JP5558298B2 - Method for manufacturing contactless data receiving / transmitting body - Google Patents

Description

The present invention, as the information recording medium of the RFID (Radio Frequency IDentification) application, an electromagnetic wave or radio wave receiving information from outside as medium, non-contact type data reception and transmission body in which to send information to the outside In particular, the present invention relates to a method for manufacturing a non-contact type data transmitter / receiver that is excellent in weather resistance, heat resistance, and flexibility.

  An IC tag, which is an example of a non-contact type data transmitting / receiving body, includes an inlet composed of a base material, an antenna provided on one surface thereof and connected to each other, and an information writing / reading When an electromagnetic wave or radio wave is received from the device, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is converted into a signal. Transmitted from the antenna.

In order to make an IC tag excellent in heat resistance, weather resistance and flexibility, various packaged IC tags have been studied.
For example, a sheet-like IC tag is known in which a thin sheet-like circuit portion is sandwiched by a surface base material made of a urethane resin coated with a silicone film via an adhesive, and these are integrated ( For example, see Patent Document 1).

Since such a sheet-like IC tag is molded by resin curing, there is an advantage that it can be manufactured in large quantities at a time. However, when they are overlapped with other similar sheet-like IC tags, they are in close contact with each other, difficult to peel off, and difficult to handle.
Therefore, in order to prevent the sheet-like IC tags from being in close contact with each other, it is sufficient that these IC tags have shapes that do not overlap each other. Thus, as a sheet-like IC tag having a shape that does not overlap each other, for example, an IC tag having a slight twist with the longitudinal direction as a rotation axis is known (for example, Patent Documents). 2).

JP 2005-056362 A JP-A-8-315264

  However, the IC tag known in Patent Document 2 is used by being inserted into a gap in a package that wraps a fixed-shaped object. It was restrained from being caught inside the package and falling out of the gap. That is, the twist applied to the IC tag is not permanent, and when an external force is applied, the IC tag may easily return to a flat state. When the IC tag returns to a flat state as described above, it may be in close contact with other IC tags.

  Moreover, in order to prevent the adhesion between IC tags, a method of providing irregularities on the surface by adding large particles (for example, silica etc.) can be considered, but it consists of a two-component curable urethane adhesive. There is a possibility that the fluidity of the adhesive is deteriorated and the phenomenon that the two liquids are not mixed uniformly when the two liquids are mixed.

  The present invention has been made in view of the above circumstances, and is a non-contact type data receiving / transmitting body that does not adhere to each other and can be easily handled even when overlapped with another sheet-like IC tag, and An object of the present invention is to provide a method for producing the non-contact type data receiving / transmitting body which lowers the adhesion of the contact type data receiving / transmitting body and hardly causes deterioration of fluidity when mixing two liquids.

Method of manufacturing a non-contact type data reception and transmission body of the present invention, the inlet and method for producing a coating material and become comprises a non-contact type data reception and transmission body which covers the surface of at least the IC chip is provided in said inlet The step A of applying an adhesive composed of a two-component curable urethane-based adhesive containing unexpanded thermally expandable microcapsules on the release layer forming one surface of the release substrate; Via the adhesive applied to the release substrate, the surface on which the IC chip in the inlet is provided is superimposed on one surface of the release substrate, and the inlet is pressed against the release substrate. By the step B of developing the adhesive between the release substrate and the inlet, and the surface of the adhesive opposite to the surface in contact with the inlet by the thermally expandable microcapsule A step D of providing the convex portion of the number, have a step C of removing the release substrate, and performing the said step D step C in random order.

Between the process B and the process D, or between the process B and the process C, and further on the surface opposite to the surface on which the IC chip is provided in the inlet, The surface on the opposite side to the surface on which the IC chip is provided in the inlet through the step E of applying an adhesive made of a two-component curable urethane-based adhesive containing a capsule and the adhesive applied to the inlet The surface of the inlet on which the IC chip is provided is formed by stacking the release substrate on the opposite side with the release layer forming one surface facing each other and pressing the release substrate against the inlet. It is preferable to have the process F which expand | deploys the said adhesive agent between the surface on the opposite side, and the said peeling base material .

According to the non-contact type data receiving / transmitting body of the present invention, at least the surface of the inlet provided with the IC chip is coated with a coating material made of a two-component curable urethane-based adhesive containing thermally expandable microcapsules, Since a plurality of convex portions by the thermally expandable microcapsules are provided on the surface opposite to the surface in contact with the inlet of the covering material, even if they are overlapped with other sheet-like IC tags, they are in close contact with each other It is easy to handle.
Further, according to the non-contact type data transmitting / receiving body of the present invention, it is possible to prevent adhesion with other sheet-like IC tags even when the covering material is not completely cured.

  According to the method for producing a non-contact type data transmitting / receiving body of the present invention, an adhesive containing a heat-expandable microcapsule and an inlet are laminated on a release substrate having a release layer, thereby forming an integrated laminate. Therefore, after the adhesive is cured, a non-contact type data receiving / transmitting body including an inlet and a coating material having a convex portion formed of the thermally expandable microcapsule on the surface is peeled off by peeling off the peeling base material. Can be obtained. Therefore, it is not necessary to provide an adhesion prevention layer again after manufacturing the non-contact type data receiving / transmitting body as in the prior art, and the flow during mixing of two liquids of an adhesive made of a two-liquid curable urethane adhesive Since it is difficult to deteriorate the property, it is possible to easily manufacture a contactless data receiving / transmitting body with reduced adhesion. Furthermore, even when the coating material is not completely cured, it is possible to prevent the sheet from contacting with other sheet-like IC tags, so that the productivity of the non-contact type data receiving / transmitting body can be improved.

It is the schematic which shows 1st embodiment of the non-contact-type data transmission / reception body of this invention, (a) is a perspective view, (b) is sectional drawing which follows the AA line of (a). It is a schematic perspective view which shows process A in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process B is shown and it is a schematic sectional drawing in alignment with the AA of FIG. It is a schematic sectional drawing which shows process H in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process H in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 1st embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows 2nd embodiment of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows the process A in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic perspective view which shows process B in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, process B is shown and it is schematic sectional drawing in alignment with the BB line of FIG. It is a schematic perspective view which shows the process E and the process F in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. In 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, the process F is shown and it is a schematic sectional drawing in alignment with CC line of FIG. It is a schematic sectional drawing which shows process H in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process H in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows process C in 2nd embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention.

Embodiments of a non-contact type data receiving / transmitting body and a manufacturing method thereof according to the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment “Non-contact Data Receiver / Transmitter”
1A and 1B are schematic views showing a first embodiment of a non-contact type data receiving / transmitting body of the present invention, wherein FIG. 1A is a perspective view, and FIG. 1B is a cross-sectional view taken along line AA of FIG. It is.
The non-contact type data receiving / transmitting body 10 of this embodiment includes an inlet 11 having a substantially rectangular shape in plan view, a covering material 12 covering one surface 11a of the inlet 11, and a surface in contact with the inlet 11 of the covering material 12. And a plurality of convex portions 41 provided on the opposite surface (hereinafter referred to as “one surface”) 12a.

 That is, the non-contact type data receiving / transmitting body 10 has a structure in which one surface 11a of the inlet 11 is directly covered with the covering material 12, and the covering material 12 and the inlet 11 are laminated in the thickness direction. ing. Thereby, the non-contact type data receiving / transmitting body 10 has a substantially rectangular shape in plan view.

The inlet 11 is generally configured by a base material 13 and an IC chip 14 and an antenna 15 which are provided on one surface 13a of the base material 13 and are electrically connected to each other.
The antenna 15 is a dipole antenna composed of a pair of planar radiating elements 16 and 17 which are made of various conductors, face each other, and have feeding points (portions connected to the IC chip 14) on the opposite sides. is there.
The length in the longitudinal direction of the antenna 15 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 16 and 17 is a length corresponding to a quarter wavelength.

The one surface 11 a of the inlet 11 corresponds to the one surface 13 a of the base material 13.
Therefore, on one surface 11 a of the inlet 11, the IC chip 14 and the antenna 15 are covered with the covering material 12.

 And the end surface of the coating | covering material 12 and the end surface of the base material 13 have comprised the same surface in the four side surfaces of the non-contact-type data transmission / reception body 10. FIG. More specifically, for example, the end surface 12 b of the covering material 12 and the end surface 13 b of the base material 13 are the same surface on the side surface 10 a of the non-contact type data transmitting / receiving body 10. Similarly, the end surface 12c of the covering material 12 and the end surface 13c of the base material 13 are the same surface on the side surface 10b of the non-contact type data transmitting / receiving body 10.

 The thickness of the covering material 12 is not particularly limited, but at least the unevenness caused by the IC chip 14 and the antenna 15 of the inlet 11 does not appear on one surface (outer surface) 10c of the non-contact type data transmitter / receiver 10; And it is a grade which the inlet 11 is not damaged by the impact from the outside, for example, exists in the range of 10 micrometers-2000 micrometers.

 The covering material 12 is in a liquid state before use, and is composed of a two-component mixed urethane adhesive that cures by reaction between the main agent and the curing agent without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. Is.

As a two-component mixed urethane adhesive, a silane coupling agent having an epoxy group is further added to a mixed solution containing an isocyanate as a first solution and a polyol having a hydroxyl group as a second solution as a second solution. The added one is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. Moreover, the compounding quantity of the silane coupling agent which has an epoxy group with respect to the whole quantity of this 2 liquid mixing type urethane type adhesive agent is 0.1 to 2.0 weight%.

Further, as the two-component mixed urethane adhesive, a mixed solution containing an isocyanate as the first solution and a polyol whose hydroxyl group is a primary hydroxyl group as the second solution has an aspect ratio of 10 or more, 100 What added the following inorganic fine particles is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. The blending amount of the inorganic fine particles having an aspect ratio of 10 or more and 100 or less with respect to the total amount of the two-component mixed urethane adhesive is 5% by weight or more and 40% by weight or less.

 Specific examples of such a two-component curable urethane-based adhesive include an adhesive composed of a main agent (trade name: MLT2900, manufactured by Etec) and a curing agent (trade name: G3021-B174, manufactured by Etec). .

 In addition, the adhesive forming the covering material 12 may contain a colorant such as a known inorganic pigment, organic pigment, or dye as necessary. The coating material 12 is colored in an arbitrary color by the colorant.

The covering material 12 has a plurality of convex portions 41 at a predetermined interval on the entire surface of one surface 12a. That is, the plurality of convex portions 41 are irregularly mixed on the one surface 12a. The convex part 41 is due to the thermally expandable microcapsule contained in the two-component curable urethane adhesive.
The heat-expandable microcapsule is formed by encapsulating a volatile solvent such as isobutane, hexane, or heptane in a capsule shell made of a copolymer such as vinylidene chloride or acrylonitrile which is a thermoplastic resin.
The softening temperature of the capsule shell is set in the range of 60 to 90 ° C. By heating the thermally expandable microcapsule at such a temperature, the volatile solvent in the capsule shell is vaporized and expanded, so that the thermally expandable microcapsule expands. The heat-expandable microcapsule expands about 20 times in particle size by heating.

  The average particle diameter of the thermally expandable microcapsule is 1 to 20 μm when not expanded, and 30 to 400 μm when expanded. When the average particle size is too large, the capsule shell is easily ruptured, and when the average particle size is too small, the capsule shell is difficult to expand.

  The thermally expandable microcapsules contained in the two-component curable urethane-based adhesive may be unexpanded ones or may include both unexpanded and already expanded ones.

The content of the thermally expandable microcapsule in the two-component curable urethane-based adhesive is preferably 0.01% by weight to 5% by weight. In the case of 5% by weight or less, the amount of components other than the adhesive in the covering material 12 does not increase excessively, the covering material 12 itself does not become soft, and it is suitable for reducing the tackiness of the covering material 12. Further, when the content is 0.01% by weight or more, the heat-expandable microcapsules are easily exposed on the surface 12a, so that the convex portions 41 are formed, which is suitable for reducing the adhesiveness of the covering material 12.
When the thermally expandable microcapsule is not expanded, the content is more preferably 0.1% by weight to 1% by weight. When the thermally expandable microcapsules include both unexpanded and already expanded, the content is more preferably 0.01% by weight to 1% by weight, and more preferably 0.1% by weight to 0%. It is particularly preferable that the amount be 5% by weight.

  The ratio of each thermally expandable microcapsule to be exposed on the surface 12a is preferably 5% to 95% of the total surface area of one thermally expandable microcapsule, and is preferably 10% to 80%. Is more preferable.

Moreover, it is preferable that the bulk density of the covering material 12 made of a two-component curable urethane-based adhesive containing thermally expandable microcapsules is 1.18 to 1.22 g / cm ³ . In the case of 1.18 g / cm ³ or more, the amount of components other than the adhesive in the covering material 12 does not increase excessively, the covering material 12 itself does not become soft, and it is suitable for alleviating the tackiness of the covering material 12. Further, in the case of 1.22 g / cm ³ or less, since the heat-expandable microcapsule is easily exposed on the surface 12a, the convex portion 41 is formed, which is suitable for reducing the adhesiveness of the covering material 12. .

 As the base material 13, a base material made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE), polypropylene Base material made of polyolefin resin such as (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene; Made of polyamide resin such as nylon 6, nylon 6,6 Base material: Base material made of vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polyacryl Base material made of acrylic resin such as butyl; Base material made of polystyrene; Base material made of polycarbonate (PC); Base material made of polyarylate; Base material made of polyimide; Fine paper, thin paper, glassine paper, sulfate paper, etc. A substrate made of paper is used.

 The IC chip 14 is not particularly limited, and information can be written and read out in a non-contact state via the antenna 15. A non-contact IC tag, a non-contact IC label, or a non-contact IC card can be used. Anything can be used as long as it is applicable to RFID media.

 The antenna 15 is formed on one surface 13a of the base material 13 using a polymer type conductive ink in a predetermined pattern by a printing method such as screen printing or ink jet printing, or by etching the conductive foil. It is made by metal plating.

 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 15 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric current path of the coating film forming the antenna 15 is formed when the conductive fine particles constituting the coating film contact each other, and the resistance value of the coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.

 The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone, or a conductive resin fine particle in a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester and isocyanate). 60% by weight or more and polyester resin 10% by weight or more, that is, solvent volatile type or cross-linked / thermoplastic type (however, thermoplastic type is 50% by weight or more), heat Polyester resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by weight or more of a polyester resin, that is, a crosslinked type or A cross-linking / thermoplastic combination type is preferably used.

Examples of the conductive foil forming the antenna 15 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 15 include copper plating, silver plating, gold plating, and platinum plating.

Since this non-contact type data receiving / transmitting body 10 is provided with a plurality of convex portions 41 on the entire surface of one surface 12a, it does not adhere to each other even if it is overlapped with other sheet-like IC tags. Easy to handle. Therefore, even if a plurality of non-contact data receiving / transmitting bodies 10 are grouped, they are easy to handle without being in close contact with each other.
In particular, the one surface 12a of the non-contact type data transmitting / receiving body 10 has tack property (property that can be temporarily fixed) by the covering material 12 made of a two-component curable urethane adhesive, but the convex portion 41 Therefore, even if they are overlapped with the same type of IC tag, they do not adhere to each other.

 In addition, since one surface 11a of the inlet 11 is directly covered with the covering material 12 made of a two-component curable urethane adhesive, the covering material 12 is based on the IC chip 14 and the antenna 15 constituting the inlet 11. Since it is formed following the concavo-convex shape to be formed, the adhesion between the inlet 11 and the covering material 12 is excellent, and peeling at the interface between the inlet 11 and the covering material 12 can be prevented. Therefore, the non-contact type data receiving / transmitting body 10 is thin and excellent in flexibility while imparting heat resistance and weather resistance to the inlet 11.

 Furthermore, since the non-contact type data receiving / transmitting body 10 has a simple configuration in which the one surface 11a of the inlet 11 is directly covered with the covering material 12, it can be easily manufactured.

In addition, in this embodiment, although the case where the non-contact type | mold data transmission / reception body 10 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 11 which has the antenna 15 which consists of a dipole antenna comprised from a pair of planar radiation elements 16 and 17 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 2-7, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 3, a long base material 13A and one surface 13a thereof are provided with a large number of RFID antennas 15 and IC chips 14 communicating through the antenna 15 at equal intervals. The case where the above-mentioned non-contact type data receiving / transmitting body 10 is continuously manufactured using the inlet sheet 22 will be exemplified.

 First, as shown in FIG. 2, the adhesive is applied to the central portion of one surface 21 a of the long release substrate 21 being conveyed in the direction of the arrow in the drawing along the conveyance direction of the release substrate 21. The adhesive 12A discharged from the nozzle 31 of the apparatus is applied linearly (step A).

As the adhesive 12 </ b> A, the same adhesive as the adhesive containing the thermally expandable microcapsule 20 that forms the covering material 12 is used. As described above, the thermally expandable microcapsule 20 may be unexpanded or a mixture of unexpanded and already expanded. When using a mixture of both, the thermally expandable microcapsule 20 may be heated in advance and a part thereof may be expanded.
Further, the width for applying the adhesive 12A to the one surface 21a of the release substrate 21, that is, the amount of the adhesive 12A applied to the one surface 21a of the release substrate 21 is not particularly limited. Appropriate adjustments are made according to the size and number of IC chips 14 and antennas 15 provided on the inlet sheet 22 to be coated and the thickness required for the covering material 12 formed by curing the adhesive 12A. Is done.

As the release substrate 21, a release film or release paper is used.
As the release film, one of the base films having a thickness of 30 μm to 160 μm made of plastic such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene naphthalate (PEN), polypropylene (PP), polyethylene (PE), etc. The surface and / or the other surface is provided with a release layer made of silicon and having a thickness of 1 μm to 50 μm. That is, one surface 21a of the peeling substrate 21 is composed of a peeling layer made of silicon.
Specific examples of such a release film include Tosero separator SP-PET-01-BU (trade name) manufactured by Tosero Co., Ltd.

As the release paper, a sealing agent is applied to one surface and / or the other surface of a 30 μm to 160 μm thick substrate made of glassine paper or fine paper, and on the layer made of the sealing agent, What provided the peeling layer with a thickness of 1 μm to 50 μm made of silicon is used. That is, one surface 21a of the peeling substrate 21 is composed of a peeling layer made of silicon.
Specific examples of such release paper include, for example, L11C (trade name) manufactured by Oji Tac Co., Ltd.

 The peeling force of the peeling substrate 21 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the release film or release paper is used as the release substrate 21, the adhesive is formed on the release layer (not shown) forming one surface 21a of the release substrate 21. Apply 12A.

 Next, as shown in FIG. 3, the inlet sheet 22 conveyed in the direction of the arrow in the figure is the portion of the peeling substrate 21 that is opposed to the pair of rollers 32 and 33 that rotate in the direction of the arrow in the figure. While superposing on the one surface 21a of the peeling base material 21 conveyed in the direction of the arrow in the figure through the adhesive 12A applied to the one surface 21a, the peeling base material 21 and the inlet sheet 22 are placed on the roller 32. , 33, as shown in FIG. 4, the adhesive 12A applied to one surface 21a of the peeling substrate 21 is spread over almost the entire area between the peeling substrate 21 and the inlet sheet 22 (step B). ).

 In this step B, one surface 13a of the substrate 13A, that is, the surface of the inlet sheet 22 on which the IC chip 14 and the antenna 15 are provided (hereinafter referred to as “one surface”) The inlet sheet 22 is overlaid on the one surface 21a of the peeling substrate 21 so that 22a faces each other.

 In Step B, as described above, the adhesive 12A made of a two-component curable urethane adhesive that is cured by the reaction of the main agent and the curing agent without applying external conditions is used. Therefore, the adhesive 12A has fluidity until it is spread between the release substrate 21 and the inlet sheet 22, but gradually loses fluidity as the reaction proceeds, and finally Harden. As a result, the one surface 22a of the inlet sheet 22 and the IC chip 14 and the antenna 15 provided on the one surface 22a are covered with the adhesive 12A, and on the one surface 21a of the peeling substrate 21. The inlet sheet 22 is temporarily fixed. When the adhesive 12A is cured, the coating material 12 is obtained.

  As described above, the adhesive 12A preferably contains 0.01% by weight to 5% by weight of the heat-expandable microcapsules, which makes it easier for the heat-expandable microcapsules to be exposed on the surface 12a. 41 is formed.

 Further, in step B, the thickness of the adhesive 12A after being developed between the peeling base material 21 and the inlet sheet 22 is at least uneven by the IC chip 14 and the antenna 15 of the inlet sheet 22. The IC chip 14 and the antenna 15 are not damaged on the surface 12c opposite to the surface in contact with the inlet sheet 22 and are not damaged by an external impact, for example, within a range of 10 μm to 2000 μm. .

In Step B, the force for sandwiching the release substrate 21 and the inlet sheet 22 between the pair of rollers 32 and 33, that is, the force (pressure) for pressing the inlet sheet 22 in the thickness direction against the release substrate 21 is is not particularly limited, the thickness or size of the release substrate 21 and the inlet sheet 22, depending on the amount of adhesive applied 12A, it is preferable that it is appropriately ^adjusted, it is 1kg / cm ² ~20kg / cm 2 , more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step B, the IC chip 14 and the antenna 15 are completely covered with the adhesive 12A, and the adhesive 12A is filled between the release substrate 21 and the inlet sheet 22 with almost no gap.

Next, in step D, a plurality of convex portions 41 made of the thermally expandable microcapsule 20 are provided on the entire surface of the one surface 12a. As described above, since the adhesive 12A is made of a two-component curable urethane-based adhesive containing thermally expandable microcapsules, the thermally expandable microcapsules are exposed on the surface 12a, and the convex portions 41 are formed. In step D, the unexpanded thermally expandable microcapsules may be expanded by the reaction heat of the adhesive generated by the reaction between the main agent and the curing agent. Such heat of reaction causes unexpanded thermally expandable microcapsules to expand about 20 times in particle size.

Next, as shown in FIG. 5, the laminated body composed of the peeling base material 21, the adhesive 12 </ b> A and the inlet sheet 22 is formed in the thickness direction thereof (in the dashed line in FIG. 5) by a cutting blade (not shown) of the cutting device. Along) and cutting according to the shape of the antenna 15, and as shown in FIG. 6, the laminate is separated into pieces (step H).
Here, cutting the laminated body according to the shape of the antenna 15 means cutting the laminated body according to the shape of the target non-contact type data receiving / transmitting body 10 without damaging the antenna 15.

 Next, after the adhesive 12A is completely cured to become the covering material 12, as shown in FIG. 7, the release substrate 21 is peeled from the above laminate (step C), and the non-shown in FIG. The contact type data receiving / transmitting body 10 is obtained.

 In addition, in this embodiment, although the case where the process C was performed after the process D was illustrated, this invention is not limited to this. In the present invention, step D and step C may be performed in any order. That is, in the present invention, the process C is performed in an uncured state of the adhesive, the adhesive is then cured in the process D, and the unexpanded thermally expandable microcapsule is expanded by the reaction heat of the adhesive. Also good.

 According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, the adhesive 12A containing the thermally expandable microcapsule 20 and the inlet sheet 22 are laminated and integrated on the release substrate 21 having the release layer. Since the laminated body is formed, after the adhesive 12A is cured, the peeling base material 21 is peeled to have the inlet 11 and the convex portions 41 made of the thermally expandable microcapsules on the entire surface 12a. The non-contact type data receiving / transmitting body 10 including the covering material 12 can be obtained. Therefore, it is not necessary to provide an adhesion prevention layer again after manufacturing the non-contact type data receiving / transmitting body 10 as in the prior art, and when the two-component adhesive of the two-component curable urethane adhesive is mixed. Since the fluidity is hardly deteriorated, the non-contact type data receiving / transmitting body 10 with reduced adhesion can be easily manufactured. Furthermore, even when the covering material 12 is not completely cured, it is possible to prevent the contact with other sheet-like IC tags, so that the productivity of the non-contact type data receiving / transmitting body 10 can be improved. .

 In addition, in this embodiment, although the case where the above-mentioned non-contact type | mold data receiving / transmitting body 10 is manufactured continuously using the elongate peeling base material 21 and the inlet sheet 22, this invention is shown to this. It is not limited. In the present invention, the non-contact type data receiving / transmitting body 10 may be manufactured individually using the inlets 11 that are separated into pieces in advance.

 Moreover, in this embodiment, although the case where the process H was performed was illustrated, this invention is not limited to this. In the present invention, the process H does not have to be performed, for example, when an inlet individually separated is used.

 Further, in this embodiment, after step B, the laminate composed of the peeling substrate 21, the adhesive 12A, and the inlet sheet 22 is cut according to the shape of the antenna 15 and the cut laminate. Although the case where the process C which peels the peeling base material 21 was performed in this order was illustrated, this invention is not limited to this. In the present invention, after step B, step H and step C may be performed in any order. That is, in this invention, after peeling a peeling base material from the laminated body which consists of a peeling base material, an adhesive agent, and an inlet sheet in process C, in step H, the laminated body which consists of an adhesive agent and an inlet sheet May be cut according to the shape of the antenna.

(2) Second Embodiment “Non-contact Data Receiver / Transmitter”
FIG. 8 is a schematic cross-sectional view showing a second embodiment of the contactless data receiving / transmitting body of the present invention.
The non-contact type data transmitting / receiving body 50 of this embodiment is provided on an inlet 51 having a substantially rectangular shape in plan view, a first covering material 53 that covers one surface 51a of the inlet 51, and one surface 53c. A plurality of convex portions 81, a second covering material 54 that covers the other surface 51 b of the inlet 51, and a plurality of convex portions 81 provided on one surface 54 c are schematically configured.
The first covering material 53 and the second covering material 54 may be collectively referred to as a covering material 52.
That is, in the non-contact type data receiving / transmitting body 50, both surfaces (one surface 51a and the other surface 51b) of the inlet 51 are directly covered with the covering material 52, and the first covering material 53, the inlet 51, and the The two coating | covering materials 54 have comprised the structure laminated | stacked in this order in the thickness direction. Thereby, the non-contact type data transmitting / receiving body 50 has a substantially rectangular shape in plan view.

The inlet 51 is generally configured by a base 55 and an IC chip 56 and an antenna 57 which are provided on one surface 55a of the base 55 and are electrically connected to each other.
The antenna 57 is a dipole antenna composed of a pair of planar radiating elements 58 and 59 made of various conductors, facing each other and having feeding points (portions connected to the IC chip 56) on the facing sides. is there.
The length in the longitudinal direction of the antenna 57 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 58 and 59 is a length corresponding to a quarter wavelength.

One surface 51 a of the inlet 51 corresponds to one surface 55 a of the base material 55, and the other surface 51 b of the inlet 51 corresponds to the other surface 55 b of the base material 55.
Therefore, the IC chip 56 and the antenna 57 are covered with the first covering member 53 on the one surface 51 a of the inlet 51.

 Then, on the four side surfaces of the non-contact type data receiving / transmitting body 50, the end surface of the first covering material 53, the end surface of the base material 55, and the end surface of the second covering material 54 form the same surface. More specifically, for example, on the side surface 50a of the non-contact type data transmitting / receiving body 50, the end surface 53a of the first covering material 53, the end surface 55c of the base material 55, and the end surface 54a of the second covering material 54 are provided. They are on the same plane. Similarly, the end surface 53b of the first covering material 53, the end surface 55d of the base material 55, and the end surface 54b of the second covering material 54 are the same surface on the side surface 50b of the non-contact type data receiving / transmitting body 50. ing.

The thickness of the first covering material 53 is not particularly limited, but at least unevenness caused by the IC chip 56 and the antenna 57 of the inlet 51 appears on one surface (outer surface) 50 c of the non-contact type data receiving / transmitting body 50. And the inlet 51 is not damaged by an external impact, for example, in the range of 10 μm to 2000 μm.
The thickness of the second covering material 54 is not particularly limited, but is such that the inlet 51 is not damaged by an external impact, and is, for example, in the range of 10 μm to 2000 μm.

 Furthermore, when the non-contact type data receiving / transmitting body 50 has sufficient flexibility (flexibility) and the non-contact type data receiving / transmitting body 50 is bent, the first covering material 53 is formed with respect to the inlet 51. In order to prevent the stress caused by the difference in thickness between the first covering material 54 and the second covering material 54, the thickness of the first covering material 53 is preferably equal to the thickness of the second covering material 54.

 The covering material 52 (the first covering material 53 and the second covering material 54) is in a liquid state before use, and the main agent and the curing agent can be used without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. It consists of a two-component curable urethane adhesive that cures by reaction.

 As the two-component curable urethane adhesive, the same one as in the first embodiment described above is used.

The covering material 52 has a plurality of convex portions 81 at predetermined intervals on the entire surface of the one surface 53c and the one surface 54c. That is, the plurality of convex portions 81 are irregularly mixed on the one surface 53c and the one surface 54c. The convex part 81 is due to the thermally expandable microcapsule 60 contained in the two-component curable urethane adhesive.
As the thermally expandable microcapsule 60, the same one as in the first embodiment described above is used. The average particle diameter of the thermally expandable microcapsule is 1 to 20 μm when not expanded, and 30 to 400 μm when expanded. When the average particle size is too large, the capsule shell is easily ruptured, and when the average particle size is too small, the capsule shell is difficult to expand.
Further, the ratio of the thermally expandable microcapsules to be exposed on the one surface 53c and the one surface 54c is preferably 5% to 95% of the total surface area of one thermally expandable microcapsule. It is more preferable that it is% -80%.

 As the base material 55, the IC chip 56, and the antenna 57, those similar to those in the first embodiment described above are used.

Since the non-contact type data receiving / transmitting body 50 is provided with a plurality of convex portions 81 on the entire surface of the one surface 53c and the one surface 54c, even if they are overlapped with other sheet-like IC tags, they are in close contact with each other. It is easy to handle. Therefore, even if a plurality of non-contact data receiving / transmitting bodies 50 are grouped together, they are easy to handle without being in close contact with each other.
In particular, the one surface 53c and the one surface 54c of the non-contact type data transmitting / receiving body 50 have tackiness (property that can be temporarily fixed) by the covering material 52 made of a two-component curable urethane adhesive. However, due to the presence of the convex portions 81, they do not adhere to each other even if they are overlapped with the same type of IC tag.

 Further, this non-contact type data receiving / transmitting body 50 is directly covered with a covering material 52 made of a two-component curable urethane-based adhesive on one surface 51a and the other surface 51b of the inlet 51. Since the material 52 is formed following the uneven shape caused by the IC chip 56 and the antenna 57 constituting the inlet 51, the adhesion between the inlet 51 and the covering material 52 is excellent, and at the interface between the inlet 51 and the covering material 52. Peeling can be prevented. Therefore, the non-contact type data receiving / transmitting body 50 is thin and excellent in flexibility while imparting heat resistance and weather resistance to the inlet 51.

 Furthermore, the non-contact type data receiving / transmitting body 50 can be easily manufactured because the one surface 51a and the other surface 51b of the inlet 51 are directly covered with the covering material 52. it can.

In addition, in this embodiment, although the case where the non-contact-type data transmission / reception body 50 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 51 which has the antenna 57 which consists of a dipole antenna comprised from a pair of planar radiation elements 58 and 59 was provided, this invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 9-16, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, as shown in FIG. 10, a long base plate 55A and a long surface 55a provided with a large number of RFID antennas 57 and IC chips 56 communicating through the antenna 57 at equal intervals. The case where the above-mentioned non-contact type data receiving / transmitting body 50 is manufactured continuously using the inlet sheet 62 will be exemplified.

 First, as shown in FIG. 9, in the center of one surface 61 a of the long first peeling substrate 61 being conveyed in the direction of the arrow in the drawing, in the conveying direction of the first peeling substrate 61. Along with this, the first adhesive 53A discharged from the nozzle 71 of the adhesive application device is applied linearly (step A).

As the first adhesive 53A, the same adhesive as the adhesive containing the heat-expandable microcapsule 60 that forms the covering material 52 is used. The thermally expandable microcapsule 60 may be unexpanded or a mixture of unexpanded and already expanded. When using a mixture of both, the thermally expandable microcapsule 60 may be heated in advance and a part thereof may be expanded.
Further, the width for applying the first adhesive 53A to the one surface 61a of the first release substrate 61, that is, the amount of the first adhesive 53A applied to the one surface 61a of the first release substrate 61. Although there is no particular limitation, the size and number of IC chips 56 and antennas 57 provided on the inlet sheet 62 and the first adhesive 53A, which are covered with the first adhesive 53A, are cured. According to the thickness etc. which are required for the first covering material 53 to be adjusted, it is appropriately adjusted.

As the 1st peeling base material 61, the thing similar to the peeling base material of the above-mentioned 1st embodiment is used.
The peeling force of the first peeling substrate 61 is 0.05 to 1.0 N / 50 mm.

 Thus, in the process A, since the above-described release film or release paper is used as the first release substrate 61, a release layer (not shown) that forms one surface 61a of the first release substrate 61. The first adhesive 53A is applied on the top.

 Next, as shown in FIG. 10, the inlet sheet 62 conveyed in the direction of the arrow in the figure is the first release group at the opposing portion of the pair of rollers 72 and 73 that rotate in the direction of the arrow in the figure. A first adhesive 53A applied to one surface 61a of the material 61 is superposed on one surface 61a of the first release substrate 61 being conveyed in the direction of the arrow in the drawing, and the first As shown in FIG. 11, the first release substrate 61 and the inlet sheet 62 are sandwiched between the first release substrate 61 and the inlet sheet 62 as shown in FIG. The first adhesive 53A applied to one surface 61a of 61 is developed (step B).

 In this step B, one surface 61a of the first peeling substrate 61 is provided on one surface 55a of the substrate 55A, that is, the surface on which the IC chip 56 and the antenna 57 in the inlet sheet 62 are provided (hereinafter referred to as “one side”). The inlet sheet 62 is superposed on one surface 61a of the first release substrate 61 so that the surfaces 62a face each other.

 Further, in the process B, as described above, the first adhesive 53A made of a two-component curable urethane adhesive that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the first adhesive 53A has fluidity until it is developed between the first release substrate 61 and the inlet sheet 62. However, as the reaction proceeds, the fluidity gradually increases. It disappears and eventually hardens. As a result, the one surface 62a of the inlet sheet 62 and the IC chip 56 and the antenna 57 provided on the one surface 62a are covered with the first adhesive 53A, and the first peeling substrate 61 An inlet sheet 62 is temporarily fixed on one surface 61a. When the first adhesive 53A is cured, the first covering material 53 is obtained.

 In Step B, the thickness of the first adhesive 53A after being developed between the first release substrate 61 and the inlet sheet 62 is caused by at least the IC chip 56 and the antenna 57 of the inlet sheet 62. The degree of unevenness does not appear on the surface 53c opposite to the surface in contact with the inlet sheet 62 of the first adhesive 53A, and the IC chip 56 and the antenna 57 are not damaged by an external impact. The range is 10 μm to 2000 μm.

Further, in step B, a force for sandwiching the first release substrate 61 and the inlet sheet 62 between the pair of rollers 72 and 73, that is, pressing the inlet sheet 62 against the first release substrate 61 in the thickness direction. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the first release substrate 61 and the inlet sheet 62, the application amount of the first adhesive 53A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step B, the IC chip 56 and the antenna 57 are completely covered by the first adhesive 53A, and the first adhesive 53A is almost completely spaced between the first peeling base 61 and the inlet sheet 62. Filled.

 Next, as shown in FIG. 12, while transporting the laminated body α composed of the first peeling substrate 61 and the inlet sheet 62 in the direction of the arrow in the figure, the side opposite to the one surface 62 a of the inlet sheet 62. A surface (hereinafter referred to as “the other surface”) 62b, that is, a central portion of the other surface 55b of the base material 55A is discharged from the nozzle 74 of the adhesive application device along the transport direction of the laminate α. The second adhesive 54A is applied linearly (step E).

As the second adhesive 54 </ b> A, the same adhesive as the adhesive containing the heat-expandable microcapsule 60 that forms the covering material 52 is used.
Further, the width for applying the second adhesive 54A to the other surface 62b of the inlet sheet 62, that is, the amount of the second adhesive 54A applied to the other surface 55b of the base material 55A is not particularly limited. The thickness is appropriately adjusted according to the thickness required for the second covering material 54 formed by curing the second adhesive 54A.

 Next, as shown in FIG. 12, the second peeling substrate 63 conveyed in the direction of the arrow in the drawing is placed at the inlet of the pair of rollers 75 and 76 that rotate in the direction of the arrow in the drawing. The second adhesive 54A applied to the other surface 62b of the sheet 62 is overlaid on the other surface 62b of the inlet sheet 62 constituting the stacked body α conveyed in the direction of the arrow in the drawing, By sandwiching the laminate α and the second release substrate 63 with the rollers 75 and 76, the inlet sheet 62 is spread over almost the entire area between the laminate α and the second release substrate 63 as shown in FIG. 13. The second adhesive 54A applied to the other surface 62b is spread (step F), and a plurality of convex portions 81 are provided by the thermally expandable microcapsules 60 on the entire surface of the one surface 54c (step D). Peeling substrate 61 During the second release substrate 63, the first adhesive 53A, inlet sheet 62 and the second adhesive 54A is laminated in this order, to form a laminate β which is integrated.

 As the 2nd peeling base material 63, the thing similar to said 1st peeling base material 61 is used. That is, one surface 63a of the second release substrate 63 is composed of a release layer made of silicon.

 In this step F, since the above-described release film or release paper is used as the second release substrate 63, one surface 63a of the second release substrate 63 is attached to the other surface 62b of the inlet sheet 62. The second release substrate 63 is overlaid on the other surface 62b of the inlet sheet 62 so that the formed release layers (not shown) face each other.

 Further, in the process F, as described above, the second adhesive 54A made of a two-component curable urethane adhesive that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the second adhesive 54A has fluidity until it is developed between the laminate α and the second release substrate 63, but gradually becomes fluid as the reaction proceeds. It disappears and eventually hardens. As a result, the other surface 62b of the inlet sheet 62 is covered with the second adhesive 54A, and the second peeling substrate 63 is temporarily fixed on the laminate α. When the second adhesive 54A is cured, the second covering material 54 is obtained.

  Moreover, in the process F, the thickness of the second adhesive 54A after being developed between the laminate α and the second release substrate 63 is changed to the first release substrate 61 in the process B described above. The thickness is the same as the thickness of the first adhesive 53A after being spread between the inlet sheets 62, for example, in the range of 10 μm to 1000 μm.

Moreover, in the process F, the force which pinches | interposes the laminated body (alpha) and the 2nd peeling base material 63 with a pair of rollers 75 and 76, ie, presses the 2nd peeling base material 63 to the thickness direction with respect to the inlet sheet 62. The force (pressure) is not particularly limited, and is appropriately adjusted according to the thickness and size of the laminate α and the second release substrate 63, the coating amount of the second adhesive 54A, and the like. is preferably cm ² ~20kg / cm ^2, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this process F, the second adhesive 54 </ b> A is filled between the laminate α and the second release substrate 63 with almost no gap.

Next, in step D, a plurality of convex portions 81 made of the thermally expandable microcapsule 60 are provided on the entire surface of the one surface 53c and the one surface 54c. As described above, since the adhesive 54A is made of a two-component curable urethane-based adhesive containing thermally expandable microcapsules, the thermally expandable microcapsules are exposed on the surface 53c and the surface 54c, and the protrusion 81 Is formed.
In step D, the unexpanded thermally expandable microcapsules may be expanded by the reaction heat of the adhesive generated by the reaction between the main agent and the curing agent. Such heat of reaction causes unexpanded thermally expandable microcapsules to expand about 20 times in particle size.

 In this embodiment, an adhesive containing the heat-expandable microcapsule 60 is used as the second adhesive 54A, and a plurality of convex portions 81 formed by the heat-expandable microcapsule 60 are provided on the entire surface 54c. Although the second covering material 54 is provided, the second covering material 54 that does not have the convex portion 81 may be provided using an adhesive that does not contain the thermally expandable microcapsule 60.

Next, as shown in FIG. 14, the first peeling substrate 61, the first adhesive 53A, the inlet sheet 62, the second adhesive 54A, and the second peeling are performed by a cutting blade (not shown) of the cutting device. The laminate γ made of the base material 63 is cut in the thickness direction (along the alternate long and short dash line in FIG. 14) according to the shape of the antenna 57, and the laminate γ is separated into individual pieces as shown in FIG. (Step H).
Here, cutting the laminate γ according to the shape of the antenna 57 means cutting the antenna 57 according to the shape of the target non-contact type data receiving / transmitting body 50 without damaging the antenna 57.

 Next, after the first adhesive 53A is completely cured to become the first covering material 53, and the second adhesive 54A is completely cured to become the second covering material 54, FIG. As shown, the first peelable substrate 61 and the second peelable substrate 63 are peeled from the laminate γ (step C) to obtain the non-contact type data transmitter / receiver 50 shown in FIG.

  In addition, in this embodiment, although the case where the process C was performed after the process D was illustrated, this invention is not limited to this. In the present invention, step D and step C may be performed in any order. That is, in the present invention, the process C is performed in an uncured state of the adhesive, the adhesive is then cured in the process D, and the unexpanded thermally expandable microcapsule is expanded by the reaction heat of the adhesive. Also good.

 According to the manufacturing method of the non-contact type data transmitting / receiving body of this embodiment, the thermally expandable microcapsule 60 is contained between the first release substrate 61 having the release layer and the second release substrate 63. Since the first adhesive 53A, the inlet sheet 62, and the second adhesive 54A containing the thermally expandable microcapsule 60 are laminated to form an integrated laminate β, the first adhesive 53A and the second adhesive 53A After the adhesive 54 </ b> A is cured, the first release substrate 61 and the second release substrate 63 are peeled off, so that one surface 51 a and the other surface 51 b of the inlet 51 are directly covered with the covering material 52. A non-contact type data receiving / transmitting body 50 can be obtained. Therefore, it is not necessary to provide an adhesion prevention layer again after manufacturing the non-contact type data receiving / transmitting body 50 as in the prior art. Since it is difficult for fluidity to deteriorate, the non-contact type data receiver / transmitter 50 with reduced adhesion can be easily manufactured. Furthermore, even when the covering material 52 is not completely cured, it is possible to prevent contact with other sheet-like IC tags, so that the productivity of the non-contact type data receiving / transmitting body 50 can be improved. .

 In this embodiment, the above-described non-contact type data receiving / transmitting body 50 is continuously manufactured using the long first peeling base 61, the inlet sheet 62, and the second peeling base 63. Although the case is illustrated, the present invention is not limited to this. In the present invention, a non-contact type data receiving / transmitting body may be individually manufactured using an inlet that has been separated into pieces.

 Moreover, in this embodiment, although the case where the process H was performed was illustrated, this invention is not limited to this. In the present invention, the process H does not have to be performed, for example, when an inlet individually separated is used.

 Further, in this embodiment, after step F, a laminate γ composed of the first release substrate 61, the first adhesive 53A, the inlet sheet 62, the second adhesive 54A, and the second release substrate 63 is provided. When the step H is cut in accordance with the shape of the antenna 57, and the step C is performed in this order to peel the first release substrate 61 and the second release substrate 63 from the cut laminate γ. However, the present invention is not limited to this. In the present invention, after step F, step H and step C may be performed in random order. That is, in the present invention, in step C, the first release substrate, the first adhesive, the inlet sheet, the second adhesive, and the laminate composed of the second release substrate, After peeling the release substrate and the second release substrate, in Step H, the laminate composed of the first adhesive, the inlet sheet, and the second adhesive is cut according to the shape of the antenna. Also good.

<Example 1>
Using a two-component curable urethane-based adhesive containing 0.1% by weight of unexpanded microcapsules, both sides of the inlet 51 are coated with a bulk density of 1.36 to 1.42 g / cm ³ as shown in FIG. A non-contact type data receiving / transmitting body 50 (hereinafter referred to as an IC tag) covered with the material 52 was manufactured. The IC tag could be easily produced without causing deterioration of fluidity when mixing two liquids of a two liquid curing type urethane adhesive.

<Example 2>
Using a two-component curable urethane-based adhesive containing 1.0% by weight of unexpanded microcapsules, both sides of the inlet 51 are coated with a bulk density of 1.36 to 1.40 g / cm ³ as shown in FIG. An IC tag coated with the material 52 was manufactured. The IC tag could be easily produced without causing deterioration of fluidity when mixing two liquids of a two liquid curing type urethane adhesive.

<Example 3>
Using a two-component curable urethane adhesive containing 5.0% by weight of unexpanded microcapsules, both sides of the inlet 51 are coated with a bulk density of 1.18 to 1.22 g / cm ³ as shown in FIG. An IC tag coated with the material 52 was manufactured. The IC tag could be easily produced without causing deterioration of fluidity when mixing two liquids of a two liquid curing type urethane adhesive.

<Comparative Example 1>
Using a two-component curable urethane-based adhesive containing 1.0% by weight of already expanded microcapsules, both sides of the inlet 51 are coated with a bulk density of 0.80 to 0.83 g / cm ³ as shown in FIG. When the IC tag coated with the material 52 was manufactured, the fluidity at the time of mixing the two liquids of the two liquid curable urethane adhesive deteriorated, and the two liquids were not mixed uniformly. Furthermore, as a result of an increase in the amount of components other than the adhesive in the covering material 52 due to the low bulk density, the covering material 52 itself becomes soft and the tackiness of the covering material 52 cannot be relaxed.

DESCRIPTION OF SYMBOLS 10 ... Non-contact type data transmission / reception body, 11 ... Inlet, 12 ... Coating | covering material, 12A ... Adhesive, 13, 13A ... Base material, 14 ... IC chip, 15 * .. Antennas 16, 17 ... Radiating elements, 20 ... Thermally expandable microcapsules, 21 ... Release substrate, 22 ... Inlet sheet, 31 ... Nozzle, 32, 33 ... Roller, 41 ... convex part, 50 ... non-contact type data receiving / transmitting body, 51 ... inlet, 52 ... coating material, 53 ... first coating material, 53A ... first 54 ... second coating material, 54A ... second adhesive, 55, 55A ... base material, 56 ... IC chip, 57 ... antenna, 58, 59 .. Radiation element, 60... Thermally expandable microcapsule, 61... First release substrate, 62. Inlet sheet, 63 ... second release substrate, 71 and 74 ... nozzle, 72,73,75,76 ... roller, 81 ... protruding portion.

Claims (2)

A manufacturing method of a non-contact type data receiver / transmitter comprising: an inlet; and a covering material that covers at least a surface of the inlet on which an IC chip is provided,
Step A of applying an adhesive composed of a two-component curable urethane-based adhesive containing unexpanded thermally expandable microcapsules on the release layer forming one surface of the release substrate;
Via the adhesive applied to the release substrate, the surface on which the IC chip in the inlet is provided is superimposed on one surface of the release substrate, and the inlet is pressed against the release substrate. Step B for developing the adhesive between the release substrate and the inlet,
A step D of providing a plurality of convex portions by the thermally expandable microcapsule on the surface opposite to the surface in contact with the inlet of the adhesive;
Step C for peeling the release substrate,
A method of manufacturing a contactless data receiving / transmitting body, wherein the step D and the step C are performed in random order. Between the process B and the process D, or between the process B and the process C,
Furthermore, a step E of applying an adhesive made of a two-component curable urethane-based adhesive containing unexpanded thermally expandable microcapsules on the surface of the inlet opposite to the surface provided with the IC chip;
Via the adhesive applied to the inlet, on the surface of the inlet opposite to the surface on which the IC chip is provided, the release substrate is overlapped with the release layer that forms one surface facing each other, Step F of developing the adhesive between the release substrate and the surface of the inlet opposite to the surface on which the IC chip is provided by pressing the release substrate against the inlet. The method of manufacturing a non-contact type data receiving / transmitting body according to claim 1 , wherein:

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