JP5690512B2 - Method for manufacturing contactless data receiving / transmitting body - Google Patents

Description

The present invention relates to a non-contact type data receiver / receiver that can receive information from the outside using electromagnetic waves or radio waves as a medium, and can transmit information to the outside, such as an information recording medium for RFID (Radio Frequency IDentification). It relates to a method of manufacturing, in particular, weather resistance, a method of manufacturing a heat resistance and excellent flexibility contactless data reception and transmission body.

  An IC tag, which is an example of a non-contact type data transmitting / receiving body, includes an inlet composed of a base material, an antenna provided on one surface thereof and connected to each other, and an information writing / reading When an electromagnetic wave or radio wave is received from the device, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is converted into a signal. Transmitted from the antenna.

In order to make such an IC tag excellent in heat resistance, weather resistance and flexibility, various packaged IC tags have been studied.
For example, an inlet is stored in a storage portion (storage space) provided in a housing made of silicon resin, polytetrafluoroethylene resin, or the like, and the storage portion containing the inlet is sealed with the same material as the housing. An IC tag sealed with a stop member is known (for example, see Patent Document 1).
Further, an IC tag in which an inlet is molded only with a resin such as an epoxy resin and packaged is known (see, for example, Patent Document 2).
Further, there is known an IC tag in which a thin sheet-like circuit portion is sandwiched by a surface base material made of a urethane resin coated with a silicone film via an adhesive, and these are integrated (for example, patents) Reference 3).

JP 2002-024783 A JP 2002-31747 A JP 2005-056362 A

  However, when the inlet is stored in the casing, there is a problem that it is difficult to reduce the thickness of the IC tag itself because a certain thickness of the casing is necessary to secure the strength of the casing. Moreover, when manufacturing such an IC tag, since it is necessary to store and arrange | position an inlet separately in a housing | casing, there existed a problem that manufacturing efficiency was low.

  In addition, in the case of an IC tag in which a sheet-like circuit portion is sandwiched between surface substrates via an adhesive, the surface substrate is pulled in the cross-sectional direction due to shrinkage when the adhesive is cured. There was a problem that a great flexibility could not be obtained. In addition, since the surface base material is bonded to the sheet-like circuit portion via an adhesive, this IC tag is not only difficult to be thinned, but also has an uneven shape due to the surface base material being caused by the circuit portion. Since it cannot follow and deform, the adhesion between the surface substrate and the circuit part is low, and there is a risk of peeling at the interface between the surface substrate and the circuit part. As a result, the IC tag has sufficient heat resistance and weather resistance. There was a problem that sex could not be imparted. Further, when the inlet is molded only with an epoxy resin, there is a problem that bubbles (pores) are generated on the surface when the epoxy resin is cured, and the weather resistance may be insufficient due to the bubbles (pores).

  In addition, in the case of an IC tag in which an inlet is sandwiched between surface substrates via an adhesive, the surface substrate is pulled in the cross-sectional direction due to shrinkage when the adhesive is cured, so that the IC tag has sufficient flexibility. There was a problem that it could not be obtained.

The present invention was made in view of the above circumstances, excellent flexibility is thin, and is excellent in weather resistance, can be easily produced provide a method of manufacturing a non-contact type data reception and transmission body The purpose is to do.

  A method of manufacturing a non-contact type data transmitting / receiving body according to the present invention includes an inlet, a covering material covering at least a surface of the inlet provided with an IC chip, at least an end face of the inlet, an end face of the covering material, and A non-contact type data transmitting / receiving body comprising a protective film that covers a surface opposite to a surface that is in contact with the inlet, wherein the release layer forms one surface of a release substrate. On top of this, the inlet is superimposed on one surface of the release substrate through the step A of applying an adhesive composed of a two-component curable urethane adhesive and the adhesive applied to the release substrate. And, by pressing the inlet against the peeling substrate, the step of developing the adhesive between the peeling substrate and the inlet, and after the step B, adhesive And the step C for cutting the laminate including the inlet according to the shape of the antenna constituting the inlet, the step D for peeling the release substrate, at least the end face of the inlet, and the end face of the covering material And a step E of applying a protective agent to the surface opposite to the surface in contact with the inlet, and performing the step E and the group of steps consisting of the step C and the step D in this order. The process C and the process D are performed in random order.

 Between the step B and the step C, further, a step F of applying an adhesive made of a two-component curable urethane-based adhesive on the surface of the inlet opposite to the surface on which the IC chip is provided; Via the adhesive applied to the inlet, on the surface of the inlet opposite to the surface on which the IC chip is provided, the release substrate is overlapped with the release layer that forms one surface facing each other, Step G of developing the adhesive between the release substrate and the surface of the inlet opposite to the surface on which the IC chip is provided by pressing the release substrate against the inlet. It is preferable to have.

  According to the method of manufacturing a non-contact type data receiving / transmitting body of the present invention, after the adhesive and the inlet are laminated on the release substrate having the release layer, an integrated laminate is formed and the adhesive is cured. Since the protective film is applied to the end surface of the inlet, the end surface of the adhesive, and one surface of the adhesive to form a protective film by peeling the release substrate, It is not necessary to store the inlet in the casing and seal it with a sealing member made of the same material as the casing, or to mold the inlet with resin, and to easily form a protective film Therefore, a non-contact type data receiving / transmitting body can be easily manufactured. Furthermore, since a member other than an adhesive and a protective film is not required to cover at least the surface on which the IC chip is provided in the inlet, a very thin non-contact type data receiving / transmitting body can be manufactured. As a result, the manufacturing cost of the non-contact type data receiving / transmitting body can be reduced.

It is a schematic sectional drawing which shows 1st embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process A in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process B is shown and it is a schematic sectional drawing in alignment with the AA of FIG. It is a schematic sectional drawing which shows process C in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process D in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process D in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 2nd embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows the process A in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process B is shown and it is a schematic sectional drawing in alignment with the BB line of FIG. It is a schematic perspective view which shows the process F and the process G in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process G is shown and it is a schematic sectional drawing in alignment with CC line of FIG. It is a schematic sectional drawing which shows process C in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process D in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process D in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention.

Embodiments of a non-contact type data receiving / transmitting body and a manufacturing method thereof according to the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment “Non-contact Data Receiver / Transmitter”
FIG. 1 is a schematic cross-sectional view showing a first embodiment of the non-contact type data receiving / transmitting body of the present invention.
The non-contact type data transmitting / receiving body 10 of this embodiment includes an inlet 11 having a substantially rectangular shape in plan view, a covering material 12 covering one surface 11a of the inlet 11, end faces 11c and 11d of the inlet 11, and a covering material 12. And a protective film 20 that covers a surface (hereinafter referred to as “one surface”) 12a opposite to the surface in contact with the inlet 11 of the covering material 12.

 That is, in the non-contact type data receiving / transmitting body 10, the one surface 11 a of the inlet 11 is directly covered with the covering material 12, and the one surface 12 a of the covering material 12 is directly covered with the protective film 20. In the thickness direction, the protective film 20, the covering material 12, and the inlet 11 are stacked in this order. Thereby, the non-contact type data receiving / transmitting body 10 has a substantially rectangular shape in plan view.

The inlet 11 is generally configured by a base material 13 and an IC chip 14 and an antenna 15 which are provided on one surface 13a of the base material 13 and are electrically connected to each other.
The antenna 15 is a dipole antenna composed of a pair of planar radiating elements 16 and 17 which are made of various conductors, face each other, and have feeding points (portions connected to the IC chip 14) on the opposite sides. is there.

 The length in the longitudinal direction of the antenna 15 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 16 and 17 is a length corresponding to a quarter wavelength.

The one surface 11 a of the inlet 11 corresponds to the one surface 13 a of the base material 13.
Therefore, on one surface 11 a of the inlet 11, the IC chip 14 and the antenna 15 are covered with the covering material 12.

 The thickness of the covering material 12 is not particularly limited, but at least the unevenness caused by the IC chip 14 and the antenna 15 of the inlet 11 does not appear on one surface (outer surface) 10a of the non-contact type data transmitter / receiver 10; And it is a grade which the inlet 11 is not damaged by the impact from the outside, for example, exists in the range of 10 micrometers-2000 mm.

 The covering material 12 is in a liquid state before use, and is composed of a two-component mixed urethane adhesive that cures by reaction between the main agent and the curing agent without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. Is.

As a two-component mixed urethane adhesive, a silane coupling agent having an epoxy group is further added to a mixed solution containing an isocyanate as a first solution and a polyol having a hydroxyl group as a second solution as a second solution. The added one is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. Moreover, the compounding quantity of the silane coupling agent which has an epoxy group with respect to whole quantity of this 2 liquid mixing type urethane type adhesive agent is 0.1 to 2.0 mass%.

Further, as the two-component mixed urethane adhesive, a mixed solution containing an isocyanate as the first solution and a polyol whose hydroxyl group is a primary hydroxyl group as the second solution has an aspect ratio of 10 or more, 100 What added the following inorganic fine particles is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. The blending amount of the inorganic fine particles having an aspect ratio of 10 or more and 100 or less with respect to the total amount of the two-component mixed urethane adhesive is 5% by mass or more and 40% by mass or less.

 Specific examples of such a two-component curable urethane-based adhesive include an adhesive composed of a main agent (trade name: MLT2900, manufactured by Etec) and a curing agent (trade name: G3021-B174, manufactured by Etec). .

 In addition, the adhesive forming the covering material 12 may contain a colorant such as a known inorganic pigment, organic pigment, or dye as necessary. The coating material 12 is colored in an arbitrary color by the colorant.

 As the substrate 13, a substrate made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE), polypropylene Base material made of polyolefin resin such as (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene; Made of polyamide resin such as nylon 6, nylon 6,6 Base material: Base material made of vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polyacryl Base material made of acrylic resin such as butyl; Base material made of polystyrene; Base material made of polycarbonate (PC); Base material made of polyarylate; Base material made of polyimide; Fine paper, thin paper, glassine paper, sulfate paper, etc. A substrate made of paper is used.

 The IC chip 14 is not particularly limited, and information can be written and read out in a non-contact state via the antenna 15. A non-contact IC tag, a non-contact IC label, or a non-contact IC card can be used. Anything can be used as long as it is applicable to RFID media.

 The antenna 15 is formed on one surface 13a of the base material 13 using a polymer type conductive ink in a predetermined pattern by a printing method such as screen printing or ink jet printing, or by etching the conductive foil. It is made by metal plating.

 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 15 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric current path of the coating film forming the antenna 15 is formed when the conductive fine particles constituting the coating film contact each other, and the resistance value of the coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photocuring type, a penetrating drying type, and a solvent volatilization type are used in addition to the thermosetting type.

 The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone, or a conductive resin fine particle in a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester and isocyanate). 60% by mass or more and a polyester resin of 10% by mass or more, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), heat Polyester resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinked type or A cross-linking / thermoplastic combination type is preferably used.

Examples of the conductive foil forming the antenna 15 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 15 include copper plating, silver plating, gold plating, and platinum plating.

 The thickness of the protective film 20 is not particularly limited. For example, when the adhesive forming the coating material 12 is cured, when bubbles (pores) 12d are formed on one surface 12a, at least the bubbles 12d are formed. The surface that is completely filled and the unevenness caused by the bubbles 12d does not appear on one surface (outer surface) 10a of the non-contact type data receiving / transmitting body 10 and is in contact with the covering material 12 of the protective film 20 The opposite surface (outer surface) 20a is a smooth surface, for example, in the range of 10 μm to 1000 mm.

 Further, when the non-contact type data receiving / transmitting body 10 is made sufficiently flexible (flexible) and the non-contact type data receiving / transmitting body 10 is bent, the thickness of the protective film 20 with respect to the inlet 11 is increased. In order to prevent the stress due to the partial difference between the two, the thickness of the protective film 20 is preferably equal on the four side surfaces of the non-contact type data transmitting / receiving body 10. More specifically, for example, the thickness of the protective film 20 is preferably equal on the end surfaces 11c and 11d of the inlet 11, the end surfaces 12b and 12c of the covering material 12, and the one surface 12a of the covering material 12.

As a material for forming the protective film 20, a protective agent that is liquid before use and is cured by irradiation with ultraviolet rays or heating is used.
As such a protective agent, it contains inorganic particles such as silica and titanium oxide and organic solids such as solid paraffin, wax and petrolatum (registered trademark), and these components are used as a photocurable resin or a thermosetting resin. A protective agent mixed with the resin is used. In this embodiment, the one containing silica and solid paraffin is used.

In this non-contact type data receiving / transmitting body 10, one surface 11 a of the inlet 11 is directly covered with a covering material 12 made of a two-component curable urethane adhesive, and the covering material 12 constitutes the inlet 11. In addition, since it is formed following the uneven shape caused by the antenna 15, the adhesion between the inlet 11 and the covering material 12 is excellent, and peeling at the interface between the inlet 11 and the covering material 12 can be prevented. Further, since the end surfaces 11c and 11d of the inlet 11, the end surfaces 12b and 12c of the covering material 12, and the one surface 12a of the covering material 12 are directly covered with the protective film 20, they are in contact with the inlet 11 of the covering material 12. Even if air bubbles (pores) 12d exist on the surface 12a opposite to the surface 12a, the air bubbles (pores) 12d are covered with the protective film 20, so that the inlet 11 has heat resistance and weather resistance. It is thin and excellent in flexibility.
In the non-contact type data receiving / transmitting body 10, one surface 11a of the inlet 11 is directly covered with the covering material 12, and the end surfaces 11c and 11d of the inlet 11, the end surfaces 12b and 12c of the covering material 12, and the covering material Since the one surface 12a of 12 has the simple structure directly covered with the protective film 20, it can be manufactured easily.

In addition, in this embodiment, although the case where the non-contact type | mold data transmission / reception body 10 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 11 which has the antenna 15 which consists of a dipole antenna comprised from a pair of planar radiation elements 16 and 17 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 2-8, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 3, a long base material 13A and one surface 13a thereof are provided with a large number of RFID antennas 15 and IC chips 14 communicating through the antenna 15 at equal intervals. The case where the above-mentioned non-contact type data receiving / transmitting body 10 is continuously manufactured using the inlet sheet 22 will be exemplified.

 First, as shown in FIG. 2, the adhesive is applied to the central portion of one surface 21 a of the long release substrate 21 being conveyed in the direction of the arrow in the drawing along the conveyance direction of the release substrate 21. The adhesive 12A discharged from the nozzle 31 of the apparatus is applied linearly (step A).

As adhesive 12A, the thing similar to the adhesive which forms said coating | covering material 12 is used.
Further, the width for applying the adhesive 12A to the one surface 21a of the release substrate 21, that is, the amount of the adhesive 12A applied to the one surface 21a of the release substrate 21 is not particularly limited. The IC chip 14 and the antenna 15 provided on the inlet sheet 22 to be coated are appropriately adjusted according to the size and number of the antenna 15 and the thickness required for the covering material 12 formed by curing the adhesive 12A. The

As the release substrate 21, a release film or release paper is used.
As the release film, one of the base films having a thickness of 30 μm to 160 μm made of plastic such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene naphthalate (PEN), polypropylene (PP), polyethylene (PE), etc. The surface and / or the other surface is provided with a release layer made of silicon and having a thickness of 1 μm to 100 μm. That is, one surface 21a of the peeling substrate 21 is composed of a peeling layer made of silicon.
Specific examples of such a release film include Tosero Separator SP-PET-01-BU (trade name) manufactured by Tosero Corporation.

As the release paper, a sealing agent is applied to one surface and / or the other surface of a 30 μm to 160 μm thick substrate made of glassine paper or fine paper, and on the layer made of the sealing agent, What provided the peeling layer with a thickness of 1 μm to 100 μm made of silicon is used. That is, one surface 21a of the peeling substrate 21 is composed of a peeling layer made of silicon.
Specific examples of such release paper include L11C (trade name) manufactured by Oji Tac Co., Ltd.

 The peeling force of the peeling substrate 21 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the release substrate 21, the adhesive is formed on the release layer (not shown) forming one surface 21a of the release substrate 21. Apply 12A.

 Next, as shown in FIG. 3, the inlet sheet 22 conveyed in the direction of the arrow in the figure is the portion of the peeling substrate 21 that is opposed to the pair of rollers 32 and 33 that rotate in the direction of the arrow in the figure. While superposing on the one surface 21a of the peeling base material 21 conveyed in the direction of the arrow in the figure through the adhesive 12A applied to the one surface 21a, the peeling base material 21 and the inlet sheet 22 are placed on the roller 32. , 33, as shown in FIG. 4, the adhesive 12A applied to one surface 21a of the peeling substrate 21 is spread over almost the entire area between the peeling substrate 21 and the inlet sheet 22 (step B). ).

 In this step B, one surface 13a of the substrate 13A, that is, the surface of the inlet sheet 22 on which the IC chip 14 and the antenna 15 are provided (hereinafter referred to as “one surface”) The inlet sheet 22 is overlaid on the one surface 21a of the peeling substrate 21 so that 22a faces each other.

 In Step B, as described above, the adhesive 12A made of a two-component curable urethane adhesive that is cured by the reaction of the main agent and the curing agent without applying external conditions is used. Therefore, the adhesive 12A has fluidity until it is spread between the release substrate 21 and the inlet sheet 22, but gradually loses fluidity as the reaction proceeds, and finally Harden. As a result, the one surface 22a of the inlet sheet 22 and the IC chip 14 and the antenna 15 provided on the one surface 22a are covered with the adhesive 12A, and on the one surface 21a of the peeling substrate 21. The inlet sheet 22 is temporarily fixed. When the adhesive 12A is cured, the coating material 12 is obtained.

 Further, in step B, the thickness of the adhesive 12A after being developed between the peeling base material 21 and the inlet sheet 22 is at least uneven by the IC chip 14 and the antenna 15 of the inlet sheet 22. The IC chip 14 and the antenna 15 are not damaged on the surface 12c opposite to the surface in contact with the inlet sheet 22 and are not damaged by an external impact, for example, within a range of 10 μm to 2000 mm. .

In Step B, the force for sandwiching the release substrate 21 and the inlet sheet 22 between the pair of rollers 32 and 33, that is, the force (pressure) for pressing the inlet sheet 22 in the thickness direction against the release substrate 21 is is not particularly limited, the thickness or size of the release substrate 21 and the inlet sheet 22, depending on the amount of adhesive applied 12A, it is preferable that it is appropriately ^adjusted, it is 1kg / cm ² ~20kg / cm 2 , more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step B, the IC chip 14 and the antenna 15 are completely covered with the adhesive 12A, and the adhesive 12A is filled between the release substrate 21 and the inlet sheet 22 with almost no gap.

Next, as shown in FIG. 5, the laminated body α <b> 1 composed of the peeling base material 21, the adhesive 12 </ b> A and the inlet sheet 22 is cut in the thickness direction (the dashed line in FIG. 5) by a cutting blade (not shown) of the cutting device. In accordance with the shape of the antenna 15, the laminate α1 is cut into pieces as shown in FIG. 6 (step C).
Here, to cut the laminated body α1 according to the shape of the antenna 15 means to cut the laminated body α1 according to the shape of the target non-contact type data receiving / transmitting body 10 without damaging the antenna 15.

 Next, after the adhesive 12A is completely cured to become the covering material 12, as shown in FIG. 7, the release substrate 21 is peeled from the laminate α1 (step D), and as shown in FIG. The laminated body (beta) 1 which consists of the adhesive agent 12A, the inlet sheet 22, and the adhesive agent 13A separated into pieces is obtained.

 Next, the protective agent for forming the protective film 20 is applied to the end surfaces 22c and 22d of the inlet sheet 22 constituting the laminate β1, the end surfaces 12b and 12c of the adhesive 12A, and one surface 12a of the adhesive 12A. A protective film 20 is formed (step E), and the non-contact type data receiving / transmitting body 10 shown in FIG. 1 is obtained.

 In this step E, for example, when the adhesive forming the coating material 12 is cured, if bubbles (pores) 12d are formed on one surface 12a, at least the bubbles (pores) 12d are completely filled. The protective film 20 is formed by applying a protective agent for forming the protective film 20.

 In the process E, as a method of applying the protective agent to the end surfaces 22c and 22d of the inlet sheet 22, the end surfaces 12b and 12c of the adhesive 12A, and the one surface 12a of the adhesive 12A, when a high-viscosity protective agent is used, an offset is used. A printing method, a screen printing method, a gravure printing method, a coating method using a coater, or the like is used. When a low-viscosity protective agent is used, a method in which the laminate β1 is immersed in the protective agent, and the laminate β1 is used. A method in which a protective agent is injected into the mold after being placed in the mold, a spray coating method, or the like is used.

 Further, in the step E, when the protective agent for forming the protective film 20 is applied, for example, when the adhesive forming the adhesive 12A is cured, bubbles (pores) 12d are generated on one surface 12a. In this case, at least the bubbles (pores) 12d are completely filled, and the unevenness caused by the bubbles (pores) 12d is one surface (outer surface) of the non-contact type data transmitting / receiving body 10 finally obtained. 10a, and the outer surface 20a of the protective film 20 forms a smooth surface, for example, within a range of 10 μm to 1000 mm.

 According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, the laminated body α1 in which the adhesive 12A and the inlet sheet 22 are laminated and integrated on the peeling base material 21 having the peeling layer, After the adhesive 12A is cured, the laminate α1 is separated into pieces, and the release substrate 21 is peeled from the separated laminate α1 to form a laminate β1, and the inlet sheet 22 constituting the laminate β1 is formed. Since the protective film 20 is formed by applying a protective agent to the end surfaces 22c and 22d, the end surfaces 12b and 12c of the adhesive 12A, and the one surface 12a of the adhesive 12A, an inlet is provided in the resin casing as in the prior art. It is not necessary to house and seal with a sealing member made of the same material as that of the casing, or to mold the inlet with resin, and the protective film 20 can be easily formed. Non-contact type The data receiving / transmitting body 10 can be manufactured. Furthermore, since no member other than the adhesive 12A and the protective film 20 is required to cover the one surface 22a of the inlet sheet 22, it is possible to manufacture the contactless data receiving / transmitting body 10 having a very thin thickness. As a result, the manufacturing cost of the non-contact type data receiving / transmitting body 10 can be reduced.

 In addition, in this embodiment, although the case where the above-mentioned non-contact type | mold data receiving / transmitting body 10 is manufactured continuously using the elongate peeling base material 21 and the inlet sheet 22, this invention is shown to this. It is not limited. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 In this embodiment, after step B, the laminate α1 composed of the release substrate 21, the adhesive 12A, and the inlet sheet 22 is cut according to the shape of the antenna 15, and the laminate α1. A protective agent is applied to the step D of peeling the peeling substrate 21, the end faces 22c and 22d of the inlet sheet 22 constituting the laminate β1, the end faces 12b and 12c of the adhesive 12A, and the one face 12a of the adhesive 12A. Although the case where the process E for forming the protective film 20 is performed in this order is illustrated, the present invention is not limited to this. In the present invention, after the process B, if the group of processes including the process C and the process D and the process E are performed in this order, the process C and the process D may be performed in random order. That is, in the present invention, in Step D, the release substrate is peeled from the laminate comprising the release substrate, the adhesive and the inlet sheet, and in Step C, the laminate comprising the adhesive and the inlet sheet. After cutting according to the shape of the antenna, in step E, a protective film may be formed on the end face of the inlet, the end face of the adhesive, and one face constituting the laminate.

(2) Second Embodiment “Non-contact Data Receiver / Transmitter”
FIG. 9 is a schematic cross-sectional view showing a second embodiment of the contactless data receiving / transmitting body of the present invention.
The non-contact type data transmitting / receiving body 50 of this embodiment includes an inlet 51 having a substantially rectangular shape in plan view, a first covering member 53 that covers one surface 51a of the inlet 51, and the other surface 51b of the inlet 51. The surface of the second coating material 54 to be coated, the end surfaces 51c and 51d of the inlet 51, the end surfaces 53b and 53c of the first coating material 53, and the surface on the opposite side to the inlet 51 of the first coating material 53 (Hereinafter referred to as “one surface”) 53a, and the surface opposite to the surface in contact with the end surfaces 54b, 54c of the second covering material 54 and the inlet 51 of the second covering material 54 (hereinafter referred to as “the one surface”). This is generally composed of a protective film 60 covering 54a.

The first covering material 53 and the second covering material 54 may be collectively referred to as a covering material 52.
That is, in the non-contact type data receiving / transmitting body 50, both surfaces (one surface 51 a and the other surface 51 b) of the inlet 51 are directly covered with the covering material 52 and are in contact with the inlet 51 of the covering material 52. The surface opposite to the surface (one surface 52a and the other surface 52b) is directly covered with the protective film 60, and in the thickness direction, the protective film 60, the first covering material 53, the inlet 51, The 2nd coating | covering material 54 and the protective film 60 have comprised the structure laminated | stacked in this order. Thereby, the non-contact type data transmitting / receiving body 50 has a substantially rectangular shape in plan view.

The inlet 51 is generally configured by a base 55 and an IC chip 56 and an antenna 57 which are provided on one surface 55a of the base 55 and are electrically connected to each other.
The antenna 57 is a dipole antenna composed of a pair of planar radiating elements 58 and 59 made of various conductors, facing each other and having feeding points (portions connected to the IC chip 56) on the facing sides. is there.

 The length in the longitudinal direction of the antenna 57 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 58 and 59 is a length corresponding to a quarter wavelength.

One surface 51 a of the inlet 51 corresponds to one surface 55 a of the base material 55, and the other surface 51 b of the inlet 11 corresponds to the other surface 55 b of the base material 55.
Therefore, the IC chip 56 and the antenna 57 are covered with the first covering member 53 on the one surface 51 a of the inlet 51.

The thickness of the first covering material 53 is not particularly limited, but at least unevenness caused by the IC chip 56 and the antenna 57 of the inlet 51 appears on one surface (outer surface) 50a of the non-contact type data receiving / transmitting body 50. And the inlet 51 is not damaged by an external impact, for example, in the range of 10 μm to 2000 mm.
The thickness of the second covering material 54 is not particularly limited, but is such that the inlet 51 is not damaged by an external impact, for example, in the range of 10 μm to 2000 mm.

 Furthermore, when the non-contact type data receiving / transmitting body 50 has sufficient flexibility (flexibility) and the non-contact type data receiving / transmitting body 50 is bent, the first covering material 53 is formed with respect to the inlet 51. In order to prevent the stress caused by the difference in thickness between the first covering material 54 and the second covering material 54, the thickness of the first covering material 53 is preferably equal to the thickness of the second covering material 54.

 The covering material 52 (the first covering material 53 and the second covering material 54) is in a liquid state before use, and the main agent and the curing agent can be used without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. It consists of a two-component curable urethane adhesive that cures by reaction.

 As the two-component curable urethane adhesive, the same one as in the first embodiment described above is used.

 As the base material 55, the IC chip 56, and the antenna 57, those similar to those in the first embodiment described above are used.

The thickness of the protective film 60 is not particularly limited. For example, when the adhesive forming the first covering material 53 is cured, when bubbles (pores) 53d are formed on one surface 53a, at least the The bubble 53d is completely filled, and the unevenness caused by the bubble 53d does not appear on one surface (outer surface) 50a of the non-contact type data transmitter / receiver 50, and the first covering material 53 of the protective film 60 The surface (outer surface) 50a opposite to the surface in contact with the surface is a smooth surface, for example, in the range of 10 μm to 1000 mm.
The thickness of the protective film 60 is not particularly limited. For example, when the adhesive forming the second coating material 54 is cured, bubbles (pores) 54d are generated on one surface 54a thereof. At least the bubbles 54d are completely filled, and the unevenness caused by the bubbles 54d does not appear on the other surface (outer surface) 50b of the non-contact type data transmitter / receiver 50, and the second covering material of the protective film 60 The surface (outer surface) 60b opposite to the surface in contact with 54 is a smooth surface, for example, in the range of 10 μm to 1000 mm.

 Furthermore, when the non-contact type data receiving / transmitting body 50 is made sufficiently flexible (flexibility) and the non-contact type data receiving / transmitting body 50 is bent, the thickness of the protective film 60 with respect to the inlet 51 is increased. In order to prevent the stress caused by the difference between the two, the thickness of the protective film 60 is preferably equal on the four side surfaces of the non-contact type data transmitting / receiving body 50. More specifically, for example, the end surfaces 51 c and 51 d of the inlet 51, the end surfaces 53 b and 53 c of the first covering material 53, one surface 53 a of the first covering material 53, and the end surface 54 b of the second covering material 54. 54c and one surface 54a of the second covering material 54, the thickness of the protective film 60 is preferably equal.

As a material for forming the protective film 60 (the first protective film 61 and the second protective film 62), a protective agent that is liquid before use and is cured by irradiation with ultraviolet rays or heating is used. .
As such a protective agent, the same one as in the first embodiment described above is used.

In the non-contact type data receiving / transmitting body 50, one surface 51a and the other surface 51b of the inlet 51 are directly covered with a covering material 52 made of a two-component curable urethane adhesive, and the covering material 52 covers the inlet 51. Since it is formed following the uneven shape caused by the IC chip 56 and the antenna 57 to be formed, the adhesiveness between the inlet 51 and the covering material 52 is excellent, and peeling at the interface between the inlet 51 and the covering material 52 is prevented. be able to. In addition, the end surfaces 51c and 51d of the inlet 51, the end surfaces 53b and 53c of the first coating material 53, one surface 53a of the first coating material 53, and the end surfaces 54b and 54c and the second surface of the second coating material 54 Since one surface 54 a of the covering material 54 is directly covered with the protective film 60, bubbles (pores) are formed on the surfaces 52 a and 52 b on the opposite side of the surface that is in contact with the inlet 51 of the covering material 52. Even if it exists, since the bubbles (pores) are covered with the protective film 60, it is thin and excellent in flexibility while imparting heat resistance and weather resistance to the inlet 51.
Further, in the non-contact type data receiving / transmitting body 50, one surface 51a and the other surface 51b of the inlet 51 are directly covered with the covering material 52, and the end surfaces 51c and 51d of the inlet 51 and the first covering material 53 are covered. The end surfaces 53b and 53c of the first covering material 53 and one surface 53a of the first covering material 53, and the end surfaces 54b and 54c of the second covering material 54 and the one surface 54a of the second covering material 54 are directly covered by the protective film 60. Since the coated structure is simple, it can be easily manufactured.

In addition, in this embodiment, although the case where the non-contact-type data transmission / reception body 50 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 51 which has the antenna 57 which consists of a dipole antenna comprised from a pair of planar radiation elements 58 and 59 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 10-18, the manufacturing method of the non-contact type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 11, a long base material 55A and one surface 55a thereof are provided with a large number of RFID antennas 57 and IC chips 56 communicating through the antennas 57 at equal intervals. The case where the above-mentioned non-contact type data receiving / transmitting body 50 is continuously manufactured using the inlet sheet 52 will be exemplified.

 First, as shown in FIG. 10, in the center of one surface 61 a of the long first peeling substrate 61 being conveyed in the direction of the arrow in the drawing, in the conveying direction of the first peeling substrate 61. Along with this, the first adhesive 53A discharged from the nozzle 71 of the adhesive application device is applied linearly (step A).

As the first adhesive 53A, the same adhesive as that used to form the covering material 52 is used.
Further, the width for applying the first adhesive 53A to the one surface 61a of the first release substrate 61, that is, the amount of the first adhesive 53A applied to the one surface 61a of the first release substrate 61. Although there is no particular limitation, the size and number of IC chips 56 and antennas 57 provided on the inlet sheet 62 covered with the first adhesive 53A, and the first adhesive 53A are cured. The thickness is appropriately adjusted according to the thickness required for the first covering material 53.

As the 1st peeling base material 61, the thing similar to the peeling base material of the above-mentioned 1st embodiment is used.
The peeling force of the first peeling substrate 61 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the above-described release film or release paper is used as the first release substrate 61, a release layer (not shown) that forms one surface 61a of the first release substrate 61. The first adhesive 53A is applied on the top.

 Next, as shown in FIG. 11, the inlet sheet 62 conveyed in the direction of the arrow in the figure is the first release group at the opposing portion of the pair of rollers 72 and 73 that rotate in the direction of the arrow in the figure. A first adhesive 53A applied to one surface 61a of the material 61 is superposed on one surface 61a of the first release substrate 61 being conveyed in the direction of the arrow in the drawing, and the first By sandwiching the release substrate 61 and the inlet sheet 62 with rollers 72 and 73, as shown in FIG. 12, the first release substrate over almost the entire area between the first release substrate 61 and the inlet sheet 62. The first adhesive 53A applied to one surface 61a of 61 is developed (step B).

 In this step B, one surface 61a of the first peeling substrate 61 is provided on one surface 55a of the substrate 55A, that is, the surface on which the IC chip 56 and the antenna 57 in the inlet sheet 62 are provided (hereinafter referred to as “one side”). The inlet sheet 62 is superposed on one surface 61a of the first release substrate 61 so that the surfaces 62a face each other.

 Further, in the process B, as described above, the first adhesive 53A made of a two-component curable urethane adhesive that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the first adhesive 53A has fluidity until it is developed between the first release substrate 61 and the inlet sheet 62. However, as the reaction proceeds, the fluidity gradually increases. It disappears and eventually hardens. As a result, the one surface 62a of the inlet sheet 62 and the IC chip 56 and the antenna 57 provided on the one surface 62a are covered with the first adhesive 53A, and the first peeling substrate 61 An inlet sheet 62 is temporarily fixed on one surface 61a. When the first adhesive 53A is cured, the first covering material 53 is obtained.

 In Step B, the thickness of the first adhesive 53A after being developed between the first release substrate 61 and the inlet sheet 62 is caused by at least the IC chip 56 and the antenna 57 of the inlet sheet 62. The degree of unevenness does not appear on the surface 53c opposite to the surface in contact with the inlet sheet 62 of the first adhesive 53A, and the IC chip 56 and the antenna 57 are not damaged by an external impact. The range is 10 μm to 2000 mm.

Further, in step B, a force for sandwiching the first release substrate 61 and the inlet sheet 62 between the pair of rollers 72 and 73, that is, pressing the inlet sheet 62 against the first release substrate 61 in the thickness direction. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the first release substrate 61 and the inlet sheet 62, the application amount of the first adhesive 53A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step B, the IC chip 56 and the antenna 57 are completely covered by the first adhesive 53A, and the first adhesive 53A is almost completely spaced between the first peeling base 61 and the inlet sheet 62. Filled.

 Next, as shown in FIG. 13, while conveying the laminated body α <b> 2 composed of the first peeling substrate 61 and the inlet sheet 62 in the direction of the arrow in the figure, the side opposite to the one surface 62 a of the inlet sheet 62. A surface (hereinafter referred to as “the other surface”) 62b, that is, a central portion of the other surface 55b of the base material 55A, is discharged from the nozzle 74 of the adhesive application device along the transport direction of the laminate α2. The second adhesive 54A is applied linearly (Step F).

As the second adhesive 54A, the same adhesive as that used to form the covering material 52 is used.
Further, the width for applying the second adhesive 54A to the other surface 62b of the inlet sheet 62, that is, the amount of the second adhesive 54A applied to the other surface 55b of the base material 55A is not particularly limited. The thickness is appropriately adjusted according to the thickness required for the second covering material 54 formed by curing the second adhesive 54A.

 Next, as shown in FIG. 13, the second peeling substrate 63 conveyed in the direction of the arrow in the drawing is placed at the inlet of the pair of rollers 75 and 76 that rotate in the direction of the arrow in the drawing. The second adhesive 54A applied to the other surface 62b of the sheet 62 is overlaid on the other surface 62b of the inlet sheet 62 constituting the laminate α2 conveyed in the direction of the arrow in the drawing, By sandwiching the laminate α2 and the second release substrate 63 with a pair of rollers 75 and 76, as shown in FIG. 14, the inlet sheet covers almost the entire area between the laminate α2 and the second release substrate 63. The second adhesive 54A applied to the other surface 62b of 62 is developed (step G), and the first adhesive 53A, between the first release substrate 61 and the second release substrate 63, Inlet sheet 62 and Second adhesive 54A is laminated in this order, to form an integrated laminate .beta.2.

 As the 2nd peeling base material 63, the thing similar to said 1st peeling base material 61 is used. That is, one surface 63a of the second release substrate 63 is composed of a release layer made of silicon.

 In this step G, since the above-described release film or release paper is used as the second release substrate 63, one surface 63a of the second release substrate 63 is attached to the other surface 62b of the inlet sheet 62. The second release substrate 63 is overlaid on the other surface 62b of the inlet sheet 62 so that the formed release layers (not shown) face each other.

 Further, in the process G, as described above, the second adhesive 54A made of a two-component curable urethane adhesive that is cured by a reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the second adhesive 54A has fluidity until the second adhesive 54A is developed between the laminate α2 and the second release substrate 63. However, as the reaction proceeds, the fluidity gradually increases. It disappears and eventually hardens. As a result, the other surface 62b of the inlet sheet 62 is covered with the second adhesive 54A, and the second release substrate 63 is temporarily fixed on the laminate α2. When the second adhesive 54A is cured, the second covering material 54 is obtained.

  Further, in step G, the thickness of the second adhesive 54A after being developed between the laminate α2 and the second release substrate 63 is the same as that of the first release substrate 61 in step B described above. The thickness is the same as the thickness of the first adhesive 53 </ b> A after being spread between the inlet sheets 62, for example, in the range of 10 μm to 2000 mm.

Moreover, in the process G, the force which pinches | interposes the laminated body (alpha) 2 and the 2nd peeling base material 63 with a pair of rollers 75 and 76, ie, presses the 2nd peeling base material 63 to the thickness direction with respect to the inlet sheet 62. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the laminate α2 and the second release substrate 63, the coating amount of the second adhesive 54A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this process G, the second adhesive 54 </ b> A is filled between the laminate α <b> 2 and the second release substrate 63 with almost no gap.

Next, as shown in FIG. 15, the first peeling substrate 61, the first adhesive 53 </ b> A, the inlet sheet 62, the second adhesive 54 </ b> A, and the second peeling are performed by a cutting blade (not shown) of the cutting device. The laminated body β2 made of the base material 63 is cut in the thickness direction (along the alternate long and short dash line in FIG. 15) according to the shape of the antenna 57, and as shown in FIG. (Step C).
Here, cutting the stacked body β2 in accordance with the shape of the antenna 57 means cutting the antenna 57 in accordance with the shape of the target non-contact type data receiving / transmitting body 50 without damaging the antenna 57.

 Next, after the first adhesive 53A is completely cured to become the first covering material 53, and the second adhesive 54A is completely cured to become the second covering material 54, FIG. As shown in FIG. 18, the first release base 61 and the second release base 63 are peeled from the laminate β2 (step D), and the first adhesive is separated into pieces as shown in FIG. A laminate γ2 composed of 53A, the inlet sheet 62, and the second adhesive 54A is obtained.

 Next, end surfaces 62c and 62d of the inlet sheet 62 constituting the laminated body γ2, end surfaces 53b and 53c of the first adhesive 53A, one surface 53a of the first adhesive 53A, and the second adhesive 54A. The protective film 60 is formed by applying the protective agent for forming the protective film 60 on the end surfaces 54b and 54c and one surface 54a of the second adhesive 54A (step E), and the non-contact type shown in FIG. The data receiving / transmitting body 50 is obtained.

 In this step E, for example, when the adhesive forming the first covering material 53 is cured, if bubbles (pores) 53d are generated on one surface 53a, at least the bubbles (pores) 53d are completely removed. Further, when the adhesive forming the second covering material 54 is cured, if bubbles (pores) 54d are formed on one surface 54a, at least the bubbles (pores) 54d are completely filled. As described above, the protective film 60 is formed by applying the protective agent for forming the protective film 60.

 In step E, end surfaces 62c and 62d of the inlet sheet 62, end surfaces 53b and 53c of the first adhesive 53A, one surface 53a of the first adhesive 53A, and end surfaces 54b and 54c of the second adhesive 54A. As a method for applying the protective agent to one surface 54a of the second adhesive 54A, when a high-viscosity protective agent is used, an offset printing method, a screen printing method, a gravure printing method, a coating method using a coater, or the like is used. In addition, when using a low-viscosity protective agent, a method of immersing the laminate γ2 in the protective agent, a method of placing the laminate γ2 in a mold, and injecting the protective agent into the mold, A spray coating method or the like is used.

 Further, in step E, for example, when the first adhesive 53A is cured to a thickness at which the protective agent for forming the protective film 60 is applied, bubbles (pores) 53d are generated on one surface 53a. In this case, when at least the bubbles (pores) are completely filled, and when the second adhesive 54A is cured, bubbles (pores) 54d are formed on the one surface 54a. The holes are completely filled, and the unevenness caused by these bubbles (pores) is one surface (outer surface) 50a and the other surface (outer surface) 50b of the non-contact type data receiving / transmitting body 50 finally obtained. And the outer surfaces 60a and 60b of the protective film 60 form a smooth surface, for example, within a range of 10 μm to 1000 mm.

 According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, the first adhesive 53A and the inlet sheet are provided between the first release substrate 61 and the second release substrate 63 having the release layer. After the first adhesive 53A and the second adhesive 54A are cured, the laminate is separated into individual pieces. From the laminated body, the first peeling base material 61 and the second peeling base material 63 are peeled to form a laminated body γ2, and end faces 62c and 62d of the inlet sheets 62 constituting the laminated body γ2 and the first adhesive 53A. A protective agent is applied to the end surfaces 53b and 53c of the first adhesive 53A and one surface 53a of the first adhesive 53A, and the end surfaces 54b and 54c of the second adhesive 54A and the first surface 54a of the second adhesive 54A. Since the protective film 60 is formed, There is no need to store the inlet in a fat casing and seal it with a sealing member made of the same material as the casing, or mold the inlet with resin, and the protective film 60 can be easily formed. Since it can be formed, the contactless data receiving / transmitting body 50 can be easily manufactured. Further, since no member other than the first adhesive 53A and the second adhesive 54A is required to cover both surfaces of the inlet sheet 62, the non-contact data receiving / transmitting body 50 having a very thin thickness is manufactured. As a result, the manufacturing cost of the non-contact type data receiving / transmitting body 50 can be reduced.

 In this embodiment, the above-described non-contact type data receiving / transmitting body 50 is continuously manufactured using the long first peeling base 61, the inlet sheet 62, and the second peeling base 63. Although the case is illustrated, the present invention is not limited to this. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 In this embodiment, after step G, a laminate β2 including the first release substrate 61, the first adhesive 53A, the inlet sheet 62, the second adhesive 54A, and the second release substrate 63 is provided. Are cut according to the shape of the antenna 57, the step D of peeling the first peeling substrate 61 and the second peeling substrate 63 from the laminate β2, and the inlet constituting the laminate γ2. End surfaces 62c and 62d of the sheet 62, end surfaces 53b and 53c of the first adhesive 53A and one surface 53a of the first adhesive 53A, and end surfaces 54b and 54c of the second adhesive 54A and the second adhesive Although the case where the process E for forming the protective film 60 on the one surface 54a of the agent 54A is performed in this order is illustrated, the present invention is not limited to this. In the present invention, after the step G, if the group of steps consisting of the steps C and D and the step E are performed in this order, the steps C and D may be performed in random order. That is, in the present invention, in Step D, the first release substrate, the first adhesive, the inlet sheet, the second adhesive, and the laminate composed of the second release substrate, After peeling the release substrate and the second release substrate, and in Step C, the laminate composed of the first adhesive, the inlet sheet, and the second adhesive is cut according to the shape of the antenna, In step E, a protective film may be formed on the end face of the inlet constituting the laminate, the end face and one surface of the first adhesive, and the end face and one surface of the second adhesive.

DESCRIPTION OF SYMBOLS 10 ... Non-contact type data transmission / reception body, 11 ... Inlet, 12 ... Coating | covering material, 12A ... Adhesive, 13, 13A ... Base material, 14 ... IC chip, 15 * ..Antenna, 16, 17 ... radiating element, 20 ... protective film, 21 ... peeling substrate, 22 ... inlet sheet, 31 ... nozzle, 32,33 ... roller, 50 ... Non-contact type data transmitting / receiving body, 51 ... Inlet, 52 ... Covering material, 53 ... First covering material, 53A ... First adhesive, 54 ... Second 54A ... second adhesive, 55, 55A ... base material, 56 ... IC chip, 57 ... antenna, 58, 59 ... radiation element, 60 ... protection Membrane 61 ... first release substrate 62 ... inlet sheet 63 ... second release substrate 71 4 ... nozzle, 72,73,75,76 ... roller

Claims (2)

An inlet, a coating material covering at least the surface of the inlet where the IC chip is provided, and covering at least the end surface of the inlet, and the surface opposite to the end surface of the coating material and the surface in contact with the inlet A non-contact type data receiving / transmitting body comprising a protective film,
Step A of applying an adhesive composed of a two-component curable urethane adhesive on the release layer forming one surface of the release substrate;
Via an adhesive applied to the release substrate, an inlet is overlaid on one surface of the release substrate, and the inlet is pressed against the release substrate, whereby the release substrate and the Step B for unfolding the adhesive between the inlets,
After step B,
Cutting the laminate including the adhesive and the inlet according to the shape of the antenna constituting the inlet; and
Step D for peeling the release substrate;
And applying a protective agent to at least the end surface of the inlet, and the surface opposite to the end surface of the covering material and the surface in contact with the inlet, and
A method of manufacturing a non-contact type data transmitter / receiver, wherein the group of steps including the step C and the step D and the step E are performed in this order, and the step C and the step D are performed in random order. Between the step B and the step C,
A step F of applying an adhesive made of a two-component curable urethane-based adhesive to the surface of the inlet opposite to the surface on which the IC chip is provided;
Via the adhesive applied to the inlet, on the surface of the inlet opposite to the surface on which the IC chip is provided, the release substrate is overlapped with the release layer that forms one surface facing each other, Step G of developing the adhesive between the release substrate and the surface of the inlet opposite to the surface on which the IC chip is provided by pressing the release substrate against the inlet. The method of manufacturing a non-contact type data receiving / transmitting body according to claim 1 , wherein:

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