JP5396341B2 - Non-contact type data receiving / transmitting body and manufacturing method thereof - Google Patents

Description

 The present invention relates to a non-contact type data receiver / receiver that can receive information from the outside using electromagnetic waves or radio waves as a medium, and can transmit information to the outside, such as an information recording medium for RFID (Radio Frequency IDentification). In particular, the present invention relates to a non-contact type data transmitter / receiver excellent in weather resistance, heat resistance and flexibility, and a method for manufacturing the same.

 An IC tag, which is an example of a non-contact type data transmitting / receiving body, includes an inlet composed of a base material, an antenna provided on one surface thereof and connected to each other, and an information writing / reading When an electromagnetic wave or radio wave is received from the device, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is converted into a signal. Transmitted from the antenna.

In order to make such an IC tag excellent in heat resistance, weather resistance and flexibility, various packaged IC tags have been studied.
For example, an inlet is stored in a storage portion (storage space) provided in a housing made of silicon resin, polytetrafluoroethylene resin, or the like, and the storage portion containing the inlet is sealed with the same material as the housing. An IC tag sealed with a stop member is known (for example, see Patent Document 1).
Further, an IC tag in which an inlet is molded only with a resin such as an epoxy resin and packaged is known (see, for example, Patent Document 2).
Further, there is known an IC tag in which a thin sheet-like circuit portion is sandwiched by a surface base material made of a urethane resin coated with a silicone film via an adhesive, and these are integrated (for example, patents) Reference 3).

JP 2002-024783 A JP 2002-31747 A JP 2005-056362 A

 However, when the inlet is stored in the casing, there is a problem that it is difficult to reduce the thickness of the IC tag itself because a certain thickness of the casing is necessary to secure the strength of the casing. Further, when manufacturing such an IC tag, there is a problem in that the manufacturing efficiency is low because it is necessary to individually store and arrange the inlet in the housing.

 In addition, in the case of an IC tag in which a sheet-like circuit portion is sandwiched between surface substrates via an adhesive, the surface substrate is pulled in the cross-sectional direction due to shrinkage when the adhesive is cured. There was a problem that a great flexibility could not be obtained. In addition, since the surface base material is bonded to the sheet-like circuit portion via an adhesive, this IC tag is not only difficult to be thinned, but also has an uneven shape due to the surface base material being caused by the circuit portion. Since it cannot follow and deform, the adhesion between the surface substrate and the circuit portion is low, and there is a risk of peeling at the interface between the surface substrate and the circuit portion. As a result, sufficient heat resistance and weather resistance for the IC tag There was a problem that could not be granted. Further, when the inlet is molded only with an epoxy resin, there is a problem that bubbles (pores) are generated on the surface when the epoxy resin is cured, and the weather resistance may be insufficient due to the bubbles (pores).

 In addition, in the case of an IC tag in which an inlet is sandwiched between surface substrates via an adhesive, the surface substrate is pulled in the cross-sectional direction due to shrinkage when the adhesive is cured, so that the IC tag has sufficient flexibility. There was a problem that it could not be obtained.

 The present invention has been made in view of the above circumstances, and is a non-contact type data transmitter / receiver that can be easily manufactured while being thin, excellent in flexibility, excellent in weather resistance, and its manufacturing method. The purpose is to provide.

 The non-contact type data transmitting / receiving body of the present invention includes an inlet, a covering material that covers at least the surface of the inlet where the IC chip is provided, and a surface opposite to the surface of the covering material that is in contact with the inlet. A non-contact data receiving / transmitting body provided with a protective film provided on the surface of the covering material, the surface of the covering material being in contact with the inlet. Is characterized in that the protective agent forming the protective film is filled in the bubbles present on the opposite surface.

 In the non-contact type data receiving / transmitting body of the present invention, it is preferable that both surfaces of the inlet are covered with the covering material.

 The manufacturing method of the non-contact type data transmitting / receiving body of the present invention is opposite to the inlet, the covering material that covers at least the surface of the inlet where the IC chip is provided, and the surface of the covering material that is in contact with the inlet. A non-contact type data receiving / transmitting body comprising a protective film provided on the side surface, and a two-component curable urethane system on a release layer forming one side of a release substrate Overlaying the surface where the IC chip in the inlet is provided on one surface of the release substrate through the step A of applying an adhesive composed of an adhesive and the adhesive applied to the release substrate, By pressing the inlet against the release substrate, the step B of developing the adhesive between the release substrate and the inlet, the step C of peeling the release substrate, and the adhesive In the above Applying a protective agent on the surface opposite to the surface in contact with the surface, filling the protective agent in bubbles present on the surface, and curing the protective agent to form a protective film; and It is characterized by having.

 In the method for manufacturing a non-contact type data receiving / transmitting body of the present invention, a two-component curable type is provided between the step B and the step C and on the surface opposite to the surface on which the IC chip is provided in the inlet. A step of applying an adhesive composed of a urethane-based adhesive, and a release substrate on the surface opposite to the surface on which the IC chip is provided in the inlet, through the adhesive applied to the inlet, The release layer forming one surface thereof is opposed and overlapped, and the release substrate is pressed against the inlet, whereby the surface of the inlet opposite to the surface on which the IC chip is provided, and the release It is preferable to have the process F which expand | deploys the said adhesive agent between base materials.

 According to the non-contact type data receiving / transmitting body of the present invention, at least the surface on which the IC chip is provided in the inlet is directly coated with a coating material made of a two-component curable urethane adhesive, and the coating material constitutes the inlet. Since it is formed following the uneven shape caused by the IC chip and the antenna to be peeled off, the adhesiveness between the inlet and the covering material is excellent, and peeling at the interface between the inlet and the covering material can be prevented. In addition, the surface of the coating material opposite to the surface in contact with the inlet is directly covered with a protective film made of a protective agent, and bubbles generated on the surface opposite to the surface of the coating material in contact with the inlet ( Since the pores are completely filled with the protective film, it is thin and excellent in flexibility while imparting heat resistance and weather resistance to the inlet. Further, according to the non-contact type data transmitting / receiving body of the present invention, at least the surface on which the IC chip is provided in the inlet is directly coated with a coating material made of a two-component curable urethane adhesive, and the coating material Since the surface opposite to the surface in contact with the inlet has a simple structure in which it is directly covered with a protective film, it can be easily manufactured.

 According to the method for manufacturing a non-contact type data receiving / transmitting body of the present invention, an adhesive and an inlet are laminated on a release substrate having a release layer to form an integrated laminate, so that the adhesive is cured. Thereafter, by peeling the release substrate from the laminate, a laminate in which at least the surface of the inlet provided with the IC chip is directly coated with the coating material can be obtained. Also, by applying a protective agent to the surface opposite to the surface that is in contact with the adhesive inlet, the protective agent is filled in the bubbles (pores) formed on the surface, thus providing weather resistance. Therefore, a protective film can be easily formed. Therefore, unlike the conventional case, it is not necessary to store the inlet in a resin casing and seal it with a sealing member made of the same material as the casing, or mold the inlet with resin. A non-contact type data receiving / transmitting body can be easily manufactured. Therefore, since a member other than the adhesive and the protective film is not required to cover at least the surface on which the IC chip is provided in the inlet, it is possible to manufacture a very thin non-contact type data receiving / transmitting body. As a result, the manufacturing cost of the non-contact type data receiving / transmitting body can be reduced.

It is a schematic sectional drawing which shows 1st embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process A in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process B is shown and it is a schematic sectional drawing in alignment with the AA of FIG. It is a schematic sectional drawing which shows process C in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process D in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process G in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 2nd embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows the process A in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process B is shown and it is a schematic sectional drawing in alignment with the BB line of FIG. It is a schematic perspective view which shows the process E and the process F in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process F is shown and it is a schematic sectional drawing in alignment with CC line of FIG. It is a schematic sectional drawing which shows process C in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process D in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process G in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention.

Embodiments of a non-contact type data receiving / transmitting body and a manufacturing method thereof according to the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment “Non-contact Data Receiver / Transmitter”
FIG. 1 is a schematic cross-sectional view showing a first embodiment of the non-contact type data receiving / transmitting body of the present invention.
The non-contact type data transmitting / receiving body 10 of this embodiment covers an inlet 11 having a substantially rectangular shape in plan view and a surface (hereinafter referred to as “one surface”) 11 a provided with the IC chip 14 in the inlet 11. The covering material 12 and the protective film 20 provided on the surface (hereinafter referred to as “one surface”) 12a opposite to the surface in contact with the inlet 11 of the covering material 12 are schematically configured.

 That is, in the non-contact type data receiving / transmitting body 10, the one surface 11 a of the inlet 11 is directly covered with the covering material 12, and the one surface 12 a of the covering material 12 is directly covered with the protective film 20. The inlet 11, the covering material 12, and the protective film 20 have a structure in which they are laminated in this order in the thickness direction. Thereby, the non-contact type data receiving / transmitting body 10 has a substantially rectangular shape in plan view.

 Further, the protective film 20 is provided so as to fill bubbles (pores) 12 b generated on one surface 12 a of the covering material 12 when the adhesive forming the covering material 12 is cured.

The inlet 11 is generally configured by a base material 13 and an IC chip 14 and an antenna 15 which are provided on one surface 13a of the base material 13 and are electrically connected to each other.
The antenna 15 is a dipole antenna composed of a pair of planar radiating elements 16 and 17 which are made of various conductors, face each other, and have feeding points (portions connected to the IC chip 14) on the opposite sides. is there.
The length in the longitudinal direction of the antenna 15 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 16 and 17 is a length corresponding to a quarter wavelength.

 The one surface 11 a of the inlet 11 corresponds to the one surface 13 a of the base material 13. Therefore, on one surface 11 a of the inlet 11, the IC chip 14 and the antenna 15 are covered with the covering material 12.

 And the end surface of the base material 13, the end surface of the coating | covering material 12, and the end surface of the protective film 20 have comprised the same surface in the four side surfaces of the non-contact-type data transmission / reception body 10. FIG. More specifically, for example, on the side surface 10a of the non-contact type data receiving / transmitting body 10, the end surface 13b of the base material 13, the end surface 12c of the covering material 12, and the end surface 20a of the protective film 20 are the same surface. . Similarly, on the side surface 10b of the non-contact type data transmitting / receiving body 10, the end surface 13c of the base material 13, the end surface 12d of the covering material 12, and the end surface 20b of the protective film 20 are the same surface.

 The thickness of the covering material 12 is not particularly limited, but at least the unevenness caused by the IC chip 14 and the antenna 15 of the inlet 11 does not appear on one surface (outer surface) 10c of the non-contact type data transmitter / receiver 10; And it is a grade which the inlet 11 is not damaged by the impact from the outside, for example, exists in the range of 10 micrometers-2000 mm.

 The covering material 12 is in a liquid state before use, and is composed of a two-component mixed urethane adhesive that cures by reaction between the main agent and the curing agent without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. Is.

As a two-component mixed urethane adhesive, a silane coupling agent having an epoxy group is further added to a mixed solution containing an isocyanate as a first solution and a polyol having a hydroxyl group as a second solution as a second solution. The added one is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. Moreover, the compounding quantity of the silane coupling agent which has an epoxy group with respect to whole quantity of this 2 liquid mixing type urethane type adhesive agent is 0.1 to 2.0 mass%.

Further, as the two-component mixed urethane adhesive, a mixed solution containing an isocyanate as the first solution and a polyol whose hydroxyl group is a primary hydroxyl group as the second solution has an aspect ratio of 10 or more, 100 What added the following inorganic fine particles is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. The blending amount of the inorganic fine particles having an aspect ratio of 10 or more and 100 or less with respect to the total amount of the two-component mixed urethane adhesive is 5% by mass or more and 40% by mass or less.

 Specific examples of such a two-component curable urethane-based adhesive include an adhesive composed of a main agent (trade name: MLT2900, manufactured by Etec) and a curing agent (trade name: G3021-B174, manufactured by Etec). .

 In addition, the adhesive forming the covering material 12 may contain a colorant such as a known inorganic pigment, organic pigment, or dye as necessary. The coating material 12 is colored in an arbitrary color by the colorant.

 As the base material 13, a base material made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE), polypropylene Base material made of polyolefin resin such as (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene; Made of polyamide resin such as nylon 6, nylon 6,6 Base material: Base material made of vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polyacryl Base material made of acrylic resin such as butyl; Base material made of polystyrene; Base material made of polycarbonate (PC); Base material made of polyarylate; Base material made of polyimide; Fine paper, thin paper, glassine paper, sulfate paper, etc. A substrate made of paper is used.

 The IC chip 14 is not particularly limited, and information can be written and read out in a non-contact state via the antenna 15. A non-contact IC tag, a non-contact IC label, or a non-contact IC card can be used. Anything can be used as long as it is applicable to RFID media.

 The antenna 15 is formed on one surface 13a of the base material 13 using a polymer type conductive ink in a predetermined pattern by a printing method such as screen printing or ink jet printing, or by etching the conductive foil. It is made by metal plating.

 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 15 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric current path of the coating film forming the antenna 15 is formed when the conductive fine particles constituting the coating film contact each other, and the resistance value of the coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photocuring type, a penetrating drying type, and a solvent volatilization type are used in addition to the thermosetting type.

 The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone, or a conductive resin fine particle in a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester and isocyanate). 60% by mass or more and a polyester resin of 10% by mass or more, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), heat Polyester resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinked type or A cross-linking / thermoplastic combination type is preferably used.

Examples of the conductive foil forming the antenna 15 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 15 include copper plating, silver plating, gold plating, and platinum plating.

 The thickness of the protective film 20 is not particularly limited, but at least the bubbles 12b generated on the one surface 12a of the covering material 12 are completely filled, and the unevenness caused by the bubbles 12b is not contacted data receiving / transmitting body 10. The surface (outer surface) 20c that does not appear on one surface (outer surface) 10c of the protective film 20 and is opposite to the surface that is in contact with the covering material 12 of the protective film 20 forms a smooth surface, for example, 10 μm to 1000 mm Is within the range.

As a material for forming the protective film 20, a protective agent that is liquid before use and is cured by irradiation with ultraviolet rays or heating is used.
As such a protective agent, it contains inorganic particles such as silica and titanium oxide and organic solids such as solid paraffin, wax and petrolatum (registered trademark), and these components are used as a photocurable resin or a thermosetting resin. A protective agent mixed with the resin is used. In this embodiment, the one containing silica and solid paraffin is used.

In this non-contact type data receiving / transmitting body 10, one surface 11 a of the inlet 11 is directly covered with a covering material 12 made of a two-component curable urethane adhesive, and the covering material 12 constitutes the inlet 11. In addition, since it is formed following the uneven shape caused by the antenna 15, the adhesion between the inlet 11 and the covering material 12 is excellent, and peeling at the interface between the inlet 11 and the covering material 12 can be prevented. Further, one surface 12 a of the covering material 12 is directly covered with the protective film 20 made of a protective agent, and the bubbles 12 b generated on the one surface 12 a of the covering material 12 are completely filled with the protective film 20. Therefore, it is thin and excellent in flexibility while imparting heat resistance and weather resistance to the inlet 11.
In the non-contact type data receiving / transmitting body 10, one surface 11 a of the inlet 11 is directly covered with the covering material 12, and one surface 12 a of the covering material 12 is directly covered with the protective film 20. Since it has a simple configuration, it can be easily manufactured.

In addition, in this embodiment, although the case where the non-contact type | mold data transmission / reception body 10 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 11 which has the antenna 15 which consists of a dipole antenna comprised from a pair of planar radiation elements 16 and 17 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 2-8, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 3, a long base material 13A and one surface 13a thereof are provided with a large number of RFID antennas 15 and IC chips 14 communicating through the antenna 15 at equal intervals. The case where the above-mentioned non-contact type data receiving / transmitting body 10 is continuously manufactured using the inlet sheet 32 will be exemplified.

 First, as shown in FIG. 2, an adhesive is applied to the central portion of one surface 31 a of the long release substrate 31 being conveyed in the direction of the arrow in the drawing along the conveyance direction of the release substrate 31. The adhesive 12A discharged from the nozzle 41 of the apparatus is applied in a line (step A).

As adhesive 12A, the thing similar to the adhesive which forms said coating | covering material 12 is used.
Further, the width for applying the adhesive 12A to the one surface 31a of the release substrate 31, that is, the amount of the adhesive 12A applied to the one surface 31a of the release substrate 31 is not particularly limited, but is covered by the adhesive 12A. The IC chip 14 and the antenna 15 provided on the inlet sheet 32 are appropriately adjusted according to the size and number of the antennas 15 and the thickness required for the covering material 12 formed by curing the adhesive 12A. The

As the release substrate 31, a release film or release paper is used.
As the release film, one of the base films having a thickness of 30 μm to 160 μm made of plastic such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene naphthalate (PEN), polypropylene (PP), polyethylene (PE), etc. The surface and / or the other surface is provided with a release layer made of silicon and having a thickness of 1 μm to 50 μm. That is, one surface 31a of the peeling substrate 31 is composed of a peeling layer made of silicon.
Specific examples of such a release film include Tosero Separator SP-PET-01-BU (trade name) manufactured by Tosero Corporation.

As the release paper, a sealing agent is applied to one surface and / or the other surface of a 30 μm to 160 μm thick substrate made of glassine paper or fine paper, and on the layer made of the sealing agent, What provided the peeling layer with a thickness of 1 μm to 50 μm made of silicon is used. That is, one surface 31a of the peeling substrate 31 is composed of a peeling layer made of silicon.
Specific examples of such release paper include L11C (trade name) manufactured by Oji Tac Co., Ltd.

 The peeling force of the peeling substrate 31 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the release substrate 31, the adhesive is formed on the release layer (not shown) forming one surface 31a of the release substrate 31. Apply 12A.

 Next, as shown in FIG. 3, the inlet sheet 32 conveyed in the direction of the arrow in the drawing is the portion of the peeling substrate 31 that is opposed to the pair of rollers 42 and 43 that rotate in the direction of the arrow in the drawing. While superposing on the one surface 31a of the peeling base material 31 conveyed in the direction of the arrow in the figure through the adhesive 12A applied to the one surface 31a, the peeling base material 31 and the inlet sheet 32 are placed on the roller 42. , 43, the adhesive 12A applied to one surface 31a of the release substrate 31 is spread over substantially the entire area between the release substrate 31 and the inlet sheet 32 (step B), as shown in FIG. ).

 In this step B, one surface 13a of the substrate 13A, that is, the surface of the inlet sheet 32 on which the IC chip 14 and the antenna 15 are provided (hereinafter referred to as “one surface”) The inlet sheet 32 is overlaid on the one surface 31a of the peeling substrate 31 so that the 32a faces.

 In Step B, as described above, the adhesive 12A made of a two-component curable urethane adhesive that is cured by the reaction of the main agent and the curing agent without applying external conditions is used. Therefore, the adhesive 12A has fluidity until it is developed between the release substrate 31 and the inlet sheet 32, but as the reaction proceeds, the adhesive 12A gradually loses fluidity, Eventually hardens. Thus, the one surface 32a of the inlet sheet 32, and the IC chip 14 and the antenna 15 provided on the one surface 32a are covered with the adhesive 12A, and on the one surface 31a of the peeling substrate 31. The inlet sheet 32 is temporarily secured. When the adhesive 12A is cured, the coating material 12 is obtained.

 Further, in step B, the thickness of the adhesive 12A after being developed between the peeling base material 31 and the inlet sheet 32 is at least uneven by the IC chip 14 and the antenna 15 of the inlet sheet 32. The IC chip 14 and the antenna 15 are not damaged on the surface 12a opposite to the surface in contact with the inlet sheet 32 and are not damaged by an external impact, for example, within a range of 10 μm to 2000 mm. .

In Step B, the force for sandwiching the release substrate 31 and the inlet sheet 32 between the pair of rollers 42 and 43, that is, the force (pressure) for pressing the inlet sheet 32 in the thickness direction against the release substrate 31 is is not particularly limited, the thickness or size of the release substrate 31 and the inlet sheet 32, depending on the amount of adhesive applied 12A, it is preferable that it is appropriately ^adjusted, it is 1kg / cm ² ~20kg / cm 2 , more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step B, the IC chip 14 and the antenna 15 are completely covered with the adhesive 12A, and the adhesive 12A is filled between the release substrate 31 and the inlet sheet 32 with almost no gap. Thereby, the laminated body α1 including the peeling base material 31, the adhesive 12A, and the inlet sheet 32 is formed.

 Next, after the adhesive 12A is completely cured to become the covering material 12, as shown in FIG. 5, the release substrate 31 is peeled off from the laminate α1 (step C), as shown in FIG. The laminated body β1 in which the adhesive 12A and the inlet sheet 32 are laminated and integrated is obtained.

 Next, as shown in FIG. 7, the surface 12a of the adhesive 12A opposite to the surface in contact with the inlet sheet 32 (one surface) 12a is filled in the bubbles 12b generated on the one surface 12a. Then, a protective agent for forming the protective film 20 is applied, and the protective agent is cured to form the protective film 20 (step D).

 In this step D, as a method of applying the protective agent to one surface 12a of the adhesive 12A, when a high-viscosity protective agent is used, an offset printing method, a screen printing method, a gravure printing method, a coating method using a coater, etc. In the case of using a low-viscosity protective agent, a method of immersing the laminate β1 in the protective agent, a method of placing the laminate β1 in a mold, and injecting the protective agent into the mold The spray coating method is used.

 Further, in step D, the thickness of the protective agent for forming the protective film 20 is completely filled with at least the bubbles 12b on the one surface 12a of the adhesive 12A, and the irregularities caused by the bubbles 12b are finally formed. The outer surface 10c of the non-contact type data receiving / transmitting body 10 obtained in the above is not smooth and the outer surface 20c of the protective film 20 forms a smooth surface, for example, in the range of 10 μm to 1000 mm.

Next, as shown in FIG. 8, the laminated body γ1 composed of the protective film 20, the adhesive 12A, and the inlet sheet 32 is formed in the thickness direction thereof (in the one-dot chain line in FIG. 8) by a cutting blade (not shown) of the cutting device. Along with this, the laminate 15 is cut according to the shape of the antenna 15 to separate the stacked body γ1 (step G), thereby obtaining the non-contact type data receiving / transmitting body 10 shown in FIG.
Here, to cut the laminated body γ1 according to the shape of the antenna 15 means to cut the laminated body γ1 according to the shape of the target non-contact type data receiving / transmitting body 10 without damaging the antenna 15.

 According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, the adhesive 12A and the inlet sheet 32 are laminated and integrated on the peeling base material 31 having the peeling layer, thereby forming the laminated body α1. After the adhesive 12A is cured, the release substrate 31 is peeled from the laminate α1 to obtain the laminate β1 in which one surface 32a of the inlet sheet 32 is directly coated with the coating material 12. it can. Further, by applying a protective agent to one surface 12a of the adhesive 12A, the protective agent 20 is filled in the bubbles 12b generated on the one surface 12a, so that the protective film 20 for imparting weather resistance can be easily provided. Can be formed. Therefore, unlike the conventional case, it is not necessary to store the inlet in a resin casing and seal it with a sealing member made of the same material as the casing, or mold the inlet with resin. The contactless data receiving / transmitting body 10 can be easily manufactured. Further, since no member other than the adhesive 12A and the protective film 20 is required to cover the one surface 32a of the inlet sheet 32, the contactless data receiving / transmitting body 10 having a very thin thickness is manufactured. As a result, the manufacturing cost of the non-contact type data receiving / transmitting body 10 can be reduced.

 In addition, in this embodiment, although the case where the above-mentioned non-contact type | mold data receiving / transmitting body 10 is manufactured continuously using the elongate peeling base material 31 and the inlet sheet 32, this invention is shown to this. It is not limited. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 Moreover, in this embodiment, although the case where the process G was performed after the process D was illustrated, this invention is not limited to this. In the present invention, the process may be ended in the process D, for example, when an inlet that has been separated in advance is used.

 Moreover, in this embodiment, after the process B, the process C for peeling the release substrate 31 from the laminate α1 composed of the release substrate 31, the adhesive 12A and the inlet sheet 32, and one surface 12a of the adhesive 12A. A process D for forming the protective film 20 on the substrate and a process G for cutting the laminate γ1 made of the protective film 20, the adhesive 12A (covering material 12) and the inlet sheet 32 according to the shape of the antenna 15 in this order. Although the case where it performs is illustrated, this invention is not limited to this. In the present invention, after step B, if it further includes a group of steps consisting of step C and step D and step G, a group of steps consisting of step C and step D, and step G may be performed in any order. That is, in the present invention, in Step G, after the laminate made of the release substrate, the adhesive, and the inlet sheet is cut according to the shape of the antenna, the laminate is peeled from the laminate in Step C. The substrate may be peeled off and a protective film may be formed on one surface of the adhesive in step D.

(2) Second Embodiment “Non-contact Data Receiver / Transmitter”
FIG. 9 is a schematic cross-sectional view showing a second embodiment of the contactless data receiving / transmitting body of the present invention.
The non-contact type data transmitting / receiving body 50 of this embodiment covers an inlet 51 having a substantially rectangular shape in plan view and a surface (hereinafter referred to as “one surface”) 51a provided with an IC chip 56 in the inlet 51. A first covering material 53, a second covering material 54 covering the surface of the inlet 51 opposite to the surface on which the IC chip 56 is provided (hereinafter referred to as “the other surface”) 51 b, The first protective film 61 provided on the surface of the covering material 53 opposite to the surface in contact with the inlet 51 (hereinafter referred to as “one surface”) 53 a and the second covering material 54 A second protective film 62 provided on a surface (hereinafter referred to as “one surface”) 54 a opposite to the surface in contact with the inlet 51 is schematically configured.

The first covering material 53 and the second covering material 54 are collectively referred to as a covering material 52, and the first protective film 61 and the second protective film 62 are collectively referred to as a protective film 60. is there.
That is, in the non-contact type data receiving / transmitting body 50, both surfaces (one surface 51 a and the other surface 51 b) of the inlet 51 are directly covered with the covering material 52 and are in contact with the inlet 51 of the covering material 52. The surface opposite to the surface (one surface 52a and the other surface 52b) is directly covered with the protective film 60, and the first protective film 61, the first covering material 53, the inlet 51, the second surface The covering material 54 and the second protective film 62 are stacked in this order in the thickness direction. Thereby, the non-contact type data transmitting / receiving body 50 has a substantially rectangular shape in plan view.

 Further, the first protective film 61 fills bubbles (pores) 53 b generated on one surface 53 a of the first covering material 53 when the adhesive forming the first covering material 53 is cured. Is provided. Similarly, the second protective film 62 fills bubbles (pores) 54 b generated on one surface 54 a of the second coating material 54 when the adhesive forming the second coating material 54 is cured. It is provided as follows.

The inlet 51 is generally configured by a base 55 and an IC chip 56 and an antenna 57 which are provided on one surface 55a of the base 55 and are electrically connected to each other.
The antenna 57 is a dipole antenna composed of a pair of planar radiating elements 58 and 59 made of various conductors, facing each other and having feeding points (portions connected to the IC chip 56) on the facing sides. is there.
The length in the longitudinal direction of the antenna 57 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 58 and 59 is a length corresponding to a quarter wavelength.

One surface 51 a of the inlet 51 corresponds to one surface 55 a of the base material 55, and the other surface 51 b of the inlet 51 corresponds to the other surface 55 b of the base material 55.
Therefore, the IC chip 56 and the antenna 57 are covered with the first covering member 53 on the one surface 51 a of the inlet 51.

 Then, on the four side surfaces of the non-contact type data receiving / transmitting body 50, the end surface of the first protective film 61, the end surface of the first covering material 53, the end surface of the base material 55, and the second covering material 54 are provided. And the end surface of the second protective film 62 are flush with each other. More specifically, for example, on the side surface 50a of the non-contact type data transmitting / receiving body 50, the end surface 61a of the first protective film 61, the end surface 53c of the first covering material 53, the end surface 55c of the base material 55, and the second The end surface 54c of the covering material 54 and the end surface 62a of the second protective film 62 are the same surface. Similarly, on the side surface 50b of the non-contact type data receiving / transmitting body 50, the end surface 61b of the first protective film 61, the end surface 53d of the first covering material 53, the end surface 55d of the base material 55, and the second covering material 54 are used. The end surface 54d of the second protective film 62 and the end surface 62b of the second protective film 62 are the same surface.

The thickness of the first covering material 53 is not particularly limited, but at least unevenness caused by the IC chip 56 and the antenna 57 of the inlet 51 appears on one surface (outer surface) 50 c of the non-contact type data receiving / transmitting body 50. And the inlet 51 is not damaged by an external impact, for example, in the range of 10 μm to 2000 mm.
The thickness of the second covering material 54 is not particularly limited, but is such that the inlet 51 is not damaged by an external impact, for example, in the range of 10 μm to 2000 mm.

 Furthermore, when the non-contact type data receiving / transmitting body 50 has sufficient flexibility (flexibility) and the non-contact type data receiving / transmitting body 50 is bent, the first covering material 53 is formed with respect to the inlet 51. In order to prevent the stress caused by the difference in thickness between the first covering material 54 and the second covering material 54, the thickness of the first covering material 53 is preferably equal to the thickness of the second covering material 54.

 The covering material 52 (the first covering material 53 and the second covering material 54) is in a liquid state before use, and the main agent and the curing agent can be used without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. It consists of a two-component curable urethane adhesive that cures by reaction.

 As the two-component curable urethane adhesive, the same one as in the first embodiment described above is used.

 As the base material 55, the IC chip 56, and the antenna 57, those similar to those in the first embodiment described above are used.

The thickness of the first protective film 61 is not particularly limited, but at least the bubbles 53b generated on one surface 53a of the first covering material 53 are completely filled, and the unevenness caused by the bubbles 53b is non-contact. The surface (outer surface) 61c that does not appear on one surface (outer surface) 50c of the mold data receiving / transmitting body 50 and is opposite to the surface in contact with the first covering material 53 of the first protective film 61 is smooth. For example, it is in the range of 10 μm to 1000 mm.
In addition, the thickness of the second protective film 62 is such that at least one of the bubbles 54b generated on the one surface 54a of the second covering material 54 is completely filled, and the unevenness caused by the bubbles 54b is not contactless data receiving. The surface (outer surface) 62c that does not appear on the other surface (outer surface) 50d of the transmitter 50 and that is opposite to the surface in contact with the second coating material 54 of the second protective film 62 forms a smooth surface. For example, it is in the range of 10 μm to 1000 mm.

 Furthermore, when the non-contact type data receiving / transmitting body 50 has sufficient flexibility (flexibility) and the non-contact type data receiving / transmitting body 50 is bent, the first protective film 61 is applied to the inlet 51. In order to prevent the stress caused by the difference in thickness between the first protective film 62 and the second protective film 62, the thickness of the first protective film 61 and the thickness of the second protective film 62 are preferably equal.

As a material for forming the protective film 60 (the first protective film 61 and the second protective film 62), a protective agent that is liquid before use and is cured by irradiation with ultraviolet rays or heating is used. .
As such a protective agent, the same one as in the first embodiment described above is used.

In the non-contact type data receiving / transmitting body 50, one surface 51a of the inlet 51 is directly coated with a first coating material 53 made of a two-component curable urethane adhesive, and the other surface 51b of the inlet 51 is directly coated. It is covered with a second covering material 54 made of a two-component curable urethane adhesive, and the first covering material 53 is formed following the uneven shape caused by the IC chip 56 and the antenna 57 constituting the inlet 51. Therefore, the adhesiveness between the inlet 51 and the covering material 52 is excellent, and peeling at the interface between the inlet 51 and the covering material 52 can be prevented. In addition, one surface 53a of the first covering material 53 is directly covered with the first protective film 61 made of a protective agent, and the bubbles 53b generated on the one surface 53a of the first covering material 53 are the first. One surface 54 a of the second covering material 54 is directly covered with the second protective film 62 made of a protective agent, and the second covering material 54 is completely filled with one protective film 61. Since the bubbles 54b generated on the one surface 54a are completely filled with the second protective film 62, they are thin and excellent in flexibility while imparting heat resistance and weather resistance to the inlet 51.
Further, the non-contact type data receiving / transmitting body 50 is a surface in which one surface 51 a and the other surface 51 b of the inlet 51 are directly covered with the covering material 52 and are in contact with the inlet 51 of the covering material 52. Since the opposite surfaces 52a and 52b have a simple structure in which they are directly covered with the protective film 60, they can be easily manufactured.

In addition, in this embodiment, although the case where the non-contact-type data transmission / reception body 50 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 51 which has the antenna 57 which consists of a dipole antenna comprised from a pair of planar radiation elements 58 and 59 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 10-18, the manufacturing method of the non-contact type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 11, a long base material 55A and one surface 55a thereof are provided with a large number of RFID antennas 57 and IC chips 56 communicating through the antennas 57 at equal intervals. The case where the above-mentioned non-contact type data receiving / transmitting body 50 is manufactured continuously using the inlet sheet 72 will be exemplified.

 First, as shown in FIG. 10, in the center of one surface 71 a of the long first release substrate 71 being conveyed in the direction of the arrow in the figure, in the conveyance direction of the first release substrate 71. The first adhesive 53A discharged from the nozzle 81 of the adhesive application device is applied linearly (step A).

As the first adhesive 53A, the same adhesive as that used to form the covering material 52 is used.
Further, the width for applying the first adhesive 53A to the one surface 71a of the first release substrate 71, that is, the application amount of the first adhesive 53A to the one surface 71a of the first release substrate 71. Although there is no particular limitation, the size and number of IC chips 56 and antennas 57 provided on the inlet sheet 72 and the first adhesive 53A, which are covered with the first adhesive 53A, are cured. According to the thickness etc. which are required for the first covering material 53 to be adjusted, it is appropriately adjusted.

As the 1st peeling base material 71, the thing similar to the peeling base material of the above-mentioned 1st embodiment is used.
The peeling force of the first peeling substrate 71 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the first release substrate 71, a release layer (not shown) forming one surface 71a of the first release substrate 71 is used. The first adhesive 53A is applied on the top.

 Next, as shown in FIG. 11, the inlet sheet 72 conveyed in the direction of the arrow in the figure is the first release group at the opposing portion of the pair of rollers 82 and 83 that rotate in the direction of the arrow in the figure. The first adhesive 71A applied to one surface 71a of the material 71 is overlaid on the one surface 71a of the first peeling substrate 71 being conveyed in the direction of the arrow in the drawing, and the first By sandwiching the release substrate 71 and the inlet sheet 72 with the rollers 82 and 83, as shown in FIG. 12, the first release substrate is formed over almost the entire area between the first release substrate 71 and the inlet sheet 72. The first adhesive 53A applied to one surface 71a of 71 is developed (step B).

 In this process B, the one surface 71a of the first peeling substrate 71 is provided on one surface 55a of the substrate 55A, that is, the surface of the inlet sheet 72 on which the IC chip 56 and the antenna 57 are provided (hereinafter referred to as “one side”). The inlet sheet 72 is overlaid on one surface 71a of the first release substrate 71 so that the surfaces 72a face each other.

 Further, in the process B, as described above, the first adhesive 53A made of a two-component curable urethane adhesive that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the first adhesive 53A has fluidity until it is developed between the first release substrate 71 and the inlet sheet 72, but the first adhesion is progressed as the reaction proceeds. The agent 53A gradually loses fluidity and eventually hardens. Accordingly, the one surface 72a of the inlet sheet 72, and the IC chip 56 and the antenna 57 provided on the one surface 72a are covered with the first adhesive 53A, and the first peeling substrate 71 An inlet sheet 72 is temporarily fixed on one surface 71a. When the first adhesive 53A is cured, the first covering material 53 is obtained.

 In Step B, the thickness of the first adhesive 53A after being developed between the first release substrate 71 and the inlet sheet 72 is caused by at least the IC chip 56 and the antenna 57 of the inlet sheet 72. The degree of unevenness does not appear on the surface 53a opposite to the surface in contact with the inlet sheet 72 of the first adhesive 53A, and the IC chip 56 and the antenna 57 are not damaged by an external impact. The range is 10 μm to 2000 mm.

Further, in step B, a force for sandwiching the first release substrate 71 and the inlet sheet 72 between the pair of rollers 82 and 83, that is, pressing the inlet sheet 72 in the thickness direction against the first release substrate 71. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the first release substrate 71 and the inlet sheet 72, the coating amount of the first adhesive 53A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step B, the IC chip 56 and the antenna 57 are completely covered by the first adhesive 53A, and the first adhesive 53A is substantially between the first peeling base 71 and the inlet sheet 72 without any gap. Filled.

 Next, as shown in FIG. 13, while transporting the laminated body α <b> 2 composed of the first peeling substrate 71 and the inlet sheet 72 in the direction of the arrow in the figure, the side opposite to the one surface 72 a of the inlet sheet 72. A surface (hereinafter referred to as “the other surface”) 72b, that is, a central portion of the other surface 55b of the base material 55A, is discharged from the nozzle 84 of the adhesive application device along the transport direction of the stacked body α2. The second adhesive 54A is applied linearly (step E).

As the second adhesive 54A, the same adhesive as that used to form the covering material 52 is used.
Further, the width for applying the second adhesive 54A to the other surface 72b of the inlet sheet 72, that is, the amount of the second adhesive 54A applied to the other surface 55b of the base material 55A is not particularly limited. The thickness is appropriately adjusted according to the thickness required for the second covering material 54 formed by curing the second adhesive 54A.

 Next, as shown in FIG. 13, the second peeling substrate 73 conveyed in the direction of the arrow in the figure is placed at the inlet of the pair of rollers 85 and 86 that rotate in the direction of the arrow in the figure. The second adhesive 54A applied to the other surface 72b of the sheet 72 is overlaid on the other surface 72b of the inlet sheet 72 constituting the laminate α2 conveyed in the direction of the arrow in the drawing, By sandwiching the laminate α2 and the second release substrate 73 with the rollers 85 and 86, as shown in FIG. 14, the inlet sheet 72 is spread over almost the entire area between the laminate α2 and the second release substrate 73. The second adhesive 54A applied to the other surface 72b is developed (step F), and the first adhesive 53A and the inlet sheet are interposed between the first release substrate 71 and the second release substrate 73. 72 and second Chakuzai 54A is laminated in this order, to form an integrated laminate .beta.2.

 As the 2nd peeling base material 73, the thing similar to said 1st peeling base material 71 is used. That is, one surface 73a of the second release substrate 73 is composed of a release layer made of silicon.

 In this step F, since the above-described release film or release paper is used as the second release substrate 73, one surface 73a of the second release substrate 73 is formed on the other surface 72b of the inlet sheet 72. The second release substrate 73 is overlaid on the other surface 72b of the inlet sheet 72 so that the formed release layers (not shown) face each other.

 Further, in the process F, as described above, the second adhesive 54A made of a two-component curable urethane adhesive that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the second adhesive 55A has fluidity until it is developed between the laminate α2 and the second release substrate 73. However, as the reaction proceeds, the second adhesive 55A The agent 54A gradually loses fluidity and eventually hardens. As a result, the other surface 72b of the inlet sheet 72 is covered with the second adhesive 54A, and the second release substrate 73 is temporarily fixed on the laminate α2. When the second adhesive 54A is cured, the second covering material 54 is obtained.

 Moreover, in the process F, the thickness of the second adhesive 54A after being developed between the laminate α2 and the second release substrate 73 is the same as that of the first release substrate 71 in the process B described above. The thickness is the same as the thickness of the first adhesive 53 </ b> A after being spread between the inlet sheets 72, for example, in the range of 10 μm to 2000 mm.

Moreover, in the process F, the force which pinches | interposes the laminated body (alpha) 2 and the 2nd peeling base material 73 with a pair of rollers 85 and 86, ie, presses the 2nd peeling base material 73 to the thickness direction with respect to the inlet sheet 72. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the laminate α2 and the second release substrate 73, the coating amount of the second adhesive 54A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this process F, the second adhesive 54 </ b> A is filled between the laminate α <b> 2 and the second release substrate 73 with almost no gap.

 Next, after the first adhesive 53A is completely cured to become the first coating material 53, and the second adhesive 54A is completely cured to become the second coating material 54, FIG. As shown, the first release substrate 71 and the second release substrate 73 are peeled from the laminate β2 (step C), and as shown in FIG. 16, the first adhesive 53A and the inlet sheet 72 are removed. And the 2nd adhesive agent 54A is laminated | stacked in this order, and the laminated body (gamma) 2 integrated is obtained.

 Next, as shown in FIG. 17, the first adhesive 53 </ b> A has a surface (one surface) 53 a opposite to the surface in contact with the inlet sheet 72, and a bubble 53 b generated on the one surface 53 a. The protective agent for forming the first protective film 61 is applied so as to be filled, the protective agent is cured to form the first protective film 61, and the inlet sheet of the second adhesive 54A Protective agent for forming the second protective film 62 on the surface 54a opposite to the surface in contact with 72 (one surface) 54a so as to fill the bubbles 54b formed on the one surface 54a. And the protective agent is cured to form the second protective film 62 (step D).

 In this step D, as a method of applying a protective agent to one surface 53a of the first adhesive 53A and one surface 54a of the second adhesive 54A, when a high-viscosity protective agent is used, an offset is used. A printing method, a screen printing method, a gravure printing method, a coating method using a coater, or the like is used. When a low-viscosity protective agent is used, a method in which the laminate γ is immersed in the protective agent, and the laminate γ is used. A method in which a protective agent is injected into the mold after being placed in the mold, a spray coating method, or the like is used.

Further, in the process D, the thickness of applying the protective agent for forming the first protective film 61 is caused by completely filling at least the air bubbles 53b on the one surface 53a of the first adhesive 53A. The unevenness to be generated does not appear on the outer surface 50c of the finally obtained non-contact type data transmitter / receiver 50, and the outer surface 61c of the first protective film 61 forms a smooth surface, for example, in the range of 10 μm to 1000 mm Within.
Further, in the process D, the thickness of applying the protective agent for forming the second protective film 62 is caused by completely filling at least the bubbles 54b on the one surface 54a of the second adhesive 54A, resulting from the bubbles 54b. The unevenness to be generated does not appear on the outer surface 50d of the finally obtained non-contact type data receiving / transmitting body 50, and the outer surface 62c of the second protective film 62 forms a smooth surface, for example, in the range of 10 μm to 1000 mm Within.

Next, as shown in FIG. 18, the first protective film 61, the first adhesive 53A, the inlet sheet 72, the second adhesive 54A, and the second protective film are cut by a cutting blade (not shown) of the cutting device. The laminated body δ2 composed of 62 is cut in the thickness direction (along the alternate long and short dash line in FIG. 18) according to the shape of the antenna 57, and the laminated body δ2 is singulated (step G), as shown in FIG. A contactless data receiving / transmitting body 50 is obtained.
Here, cutting the stacked body δ2 according to the shape of the antenna 57 means cutting the antenna 57 according to the shape of the target non-contact type data receiving / transmitting body 50 without damaging the antenna 57.

 According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, the first adhesive 53A and the inlet sheet are provided between the first release base 71 having the release layer and the second release base 73. 72 and the second adhesive 54A are laminated and integrated to form a laminated body β2, so that the first peeling from the laminated body β2 after the first adhesive 53A and the second adhesive 54A are cured. By peeling the base material 71 and the second peeling base material 73, it is possible to obtain a laminate γ2 in which the one surface 72a and the other surface 72b of the inlet sheet 72 are directly coated with the coating material 52. Further, by applying a protective agent to one surface 53a of the first adhesive 53A, the protective agent is filled into the bubbles 53b generated on the one surface 53a, and one of the second adhesives 54A is filled. By applying the protective agent to the surface 54a, the protective agent 60 is filled in the bubbles 54b generated on the one surface 54a, so that the protective film 60 for imparting weather resistance can be easily formed. Therefore, unlike the conventional case, it is not necessary to store the inlet in a resin casing and seal it with a sealing member made of the same material as the casing, or mold the inlet with resin. The contactless data receiving / transmitting body 50 can be easily manufactured. Further, in order to cover one surface 72 a and the other surface 72 b of the inlet sheet 72, other than the first protective film 61, the first adhesive 53 </ b> A, the second adhesive 54 </ b> A, and the second protective film 62. Since no member is required, the contactless data receiving / transmitting body 50 having a very small thickness can be manufactured. As a result, the manufacturing cost of the contactless data receiving / transmitting body 10 can be reduced.

 In this embodiment, the above-described non-contact type data receiving / transmitting body 50 is continuously manufactured by using the long first peeling base material 71, the inlet sheet 72, and the second peeling base material 73. Although the case is illustrated, the present invention is not limited to this. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 Moreover, in this embodiment, although the case where the process G was performed after the process D was illustrated, this invention is not limited to this. In the present invention, the process may be ended in the process D, for example, when an inlet that has been separated in advance is used.

 In this embodiment, after step F, a laminate β2 composed of the first release substrate 71, the first adhesive 53A, the inlet sheet 72, the second adhesive 54A, and the second release substrate 73 is provided. The first protective film 61 is formed on the one surface 53a of the first adhesive 53A and the process C for peeling the first peeling base material 71 and the second peeling base material 73. Step D of forming the second protective film 62 on one surface 54a of the adhesive 54A, the first protective film 61, the first adhesive 53A, the inlet sheet 72, the second adhesive 54A, and the second adhesive 54A. Although the case where the step G of cutting the laminated body δ2 made of the protective film 62 according to the shape of the antenna 57 is performed in this order is exemplified, the present invention is not limited to this. In the present invention, after step F, if it further includes a group of steps consisting of step C and step D and step G, a group of steps consisting of step C and step D and step G may be performed in any order. That is, in the present invention, in Step G, a laminate composed of the first release substrate, the first adhesive, the inlet sheet, the second adhesive, and the second release substrate is formed on the antenna. After cutting according to the shape, in step C, the first release substrate and the second release substrate are peeled from the laminate, and in step D, one surface of the first adhesive is applied. While forming a 1st protective film, you may form a 2nd protective film in one side of a 2nd adhesive agent.

DESCRIPTION OF SYMBOLS 10 ... Non-contact type data transmission / reception body, 11 ... Inlet, 12 ... Coating | covering material, 12A ... Adhesive, 13, 13A ... Base material, 14 ... IC chip, 15 * ..Antenna, 16, 17 ... radiating element, 20 ... protective film, 31 ... peeling substrate, 32 ... inlet sheet, 41 ... nozzle, 42,43 ... roller, 50 ... Non-contact type data transmitting / receiving body, 51 ... Inlet, 52 ... Covering material, 53 ... First covering material, 54 ... Second covering material, 55 ... Base material 56 ... IC chip, 57 ... antenna, 58,59 ... radiation element, 60 ... protective film, 61 ... first protective film, 62 ... second protective film, 71 ... first release substrate, 72 ... inlet sheet, 73 ... second release substrate, 81,84 ... no Le, 82,83,85,86 ... roller.

Claims (4)

An inlet, a coating material that covers at least a surface of the inlet where the IC chip is provided, and a protective film provided on a surface of the coating material that is opposite to the surface that is in contact with the inlet. A contactless data receiving and transmitting body,
The covering material comprises a two-component curable urethane adhesive,
A non-contact type data transmitter / receiver characterized in that a protective agent that forms the protective film is filled in bubbles present on a surface opposite to a surface in contact with the inlet of the coating material.  The contactless data receiving / transmitting body according to claim 1, wherein both surfaces of the inlet are covered with the covering material. An inlet, a coating material that covers at least a surface of the inlet where the IC chip is provided, and a protective film provided on a surface of the coating material that is opposite to the surface that is in contact with the inlet. A method of manufacturing a contactless data receiving / transmitting body,
Step A of applying an adhesive composed of a two-component curable urethane adhesive on the release layer forming one surface of the release substrate;
Via the adhesive applied to the release substrate, the surface on which the IC chip in the inlet is provided is superimposed on one surface of the release substrate, and the inlet is pressed against the release substrate. Step B for developing the adhesive between the release substrate and the inlet,
Step C for peeling the release substrate;
A protective agent is applied to the surface of the adhesive opposite to the surface that is in contact with the inlet, the protective agent is filled in bubbles present on the surface, and the protective agent is cured to form a protective film. A non-contact type data receiving / transmitting method. Between the step B and the step C,
Step E of applying an adhesive made of a two-component curable urethane-based adhesive to the surface opposite to the surface on which the IC chip is provided in the inlet;
Via the adhesive applied to the inlet, on the surface of the inlet opposite to the surface on which the IC chip is provided, the release substrate is overlapped with the release layer that forms one surface facing each other, Step F of developing the adhesive between the release substrate and the surface of the inlet opposite to the surface on which the IC chip is provided by pressing the release substrate against the inlet. The method of manufacturing a contactless data receiving / transmitting body according to claim 3, wherein:

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