JPH11309969A - Electronic card and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To physically and chemically reinforce the peripheral part of an electronic part for a card. SOLUTION: This electronic card is equipped with a back face sheet 1, a frame member 2 provided on the outer peripheral area of the back face sheet 1, a porous chip storage sheet 3 formed inside the frame member 11 of the back face sheet 1, storing an electronic part 4 and a front face sheet 5 attached to the entire surface of the back face sheet 1 through an adhesive member, sealing the chip storage sheet 3. The frame member 2 is at least almost equal to the thickness of the electronic part 4 and is made of a water-resistant and a chemical-resistant resin material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention is applicable to non-contact type IC cards such as cash cards, employee ID cards, employee ID cards, employee ID cards, student ID cards, alien registration IDs and various driver's licenses. And a method for manufacturing the same.

More specifically, a frame member made of a water-resistant and chemical-resistant resin material is provided on an outer peripheral region of an electronic component on a member for a substrate, and the peripheral edge of the housing member is physically and chemically strengthened. It is made possible.

[0003]

2. Description of the Related Art In recent years, an IC card in which an IC chip or an antenna is sealed in a resin card has been proposed. Since this type of IC card is a non-contact type, it has no information input / output terminals. Therefore, the information is used by converting it into a specific modulated radio wave, receiving it with an antenna, demodulating it with an IC chip, writing it into a memory or the like, or reading it out.

[0004] The non-contact type IC card is disclosed in, for example, Japanese Patent Application Laid-Open No. 9-275184, which is a technical document, as "Information Carrier and its Manufacturing Method".
According to this technical document, an electronic component such as an IC chip or an antenna is housed in a woven reinforcing member (hereinafter also referred to as a housing member), and is bonded with an upper and lower cover sheet via an adhesive member. An IC card is formed. Thereby, the IC card itself can be formed thin.

[0005] In this type of IC card, a printed member is used as a surface member, and for example, "XXX employee ID", "name", "issue date", etc. are used for the field of use of the card. Such image display information is often printed. The printing member is provided with an image receiving layer for forming a photograph of the face of the user of the card, and a material such as a sublimation dye or a diffusion dye is used for the image receiving layer. A face photograph or the like is formed on the image receiving layer using a thermal head or an ink jet means. The back sheet serving as a member for the substrate of the IC card may be provided with a writing layer or the like that can be written with a pen.

Accordingly, when mass-producing cash cards, employee cards, employee cards, membership cards, student cards, alien registration cards, various driver's licenses, and the like, a member for the surface on which image display information is printed. In many cases, a storage member for storing electronic components and a substrate member having a writing layer are used in the form of a long sheet.

[0007] The surface member formed into a long sheet shape,
The accommodating member and the member for the substrate are heated and bonded by a vacuum hot press or the like with an adhesive member interposed therebetween. The long sheet-shaped card aggregate after the heat bonding is cut into one unit of card aggregate. Thereafter, when the card assembly is completely cured, IC cards are punched out one by one from the card assembly by a punching device or the like.

[0008]

Generally, this kind of IC
Cards are required to have weather resistance and durability. In other words, even after many years, the electronic components in the IC card do not deteriorate, and even if the card is accidentally washed with clothes or wet, the IC card does not cause any trouble. Function must be able to continue.

[0009] Therefore, even after several years of use, the end of the card is prevented from being broken or peeled off, and water enters the inside of the card from the end face, or other chemicals enter the inside of the card. Need to be eliminated.

However, the thinning of the IC card and the
With the demand for mass production of C cards, it is difficult to select a resin to be impregnated at the end of the card, and there is a problem that it is difficult to physically and chemically strengthen the periphery of the storage member that stores the electronic components. .

It is an object of the present invention to solve the above-mentioned problems, and to provide an electronic card and a method of manufacturing the electronic card in which the peripheral portion of the electronic component can be physically and chemically strengthened. .

[0012]

In order to solve the above-mentioned problems, an electronic card according to the present invention comprises a substrate, a frame member provided in an outer peripheral region on the substrate, and A porous thin sheet-shaped storage member provided inside the frame member, and a surface member sealed and sealed with the storage member with an adhesive member interposed on the entire surface of the substrate,
At least the frame member is made of a water-resistant and chemical-resistant resin material.

According to the electronic card of the present invention, for example,
Since the periphery of the storage member storing the electronic components can be reinforced by a water-resistant and chemical-resistant frame member, an electronic card having excellent water absorption and corrosion resistance, strong peeling, and extremely thin card thickness is provided. can do.

A first method for manufacturing an electronic card according to the present invention comprises:
Forming a frame member having an opening having substantially the same size as the outer peripheral region of the electronic component on the substrate member; and storing the electronic component inside the frame member formed on the substrate member. A step of disposing a leaf-shaped storage member, and a step of forming a surface member on the entire surface of the substrate member on which the storage member is disposed, wherein the frame member includes a water-resistant and chemical-resistant resin. It is characterized by using a material.

According to the first method of manufacturing an electronic card according to the present invention, for example, the outer peripheral region of the sheet-like storage member storing the electronic component has a thickness substantially equal to or greater than the thickness of the electronic component. A frame member made of a water-resistant and chemical-resistant resin material is formed. Thereafter, a thermosetting resin is used as an adhesive member on the entire surface of the substrate member including the frame member and the storage member, and a surface member is used. Are pasted together.

Therefore, since the peripheral portion of the electronic component can be strengthened by the frame member, an electronic card having excellent water absorption and corrosion resistance, strong peeling, and extremely small card thickness can be manufactured.

According to a second manufacturing method of the present invention, a long sheet-like frame member having an opening having substantially the same size as the outer peripheral region of an electronic component is formed on a long sheet-like substrate member. A step of arranging a sheet-like storage member storing electronic components inside a frame member formed on the substrate member, and a step of elongating the entire surface of the substrate member on which the storage member is disposed. Forming a sheet-like surface member, and using a water-resistant and chemical-resistant resin material for the frame member.

According to the second method of manufacturing an electronic card of the present invention, for example, the outer peripheral region of the long sheet-like storage member storing the electronic components is substantially equal to or more than the thickness of the electronic components. A frame member made of a water-resistant and chemical-resistant resin material having a thickness is formed, and thereafter, the thermosetting resin is used as an adhesive member on the entire surface of the substrate member including the frame member and the storage member. Are bonded.

Therefore, since the peripheral portion of the electronic component can be strengthened by the frame member, it is possible to manufacture a long sheet-shaped electronic card which is excellent in water absorption and corrosion resistance, resistant to peeling and extremely thin. Can be.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic card and a method of manufacturing the same according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing a configuration example of an electronic card 100 according to each embodiment of the present invention in a stacking direction. FIG. 2 is a cross-sectional view showing a laminated structure of the topsheet 5.

In the present embodiment, a frame member made of a water-resistant and chemical-resistant resin material is provided on the substrate member in the outer peripheral region of the electronic component on the substrate, and the peripheral edge of the housing member is provided. It can be physically and chemically strengthened.

The electronic card 100 shown in FIG. 1 has a vertical length of about 6 cm, a horizontal length of about 9 cm, and a thickness of 0.5 cm.
It has a thickness of about 1.0 mm, and has a three-layer structure when roughly divided except for an adhesive member.

On the lowermost layer of the electronic card 100, a back sheet 1 having a thickness of about 100 μm as a substrate is provided. The back sheet 1 further has a writing layer (not shown) that can be written with a pen. A frame member 2 is provided in an outer peripheral area on the back sheet 1 to prevent intrusion of water or chemicals from the outside.

A chip storage sheet 3 is provided inside the frame member 2 as a porous storage member, and the electronic components 4 are stored in advance. Generally, IC chip 4A is 200-30
It is formed as thin as about 0 μm. The antenna 4B has the same thickness. In this example, at least the frame member 2 is made of a resin material that is substantially equal to the thickness of the electronic component 4 or about twice as thick as the electronic component 4 and has water resistance and chemical resistance.

Further, a woven or nonwoven resin sheet is used for the porous storage member. If the frame member 2 is, for example, 500 μm and is protected by the electronic component 4 and its upper and lower cushioning properties or a porous body or an adhesive member, the durability is further improved.

The reason why the porous resin sheet is used for the housing member is that the impregnating property of the adhesive member is improved and the adhesive property between the members becomes superior. The electronic component 4 electrically stores information relating to the user of the electronic card 100.
C-shaped chip 4A and coil-shaped antenna 4B connected to IC chip 4A. The IC chip 4A is a memory only or a microcomputer in addition to the memory. It may include a capacitor.

Since the electronic card 100 is of a non-contact type, it does not have any information input / output terminals. The information is converted into a specific modulated radio wave, received by the antenna 4B, demodulated by an IC chip, written into a memory or the like, or read therefrom. In a method used for a normal non-contact type IC card, the driving power source can take in external electromagnetic energy into the antenna 4B. For example, a DC power supply is obtained by rectifying an electromotive force generated by electromagnetic induction. In this example, the electronic component 4 is previously covered with a porous resin sheet, and the electronic component 4 is protected. Of course, in addition to this, it is conceivable to take in electricity from external high-frequency electromagnetic energy into the antenna or other objects.

A surface sheet 5 having a thickness of about 100 μm as a surface member is bonded to the entire surface of the back sheet 1 including the frame member 2 with an adhesive member interposed therebetween so as to enclose the chip storage sheet 3. Is done. The topsheet 5 is formed, for example, by stacking a cushion layer 52, an anchor layer 53, an image receiving layer 54, and an upper layer 55 on a film support 51 shown in FIG. The adhesive member 10 is applied to the film support 51 side.

The film support 51 is preferably formed of a resin such as polyethylene terephthalate (PET) or polypropylene (PP). In particular, when a biaxially stretched resin is used, a thin topsheet 5 having excellent strength can be formed. The film thickness of the film support 51 is, for example, 12 μm or more (particularly 25 μm) when a biaxially stretched polyethylene terephthalate resin is used.
It is preferably 300 μm or less (particularly 250 μm).

The cushion layer 52 is provided to alleviate the influence of the unevenness of the IC chip 4A when the film support 51 has a structure containing bubbles or is made of a flexible material. In addition, the cushion layer 52 has a function of improving the contact of the thermal head during the image display processing.

[0031] Preferably the tensile modulus is as a cushion layer 52 (ASTM D790) is 20 kgf / mm ² or more, and is preferably 200 kgf / mm ² or less. The thickness of the cushion layer 52 is preferably 2 μm or more (particularly 5 μm) from the viewpoint of the cushion effect, and is preferably 200 μm or less (particularly 50 μm) from the viewpoint of the overall thickness and curl suppression.

As a member forming the cushion layer 52, for example, polyethylene resin, polypropylene resin,
Polybutadiene resin, ethylene-vinyl acetate copolymer resin, ethylene-ethyl acrylate copolymer resin, styrene-butadiene-styrene block copolymer resin, styrene-isoprene-styrene block copolymer resin, styrene-ethylene-butadiene- Polyolefin resins such as a styrene block copolymer resin and a styrene-hydrogenated isoprene-styrene block copolymer resin are preferred because of their flexibility.

The top sheet 5 is a printing member, and image display information is printed on a predetermined area on the front surface in advance. The image display information is a field in which the electronic card 100 is used, for example, “XXX employee ID”, “name”, “issue date”, and the like. The printing member is provided with an image receiving layer 54 for forming a photograph of the face of the user of the card 100.
The image receiving layer 54 is made of a material such as a sublimation dye or a diffusion dye.
A face photograph or the like is formed by fixing the image receiving layer 54 by trapping these dyes by applying heat by a thermal head.

As a material of the image receiving layer 54, a polymer material such as a polyester resin, a polyvinyl chloride resin, a polyvinyl acetal resin, a polyvinyl butyral resin, an epoxy resin, and an acrylic resin can be used. Among them, the use of a polyester-based resin is preferable from the viewpoint of the environment. The image receiving layer 54 is formed by powdering these resins, dissolving them in a solvent such as isocyanate, coating them with a gravure coater or the like, drying them, and then volatilizing the solvents.

The layer adjacent to the image receiving layer 54, for example, the film support 51 or the cushion layer 52 is preferably made of a resin mixed with (containing) a white pigment in order to enhance the image formed on the image receiving layer 54. The present invention is not limited to this. In order to increase the whiteness, a layer provided with voids may be used. The voids provide cushioning. Preferred examples of the white pigment include, but are not limited to, titanium oxide, barium sulfate, and calcium carbonate.

FIG. 3 is a cross-sectional view showing a laminated structure of the back sheet 1. The back sheet 1 of this example has a film support 11
It has a writing layer 12 below. The writing layer 12 is obtained by diffusing calcium carbonate and silica fine particles into a polyester emulsion. Similarly to the image receiving layer 54 of the topsheet 5, the writing layer 12 is formed by dissolving the above-described material with a solvent, applying the solution with a gravure coater or the like, and then drying and evaporating the solvent. The adhesive member 10 is applied on a support.

In this example, a thermosetting resin or a reactive hot melt resin is used for the adhesive member 10. As the thermosetting resin, a gel epoxy resin generally called a B-stage epoxy is used.

As the reactive hot melt resin, Hen
Polyamide-based hot melt resins such as macromelt series manufactured by kel, Calflex TR and Quinton series manufactured by Shell Chemical Co., Ltd., Tufprene manufactured by Asahi Kasei Corporation, Firestone Synthetic Rubber
Phil and Tuffden from ber and Latex
Siprene 400 manufactured by Lips Petroleum
Thermoreversible elastomer type reactive hot-melt resin such as a series is preferable, and also, Sumitics manufactured by Sumitomo Chemical Co., Ltd., Vistax manufactured by Chisso Petrochemical Co., Yucatak manufactured by Mitsubishi Yuka, Macromelt manufactured by Henkel, Preferred are polyolefin-based reactive hot melt resins such as Tuffmer manufactured by Mitsui Petrochemical Co., APAO manufactured by Ube Lexen, Eastman Bond manufactured by Eastman Chemical Co., and A-FAX manufactured by Hercules, and Sumitomo 3M Limited. TE030 and TE100 manufactured by Hitachi Chemical Co., Ltd., Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., Bondmaster 170 series manufactured by Kanebo NSC, Henkel
A reactive hot-melt resin such as Macroplast QR3460 manufactured by Co., Ltd. is preferable, and a hot-melt resin of an ethylene / vinyl acetate copolymer system or a reactive hot-melt resin of a polyester system is preferable. The reactive hot melt resin has a property of being cured by absorbing moisture after bonding. Compared with a normal hot melt resin, the reactive hot melt resin has an advantage that the stability is high at a high temperature of 80 ° C. or 90 ° C.

In this example, the frame member 2 has an IC chip 4
For example, a frame member 2 having an opening having substantially the same size as the outer peripheral region of the electronic component 4 is formed on the back sheet 1 and then formed on the back sheet 1. Inside the frame member 2, a sheet-like chip storage sheet 3 containing the electronic component 4 is arranged. Thereafter, when the top sheet 5 is formed on the entire surface of the back sheet 1 on which the chip storage sheet 3 is arranged, the electronic card 100 shown in FIG. 4 is obtained. Of course, a water-resistant and chemical-resistant resin material is used for the frame member 2.

As described above, according to the electronic card 100 of the present embodiment, the outer peripheral area of the porous chip storage sheet 3 in which the electronic components 4 such as the IC chip 4A and the antenna 4B shown in FIG. The thickness t of the IC chip 4A
A frame member 2 which is substantially equal to or thicker than the above and is made of a water-resistant and chemical-resistant resin material is provided. Therefore, the peripheral portion of the chip storage sheet 3 containing the electronic components 4 shown in FIG. 5 can be strengthened by the frame member 2, so that the electronic device has excellent water absorption and corrosion resistance, is strong in peeling, and has a very thin card thickness. A card 100 can be provided.

Next, an example of the configuration of an electronic card manufacturing apparatus 200 for manufacturing the electronic card 100 will be described with reference to FIGS.

In FIG. 6, an electronic card manufacturing apparatus 200 according to the present invention includes a back sheet supply section 6 around which a long sheet-like back sheet 1 for forming the electronic card 100 is wound, and a long sheet-like frame. Frame member supply unit 7 wound with member 2
And a chip sheet supply unit 8 in which the porous chip storage sheet 3 is similarly wound, and a top sheet supply unit 9 in which the long sheet-like top sheet 5 is wound. Supply units 6 to
9 is provided with sending shafts 6A to 9A. Each supply unit 6
Driven rollers 19A to 19D and the like are provided on the downstream side of to 9 to change the conveying direction of the back sheet 1, the frame member 2, the top sheet 5, and the like.

In this example, an adhesive supply device 14 is provided downstream of the chip sheet supply section 8, and the surface of the chip storage sheet 3 is impregnated with a thermosetting epoxy resin as an adhesive member 10A. An adhesive supply device 15 is provided downstream of the frame member supply unit 7, and a thermosetting reactive hot melt resin is applied as an adhesive member 10B to the surface of the sheet-shaped frame member 2. Both resins are extruded and applied to the sheet-like frame member 2, the chip storage sheet 3, and the like by using a die called an extrusion and pumping out by a pump. Adhesive supply device 14
May also serve as the adhesive supply device 15 for the frame member. Further, an adhesive supply device 14 for a chip sheet may be provided near the adhesive supply device 15. This is because the chip storage sheet 3 is inserted into the opening of the frame member 2 and the adhesive member 10
A, 10B is better to apply these adhesive members 10
This is because there is no need to worry about sagging of A and 10B.

Downstream of these four back sheet supply units 6, frame member supply unit 7, chip sheet supply unit 8, and front sheet supply unit 9, drive rollers 16 for guiding and positioning are provided.
Are provided, and the back sheet 1, the sheet-like frame member 2, the chip storage sheet 3, and the top sheet 5 are aligned based on the pre-printed alignment marks p0, and are guided in a predetermined direction. This back sheet 1 and top sheet 5
The chip housing sheet 3 is sealed inside the frame member 2 with the adhesive members 10A and 10B interposed therebetween.

A vacuum heat press 17 is provided downstream of the drive roller 16 to apply heat and pressure to the card assembly 20 guided by the drive roller 16. The vacuum heat press device 17 has flat upper and lower press portions 17A and 17B which are arranged opposite to each other on the upper and lower sides of the transport path, and a predetermined pressure is applied from above and below the card assembly 20. Therefore, the upper and lower press sections 17
A and 17B can move in the direction in which they are separated from each other. The upper and lower press sections 17A, 17B
Inside, an electric heater 18 is provided.
The inner electric heater 18 is not shown), and heats the card assembly 20 to a predetermined temperature (see FIG. 7 for the electric heater 18).

In this example, although depending on the materials of the adhesive members 10A and 10B, the back sheet 1 and the top sheet 5, the heating temperature is about 60.degree.
On the order of seconds. The device for heating and bonding the card assembly 20 is not limited to the vacuum heat press device 17, but may be a heat roller device. Vacuum heat press 17
Is a so-called semi-dry state, which is not completely cured.

A card sheet conveying belt 30 is provided downstream of the vacuum hot pressing device 17 to transfer the card assembly 20 heated and bonded by the vacuum hot pressing device 17 in a predetermined conveying direction, in this example, a cutting device. It is conveyed to 40.
At this time, the moving distance of the card sheet conveying belt 30 is equal to the length L1 of the vacuum heat press device 17 in the conveying direction. A cutting device 40 is provided downstream of the card sheet transport belt 30.
Are provided, and the card assembly 20 is cut for each unit. As the cutting device 40, a vertical push-type cutter or a rotary cutter is used.

Next, a control method of the electronic card manufacturing apparatus 200 will be described with reference to FIG. FIG. 7 is a block diagram illustrating an outline of an example of a control system of the electronic card manufacturing apparatus 200.

In this example, an alignment mark p0 formed in advance on the card assembly 20 is detected, and the card sheet transport belt 30 is controlled based on the detection. In this control system, a delivery detection sensor 71 is provided on the vacuum heat press device 17 side, and the alignment mark p0 (shown in FIG. 13) of the card assembly 20 is detected at the card delivery position p1. The sensor 71 outputs a card sending position detection signal S1. An arrival detection sensor 72 is provided on the cutting device 40 side, and the alignment mark p0 of the card assembly 20 is detected at the card arrival position p2. The sensor 72 outputs a card arrival detection signal S2.

The output stages of these sensors 71 and 72 include:
The control device 70 is connected, and the card sheet transport belt 30 is controlled based on the two detection signals S1 and S2. For example, the control device 70 controls the card sheet transport belt 30 to operate intermittently between the card delivery position p1 and the card arrival position p2. If the topsheet 5 is long and non-stretchable, only one of the sensors 71 and 72 can be used.

In this example, in order to form the electronic card 100, the back sheet 1 is fed from the back sheet supply unit 6 to the drive roller 16, and the chip storage sheet 3 is fed from the chip sheet supply unit 8 to the drive roller 16. The sheet frame member 2 is fed from the member supply unit 7 to the drive roller 16, and the top sheet 5 is fed from the top sheet supply unit 9 to the drive roller 16. Thereafter, when the drive control signal S3 is output from the control device 70 to the drive roller 16, the drive roller 1
6 rotates. Before or after this, an adhesive control signal S4A is output from the control device 70 to the adhesive supply device 14, and the surface of the chip housing sheet 3 is impregnated with a thermosetting epoxy resin as the adhesive member 10A.

Similarly, an adhesive control signal S4B is output from the control device 70 to the adhesive supply device 15, and a thermosetting reactive hot melt resin is applied to the surface of the sheet-like frame member 2 as the adhesive member 10B ( Coating).

Card assembly 2 impregnated with these resins
0 is guided to the vacuum heat press device 17 by the drive roller 16, and the control device 70 outputs a heating bonding control signal S 5 to the vacuum heat press device 17. In the vacuum heat press device 17, the temperature and the press pressure of the upper press portion 17A and the lower press portion 17B are controlled to be constant. First card assembly 2
The leading end of the "0" is made to protrude from the vacuum heat press device 17. When the first heat bonding is completed, an end signal S6 is output from the vacuum heat press device 17 to the control device 70.
This tip is detected by the sensor 71. The card sending position detection signal S1 by the sensor 71 is obtained by detecting the alignment mark p1.

A belt transport control signal S7 is output to the card sheet transport belt 30 from the controller 70 which has received the card sending position detection signal S1. The card sheet transport belt 30 starts to move by placing the card assembly 20 on the basis of the belt transport control signal S7, and the card assembly 20 after the first heat bonding is transported from the vacuum heat press device 17 to the cutting device 40. You. At this time, the drive rollers 16 also cooperate to move the card assembly 20 downstream. At this stage, the card assembly 20 has not been cut.

When the first card assembly 20 is conveyed from the vacuum hot press device 17 to the cutting device 40, the sensor 72
Thus, the arrival of the card assembly 20 is detected. The sensor 72 outputs a card delivery arrival detection signal S2 to the control device 70. Card delivery arrival detection signal S
The belt transport control signal S7 is output from the control device 70 to which the 2 has been input to the card sheet transport belt 30, and the card sheet transport belt 30 stops. Although not shown, a fan is provided on the downstream side of the vacuum hot press device 17, and is cooled to, for example, about 50 ° C. by wind from the fan until the card assembly 20 discharged from the vacuum hot press device 17 is cut. It is.

On the other hand, the second heat bonding is performed in the vacuum heat press device 17. When the second heat bonding is completed, the vacuum heat press device 17 outputs an end signal S6 to the control device 70. After that, a belt transport control signal S7 is output to the card sheet transport belt 30 from the control device 70 which has received the card sending position detection signal S1 from the sensor 71. The card sheet transport belt 30 starts moving the card assembly 20 by the belt transport control signal S7, and the card assembly 20 after the second heating and bonding is transported from the vacuum heat press device 17 to the cutting device 40.

At this time, the drive roller 16 also moves the card assembly 20 to the downstream side in cooperation. At this stage, the card assembly 20 can be cut. Therefore, when the second card assembly 20 is transported from the vacuum heat press device 17 to the cutting device 40, the sensor 72 detects that the card assembly 20 has arrived. A card arrival detection signal S2 is output from the sensor 72 to the control device 70.
The controller 70 that has received the card arrival detection signal S2 outputs the belt transport control signal S7 to the card sheet transport belt 30, and the card sheet transport belt 30 stops.

At the same time, a cutting control signal S8 is output to the cutting device 40. In the cutting device 40 that has received the cutting control signal S8, the long sheet-shaped card assembly 20
The unit is cut into electronic card sheets. Similar operations are repeated for the third and subsequent times. Thereby, a plurality of electronic card sheets can be obtained from the long sheet-shaped card assembly 20.

In the electronic card manufacturing apparatus 200 of this example,
Although the case where the long sheet-shaped chip storage sheet 3 is used has been described, the present invention is not limited to this. For example,
An apparatus may be used in which sheet-like storage members are dropped one by one into the opening of the frame member 2 shown in FIG.

In this case, the storage members are temporarily fixed one by one to the long sheet-shaped common sheet, and the storage members are separated from the common sheet at the openings thereof and dropped and disposed in the frame member 2. It is necessary to have a mechanism. This also
Since the periphery of the sheet-like chip storage sheet can be reinforced by the frame member 2, the electronic card 1 has excellent water absorption and corrosion resistance, is strong in peeling, and has a very small card thickness.
00 can be provided.

Next, three manufacturing methods of the electronic card 100 according to the present embodiment will be described with reference to FIGS.

(1) First Embodiment FIGS. 8A to 8C show an electronic card 1 according to a first embodiment.
FIG. 14 is a cross-sectional view of an example of a forming step showing the method of manufacturing 00. FIG.
FIG. 13 to FIG. 13 are top views showing the sheet-like members that complement it. In this example, a sheet-like card in which a chip storage sheet 3 arranged inside a sheet-like frame member 2 is selectively bonded between a back sheet 1 and a top sheet 5 with adhesive members 10A and 10B interposed therebetween. The case where the aggregate 20 is formed will be described.

In this example, the back sheet 1 is wound around the delivery shaft 6A of the back sheet supply section 6 shown in FIG. An electronic component 4 having a predetermined size is stored in advance in a long sheet-shaped chip storage sheet 3 made of a porous storage member, and the chip storage sheet 3 is stored in a chip sheet supply unit 8 shown in FIG.
Is wound around the delivery shaft 8A. Further, a sheet-like frame member 2 in which an opening 13 having substantially the same size as the outer peripheral region of the electronic component 4 is formed in advance is wound around the delivery shaft 7A of the frame member supply unit 7. The topsheet 5 is wound around a delivery shaft 9A of the topsheet supply unit 9 shown in FIG. It is assumed that these members are prepared.

First, in FIG. 8A, the chip storage sheet 3 fed from the chip sheet supply unit 8 is bonded onto the back sheet 1 fed from the back sheet supply unit 6. The surface of the chip storage sheet 3 is impregnated with a thermosetting epoxy resin as an adhesive member 10A. The back sheet 1 has a writing layer 12 shown in FIG. 9 that can be written with a pen. An alignment mark p0 is also printed on the end of the back sheet 1 in advance. This alignment mark p0
Are formed for each card area. The alignment mark p0 may be a black line or block having a low reflectance that can be detected by the optical sensor, but may be a magnetic mark, a slit, or a hole.

The chip storage sheet 3 is made of a woven or non-woven resin sheet. The chip storage sheet 3 shown in FIG. 10 includes an IC chip 4A and an antenna 4B in advance.
And other electronic components 4 are stored. The electronic component 4 includes a chip capacitor and the like. Electronic component thickness is 45
It is about 0 μm. The thickness of the IC chip 4A is 300 μm
And the thickness of the antenna 4B is about 300 μm. For example, a urethane wire having a diameter of about 0.1 mm is about 50 mm thick.
It is wound around.

In this example, the reason why the chip storage sheet 3 is first formed on the back sheet 1 is to make the top sheet 5 as flat as possible. That is, when the frame member 2 is formed on the back sheet 1 first, since the chip storage sheet 3 is formed in a long sheet shape, an excess portion of the chip storage sheet 3 covers the frame member 2. . Therefore, although slightly, the chip storage sheet 3 remains in the pressed frame member 2 in a thickness together with the adhesive member 10A. This uneven thickness prevents flattening of the topsheet 5. By bringing this to the back side of the frame member 2, the topsheet 5 can be flattened.

The chip storage sheet 3 is placed on the back sheet 1.
8B, the frame member 2 is bonded from above the chip storage sheet 3 in FIG. 8B. In this example, if the vacuum heat press device 17 is of a large plate type, for example, the frame member 2 in which the openings 13 are arranged in three rows in the transport direction is used (FIG. 6).
reference).

The sheet-shaped frame member 2 and the chip storage sheet 3 are impregnated with a thermosetting hot melt resin as an adhesive member 10B. Also, the electronic component 4 is attached to the frame member 2 by one.
An opening 13 shown in FIG. 11 and having a size that can be stored next is continuously opened in the transport direction, for example. This opening 13
Is equal to the size of the outer peripheral area of the electric component 4,
Its thickness is substantially equal to the thickness of the electronic component 4. Moreover, the sheet-like frame member 2 is formed using a water-resistant and chemical-resistant resin material. The frame member 3 is made of, for example, a reactive hot melt or acrylic thermosetting resin in a sheet shape.
Use the one punched out.

Thereafter, in FIG. 8C, the top sheet 5 is formed on the entire surface of the sheet-shaped frame member 2 and the chip storage sheet 3 disposed inside the frame member 2. Image display information for the user of the electronic card 100 is printed on the front sheet 5 in a predetermined print area shown in FIG. This print area is hereinafter referred to as an image display area A.

In this example, the top sheet 5 has a long sheet shape in which the image display information shown in FIG. 12 is continuously printed in the transport direction. An alignment mark p0 is printed on the end of the topsheet 5 in advance. The topsheet 5 is not limited to a long sheet shape, and a topsheet 5 previously divided into a predetermined size may be used. For example, 6
The top sheet 5 on which one or nine pieces of image display information are printed may be cut in advance into a sheet type sheet, and the electronic card 100 may be manufactured using the cut sheet.

When the topsheet 5 is formed on the frame member 2 and the chip storage sheet 3, the foamable urethane sheet is placed inside the frame member 2, that is, the storage area for the electronic components 4 and the topsheet 5. It may be formed between. The urethane sheet can further protect the top sheet 1 and the like made of the electronic component 4.

Thereafter, when a heating and pressing treatment is performed in the same manner as in the conventional method, a sheet-shaped card assembly 20 shown in FIG. 13 is completed. The card assembly 20 discharged from the vacuum heat press device 17 is not completely cured, that is, is in a so-called semi-dry state. In this example, the card assembly 20 is cut from the frame member 2 to form one unit of an electronic card sheet.
For example, the long sheet-shaped card assembly 20 is cut into two or more based on the alignment mark p0 formed outside the image display area A of the card assembly 20.

Then, after the electronic card sheet is completely cured, it is punched out by a punching device or the like, and one electronic card 100 is obtained. The hatched portion shown in FIG. 13 is the frame member 2 formed to protect the electronic component 4. When the card assembly 20 is punched into one electronic card 100, the frame member 2
It is a part that is harder than the central part. When cutting is performed with the above-mentioned frame member 2 as a target, the card assembly 20
Can be cut without deformation. For example, the bonding member 10
Even if is not completely cured, if the frame member 2 is cut, the card is hardly distorted.

As described above, according to the method of manufacturing the electronic card 100 according to the present embodiment, the thickness of the electronic component 4 is substantially equal to the thickness of the porous chip storage sheet 3 in which the electronic component 4 is stored. Then, a frame member 2 made of a water-resistant and chemical-resistant resin material is formed, and thereafter, the entire surface of the back sheet 1 including the frame member 2 and the chip storage sheet 3 is thermosetting as an adhesive member 10B, for example. Is bonded to the top sheet 5.

Therefore, the peripheral edge of the chip storage sheet 3 in which the electronic components 4 are stored can be strengthened by the frame member 2.
Excellent water absorption and corrosion resistance, strong peeling, and
The electronic card 100 having a very small card thickness can be manufactured.

In this example, the case where the chip storage sheet 3 in which the storage member of the electric component 4 is formed in a sheet shape in advance is used, but the present invention is not limited to this. For example, the first porous member is provided on the frame member 2 of the back sheet 1 shown in FIG. 14A.
Then, the electric component 4 is arranged on the first resin sheet 21 shown in FIG. 14B. At this time, the electric components 4 may be arranged by dropping the electronic components 4 onto the first resin sheet 21 using a pallet-like gripper or the like. At this time, each member is fixed to the back sheet 1 with an adhesive member 10A or the like. Then, FIG.
In C, a porous second resin sheet 22 is formed on the electric component 4. According to this forming method, the back sheet 1
Thus, the chip storage sheet 3 'can be formed in real time.

The case where the chip storage sheet 3 is formed first on the back sheet 1 has been described. However, the present invention is not limited to this. The frame member 2 is formed first on the back sheet 1 shown in FIG. 15A. Thereafter, the chip storage sheet 3 may be formed on the frame member 2 shown in FIG. 15B, and the top sheet 5 may be formed on the frame member 2 and the chip storage sheet 3 shown in FIG. 15C. Even with this forming method, since the peripheral portion of the chip storage sheet 3 can be strengthened by the frame member 2, it is possible to manufacture the electronic card 100 which is excellent in water absorption and corrosion resistance, resistant to peeling and extremely thin in card thickness. it can.

In this embodiment, the case where the reaction type hot melt resin is used for the frame member 2 has been described. However, the present invention is not limited to this, and both the frame member 2 and the central portion of the card (chip storage sheet 3) are used. It may be bonded using a reactive hot melt resin. According to the data obtained by experiments by the present inventors, the reactive hot melt resin as the adhesive member 10 is suitable for thinning the card, including maintaining flatness.

Also, as in the present embodiment, the electronic component 4
In the sandwich-type electronic card 100 in which the frame member 2 surrounding the frame is bonded to the back sheet 1 and the top sheet 5 using a reactive hot-melt resin, the influence of the penetration of moisture from the end face of the card is extremely reduced. There are advantages too.

(2) Second Embodiment FIGS. 16A to 16C are cross-sectional views of an example of a forming process showing a method of manufacturing an electronic card 100 according to a second embodiment.
FIG. 17 shows a chip storage sheet 3 that supplements the example of the forming process.
It is a top view which shows the example of application of the adhesive member of FIG. In this example,
The frame member 2 is simultaneously formed in real time in the step of enclosing the chip storage sheet 3 by utilizing the difference in the chemical and physical properties of the adhesive member.

For example, in FIG.
The chip storage sheet 3 is formed thereon. Then, FIG. 16B
Then, two types of adhesive members having different chemical and physical properties are selectively impregnated on the area of the chip storage sheet 3.
In this example, a thermosetting adhesive member 10B having different chemical and physical characteristics is attached to the outer periphery of the chip storage sheet 3 with respect to the adhesive member 10A in the storage area of the electric component 4 inside the wavy line shown in FIG. Impregnate the part. The outer peripheral portion of the chip storage sheet 3 is a region to function as a frame, and a water-resistant and chemical-resistant resin material is formed in this region. As this resin material, a thermosetting resin such as a reactive hot-melt resin is used.

Then, after the topsheet 5 shown in FIG. 16C is pasted on the chip storage sheet 3, the resin material is cured by heat treatment. This heat treatment is performed at the same time as the pressing by the vacuum hot pressing device 17. By this heat bonding process, the adhesive member at the peripheral portion of the card becomes harder like the frame 10C than at the central portion of the card.

As described above, according to the present embodiment, unlike the first embodiment, the peripheral portion of the chip housing sheet 3 housing the electronic components 4 can be heat-cured without using the frame member 2. Since it can be strengthened by the frame 10C made of an adhesive member,
Excellent water absorption and corrosion resistance, strong peeling, and
The electronic card 100 having an extremely thin card thickness as compared with the first embodiment can be manufactured.

(3) Third Embodiment FIGS. 18A to 18C are cross-sectional views of a forming process example showing a method of manufacturing an electronic card 100 according to a third embodiment.
In this example, the frame member 2 is formed on the back sheet 1 in real time using a resin that is cured by ultraviolet rays.

For example, in FIG.
The chip storage sheet 3 is formed thereon. Then, FIG. 18B
Then, the chip storage sheet 3 is impregnated with the resin 10D which is cured by ultraviolet rays. A water-resistant and chemical-resistant resin material is used for the resin 10D. An epoxy or acrylic resin is used as the resin material.

Thereafter, in FIG. 18C, the resin 10
The frame member 2 is formed by irradiating D with ultraviolet rays. Then, the resin 10D is cured by heat treatment. In this heat treatment, the above-mentioned back sheet 1, chip storage sheet 3 and top sheet 5 are subjected to heat bonding by a vacuum heat press device 17. By this heat bonding process, the peripheral portion of the card becomes harder like a frame than the central portion of the card.

As described above, according to the present embodiment, similarly to the second embodiment, even if the frame member 2 is not used, the peripheral portion of the chip storage sheet 3 in which the electronic components 4 are stored is heat-cured. Can be strengthened with the passage of time by the adhesive member, so that it is possible to manufacture the electronic card 100 which is excellent in water absorption and corrosion resistance, resistant to peeling, and extremely thin in card thickness as compared with the first embodiment.

[0088]

As described above, according to the electronic card of the present invention, a frame member made of a water-resistant and chemical-resistant resin material is provided in the outer peripheral region of the electronic component.

With this structure, the peripheral portion of the electronic component can be strengthened, so that it is possible to provide an electronic card which is excellent in water absorption and corrosion resistance, resistant to peeling, and extremely thin.

According to the electronic card manufacturing method of the present invention, for example, the thickness of the electronic component is substantially equal to the thickness of the electronic component in the outer peripheral region of the porous storage member in which the electronic component is stored.
A frame member made of a water-resistant and chemical-resistant resin material is formed. After a housing member is arranged inside the frame member, a surface member is formed on the entire surface of the substrate.

With this structure, the peripheral portion of the storage member storing the electronic components can be reinforced by the frame member, so that an electronic card having excellent water absorption and corrosion resistance, strong peeling, and extremely thin card can be manufactured. can do.

The present invention is extremely suitable when applied to an IC card such as a cash card, an employee ID card with a face photograph, an employee ID card, various driver's licenses, etc., and a method of manufacturing the same.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a laminated structure of an electronic card 100 according to each embodiment.

FIG. 2 is a cross-sectional view showing an example of a laminated structure of a top sheet 5 of the electronic card 100.

FIG. 3 is a sectional view showing an example of a laminated structure of the back sheet 1.

FIG. 4 shows the frame member 2 of the electronic card 100 and the IC chip 4A.
It is sectional drawing which shows the example of a relationship of thickness with this.

FIG. 5 is a partial cross-sectional top view illustrating a state example of a frame member 2 surrounding an electronic component 4 of the electronic card 100.

6 is a perspective view showing a configuration example of an electronic card manufacturing device 200. FIG.

FIG. 7 is a block diagram showing an example of a control system of the electronic card manufacturing apparatus 200.

8A to 8C are cross-sectional views illustrating an example of a forming process of the method for manufacturing the electronic card 100 according to the first embodiment.

FIG. 9 is a top view showing a printing example of the back sheet 1;

FIG. 10 is a top view showing a configuration example of the chip storage sheet 3.

11 is a top view showing a configuration example of a sheet-like frame member 2. FIG.

12 is a top view showing a printing example of the top sheet 5. FIG.

FIG. 13 is a top view showing an example of cutting the card assembly 20 after heat bonding.

14A to 14C are cross-sectional views illustrating an example of a process of forming another chip storage sheet 3 of the electronic card 100. FIG.

15A to 15C are cross-sectional views illustrating another example of a forming process of the electronic card 100. FIG.

16A to 16C are cross-sectional views illustrating an example of a forming process of a method of manufacturing the electronic card 100 according to the second embodiment.

FIG. 17 is a top view showing an example of application of a thermosetting resin to the chip storage sheet 3.

18A to 18C are cross-sectional views illustrating an example of a forming process of a method of manufacturing the electronic card 100 according to the third embodiment.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 back sheet (member for substrate) 2 frame member 3 chip storage sheet (storage member) 4 electronic component 4A IC chip 4B antenna body 5 surface sheet (surface member) 10, 10A, 10B adhesive member 13 opening 17 vacuum Heat press device 20 Card assembly 70 Control device 100 Electronic card 200 Electronic card manufacturing device

Claims (19)

[Claims] 1. A substrate, a frame member provided in an outer peripheral region on the substrate, and a porous thin sheet-like storage member for storing electronic components and provided inside the frame member on the substrate. A member for a surface that is sealed and bonded to the housing member with an adhesive member interposed on the entire surface of the substrate, and at least the frame member is made of a water-resistant and chemical-resistant resin material. Electronic card characterized by the following. 2. The electronic card according to claim 1, wherein the frame member is made of a resin material having a thickness substantially equal to or greater than the thickness of the electronic component. 3. The electronic card according to claim 1, wherein the substrate, the housing member, and the surface member are bonded with a reactive hot melt resin. 4. A step of forming a frame member having an opening approximately the same size as or slightly larger than the outer peripheral region of the electronic component on a substrate member, and forming the frame member on the substrate member. A step of arranging a sheet-like storage member storing the electronic component inside a frame member, and a step of forming a surface member on the entire surface of the substrate member on which the storage member is disposed, A method for manufacturing an electronic card, wherein a water-resistant and chemical-resistant resin material is used for a frame member. 5. A step of forming a long sheet-like frame member having an opening substantially the same size as or slightly larger than the outer peripheral region of the electronic component on a long sheet-like substrate member; Arranging a long sheet-shaped storage member storing the electronic component inside a frame member formed on the substrate member; Forming a sheet-like surface member, wherein a water-resistant and chemical-resistant resin material is used for the frame member. 6. The method for manufacturing an electronic card according to claim 4, wherein a resin material substantially equal to or thicker than the thickness of the electronic component is used for the frame member. 7. The method for manufacturing an electronic card according to claim 4, wherein a woven, non-woven, or porous resin sheet is used for the storage member. 8. The method for manufacturing an electronic card according to claim 4, wherein the surface member is a printing member in which image display information is printed in a predetermined area in advance. 9. The method for manufacturing an electronic card according to claim 4, wherein the surface member has an image receiving layer for forming a photo of the face of the card user. 10. The electronic component according to claim 4, wherein the electronic component is an IC chip for electrically storing information relating to the card user, and a coil-shaped antenna connected to the IC chip. The manufacturing method of the electronic card according to the above. 11. The frame member according to claim 4, wherein a water-resistant and chemical-resistant resin material is formed in an outer peripheral region of the housing member, and the resin material is cured by heat treatment. The manufacturing method of the electronic card according to the above. 12. The method for manufacturing an electronic card according to claim 4, wherein the member for the front surface, the member for the substrate, and the housing member are joined by a thermosetting adhesive member. 13. The frame member according to claim 4, wherein the frame member is formed of a thermosetting adhesive member having different chemical and physical characteristics from the adhesive member joining the storage member. The manufacturing method of the electronic card according to the above. 14. The method according to claim 4, wherein a reactive hot melt resin or an epoxy resin is used for the frame member. 15. The method for manufacturing an electronic card according to claim 4, wherein the housing member is impregnated with an epoxy resin, and the frame member is coated with a reactive hot melt resin. 16. The frame member is formed of a resin cured by ultraviolet rays or a member coated with the resin,
6. The method according to claim 4, wherein the resin is irradiated with ultraviolet rays. 17. A long sheet-shaped card assembly in which a storage member disposed inside the frame member is bonded between the substrate member and the surface member with an adhesive member interposed therebetween. 6. The method for manufacturing an electronic card according to claim 5, wherein: 18. A case in which a long sheet-shaped card assembly enclosing the storage member is formed, wherein a sheet-shaped frame member having a plurality of openings is used for disposing the storage member. 18. The method of claim 17, wherein
The manufacturing method of the electronic card according to the above. 19. The manufacturing of an electronic card according to claim 18, wherein the long sheet-shaped card assembly is cut from a frame member of the card assembly to form one unit of an electronic card sheet. Method.