JP2011150676A - Non-contact type data receiver-transmitter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact type data receiver/transmitter which is excellent in weather resistance, heat resistance, and flexibility, and prevents a crack from being generated in a protective film. <P>SOLUTION: A non-contact type data receiver-transmitter 10 is provided with: an inlet 11; a coating material 12 for coating one surface 11a of the inlet 11; and a protective film 20 provided on one surface 12a of the coating material 12. The protective film 20 is constituted of multiple dot-shaped fine films 21 arranged at equal interval on one surface 12a of the coating material 12. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

 The present invention relates to a non-contact type data receiver / receiver that can receive information from the outside using electromagnetic waves or radio waves as a medium, and can transmit information to the outside, such as an information recording medium for RFID (Radio Frequency IDentification). In particular, the present invention relates to a contactless data receiving / transmitting body excellent in weather resistance, heat resistance and flexibility.

 An IC tag, which is an example of a non-contact type data transmitting / receiving body, includes an inlet composed of a base material, an antenna provided on one surface thereof and connected to each other, and an information writing / reading When an electromagnetic wave or radio wave is received from the device, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is converted into a signal. Transmitted from the antenna.

In order to make such an IC tag excellent in heat resistance, weather resistance and flexibility, various packaged IC tags have been studied.
For example, an inlet is stored in a storage portion (storage space) provided in a housing made of silicon resin, polytetrafluoroethylene resin, or the like, and the storage portion containing the inlet is sealed with the same material as the housing. An IC tag sealed with a stop member is known (for example, see Patent Document 1).
Further, an IC tag in which an inlet is molded only with a resin such as an epoxy resin and packaged is known (see, for example, Patent Document 2).
Further, there is known an IC tag in which a thin sheet-like circuit portion is sandwiched by a surface base material made of a urethane resin coated with a silicone film via an adhesive, and these are integrated (for example, patents) Reference 3).

JP 2002-024783 A JP 2002-31747 A JP 2005-056362 A

 The surface of the IC tag as described above is variously provided to provide weather resistance by closing air bubbles (pores) generated on the surface of the IC tag by curing a coating material such as an epoxy resin covering the inlet. A protective film made of the above resin may be formed.

 By the way, when the IC tag is thin and flexible, the inlet and the covering material are mainly composed of a soft material, but the above protective film imparts weather resistance to the IC tag. Therefore, the protective film is often formed of a hard resin because it is provided not only for the purpose but also for imparting scratch strength to the surface of the IC tag. Thus, when the IC tag is a laminate in which an inlet and a covering material made of a soft material and a protective film made of a hard material are laminated, the hard material is inferior in flexibility as compared with the soft material, The IC tag has poor shape followability between the soft material and the hard material, and when the IC tag is bent, the protective film may be cracked. And when a crack arises in such a protective film, there existed a problem that the external appearance and weather resistance of an IC tag were impaired.

 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a non-contact type data transmitter / receiver that is excellent in weather resistance, heat resistance, and flexibility and prevents the protective film from cracking. And

 The non-contact type data transmitting / receiving body of the present invention includes an inlet, a covering material that covers at least the surface of the inlet where the IC chip is provided, and a surface opposite to the surface of the covering material that is in contact with the inlet. a non-contact type data receiving / transmitting body provided with a protective film provided on α, wherein the covering material is made of a two-component curable urethane adhesive, and the protective film is equidistant from the surface α. The fine film is formed so as to cover the bubbles existing on the surface α.

 The fine film is preferably provided so as to fill the bubbles.

 It is preferable that both surfaces of the inlet are covered with the covering material.

  According to the non-contact type data receiving / transmitting body of the present invention, the inlet, the covering material that covers at least the surface of the inlet where the IC chip is provided, and the surface of the covering material that is opposite to the surface in contact with the inlet And a protective film provided on the surface α of the non-contact type data receiving and transmitting body, wherein the covering material is made of a two-component curable urethane adhesive, and the protective film is formed on the surface α. It is composed of a large number of dot-like fine films provided at equal intervals, and the fine film is provided so as to cover the bubbles existing on the surface α, so that when the non-contact type data receiving / transmitting body is bent, In addition, since the laminate of the inlet and the covering material bends between a large number of microfilms (between microfilms and areas where no microfilm is provided), the protective film does not crack, Excellent flexibility. Therefore, the non-contact type data transmitting / receiving body of the present invention has excellent flexibility and weather resistance without impairing the appearance.

It is the schematic which shows 1st embodiment of the non-contact-type data transmission / reception body of this invention, (a) is a perspective view, (b) is sectional drawing which follows the AA line of (a). It is the schematic which shows the 1st example of arrangement | positioning of the fine film | membrane which comprises a protective film, (a) is a top view, (b) is sectional drawing which follows the BB line of (a). It is a schematic plan view which shows the 2nd example of arrangement | positioning of the fine film | membrane which comprises a protective film. It is the schematic which shows the 3rd example of arrangement | positioning of the fine film | membrane which comprises a protective film, (a) is a top view, (b) is sectional drawing which follows the CC line of (a). It is a schematic plan view which shows the 4th example of arrangement | positioning of the fine film | membrane which comprises a protective film. It is a schematic plan view which shows the 5th example of arrangement | positioning of the fine film | membrane which comprises a protective film. It is a schematic perspective view which shows process A in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process B is shown and it is a schematic sectional drawing in alignment with the DD line | wire of FIG. It is a schematic sectional drawing which shows process C in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process D in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process E in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is the schematic which shows 2nd embodiment of the non-contact-type data transmission / reception body of this invention, (a) is a perspective view, (b) is sectional drawing which follows the EE line of (a). It is a schematic perspective view which shows the process A in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process B is shown and it is schematic sectional drawing in alignment with the FF line of FIG. It is a schematic perspective view which shows the process F and the process G in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process G is shown and it is a schematic sectional drawing in alignment with the GG line of FIG. It is a schematic sectional drawing which shows process C in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process D in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process E in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention.

An embodiment of the non-contact type data receiving / transmitting body of the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment “Non-contact Data Receiver / Transmitter”
1A and 1B are schematic views showing a first embodiment of a non-contact type data receiving / transmitting body of the present invention, wherein FIG. 1A is a perspective view, and FIG. 1B is a cross-sectional view taken along line AA of FIG. It is.
The non-contact type data receiving / transmitting body 10 of this embodiment includes an inlet 11 having a substantially rectangular shape in plan view, a covering material 12 covering one surface 11a of the inlet 11, and a surface in contact with the inlet 11 of the covering material 12. And a protective film 20 provided on the opposite surface (hereinafter referred to as “one surface”) 12a.

 That is, in the non-contact type data receiving / transmitting body 10, the one surface 11 a of the inlet 11 is directly covered with the covering material 12, and the one surface 12 a of the covering material 12 is directly covered with the protective film 20. The inlet 11, the covering material 12, and the protective film 20 have a structure in which they are laminated in this order in the thickness direction. Thereby, the non-contact type data receiving / transmitting body 10 has a substantially rectangular shape in plan view.

Moreover, the inlet 11 is schematically configured by a base material 13 and an IC chip 14 and an antenna 15 which are provided on one surface 13a of the base material 13 and are electrically connected to each other.
The antenna 15 is a dipole antenna composed of a pair of planar radiating elements 16 and 17 which are made of various conductors, face each other, and have feeding points (portions connected to the IC chip 14) on the opposite sides. is there.
The length in the longitudinal direction of the antenna 15 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 16 and 17 is a length corresponding to a quarter wavelength.

The one surface 11 a of the inlet 11 corresponds to the one surface 13 a of the base material 13.
Therefore, on one surface 11 a of the inlet 11, the IC chip 14 and the antenna 15 are covered with the covering material 12.

 And the end surface of the base material 13, the end surface of the coating | covering material 12, and the end surface of the protective film 20 have comprised the same surface in the four side surfaces of the non-contact-type data transmission / reception body 10. FIG. More specifically, for example, on the side surface 10a of the non-contact type data transmitting / receiving body 10, the end surface 13b of the base material 13, the end surface 12b of the covering material 12, and the end surface 20a of the protective film 20 are the same surface. . Similarly, the end surface 13c of the base material 13, the end surface 12c of the covering material 12, and the end surface 20b of the protective film 20 are the same surface on the side surface 10b of the non-contact type data transmitting / receiving body 10.

 The thickness of the covering material 12 is not particularly limited, but at least the unevenness caused by the IC chip 14 and the antenna 15 of the inlet 11 does not appear on one surface (outer surface) 10c of the non-contact type data transmitter / receiver 10; And it is a grade which the inlet 11 is not damaged by the impact from the outside, for example, exists in the range of 10 micrometers-2000 mm.

The protective film 20 is composed of a large number of dot-like fine films 21 provided at equal intervals on the entire one surface 12 a of the covering material 12.
The fine film 21 is formed by applying a large number of dot-like (dot-like) protective agents forming the same to the one surface 12a of the covering material 12 at equal intervals, and curing the dot-like protective agent. It is a film.

 The fine film 21 constituting the protective film 20 is provided so as to cover the bubbles (pores) 12d generated on the one surface 12a of the coating material 12 when the adhesive forming the coating material 12 is cured. In addition, it is preferable to be provided so as to fill the bubbles (pores) 12d.

 Here, with reference to FIGS. 2 to 6, the arrangement (first to fifth examples) of a large number of fine films 21 constituting the protective film 20 will be described.

"First example"
2A and 2B are schematic views showing a first example of the arrangement of the fine film 21 constituting the protective film 20, wherein FIG. 2A is a plan view and FIG. 2B is a cross-sectional view taken along line BB in FIG. It is.
In this example, a large number of circular microscopic films 21 constituting the protective film 20 are arranged in a matrix on one surface 12 a of the covering material 12.
Here, the fact that the fine films 21 are arranged in a matrix means that in one surface 12a of the covering material 12, in the longitudinal direction of the covering material 12 (the short side direction of the non-contact type data transmitting / receiving body 10). In many rows (L ₁ , L ₂ , L ₃ , L ₄ , L ₅ , L ₆ , L ₇ , L ₈ , L ₉ , L ₁₀ ,...) Extending along the fine film 21 21 are arranged at equal intervals, and the rows (l ₁ , l ₂ ,) of the fine films 21 extending along the lateral direction of the covering material 12 (long-side direction of the non-contact type data transmitter / receiver 10). (l ₃ , l ₄ ,...)) means that the fine films 21 are arranged at equal intervals.

In other words, the fine films 21 are arranged at equal intervals in all the columns L ₁ , L ₂ , L ₃ , L ₄ , L ₅ , L ₆ , L ₇ , L ₈ , L ₉ , L ₁₀ ,. That is, between the adjacent columns (for example, between the columns L ₁ and L ₂ ), the fine films 21 are arranged at equal intervals, and the non-contact type data transmitting / receiving body 10 is viewed from the side (FIG. 2). (B) (refer to the cross-sectional view), it means that the fine film 21 overlaps between adjacent rows.
Further, in all the rows l ₁ , l ₂ , l ₃ , l ₄ ,..., That the fine films 21 are arranged at equal intervals means that between adjacent rows (for example, row l ₁ and row l _2). (Between), the fine films 21 are arranged at equal intervals, and when the non-contact data receiving / transmitting body 10 is viewed from the side, the fine films 21 are overlapped between adjacent rows.

The interval between the fine films 21 in the rows L ₁ , L ₂ , L ₃ , L ₄ , L ₅ , L ₆ , L ₇ , L ₈ , L ₉ , L ₁₀ ,. On the one surface 12a, it is preferable that the interval is such that the fine film 21 can cover the bubbles (pores) 12d no matter where the bubbles (pores) 12d are generated. Specifically, since the size (opening diameter) of the bubbles (pores) 12d generated on one surface 12a of the covering material 12 is 100 μm to 2 mm, the rows L ₁ , L ₂ , L ₃ , L ₄ , L More preferably, the distance between the fine films 21 of L ₅ , L ₆ , L ₇ , L ₈ , L ₉ , L ₁₀ ,... Is 100 μm to 2 mm.

The distance between the fine films 21 in the rows l ₁ , l ₂ , l ₃ , l ₄ ,... Is not particularly limited, but it is assumed that bubbles (pores) 12d are generated on one surface 12a of the covering material 12. However, it is preferable that the intervals be such that the fine film 21 can cover the bubbles (pores) 12d. Specifically, since the size (opening diameter) of the bubbles (pores) 12d generated on the one surface 12a of the covering material 12 is 100 μm to 2 mm, the rows l ₁ , l ₂ , l ₃ , l ₄ ,. The interval between the fine films 21 is more preferably 100 μm to 2 mm.

Furthermore, column _{L 1, L 2, L 3} , L 4, L 5, L 6, L 7, L 8, L 9, L 10, ··· spacing fine film 21 (e.g., the distance _{D 1} )) And the distance between the fine films 21 in the rows l ₁ , l ₂ , l ₃ , l ₄ ,... (For example, the distance D ₂ ) may be the same or different. However, the non-contact type data receiving / transmitting body 10 can be easily bent in any direction without being affected by the presence of the large number of fine films 21 (the large number of fine films 21 are non-contact type data receiving / transmitting bodies). 10) or when the non-contact type data receiving / transmitting body 10 is bent, the stress is concentrated locally, and the non-contact type data receiving is received at the stress concentrated portion. etc. can be prevented from transmitting member 10 is broken, the distance D ₁ and the distance D ₂ of the above equal Preferred.

 Further, the outer diameter of the fine film 21 is not particularly limited, but the fine film 21 covers the bubbles (pores) 12d no matter where the bubbles (pores) 12d occur on the one surface 12a of the covering material 12. It is preferable that it is the extent which can be performed. Specifically, since the size (opening diameter) of the bubbles (pores) 12d generated on the one surface 12a of the covering material 12 is 100 μm to 2 mm, the outer diameter of the fine film 21 is 100 μm to 2 mm. More preferred.

 Note that “the fine film 21 covers the bubbles (pores) 12d” not only means that one bubble (pore) 12d is covered by one fine film 21, but also two or more fine films. 21 includes a case where one bubble (pore) 12d is covered. In addition, “the fine membrane 21 covers the bubbles (pores) 12d” is not only the case where the entire opening of one bubble (pore) 12d is covered, but also one bubble (pore) 12d. The case where a part of the opening is covered is also included. In order to prevent the weather resistance of the non-contact type data receiving / transmitting body 10 from being impaired, and to improve the appearance of the non-contact type data receiving / transmitting body 10, one or more fine films 21 are provided. Is preferably provided so as to fill one bubble (pore) 12d.

"Second example"
FIG. 3 is a schematic plan view showing a second example of the arrangement of the fine film 21 constituting the protective film 20.
In this example, on one surface 12a of the covering material 12, a large number of circular microscopic films 21 constituting the protective film 20 are arranged in the lateral direction of the covering material 12 (the long side of the non-contact type data transmitter / receiver 10). Are arranged in a number of rows, and the fine films 21 constituting each row are arranged in a number of rows along the longitudinal direction of the covering material 12 (the short side direction of the non-contact type data transmitter / receiver 10). Not arranged.

Here, the fine films 21 are arranged in a number of rows. The rows (l ₁₁₎ of the fine films 21 extending along the lateral direction of the covering material 12 on one surface 12a of the covering material 12. , L ₁₂ , l ₁₃ , l ₁₄ ,...)), The fine films 21 are arranged at equal intervals.

Further, the fact that the fine films 21 constituting each row are not arranged in a large number of columns along the longitudinal direction of the covering material 12 is, specifically, the direction of the short side of the non-contact type data receiving / transmitting body 10 straight line passing through the center of the fine film 21 _{l 12} along the _can so pass through the midpoint of the two fine films 21 and 21 adjacent to each other in _{l 11,} that row _{l 11} and line _{l 12} is arranged To tell.
In other words, the fine films 21 constituting each row are not arranged in a large number of columns along the longitudinal direction of the covering material 12 when the non-contact type data receiving / transmitting body 10 is viewed from the side. It means that the fine films 21 do not overlap between the rows (for example, between the rows ₁₁ and ₁₂ ).

The distance between the fine films 21 in the rows l ₁₁ , l ₁₂ , l ₁₃ , l ₁₄ ,... Is not particularly limited, but it is assumed that bubbles (pores) 12d are generated on one surface 12a of the covering material 12. However, it is preferable that the intervals be such that the fine film 21 can cover the bubbles (pores) 12d. Specifically, since the size (opening diameter) of the bubbles (pores) 12d generated on one surface 12a of the covering material 12 is 100 μm to 2 mm, the rows l ₁₁ , l ₁₂ , l ₁₃ , l ₁₄ ,. The interval between the fine films 21 is more preferably 100 μm to 2 mm.

 Further, the outer diameter of the fine film 21 is more preferably 100 μm to 2 mm, as in the first example.

"Third example"
4A and 4B are schematic views showing a third example of the arrangement of the fine film 21 constituting the protective film 20, wherein FIG. 4A is a plan view and FIG. 4B is a cross-sectional view taken along the line CC of FIG. It is.
In this example, on one surface 12a of the covering material 12, a large number of circular microscopic films 21 constituting the protective film 20 are arranged in the lateral direction of the covering material 12 (the long side of the non-contact type data transmitter / receiver 10). Are arranged in a number of rows, and the fine films 21 constituting each row are arranged in a number of rows along the longitudinal direction of the covering material 12 (the short side direction of the non-contact type data transmitter / receiver 10). In addition, the adjacent fine films 21 are in contact with each other (externally).

Here, the fine films 21 are arranged in a number of rows. The lines (l ₂₁₎ of the fine films 21 extending along the lateral direction of the covering material 12 on one surface 12 a of the covering material 12. , L ₂₂ , l ₂₃ , l ₂₄ ,...)), The fine films 21 are arranged at equal intervals.

Further, the fact that the fine films 21 constituting each row are not arranged in a large number of columns along the longitudinal direction of the covering material 12 is, specifically, the direction of the short side of the non-contact type data receiving / transmitting body 10 The line l ₂₁ and the line l ₂₂ are arranged so that a straight line passing through the center of the fine film 21 of the l ₂₂ passes along the midpoint between the two fine films 21 and 21 adjacent to each other in the l ₂₁ . To tell.
In other words, the fine films 21 constituting each row are not arranged in a large number of columns along the longitudinal direction of the covering material 12 when the non-contact type data receiving / transmitting body 10 is viewed from the side. It means that the fine films 21 do not overlap between the rows (for example, between the rows l ₂₁ and l ₂₂ ).

Furthermore, the adjacent fine films 21 are in contact with each other (circumscribed). In the rows l ₂₁ , l ₂₂ , l ₂₃ , l ₂₄ ,..., The fine films 21 are in contact with each other (enclosed). Also, it means that the fine films 21 are in contact (external) with each other even between adjacent rows (for example, between the rows l ₂₁ and l ₂₂ ). That is, between the adjacent rows, for example, between the row l ₂₁ and the row l ₂₂ , as described above, the straight line passing through the center of the fine film 21 of the l ₂₂ has two fine films 21 and 21 adjacent in the l ₂₁ . Therefore, two fine films 21 are in contact (externally) with respect to one fine film 21 between rows l ₂₁ and l ₂₂ .
That is, in this third example, a large number of fine films 21 are arranged in a hexagonal close-packed structure on one surface 12 a of the covering material 12.

 Further, the outer diameter of the fine film 21 is more preferably 100 μm to 2 mm, as in the first example.

 In this way, a large number of fine films 21 are arranged in a large number of rows along the lateral direction of the covering material 12, and the fine films 21 constituting each row are formed in a number of rows along the longitudinal direction of the covering material 12. In addition, if adjacent fine films 21 are in contact with each other (externally), in one surface 12 a of the covering material 12, a region where the fine film 21 is not provided, that is, the protective film 20. Since the uncovered area is reduced, the non-contact type data receiving / transmitting body 10 is more excellent in weather resistance.

 In this example, the adjacent fine films 21 are in contact (external) with each other and never overlap each other. That is, since the fine film 21 is formed by applying a protective agent described later by printing, as shown in FIG. 4B (see also FIG. 2B), its cross-sectional shape is protected. Since the convexity gradually decreases in diameter from the portion in contact with the one surface 12a of the covering material 12 due to the surface tension of the agent, the adjacent fine films 21 are mutually adjacent to each other. Is in contact with the outer periphery of the portion in contact with the surface 12a. Accordingly, the non-contact type data receiving / transmitting body 10 is easily deformed at a portion where the adjacent fine films 21 are in contact (boundary points of the adjacent fine films 21). Flexibility is not impaired.

 In the above first to third examples, the case where the fine film 21 having a circular shape in plan view is provided is illustrated, but the present invention is not limited to this. In the present invention, the shape of the fine film is any shape as long as a large number of fine films can be densely provided on the surface opposite to the surface in contact with the inlet of the coating material. For example, it may be a triangular shape in plan view, a quadrangular shape in plan view, a pentagonal shape in plan view, a hexagonal shape in plan view, or the like.

"Fourth Example"
FIG. 5 is a schematic plan view showing a fourth example of the arrangement of the fine film 21 constituting the protective film 20.
In this example, on one surface 12a of the covering material 12, a large number of fine films 21 constituting the protective film 20 are arranged in a honeycomb shape.

 In this example, the fact that a large number of fine films 21 are arranged in a honeycomb shape means that a large number of fine films 21 having a regular hexagonal shape in plan view are arranged closest to each other at a predetermined interval. To tell.

 The interval between the fine films 21 is not particularly limited, but the fine film 21 can cover the bubbles (pores) 12d no matter where the bubbles (pores) 12d occur on one surface 12a of the covering material 12. It is preferable that the interval is about. Specifically, since the size (opening diameter) of the bubbles (pores) 12d generated on the one surface 12a of the covering material 12 is 100 μm to 2 mm, the interval between the fine films 21 is more preferably 100 μm to 2 mm. preferable.

The length D ₄ between two points of the regular hexagon facing each other in the fine film 21 is not particularly limited, but the fine film no matter where bubbles (pores) 12d occur on one surface 12a of the covering material 12. It is preferable that 21 can cover the bubbles (pores) 12d. Specifically, since the size (opening diameter) of the bubbles (pores) 12d generated on the one surface 12a of the covering material 12 is 100 μm to 2 mm, the length D ₄ of the fine film 21 is 100 μm to 2 mm. More preferably.
In addition, the length D ₅ between two opposing sides of the regular hexagon in the fine film 21 is not particularly limited, but no matter where bubbles (pores) 12d occur on one surface 12a of the covering material 12, It is preferable that the fine film 21 can cover the bubbles (pores) 12d. Specifically, since the size (opening diameter) of the bubbles (pores) 12d generated on the one surface 12a of the covering material 12 is 100 μm to 2 mm, the length D ₅ of the fine film 21 is 100 μm to 2 mm. It is more preferable.

"Fifth Example"
FIG. 6 is a schematic plan view showing a fifth example of the arrangement of the fine film 21 constituting the protective film 20.
In this example, on one surface 12a of the covering material 12, a large number of fine films 21 constituting the protective film 20 are arranged in a honeycomb shape.

In this example, the fact that a large number of fine films 21 are arranged in a honeycomb shape means that a large number of fine hexagonal films 21 in a plan view are arranged in contact with each other (externally) without gaps. .
Also in this example, the adjacent fine films 21 are in contact (externally) with each other and never overlap each other. That is, since the fine film 21 is formed by applying a protective agent, which will be described later, by printing, as described above, the cross-sectional shape thereof is different from that of the one surface 12a of the covering material 12 due to the surface tension of the protective agent. Since the projecting shape gradually decreases in diameter from the contacting portion, the adjacent fine films 21 are in contact with each other at the outer periphery of the portion where each fine film 21 is in contact with one surface 12a of the covering material 12. Yes. Accordingly, the non-contact type data receiving / transmitting body 10 is easily deformed at a portion where the adjacent fine films 21 are in contact (boundary points of the adjacent fine films 21). Flexibility is not impaired.

As in the fourth example, the length D ₄ between two opposing points of the regular hexagon in the fine film 21 is more preferably 100 μm to 2 mm.
The length D ₅ between the two sides facing the regular hexagon in the fine layer 21, like the fourth example, and more preferably 100Myuemu～2mm.

 In this way, if a large number of fine films 21 are arranged in a honeycomb shape, a large number of the fine films 21 can be provided on the one surface 12a of the covering material 12 with almost no gap. The transmitter / receiver 10 is more excellent in weather resistance.

 In the first to fifth examples, the thickness of the protective film 20, that is, the thickness of the fine film 21 is not particularly limited, but at least the bubbles 12 d generated on the one surface 12 a of the covering material 12 are completely removed. The unevenness caused by the bubbles 12d is buried, and does not appear on one surface (outer surface) 10c of the non-contact type data receiving / transmitting body 10, and is opposite to the surface in contact with the covering material 12 of the protective film 20 The surface (outer surface) 20c forms a smooth surface, for example, in the range of 10 μm to 1000 mm.

 The covering material 12 is in a liquid state before use, and is composed of a two-component mixed urethane adhesive that cures by reaction between the main agent and the curing agent without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. Is.

As a two-component mixed urethane adhesive, a silane coupling agent having an epoxy group is further added to a mixed solution containing an isocyanate as a first solution and a polyol having a hydroxyl group as a second solution as a second solution. The added one is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. Moreover, the compounding quantity of the silane coupling agent which has an epoxy group with respect to whole quantity of this 2 liquid mixing type urethane type adhesive agent is 0.1 to 2.0 mass%.

Further, as the two-component mixed urethane adhesive, a mixed solution containing an isocyanate as the first solution and a polyol whose hydroxyl group is a primary hydroxyl group as the second solution has an aspect ratio of 10 or more, 100 What added the following inorganic fine particles is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. The blending amount of the inorganic fine particles having an aspect ratio of 10 or more and 100 or less with respect to the total amount of the two-component mixed urethane adhesive is 5% by mass or more and 40% by mass or less.

 Specific examples of such a two-component curable urethane-based adhesive include an adhesive composed of a main agent (trade name: MLT2900, manufactured by Etec) and a curing agent (trade name: G3021-B174, manufactured by Etec). .

 In addition, the adhesive forming the covering material 12 may contain a colorant such as a known inorganic pigment, organic pigment, or dye as necessary. The coating material 12 is colored in an arbitrary color by the colorant.

 As the substrate 13, a substrate made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE), polypropylene Base material made of polyolefin resin such as (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene; Made of polyamide resin such as nylon 6, nylon 6,6 Base material: Base material made of vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polyacryl Base material made of acrylic resin such as butyl; Base material made of polystyrene; Base material made of polycarbonate (PC); Base material made of polyarylate; Base material made of polyimide; Fine paper, thin paper, glassine paper, sulfate paper, etc. A substrate made of paper is used.

 The IC chip 14 is not particularly limited, and information can be written and read out in a non-contact state via the antenna 15. A non-contact IC tag, a non-contact IC label, or a non-contact IC card can be used. Anything can be used as long as it is applicable to RFID media.

 The antenna 15 is formed on one surface 13a of the base material 13 using a polymer type conductive ink in a predetermined pattern by a printing method such as screen printing or ink jet printing, or by etching the conductive foil. It is made by metal plating.

 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 15 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric current path of the coating film forming the antenna 15 is formed when the conductive fine particles constituting the coating film contact each other, and the resistance value of the coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.

 The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone, or a conductive resin fine particle in a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester and isocyanate). 60% by mass or more and a polyester resin of 10% by mass or more, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), heat Polyester resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinked type or A cross-linking / thermoplastic combination type is preferably used.

Examples of the conductive foil forming the antenna 15 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 15 include copper plating, silver plating, gold plating, and platinum plating.

As a material for forming the protective film 20, a protective agent that is liquid before use and is cured by irradiation with ultraviolet rays or heating is used.
As such a protective agent, it contains inorganic particles such as silica and titanium oxide and organic solids such as solid paraffin, wax and petrolatum (registered trademark), and these components are used as a photocurable resin or a thermosetting resin. A protective agent mixed with the resin is used. In this embodiment, the one containing silica and solid paraffin is used.

 According to the non-contact type data transmitting / receiving body 10, the protective film 20 is provided on the one surface 12 a of the covering material 12 that covers the one surface 11 a of the inlet 11, and the protective film 20 is provided on one surface of the covering material 12. Since it is composed of a large number of dot-like fine films 21 provided at equal intervals on the entire surface of 12a, when the non-contact type data receiving / transmitting body 10 is bent, a large number of fine films 21 (a fine Since the laminated body of the inlet 11 and the covering material 12 bends at the boundary part between the films 21 and the region where the fine film 21 is not provided), the protective film 20 is not cracked and has excellent flexibility. ing. Therefore, the non-contact type data receiving / transmitting body 10 is excellent in flexibility and weather resistance without impairing the appearance.

In the non-contact type data receiving / transmitting body 10, one surface 11 a of the inlet 11 is directly covered with the covering material 12, and one surface 12 a of the covering material 12 is directly covered with the protective film 20. Since it has a simple configuration, it can be easily manufactured.
In this embodiment, the case where the protective film 20 is composed of a large number of dot-like fine films 21 provided on the entire surface of the one surface 12a of the covering material 12 is illustrated, but the present invention is not limited to this. In this invention, the protective film comprised from a fine film may be provided only in the predetermined area | region in the surface on the opposite side to the surface which is in contact with the inlet of a coating | covering material.

Moreover, in this embodiment, although the case where the non-contact type data transmission / reception body 10 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 11 which has the antenna 15 which consists of a dipole antenna comprised from a pair of planar radiation elements 16 and 17 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 7-13, the manufacturing method of the non-contact-type data receiving / transmitting body of this embodiment is demonstrated.
Here, as shown in FIG. 8, a long base material 13A and one surface 13a thereof are provided with a large number of RFID antennas 15 and IC chips 14 communicating through the antennas 15 at equal intervals. The case where the above-mentioned non-contact type data receiving / transmitting body 10 is continuously manufactured using the inlet sheet 32 will be exemplified.

 First, as shown in FIG. 7, an adhesive is applied to the central portion of one surface 31 a of the long release substrate 31 being conveyed in the direction of the arrow in the drawing along the conveyance direction of the release substrate 31. The adhesive 12A discharged from the nozzle 41 of the apparatus is applied in a line (step A).

As adhesive 12A, the thing similar to the adhesive which forms said coating | covering material 12 is used.
Further, the width of the adhesive 12A applied to the one surface 31a of the release substrate 31, that is, the amount of the adhesive 12A applied to the one surface 31a of the release substrate 31 is not particularly limited, but the adhesive 12A Appropriate adjustments are made according to the size and number of the IC chip 14 and antenna 15 provided on the inlet sheet 32 to be coated, the thickness required for the covering material 12 formed by curing the adhesive 12A, and the like. Is done.

As the release substrate 31, a release film or release paper is used.
As the release film, one of the base films having a thickness of 30 μm to 160 μm made of plastic such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene naphthalate (PEN), polypropylene (PP), polyethylene (PE), etc. The surface and / or the other surface is provided with a release layer made of silicon and having a thickness of 1 μm to 50 μm. That is, one surface 31a of the peeling substrate 31 is composed of a peeling layer made of silicon.
Specific examples of such a release film include Tosero Separator SP-PET-01-BU (trade name) manufactured by Tosero Corporation.

As the release paper, a sealing agent is applied to one surface and / or the other surface of a 30 μm to 160 μm thick substrate made of glassine paper or fine paper, and on the layer made of the sealing agent, What provided the peeling layer with a thickness of 1 μm to 50 μm made of silicon is used. That is, one surface 31a of the peeling substrate 31 is composed of a peeling layer made of silicon.
Specific examples of such release paper include L11C (trade name) manufactured by Oji Tac Co., Ltd.

 The peeling force of the peeling substrate 31 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the release substrate 31, the adhesive is formed on the release layer (not shown) forming one surface 31a of the release substrate 31. Apply 12A.

 Next, as shown in FIG. 8, the inlet sheet 32 conveyed in the direction of the arrow in the figure is the part of the peeling base material 31 at a portion where the pair of rollers 42 and 43 that rotate in the direction of the arrow in the figure are opposed. While superposing on the one surface 31a of the peeling base material 31 conveyed in the direction of the arrow in the figure through the adhesive 12A applied to the one surface 31a, the peeling base material 31 and the inlet sheet 32 are placed on the roller 42. 9, the adhesive 12 </ b> A applied to one surface 31 a of the release substrate 31 is spread over almost the entire area between the release substrate 31 and the inlet sheet 32 (step B), as shown in FIG. 9. ).

 In this step B, one surface 13a of the substrate 13A, that is, the surface of the inlet sheet 32 on which the IC chip 14 and the antenna 15 are provided (hereinafter referred to as “one surface”) The inlet sheet 32 is overlaid on the one surface 31a of the peeling substrate 31 so that the 32a faces.

 Further, in the process B, as described above, the adhesive 12A made of a two-component mixed urethane resin that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the adhesive 12A has fluidity until it is developed between the release substrate 31 and the inlet sheet 32, but as the reaction proceeds, the adhesive 12A gradually loses fluidity, Eventually hardens. Thus, the one surface 32a of the inlet sheet 32, and the IC chip 14 and the antenna 15 provided on the one surface 32a are covered with the adhesive 12A, and on the one surface 31a of the peeling substrate 31. The inlet sheet 32 is temporarily secured. When the adhesive 12A is cured, the coating material 12 is obtained.

 Further, in step B, the thickness of the adhesive 12A after being developed between the peeling base material 31 and the inlet sheet 32 is at least uneven by the IC chip 14 and the antenna 15 of the inlet sheet 32. The IC chip 14 and the antenna 15 are not damaged on the surface 12a opposite to the surface in contact with the inlet sheet 32 and are not damaged by an external impact, for example, within a range of 10 μm to 2000 mm. .

In Step B, the force for sandwiching the release substrate 31 and the inlet sheet 32 between the pair of rollers 42 and 43, that is, the force (pressure) for pressing the inlet sheet 32 in the thickness direction against the release substrate 31 is is not particularly limited, the thickness or size of the release substrate 31 and the inlet sheet 32, depending on the amount of adhesive applied 12A, it is preferable that it is appropriately ^adjusted, it is 1kg / cm ² ~20kg / cm 2 , more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step B, the IC chip 14 and the antenna 15 are completely covered with the adhesive 12A, and the adhesive 12A is filled between the release substrate 31 and the inlet sheet 32 with almost no gap.

 Next, after the adhesive 12A is completely cured to become the covering material 12, as shown in FIG. 10, the release substrate 31 is removed from the laminate α1 composed of the release substrate 31, the inlet sheet 32, and the adhesive 12A. It peels (process C), and as shown in FIG. 11, 12 A of adhesive agents and the inlet sheet 32 are laminated | stacked and the laminated body (beta) 1 integrated is obtained.

 Next, as shown in FIG. 12, the surface 12a opposite to the surface in contact with the inlet 11 of the adhesive 12A (one surface) 12a is covered with the bubbles 12d generated on the one surface 12a. A number of protective agents for forming the fine film 21 constituting the protective film 20 are applied at regular intervals in the form of dots (dots), and the protective agent is cured to form the protective film 20 (step D).

 In this step D, as a method of applying a large number of dot-shaped (dot-shaped) protective agents to one surface 12a of the adhesive 12A at equal intervals, a portion through which the protective agent passes at a predetermined interval and a predetermined shape An offset printing method, a screen printing method, a gravure printing method, a coating method using a coater, or the like, to which a printing plate provided with is applied is used.

 In step D, a protective agent for forming the fine film 21 constituting the protective film 20 is applied so as to cover the bubbles (pores) 12d formed on the one surface 12a of the coating material 12, but the bubbles (pores) are applied. It is preferable to apply so as to fill 12d.

 Further, in Step D, the thickness of the protective agent for forming the protective film 20 is completely filled with at least the air bubbles 12d on one surface 12a of the adhesive 12A, and the unevenness caused by the air bubbles 12d is finally reduced. The outer surface 10c of the non-contact type data receiving / transmitting body 10 obtained in the above is not smooth and the outer surface 20c of the protective film 20 forms a smooth surface, for example, in the range of 10 μm to 1000 mm.

Next, as shown in FIG. 13, the laminated body γ1 composed of the protective film 20, the adhesive 12A, and the inlet sheet 32 is formed in the thickness direction thereof (in the one-dot chain line in FIG. 13) by a cutting blade (not shown) of the cutting device. Along with this, the laminate 15 is cut according to the shape of the antenna 15 to separate the laminate γ1 (step E), thereby obtaining the non-contact type data receiving / transmitting body 10 shown in FIG.
Here, to cut the laminated body γ1 according to the shape of the antenna 15 means to cut the laminated body γ1 according to the shape of the target non-contact type data receiving / transmitting body 10 without damaging the antenna 15.

 In addition, in this embodiment, although the case where the above-mentioned non-contact-type data receiving / transmitting body 10 was manufactured continuously using the long 1st peeling base material 31 and the inlet sheet 32 was illustrated, this invention Is not limited to this. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 Moreover, in this embodiment, although the case where the process E was performed after the process D was illustrated, this invention is not limited to this. In the present invention, the process may be ended in the process D, for example, when an inlet that has been separated in advance is used.

 Further, in this embodiment, after the step C, the step D for forming the protective film 20 on the one surface 12a of the adhesive 12A, and the laminate γ1 composed of the protective film 20, the adhesive 12A and the inlet sheet 32 are used as the antenna. Although the case where the process E cut | judging according to the shape of 15 is performed in this order was illustrated, this invention is not limited to this. In the present invention, after step C, step D and step E may be performed in any order. That is, in the present invention, in Step E, the laminate made of the adhesive and the inlet sheet is cut according to the shape of the antenna, and then in Step D, a protective film is formed on one surface of the adhesive. It may be formed.

 The density of bubbles generated in the covering material 12 (density on one surface 12a of the covering material 12) and the size of the bubbles are controlled by the humidity of the atmosphere from coating to curing of the covering material 12. Can do.

(2) Second Embodiment “Non-contact Data Receiver / Transmitter”
FIG. 14 is a schematic view showing a second embodiment of the non-contact type data receiving / transmitting body of the present invention, where (a) is a perspective view and (b) is a cross-sectional view taken along line EE of (a). It is.
The non-contact type data transmitting / receiving body 50 of this embodiment includes an inlet 51 having a substantially rectangular shape in plan view, a first covering member 53 that covers one surface 51a of the inlet 51, and the other surface 51b of the inlet 51. The first protection provided on the second covering material 54 to be coated and the surface 53a opposite to the surface in contact with the inlet 51 of the first covering material 53 (hereinafter referred to as “one surface”) 53a. Schematic configuration of the film 61 and a second protective film 62 provided on a surface (hereinafter referred to as “one surface”) 54 a opposite to the surface in contact with the inlet 51 of the second covering material 54. Has been.

The first covering material 53 and the second covering material 54 are collectively referred to as a covering material 52, and the first protective film 61 and the second protective film 62 are collectively referred to as a protective film 60. is there.
That is, in the non-contact type data receiving / transmitting body 50, both surfaces (one surface 51 a and the other surface 51 b) of the inlet 51 are directly covered with the covering material 52 and are in contact with the inlet 51 of the covering material 52. The surface opposite to the surface (one surface 52a and the other surface 52b) is directly covered with the protective film 60, and the first protective film 61, the first covering material 53, the inlet 51, the second surface The covering material 54 and the second protective film 62 are stacked in this order in the thickness direction. Thereby, the non-contact type data transmitting / receiving body 50 has a substantially rectangular shape in plan view.

Further, the inlet 51 is generally configured by a base material 55 and an IC chip 56 and an antenna 57 which are provided on one surface 55a of the base material 55 and are electrically connected to each other.
The antenna 57 is a dipole antenna composed of a pair of planar radiating elements 58 and 59 made of various conductors, facing each other and having feeding points (portions connected to the IC chip 56) on the facing sides. is there.
The length in the longitudinal direction of the antenna 57 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 58 and 59 is a length corresponding to a quarter wavelength.

One surface 51 a of the inlet 51 corresponds to one surface 55 a of the base material 55, and the other surface 51 b of the inlet 51 corresponds to the other surface 55 b of the base material 55.
Therefore, the IC chip 56 and the antenna 57 are covered with the first covering member 53 on the one surface 51 a of the inlet 51.

 And on the four side surfaces of the non-contact type data transmitting / receiving body 50, the end surface of the first protective film 61, the end surface of the first covering material 53, the end surface of the base material 55, the end surface of the second covering material 54, The end surfaces of the second protective film 62 are the same surface. More specifically, for example, on the side surface 50a of the non-contact type data transmitting / receiving body 50, the end surface 61a of the first protective film 61, the end surface 53b of the first covering material 53, the end surface 55c of the base 55, and the second The end surface 54b of the covering material 54 and the end surface 62a of the second protective film 62 are the same surface. Similarly, on the side surface 50b of the non-contact type data transmitting / receiving body 50, the end surface 61b of the first protective film 61, the end surface 53c of the first covering material 53, the end surface 55d of the base material 55, and the second covering material 54 are used. The end face 54c and the end face 62b of the second protective film 62 are on the same plane.

The thickness of the first covering material 53 is not particularly limited, but at least unevenness caused by the IC chip 56 and the antenna 57 of the inlet 51 appears on one surface (outer surface) 50 c of the non-contact type data receiving / transmitting body 50. And the inlet 51 is not damaged by an external impact, for example, in the range of 10 μm to 2000 mm.
The thickness of the second covering material 54 is not particularly limited, but is such that the inlet 51 is not damaged by an external impact, for example, in the range of 10 μm to 2000 mm.

 Furthermore, when the non-contact type data receiving / transmitting body 50 has sufficient flexibility (flexibility) and the non-contact type data receiving / transmitting body 50 is bent, the first covering material 53 is formed with respect to the inlet 51. In order to prevent the stress caused by the difference in thickness between the first covering material 54 and the second covering material 54, the thickness of the first covering material 53 is preferably equal to the thickness of the second covering material 54.

The first protective film 61 is composed of a large number of dot-like fine films 63 provided at equal intervals over the entire one surface 53 a of the first covering material 53.
Similarly, the second protective film 62 is composed of a large number of dot-like fine films 64 provided at equal intervals over the entire one surface 54 a of the second covering material 54.
In the fine films 63 and 64, a large number of protective agents forming the same are formed on the one surface 53a of the first coating material 53 or the one surface 54a of the second coating material 54 in the form of dots (dots). It is a point-like film formed by applying to the substrate and curing the point-like protective agent.

Further, the fine film 63 constituting the first protective film 61 is formed of bubbles (pores) generated on one surface 53a of the first coating material 53 when the adhesive forming the first coating material 53 is cured. ) 53d is preferably provided so as to cover the bubbles (pores) 53d.
Similarly, the fine film 64 constituting the second protective film 62 is formed of bubbles (thin film) generated on one surface 54a of the second coating material 54 when the adhesive forming the second coating material 54 is cured. (Hole) 54d is preferably provided so as to cover the bubble (pore) 54d.

 The arrangement of the fine films 63 constituting the first protective film 61 and the numerous 64 constituting the second protective film 62 is the same as in the first embodiment described above.

The thickness of the first protective film 61, that is, the thickness of the fine film 63 is not particularly limited, but at least the bubbles 53 d generated on one surface 53 a of the first covering material 53 are completely filled, and the bubbles The unevenness caused by 53d does not appear on one surface (outer surface) 50c of the non-contact type data transmitting / receiving body 50 and is opposite to the surface in contact with the first covering material 53 of the first protective film 61. The side surface (outer surface) 61c is a smooth surface, for example, within a range of 10 μm to 1000 mm.
In addition, the thickness of the second protective film 62, that is, the thickness of the fine film 64 is caused by completely filling the bubble 54d generated on at least one surface 54a of the second covering material 54 and causing the bubble 54d. The surface that does not appear on the other surface (outer surface) 50d of the non-contact type data transmitting / receiving body 50 and is opposite to the surface that is in contact with the second covering material 54 of the second protective film 62 ( The outer surface 62c is a smooth surface, for example, in the range of 10 μm to 1000 mm.

 Furthermore, when the non-contact type data receiving / transmitting body 50 has sufficient flexibility (flexibility) and the non-contact type data receiving / transmitting body 50 is bent, the first protective film 61 is applied to the inlet 51. In order to prevent the stress caused by the difference in thickness between the first protective film 62 and the second protective film 62, the thickness of the first protective film 61 and the thickness of the second protective film 62 are preferably equal.

 The covering material 52 (the first covering material 53 and the second covering material 54) is in a liquid state before use, and the main agent and the curing agent can be used without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. It consists of a two-component curable urethane adhesive that cures by reaction.

 As the two-component curable urethane adhesive, the same one as in the first embodiment described above is used.

 As the base material 55, the IC chip 56, and the antenna 57, those similar to those in the first embodiment described above are used.

As a material for forming the protective film 60 (the first protective film 61 and the second protective film 62), a protective agent that is liquid before use and is cured by irradiation with ultraviolet rays or heating is used. .
As such a protective agent, the same one as in the first embodiment described above is used.

 According to the non-contact type data receiving / transmitting body 50, the first protective film 61 is provided on one surface 53 a of the first covering material 53 that covers one surface 51 a of the inlet 51, and the other surface of the inlet 51. A second protective film 62 is provided on one surface 54 a of the second covering material 54 covering 51 b, and the first protective film 61 is equidistantly disposed on the entire surface of the one surface 53 a of the first covering material 53. A plurality of point-like fine films 63 provided on the entire surface of one surface 54a of the second covering material 54 at equal intervals. Since it is comprised from the film | membrane 64, when the non-contact-type data transmission / reception body 50 is bent, it is between many fine films | membranes 63, 64 (a boundary part of the fine films | membranes 63, 64, the fine film | membrane 63, In the region where 64 is not provided), a laminate of the inlet 51 and the covering material 52 Since the bent without cracks in the first protective film 61 and the second protective film 62, it is excellent in flexibility. Therefore, the non-contact type data receiving / transmitting body 50 is excellent in flexibility and weather resistance without impairing the appearance.

 Further, the non-contact type data receiving / transmitting body 50 is a surface in which one surface 51 a and the other surface 51 b of the inlet 51 are directly covered with the covering material 52 and are in contact with the inlet 51 of the covering material 52. Since the opposite surfaces 52a and 52b have a simple structure in which they are directly covered with the protective film 60, they can be easily manufactured.

 In this embodiment, the first protective film 63 is composed of a large number of dot-like fine films 63 provided on the entire one surface 53a of the first covering material 53, and the second protective film. Although the case where 64 consists of many dotted | punctate fine films | membranes 64 provided in the whole one surface 54a of the 2nd coating | covering material 54 was illustrated, this invention is not limited to this. In this invention, the protective film comprised from a fine film may be provided only in the predetermined area | region in the surface on the opposite side to the surface which is in contact with the inlet of a coating | covering material.

Moreover, in this embodiment, although the case where the non-contact-type data transmission / reception body 50 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 51 which has the antenna 57 which consists of a dipole antenna comprised from a pair of planar radiation elements 58 and 59 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 15-23, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 16, a base 55 </ b> A and a long surface in which a large number of RFID antennas 57 and IC chips 56 communicating through the antenna 57 are provided at equal intervals on one surface 55 a. The case where the above-mentioned non-contact type data receiving / transmitting body 50 is manufactured continuously using the inlet sheet 72 will be exemplified.

 First, as shown in FIG. 15, in the center of one surface 71a of the long first peeling substrate 71 being conveyed in the direction of the arrow in the figure, in the conveying direction of the first peeling substrate 71. The first adhesive 53A discharged from the nozzle 81 of the adhesive application device is applied linearly (step A).

As the first adhesive 53A, the same adhesive as that used to form the covering material 52 is used.
Further, the width for applying the first adhesive 53A to the one surface 71a of the first release substrate 71, that is, the application amount of the first adhesive 53A to the one surface 71a of the first release substrate 71. Although there is no particular limitation, the size and number of IC chips 56 and antennas 57 provided on the inlet sheet 72 and the first adhesive 53A, which are covered with the first adhesive 53A, are cured. According to the thickness etc. which are required for the first covering material 53 to be adjusted, it is appropriately adjusted.

As the 1st peeling base material 71, the thing similar to the peeling base material of the above-mentioned 1st embodiment is used.
The peeling force of the first peeling substrate 71 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the first release substrate 71, a release layer (not shown) forming one surface 71a of the first release substrate 71 is used. The first adhesive 53A is applied on the top.

 Next, as shown in FIG. 16, the inlet sheet 72 conveyed in the direction of the arrow in the drawing is moved to the first peeling group at the opposing portion of the pair of rollers 82 and 83 that rotate in the direction of the arrow in the drawing. The first adhesive 71A applied to one surface 71a of the material 71 is overlaid on the one surface 71a of the first peeling substrate 71 being conveyed in the direction of the arrow in the drawing, and the first By sandwiching the release substrate 71 and the inlet sheet 72 with rollers 82 and 83, as shown in FIG. 17, the first release substrate is formed over almost the entire area between the first release substrate 71 and the inlet sheet 72. The first adhesive 53A applied to one surface 71a of 71 is developed (step B).

 In this process B, the one surface 71a of the first peeling substrate 71 is provided on one surface 55a of the substrate 55A, that is, the surface of the inlet sheet 72 on which the IC chip 56 and the antenna 57 are provided (hereinafter referred to as “one side”). The inlet sheet 72 is overlaid on one surface 71a of the first release substrate 71 so that the surfaces 72a face each other.

 Further, in the process B, as described above, the first adhesive 53A made of a two-component mixed urethane resin that is cured by the reaction of the main agent and the curing agent without applying external conditions is used. Therefore, the first adhesive 53A has fluidity until it is developed between the first release substrate 71 and the inlet sheet 72, but the first adhesion is progressed as the reaction proceeds. The agent 53A gradually loses fluidity and eventually hardens. Thus, the one surface 32a of the inlet sheet 72, and the IC chip 56 and the antenna 57 provided on the one surface 32a are covered with the first adhesive 53A, and the first peeling substrate 71 An inlet sheet 72 is temporarily fixed on one surface 71a. When the first adhesive 53A is cured, the first covering material 53 is obtained.

 In Step B, the thickness of the first adhesive 53A after being developed between the first release substrate 71 and the inlet sheet 72 is caused by at least the IC chip 56 and the antenna 57 of the inlet sheet 72. The degree of unevenness does not appear on the surface 53a opposite to the surface in contact with the inlet sheet 72 of the first adhesive 53A, and the IC chip 56 and the antenna 57 are not damaged by an external impact. The range is 10 μm to 2000 mm.

Further, in step B, a force for sandwiching the first release substrate 71 and the inlet sheet 72 between the pair of rollers 82 and 83, that is, pressing the inlet sheet 72 in the thickness direction against the first release substrate 71. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the first release substrate 71 and the inlet sheet 72, the coating amount of the first adhesive 53A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step B, the IC chip 56 and the antenna 57 are completely covered by the first adhesive 53A, and the first adhesive 53A is substantially between the first peeling base 71 and the inlet sheet 72 without any gap. Filled.

 Next, as shown in FIG. 18, while conveying the laminated body α <b> 2 composed of the first peeling base material 71 and the inlet sheet 72 in the direction of the arrow in the figure, the side opposite to the one surface 72 a of the inlet sheet 72. A surface (hereinafter referred to as “the other surface”) 72b, that is, a central portion of the other surface 55b of the base material 55A, is discharged from the nozzle 84 of the adhesive application device along the transport direction of the stacked body α2. The second adhesive 54A is applied linearly (Step F).

As the second adhesive 54A, the same adhesive as that used to form the covering material 52 is used.
Further, the width for applying the second adhesive 54A to the other surface 72b of the inlet sheet 72, that is, the amount of the second adhesive 54A applied to the other surface 55b of the base material 55A is not particularly limited. The thickness is appropriately adjusted according to the thickness required for the second covering material 54 formed by curing the second adhesive 54A.

 Next, as shown in FIG. 18, the second peeling base material 73 conveyed in the direction of the arrow in the figure is placed at the inlet of the pair of rollers 85 and 86 that rotate in the direction of the arrow in the figure. The second adhesive 54A applied to the other surface 72b of the sheet 72 is overlaid on the other surface 72b of the inlet sheet 72 constituting the laminate α2 conveyed in the direction of the arrow in the drawing, By sandwiching the laminate α2 and the second release substrate 73 with the rollers 85 and 86, as shown in FIG. 19, the inlet sheet 72 is almost entirely covered between the laminate α2 and the second release substrate 73. The second adhesive 74A applied to the other surface 72b is developed (step G), and the first adhesive 53A and the inlet sheet are interposed between the first release substrate 71 and the second release substrate 73. 72 and second Chakuzai 54A is laminated in this order, to form an integrated laminate .beta.2.

 As the 2nd peeling base material 73, the thing similar to said 1st peeling base material 71 is used. That is, one surface 73a of the second release substrate 73 is composed of a release layer made of silicon.

 In this step G, since the above-described release film or release paper is used as the second release substrate 73, one surface 73a of the second release substrate 73 is formed on the other surface 72b of the inlet sheet 72. The second release substrate 73 is overlaid on the other surface 72b of the inlet sheet 72 so that the formed release layers (not shown) face each other.

 Further, in the process G, as described above, the second adhesive 54A made of a two-component mixed urethane resin that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the second adhesive 54A has fluidity until the second adhesive 54A is developed between the laminate α2 and the second release substrate 73. The agent 54A gradually loses fluidity and eventually hardens. As a result, the other surface 72b of the inlet sheet 72 is covered with the second adhesive 54A, and the second release substrate 73 is temporarily fixed on the laminate α2. When the second adhesive 54A is cured, the second covering material 54 is obtained.

 In Step G, the thickness of the second adhesive 54A after being developed between the laminate α2 and the second release substrate 73 is the same as that of the first release substrate 71 in Step B described above. The thickness is the same as the thickness of the first adhesive 53 </ b> A after being spread between the inlet sheets 72, for example, in the range of 10 μm to 2000 mm.

Further, in step G, the force that sandwiches the laminate α2 and the second release substrate 73 between the pair of rollers 85 and 86, that is, the second release substrate 73 is pressed against the inlet sheet 72 in the thickness direction. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the laminate α2 and the second release substrate 73, the coating amount of the second adhesive 54A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step G, the second adhesive 54 </ b> A is filled between the laminate α <b> 2 and the second release substrate 73 with almost no gap.

 Next, after the first adhesive 53A is completely cured to become the first covering material 53, and the second adhesive 54A is completely cured to become the second covering material 54, FIG. As shown, the first release base material 71 and the second release base material 73 are peeled from the laminate β2 (step C), and as shown in FIG. 21, the first adhesive 53A and the inlet sheet 72 are removed. And the 2nd adhesive agent 54A is laminated | stacked in this order, and the laminated body (gamma) 2 integrated is obtained.

 Next, as shown in FIG. 22, the surface (one surface) 53a opposite to the surface in contact with the inlet 51 of the first adhesive 53A covers the bubbles 53d generated on the one surface 53a. In addition, a large number of dot-shaped (dot-shaped) protective agents for forming the fine film 63 constituting the first protective film 61 are applied at equal intervals, and the protective agent is cured to form the first protective film 61. The second adhesive 54A is formed on the surface 54a opposite to the surface in contact with the inlet 51 (one surface) 54a so as to cover the bubbles 54d generated on the one surface 54a. A number of protective agents for forming the fine film 64 constituting the second protective film 62 are applied in the form of dots (dots) at equal intervals, and the protective agent is cured to form the second protective film 62 (step) D).

 In this step D, as a method of applying a large number of protective agents in the form of dots (dots) at equal intervals on one surface 53a of the first adhesive 53A and one surface 54a of the second adhesive 54A. In addition, an offset printing method, a screen printing method, a gravure printing method, a coating method using a coater, or the like to which a printing plate having a predetermined interval and a predetermined shape and provided with a portion through which a protective agent passes is used.

In step D, a protective agent for forming the fine film 63 constituting the first protective film 61 is applied so as to cover the bubbles (pores) 53 d generated on one surface 53 a of the first covering material 53. It is preferable to apply so as to fill the bubbles (pores) 53d.
Similarly, the protective agent for forming the fine film 64 constituting the second protective film 62 is applied so as to cover the bubbles (pores) 54d formed on one surface 54a of the second covering material 54. It is preferable to apply so as to fill the bubbles (pores) 54d.

Further, in step D, the thickness for applying the protective agent for forming the first protective film 61 is at least completely filled with the air bubbles 53d on the one surface 53a of the first adhesive 53A, and is caused by the air bubbles 53d. The unevenness to be generated does not appear on the outer surface 50c of the finally obtained non-contact type data transmitter / receiver 50, and the outer surface 61c of the first protective film 61 forms a smooth surface, for example, in the range of 10 μm to 1000 mm Within.
Further, in the process D, the thickness of applying the protective agent for forming the second protective film 62 is set such that at least the air bubbles 54d on the one surface 54a of the second adhesive 54A are completely filled, and the air bubbles 54d are caused. The unevenness to be generated does not appear on the outer surface 50d of the finally obtained non-contact type data receiving / transmitting body 50, and the outer surface 62c of the second protective film 62 forms a smooth surface, for example, in the range of 10 μm to 1000 mm Within.

23, the first protective film 61, the first adhesive 53A, the inlet sheet 72, the second adhesive 54A, and the second protective film are cut by a cutting blade (not shown) of the cutting device. The laminated body δ2 composed of 62 is cut in the thickness direction (along the alternate long and short dash line in FIG. 23) according to the shape of the antenna 57, and the laminated body δ2 is singulated (step E), as shown in FIG. A contactless data receiving / transmitting body 50 is obtained.
Here, cutting the stacked body δ2 according to the shape of the antenna 57 means cutting the antenna 57 according to the shape of the target non-contact type data receiving / transmitting body 50 without damaging the antenna 57.

 In this embodiment, the above-described non-contact type data receiving / transmitting body 50 is continuously manufactured by using the long first peeling base material 71, the inlet sheet 72, and the second peeling base material 73. Although the case is illustrated, the present invention is not limited to this. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 Moreover, in this embodiment, although the case where the process G was performed after the process D was illustrated, this invention is not limited to this. In the present invention, the process may be ended in the process D, for example, when an inlet that has been separated in advance is used.

 In this embodiment, after Step G, the first protective film 61 is formed on one surface 53a of the first adhesive 53A, and the second surface 54a of the second adhesive 54A is second. A step D for forming the protective film 62, and a laminate δ2 made up of the first protective film 61, the first adhesive 53A, the inlet sheet 72, the second adhesive 54A, and the second protective film 62 are combined with the antenna 57. Although the case where the process E which cuts according to the shape of this is performed in this order is illustrated, the present invention is not limited to this. In the present invention, after step G, step D and step E may be performed in any order. That is, in the present invention, in Step E, after cutting the laminate composed of the first adhesive, the inlet sheet, and the second adhesive in accordance with the shape of the antenna, in Step D, A protective film may be formed on one surface of one adhesive and one surface of the second adhesive.

 Further, the density of bubbles generated in the first coating material 53 (density on one surface 53a of the first coating material 53) and the density of bubbles generated in the second coating material 54 (of the second coating material 54). The density on one surface 54a) and the size of the bubbles can be controlled by the humidity of the atmosphere from coating to curing of the covering material 52.

DESCRIPTION OF SYMBOLS 10 ... Non-contact type data transmission / reception body, 11 ... Inlet, 12 ... Coating | covering material, 12A ... Adhesive, 13, 13A ... Base material, 14 ... IC chip, 15 * .. Antennas 16, 17 ... Radiating elements, 20 ... Protective film, 21 ... Fine film, 31 ... Release substrate, 32 ... Inlet sheet, 41 ... Nozzle, 42, DESCRIPTION OF SYMBOLS 43 ... Roller, 50 ... Non-contact type | mold data transmission / reception body, 51 ... Inlet, 52 ... Coating | covering material, 53 ... 1st coating | covering material, 53A ... 1st adhesive agent 54 ... second coating material, 54A ... second adhesive, 55,55A ... base material, 56 ... IC chip, 57 ... antenna, 58,59 ... radiation Element, 60 ... protective film, 61 ... first protective film, 62 ... second protective film, 63, 64 ... fine , 71 ... first release substrate, 72 ... inlet sheet, 73 ... second release substrate, 81 and 84 ... nozzle, 82,83,85,86 ... roller.

Claims (3)

An inlet, a coating material that covers at least the surface of the inlet where the IC chip is provided, and a protective film provided on a surface α of the coating material opposite to the surface that is in contact with the inlet. A contactless data receiving / transmitting body,
The covering material comprises a two-component curable urethane adhesive,
The protective film is composed of a large number of dot-like fine films provided at equal intervals on the surface α, and the fine film is provided so as to cover bubbles present on the surface α. Contact data receiver / transmitter.  The non-contact type data receiving / transmitting body according to claim 1, wherein the fine film is provided so as to fill the bubbles. The non-contact type data receiving / transmitting body according to claim 1 or 2, wherein both surfaces of the inlet are covered with the covering material.

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