JP5766920B2 - Method for manufacturing contactless data receiving / transmitting body - Google Patents

Description

The present invention relates to a non-contact type data receiver / receiver that can receive information from the outside using electromagnetic waves or radio waves as a medium, and can transmit information to the outside, such as an information recording medium for RFID (Radio Frequency IDentification). It relates to a method of manufacturing, in particular, weather resistance, a method of manufacturing a heat resistance and excellent flexibility contactless data reception and transmission body.

  An IC tag, which is an example of a non-contact type data transmitting / receiving body, includes an inlet composed of a base material, an antenna provided on one surface thereof and connected to each other, and an information writing / reading When an electromagnetic wave or radio wave is received from the device, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is converted into a signal. Transmitted from the antenna.

In order to make such an IC tag excellent in heat resistance, weather resistance and flexibility, various packaged IC tags have been studied.
For example, an inlet is stored in a storage portion (storage space) provided in a casing made of silicone resin, polytetrafluoroethylene resin, or the like, and the storage section storing the inlet is sealed with a material similar to that of the casing. An IC tag sealed with a stop member is known (for example, see Patent Document 1).
Further, an IC tag in which an inlet is molded only with a resin such as an epoxy resin and packaged is known (see, for example, Patent Document 2).
Further, there is known an IC tag in which a thin sheet-like circuit portion is sandwiched by a surface base material made of a urethane resin coated with a silicone film via an adhesive, and these are integrated (for example, patents) Reference 3).

JP 2002-024783 A JP 2002-31747 A JP 2005-056362 A

  However, when the inlet is stored in the casing, there is a problem that it is difficult to reduce the thickness of the IC tag itself because a certain thickness of the casing is necessary to secure the strength of the casing. Moreover, when manufacturing such an IC tag, since it is necessary to store and arrange | position an inlet separately in a housing | casing, there existed a problem that manufacturing efficiency was low.

  In addition, in the case of an IC tag in which a sheet-like circuit portion is sandwiched between surface substrates via an adhesive, the surface substrate is pulled in the cross-sectional direction due to shrinkage when the adhesive is cured. There was a problem that a great flexibility could not be obtained. In addition, since the surface base material is bonded to the sheet-like circuit portion via an adhesive, this IC tag is not only difficult to be thinned, but also has an uneven shape due to the surface base material being caused by the circuit portion. Since it cannot follow and deform, the adhesion between the surface substrate and the circuit portion is low, and there is a risk of peeling at the interface between the surface substrate and the circuit portion. As a result, sufficient heat resistance and weather resistance for the IC tag There was a problem that could not be granted.

  In order to attach the packaged IC tag to the object, an adhesive material is separately provided on the surface (outer surface) of the IC tag, and the IC tag is attached to the object via the adhesive material, or A method of locking the IC tag to the object with bolts, screws, or the like is employed. Therefore, there are problems that the number of components of the IC tag is increased, the thickness of the IC tag is increased, the manufacturing process is increased, and the manufacturing cost is increased.

This invention is made | formed in view of the said situation, Comprising: It is thin and excellent in a softness | flexibility, and it can stick to a target object without using an adhesive material etc., and can be manufactured easily. It is an object of the present invention to provide a method for manufacturing a non-contact type data receiving / transmitting body.

Method of manufacturing a non-contact type data reception and transmission body of the present invention, the inlet and the coating that covers the surface opposite to the surface on which the IC chip is provided in the surface and the inlet provided IC chips definitive to the inlets A non-contact type data transmitting / receiving body comprising a two-component curable urethane adhesive on a release layer forming one surface of the first release substrate . a step of applying an adhesive through said first adhesive applied to said first release substrate, IC chip is provided in the inlet on the one surface of the first release substrate It was superposed a surface, by pressing the inlet to the first release substrate, between the said first release substrate inlet, a step of developing the first adhesive IC chip in the inlet is installed A step of applying a second adhesive composed of a two-component curable urethane-based adhesive to the surface opposite to the formed surface, and the second adhesive applied to the inlet. On the surface opposite to the surface on which the IC chip is provided, a second release substrate is overlapped with the release layer forming one surface thereof facing each other, and the second release group is placed on the inlet. A step of developing the second adhesive between the surface of the inlet opposite to the surface on which the IC chip is provided and the second peeling substrate by pressing the material; The cured first adhesive is cured to have tackiness and becomes the coating material, and the developed second adhesive is cured to have tackiness and becomes the coating material. Later, the first release substrate and the second release group Characterized in that it and a step of peeling off the.

  According to the method for manufacturing a non-contact type data receiving / transmitting body of the present invention, an adhesive and an inlet are laminated on a release substrate having a release layer to form an integrated laminate, so that the adhesive is cured. Thereafter, by peeling off the peeling substrate, a non-contact type data transmitting / receiving body including an inlet and a covering material covering at least the surface on which the IC chip is provided can be obtained. Therefore, unlike the conventional case, it is not necessary to store the inlet in a resin casing and seal it with a sealing member made of the same material as the casing, or mold the inlet with resin. A non-contact type data receiving / transmitting body can be easily manufactured. Furthermore, since a member other than an adhesive is not required to cover both sides of the inlet, a non-contact type data receiving / transmitting body having a very thin thickness can be manufactured. Therefore, the manufacturing cost of the non-contact type data receiving / transmitting body can be reduced.

It is a schematic sectional drawing which shows 1st embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process A in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process B is shown and it is a schematic sectional drawing in alignment with the AA of FIG. It is a schematic sectional drawing which shows process F in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process F in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 2nd embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows the process A in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, process B is shown and it is schematic sectional drawing in alignment with the BB line of FIG. It is a schematic perspective view which shows the process D and the process E in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process E is shown and it is a schematic sectional drawing in alignment with CC line of FIG. It is a schematic sectional drawing which shows process F in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process F in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention.

Embodiments of a non-contact type data receiving / transmitting body and a manufacturing method thereof according to the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment “Non-contact Data Receiver / Transmitter”
FIG. 1 is a schematic cross-sectional view showing a first embodiment of the non-contact type data receiving / transmitting body of the present invention.
The non-contact type data transmitting / receiving body 10 of this embodiment is generally configured by an inlet 11 having a substantially rectangular shape in plan view and a covering material 12 that covers one surface 11a of the inlet 11.
That is, the non-contact type data receiving / transmitting body 10 has a structure in which one surface 11a of the inlet 11 is directly covered with the covering material 12, and the covering material 12 and the inlet 11 are laminated in the thickness direction. ing. Thereby, the non-contact type data receiving / transmitting body 10 has a substantially rectangular shape in plan view.

The inlet 11 is generally configured by a base material 13 and an IC chip 14 and an antenna 15 which are provided on one surface 13a of the base material 13 and are electrically connected to each other.
The antenna 15 is a dipole antenna composed of a pair of planar radiating elements 16 and 17 which are made of various conductors, face each other, and have feeding points (portions connected to the IC chip 14) on the opposite sides. is there.
The length in the longitudinal direction of the antenna 15 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 16 and 17 is a length corresponding to a quarter wavelength.

The one surface 11 a of the inlet 11 corresponds to the one surface 15 a of the base material 13.
Therefore, on one surface 11 a of the inlet 11, the IC chip 14 and the antenna 15 are covered with the covering material 12.

 And the end surface of the coating | covering material 12 and the base material 13 have comprised the same surface in the four side surfaces of the non-contact-type data transmission / reception body 10. FIG. More specifically, for example, the end surface 12a of the covering material 12 and the end surface 13c of the base material 13 are the same surface on the side surface 10a of the non-contact type data transmitting / receiving body 10. Similarly, the end surface 12b of the covering material 12 and the end surface 13d of the base material 13 are the same surface on the side surface 10b of the non-contact type data transmitting / receiving body 10.

 The thickness of the covering material 12 is not particularly limited, but at least the unevenness caused by the IC chip 14 and the antenna 15 of the inlet 11 does not appear on one surface (outer surface) 10c of the non-contact type data transmitter / receiver 10; And it is a grade which the inlet 11 is not damaged by the impact from the outside, for example, exists in the range of 10 micrometers-2000 mm.

 The covering material 12 is in a liquid state before use, and is composed of a two-component mixed urethane adhesive that cures by reaction between the main agent and the curing agent without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. Is.

As a two-component mixed urethane adhesive, a silane coupling agent having an epoxy group is further added to a mixed solution containing an isocyanate as a first solution and a polyol having a hydroxyl group as a second solution as a second solution. The added one is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. Moreover, the compounding quantity of the silane coupling agent which has an epoxy group with respect to whole quantity of this 2 liquid mixing type urethane type adhesive agent is 0.1 to 2.0 mass%.

Further, as the two-component mixed urethane adhesive, a mixed solution containing an isocyanate as the first solution and a polyol whose hydroxyl group is a primary hydroxyl group as the second solution has an aspect ratio of 10 or more, 100 What added the following inorganic fine particles is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. The blending amount of the inorganic fine particles having an aspect ratio of 10 or more and 100 or less with respect to the total amount of the two-component mixed urethane adhesive is 5% by mass or more and 40% by mass or less.

 Specific examples of such a two-component curable urethane-based adhesive include an adhesive composed of a main agent (trade name: MLT2900, manufactured by Etec) and a curing agent (trade name: G3021-B174, manufactured by Etec). .

 In addition, the adhesive forming the covering material 12 may contain a colorant such as a known inorganic pigment, organic pigment, or dye as necessary. The coating material 12 is colored in an arbitrary color by the colorant.

 As the substrate 13, a substrate made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE), polypropylene Base material made of polyolefin resin such as (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene; Made of polyamide resin such as nylon 6, nylon 6,6 Base material: Base material made of vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polyacryl Base material made of acrylic resin such as butyl; Base material made of polystyrene; Base material made of polycarbonate (PC); Base material made of polyarylate; Base material made of polyimide; Fine paper, thin paper, glassine paper, sulfate paper, etc. A substrate made of paper is used.

 The IC chip 14 is not particularly limited, and information can be written and read out in a non-contact state via the antenna 15. A non-contact IC tag, a non-contact IC label, or a non-contact IC card can be used. Anything can be used as long as it is applicable to RFID media.

 The antenna 15 is formed on one surface 13a of the base material 13 using a polymer type conductive ink in a predetermined pattern by a printing method such as screen printing or ink jet printing, or by etching the conductive foil. It is made by metal plating.

 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 15 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric current path of the coating film forming the antenna 15 is formed when the conductive fine particles constituting the coating film contact each other, and the resistance value of the coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.

 The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone, or a conductive resin fine particle in a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester and isocyanate). 60% by mass or more and a polyester resin of 10% by mass or more, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), heat Polyester resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinked type or A cross-linking / thermoplastic combination type is preferably used.

Examples of the conductive foil forming the antenna 15 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 15 include copper plating, silver plating, gold plating, and platinum plating.

In this non-contact type data receiving / transmitting body 10, since one surface 11 a of the inlet 11 is directly covered with a coating material 12 made of a two-component curable urethane adhesive, the coating material 12 constitutes the inlet 11. Since it is formed following the uneven shape caused by the IC chip 14 and the antenna 15 to be formed, it has excellent adhesion between the inlet 11 and the covering material 12 and prevents peeling at the interface between the inlet 11 and the covering material 12. Can do. Therefore, the non-contact type data receiving / transmitting body 10 is thin and excellent in flexibility while imparting heat resistance and weather resistance to the inlet 11.
In addition, the non-contact type data receiving / transmitting body 10 has a tack property (property that can be temporarily fixed) by the one surface 10c of the non-contact type data receiving / transmitting body 10 made of a two-component curable urethane adhesive. Therefore, it can be attached to an object without using an adhesive material or a bolt in an application intended for short-term use without using it for a long period of time. That is, the non-contact type data receiving / transmitting body 10 is preferably used in an application that needs to be replaced periodically or frequently.

 Furthermore, since the non-contact type data receiving / transmitting body 10 has a simple configuration in which the one surface 11a of the inlet 11 is directly covered with the covering material 12, it can be easily manufactured.

In addition, in this embodiment, although the case where the non-contact type | mold data transmission / reception body 10 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 11 which has the antenna 15 which consists of a dipole antenna comprised from a pair of planar radiation elements 16 and 17 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 2-7, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 3, a long base material 13A and one surface 13a thereof are provided with a large number of RFID antennas 15 and IC chips 14 communicating through the antenna 15 at equal intervals. The case where the above-mentioned non-contact type data receiving / transmitting body 10 is continuously manufactured using the inlet sheet 22 will be exemplified.

 First, as shown in FIG. 2, the adhesive is applied to the central portion of one surface 21 a of the long release substrate 21 being conveyed in the direction of the arrow in the drawing along the conveyance direction of the release substrate 21. The adhesive 12A discharged from the nozzle 31 of the apparatus is applied linearly (step A).

As adhesive 12A, the thing similar to the adhesive which forms said coating | covering material 12 is used.
Further, the width for applying the adhesive 12A to the one surface 21a of the release substrate 21, that is, the amount of the adhesive 12A applied to the one surface 21a of the release substrate 21 is not particularly limited. Appropriate adjustments are made according to the size and number of IC chips 14 and antennas 15 provided on the inlet sheet 22 to be coated and the thickness required for the covering material 12 formed by curing the adhesive 12A. Is done.

As the release substrate 21, a release film or release paper is used.
As the release film, one of the base films having a thickness of 30 μm to 160 μm made of plastic such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene naphthalate (PEN), polypropylene (PP), polyethylene (PE), etc. The surface and / or the other surface is provided with a release layer made of silicon and having a thickness of 1 μm to 50 μm. That is, one surface 21a of the peeling substrate 21 is composed of a peeling layer made of silicon.
Specific examples of such a release film include Tosero separator SP-PET-01-BU (trade name) manufactured by Tosero Co., Ltd.

As the release paper, a sealing agent is applied to one surface and / or the other surface of a 30 μm to 160 μm thick substrate made of glassine paper or fine paper, and on the layer made of the sealing agent, What provided the peeling layer with a thickness of 1 μm to 50 μm made of silicon is used. That is, one surface 21a of the peeling substrate 21 is composed of a peeling layer made of silicon.
Specific examples of such release paper include, for example, L11C (trade name) manufactured by Oji Tac Co., Ltd.

 The peeling force of the peeling substrate 21 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the release substrate 21, the adhesive is formed on the release layer (not shown) forming one surface 21a of the release substrate 21. Apply 12A.

 Next, as shown in FIG. 3, the inlet sheet 22 conveyed in the direction of the arrow in the figure is the portion of the peeling substrate 21 that is opposed to the pair of rollers 32 and 33 that rotate in the direction of the arrow in the figure. While superposing on the one surface 21a of the peeling base material 21 conveyed in the direction of the arrow in the figure through the adhesive 12A applied to the one surface 21a, the peeling base material 21 and the inlet sheet 22 are placed on the roller 32. , 33, as shown in FIG. 4, the adhesive 12A applied to one surface 21a of the peeling substrate 21 is spread over almost the entire area between the peeling substrate 21 and the inlet sheet 22 (step B). ).

 In this step B, one surface 13a of the substrate 13A, that is, the surface of the inlet sheet 22 on which the IC chip 14 and the antenna 15 are provided (hereinafter referred to as “one surface”) The inlet sheet 22 is overlaid on the one surface 21a of the peeling substrate 21 so that 22a faces each other.

 In Step B, as described above, the adhesive 12A made of a two-component curable urethane adhesive that is cured by the reaction of the main agent and the curing agent without applying external conditions is used. Therefore, the adhesive 12A has fluidity until it is spread between the release substrate 21 and the inlet sheet 22, but gradually loses fluidity as the reaction proceeds, and finally Harden. As a result, the one surface 22a of the inlet sheet 22 and the IC chip 14 and the antenna 15 provided on the one surface 22a are covered with the adhesive 12A, and on the one surface 21a of the peeling substrate 21. The inlet sheet 22 is temporarily fixed. When the adhesive 12A is cured, the coating material 12 is obtained.

 Further, in step B, the thickness of the adhesive 12A after being developed between the peeling base material 21 and the inlet sheet 22 is at least uneven by the IC chip 14 and the antenna 15 of the inlet sheet 22. The IC chip 14 and the antenna 15 are not damaged on the surface 12c opposite to the surface in contact with the inlet sheet 22 and are not damaged by an external impact, for example, within a range of 10 μm to 2000 mm. .

In Step B, the force for sandwiching the release substrate 21 and the inlet sheet 22 between the pair of rollers 32 and 33, that is, the force (pressure) for pressing the inlet sheet 22 in the thickness direction against the release substrate 21 is is not particularly limited, the thickness or size of the release substrate 21 and the inlet sheet 22, depending on the amount of adhesive applied 12A, it is preferable that it is appropriately ^adjusted, it is 1kg / cm ² ~20kg / cm 2 , more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step B, the IC chip 14 and the antenna 15 are completely covered with the adhesive 12A, and the adhesive 12A is filled between the release substrate 21 and the inlet sheet 22 with almost no gap.

Next, as shown in FIG. 5, the laminated body composed of the peeling base material 21, the adhesive 12 </ b> A and the inlet sheet 22 is formed in the thickness direction thereof (in the dashed line in FIG. 5) by a cutting blade (not shown) of the cutting device. Along with this, the laminate is cut according to the shape of the antenna 15, and the laminate is separated into pieces as shown in FIG. 6 (step F).
Here, cutting the laminated body according to the shape of the antenna 15 means cutting the laminated body according to the shape of the target non-contact type data receiving / transmitting body 10 without damaging the antenna 15.

 Next, after the adhesive 12A is completely cured to become the covering material 12, as shown in FIG. 7, the release substrate 21 is peeled from the above laminate (step C), and the non-shown in FIG. The contact type data receiving / transmitting body 10 is obtained.

 According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, since the adhesive 12A and the inlet sheet 22 are laminated and integrated on the peeling base material 21 having the peeling layer, a laminated body is formed. After the adhesive 12 </ b> A is cured, the non-contact type data receiving / transmitting body 10 in which the one surface 11 a of the inlet 11 is directly covered with the covering material 12 can be obtained by peeling off the peeling base material 21. Therefore, unlike the conventional case, it is not necessary to store the inlet in a resin casing and seal it with a sealing member made of the same material as the casing, or mold the inlet with resin. The contactless data receiving / transmitting body 10 can be easily manufactured. Further, since a member other than the adhesive 12A is not required to cover one surface of the inlet sheet 22, the contactless data receiving / transmitting body 10 having a very thin thickness can be manufactured. The manufacturing cost of the contact-type data receiving / transmitting body 10 can be reduced.

 In addition, in this embodiment, although the case where the above-mentioned non-contact type | mold data receiving / transmitting body 10 is manufactured continuously using the elongate peeling base material 21 and the inlet sheet 22, this invention is shown to this. It is not limited. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 Moreover, in this embodiment, although the case where the process F was performed after the process B was illustrated, this invention is not limited to this. In the present invention, when using an inlet that has been separated into pieces in advance, the process C is performed after the process B, and the process F may not be performed.

 Further, in this embodiment, after step B, the laminate composed of the peeling substrate 21, the adhesive 12A and the inlet sheet 22 is cut according to the shape of the antenna 15 and the cut laminate. Although the case where the process C which peels the peeling base material 21 was performed in this order was illustrated, this invention is not limited to this. In the present invention, after step B, step F and step C may be performed in any order. That is, in this invention, after peeling a peeling base material from the laminated body which consists of a peeling base material, an adhesive agent, and an inlet sheet in process C, the laminated body which consists of an adhesive agent and an inlet sheet in process F May be cut according to the shape of the antenna.

(2) Second Embodiment “Non-contact Data Receiver / Transmitter”
FIG. 8 is a schematic cross-sectional view showing a second embodiment of the contactless data receiving / transmitting body of the present invention.
The non-contact type data transmitting / receiving body 50 of this embodiment includes an inlet 51 having a substantially rectangular shape in plan view, a first covering member 53 that covers one surface 51a of the inlet 51, and the other surface 51b of the inlet 51. A second covering material 54 to be covered is schematically configured.
The first covering material 53 and the second covering material 54 may be collectively referred to as a covering material 52.
That is, in the non-contact type data receiving / transmitting body 50, both surfaces (one surface 51a and the other surface 51b) of the inlet 51 are directly covered with the covering material 52, and the first covering material 53, the inlet 51, and the The two coating | covering materials 54 have comprised the structure laminated | stacked in this order in the thickness direction. Thereby, the non-contact type data transmitting / receiving body 50 has a substantially rectangular shape in plan view.

The inlet 51 is generally configured by a base 55 and an IC chip 56 and an antenna 57 which are provided on one surface 55a of the base 55 and are electrically connected to each other.
The antenna 57 is a dipole antenna composed of a pair of planar radiating elements 58 and 59 made of various conductors, facing each other and having feeding points (portions connected to the IC chip 56) on the facing sides. is there.
The length in the longitudinal direction of the antenna 57 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 58 and 59 is a length corresponding to a quarter wavelength.

One surface 51 a of the inlet 51 corresponds to one surface 55 a of the base material 55, and the other surface 51 b of the inlet 51 corresponds to the other surface 55 b of the base material 55.
Therefore, the IC chip 56 and the antenna 57 are covered with the first covering member 53 on the one surface 51 a of the inlet 51.

 Then, on the four side surfaces of the non-contact type data receiving / transmitting body 50, the end surface of the first covering material 53, the end surface of the base material 55, and the end surface of the second covering material 54 form the same surface. More specifically, for example, on the side surface 50a of the non-contact type data transmitting / receiving body 50, the end surface 53a of the first covering material 53, the end surface 55c of the base material 55, and the end surface 54a of the second covering material 54 are provided. They are on the same plane. Similarly, the end surface 53b of the first covering material 53, the end surface 55d of the base material 55, and the end surface 54b of the second covering material 54 are the same surface on the side surface 50b of the non-contact type data receiving / transmitting body 50. ing.

The thickness of the first covering material 53 is not particularly limited, but at least unevenness caused by the IC chip 56 and the antenna 57 of the inlet 51 appears on one surface (outer surface) 50 c of the non-contact type data receiving / transmitting body 50. And the inlet 51 is not damaged by an external impact, for example, in the range of 10 μm to 2000 mm.
The thickness of the second covering material 54 is not particularly limited, but is such that the inlet 51 is not damaged by an external impact, for example, in the range of 10 μm to 2000 mm.

 Furthermore, when the non-contact type data receiving / transmitting body 50 has sufficient flexibility (flexibility) and the non-contact type data receiving / transmitting body 50 is bent, the first covering material 53 is formed with respect to the inlet 51. In order to prevent the stress caused by the difference in thickness between the first covering material 54 and the second covering material 54, the thickness of the first covering material 53 is preferably equal to the thickness of the second covering material 54.

 The covering material 52 (the first covering material 53 and the second covering material 54) is in a liquid state before use, and the main agent and the curing agent can be used without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. It consists of a two-component curable urethane adhesive that cures by reaction.

 As the two-component curable urethane adhesive, the same one as in the first embodiment described above is used.

 As the base material 55, the IC chip 56, and the antenna 57, those similar to those in the first embodiment described above are used.

In this non-contact type data receiving / transmitting body 50, one surface 51a and the other surface 51b of the inlet 51 are directly covered with a covering material 52 made of a two-component curable urethane adhesive. Is formed following the uneven shape caused by the IC chip 56 and the antenna 57 constituting the inlet 51, and therefore, the adhesiveness between the inlet 51 and the covering material 52 is excellent, and peeling occurs at the interface between the inlet 51 and the covering material 52. Can be prevented. Therefore, the non-contact type data receiving / transmitting body 50 is thin and excellent in flexibility while imparting heat resistance and weather resistance to the inlet 51.
Further, the non-contact type data receiving / transmitting body 50 has a tack property (temporary) by the covering material 52 made of a two-component curable urethane adhesive on one surface 50c and the other surface 50d of the non-contact type data receiving / transmitting body 50. It can be attached to objects without using adhesives or bolts in applications intended for short-term use. . That is, the non-contact type data receiving / transmitting body 50 is preferably used in an application that needs to be replaced regularly or frequently.

 Furthermore, the non-contact type data receiving / transmitting body 50 can be easily manufactured because the one surface 51a and the other surface 51b of the inlet 51 are directly covered with the covering material 52. it can.

In addition, in this embodiment, although the case where the non-contact-type data transmission / reception body 50 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 51 which has the antenna 57 which consists of a dipole antenna comprised from a pair of planar radiation elements 58 and 59 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 9-16, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 10, a long base plate 55A and a long surface 55a provided with a large number of RFID antennas 57 and IC chips 56 communicating through the antenna 57 at equal intervals. The case where the above-mentioned non-contact type data receiving / transmitting body 50 is manufactured continuously using the inlet sheet 62 will be exemplified.

 First, as shown in FIG. 9, in the center of one surface 61 a of the long first peeling substrate 61 being conveyed in the direction of the arrow in the drawing, in the conveying direction of the first peeling substrate 61. Along with this, the first adhesive 53A discharged from the nozzle 71 of the adhesive application device is applied linearly (step A).

As the first adhesive 53A, the same adhesive as that used to form the covering material 52 is used.
Further, the width for applying the first adhesive 53A to the one surface 61a of the first release substrate 61, that is, the amount of the first adhesive 53A applied to the one surface 61a of the first release substrate 61. Although there is no particular limitation, the size and number of IC chips 56 and antennas 57 provided on the inlet sheet 62 and the first adhesive 53A, which are covered with the first adhesive 53A, are cured. According to the thickness etc. which are required for the first covering material 53 to be adjusted, it is appropriately adjusted.

As the 1st peeling base material 61, the thing similar to the peeling base material of the above-mentioned 1st embodiment is used.
The peeling force of the first peeling substrate 61 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the above-described release film or release paper is used as the first release substrate 61, a release layer (not shown) that forms one surface 61a of the first release substrate 61. The first adhesive 53A is applied on the top.

 Next, as shown in FIG. 10, the inlet sheet 62 conveyed in the direction of the arrow in the figure is the first release group at the opposing portion of the pair of rollers 72 and 73 that rotate in the direction of the arrow in the figure. A first adhesive 53A applied to one surface 61a of the material 61 is superposed on one surface 61a of the first release substrate 61 being conveyed in the direction of the arrow in the drawing, and the first As shown in FIG. 11, the first release substrate 61 and the inlet sheet 62 are sandwiched between the first release substrate 61 and the inlet sheet 62 as shown in FIG. The first adhesive 53A applied to one surface 61a of 61 is developed (step B).

 In this step B, one surface 61a of the first peeling substrate 61 is provided on one surface 55a of the substrate 55A, that is, the surface on which the IC chip 56 and the antenna 57 in the inlet sheet 62 are provided (hereinafter referred to as “one side”). The inlet sheet 62 is superposed on one surface 61a of the first release substrate 61 so that the surfaces 62a face each other.

 Further, in the process B, as described above, the first adhesive 53A made of a two-component curable urethane adhesive that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the first adhesive 53A has fluidity until it is developed between the first release substrate 61 and the inlet sheet 62. However, as the reaction proceeds, the fluidity gradually increases. It disappears and eventually hardens. As a result, the one surface 62a of the inlet sheet 62 and the IC chip 56 and the antenna 57 provided on the one surface 62a are covered with the first adhesive 53A, and the first peeling substrate 61 An inlet sheet 62 is temporarily fixed on one surface 61a. When the first adhesive 53A is cured, the first covering material 53 is obtained.

 In Step B, the thickness of the first adhesive 53A after being developed between the first release substrate 61 and the inlet sheet 62 is caused by at least the IC chip 56 and the antenna 57 of the inlet sheet 62. The degree of unevenness does not appear on the surface 53c opposite to the surface in contact with the inlet sheet 62 of the first adhesive 53A, and the IC chip 56 and the antenna 57 are not damaged by an external impact. The range is 10 μm to 2000 mm.

Further, in step B, a force for sandwiching the first release substrate 61 and the inlet sheet 62 between the pair of rollers 72 and 73, that is, pressing the inlet sheet 62 against the first release substrate 61 in the thickness direction. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the first release substrate 61 and the inlet sheet 62, the application amount of the first adhesive 53A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step B, the IC chip 56 and the antenna 57 are completely covered by the first adhesive 53A, and the first adhesive 53A is almost completely spaced between the first peeling base 61 and the inlet sheet 62. Filled.

 Next, as shown in FIG. 12, while transporting the laminated body α composed of the first peeling substrate 61 and the inlet sheet 62 in the direction of the arrow in the figure, the side opposite to the one surface 62 a of the inlet sheet 62. A surface (hereinafter referred to as “the other surface”) 62b, that is, a central portion of the other surface 55b of the base material 55A is discharged from the nozzle 74 of the adhesive application device along the transport direction of the laminate α. The second adhesive 54A is applied linearly (step D).

As the second adhesive 54A, the same adhesive as that used to form the covering material 52 is used.
Further, the width for applying the second adhesive 54A to the other surface 62b of the inlet sheet 62, that is, the amount of the second adhesive 54A applied to the other surface 55b of the base material 55A is not particularly limited. The thickness is appropriately adjusted according to the thickness required for the second covering material 54 formed by curing the second adhesive 54A.

 Next, as shown in FIG. 12, the second peeling substrate 63 conveyed in the direction of the arrow in the drawing is placed at the inlet of the pair of rollers 75 and 76 that rotate in the direction of the arrow in the drawing. The second adhesive 54A applied to the other surface 62b of the sheet 62 is overlaid on the other surface 62b of the inlet sheet 62 constituting the stacked body α conveyed in the direction of the arrow in the drawing, By sandwiching the laminate α and the second release substrate 63 with the rollers 75 and 76, the inlet sheet 62 is spread over almost the entire area between the laminate α and the second release substrate 63 as shown in FIG. 13. The second adhesive 54A applied to the other surface 62b is developed (step E), and the first adhesive 53A and the inlet sheet are interposed between the first release base 61 and the second release base 63. 62 and second adhesive 4A is laminated in this order, to form a laminate β which is integrated.

 As the 2nd peeling base material 63, the thing similar to said 1st peeling base material 61 is used. That is, one surface 63a of the second release substrate 63 is composed of a release layer made of silicon.

 In this step E, since the above-described release film or release paper is used as the second release substrate 63, one surface 63a of the second release substrate 63 is attached to the other surface 62b of the inlet sheet 62. The second release substrate 63 is overlaid on the other surface 62b of the inlet sheet 62 so that the formed release layers (not shown) face each other.

 In Step E, as described above, the second adhesive 54A made of a two-component curable urethane adhesive that is cured by the reaction of the main agent and the curing agent without applying external conditions is used. Therefore, the second adhesive 54A has fluidity until it is developed between the laminate α and the second release substrate 63, but gradually becomes fluid as the reaction proceeds. It disappears and eventually hardens. As a result, the other surface 62b of the inlet sheet 62 is covered with the second adhesive 54A, and the second peeling substrate 63 is temporarily fixed on the laminate α. When the second adhesive 54A is cured, the second covering material 54 is obtained.

  In Step E, the thickness of the second adhesive 54 </ b> A after being developed between the laminate α and the second release substrate 63 is the same as that of the first release substrate 61 in Step B described above. The thickness is the same as the thickness of the first adhesive 53 </ b> A after being spread between the inlet sheets 62, for example, in the range of 10 μm to 1000 mm.

Moreover, in the process E, the force which pinches | interposes the laminated body (alpha) and the 2nd peeling base material 63 with a pair of rollers 75 and 76, ie, presses the 2nd peeling base material 63 to the thickness direction with respect to the inlet sheet 62. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the laminate α and the second release substrate 63, the coating amount of the second adhesive 54A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step E, the second adhesive 54 </ b> A is filled between the laminate α and the second release substrate 63 with almost no gap.

Next, as shown in FIG. 14, the first peeling substrate 61, the first adhesive 53A, the inlet sheet 62, the second adhesive 54A, and the second peeling are performed by a cutting blade (not shown) of the cutting device. The laminate γ made of the base material 63 is cut in the thickness direction (along the alternate long and short dash line in FIG. 14) according to the shape of the antenna 57, and the laminate γ is separated into individual pieces as shown in FIG. (Step F).
Here, cutting the laminate γ according to the shape of the antenna 57 means cutting the antenna 57 according to the shape of the target non-contact type data receiving / transmitting body 50 without damaging the antenna 57.

 Next, after the first adhesive 53A is completely cured to become the first covering material 53, and the second adhesive 54A is completely cured to become the second covering material 54, FIG. As shown, the first peelable substrate 61 and the second peelable substrate 63 are peeled from the laminate γ (step C) to obtain the non-contact type data transmitter / receiver 50 shown in FIG.

 According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, the first adhesive 53A and the inlet sheet are provided between the first release substrate 61 and the second release substrate 63 having the release layer. 62 and the second adhesive 54A are stacked and integrated to form a laminated body β, and therefore, after the first adhesive 53A and the second adhesive 54A are cured, the first peeling substrate 61 and the second adhesive 54A By peeling the second peeling substrate 63, the non-contact type data receiving / transmitting body 50 in which the one surface 51a and the other surface 51b of the inlet 51 are directly covered with the covering material 52 can be obtained. Therefore, unlike the conventional case, it is not necessary to store the inlet in a resin casing and seal it with a sealing member made of the same material as the casing, or mold the inlet with resin. The contactless data receiving / transmitting body 50 can be easily manufactured. Further, since no member other than the first adhesive 53A and the second adhesive 54A is required to cover both surfaces of the inlet sheet 62, the non-contact data receiving / transmitting body 10 having a very thin thickness is manufactured. As a result, the manufacturing cost of the non-contact type data receiving / transmitting body 50 can be reduced.

 In this embodiment, the above-described non-contact type data receiving / transmitting body 50 is continuously manufactured using the long first peeling base 61, the inlet sheet 62, and the second peeling base 63. Although the case is illustrated, the present invention is not limited to this. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 Moreover, in this embodiment, although the case where the process F was performed after the process E was illustrated, this invention is not limited to this. In the present invention, when using an inlet that has been separated into pieces in advance, the process C is performed after the process E, and the process F may not be performed.

 In this embodiment, after step E, a laminate γ composed of the first release substrate 61, the first adhesive 53A, the inlet sheet 62, the second adhesive 54A, and the second release substrate 63 is provided. When the step F is cut in accordance with the shape of the antenna 57, and the step C of peeling the first peeling substrate 61 and the second peeling substrate 63 from the cut laminate γ is performed in this order. However, the present invention is not limited to this. In the present invention, after step E, step F and step C may be performed in random order. That is, in the present invention, in step C, the first release substrate, the first adhesive, the inlet sheet, the second adhesive, and the laminate composed of the second release substrate, In Step F, the laminate made of the first adhesive, the inlet sheet, and the second adhesive is cut according to the shape of the antenna. Also good.

DESCRIPTION OF SYMBOLS 10 ... Non-contact type data transmission / reception body, 11 ... Inlet, 12 ... Coating | covering material, 12A ... Adhesive, 13, 13A ... Base material, 14 ... IC chip, 15 * ..Antenna, 16, 17 ... radiation element, 21 ... peeling substrate, 22 ... inlet sheet, 31 ... nozzle, 32,33 ... roller, 50 ... non-contact data Transmission / reception body, 51... Inlet, 52... Coating material, 53... First coating material, 53 A... First adhesive, 54. Second adhesive, 55, 55A ... substrate, 56 ... IC chip, 57 ... antenna, 58, 59 ... radiating element, 61 ... first release substrate, 62 ... Inlet sheet, 63 ... Second release substrate, 71, 74 ... Nozzle, 72, 73, 75, 6 ... roller.

Claims (1)

Inlet and becomes provided with a covering material covering the surface opposite to the surface on which the IC chip is provided in a plane and said inlet IC chip is provided which definitive to the inlet of the non-contact type data reception and transmission body A manufacturing method comprising:
A step of applying a first adhesive composed of a two-component curable urethane-based adhesive on the release layer forming one surface of the first release substrate;
Said first through said first adhesive applied to the release substrate, an IC chip is superimposed surfaces provided at the inlet on the one surface of the first release substrate, said first by pressing the inlet against the release substrate, between the said first release substrate inlet, a step of developing the first adhesive,
Applying a second adhesive made of a two-component curable urethane-based adhesive to the surface of the inlet opposite to the surface on which the IC chip is provided;
A release layer that forms one surface of the second release substrate on the surface of the inlet opposite to the surface on which the IC chip is provided via the second adhesive applied to the inlet. And by pressing the second release substrate against the inlet, the surface of the inlet opposite to the surface on which the IC chip is provided, and the second release substrate And the step of developing the second adhesive,
The developed first adhesive is cured to have tackiness and becomes the coating material, and the deployed second adhesive is cured to have tackiness and becomes the coating material. And then peeling the first release substrate and the second release substrate,
A method of manufacturing a non-contact type data receiving / transmitting body characterized by comprising:

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