JP2000251049A - Card and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a card immune to peeling against curvature and other stress and to make the thickness of the card thin and uniform. SOLUTION: This card is provided with a sheet-shaped rear sheet 1 for card and a sheet-shaped front sheet 5 and has a laminate structure sticking the card while interposing an adhesive sheet 10 between the rear sheet 1 and the front sheet 5 with which specified rugged parts 1A and 5A are formed on the side of an abutting surface with the depth of from 5 μm to 100 μm from an average sheet thickness side and since the adhesive sheet 10 is hardened in the state of inserting the adhesive sheet 10 to the rugged parts of the rear sheet 1 and the front sheet 5, the IC card, which is immune to peeling against curvature or other stress and has the thin and uniform thickness, etc., can be provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention is applicable to non-contact type IC cards such as cash cards, employee ID cards, employee ID cards, employee ID cards, student ID cards, alien registration IDs and various driver's licenses. And a method for manufacturing the same. More specifically, a concave and convex portion is formed on the contact surface side of the two members for the card in advance, and then the two members are bonded to each other with an adhesive member interposed therebetween, so as to reduce the bending of the card and other stress. On the other hand, the card is resistant to peeling, has a small card thickness, and can achieve a uniform thickness.

[0002]

2. Description of the Related Art In recent years, an IC card in which an IC chip or an antenna is sealed in a resin card has been proposed. Since this type of IC card is a non-contact type, it has no information input / output terminals. Therefore, the information is used by converting it into a specific modulated radio wave, receiving it with an antenna, demodulating it with an IC chip, writing it into a memory or the like, or reading it out.

[0003] The non-contact type IC card is disclosed, for example, in Japanese Patent Application Laid-Open No. 9-275184 as "information carrier and method for producing the same".
According to this technical document, an electronic component such as an IC chip or an antenna is housed in a woven reinforcing member (hereinafter also referred to as a housing member), and is bonded with an upper and lower cover sheet via an adhesive member. An IC card is formed. Thereby, the IC card itself can be formed thin.

By the way, in this type of IC card, a printed member is used as a member for the front side, and for example, “○○○ employee ID”, “name”, “issue date”. Such image display information is often printed. The printing member is provided with an image receiving layer for forming a photograph of the face of the user of the card. A face photograph or the like is formed by sublimation thermal transfer using a thermal head, melt thermal transfer, or ink jet means. This I
The back sheet serving as a member for the substrate of the C card may be provided with a writing layer that can be written with a pen.

Therefore, when mass-producing cash cards, employee cards, employee cards, membership cards, student cards, alien registration cards, various driver's licenses, and the like, surface members on which image display information is printed. In many cases, a storage member for storing electronic components and a substrate member having a writing layer are used in the form of a long sheet. Of course, there are cases where ten or twenty cards are manufactured using large-sized sheets.

[0006] The long sheet-shaped surface member, the housing member and the substrate member are heated and bonded by a vacuum heat press or the like with a liquid adhesive member interposed therebetween. The long sheet-shaped card aggregate after the heat bonding is cut into one unit of card aggregate. Thereafter, when the card assembly is completely cured, IC cards are punched out one by one from the card assembly by a punching device or the like.

[0007]

However, in response to a demand for mass production of cash cards, employee cards, employee cards, membership cards, student cards, alien registration cards, various driver's licenses, etc., long sheets are required. When a method is used in which a member for a substrate in the form of a sheet or a large plate, a housing member, and a member for a surface are bonded with a liquid adhesive member, an equal amount of the adhesive member is applied to the housing member. Becomes difficult.

Accordingly, the thickness of the adhesive layers on the front and back of the storage member may be uneven, and the card surface may be uneven. The unevenness of the adhesive layer deteriorates the flatness of the card, which hinders the production of an IC card having a uniform thickness.

Recently, hot melt resins and reactive hot melt resins have been used as adhesive members. The reactive hot-melt resin to accompany emission of absorption and CO ₂ in water is an adhesive member whose main component, easily CO ₂ remains in the seat surface of the card, the thickness of the card partially CO ₂ is expanded May be uneven and wrinkles may occur. Regarding the curing of reactive hot melt resin, it depends on the direction of penetration of moisture and the dispersion of card members,
Wrinkles are likely to occur if the way of curing the card is locally different.

Accordingly, the present invention has been made to solve the above-mentioned problems, and has a card which is resistant to peeling against bending and other stresses of the card, has a small card thickness, and can achieve a uniform thickness. It is intended to provide a manufacturing method.

[0011]

In order to solve the above-mentioned problems, a card according to the present invention comprises a sheet-like first member for a card and a sheet-like second member.
It has a laminated structure in which an adhesive member is interposed and bonded between a first member and a second member, each of which has an uneven surface formed in advance on the contact surface side.

According to the card according to the present invention, for example, a depth of 5 μm to 10
It has a laminated structure in which an adhesive member is interposed between a first member and a second member having an uneven portion defined between 0 μm and the first member and the second member. Since the adhesive member is hardened in a state where it has entered the uneven shape of the second member,
It is possible to provide an IC card or the like having a small card thickness and a uniform thickness which is resistant to peeling of the card due to bending and other stresses and does not generate wrinkles due to curing of the adhesive member.

The method for manufacturing a card according to the present invention comprises the steps of: forming an uneven shape on the surface to be bonded of the first member for the card; and forming an uneven portion on the surface to be bonded of the second member for the card. Forming the first member and the second member on which the uneven portion is formed.
And a step of bonding the first member and the second member with an adhesive member interposed between the first member and the second member.

According to the card manufacturing method of the present invention, the adhesive member is inserted into the concave and convex portions of the first and second members defined between 5 μm and 100 μm in depth from the sheet thickness average surface. The adhesive member can be cured. Therefore, it is possible to manufacture a card which is resistant to peeling due to card bending and other stresses and does not generate wrinkles. Thus, a non-contact type IC card having a small card thickness and being flat can be provided.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A card according to an embodiment of the present invention and a method for manufacturing the card will be described below with reference to the drawings. (1) First Embodiment FIG. 1 shows an ID card 1 according to a first embodiment of the present invention.
It is a perspective view which shows the example of a structure of 00. In the present embodiment,
An uneven portion is formed on the contact surface side of the two members for the card in advance, and then bonded by interposing an adhesive member between the two members, whereby the card is peeled against the bending of the card and other stresses. The card has a small thickness and can achieve a uniform thickness.

The ID card 100 shown in FIG. 1 has, for example, a vertical length of about 6 cm, a horizontal length of about 9 cm, and a thickness of about 0.5 mm to 1.0 mm. This ID
The lowermost layer of the card 100 has a thickness of 1 as a first member.
A back sheet 1 of about 00 μm is provided. The sheet thickness of the back sheet 1 is preferably about 50 μm to 300 μm.
The back sheet 1 further has a writing layer (not shown) that can be written with a pen.

In this example, a top sheet 5 having a thickness of about 100 μm is provided on the back sheet 1 as a second member.
It has a laminated structure in which at least the back sheet 1 and the top sheet 5, which are previously formed with irregularities on the contact surface side, are laminated with a thin sheet-like adhesive member (hereinafter also simply referred to as an adhesive sheet) 10 interposed therebetween. ing. That is, in order to improve the adhesiveness, an uneven portion 1A having a predetermined depth is formed in advance on the surface to be bonded of the back sheet 1 shown in the wavy circle in FIG. The uneven portion 5A having a predetermined depth on the side
Are formed.

In this example, the top sheet 5 is made of a printing material, and image display information is printed in a predetermined area in advance. The image display information indicates the field in which the ID card 100 is used, for example, “XXX employee ID”, “name”, “issue date”, and so on.
And so on. This printing member includes the ID card 100
An image receiving layer for forming a photograph of the user's face is also provided. An example of a laminated structure of the back sheet 1 and the top sheet 5 will be described with reference to FIGS.

The ID card 100 is bonded between the back sheet 1 and the top sheet 5 with a thin sheet adhesive member 10 containing a reactive hot melt resin as a main component. In this example, the adhesive sheet 10 includes a hot melt resin,
Preferably, a reactive hot melt resin is used. A commonly used hot melt resin can be used. As a main component of the hot melt resin, for example, ethylene-vinyl acetate copolymer (EVA)
System, polyester system, polyamide system, thermoreversible elastomer system, polyolefin system and the like.

Examples of the polyamide hot melt resin include Macromelt series manufactured by Henkel and the like. Examples of the thermoreversible elastomer type include curry flex TR and Clayton series manufactured by Shell Chemical Co., Ltd., and Tufprene manufactured by Asahi Kasei Corporation. Firestone Synthe
There are Tuffden manufactured by tic Rubber and Latex, Solprene 400 series manufactured by Phillips Petroleum, and the like.

Examples of the polyolefin-based reactive hot melt resin include Sumitics manufactured by Sumitomo Chemical Co., Ltd., Vistax manufactured by Chisso Petrochemical Co., Yucatac manufactured by Mitsubishi Yuka, Macromelt Series manufactured by Henkel, and Mitsui Petrochemical. Tuffmer, Ube Lexen APAO,
Examples include East Bond manufactured by Eastman Chemical Company and A-FAX manufactured by Hercules Company.

The reactive hot melt resin is of a type in which the resin is melted and bonded, and then the resin is cured by absorbing moisture. Its characteristics are that, compared to ordinary hot melt resins, reactive hot melt resins have a longer bondable time and a higher softening temperature after bonding, so they are more durable and can be applied at lower temperatures. Suitable for processing and bonding. That is, in a normal hot melt resin, the temperature of the resin at the time of coating (hereinafter, referred to as a coating temperature) is the same as the temperature at which the resin is softened (hereinafter, referred to as a softening temperature). It does not become heat resistant. Therefore, when high heat resistance is required, a high coating temperature is required.

At that point, since the reactive hot melt resin is cured after coating, the softening temperature is higher than the coating temperature.
The temperature rises by several tens of degrees Celsius. Therefore, when the surface of the image receiving layer 54 is made of a material that is easily damaged at high temperatures, the damage can be reduced. An example of a reactive hot melt resin is a resin mainly composed of a urethane polymer containing an isocyanate group at a molecular terminal, and the isocyanate group is activated by reacting with water, and further, isocyanate group reacted with water. Reacts with the prepolymer to form a crosslinked structure.

The reactive hot melt resins usable in the present invention include TE030 and T30 manufactured by Sumitomo 3M Limited.
E100 or Hibon 482 manufactured by Hitachi Chemical Co., Ltd.
0, Bondmaster 170 manufactured by Kanebo UNS Co.
Series, Macroplast made by Henkel
QR3460 and the like. Hereinafter, the reactive hot melt resin formed in a thin sheet shape is also referred to as a reactive hot melt web. Here, a method for forming the reactive hot melt web will be described.

For example, a reactive hot melt resin is melt-coated on a release sheet to a predetermined thickness by a T-die or the like. Thereafter, the hot melt resin or the like on the release sheet is cooled. The solidified hot melt resin or the like is wound into a roll. Thereby, a roll-shaped reactive hot melt web can be formed. In this example, the reactive hot melt is coated with a thickness of 50 μm to 30 μm.
It is used in the form of a web of 0 μm, preferably 150 μm to 250 μm. The softening point of the reactive hot melt is 50
C. to 130 ° C. or less.

In the case of the reactive hot melt resin, the curing proceeds by absorbing moisture in the air. Therefore, the curing is prevented from proceeding before the laminating process. For this reason, the bonding process must be performed in a short time (for example, within 24 hours after the processing). In order to avoid such a time constraint, some storage method is required.

In this example, the method of storing the reactive hot melt web is to store the reactive hot melt web in a sealed container filled with a gas containing 80% or more of nitrogen. According to this storage method, it is possible to avoid time restrictions such as lamination processing within 24 hours after processing. Alternatively, a reactive hot melt web is placed under a normal pressure of 25 ° C. with a small air flow, an outside air humidity of 80% (relative) and a container humidity of 10%.
% (Relative) for about 24 hours. afterwards,
The reactive hot melt web may be stored in a closed container where the humidity in the container is kept at 15% or less. This also makes it possible to avoid time constraints after processing.

Further, when the roll-shaped adhesive sheet is spread, the electric charges are peeled and charged, and when the electric charges come into contact with an IC chip or the like, the chip may be broken. In order to cope with this, in this example, an antistatic coat is applied to the surface of the adhesive sheet, or a charge elimination process is performed before contacting the IC chip, thereby preventing chip breakage. At this time,
The discharge process can be performed by using an AC discharge, a discharge brush, a grounded cloth, or the like.

FIG. 2 is a sectional view showing an example of the configuration of the uneven portion 5A of the topsheet 5. As shown in FIG. In this example, an uneven portion 5A is formed on the contact surface side of the topsheet 5, and the depth d of the uneven portion 5A is such that the rubber elasticity of the topsheet 5 itself is 40 ° to 75 °.
°, 5 μm to 100 μm from the sheet thickness average plane
Stipulated between. Since the back sheet 1 is the same as the top sheet 5, its description is omitted. When the thickness of the entire card, the thickness of the adhesive layer and the thickness of the resin layer are small, and the thickness of the card is 500 μm or less or the adhesive layer is 300 μm or less, the uneven portion 5A is preferably 60 μm or less.

The uneven portion 5A enhances the integrity of the adhesive member 10 such as a hot-melt resin or a reactive hot-melt resin. And integrated. Then, the stress generated during the hardening of the adhesive member 10 can be gradually dispersed to the uneven portions 5A of the topsheet 5. Therefore, the topsheet 5 is unlikely to be wrinkled.

According to the uneven portion 5A, the topsheet 5
For example, in the case of PET (polyethylene terephthalate) resin, the uneven surface of the inner surface of With respect to an envelope formed by connecting the outermost peaks of the portion 5A, recesses of 5 μm to 100 μm exist in an average of 1.0 to 5.0 within 1 mm ² (1 mm square). Is preferred.

If the concave portion is not more than 1.0 within 1 mm ² , the top sheet 5 and the adhesive member 10 are less familiar with each other and the top sheet 5 is easily separated when stress is generated. 1 recess
If it is more than 5.0 in mm ² , the adhesive member 10 may not sufficiently enter the inside of the concave portion, and a minute cavity may be generated, which causes peeling.

With respect to the concave portion of the topsheet 5, the depth d
Is less than 5 μm, the adhesive force is small, and the surface sheet 5 is easily peeled against the surface tension of the surface sheet 5. When the concave portion has a size of 5 μm or more, the degree of shrinkage during curing of the card is partially different due to the reactive hot melt resin or other adhesive members, or the stress due to the difference in shrinkage between the adhesive member and the top sheet 5 is reduced. Even when applied to the interface, wrinkles can be prevented. In addition, displacement of the topsheet 5 can be prevented.

If the depth d exceeds 100 μm, especially if the viscosity of the adhesive member is high, even if the concave portion has a size of about 1.0 in a square of 1 mm ² ,
There is a possibility that 0 may be difficult to enter. When a space is left between the adhesive member and the sheet, the adhesive force is weakened, the top sheet 5 is easily peeled off, the bubbles expand due to a temperature change, and a convex portion may be generated on the card surface.

For these reasons, the uneven portions of the back sheet 1 and the top sheet 5 may have a shape repeating the uneven shape shown in FIG. 2, but are more preferably the uneven shapes shown in FIGS. . FIG. 3 is a cross-sectional view illustrating a configuration example of another uneven portion 5 </ b> B of the back sheet 1 and the top sheet 5.
In this example, the uneven portion 5B has a rounded shape like a sinusoidal cross section. The uneven portion 5B is formed into a round shape like a sine wave by applying particles to the sheet surface or forming the sheet on a roller having an uneven portion in advance. Although the bonding of the sheet is weaker in the uneven portion 5B than in the uneven portion 5A, the adhesive member can easily enter the corner of the concave portion firmly.

FIG. 4 is a cross-sectional view showing a configuration example of another uneven portion 5C of the back sheet 1 and the top sheet 5. As shown in FIG. In this example, the inside of the uneven portion 5C has an inverted mesa shape. Although this inverted mesa shape depends on the sheet member, it can be formed by using a different direction etch solution or the like. The adhesive member is wrapped around the inverted mesa shape, and peeling of the adhesive member after the curing can be prevented by the inverted mesa shape.

Next, a method for forming the uneven portions 1A and 5A shown in FIG. 2 on the back sheet 1 and the top sheet 5 will be described. FIG. 5 is a conceptual diagram illustrating a configuration example of a cross section of the double-sided water spray device 41. In this example, the sound blasting back surface processing is performed in a state where the surfaces to be bonded of the back sheet 1 and the top sheet 5 face each other.

This water spraying device 41 has one sand roller 45 and two tanks 42 and 47 shown in FIG. Water 50 is stored in each of the tanks 42 and 47. The upper surface of the sand roller 45 is in contact with the back surface of the top sheet 5, and the lower portion is in contact with the back surface of the back sheet 1. In this example, the back sheet 1 and the top sheet 5 are moved in the directions of the arrows.

In this example, the water 50 in the left tank 42 is dropped by gravity. A water supply stop valve 43 is attached below the tank 42, and a drain pipe (not shown) is connected to the water supply stop valve 43, and the end (lower left portion) is directed to the sand roller 45. The amount of water applied from the tank 42 to the sand roller 45 is controlled by a water supply stop valve 43. This is for supplying a certain amount of water to the sand roller 45.

A drain pipe (not shown) is connected to the upper right portion of the sand roller 45, and a pump 46 is attached to this pipe. This pump 46 is connected to a right tank 47 containing water 50. The amount of water sent from the tank 47 to the sand roller 45 is controlled by a pump 46. This is to supply a certain amount of water. With this configuration, the back surface of the top sheet 5 passed through the upper and lower portions of the sand roller 45 is provided with irregularities, and the back surface of the back sheet 1 is simultaneously provided with the irregularities to be in a water absorbing state (sand back surface treatment). . By providing irregularities on the back surface of the back sheet 1 and the top sheet 5, the adhesiveness of the card can be improved. In addition, the sand back processing is performed in a state where the surfaces to be bonded of the back sheet 1 and the top sheet 5 face each other.

FIG. 6 is a conceptual diagram showing a configuration example of a cross section of another water spraying device 41 '. This water spraying device 41 'has two sand rollers 45A and 45B and two tanks 42 and 47 shown in FIG. The upper surface of the sand roller 45A is brought into contact with the back surface of the topsheet 5, and the topsheet 5 is moved in the direction of the arrow.

In this example, the water 50 in the left and right tanks 42, 47
Are all dropped by gravity. Therefore, the pump can be omitted. A water supply stop valve 43A is provided below the tank 42.
A drain pipe (not shown) is connected to the water supply stop valve 43A.
Pointed at A. Sand roller 45 from tank 42
The amount of water applied to A is controlled by a water supply stop valve 43A. This is for supplying a certain amount of water to the sand roller 45A.

The upper surface of the sand roller 45B is brought into contact with the back surface of the back sheet 1, and the back sheet 1 is moved in the direction of the arrow.
Is moved. A water supply stop valve 43B is provided below the tank 47.
A drain pipe (not shown) is connected to the water supply stop valve 43B, and water is supplied from the end of the drain pipe (lower left) to the sand roller 45B. The amount of water applied from the tank 47 to the sand roller 45B is controlled by a water supply stop valve 43B. This is for supplying a certain amount of water to the sand roller 45B.

With this configuration, the back surface of the top sheet 5 passed through the upper portion of the sand roller 45A is provided with irregularities,
The back surface of the back sheet 1 passed through the lower portion of the sand roller 45B is made uneven, and the back surfaces of the top sheet 5 and the back sheet 1 are simultaneously brought into a water absorbing state (sand back processing).
By providing irregularities on the back surface of the back sheet 1 and the top sheet 5, the adhesiveness of the card can be improved.
In addition, the back surface processing is performed in a state where the surfaces to be bonded of the back sheet 1 and the top sheet 5 face each other.

FIG. 7 shows an ID card 1 according to the first embodiment.
FIG. 8 is a cross-sectional view showing a manufacturing example of the back sheet 1 of FIG.
It is an expanded sectional view which shows the example of lamination | bonding with the surface sheet 5. In this example, the uneven portion 1A is formed on the bonded surface side of the back sheet 1 for a card, and the uneven portion 5A is also formed on the bonded surface side of the top sheet 5 for a card. Then, the uneven portion 1A,
An adhesive sheet 10 is interposed between the back sheet 1 and the top sheet 5 on which the back sheet 5A is formed and the back sheet 1 and the top sheet 5
And stick them together.

At this time, assuming that the introduction angle of the top sheet 5 with respect to the surface to be bonded of the back sheet 1 shown in FIG. 7 is θ, the introduction angle θ is defined in the range of 45 ° ≦ θ ≦ 120 °. The introduction angle θ is specified so that the adhesive member 10 such as a hot melt resin or a reactive hot melt resin is sufficiently inserted into the uneven portion 5A of the topsheet 5 to adapt the adhesive member 10 and to prevent extra air bubbles from entering. That's why.

If the introduction angle θ at the start of the contact is less than 45 °, the concave portion of the topsheet 5 cannot be opened sufficiently, so that the adhesive member 10 does not enter the concave portion. When the introduction angle θ at the start of the contact exceeds 120 °, the concave portion of the topsheet 5 tries to hold many adhesive members, and the adhesive member 10 does not enter the concave portion. With the introduction angle θ in this range, the concave portion of the topsheet 5 shown in FIG. 8 acts so as to be greatly opened at the time of starting the contact, so that the optimal amount of the adhesive member 10 enters the concave portion. Adhesiveness is further improved as compared with the surface sheet 5 having a smooth surface to be bonded.

As described above, according to the ID card 100 according to the present embodiment, the depth d defined in advance between the sheet thickness average surface and 5 μm to 100 μm, preferably 10 μm to 30 μm, is provided on the contact surface side. Has a laminated structure in which an adhesive member 10 is interposed between the back sheet 1 on which the uneven portions 1A and 5A are formed and the top sheet 5, and the adhesive member 10 is bonded to the back sheet 1 and the front surface. Since the adhesive member 10 is cured in a state where the adhesive member 10 has entered the uneven portion of the sheet 5,
It is possible to provide an ID card or the like having a small card thickness and a uniform thickness that is resistant to peeling due to the bending of the D card 100 and other stresses and does not generate wrinkles due to curing of the adhesive member 1.

(2) Second Embodiment FIG. 9 is a perspective view showing a configuration example of an electronic card 200 according to a second embodiment. The electronic card 200 has, for example, a vertical length of about 6 cm, a horizontal length of about 9 cm, and a thickness of about 0.5 mm to 1.0 mm. Have. The lowermost layer of the electronic card 200 has a thickness of 100% as a first member.
A back sheet 1 of about μm is provided. The sheet thickness of the back sheet 1 is preferably about 50 μm to 300 μm. The back sheet 1 further has a writing layer (not shown) that can be written with a pen.

In this example, the electronic component 4 for a card is provided on the back sheet 1. The electronic component 4 is the electronic card 2
The IC chip 4A electrically records information relating to the user No. 00, and a coil-shaped antenna 4B connected to the IC chip 4A. The IC chip 4A is a memory only or a microcomputer in addition to the memory. The electronic component 4 may include a capacitor.

Since the electronic card 200 is of a non-contact type, it does not have any information input / output terminals. The information is converted into a specific modulated radio wave, received by the antenna 4B, demodulated by an IC chip, written into a memory or the like, or read therefrom. In a method used for a normal non-contact type IC card, the driving power source can take in external electromagnetic energy into the antenna 4B. For example, a DC power supply is obtained by rectifying an electromotive force generated by electromagnetic induction. Of course, in addition to this, it is also conceivable to take in electricity from high-frequency electromagnetic energy from the outside into the antenna body 4B or another object.

A surface sheet 5 having a thickness of about 100 μm is provided on the electronic component 4 as a second member, and the electronic component 4 is encapsulated. In this example, the electronic component 4 is adhered to the back sheet 1 and the top sheet 5 which are formed in advance on the contact surface side with an adhesive member in the form of a thin sheet (hereinafter simply referred to as an adhesive sheet). It has a laminated structure. That is, the back sheet 1 shown in the wavy circle in FIG.
In order to improve the adhesiveness, an uneven portion 1A having a predetermined depth is formed in advance on the surface to be bonded, and an uneven portion 5A having a predetermined depth is also formed on the surface to be bonded of the top sheet 5 in advance. Is formed.

For example, the first adhesive sheet 10A having a thickness of about 50 μm to 300 μm bonds the back surface of the IC chip 4A to the back sheet, and the gap between the top surface of the IC chip 4A and the top sheet 5 has a thickness of 50 μm to 300 μm. Laminated with a second adhesive sheet 10B of about 300 μm. For these adhesive sheets 10A and 10B, a hot melt resin or a reactive hot melt resin in which a thin sheet is formed in advance is used.

The topsheet 5 is formed, for example, on a film support 51 shown in FIG.
3. An image receiving layer 54 and an upper layer 55 are laminated. The second adhesive sheet 10B is attached to the film support 51 side. The uneven portion 5A is formed on the side of the film support 51 to be bonded.

As the film support 51, a general plastic film such as polyester, polyolefin, polystyrene, and ABS is used. In particular, it is preferably formed of a resin such as polyethylene terephthalate (PET) or polypropylene (PP). In particular, when a biaxially stretched resin is used, a thin topsheet 5 having excellent strength can be formed. The film thickness of the film support 51 is, for example, 12 μm or more (particularly 25 μm) when a biaxially stretched polyethylene terephthalate resin is used.
It is preferably 300 μm or less (particularly 250 μm).

The cushion layer 52 is provided to alleviate the influence of the unevenness of the IC chip 4A when the film support 51 has a structure containing air bubbles or is formed of a flexible material. In addition, the cushion layer 52 has a function of improving the contact of the thermal head when printing a face image or the like.

[0057] Preferably the tensile modulus is as a cushion layer 52 (ASTM D790) is 20 kgf / mm ² or more, and is preferably 200 kgf / mm ² or less. The thickness of the cushion layer 52 is preferably 2 μm or more (particularly 5 μm) from the viewpoint of the cushion effect, and is preferably 200 μm or less (particularly 50 μm) from the viewpoint of the overall thickness and curl suppression.

As a member forming the cushion layer 52, for example, polyethylene resin, polypropylene resin,
Polybutadiene resin, ethylene-vinyl acetate copolymer resin, ethylene-ethyl acrylate copolymer resin, styrene-butadiene-styrene block copolymer resin, styrene-isoprene-styrene block copolymer resin, styrene-ethylene-butadiene- Polyolefin resins such as a styrene block copolymer resin and a styrene-hydrogenated isoprene-styrene block copolymer resin are preferred because of their flexibility.

In this example, the top sheet 5 is made of a printing material, and image display information is printed in a predetermined area in advance. The image display information indicates the field in which the electronic card 200 is used, for example, “XXX employee ID”, “name”, “issue date”, and so on.
And so on. This printing member includes the electronic card 200
An image receiving layer 54 for forming a photograph of the user's face is provided. A face photograph or the like is formed by applying heat from a thermal head from the ink sheet side containing the dye and sublimating or transferring the dye to the image receiving layer 54 by the heat. As a material of the image receiving layer 54, polyester resin, polyvinyl chloride resin, polyvinyl acetal resin, polyvinyl butyral resin, epoxy resin,
A polymeric material such as an acrylic resin can be used.

The layer adjacent to the image receiving layer 54, for example, the film support 51 or the cushion layer 52 is preferably a resin mixed (containing) with a white pigment in order to enhance the image formed on the image receiving layer 54. The present invention is not limited to this. In order to increase the whiteness, a layer provided with voids may be used. The voids provide cushioning. Preferred examples of the white pigment include, but are not limited to, titanium oxide, barium sulfate, and calcium carbonate.

FIG. 11 is a cross-sectional view showing the laminated structure of the back sheet 1. The back sheet 1 of this example has a writing layer 12 below a film support 11. This writing layer 12
Is formed, for example, by diffusing calcium carbonate and silica fine particles into a polyester emulsion. The first adhesive sheet 10A is stuck on the film support 11. The uneven portion 1A is formed on the surface of the film support 11 to be bonded.

As described above, according to the electronic card 200 of the present embodiment, the uneven portions 1A, 5A having a depth d defined between 5 μm and 100 μm from the average sheet thickness surface are provided on the contact surface side in advance. Has a laminated structure in which the adhesive sheets 10A and 10B shown in FIG. 12 are interposed between the back sheet 1 and the top sheet 5 on which the top sheet 5 is formed. Each of the adhesive sheets 10A, 1A, 1A, 1B,
Since 0B is cured, the card is strong against peeling against bending and other stresses of the electronic card 200 and does not generate wrinkles due to curing of the sheets 10A and 10B. Can be.

Subsequently, referring to FIGS. 13 to 18,
A method for manufacturing the electronic card 200 according to the second embodiment will be described. 13A to 13C show the electronic card 20.
FIG. 14A is a cross-sectional view of an example (No. 1) of the process for forming a No. 0,
FIG. 14B is a sectional view of an example (part 2) of the forming step. FIG. 15 to FIG. 18 are top views showing the sheet-like members that complement it.

In this example, a long sheet-like back sheet 1 is used.
A case will be described in which a card assembly 20 is formed in which the electronic component 4 is bonded to the long sheet-shaped top sheet 5 with the adhesive sheets 10A and 10B interposed therebetween. Needless to say, the back sheet 1 and the top sheet 5 used are those in which the uneven portions 1A and 5A having a depth d defined between 5 μm and 100 μm from the average sheet thickness surface are formed on the surfaces to be bonded. .

First, in FIG. 13A, an adhesive sheet 10A is bonded on a back sheet in which an upper surface of irregularities is formed on a surface to be bonded in advance. A reactive hot melt resin is used as the adhesive sheet 10A. In this example, the softening point of the reactive hot melt resin is 95 ° C. or higher.

When the softening point is set to 95 ° C. or higher, an employee card, an employee card, a member card, a student card, an alien registration card, various driver's licenses, etc. are placed in a parked car under the sunshine. This is because it is empirically found that the vehicle interior temperature reaches 90 ° C.

The back sheet 1 has a writing layer 12 shown in FIG. 15, which can be written with a pen. An alignment mark p0 is also printed on the end of the back sheet 1 in advance. The alignment mark p0 is formed for each one or a plurality of card areas. Alignment mark p0
May be a black line or block having a low reflectance that can be detected by an optical sensor, but may be a magnetic mark, a slit or a hole.

Thereafter, the adhesive sheet 10A shown in FIG.
The electronic component 4 is arranged thereon. This electronic component 4 has an IC chip 4A and an antenna 4B shown in FIG.
It is automatically supplied onto the adhesive sheet 10A via a component carrier (not shown). In addition, the electronic component 4 may be used in which the electronic component 4 is stored in advance in the chip storage sheet 3 in a sheet shape. A woven or nonwoven resin sheet is used for the chip storage sheet 3. Electronic component 4 is IC chip 4A
And the antenna body 4B are housed therein, and include a chip capacitor and the like.

After forming the electronic component 4 on the adhesive sheet 10A, the adhesive sheet 10B is attached on the electronic component 4 in FIG. 13C. As the adhesive sheet 10B, a sheet in which a reactive hot melt resin is formed in a thin sheet shape in advance is used. Then, in FIG. 14A, the adhesive sheet 1
A long sheet-like top sheet 5 drawn out from a top sheet supply unit (not shown) is formed on the entire surface of the top sheet 0B. At this time, the introduction angle θ of the top sheet 5 is set in a range of 45 ° ≦ θ ≦ 120 °. For example, the top sheet 5 is formed on the adhesive sheet 10B at an introduction angle of θ = 60 °.

Image display information for the user of the electronic card 200 is printed on the front sheet 5 in a predetermined printing area shown in FIG. In this example, the top sheet 5 shown in FIG. 18 has a long sheet shape in which image display information is continuously printed in the transport direction. An alignment mark p0 is printed on the end of the topsheet 5 in advance.
In this example, the long sheet-shaped top sheet 5 has “○○
-Image display information such as "employee's card", "name" and "issue date" are arranged in three columns in the width direction, and the image display information is continuously printed in the transport direction.

When the long sheet-like top sheet 5 is formed on the adhesive sheet 10B, a foamable urethane sheet (not shown) may be formed inside the antenna 4B. With this urethane sheet, the topsheet 5 can be further flattened, and the image forming condition of the image receiving layer 54 can be improved.

Thereafter, the card assembly 20 is heated in the same manner as in the conventional method, and a pressing process is performed from the top sheet 5 side and the back sheet 1 side shown in FIG. 14B. The bonding conditions at this time are a heating temperature of about 60 ° C. and a heating time of about 30 seconds. The pressure is about 5 kg / cm ² . At this time, the upper press section 17A and the lower press section 1 shown in FIG.
The temperature and press pressure of 7B are controlled to be constant by the controller 70. Thus, the long sheet-shaped card assembly 20 is completed.

In this example, the card assembly 20 is cut to form one unit of an electronic card sheet. For example, the card assembly 20 is cut into two or more pieces based on the alignment mark p0 formed outside the image display area of the card assembly 20. After that, after the electronic card sheet is completely cured, the electronic cards 2 are placed one by one by a punching device or the like.
00 is punched out.

As described above, according to the method of manufacturing the electronic card 200 according to the second embodiment, the distance between the contact surface and the sheet thickness average surface is set to 5 μm to 100 μm, preferably 10 μm to 30 μm. Sheet 1 and top sheet 5 on which uneven portions 1A and 5A having a depth d are formed.
The electronic component 4 is bonded with an adhesive member 10 interposed therebetween.

Accordingly, the adhesive sheet 10A, 10B formed by the heat melting and pressurization is perfectly integrated at the part on the electronic component 4 side, and the adhesive sheet 10A on the opposite side is the topsheet 5
The adhesive sheets 10A and 10B are cured while the adhesive sheet 10B enters the uneven portion 1A of the back sheet 1 in a state where the adhesive sheet 10B enters the uneven portion 5A. It is possible to manufacture a non-contact electronic card or the like having a small card thickness and a uniform thickness which is resistant to peeling against stress and does not generate wrinkles due to curing of the sheets 10A and 10B.

(3) Third Embodiment FIG. 19 is a perspective view showing an example of a laminated structure of an electronic card 300 as a third embodiment. In this embodiment, the electronic component previously stored in the porous storage member is a back sheet 1
A frame member provided in the upper outer peripheral area, and the frame member and the storage member are bonded between the top sheet 5 and the back sheet 1 with the adhesive sheets 10A and 10B interposed therebetween. It is. Of course, the bonding surfaces of the back sheet 1 and the top sheet 5 shown in the wavy circle in FIG.
The concave and convex portions 1A and 5A having a depth d defined between them are formed.

The electronic card 300 shown in FIG. 19 has the same size as that of the second embodiment, and has a size of 3
It has a layered structure. A back sheet 1 is provided in the lowermost layer of the electronic card 300, and a frame member 2 is provided in an outer peripheral area of the back sheet 1 to prevent water and chemicals from entering from an end of the card. The back surface of the frame member 2 is attached by a first adhesive sheet 10A formed on the entire surface of the back sheet 1.

A chip storage sheet 3 is provided inside the frame member 2 as a porous storage member, and stores the electronic component 4 as described in the second embodiment. In this example, at least the frame member 2 is made of a resin material that is substantially equal to or thicker than the thickness of the electronic component 4 and has high water resistance and chemical resistance. In this example, the electronic component 4 is previously covered with a porous resin sheet, and the electronic component 4 is protected.

As the chip storage sheet 3, a woven or nonwoven resin sheet is used. For example, if the thickness of the frame member 2 is set to 500 μm and the electronic component 4 having a thickness of about 300 μm is protected above and below by a porous material having cushioning properties and the adhesive sheets 10A and 10B, the durability is further improved. The use of a porous resin sheet for the chip storage sheet 3 is based on the fact that the adhesive sheet 10 at the time of heat bonding is used.
This is because the impregnating properties of A and 10B are improved and the adhesiveness between the members becomes superior.

As in the second embodiment, a top sheet 5 is attached to the entire surface of the back sheet 1 including the frame member 2 so as to enclose the chip storage sheet 3. This frame member 2
Is adhered by a second adhesive sheet 10 </ b> B formed on the entire surface under the topsheet 5. Top sheet 5
The laminated structure of the back sheet 1 is the same as that of the second embodiment, and the members of the adhesive sheets 10A and 10B are the same as those of the second embodiment.
Since the third embodiment is the same as the first embodiment, the description thereof is omitted. Also, the components having the same reference numerals as those in the second embodiment have the same functions, and the description thereof will be omitted.

In this example, the frame member 2 has an IC chip 4
For example, after forming the frame member 2 having the opening 13 having substantially the same size as the outer peripheral region of the electronic component 4 on the back sheet 1 with the adhesive sheet 10A interposed therebetween, The chip housing sheet 3 housing the electronic component 4 is arranged inside the frame member 2. Thereafter, the topsheet 5 is bonded to the entire surface of the chip storage sheet 3 with the adhesive sheet 10.
By forming them with B interposed therebetween, an electronic card 300 having a three-layer structure shown in FIG. 19 is obtained. Of course, frame member 2
, A resin material having high water resistance and chemical resistance is used.

As described above, according to the electronic card 300 of the third embodiment, the uneven portion 1A having a depth d defined between 5 μm and 100 μm from the sheet thickness average surface is provided on the contact surface in advance. 20 has a laminated structure in which a porous chip storage sheet 3 shown in FIG. 20 is bonded between the back sheet 1 and the top sheet 5 with the adhesive sheets 10A and 10B interposed therebetween. In the outer peripheral area of the porous chip housing sheet 3 in which the electronic components 4 such as the IC chip 4A and the antenna body 4B are housed, the thickness is slightly larger than the thickness t of the IC chip 4A and high in water resistance and chemical resistance. A frame member 2 made of a resin material is provided.

Therefore, the adhesive sheet 10A is used as the top sheet 5
Each of the adhesive sheets 10A and 10B is cured in a state in which the adhesive sheet 10B has entered the uneven portion of the back sheet 1 in a state where the electronic sheet 200 has entered the uneven portion of the electronic card 200. To provide an electronic card 300 that is resistant to peeling and does not generate wrinkles due to curing of the adhesive sheets 10A and 10B. Furthermore, since the periphery of the chip storage sheet 3 storing the electronic components 4 shown in FIG. 21 can be strengthened by the frame member 2, the electronic card has excellent water resistance and chemical resistance, is resistant to peeling, and has a very thin card thickness. 300 can be provided.

Subsequently, referring to FIGS. 22 to 24,
A method for manufacturing the electronic card 300 according to the third embodiment will be described. FIGS. 22A to 22C show the electronic card 30.
FIG. 23 is a cross-sectional view showing an example (No. 1) of the forming process of No. 0 and FIG.
23A to 23C are cross-sectional views illustrating an example (No. 2) of the forming process. FIG. 24 is a top view showing a sheet-shaped chip storage sheet 3 which complements the chip storage sheet.

In this example, each of the members is in the form of a long sheet, and the chip storage sheet 3 disposed inside the frame member 2 is attached to the adhesive sheet 10 between the back sheet 1 and the top sheet 5.
A case will be described in which a card assembly 20 ′ bonded with A and 10B interposed is formed. Of course, back sheet 1
And the surface sheet 5 has a depth d defined in advance between 5 μm and 100 μm from the sheet thickness average surface on the surface to be bonded.
Is used in which the uneven portions 1A and 5A are formed.

First, in FIG. 22A, the adhesive sheet 10A is attached on the back sheet 1. First sheet on back sheet 1
And a writing layer 12 that can be written with a pen as in the second embodiment. Thereafter, in FIG. 22B, the chip storage sheet 3 is bonded onto the adhesive sheet 10A. The chip storage sheet 3 is made of a woven or nonwoven resin sheet. The chip storage sheet 3 shown in FIG. 24 includes electronic components 4 such as the IC chip 4A and the antenna 4B described in the second embodiment. Are stored in advance.

After forming the chip storage sheet 3 on the adhesive sheet 10A, the frame member 2 is bonded from above the chip storage sheet 3 in FIG. 22C. The frame member 2 and the back sheet 1 are bonded together by an adhesive sheet 10A that impregnates the chip storage sheet at the time of heat melting. The frame member 2 has an opening (not shown) large enough to accommodate the electronic components 4 one by one, for example, continuously in the transport direction. The size of the opening is equal to the size of the outer peripheral region of the electric component 4 and its thickness is substantially equal to the thickness of the electronic component 4.
Thicker than that. Moreover, the frame member 2 is formed using a water-resistant and chemical-resistant resin material. For example, a reactive hot-melt type, acrylic-type or epoxy-type hot-melt resin is formed into a sheet shape for the frame member 3,
The resin sheet having an opening punched out is used.

Thereafter, in FIG. 23A, the adhesive sheet 10B is attached to the entire surface of the frame member 2 and the chip storage sheet 3. As the adhesive sheets 10A and 10B, those obtained by forming a reactive hot melt resin in a thin sheet shape in advance are used. In this example, the adhesive sheets 10A and 10B having a lower softening point than the chip storage sheet 3 are used. Preferably, a thin sheet-shaped hot melt resin or a reactive hot melt resin having a softening point lower than that of the chip storage sheet 3 by 20 ° C. or more is used for the adhesive sheets 10A and 10B.

The reason for lowering the softening point of the chip storage sheet 3 by 20 ° C. or more with respect to the adhesive sheets 10 A and 10 B at this time is that the chip storage sheet 3 does not lose its shape as a container and the IC chip 4 To protect the device from thermal destruction. This is because if the softening points of the adhesive sheets 10A and 10B and the softening point of the chip storage sheet 3 are too close to each other, the chip storage sheet 3 may be damaged in the card bonding process or in the use state of the electronic card as described above. This is because the electronic card may be deformed and cause the unevenness of the electronic card.

That is, with respect to the adhesive sheets 10A and 10B, the softening point of the chip housing sheet 3 is 20 ° C. or more, preferably 95 ° C. or higher as compared with the softening point of the chip housing sheet 3. The temperature difference between the softening point of the adhesive sheets 10A and 10B and the softening point of the chip housing sheet 3 may be provided to such an extent that the temperature can be suppressed below the breaking temperature of the IC chip (for example, the melting temperature of the solder). It is based on ideas.

In this example, the reason why the chip storage sheet 3 is first formed on the back sheet 1 is to make the long sheet-shaped top sheet 5 as flat as possible. That is, when the frame member 2 is formed on the back sheet 1 first, since the chip storage sheet 3 is formed in a long sheet shape, an excess portion of the chip storage sheet 3 covers the frame member 2. . Therefore, although slightly, the chip storage sheet 3 remains in the pressed frame member 2 in the thickness together with the adhesive sheet 10B. This uneven thickness prevents flattening of the topsheet 5. By bringing this to the back side of the frame member 2, the topsheet 5 can be flattened.

Then, in FIG. 23B, the adhesive sheet 1
The top sheet 5 is formed on OB. At this time, the introduction angle θ of the top sheet 5 is set in a range of 45 ° ≦ θ ≦ 120 °. For example, the top sheet 5 is formed on the adhesive sheet 10B at an introduction angle of θ = 60 °. The front sheet 5 is provided in advance with the electronic card 300 in the same manner as in the second embodiment.
The image display information for the user is printed. In this example, the topsheet 5 has a long sheet shape. An alignment mark p0 is printed on the end of the topsheet 5 in advance. The frame member 2 and the chip storage sheet 3
When the topsheet 5 is formed thereon, a foamable urethane sheet (not shown) may be formed inside the frame member 2, that is, between the storage area for the electronic component 4 and the topsheet 5. The urethane sheet can further protect the top sheet 5 and the like of the electronic component 4.

Thereafter, in FIG. 23C, when a heating and pressing treatment is performed in the same manner as in the conventional method, a long sheet-shaped card assembly 20 'shown in FIG. 22 is completed. The bonding conditions are almost the same as in the second embodiment. In this example, the card assembly 20 ′ is cut from the frame member 2 to form one unit of an electronic card sheet.

As described above, according to the method of manufacturing the electronic card 300 according to the third embodiment, the distance between the contact surface and the average sheet thickness is set to 5 μm to 100 μm, preferably 10 μm to 30 μm. Sheet 1 and top sheet 5 on which uneven portions 1A and 5A having a depth d are formed.
And the chip storage sheet 3 are bonded together with an adhesive member 10 interposed therebetween.

Accordingly, the adhesive sheet 10A, 10B and the porous member by the heat melting and pressurization are perfectly integrated in the part on the electronic component 4 side, and the adhesive sheet 10A on the opposite side is integrated.
Is the top sheet 5 together with the porous member of the chip storage sheet 3.
Each of the adhesive sheets 10A and 10B is cured while the adhesive sheet 10B enters the uneven portion of the back sheet 1 together with the porous member. It is possible to manufacture a non-contact type electronic card or the like having a small card thickness and a uniform thickness which is resistant to peeling against other stress and does not generate wrinkles due to curing of the adhesive sheets 10A and 10B.

In each of the embodiments described above, the case where the uneven portion is formed on the surface to be bonded of the top sheet 5 and the back sheet 1 has been described, but the uneven portion is formed on the side in contact with the top sheet 5 and the back sheet 1. May be used. At this time, the depth of the uneven portion of the adhesive sheet is specified to be between 5 μm and 100 μm from the sheet thickness average surface, preferably 10 μm to 30 μm. by this,
An electronic card that is more resistant to peeling and does not generate wrinkles can be manufactured.

[0097]

As described above, according to the card of the present invention, the adhesive member is interposed between the first member and the second member, each of which has an uneven surface formed on the contact surface in advance. It has a laminated structure that is bonded together.

With this configuration, the adhesive member is cured in a state where the adhesive member has entered the unevenness of the first and second members, so that the adhesive member is resistant to peeling against bending of the card and other stress, and the curing of the adhesive member And a card that does not cause wrinkles.

According to the card manufacturing method of the present invention, irregularities are formed on the contact surfaces of the first and second members for the card in advance, and then the first member and the second member are joined together. They are bonded together with an adhesive member interposed therebetween.

With this configuration, the adhesive member can be cured while the adhesive member has entered the unevenness of the first and second members. Therefore, it is possible to manufacture a card that is resistant to peeling due to bending of the card and other stresses and does not generate wrinkles. As a result, the card thickness is thin,
Moreover, a flat non-contact IC card or the like can be manufactured.

The present invention is very suitable when applied to a non-contact type IC card such as a cash card, an employee card with a face photograph, an employee card, a member card, a student card, an alien registration card, and various driver's licenses. It is.

[Brief description of the drawings]

FIG. 1 is an ID card 1 according to a first embodiment of the present invention.
It is a perspective view which shows the example of lamination structure of 00.

FIG. 2 is a cross-sectional view showing a configuration example of an uneven portion 5A of a topsheet 5.

FIG. 3 is a cross-sectional view illustrating a configuration example of another uneven portion 5B of the topsheet 5.

FIG. 4 is a cross-sectional view illustrating a configuration example of another uneven portion 5C of the topsheet 5;

FIG. 5 is a cross-sectional view illustrating a configuration example of a water spray device 41.

FIG. 6 is a cross-sectional view illustrating a configuration example of another water spray device 41 ′.

FIG. 7 is a cross-sectional view illustrating a manufacturing example of the ID card 100 according to the first embodiment.

FIG. 8 is an enlarged cross-sectional view showing an example of bonding the back sheet 1 and the top sheet 5.

FIG. 9 is a perspective view illustrating an example of a laminated structure of an electronic card 200 according to a second embodiment.

FIG. 10 is a cross-sectional view showing an example of a laminated structure of the topsheet 5.

FIG. 11 is a cross-sectional view showing an example of a laminated structure of the back sheet 1.

FIG. 12 is a diagram showing a configuration example of a cross section of the electronic card 200.

FIGS. 13A to 13C are cross-sectional views illustrating an example (No. 1) of a forming process of the electronic card 200 according to the second embodiment.

14A and 14B are cross-sectional views illustrating an example (No. 2) of a forming process of the electronic card 200 according to the second embodiment.

FIG. 15 is a top view showing a printing example of the back sheet 1;

FIG. 16 is a top view showing a supply example (part 1) of the electronic component 4;

FIG. 17 is a top view showing a supply example (part 2) of the electronic component 4;

FIG. 18 is a top view showing a printing example of the top sheet 5.

FIG. 19 is a perspective view showing an example of a laminated structure of an electronic card 300 as a third embodiment.

FIG. 20 is a sectional view showing an example of the relationship between the frame member 2 of the electronic card 300 and the thickness of the IC chip 4A.

21 is a top view showing a configuration example of a frame member 2 surrounding the electronic component 4. FIG.

FIGS. 22A to 22C are cross-sectional views illustrating an example (part 1) of a process of forming an electronic card 300 according to the third embodiment.

FIGS. 23A to 23C are cross-sectional views illustrating an example (part 2) of a forming process of the electronic card 300 according to the third embodiment.

FIG. 24 is a top view showing a configuration example of the long sheet-shaped chip storage sheet 3.

[Description of Signs] 1 Back sheet (first member) 2 Frame member 3 Chip storage sheet (storage member) 4 Electronic component 4A IC chip 4B Antenna body 5 Surface sheet (second member) 10, 10A, 10B Adhesive sheet (Thin sheet adhesive member) 20, 20 'Card assembly 100 ID card 200, 300 Electronic card

Claims (18)

[Claims] 1. A sheet-like first member for a card, and a sheet-like second member, wherein at least the first member and the first member, each having an uneven portion formed on the contact surface side in advance. A card having a laminated structure in which an adhesive member is interposed between the second member and the second member. 2. The depth of the uneven portion of the first and second members is defined between 5 μm and 100 μm from the sheet thickness average surface when the rubber elasticity of the sheet itself is 40 ° to 75 °. The card according to claim 1, wherein: 3. The card according to claim 1, wherein the adhesive member is formed of a hot-melt resin or a reactive hot-melt resin formed in a thin sheet in advance. 4. The card according to claim 1, wherein an electronic component for a card is sealed between the first member and the second member. 5. The electronic device according to claim 4, wherein the electronic component is an IC chip for electrically storing information of the card user, and a coil-shaped antenna connected to the IC chip. card. 6. The card according to claim 4, wherein the electronic component is stored in a porous storage member. 7. A step of forming irregularities on the side of the first member for card to be adhered, a step of forming irregularities on the side of the second member for card to be adhered, and And bonding the first member and the second member together with an adhesive member interposed between the first member and the second member on which the first member is formed. Card manufacturing method. 8. The depth of the concave and convex portions of the first and second members is defined between 5 μm and 100 μm from the sheet thickness average plane when the rubber elasticity of the sheet itself is 40 ° to 75 °. The method for manufacturing a card according to claim 7, wherein 9. A second member for a surface to be bonded of the first member.
8. The card manufacturing method according to claim 7, wherein when the introduction angle of the member is defined as θ, the introduction angle θ is defined in a range of 45 ° ≦ θ ≦ 120 °. 10. The card manufacturing method according to claim 7, wherein the adhesive member is formed of a hot-melt resin or a reactive hot-melt resin formed in a thin sheet in advance. 11. The method according to claim 7, wherein an electronic component for a card is sealed between the first member and the second member. 12. The device according to claim 7, wherein the electronic component is an IC chip for electrically storing information of the card user, and a coil-shaped antenna connected to the IC chip. Card manufacturing method. 13. The card manufacturing method according to claim 7, wherein the electronic component is stored in a porous storage member. 14. The card manufacturing method according to claim 13, wherein a woven, non-woven, or porous resin sheet is used for the storage member. 15. The method according to claim 7, wherein the first member is a printing member on which image display information is printed in a predetermined area in advance. 16. The method according to claim 15, wherein the printing member has an image receiving layer for forming a photograph of the face of the card user. 17. The method for manufacturing a card according to claim 7, wherein a thin sheet-like adhesive member having an uneven portion on a surface in contact with the first and second members is used. . 18. The depth of the uneven portion of the adhesive member, when the rubber elasticity of the adhesive sheet itself is 40 ° to 75 °,
18. The method for manufacturing a card according to claim 17, wherein the thickness is defined between 5 μm and 100 μm from the sheet thickness average surface.