present embodiment, first, the sealing material 3 is applied to the surface of the metal 1 in a range slightly wider than the attachment surface of the IC tag to be attached, and the applied sealing material 3 is uncured. The IC tag 5 is placed on the IC tag 5 and the sealing material 3 is further applied on the IC tag 5.

  According to the second embodiment, even with an existing general-purpose IC tag, the original communication characteristics can be secured satisfactorily and used by being attached to metal.

FIG. 3 is an explanatory diagram of an IC tag according to the third embodiment of the present invention. Fig.3 (a) is a top view, FIG.3 (b) is AA arrow sectional drawing in Fig.3 (a).
In the third embodiment, the same members as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In this embodiment, a recess 7 is provided in the metal 1, and an IC tag 5 is mounted on a sealing material 3 applied to the bottom of the recess 7. By mounting the IC tag via the sealing material, it is possible to suppress the influence of metal and to perform good communication between the IC tag and the reader / writer.

  The shape and size of the recess 7 are not particularly limited, and in the present embodiment, it is a cylindrical space, but is appropriately selected in consideration of the shape and size of the IC tag 5.

  The coating amount of the sealing material 3 is not particularly limited, but it is preferable that the coating thickness is about 1 cm and the coating range is about 1 cm larger than the tag size.

  In attaching the IC tag in the present embodiment, first, the recess 7 is formed at the attachment position of the IC tag 5 on the surface of the metal 1. The sealing material 3 is applied to the bottom of the recess 7, and the IC tag 5 is placed on the sealing material 3 and pasted in a state where the applied sealing material 3 is uncured.

  As described above, according to the third embodiment, even an existing general-purpose IC tag can be used by attaching it to metal while ensuring good original communication characteristics. In addition, by mounting the IC tag in the recess, there is no protrusion on the metal surface, and it is possible to prevent dropping or damage due to catching or pressing.

FIG. 4 is an explanatory diagram of an IC tag according to the fourth embodiment of the present invention. 4A is a plan view, and FIG. 4B is a cross-sectional view taken along the line AA in FIG. 4A.
In the fourth embodiment, the same members as those in the first to third embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.

  In this embodiment, an IC tag 5 covered with a sealing material 3 is attached to a recess 7 provided in the metal 1. By mounting the IC tag covered with the sealing material, it is possible to satisfactorily perform communication between the IC tag and the reader / writer while suppressing the influence of metal.

  The coating amount of the sealing material 3 is not particularly limited, but it is preferable that the coating thickness is about 1 cm and the coating range is about 1 cm larger than the tag size.

  In attaching the IC tag in the present embodiment, first, the recess 7 is formed at the attachment position of the IC tag 5 on the surface of the metal 1. By applying the sealing material 3 to the bottom of the recess 7, placing the IC tag 5 on the sealing material 3 with the applied sealing material 3 uncured, and further applying the sealing material 3 on the IC tag 5 Done.

  As described above, according to the fourth embodiment, even an existing general-purpose IC tag can be used by attaching it to metal while ensuring good original communication characteristics. In addition, by mounting the IC tag in the recess, there is no protrusion on the metal surface, and it is possible to prevent dropping or damage due to catching or pressing.

The technical scope of the present invention is not limited to the above-described embodiments, and various modifications and variations of the embodiments are also included in the technical scope of the present invention.
For example, in each embodiment, the IC tag 5 has a substantially circular planar shape, but is not limited thereto, and may have another shape, for example, a substantially rectangular shape. Further, the concave portion 7 may have a square columnar space. In each embodiment, a sealing material is applied to a metal surface, and then an IC tag is attached. However, the IC tag and the sealing material are previously processed integrally (the sealing material is in an uncured state) May be attached to a metal surface.

5 is applied to the surface of the cylinder shown in FIG. 5 (10 in FIG. 5) with a silicone sealant composed mainly of a silicone polymer in a thickness of 1 cm, and a coin-type IC tag for cleaning is provided at the center of the sealant. Was attached to create a cylinder with an IC tag.
Using this IC-tagged cylinder, a communication test with a reader / writer was conducted. When the maximum communication distance was measured, the result was 2 cm, and good communication was possible.

A cylinder with an IC tag was prepared in the same manner as in Example 1 except that the IC tag was a heat-resistant IC tag and the sealing material was applied with a thickness of 1 cm.
Using this cylinder with an IC tag, a communication test with a reader / writer was conducted in the same manner as in Example 1. When the maximum communication distance was measured, the result was 3 cm, and good communication was possible.

As in Example 1, the silicone sealant used in Example 1 was applied to the surface of the cylinder with a thickness of 1 cm, and a coin-type IC tag for cleaning was attached to the center of the applied sealant. A sealing material was applied at a thickness of 1 cm on the IC tag to create a cylinder with an IC tag.
Using this cylinder with an IC tag, a communication test with a reader / writer was conducted in the same manner as in Example 1. When the maximum communication distance was measured, the result was 2 cm, and good communication was possible.

A cylinder with an IC tag was prepared in the same manner as in Example 3 except that the IC tag was a heat-resistant IC tag and the sealing material was applied to the surface of the cylinder with a thickness of 1 cm and further onto the IC tag with a thickness of 1 cm.
Using this cylinder with an IC tag, a communication test with a reader / writer was conducted in the same manner as in Example 1. When the maximum communication distance was measured, the result was 2 cm, and good communication was possible.

(Comparative Example 1)
A cleaning tag used in Example 1 was placed on the surface of a cylinder similar to that in Example 1 to produce a cylinder with an IC tag for comparison test.
Using this IC-tagged cylinder, a communication test with a reader / writer was carried out in the same manner as in Example 1. As a result, reading was impossible.

It is explanatory drawing of the IC tag attachment structure which concerns on 1st Embodiment. It is explanatory drawing of the IC tag attachment structure which concerns on 2nd Embodiment. It is explanatory drawing of the IC tag attachment structure which concerns on 3rd Embodiment. It is explanatory drawing of the IC tag attachment structure which concerns on 4th Embodiment. It is explanatory drawing of the cylinder used by the Example and the comparative example.

Explanation of symbols

1 ... Metal 3 ... Sealing material 5 ... IC tag 7 ... Recess 9 ... Cylinder

Claims (3)

A structure for attaching an IC tag to metal,
An IC tag mounting structure, wherein the IC tag is attached to a metal via a sealing material.   The IC tag mounting structure according to claim 1, wherein the IC tag is covered with the sealing material.   3. The IC tag mounting structure according to claim 1, wherein the metal has a recess, and the IC tag is attached to the recess.

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