JP2012068945A - Stack of non-contact type data transmission and reception body and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stack of non-contact type data transmission and reception bodies which are stacked with no pressure-sensitive adhesive layer interposed, and adaptive to a plurality of frequency bands, and a method of manufacturing the same.SOLUTION: A stack 10 of non-contact type data transmission and reception bodies is characterized in that a plurality of non-contact type data transmission and reception bodies 50 each including an inlet 20, a coating material 30 covering both surfaces of the inlet 20, and a peel base material having a surface on the opposite side from a surface, where a peal layer 41 is provided, stuck on one external surface of the coating material 30 are stacked with peel layers 41 interposed.

Description

 The present invention relates to a non-contact type data receiver / receiver that can receive information from the outside using electromagnetic waves or radio waves as a medium, and can transmit information to the outside, such as an information recording medium for RFID (Radio Frequency IDentification). The present invention relates to a laminate and a method for producing the same.

 An IC tag, which is an example of a non-contact type data transmitting / receiving body, includes an inlet composed of a base material, an antenna provided on one surface thereof and connected to each other, and an information writing / reading When an electromagnetic wave or radio wave is received from the device, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is converted into a signal. Transmitted from the antenna.

 As an application of the IC tag, a weak adhesive material layer for removably sticking to an object is provided on one surface of a base material, and the IC tag is provided via this weak adhesive material layer. A stacked body of a plurality of stacked IC tags is known (for example, see Patent Document 1).

JP 2006-231610 A

 The above-mentioned IC tag laminated body peels off one IC tag at a time and attaches the IC tag to an object with a weak adhesive material layer, so that the message contents can be easily and reliably specified. It is to communicate only to. Therefore, since this IC tag is used with the adhesive material layer provided on one surface (sticking surface) of the base material, there is a problem that the application is limited.

 This invention is made | formed in view of the said situation, Comprising: It aims at providing the laminated body of the non-contact-type data transmission / reception body laminated | stacked without interposing an adhesive material layer, and its manufacturing method.

 The laminate of the non-contact type data receiving / transmitting body of the present invention includes an inlet, a covering material that covers both sides of the inlet, and an outer surface of the covering material on a side opposite to a surface on which a release layer is provided. A non-contact type data receiving / transmitting body comprising a release substrate having a surface attached thereto, and a plurality of non-contact type data receiving / transmitting bodies are laminated via the release layer, and the covering material is made of a two-component curable urethane adhesive. It is characterized by that.

 A method for manufacturing a laminate of a non-contact type data transmitting / receiving body according to the present invention includes: an inlet; a covering material that covers both surfaces of the inlet; and a surface on which one of the outer surfaces of the covering material is provided with a release layer A non-contact type data receiving / transmitting body comprising a release substrate having an opposite surface attached thereto, and a plurality of non-contact type data receiving / transmitting bodies laminated through the release layer, and the covering material is a two-component curable urethane adhesive A method for producing a laminate of a non-contact type data receiving / transmitting body made of an agent, wherein the adhesive is made of a two-component curable urethane adhesive on the surface of the release substrate opposite to the surface provided with the release layer. The surface on which the IC chip in the inlet is provided on the release substrate is overlapped with the adhesive applied to the release substrate, and the inlet is applied to the release substrate. By pressing, between the peeling substrate and the inlet Step B for spreading the adhesive, Step C for applying an adhesive made of a two-component curable urethane adhesive to the surface of the inlet opposite to the surface on which the IC chip is provided, and the inlet Through the applied adhesive, the release substrate is superposed on the surface of the inlet opposite to the surface on which the IC chip is provided, with the release layer forming one surface facing each other, and is placed on the inlet. A step D of developing the adhesive between the surface of the inlet opposite to the surface on which the IC chip is provided and the release substrate by pressing the release substrate. And the step A, the step B, the step C and the step D are repeated a plurality of times in this order.

 According to the laminate of the non-contact type data receiving / transmitting body of the present invention, the inlet, the covering material covering both surfaces thereof, and the surface opposite to the surface provided with the release layer on one of the outer surfaces of the covering material Since a plurality of non-contact type data receiving / transmitting bodies comprising a peeling base material to which the non-contact type data is attached are laminated via a peeling layer of the peeling base material, each non-contact type data receiving / transmitting body is peeled off. When used, the non-contact type data receiving / transmitting body can be applied to many uses because there is no adhesive layer on the outer surface.

 According to the method for manufacturing a laminate of a non-contact type data receiving / transmitting body of the present invention, by repeating Step A, Step B, Step C and Step D a plurality of times in this order, through the release layer of the release substrate. A laminated body of non-contact type data receiving / transmitting bodies obtained by stacking a plurality of non-contact type data receiving / transmitting bodies can be manufactured. Therefore, unlike the prior art, there is no need to stack the non-contact type data transmitting / receiving body via the weak adhesive material layer.

It is a schematic sectional drawing which shows one Embodiment of the laminated body of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows one Embodiment of the non-contact type data transmission / reception body which comprises the laminated body of the non-contact type data transmission / reception body of this invention. It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the laminated body of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the laminated body of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the laminated body of the non-contact-type data transmission / reception body of this invention. It is a schematic sectional drawing which shows one Embodiment of the manufacturing method of the laminated body of the non-contact-type data transmission / reception body of this invention.

Embodiments of a non-contact type data receiving / transmitting body laminate and a method of manufacturing the same according to the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

"Laminated body of non-contact type data receiving and transmitting body"
FIG. 1 is a schematic cross-sectional view showing an embodiment of a non-contact type data receiving / transmitting body laminate according to the present invention. FIG. 2 is a schematic cross-sectional view showing an embodiment of a non-contact type data receiving / transmitting body constituting the laminate of the non-contact type data receiving / transmitting body of the present invention.
The laminated body 10 of the contactless data transmitting / receiving body of this embodiment includes an inlet 20 having a substantially rectangular shape in plan view, a first covering material 31 that covers one surface 20a of the inlet 20, and the other of the inlet 20 The second covering material 32 that covers the surface 20b and the surface 31a opposite to the surface that contacts the inlet 20 of the first covering material 31 (hereinafter referred to as "one surface (outer surface)") 31a are peeled off. A non-contact type data receiving / transmitting body 50 is schematically configured from a peeling substrate 40 to which a surface (hereinafter referred to as “one surface”) 40a opposite to the surface on which the layer 41 is provided. A plurality of layers are laminated via the release layer 41.
Here, the laminated body 10 of the non-contact type data transmitting / receiving body may be simply referred to as the laminated body 10.
The first covering material 31 and the second covering material 32 may be collectively referred to as the covering material 30.

That is, in the non-contact type data receiving / transmitting body 50, both surfaces of the inlet 20 are directly covered with the covering material 30, and the peeling base material 40 is attached to one of the outer surfaces of the covering material 30. And the peeling base material 40 has comprised the structure laminated | stacked in the thickness direction. Thereby, the non-contact type data transmitting / receiving body 50 has a substantially rectangular shape in plan view.
Furthermore, the laminated body 10 has a structure in which a plurality of non-contact type data receiving / transmitting bodies 50 are stacked via a peeling layer 41, and a plurality of non-contact type data receiving / transmitting bodies 50 are stacked in the thickness direction. I am doing. Thereby, the laminated body 10 has comprised the substantially rectangular shape in planar view.

The inlet 20 is schematically configured by a base 21 and an IC chip 22 and an antenna 23 which are provided on one surface 21a of the base 21 and are electrically connected to each other.
The antenna 23 is a dipole antenna composed of a pair of planar radiating elements 24 and 25 made of various conductors, facing each other and having feeding points (portions connected to the IC chip 22) on the facing sides. is there.
The length in the longitudinal direction of the antenna 23 corresponds to a half wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length to do. That is, the length in the longitudinal direction of the radiating elements 24 and 25 is a length corresponding to a quarter wavelength.

The one surface 20 a of the inlet 20 corresponds to the one surface 21 a of the base material 21.
Therefore, the IC chip 22 and the antenna 23 are covered with the first covering material 31 on the one surface 20 a of the inlet 20.
The other surface 20 b of the inlet 20 corresponds to the other surface 21 b of the base material 21.
Therefore, the other surface 20 b of the inlet 20 is covered with the second covering material 32.

 Then, on the four side surfaces of the non-contact type data transmitting / receiving body 50, the end surface of the peeling substrate 40, the end surface of the first covering material 31, the end surface of the base material 21, and the end surface of the second covering material 32 are They are on the same plane. More specifically, for example, on the side surface 50a of the non-contact type data transmitting / receiving body 50, the end surface 40b of the peeling substrate 40, the end surface 31b of the first covering material 31, the end surface 21c of the substrate 21, and the second The end surface 32a of the covering material 32 is the same surface. Similarly, on the side surface 50b of the non-contact type data receiving / transmitting body 50, the end surface 40c of the peeling base material 40, the end surface 31c of the first covering material 31, the end surface 21d of the base material 21, and the second covering material 32 are used. The end surfaces 32b of the two are the same surface.

The thickness of the first covering material 31 is not particularly limited, but at least unevenness caused by the IC chip 22 and the antenna 23 of the inlet 20 appears on one surface (outer surface) 50c of the non-contact type data receiving / transmitting body 50. And the inlet 20 is not damaged by an external impact, for example, in the range of 10 μm to 2000 μm.
The thickness of the second covering material 32 is not particularly limited, but is such that the inlet 20 is not damaged by an external impact, for example, in the range of 10 μm to 2000 μm.

 Furthermore, when the non-contact type data receiving / transmitting body 50 has sufficient flexibility (flexibility) and the non-contact type data receiving / transmitting body 50 is bent, the first covering material 31 is formed with respect to the inlet 20. In order to prevent the stress caused by the difference in thickness between the first covering material 32 and the second covering material 32, the thickness of the first covering material 31 and the thickness of the second covering material 32 are preferably equal.

In addition, the inlets 20 constituting each non-contact type data transmitting / receiving body 50 include antennas 23 having different resonance frequencies.
The antenna 23 is set to a frequency for each country defined by ISO / IEC 18000-6. For example, the resonance frequency of the antenna 23 provided in the non-contact type data receiver / transmitter 50A is 865 to 868 MHz (for Europe). The resonance frequency of the antenna 23 provided in the non-contact type data receiving / transmitting body 50B is 902 to 928 MHz (for US), and the resonance frequency of the antenna 23 provided in the non-contact type data receiving / transmitting body 50C is 952 to 954 MHz (Japan). Each antenna 23 is set so that

 As the substrate 21, a substrate made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE), polypropylene Base material made of polyolefin resin such as (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene; Made of polyamide resin such as nylon 6, nylon 6,6 Base material: Base material made of vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polyacryl Base material made of acrylic resin such as butyl; Base material made of polystyrene; Base material made of polycarbonate (PC); Base material made of polyarylate; Base material made of polyimide; Fine paper, thin paper, glassine paper, sulfate paper, etc. A substrate made of paper is used.

 The IC chip 22 is not particularly limited, and can write and read information in a non-contact state via the antenna 23. A non-contact IC tag, a non-contact IC label, or a non-contact IC card Anything can be used as long as it is applicable to RFID media.

 The antenna 23 is formed on one surface 21a of the base material 21 using a polymer type conductive ink in a predetermined pattern by a printing method such as screen printing or ink jet printing, or by etching the conductive foil. It is made by metal plating.

 Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 15 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric current path of the coating film forming the antenna 15 is formed when the conductive fine particles constituting the coating film contact each other, and the resistance value of the coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photo-curing type, a permeation drying type, and a solvent volatilization type are used in addition to the thermosetting type.

 The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer type conductive ink include, for example, a thermoplastic resin alone, or a conductive resin fine particle in a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester and isocyanate). 60% by mass or more and a polyester resin of 10% by mass or more, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), heat Polyester resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinked type or A cross-linking / thermoplastic combination type is preferably used.

Examples of the conductive foil forming the antenna 23 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 23 include copper plating, silver plating, gold plating, and platinum plating.

 The covering material 30 is in a liquid state before use, and is composed of a two-component mixed urethane adhesive that cures by the reaction between the main agent and the curing agent without applying external conditions such as heating, ultraviolet irradiation, and electron beam irradiation. Is.

As a two-component mixed urethane adhesive, a silane coupling agent having an epoxy group is further added to a mixed solution containing an isocyanate as a first solution and a polyol having a hydroxyl group as a second solution as a second solution. The added one is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. Moreover, the compounding quantity of the silane coupling agent which has an epoxy group with respect to whole quantity of this 2 liquid mixing type urethane type adhesive agent is 0.1 to 2.0 mass%.

Further, as the two-component mixed urethane adhesive, a mixed solution containing an isocyanate as the first solution and a polyol whose hydroxyl group is a primary hydroxyl group as the second solution has an aspect ratio of 10 or more, 100 What added the following inorganic fine particles is used.
In this two-component mixed urethane adhesive, the isocyanate and polyol are blended so that the molar ratio (-NCO / -OH) between the isocyanate group of the isocyanate and the hydroxyl group of the polyol is 0.8 or more and 1.1 or less. Are mixed. The blending amount of the inorganic fine particles having an aspect ratio of 10 or more and 100 or less with respect to the total amount of the two-component mixed urethane adhesive is 5% by mass or more and 40% by mass or less.

 Specific examples of such a two-component curable urethane-based adhesive include an adhesive composed of a main agent (trade name: MLT2900, manufactured by Etec) and a curing agent (trade name: G3021-B174, manufactured by Etec). .

 In addition, the adhesive forming the covering material 30 may contain a colorant such as a known inorganic pigment, organic pigment, or dye as necessary. With this colorant, the covering material 30 is colored in an arbitrary color.

As the release substrate 40, a release film or release paper provided with a release layer is used.
As the release film, one of the base films having a thickness of 30 μm to 160 μm made of plastic such as polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene naphthalate (PEN), polypropylene (PP), polyethylene (PE), etc. The surface and / or the other surface is provided with a release layer made of silicon and having a thickness of 1 μm to 50 μm.
That is, a release layer 41 made of silicon is provided on the other surface 40 d of the release substrate 40.
Specific examples of such a release film include Tosero separator SP-PET-01-BU (trade name) manufactured by Tosero Co., Ltd.

As the release paper, a sealing agent is applied to one surface and / or the other surface of a 30 μm to 160 μm thick substrate made of glassine paper or fine paper, and on the layer made of the sealing agent, What provided the peeling layer with a thickness of 1 μm to 50 μm made of silicon is used.
That is, a release layer 41 made of silicon is provided on the other surface 40 d of the release substrate 40.
Specific examples of such release paper include, for example, L11C (trade name) manufactured by Oji Tac Co., Ltd.

 The peeling force of the peeling substrate 40 (peeling force of the peeling layer 41) is 0.05 to 1.0 N / 50 mm.

 In the non-contact type data receiving / transmitting body laminate 10, one surface 40 a is adhered to the inlet 20, the covering material 30 covering both surfaces of the inlet 20, and one surface 31 a of the first covering material 31. Since the non-contact type data receiving / transmitting body 50 having the peeled substrate 40 is laminated in plural via the peel layer 41 provided on the other surface 40d of the peel substrate 40, each non-contact type When the data transmitting / receiving body 50 is used by being peeled from the laminated body 10, there is no adhesive material layer on one outer surface 50d thereof. Further, the other outer surface 50c of the non-contact type data receiving / transmitting body 50 is composed of the release layer 41 of the release substrate 40, and there is no adhesive material layer. Therefore, since the adhesive material layer does not exist on the outer surface, the non-contact type data transmitting / receiving body 50 can be applied to many uses.

 In this embodiment, the case where the inlets 20 constituting the respective contactless data receiving / transmitting bodies 50 (50A, 50B, 50C) are provided with the antennas 23 having different resonance frequencies is illustrated. Is not limited to this. In this invention, the inlet which comprises each non-contact-type data transmission / reception body may be provided with the antenna with the same resonant frequency.

Moreover, in this embodiment, although the case where the non-contact-type data transmission / reception body 50 has comprised the planar view substantially rectangular shape was illustrated, this invention is not limited to this. In the present invention, the non-contact data receiving / transmitting body may have an arbitrary card shape or tag shape when viewed in plan.
Moreover, although this embodiment illustrated the case where the inlet 20 having the antenna 23 composed of a dipole antenna composed of a pair of planar radiating elements 24 and 25 is provided, the present invention is not limited to this. In the present invention, the antenna may be a dipole antenna composed of a pair of frame-shaped radiating elements, a meander-shaped dipole antenna, a monopole antenna, or the like.

"Method for manufacturing non-contact type data receiver / transmitter"
Next, with reference to FIGS. 3-6, the manufacturing method of the non-contact type data transmission / reception body of this embodiment is demonstrated.
3 to 6, the same components as those illustrated in FIG. 1 or 2 are denoted by the same reference numerals, and the description thereof is omitted.

First, as shown in FIG. 3, a first adhesive 31 </ b> A discharged from a nozzle of an adhesive application device or the like is applied to one surface 40 a of the peeling substrate 40 (step A).
That is, in this step A, the first adhesive 31 </ b> A is not applied on the release layer 41 provided on the other surface 40 d of the release substrate 40.

As 1st adhesive agent 31A, the thing similar to the adhesive agent which forms said coating | covering material 30 is used.
The amount of the first adhesive 31A applied to the one surface 40a of the peeling substrate 40 is not particularly limited, but the IC chip 22 and the antenna constituting the inlet 20 that are covered by the first adhesive 31A. According to the size and number of 23, the thickness required for the first covering material 31 formed by curing the first adhesive 31A, and the like are appropriately adjusted.

Next, as shown in FIG. 4, the one surface 20 a of the inlet 20 is superposed on the release substrate 40 via the first adhesive 31 </ b> A applied to the one surface 40 a of the release substrate 40, thereby releasing the release group. By pressing the inlet 20 against the material 40, the first adhesive 31A is developed between the peeling substrate 40 and one surface 20a of the inlet 20 (step B).
That is, in this step B, one side of the peeling substrate 40 is arranged such that the surface (one surface) 21a provided with the IC chip 22 and the antenna 23 in the inlet 20 faces the one surface 40a of the peeling substrate 40. The inlet 20 is overlaid on the surface 40a.

 In this step B, for example, the inlet 20 is superposed on the one surface 40a of the peeling substrate 40 via the first adhesive 31A at a portion where the pair of rotating rollers are opposed to each other, and the peeling group. The material 40 and the inlet 20 are sandwiched between a pair of rollers. Thereby, the first adhesive 31 </ b> A is developed between the peeling substrate 40 and the inlet 20.

 In Step B, as described above, the first adhesive 31A made of a two-component curable urethane adhesive that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the first adhesive 31A has fluidity until it is developed between the peeling substrate 40 and the inlet 20, but as the reaction proceeds, the fluidity gradually disappears, and finally It hardens. As a result, the one surface 20a of the inlet 20 and the IC chip 22 and the antenna 23 provided on the one surface 20a are covered with the first adhesive 31A, and the one surface 40a of the peeling substrate 40 is provided. The inlet 20 is stuck on the top. The first adhesive 31A becomes the first covering material 31 when cured.

 In step B, the thickness of the first adhesive 31A after being developed between the peeling substrate 40 and the inlet 20 is set so that at least the unevenness caused by the IC chip 22 and the antenna 23 of the inlet 20 The level is such that it does not appear on the other surface 40d side of the material 40 and the IC chip 22 and the antenna 23 are not damaged by an external impact, for example, in the range of 10 μm to 2000 μm.

In Step B, when a roller is used, the force for sandwiching the peeling substrate 40 and the inlet 20 with a pair of rollers, that is, the force (pressure) for pressing the inlet 20 in the thickness direction against the peeling substrate 40 is is not particularly limited, the thickness and size of the release substrate 40 and the inlet 20, depending on the coating amount of the first adhesive 31A, is appropriately ^adjusted, it is 1kg / cm ² ~20kg / cm 2 , more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step B, the IC chip 22 and the antenna 23 are completely covered with the first adhesive 31A, and the first adhesive 31A is filled between the peeling substrate 40 and the inlet 20 with almost no gap.

 Next, as shown in FIG. 5, the second adhesive 32 </ b> A discharged from the nozzle or the like of the adhesive application device is applied to the other surface 20 b of the inlet 20 (the other surface 21 b of the base material 21) (process). C).

As the 2nd adhesive agent 32A, the thing similar to the adhesive agent which forms said coating | covering material 30 is used.
The amount of the second adhesive 32A applied to the other surface 20b of the inlet 20 is not particularly limited, but is required for the second covering material 32 formed by curing the second adhesive 32A. It is adjusted appropriately according to the thickness to be adjusted.

 Next, as shown in FIG. 6, the peeling substrate 40 is placed on the other surface 20b of the inlet 20 via the second adhesive 32A applied to the other surface 20b of the inlet 20, and the other surface 40d. The peeling layer 41 provided on the opposite side is overlapped and pressed against the inlet 20 to press the peeling base material 40, so that the second surface 20 b of the inlet 20 and the peeling base material 40 have a second gap. The adhesive 32A is developed (step D).

 In this step D, for example, the peeling substrate 40 is superposed on the other surface 20b of the inlet 20 via the first adhesive 32A at a portion where the pair of rotating rollers face each other. The material 40 and the laminate α including the inlet 20 and the peeling substrate 40 are sandwiched between a pair of rollers. Thereby, the second adhesive 32 </ b> A is developed between the other surface 20 b of the inlet 20 and the release layer 41 of the release substrate 40.

 In Step D, as described above, the second adhesive 32A made of a two-component curable urethane adhesive that is cured by the reaction between the main agent and the curing agent without applying external conditions is used. Therefore, the second adhesive 32A has fluidity until the second adhesive 32A is developed between the laminate α and the release substrate 40, but gradually loses fluidity as the reaction proceeds. It hardens. Thereby, while the other surface 20b of the inlet 20 is coat | covered with the 2nd adhesive agent 32A, the peeling base material 40 is stuck on the laminated body (alpha). The second adhesive 32A becomes the second covering material 32 when cured.

 In Step D, the thickness of the second adhesive 32A after being developed between the laminate α and the peeling substrate 40 is spread between the peeling substrate 40 and the inlet 20 in Step B described above. The thickness is the same as the thickness of the first adhesive 31 </ b> A after being made, for example, in the range of 10 μm to 1000 μm.

Moreover, in the process D, when using a roller, the force (pressure) which presses the peeling base material 40 to the thickness direction with respect to the inlet 20, ie, the force which pinches | interposes the laminated body α and the peeling base material 40 with a pair of roller is is not particularly limited, the thickness or size of the laminate α and the release substrate 40, depending on the coating amount of the second adhesive 32A, is suitably ^adjusted, at 1kg / cm ² ~20kg / cm 2 preferably there, more preferably ^{5kg / cm 2 ~10kg / cm 2} .

 By this step D, the second adhesive 32 </ b> A is filled between the laminate α and the peeling substrate 40 with almost no gap.

 Further, the above-described step A, step B, step C and step D are repeated a plurality of times in this order, thereby obtaining the non-contact type data receiving / transmitting body 10 shown in FIG.

If necessary, the non-contact type data receiving / transmitting body laminate 10 may be cut according to the shape of the antenna 23 by a cutting blade (not shown) of a cutting device.
Here, cutting the laminated body 10 according to the shape of the antenna 23 means cutting the antenna 23 according to the shape of the target non-contact type data receiving / transmitting body 50 without damaging the antenna 23.

 According to the manufacturing method of the non-contact type data receiving / transmitting body laminate of this embodiment, the above-mentioned process A, process B, process C and process D are repeated a plurality of times in this order, whereby the peeling substrate 40 is peeled off. Via the layer 41, the non-contact type data receiving / transmitting body laminate 10 in which a plurality of non-contact type data receiving / transmitting bodies 50 are stacked can be manufactured. Therefore, unlike the prior art, there is no need to stack the non-contact type data transmitting / receiving body via the weak adhesive material layer.

 In addition, in this embodiment, although the case where the laminated body 10 was manufactured using the inlet 20 separated into pieces previously was illustrated, this invention is not limited to this. In the present invention, a long peeling base material, and a long surface provided with a large number of RFID antennas and IC chips communicating through the antenna at equal intervals on one surface of the base material. You may manufacture the laminated body of a non-contact-type data transmission / reception body continuously using an inlet sheet.

DESCRIPTION OF SYMBOLS 10 ... Laminated body (laminated body) of non-contact type data transmission / reception body, 20 ... Inlet, 21 ... Base material, 22 ... IC chip, 23 ... Antenna, 24, 25 ... -Radiating element, 30 ... coating material, 31 ... first coating material, 31A ... first adhesive, 32 ... second coating material, 32A ... second adhesive , 40... Release substrate, 41... Release layer, 50.

Claims (2)

An inlet, a covering material that covers both sides of the inlet, and a peeling base material having a surface opposite to the surface on which the peeling layer is provided on one of the outer surfaces of the covering material. A plurality of non-contact type data transmitting / receiving bodies are stacked through the release layer,
The said coating | covering material consists of 2 liquid-curing urethane type adhesives, The laminated body of the non-contact-type data transmission / reception body characterized by the above-mentioned. An inlet, a covering material that covers both sides of the inlet, and a peeling base material having a surface opposite to the surface on which the peeling layer is provided on one of the outer surfaces of the covering material. A non-contact type data transmitter / receiver is formed by laminating a plurality of layers through the release layer, and the coating material is a method for manufacturing a non-contact type data transmitter / receiver laminate comprising a two-component curable urethane adhesive. And
Step A of applying an adhesive composed of a two-component curable urethane adhesive to the surface opposite to the surface on which the release layer of the release substrate is provided;
Via the adhesive applied to the release substrate, the release substrate is overlapped with the surface on which the IC chip in the inlet is provided, and the inlet is pressed against the release substrate, thereby releasing the release group. A step B of spreading the adhesive between a material and the inlet;
Applying an adhesive made of a two-component curable urethane-based adhesive to a surface opposite to the surface on which the IC chip is provided in the inlet; and
Via the adhesive applied to the inlet, on the surface of the inlet opposite to the surface on which the IC chip is provided, the release substrate is overlapped with the release layer that forms one surface facing each other, Step D of spreading the adhesive between the release substrate and the surface of the inlet opposite to the surface on which the IC chip is provided by pressing the release substrate against the inlet. And having
The method of manufacturing a non-contact type data transmitting / receiving body, wherein the step A, the step B, the step C, and the step D are repeated a plurality of times in this order.

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